With Cooling Means Patents (Class 361/688)
  • Patent number: 10261275
    Abstract: Examples disclosed herein relate to a baffle with an integrated optical connector. One example includes a component to attach to an interconnect device where the component allows a heat exchanging medium to flow through an opening in itself. This example can include a slot in the component for integration of an optical connector into the component. The slot can also be used to secure the optical connector to the interconnect device and to align the optical connector to enable communication with the interconnect device.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: April 16, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: John Norton
  • Patent number: 10261370
    Abstract: An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: April 16, 2019
    Assignee: Apple Inc.
    Inventors: Paul S. Drzaic, Jeremy C. Franklin, Stephen Brian Lynch, Scott A. Myers, Benjamin M. Rappoport, Fletcher R. Rothkopf, John P. Ternus
  • Patent number: 10199595
    Abstract: A display device for a vehicle and an automobile including the same are disclosed. In one aspect, the display device includes a display unit including an display area on which a plurality of pixels are disposed and a non-display area adjacent to the display area and bent with respect to the display area, wherein a light from the plurality of pixels emits in a front direction, and a heat radiation member adjacent to a rear surface of the display unit and including a first plate facing the rear surface of the display unit, a plurality of first heat radiation pins protruding from the first plate, a first opposite plate parallel to the first plate, and a pair of first side plates at opposite sides of the first plate.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: February 5, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Cheolyun Jeong, Kinyeng Kang
  • Patent number: 10186009
    Abstract: The present disclosure relates to a method for controlling a display of an electronic device and a device thereof to adjust a load of the electronic device by adjusting a resolution of the display. An operation method of the electronic device comprises: detecting, by a load detector, an amount of load on the electronic device; analyzing, by a monitoring unit, the detected amount of load and generating a graphic control signal; changing, by a graphic processing unit, a resolution of the electronic device; and displaying, by a display, data reflecting the changed resolution.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 22, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Ho Kang, Mooyoung Kim, Sangwon Chae, Seungjae Han
  • Patent number: 10150579
    Abstract: Exemplary drone power pack housing/assembly embodiments and drone power pack embodiments disclosed herein are standardized, common form factor, devices. Exemplary power packs and power pack housings may be modular in nature such that components thereof may be shared. Exemplary power packs and power pack housings may be used on a multitude of drones to facilitate repowering and servicing. Exemplary power packs and power pack housings may be designed to also facilitate installation to and removal from a drone by automated means.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: December 11, 2018
    Assignee: Droneovation, Inc.
    Inventors: Todd A. James, Michael W. Westerfield, Bryan C. James
  • Patent number: 10147667
    Abstract: A cooler module has a cooling tube and a support member. The cooling tube has a first protruding tube portion and a second protruding tube portion. The first protruding tube portion is provided with a first flexible portion formed in an annular shape. The second protruding tube portion is provided with a second flexible portion formed in an annular shape. The support member has a first fitting portion fitted to the first protruding tube portion and a second fitting portion fitted to the second protruding tube portion. The support member supports a longitudinal center portion of the cooling tube on a condition that the first protruding tube portion and the first fitting portion are fitted together, the second protruding tube portion and the second fitting portion are fitted together, and the first flexible portion and the second flexible portion are recessed toward an inside of the cooling tube.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: December 4, 2018
    Inventors: Ryohei Tomita, Tomohiro Shimazu
  • Patent number: 10139874
    Abstract: The present disclosure involves a heat dissipater for a storage and the corresponding storage. The storage comprises a drawer chassis including at least one baffle arranged in a direction perpendicular to a pulling direction of the drawer chassis. The drawer chassis accommodates disks organized in a plurality of rows and placed against the corresponding baffle. The heat dissipater comprises: venting holes arranged on the baffle and corresponding to disks placed against the respective baffle; and flyers arranged on the baffle and corresponding to the venting holes respectively, the flyers being arranged to block the corresponding venting holes and to expose the corresponding venting holes in response to the attraction of the magnetic winding.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: November 27, 2018
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Hendry Xiaoping Wu, David Dong
  • Patent number: 10091904
    Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The dual-mode optical network interface circuitry can have a bandwidth equal to or greater than the storage devices.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 2, 2018
    Inventors: Steven C. Miller, Michael Crocker, Aaron Gorius, Paul Dormitzer
  • Patent number: 10038391
    Abstract: A central-string inverter device is provided, including a container and multiple string inverters installed in the container. The multiple string inverters are arranged in two rows located respectively on two opposite sides of the container. An intermediate duct is formed between the two rows of string inverters. An air outlet is arranged on each of side walls of the two opposite sides of the container. An air inlet is arranged on each of side walls of the other two opposite sides of the container or on a bottom wall of the container. Pulling structures corresponding to the multiple string inverters are arranged on the side walls of the two opposite sides of the container. Each string inverter is installed or removed through the pulling structure.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: July 31, 2018
    Inventors: Wei Zhao, You Lu, Tan Shen, Xiaodong Mei
  • Patent number: 10034416
    Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: July 24, 2018
    Assignee: Cray Inc.
