Abstract: A communication device is provided. The communication device includes a heat dissipation case, a heat conductive member, a heat dissipation base, and a communication module. The heat conductive member is thermally connected to the heat dissipation case, and the heat dissipation base is pivotally connected to the heat conductive member. The heat dissipation base is thermally connected to the heat conductive member and is adapted to be rotated between a first orientation and a second orientation relative to the heat conductive member. The communication module is affixed to the heat dissipation base.

Abstract: A heat dissipation device includes a housing with an air passage and air inlet and air outlet. The heat dissipation structures are in the air passage and include a first heat dissipation structure adjacent to the air inlet and a second heat dissipation structure adjacent to the air outlet. A projection of the first heat dissipation structure in the second heat dissipation structure along the first direction is within the second heat dissipation structure. The first and second heat dissipation structures each include a thermally conductive plate and gapped fins thereon disposed. A spacing of each gap in the first heat dissipation structure is greater than a spacing of each gap in the second heat dissipation structure.

Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.

Abstract: An information handling system includes a cover and a bonded hinge assembly bonded to the cover. The bonded hinge assembly includes a support frame and a hinge. The support frame has a low airflow impedance. The hinge is bonded to the support frame. The hinge is integrated within the support frame when the hinge is bonded to the support frame.

Abstract: The invention relates to an electrical assembly, in particular for a vehicle, comprising a casing (13), at least one electrical module (11) having at least one electrical component to be cooled, a cooling module (12) comprising at least two fluid orifices (122), at least one cooling duct provided in said cooling module (12), configured to form a portion of a cooling circuit and to provide a fluidic connection between said fluid orifices (122), said at least one electrical module (11) being connected to said cooling module (12) in order for the electrical module (11) to be cooled, said casing (13) being connected to said cooling module (12) so as to define a free volume, said free volume accommodating said at least one electrical module (11) so as to form an independent module configured to be connected to a frame of an item of electrical equipment.

Abstract: An audio video navigation (AVN) device includes: a first housing including a first circuit board, a second housing that includes a second circuit board and that detachably couples to the first housing, a conduction module provided between a first coupling surface of the first housing and a second coupling surface of the second housing based on the second housing being coupled to the first housing, and a heat dissipation fan that is provided at the first housing and that is configured to exhaust air inside the first housing to an outside of the first housing. The conduction module includes: a first surface coupled to one of the first coupling surface or the second coupling surface, and a second surface facing the other one of the first coupling surface or the second coupling surface, where the second surface is not adhesive.

Abstract: A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.

Abstract: A wearable electronic device includes a first device housing coupled to a second device housing by at least one strap. The wearable electronic device includes heat generating electronics situated within the first device housing. A heat pipe thermally coupled to the heat generating electronics transfers thermal energy from the heat generating electronics through the at least one neck strap to the second device housing.

Abstract: A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.

Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

Abstract: Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.

Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.

Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.

Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

Abstract: A portable information handling system folds a flexible display over a hinge and selectively engages a brake that restricts hinge movement if a predetermined condition exists, such as a predetermined thermal state associate with potential damage to the flexible display. Heating and cooling elements increase or decrease the flexible display thermal state to fall within a constraint that supports folding and releases the hinge brake.

Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.

Abstract: An outdoor unit of an air conditioner is disclosed. The outdoor unit of the air conditioner includes an outdoor unit body, a printed circuit board having a heat generating element installed thereat, an electronic box mounted in the outdoor unit body, the electronic box having the printed circuit board installed therein, a heat dissipation module contacting the heat generating element, the heat dissipation module allowing refrigerant to flow therethrough, and a heat dissipation module support mounted in the outdoor unit body such that the heat dissipation module is fixed to the heat dissipation module support to support the heat dissipation module. Shaking of the heat dissipation module can be minimized when the electronic box is separated, thereby improving reliability of the heat dissipation module.

Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Abstract: A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.

Abstract: A protective cover for a slot and a screen provided in a mobile terminal is provided. The protective cover for a slot and a screen of a mobile terminal having a window at a front surface, having a slot in a recess formed in a predetermined depth at an upper portion of a rear surface, and mounts an injection and discharge element in the slot includes: a slot protective cover for covering the injection and discharge element and fastened to the recess; and a screen protective cover extended in a length for covering the window from the slot protective cover and for rotating to the front surface or the rear surface using one side surface of the mobile terminal as a central axis.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.

Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract: A computer includes various features that improve its functionality and/or ease of use. A modular electronics cartridge that includes a piston seal and opposed-direction latches removably engages a cartridge bay of the computer. A high intensity touch-screen display and a high power processor are disposed in a sealed compartment of the computer, and a remote heat exchanger is used to cool the sealed compartment. An interface converter/adapter converts a standard mini-PCI Express slot into a specialized mini-PCI Express slot with voice capabilities. SIM and microSD card slots mount to a pivoting door on the computer such that opening the door provides easier access to the card slots.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.

Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.

Abstract: A memory protection device and a computer including the memory protection device are disclosed. The memory protection device includes insulating heat-conducting bars which are provided on an upper end of slot arms at two sides of a memory connection base and cover up heat emitting holes of the slot arms.

Abstract: A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.

Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.

Abstract: A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided.

Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.

Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.