Abstract: A UFAD system with bifurcated air towers. The air towers are bifurcated in the sense that the air columns are fan-less and coil-less, and fans for delivering pressurized air to the air columns, and hence to the underfloor plenum of the UFAD system, are in overhead ceiling air ducts and spaced away from the air columns. Cooling coils could be located in a remote air handling unit that feeds conditioned air to the overhead ceiling air ducts to be pressurized by the fans.

Abstract: A storage container includes a casing and a bi-parting door. The casing has an opening and stores a device to be used in a fluid chromatograph. A door of the bi-parting door includes a frame member and a cover member. The frame member includes an upper frame and a lower frame. The upper frame and the lower frame are provided at the casing to be turnable around a turning axis and be spaced apart from each other on the turning axis. The cover member is configured to be attachable to and detachable from the frame member and partially cover the opening when the door is closed. A space is formed between the upper frame and the lower frame.

Abstract: A housing for an electronic device can include a body having an exterior surface and a second surface disposed opposite the exterior surface at least partially defining an interior volume, the body defining a first repeating pattern of apertures extending from the exterior surface to the second surface. The housing can also include a component defining a second repeating pattern of apertures, the component positioned adjacent to the second surface. The first repeating pattern of apertures and the second repeating pattern of apertures can combine to define an open area of at least about 70%.

Abstract: A power converter includes: at least one pair of first and second semiconductor devices including multiple first and second semiconductor chips, having first and second switching elements providing upper and lower arms, and multiple first and second main terminals having at least one of multiple first and second high potential terminals and multiple first and second low potential terminals; and a bridging member providing an upper and lower coupling portion, together with the first low and second high potential terminals. The first and second semiconductor chips are arranged in line symmetry with respect to first and second axes and in line symmetry with the second axis as a symmetry axis to differentiate the arrangement of the second low potential terminal with respect to the second high potential terminal from the arrangement of the first low potential terminal with respect to the first high potential terminal.

Abstract: A power supply voltage terminal and a ground terminal having a rectangular cross section are respectively connected to a first terminal hole of a power supply pattern and a second terminal hole of a ground pattern. An inductor is surface-mounted on a substrate, and has a rectangular parallelepiped shape in which an input end connected to a power supply pattern and an output end connected to a power supply relay face each other. A first electrode terminal of a capacitor is connected to the power supply pattern, a second electrode terminal is connected to the ground pattern, and constitutes a filter circuit together with the inductor. A wall surface of an input end of the inductor is arranged parallel to the longitudinal axis direction (x direction) of the first terminal hole. The inductor opposes the first terminal hole so as to include the entire length Wh of the first terminal hole within the width Wt of the input end in the x direction.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A power conversion device includes: a main body including a substrate to which a power conversion unit and a coil are provided; and a first heat dissipation portion which holds the substrate and dissipates heat of the substrate, wherein the substrate is formed by one sheet, the coil is formed integrally with the substrate, the first heat dissipation portion is fixed to a substrate first surface of the substrate, a heat dissipation second surface of the first heat dissipation portion has a coil cooling portion opposed to and abutting on a part where the coil is formed, of the substrate.

Abstract: A notebook computer is provided. The notebook computer includes a device body, a cover and a media unit. The device body includes a first body housing and a second body housing, wherein the second body housing pivots on the first body housing. The cover pivots on the first body housing and is slidably connected to the second body housing. When the cover is rotated from a folded state to an unfolded state relative to the device body, the second body housing is pushed to rotate from the first housing orientation to the second housing orientation relative to the first body housing. The media unit pivots on the first body housing and is slidably connected to the second body housing.

Abstract: Provided is an electronic control device including a first electronic component having a first heat generation amount, a second electronic component having a second heat generation amount smaller than the first heat generation amount, a substrate on which the first and second electronic components are mounted, and a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated. The heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block.

Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.