    Inventors: Gregory W. Pautsch, Eric D. Lakin
  • Patent number: 9974213
    Abstract: Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 15, 2018
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 9961806
    Abstract: Systems and methods for transformer cooling by vertical airflow are described. One embodiment of an air transfer unit includes an assembly frame that includes an interior portion and defines a lateral side, an upper side, and a lower side, where the assembly frame includes a length that is substantially the same as a width of a plurality of cooling fins on a transformer. Some embodiments include a plurality of air directing apparatuses that are positioned in the interior portion and are aligned along the length of the assembly frame, where the plurality of air directing apparatuses receive airflow from the lateral side and direct the airflow vertically through the upper side to further cool the plurality of cooling fins. Similarly, some embodiments include an exhaust screen that is coupled to the upper side, wherein the exhaust screen further consolidates the airflow vertically toward the plurality of cooling fins.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: May 1, 2018
    Assignee: Power Distribution Systems Development LLC
    Inventor: Joseph M. Guentert
  • Patent number: 9952638
    Abstract: In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: April 24, 2018
    Assignee: Intel Corporation
    Inventors: Shaorong Zhou, Hong W. Wong
  • Patent number: 9946315
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 17, 2018
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 9910231
    Abstract: An apparatus comprising a cage for pluggable optical modules including a bay having a first port stacked with a second port, the bay having an opening between the first and second port; a heat collector module in the opening comprising a first contact plate adjacent to the first port bottom and provided in the first port and configured to contact a first optical module in the first port, a second contact plate adjacent to the second port top and provided in the second port and configured to contact a second optical module insertable in the second port, a cold plate between the first and second contact plates, compressible thermal material layers between the contact plates and the cold plate; and a heat pipe having a first portion in thermal contact with the cold plate and a second portion extending beyond the stacked cage and in thermal contact with a radiator.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: March 6, 2018
    Assignee: Infinera Corporation
    Inventors: Matthew James Kelty, Thomas George Macall
  • Patent number: 9899999
    Abstract: An intelligent gate drive unit and related method for controlling one or more semiconductor switches of one or more power modules, the intelligent gate drive unit comprises at least a gate driver and an analog measuring circuit, wherein the gate driver facilitates control of the one or more semiconductor switches and wherein the analog measuring circuit facilitates measuring the switch voltage when the one or more semiconductor switches are in a conducting mode.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 20, 2018
    Assignee: KK Wind Solutions A/S
    Inventor: Bjørn Rannestad
  • Patent number: 9901010
    Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 20, 2018
    Assignee: Skyera, LLC
    Inventors: Pinchas Herman, William Radke, Radoslav Danilak
  • Patent number: 9859810
    Abstract: A power converter (30) comprising components of a power converter circuit, the components including switching elements (31 to 36), smoothing capacitors (37 to 39), and circuit boards (66 and 67) on which drive circuit parts for driving the switching elements are mounted, wherein the components are housed in a case (65), input power is converted and output through high-voltage terminals (69 to 79), and the high-voltage terminals (69 to 79) and the circuit boards (66 and 67) are provided in a common plane area (E).
