Heat Pipe Patents (Class 361/679.52)
  • Patent number: 10143108
    Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: November 27, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chun-Ching Ho, Hsin-Hung Chen
  • Patent number: 9861008
    Abstract: An outdoor unit of an air conditioner is disclosed. The outdoor unit of the air conditioner includes an outdoor unit body, a printed circuit board having a heat generating element installed thereat, an electronic box mounted in the outdoor unit body, the electronic box having the printed circuit board installed therein, a heat dissipation module contacting the heat generating element, the heat dissipation module allowing refrigerant to flow therethrough, and a heat dissipation module support mounted in the outdoor unit body such that the heat dissipation module is fixed to the heat dissipation module support to support the heat dissipation module. Shaking of the heat dissipation module can be minimized when the electronic box is separated, thereby improving reliability of the heat dissipation module.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: January 2, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Kakjoong Kim, Jaehwa Jung, Chiwoo Song
  • Patent number: 9848515
    Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: December 19, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Christopher Janak, Steve Capezza, Christopher M Jaggers, David A McAfee, Ali Akbar Merrikh, Matthew Grossman, Nicholas Poteracki, Jefferson West, Paul Hughes
  • Patent number: 9606590
    Abstract: A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: March 28, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Paul N. Walker, Earl W Moore
  • Patent number: 9128667
    Abstract: A protective cover for a slot and a screen provided in a mobile terminal is provided. The protective cover for a slot and a screen of a mobile terminal having a window at a front surface, having a slot in a recess formed in a predetermined depth at an upper portion of a rear surface, and mounts an injection and discharge element in the slot includes: a slot protective cover for covering the injection and discharge element and fastened to the recess; and a screen protective cover extended in a length for covering the window from the slot protective cover and for rotating to the front surface or the rear surface using one side surface of the mobile terminal as a central axis.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: September 8, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Namsu Kim, Jinsoo Kim
  • Publication number: 20150124399
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Application
    Filed: February 26, 2014
    Publication date: May 7, 2015
    Applicant: ACER INCORPORATED
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 9013874
    Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 21, 2015
    Assignee: SK hynix memory solutions inc.
    Inventor: Givargis George Kaldani
  • Patent number: 9013869
    Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: April 21, 2015
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Gregory Tice
  • Patent number: 8988880
    Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: March 24, 2015
    Assignee: GE Intelligent Platforms, Inc.
    Inventor: Laith Anthony Vincent
  • Publication number: 20150077929
    Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 19, 2015
    Inventors: Osamu HONMURA, Nobuyuki Kojima, Naoto Sakuma
  • Patent number: 8982557
    Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: March 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Watanabe, Shigeo Hayashi
  • Publication number: 20150062802
    Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Applicant: Dell Products, L.P.
    Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow
  • Patent number: 8966922
    Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: March 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8959941
    Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8955347
    Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: February 17, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Publication number: 20150043160
    Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Applicant: Dell Products L.P.
    Inventors: Eric M. Tunks, Stuart Allen Berke
  • Patent number: 8947873
    Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: February 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8941986
    Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: January 27, 2015
    Assignee: ScienBizIP Consulting (Shenzhen) Co., Ltd.
    Inventor: Yang Li
  • Patent number: 8941981
    Abstract: A computer includes various features that improve its functionality and/or ease of use. A modular electronics cartridge that includes a piston seal and opposed-direction latches removably engages a cartridge bay of the computer. A high intensity touch-screen display and a high power processor are disposed in a sealed compartment of the computer, and a remote heat exchanger is used to cool the sealed compartment. An interface converter/adapter converts a standard mini-PCI Express slot into a specialized mini-PCI Express slot with voice capabilities. SIM and microSD card slots mount to a pivoting door on the computer such that opening the door provides easier access to the card slots.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: January 27, 2015
    Assignee: Xplore Technologies Corp.
    Inventors: David Reber, Michael Garel
  • Patent number: 8934235
    Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: January 13, 2015
    Assignee: Microsoft Corporation
    Inventors: Brandon A. Rubenstein, Jeffrey Taylor Stellman
  • Publication number: 20140368991
    Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.
    Type: Application
    Filed: June 13, 2013
    Publication date: December 18, 2014
    Inventors: Sean M. James, Brandon Aaron Rubenstein
  • Patent number: 8897012
    Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: November 25, 2014
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang, Wei-Hsin Wu, Hua-Feng Chen, Ming-Hung Lin
  • Patent number: 8897016
    Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: November 25, 2014
    Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson
  • Patent number: 8897002
    Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: November 25, 2014
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Christiaan A. Ligtenberg, Ron A. Hopkinson, Patrick Kessler, Bradley J. Hamel, Dinesh C. Mathew, John M. Brock, Keith J. Hendren, Peteris K. Augenbergs, Joss N. Giddings, Matthew C. Waldon, Cina Hazegh, Matthew P. Casebolt, Charles A. Schwalbach, Brandon S. Smith, William F. Leggett, Gavin J. Reid, Tom Tate, Gary Thomason
  • Patent number: 8891234
    Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Lung-Chi Huang, Chih-Hao Yang
  • Patent number: 8879261
    Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: November 4, 2014
    Assignee: Icepipe Corporation
    Inventor: Sang-Cheol Lee
  • Patent number: 8879260
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8854806
    Abstract: A memory protection device and a computer including the memory protection device are disclosed. The memory protection device includes insulating heat-conducting bars which are provided on an upper end of slot arms at two sides of a memory connection base and cover up heat emitting holes of the slot arms.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: October 7, 2014
    Inventor: Lin Feng
  • Patent number: 8850176
    Abstract: A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: September 30, 2014
    Assignee: Getac Technology Corporation
    Inventor: Chi-Jung Wu
  • Publication number: 20140268553
    Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.