Abstract: The invention provides a heat sink. The heat sink is configured to be in thermal contact with a heat source. The heat sink includes a base portion, a plurality of fin portions, and a wall portion. The base portion includes a thermal contact surface and a rear surface. The thermal contact surface is configured to be in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface. The fin portions protrude from the rear surface of the base portion. The wall portion protrudes from the rear surface of the base portion and surrounds the fin portions. In addition, the invention also provides an electronic assembly including the heat sink.

Abstract: A semiconductor module unit includes a semiconductor module, and a control board that includes a driver circuit configured to output drive signals to the semiconductor module and controls the semiconductor module. The control board includes a main board, a sub board that is separated from the main board and on which the driver circuit is mounted, and a flexible board that has flexibility and electrically connects the main board and the sub board. The sub board includes a fitting part that is fitted in a fitted part of the semiconductor module. The semiconductor module is electrically connected to the driver circuit in a state where the fitting part is fitted in the fitted part.

Abstract: A network-connected access point is disclosed having a network access transceiver configured to provide access to a network for computing devices in communication therewith. The network access point also comprises one or more environmental sensors each configured to determine at least one environmental characteristic value that quantifies an environmental characteristic at a location distant from the network access point. Without limitation, environmental characteristics include temperature, humidity, sound, light, motion, and air quality, The network access point further comprises a sensor controller in communication with the at least one environmental sensor. The sensor controller may be separate from the network access transceiver, or may be part of the same component.

Abstract: A battery module includes a plurality of individual electrical cells which are arranged within a common housing, wherein an end side of the housing has mechanical connecting elements for connecting the battery module to a temperature-control element which is provided outside the battery module in order to thereby enable good heat transfer between the battery module and the temperature-control element. The mechanical connecting elements are provided as corresponding upper and lower cutouts in the end side of the housing, which upper and lower cutouts are connected to one another by a through-passage, for receiving a connector of which the head can be positioned in the one cutout. The connector can extend vertically along the through-passage and can be connected to a mating piece which can be positioned at least partially in the other cutout and is fixedly connected to the temperature-control element.

Abstract: A wirelessly rechargeable energy store includes a housing, having a casing wall, in which a converter, a storage core, charging electronics and an antenna structure are arranged along a longitudinal axis. The energy store, independently of the relative alignment of antenna structures used with respect to the acting field direction, achieves an increased recharging efficiency and, because of its housing configuration, is diversely usable as a replacement for batteries and battery packs in small electrical devices. The antenna structure comprises at least two induction loops—shaped from an electrically conductive wire—formed as flat coils, which are arranged in a partly overlapping manner on a flexible printed circuit board.

Abstract: There is disclosed a motor vehicle electronic control unit casing. The casing includes a housing (1) for electronic components, and a cover (15). The housing and cover (15) are inter-engageable. The housing (1) has a base (2), and an upstanding peripheral side wall (3) defining a peripheral edge (4) in spaced relation to the base (2) and which extends around an access opening of the housing. The cover (15) has a closure part (16) and is configured to close the access opening via engagement between the closure part (16) and the housing (1) around the peripheral edge (4). The cover (15) also has a mounting portion configured to be mounted to a mounting surface (27) in a motor vehicle.

Abstract: A light fixture includes a heat dissipating structure, an electronics assembly, and a bolt for attaching the heat dissipating structure to an external panel. The heat dissipating structure includes a first side having multiple outwardly extending projection regions and a socket, for receiving a light source, is formed in an apex of each projection region. A second side of the heat dissipating structure includes a heat sink formed in an internal cavity of each projection region. The heat sink includes fins in contact with and radially arranged about an outer surface of the socket. The electronics assembly is located at the first side of the heat dissipating structure. The bolt includes a passage through which wiring from an external source is routed to the electronics assembly. The electronics assembly includes wires routed through channels in each of the projection regions that electrically interconnect the light sources to the electronics assembly.

Abstract: Example DC-DC converters include a housing having at least two bullet terminals. The at least two bullet terminals are configured to mate with corresponding terminals in a DC bullet breaker panel. The converter also includes a DC-DC voltage converter circuit coupled between the at least two bullet terminals, and a controller coupled with the DC-DC voltage converter circuit. The controller is configured to control the DC-DC converter circuit to convert a DC input voltage at a first one of the at least two bullet terminals to a different DC output voltage at another one of the at least two bullet terminals. Methods of converting DC voltages using DC-DC converters having bullet terminals are also disclosed.

Abstract: Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material. The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components. The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.

Abstract: Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.

Abstract: A display device may include a heat radiation member on a lower surface of a display panel, a first circuit board overlapped with and electrically connected to a pad of the display panel and overlapped with the heat radiation member, a driving chip mounted on the first circuit board and located between the first circuit board and the heat radiation member, and an adhesive member coupling the first circuit board to the heat radiation member. When viewed in a plan view, the adhesive member may define an internal region in which the driving chip is located and a passage region connecting the internal region to an outer region of the adhesive member.

Abstract: A solar powered cooler for a smart device such as a smartphone or smart tablet is provided. The cooler may include an upper fan casing, an optional bottom fan casing, smart device holder, and an air passage formed between the upper fan casing and the smart device holder. Also provided are one or more cooling fans drawing air into the air passage along a substantially vertical direction. One or more solar panels allows the cooler to harvest solar energy and deliver electric power to the one or more fans, or motors thereof. The solar panels are connected by one or more, e.g., a pair of, connector cables to the motor. The cooler may cool an entire bottom surface of the smart device using one or more cooling fans.

Abstract: A high-voltage accumulator battery module includes a first connection component adjacent to a plate-shaped frame component remotely from a heat sink. The first connection component includes at least one of: an inlet first connection unit having a fluid inlet connected to a cooling channel system via an inlet fluid line connecting the fluid inlet to an inlet second connection unit connected to the cooling channel system, and an outlet first connection unit having a fluid outlet connected to the cooling channel system via an outlet fluid line connecting the fluid outlet to an outlet second connection unit connected to the cooling channel system. A second connection component is adjacent to the plate-shaped frame component at the heat sink side, and includes at least one of: the inlet second connection unit, and the outlet second connection unit. A clamping device clamps the first and second connection components against each other.

Abstract: Disclosed is a wireless charger for a mobile terminal in a vehicle, the wireless charger including: a tray on which the mobile terminal is placed and which has one or more holes; a coil part configured to wirelessly provide electrical energy to the mobile terminal; a driving part configured to drive the coil part; a case which accommodates the coil part and the driving part and in which an air flow path is formed; and a fan module configured to discharge air toward the mobile terminal through the holes or suction ambient air of the mobile terminal.

Abstract: A cooling and heating structure for a fiber optic transceiver is disclosed. In the cooling and heating structure, a field programmable gate array (FPGA) chip reads a temperature value of a small form-factor pluggable transceiver (SFP) cage from a sensor, a digital to analog converter (DAC) converts the temperature value into a voltage value, a processing chip converts the voltage value into an output-voltage value, and a thermoelectric cooler (TEC) adjusts a working wattage thereof according to the output-voltage value, so as to control the TEC to cool or heat the SFP cage, thereby achieving the technical effect of using the TEC to cool and heat the SFP cage to prevent link down and instability of the fiber optic transceiver during signal transmission in the high-temperature environment and the low-temperature environment from occurring.

Abstract: A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to engage at least a portion of a rail assembly attached to a structure of a data center building; and a lower module attachable to the upper module and configured to suspend above a floor of a human-occupiable workspace of the data center that supports a plurality of racks including a plurality of heat-generating electronic devices, the lower module including a power support assembly configured to provide electrical power to the plurality of heat-generating electronic devices.

Abstract: A common carrier for different device cards for installation in a server is disclosed. The common carrier has a base module that includes side walls and a bottom panel. The bottom panel has a plurality of registration features, each of the registration features corresponding to one of a plurality of different device cards. A top cover includes side walls that is assembled with the base module. A device card of the plurality of different device cards is positioned between the base module and the top cover by at least one of the registration features.

Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.

Abstract: A power converter includes: two switching elements; a positive electrode conductive plate: a negative electrode conductive plate; a mid-point conductive plate; a first heat sink; and a second heat sink. The positive electrode conductive plate is connected to a high-potential terminal of a series connection of the two switching elements, and the negative electrode conductive plate is connected to a low-potential terminal of the series connection. The mid-point conductive plate is connected to a middle point of the series connection. The first heat sink faces the positive electrode conductive plate and the negative electrode conductive plate with a first isolating layer interposed therebetween, and is connected to a ground terminal. The second heat sink faces the mid-point conductive plate with a second isolating layer interposed therebetween, and is isolated from the ground terminal.

Abstract: An electrical connector assembly includes an electrical connector having a mating end and a mounting end mounted to a PCB. The electrical connector assembly includes an airflow fairing extending rearward from the electrical connector. The airflow fairing has a front end and a rear end. The airflow fairing has a curved profile between the front end and the rear end having a front cross-sectional area at the front end and a rear cross-sectional area at the rear end less than the front cross-sectional area.

Abstract: An optical communication device according to an embodiment of the present invention includes: a heat sink integrally having a plurality of contact portions respectively corresponding to the plurality of the optical transceivers, and a heat transfer portion bound to a casing so as to be able to transfer heat to the casing; a plurality of cage members configured to respectively accommodate the plurality of the optical transceivers, and having openings so as to allow the optical transceivers to be partially exposed to the contact portion side, respectively; a holding unit configured to hold the plurality of the cage members inside the casing in a state where the openings correspond to the contact portions, respectively; and an elastic member configured to bring the plurality of the optical transceivers into thermal contact with the plurality of the contact portions, respectively, by pressing each of the plurality of the cage members toward the heat sink side.

Abstract: In a joint structure between an electronic component and a frame provided in the present invention, an electronic component is disposed in a frame, and heat is conducted from the electronic component to a corresponding windward part of the frame when a bicycle moves, so that the heat can be dissipated rapidly, thereby achieving a desirable heat dissipation effect.

Abstract: A galley cooling system for an aircraft includes a trolley compartment which includes a cooling unit. A first cooling fluid manifold connects to a cooling fluid outlet or a cooling fluid inlet and has a first cooling fluid manifold wall defining a portion of a lateral boundary of a receiving space of the trolley compartment. A first cooling fluid opening is in the first cooling fluid manifold wall connecting the first cooling fluid manifold to the receiving space of the trolley compartment. A second cooling fluid manifold connected to the cooling fluid inlet or outlet of the cooling unit has a second cooling fluid manifold wall defining a portion of an upper boundary of the receiving space of the trolley compartment, a second cooling fluid opening in the second cooling fluid manifold wall to connect the second cooling fluid manifold to the receiving space of the trolley compartment.

Abstract: Examples disclosed herein relate to a baffle with an integrated optical connector. One example includes a component to attach to an interconnect device where the component allows a heat exchanging medium to flow through an opening in itself. This example can include a slot in the component for integration of an optical connector into the component. The slot can also be used to secure the optical connector to the interconnect device and to align the optical connector to enable communication with the interconnect device.

Abstract: An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry.

Abstract: A display device for a vehicle and an automobile including the same are disclosed. In one aspect, the display device includes a display unit including an display area on which a plurality of pixels are disposed and a non-display area adjacent to the display area and bent with respect to the display area, wherein a light from the plurality of pixels emits in a front direction, and a heat radiation member adjacent to a rear surface of the display unit and including a first plate facing the rear surface of the display unit, a plurality of first heat radiation pins protruding from the first plate, a first opposite plate parallel to the first plate, and a pair of first side plates at opposite sides of the first plate.

Abstract: The present disclosure relates to a method for controlling a display of an electronic device and a device thereof to adjust a load of the electronic device by adjusting a resolution of the display. An operation method of the electronic device comprises: detecting, by a load detector, an amount of load on the electronic device; analyzing, by a monitoring unit, the detected amount of load and generating a graphic control signal; changing, by a graphic processing unit, a resolution of the electronic device; and displaying, by a display, data reflecting the changed resolution.

Abstract: Exemplary drone power pack housing/assembly embodiments and drone power pack embodiments disclosed herein are standardized, common form factor, devices. Exemplary power packs and power pack housings may be modular in nature such that components thereof may be shared. Exemplary power packs and power pack housings may be used on a multitude of drones to facilitate repowering and servicing. Exemplary power packs and power pack housings may be designed to also facilitate installation to and removal from a drone by automated means.

Abstract: A cooler module has a cooling tube and a support member. The cooling tube has a first protruding tube portion and a second protruding tube portion. The first protruding tube portion is provided with a first flexible portion formed in an annular shape. The second protruding tube portion is provided with a second flexible portion formed in an annular shape. The support member has a first fitting portion fitted to the first protruding tube portion and a second fitting portion fitted to the second protruding tube portion. The support member supports a longitudinal center portion of the cooling tube on a condition that the first protruding tube portion and the first fitting portion are fitted together, the second protruding tube portion and the second fitting portion are fitted together, and the first flexible portion and the second flexible portion are recessed toward an inside of the cooling tube.

Abstract: The present disclosure involves a heat dissipater for a storage and the corresponding storage. The storage comprises a drawer chassis including at least one baffle arranged in a direction perpendicular to a pulling direction of the drawer chassis. The drawer chassis accommodates disks organized in a plurality of rows and placed against the corresponding baffle. The heat dissipater comprises: venting holes arranged on the baffle and corresponding to disks placed against the respective baffle; and flyers arranged on the baffle and corresponding to the venting holes respectively, the flyers being arranged to block the corresponding venting holes and to expose the corresponding venting holes in response to the attraction of the magnetic winding.

Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The dual-mode optical network interface circuitry can have a bandwidth equal to or greater than the storage devices.

Abstract: A central-string inverter device is provided, including a container and multiple string inverters installed in the container. The multiple string inverters are arranged in two rows located respectively on two opposite sides of the container. An intermediate duct is formed between the two rows of string inverters. An air outlet is arranged on each of side walls of the two opposite sides of the container. An air inlet is arranged on each of side walls of the other two opposite sides of the container or on a bottom wall of the container. Pulling structures corresponding to the multiple string inverters are arranged on the side walls of the two opposite sides of the container. Each string inverter is installed or removed through the pulling structure.

Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Abstract: Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Abstract: Systems and methods for transformer cooling by vertical airflow are described. One embodiment of an air transfer unit includes an assembly frame that includes an interior portion and defines a lateral side, an upper side, and a lower side, where the assembly frame includes a length that is substantially the same as a width of a plurality of cooling fins on a transformer. Some embodiments include a plurality of air directing apparatuses that are positioned in the interior portion and are aligned along the length of the assembly frame, where the plurality of air directing apparatuses receive airflow from the lateral side and direct the airflow vertically through the upper side to further cool the plurality of cooling fins. Similarly, some embodiments include an exhaust screen that is coupled to the upper side, wherein the exhaust screen further consolidates the airflow vertically toward the plurality of cooling fins.

Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract: An apparatus comprising a cage for pluggable optical modules including a bay having a first port stacked with a second port, the bay having an opening between the first and second port; a heat collector module in the opening comprising a first contact plate adjacent to the first port bottom and provided in the first port and configured to contact a first optical module in the first port, a second contact plate adjacent to the second port top and provided in the second port and configured to contact a second optical module insertable in the second port, a cold plate between the first and second contact plates, compressible thermal material layers between the contact plates and the cold plate; and a heat pipe having a first portion in thermal contact with the cold plate and a second portion extending beyond the stacked cage and in thermal contact with a radiator.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: An intelligent gate drive unit and related method for controlling one or more semiconductor switches of one or more power modules, the intelligent gate drive unit comprises at least a gate driver and an analog measuring circuit, wherein the gate driver facilitates control of the one or more semiconductor switches and wherein the analog measuring circuit facilitates measuring the switch voltage when the one or more semiconductor switches are in a conducting mode.