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: January 2, 2018
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Nobuaki Yokoyama, Kazuhiro Hayakawa, Takaya Ishii
  • Patent number: 9843395
    Abstract: An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: December 12, 2017
    Assignee: FCI Asia Pte. Ltd.
    Inventor: Ulrich Keil
  • Patent number: 9807911
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: October 31, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: David Edward Bryan, Christopher Strickland Beall, Darin Lee Frink
  • Patent number: 9704777
    Abstract: An electric power converter includes a laminated semiconductor unit, a beam member that supports the laminated semiconductor unit from a rear end in a laminating direction, a frame, and a plurality of pressing plates. The frame that accommodates the laminated semiconductor unit, and has an insertion opening in a rear thereof in the laminating direction into which the laminated semiconductor unit can be inserted. The plurality of pressing plates are accommodated between a front wall portion of the frame and the laminated semiconductor unit, and the pressing plates press the laminated semiconductor unit in a direction from the front toward the rear. The plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction. The beam member is fixed to the frame.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: July 11, 2017
    Inventor: Eiji Nakagawa
  • Patent number: 9696769
    Abstract: A chassis includes a base, a lid, and air baffles disposed within the base. The lid slidably engages opposing base side walls and slides between secured and unsecured positions. In one embodiment, a mechanical latch attaches to the lid and has a spring-biased latch arm for selectively locking the lid to the base and a latch hook for selectively locking the air baffle to the lid, wherein depressing the mechanical latch releases the lid from the base and physically separating the lid from the base causes the latch hook to secure the air baffle for removing the air baffle along with the lid. In another embodiment, a first magnet is attached to the lid and a second magnet is attached to the air baffle, wherein sliding the lid to the unsecured position aligns the first and second magnets and magnetically couples the air baffle to the lid.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: July 4, 2017
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Jeffrey R. Hamilton, Mark J. Staley, Jimmy X. Tang, Troy S. Voytko, Jack P. Wong
  • Patent number: 9689340
    Abstract: A controller integrated fuel pump module may include a receiving part formed on an outer surface of a flange assembled in a fuel tank, a PCB assembly configured by mounting elements of a controller to a PCB, wherein the PCB assembly is molded by a molding part while being received in the receiving part, and a convexo-concave portion having a shape in which recesses and bosses, the convexo-concave portion being repeatedly formed on an inner surface of the receiving part, such that a bonding force between the receiving part and the molding part is increased by the convexo-concave portion.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: June 27, 2017
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Ju Tae Song, Byung Cheol Lee
  • Patent number: 9622292
    Abstract: Mount for an access point and an antenna includes a base for attachment to a support structure, the base for attaching thereto an access point; and a tray pivotably attached to the base, the tray for attaching thereto an antenna. The tray is disposed above the base and the tray is positionable at an angle relative to a reference plane.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: April 11, 2017
    Assignee: Tessco Communications Incorporated
    Inventors: Dennis Burrell, Timothy Ortel
  • Patent number: 9622362
    Abstract: Mount for an access point and an antenna includes a base for attachment to a mounting structure, the base for attaching thereto an access point; and a tray pivotably attached to the base, the tray for attaching thereto an antenna. The tray is disposed above the base and the tray is positionable at an angle relative to a reference plane.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: April 11, 2017
    Assignee: Tessco Communications Incorporated
    Inventors: Dennis Burrell, Timothy Ortel
  • Patent number: 9450547
    Abstract: A system and method for packaging a semiconductor device that includes a wall to reduce electromagnetic coupling is presented. A semiconductor device has a substrate on which a first circuit and a second circuit are formed proximate to each other. An isolation wall of electrically conductive material is located between the first circuit and the second circuit, the isolation wall being configured to reduce inductive coupling between the first and second circuits during an operation of the semiconductor device. Several types of isolation walls are presented.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: September 20, 2016
    Inventors: Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos, Mahesh K. Shah
  • Patent number: 9414515
    Abstract: An electrical device, which is assembled from modules or includes assembled modules, the modules each including an electronic circuit mounted on a respective heat sink, the modules being configured as nodes of a system bus that also leads to an electronic circuit designed as a node of the system bus, the electronic circuit being configured in a lower part that is configured in a recess of the housing of the electrical device; an upper part being detachably connectable to the lower part; a memory element being configured in the upper part; and data lines for reading out the memory element via the electronic circuit being routed via a plug connection to the electronic circuit.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 9, 2016
    Inventors: Michael Kiesel, Ronny Enenkel, Alexander Junginger
  • Patent number: 9408328
    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: August 2, 2016
    Assignee: Apple Inc.
    Inventors: Jay S. Nigen, Ron A. Hopkinson, Derek J. Yap, Eric A. Knopf, William F. Leggett, Richard H. Tan
  • Patent number: 9318407
    Abstract: A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: April 19, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Weifeng Liu, Yuming Ye, Zhao Xiang, Zhi Xu
  • Patent number: 9298231
    Abstract: Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s).
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: March 29, 2016
    Inventors: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider
  • Patent number: 9289844
    Abstract: A welding power supply includes a housing and a one-piece chassis. The one-piece chassis is coupled to the housing and configured to be enclosed within the housing. Moreover, the one-piece chassis is configured to be selectively removable from the housing and the one-piece chassis is configured to have multiple components coupled thereto. The components include one or more transformers, a fan blade, one or more rectifiers, one or more inductors, and control circuitry.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: March 22, 2016
    Inventor: Dennis R. Sigl
  • Patent number: 9252070
    Abstract: A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the second substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: February 2, 2016
    Inventors: Yoshihiro Mizuno, Norinao Kouma, Osamu Tsuboi
  • Patent number: 9204490
    Abstract: A base station installation apparatus included in a base station, and a base station are disclosed. The base station installation apparatus included in a base station may include a front housing, N substrates, an elastic component, and a back housing, where the N substrates are secured on the elastic component, the elastic component is secured on the back housing or the front housing, and the substrate is configured to secure a base station processing module; the elastic component can drive the N substrates to be arranged in a straight line, and the elastic component can also drive, by deformation, the N substrates to be arranged in a curve; and the front housing and the back housing are each provided with a deformable structure, so that the front housing and the back housing can deform adaptively as the elastic component deforms, where N is an integer greater than 1.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: December 1, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Chang Shi, Chunbo Zhao, Minghui Zheng
  • Patent number: 9142602
    Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: September 22, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jin Sic Min, Dae Geun Lee, Sang Urn Lim, Eu Tteum Kim
  • Patent number: 9131623
    Abstract: Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer form a sub-assembly. The sub-assembly is placed in an aperture in a circuit board with the interposer providing interconnections between the electronic component and the circuit board. The circuit board is coupled to the electronic component at least by one or more fluidic channels included in the interposer. The sub-assembly placed in the aperture in the circuit board as described herein conceals the thickness of the integrated circuit within the thickness of the circuit board, reducing overall thickness.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: September 8, 2015
    Assignee: Amazon Technologies, Inc.
    Inventor: David C. Buuck
  • Patent number: 9078357
    Abstract: An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: July 7, 2015
    Assignee: Seagate Technology LLC
    Inventor: Neal Frank Gunderson
  • Publication number: 20150146375
    Abstract: A power conversion device is provided. The power conversion device includes a printed wiring board assembly, a grounding member, and a plurality of insulating struts. The printed wiring board assembly includes a printed circuit board and a plurality of electronic components. The printed circuit board has a plurality of through holes. The electronic components are disposed on the printed circuit board. The insulating struts correspond to the through holes and physically connect and electrically insulate the printed circuit board and the grounding member.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 28, 2015
    Inventors: Xing-Xian LU, Pei-Ai YOU, Gang LIU, Jin-Fa ZHANG
  • Patent number: 9042096
    Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 26, 2015
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Mark A. Thomas, Dennis Gammel, Shankar V. Achanta
  • Patent number: 9035583
    Abstract: The system has a driving circuit for the motor of the electric fan, coupled to the electrical system of a motor vehicle and having a plurality of controlled electronic switches, and an electronic control unit arranged to control the driving circuit in such a way as to cause the flow in the motor of a variable average current capable of producing a required speed of rotation, in accordance with a predetermined relationship or function. The control unit is designed to store a predetermined threshold of rotation speed, and to control the motor through the associated driving circuit in such a way that when the rotational speed of the motor exceeds the threshold the driving circuit causes electrical braking of the motor.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: May 19, 2015
    Assignee: GATE S.R.L.