    Type: Application
    Filed: June 28, 2013
    Publication date: September 18, 2014
    Inventors: Kevin Lee Van Pelt, Theodore Robert Johnson, Robert Michael Kinstle III
  • Patent number: 8837139
    Abstract: A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: September 16, 2014
    Inventor: Biao Qin
  • Patent number: 8804336
    Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: August 12, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Chih-Peng Lee
  • Patent number: 8792241
    Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: July 29, 2014
    Assignee: Wistron Corporation
    Inventors: Po-Yuan Hsu, Wei-Cheng Wang, Chen-Yu Li, Hsing-Wang Chang, Tsung-Hsien Chen, Chia-Cheng Su
  • Patent number: 8792240
    Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: July 29, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Taqing Feng, Zhijian Li, Yuping Hong, Hongliang Chen, Jian Shi
  • Patent number: 8792238
    Abstract: A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: July 29, 2014
    Assignee: Celsia Technologies Taiwan, Inc.
    Inventors: George Anthony Meyer, IV, Chien-Hung Sun, Chieh-Ping Chen, Yung-Tai Lu, Ming-Kuei Hsieh
  • Patent number: 8792235
    Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: July 29, 2014
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventor: Kazuyuki Matsumura
  • Patent number: 8780559
    Abstract: An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: July 15, 2014
    Assignee: General Electric Company
    Inventors: Stanton Earl Weaver, Jr., Tao Deng, Hendrik Pieter Jacobus de Bock, Shakti Singh Chauhan
  • Patent number: 8773855
    Abstract: A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: July 8, 2014
    Assignee: Zaonzi Co., Ltd.
    Inventor: Sang-Cheol Lee
  • Publication number: 20140185232
    Abstract: In some embodiments, cooling devices with metal hydrides are disclosed.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 3, 2014
    Inventors: Dhanesh Chandra, Daryl J. Nelson, Muralidhar Tirumala, Anupam Kumar, Anjali Talekar
  • Patent number: 8767390
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: July 1, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichiro Takeguchi, Yasuyuki Horii, Shingo Koide
  • Patent number: 8760864
    Abstract: A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.
    Type: Grant
    Filed: April 29, 2012
    Date of Patent: June 24, 2014
    Assignee: AU Optronics Corp.
    Inventor: Ho-Hsing Chiang
  • Patent number: 8760862
    Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Asustek Computer Inc.
    Inventor: Cheng-Yu Wang
  • Patent number: 8743541
    Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: June 3, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiko Hata, Yasuyuki Horii
  • Patent number: 8737071
    Abstract: A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: May 27, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mingliang Hao, Jun Zhao
  • Patent number: 8730662
    Abstract: A server rack system includes a rack, servers, and a heat-dissipating wall. The rack has guiding rails, a front end, and a rear end opposite to the front end. The servers slidably configured on the guiding rails and in the rack are adapted for being moved into or out of the rack from the front end. The heat-dissipating wall is pivoted to the rear end and adapted for being folded against or unfolded away from the rear end. The heat-dissipating wall includes a fan wall. Fans lie on the fan wall. The fans are adapted for sucking cool air, such that the cool air enters the rack from the front end and passes through the servers. Heat exchange between the cool air and the servers is carried out to generate hot air that flows out of the rack through the heat-dissipating wall to dissipate heat of the servers.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 20, 2014
    Assignee: Inventec Corporation
    Inventors: Shi-Feng Wang, Ji-Peng Xu, Tsai-Kuei Cheng
  • Patent number: 8717745
    Abstract: The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two heat pipes (11) inside said switchgear, putting a first end (11A) of the first heat pipe (11) in the hot portion of the hot portions (10A, 10C) of the circuit breaker (10) and a second end (11B) of the first heat pipe (11) in a portion that is cooler (10A) of the hot portions (10A, 10C). The other heat pipe (11) is put between the cooler of the hot portions (10A) and a cooler part of the circuit breaker (10). A particular application is provided for medium-voltage, high-current circuit breakers.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: May 6, 2014
    Assignee: Alstom Technology Ltd
    Inventors: Denis Frigiere, Didier Rodrigues, Jean-Marc Willieme, Frank Jacquier
  • Patent number: 8703320
    Abstract: A battery pack includes a secondary battery, an outer case receiving the secondary battery, and a cooling unit disposed at a predetermined position of the outer case, wherein the cooling unit includes a first heatsink disposed toward the inside of the outer case, a second heatsink disposed toward the outside of the outer case, and a thermoelectric device between the first heatsink and the second heatsink.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: April 22, 2014
    Assignees: Samsung SDI Co., Ltd., Robert Bosch GmbH
    Inventor: Kwon Sohn
  • Patent number: 8693186
    Abstract: A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: April 8, 2014
    Assignee: Getac Technology Corporation
    Inventor: Chi-Jung Wu
  • Patent number: 8693196
    Abstract: A heat dissipation module suitable for a host apparatus is provided. The heat dissipation module has a shell body. The shell body has a heat conductive side and an air outlet-inlet side. The air outlet-inlet side has an air outlet and an air inlet. A contact sink having a fixing portion and a contact portion is installed on the heat conductive side such that the contact portion contacts a position requiring heat dissipation in the host apparatus. A heat conductive tube is disposed in the shell body between the fixing portion of the contact sink and the air outlet. A heat dissipation fin is disposed on the air outlet. A waterproof fan is installed on the air outlet. The shell body and the contact sink define an enclosure having waterproof edges except for openings on the air outlet-inlet side.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Getac Technology Corporation
    Inventor: Chi-Jung Wu
  • Patent number: 8693200
    Abstract: A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: April 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz