Abstract: A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-side with a set of bump-bonds, a set of through-silicon vias (TSVs) connected to at least one of: the first chip layer back-side or the qubit chip layer back-side and a cap wafer metal bonded to at least one of: the qubit chip layer back-side or the first chip layer back-side.

Abstract: An immersion cooling system includes a plurality of spaced-apart cooling plates defining a plurality of subvolumes therebetween, the cooling plates at least partially immersed in a first liquid coolant, so that the first liquid coolant at least partially fills each subvolume; a second liquid coolant flowing through at least a portion of each cooling plate; and at least one electronic device at least partially immersed in the first liquid coolant within each subvolume.

Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.

Abstract: According to one embodiment, a system for a rack includes an equipment module for coupling to a rack module. The rack module includes a pair of main connectors for coupling to a coolant source and a pair of manifold connectors, and includes a vertical leak detection channel that has a leak detection cable. Positioned between the main connectors and the manifold connectors is a structure that at least partially contains the main connectors and has a liquid path to the channel. The equipment module includes a chassis that has a pair of connectors and a conducting path. The chassis also has an opening for receiving the manifold connectors for coupling to the connectors, and another opening, the conducting path extends from an interior of the chassis to the other opening and is arranged to guide liquid out of the opening and into the channel while both modules are coupled together.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: In order to provide a method for de-icing a heat exchanger of a motor vehicle, which prevents large amounts of melt water from a defrosting process running onto the floor or the road beneath the motor vehicle, freeze again and pose a risk of injury to pedestrians, in a method for defrosting a heat exchanger of a motor vehicle, in which, for a heat exchanger arranged in a motor vehicle, a defrosting process for removing a layer of frozen water or frost formed on a surface of the heat exchanger is carried out, the defrosting process comprising heating the surface, and melt water being produced, it is proposed that the amount of melt water discharged onto a local region of a floor beneath the motor vehicle is limited to a maximum value.

Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Abstract: An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.

Abstract: According to one embodiment, a leak segregation system for a rack that includes a rack liquid manifold. The system includes at least one leak segregation structure that is mounted to the manifold, the structure having a top opening, a bottom that includes at least one opening, a back opening for receiving a manifold connector of the manifold, and a front opening for receiving a connector of an electronics component mounted within the rack, where the structure contains the manifold connector and at least partially contains the connector when the connectors are coupled together. The system also includes a leak detection structure that is positioned below the leak segregation structure and includes a leak detection sensor that is configured to detect a presence of liquid from the leak segregation structure.

Abstract: Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

Abstract: An electrical device for electrically measuring a sample during electron microscope imaging includes: a chip through which a slit is defined, the chip having at least one peripheral edge, the slit having an open end at the at least one peripheral edge; an electrically conductive first contact on the chip; and an electrically conductive second contact on the chip; wherein the slit is at least partially positioned between the first contacts and second contact. An electrically conductive first wire may extend along the chip electrically connected to the first contact; and an electrically conductive second wire may extend along the chip electrically connected to the second contact. The first wire and second wire may diverge from each other in extending along the chip away from the slit.

Abstract: In one instance, a heat sink for thermal management of an electronic component includes a top plate and a base plate that is displaced from the top plate when in an assembled position. The base plate has a first side and a second side, and the second side is for thermally coupling to the electronic component. The heat sink also includes a plurality of fins each including a flat member formed with a plurality of pin apertures and a plurality of fastener apertures. A plurality of pins is disposed through the plurality of pin apertures. The members of the plurality of fins are spaced from one another. The top plate is coupled to a first end of the plurality of pins, and the base plate is coupled to a second end of the plurality of pins to form a secure structure. Other heat sinks are presented.

Abstract: Waste heat generated by devices as a byproduct of their operation is utilized to increase and maintain the temperature of non-potable water to neutralize biological contaminants, thereby rendering such water potable. The potable water can then be utilized for evaporative cooling of the devices. A temperature sensor monitors the temperature of the non-potable water and a controller controls the pump to provide sufficient time for the water to remain in the heat exchanger above a predetermined temperature to neutralize biological contaminants and render such water potable. To the extent that different devices generate different quantities and intensities of waste heat, multiple heat exchangers are utilized, with lower intensity waste heat serving to preheat the water and, thereby, reduce the amount of time needed to reach the target temperature in a primary heat exchanger. Waste heat not utilized to generate potable water can be utilized for other heat-driven processes.

Abstract: A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.

Abstract: Thermal management systems for battery cells and methods for their additive manufacture are provided. The thermal management systems include at least one heat pipe that physically contacts the battery cell and conforms to its geometry. Each battery cell is deposited within a separate heat pipe, and each heat pipe is disposed on a base plate, which itself connects to a heat sink. In many embodiments, the heat pipe is a two-phase heat exchanger having three major components: liquid channels, wick elements, and vapor channels. In such embodiments, the wick component comprises a porous body configured to be disposed between the liquid channels and vapor channels. The wick component may be made using a stochastic additive manufacturing process such that the wick component may take any configuration and/or such that the wick component may be directly integrated into the body of the heat pipe as a unitary piece thereof.

Abstract: Aspects of the disclosed technology relate to techniques of improving heat sink designs based on systematic mass removal. A thermal simulation is performed to determine thermal property values for a heat sink design. The thermal property value of a portion of the heat sink design relates to the portion's contribution to thermal performance of the heat sink design. One or more portions of the heat sink design are selected based on the thermal property values and removed to generate a new heat sink design. The performing operation and the removing operation are repeated until one of one or more predetermined conditions is met.

Abstract: The present invention includes a rack stand for computer servers that ingests cooled air and accepts heated exhaust. Oriented cooled spaces adjacent to heated spaces allows thermoelectric power generation.

Abstract: The present disclosure provides a battery pack comprising: a module assembly having a structure in which a plurality of battery modules is mounted on a cooling plate having an internal hollow structure capable of accommodating a fluid; a pack housing having an inwardly recessed seating portion for mounting of the module assembly, and having an opened upper end; and a coolant circulation system configured to supply a liquid coolant into an internal hollow of the cooling plate to absorb heat of the battery module mounted on the cooling plate, wherein the pack housing includes a drain hose to discharge the liquid coolant that flows out from the coolant circulation system to the outside of the pack housing, and an opening through which the drain hose is mounted is formed on one surface of the pack housing.

Abstract: A battery pack includes a first battery module level and a second battery module level. The first battery module level includes: a first heat exchanger including a cooling tube that defines a cooling area; a first secondary battery cell in thermal contact with the first heat exchanger at the cooling area; a coolant distributor line outside the first heat exchanger and configured to supply coolant to the cooling tube; a coolant interconnector fluidly connecting the cooling tube or the coolant distributor line to the second battery module level; and an encapsulation element enclosing the coolant interconnector and confining a volume in which the coolant interconnector is arranged between the first battery module level and the second battery module level.

Abstract: The present invention includes a lateral support member for a server computer constructed to permit controlled airflow. The lateral support member permits a new rack stand, facility, and complex of computer/member. Obstructers control airflow manually or automatically.

Abstract: An air vehicle power and thermal management system includes an aircraft controller structured to distribute power provided by a gas turbine engine between a cooling system and an electrically powered load. The controller is configured to direct the power to create a first duration cooling power to the cooling system to cool the engine fuel cooling medium over a first power time period. The controller is configured to shift the power to reduce the first duration cooling power to create a load electrical power to drive the electrically powered load over a second power time period. By operation of the controller to shift the power from the first duration cooling power to the load electrical power a second duration cooling power is provided to the cooling system to cool the electrically powered load using the engine fuel cooling medium that was cooled during the first power time period.

Abstract: The invention relates to an electric power distribution box for an aircraft, comprising a frame (3) containing at least one power connector (7) formed of one or more slide rails (8) that are able to interact with one end (11) of a power circuit board (9), said power circuit board (9) comprising at least one switching element (13) for an electric power distribution plate. The invention also relates to an electric power distribution assembly (1) comprising such a power distribution box.

Abstract: A data center includes a rack computer system, a tape library rack module and a heat exchange circuit. The rack computer system is positioned inside the data center and is operable to provide computing capacity and generate waste heat within a first environment. The tape library rack module is positioned within the data center and comprises an enclosure that encompasses its interior, a rack within the interior, at least one tape library unit mounted on the rack within a second environment that is environmentally isolated from the first environment. The heat exchange circuit comprises a pump to circulate heat transfer fluid, a first heat exchanger that receives waste heat in the first environment from the rack computer system to warm heat transfer fluid and a second heat exchanger that releases heat from warmed heat transfer fluid into the second environment to help control the temperature and/or relative humidity of the second environment.

Abstract: A water cooling system of single board module level comprises: a device subrack (1), provided with a backplate (2); multiple single board modules (3), located on one side of the backplate (2); multiple single board water-cooling modules (4), mounted on the corresponding board modules (3) and having liquid for cooling a heating element of the single board modules (3); multiple sealing plug-connection units (5) mounted on the backplate (2) and connected to the single board water-cooling modules (4); and multiple water pump modules (11) connected to the multiple single board water-cooling modules (4) by means of the multiple sealing plug-connection units (5), wherein the water pump modules (11) are located on the other side of the backplate (2). The water cooling system of single board module level has a simple structure, saves space, and has a high device maintenance efficiency.

Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

Abstract: An air vehicle power and thermal management system includes an aircraft controller structured to distribute power provided by a gas turbine engine between a cooling system and an electrically powered load. The controller is configured to direct the power to create a first duration cooling power to the cooling system to cool the engine fuel cooling medium over a first power time period. The controller is configured to shift the power to reduce the first duration cooling power to create a load electrical power to drive the electrically powered load over a second power time period. By operation of the controller to shift the power from the first duration cooling power to the load electrical power a second duration cooling power is provided to the cooling system to cool the electrically powered load using the engine fuel cooling medium that was cooled during the first power time period.

Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.

Abstract: An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.

Abstract: The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost air-cooled computing systems. It integrates a hybrid cooling system that can benefit from an air-side economizer without compromising its compact footprint. For polluted urban environments, this air-side economizer comprises an air-to-air heat exchanger to effectively limit the amount of outside air that can enter the module and come into contact with sensitive computing systems. Through side-to-side, side-to-back or back-to-back juxtaposition, multiple units can be assembled in clusters on a colocation site to create large-scale vertical data center complexes, effectively maximizing real estate use and cost effectiveness by fully exploiting all three dimensions.

Abstract: Various methods and systems are provided for an electrical testing apparatus for an electrical panel and associated wiring harness. In one embodiment, an electrical testing apparatus includes a common housing; a first connector tethered to the housing via a first plurality of wires extending away from and coupled within the housing, where the first connector is adapted to connect to an electrical panel; a second connector mounted to the housing and adapted to connect to a wiring harness of the electrical panel, the wiring harness including a second plurality of wires; and a third connector mounted to the housing and including a plurality of test points for testing an electrical signal passing through each wire of the second plurality of wires.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: A server rack holds a number of modular servers configured for liquid cooling by passing a liquid coolant through interiors of the servers. Failure management of the cooling system is by management of the servers in segregated fault domains. Each fault domain comprises a number of the servers serviced by a dedicated coolant circuit that is segregated from the cooling circuits of the other fault domains. Potential liquid coolant leaks in a specific fault domain can be identified by monitoring liquid coolant levels in the respective coolant circuits. Each fault domain can include a separate, dedicated heat exchanger and a separate, dedicated coolant reservoir.

Abstract: An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.

Abstract: A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another.

Abstract: A cooling system includes a cooling circuit having an evaporator, a condenser, a compressor, an expansion device, a liquid pump, and a receiver/surge tank coupled between the condenser and the liquid pump. The cooling system has a direct expansion mode and a pumped refrigerant economizer mode. When the cooling system switches from the direct expansion mode to the pumped refrigerant economizer mode, refrigerant is flushed from the refrigerant/surge tank so that the cooling circuit is overcharged when it begins operating in the pumped refrigerant economizer mode.

Abstract: A data center cooling system is disclosed. The system includes a plurality of computer racks arranged in a plurality of substantially parallel rows, cooling units associated with the computer racks and arranged in substantially parallel rows to cool air warmed by the cooling racks, and cooling fluid supply and return conduits that are divided by isolation valves into a plurality of cooling sub-loops, wherein adjacent cooling units in a common row are supplied from different sub-loops, and individual sub-loops serve cooling units in multiple rows, so as to provide water-side diversity across the cooling system.

Abstract: A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another.

Abstract: The present invention discloses a mobile terminal comprising: a color changing layer provided on a surface of a shell of the mobile terminal, the color changing layer showing different colors at different temperatures; and a temperature control module positioned inside the mobile terminal, the temperature control module being connected to the color changing layer to supply heat for the color changing layer. The mobile terminal in accordance with the present invention can change color and odor according to requirements of users of different mobile terminals and environmental changes, thus it has very distinct personalization and is easy to operate.

Abstract: The invention provides a modular, configurable aisle isolation and containment system that may function as a hot aisle or as a cold aisle. The data center air routing system of the invention comprises one or more free-standing, essentially identical, modular system units. Each modular unit comprises two sidewalls, a ceiling, and a door or panel at either end to form an interior, enclosed aisle. Two or modular units may be coupled together end-to-end. Each modular unit further comprises one or more sidewall blanking panels that may be removed to create gaps of varying height and width to accommodate one or more IT racks. Each modular unit may also include one or more ceiling-mounted air ducts, baffles and fans to manage air flow.

Abstract: A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.