    Inventors: Davide Cerrato, Pierfranco Pangella
  • Patent number: 9029814
    Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 12, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Ryotaro Matui, Hideaki Yokoyama
  • Patent number: 9030842
    Abstract: An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 12, 2015
    Assignee: Electrojet, Inc.
    Inventor: Kyle E. E. Schwulst
  • Publication number: 20150124407
    Abstract: An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity, such as polyetheretherketone. A reflective surface may be disposed on a housing containing the substrate to reduce the absorption of radiation. A heat sink and fluid inlet and outlet may also be arranged to remove heat generated by the electrical components.
    Type: Application
    Filed: February 27, 2014
    Publication date: May 7, 2015
    Applicant: Hamilton Sundstrand Corporation
    Inventor: Leo J. Veilleux, JR.
  • Patent number: 9019700
    Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: April 28, 2015
    Assignee: Bloom Energy Corporation
    Inventors: Arne Ballantine, KR Sridhar, Jon Christopher Motta, Peter Light, Carl Cottuli, Jessica Mahler
  • Publication number: 20150098187
    Abstract: A method according to an exemplary aspect of the present disclosure includes, among other things, controlling a vehicle using switching loss information of a semiconductor switching device, the switching loss information derived from a conduction loss and a combined conduction and switching loss.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 9, 2015
    Inventors: Chingchi CHEN, Krishna Prasad BHAT, Michael W. DEGNER, Ke ZOU
  • Patent number: 9000582
    Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 7, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Shinji Hiramitsu, Atsushi Koshizaka, Masato Higuma, Hiroshi Tokuda, Keiji Kawahara
  • Patent number: 8995122
    Abstract: An electronic-device housing stores an electronic circuit and a cooling fan. The electronic-device housing includes a first surface having at least one opening to release heat outside. At least one projected portion projects toward an outside of the electronic-device housing, and when the electronic-device housing is installed on an installation surface so that the first surface is opposed to the installation surface and the projected portion comes into contact with the installation surface, a rotation moment acting on a gravity center of the electronic-device housing acts in a direction where the rotation moment causes the first surface to move away from the installation surface.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Tetsuhiro Sano
  • Patent number: 8995933
    Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: March 31, 2015
    Assignee: Motorola Solutions, Inc.
    Inventors: John M. Waldvogel, Herman J. Miller
  • Patent number: 8984906
    Abstract: An improved solution for cooling a data center is provided. In an embodiment of the invention, a data center design that combines physical segregation of hot and cold air streams together with a data hall variable air volume system is provided. The invention is a data center design that resolves air management issues of re-circulation, bypass and load balance. Bypass is airflow supplied by the cooling units that directly returns without cooling servers. Recirculation airflow is server discharge warm air that returns directly without being cooled. Load balance is supplying the required server airflow. An embodiment includes physical segregation of cold and hot air streams and by providing variable air volume to match server load. Air segregation is done by enclosing the hot aisle end and above the cabinets. The air conditioning system provides variable air volume to the data hall (cold side) to meet server demands.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: March 24, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Robert M. Tozer
  • Patent number: 8988877
    Abstract: In a computer system, airflow through first and second cooling regions are normally separated by a chassis wall, and are independently controlled by respective first and second fan modules. The internal chassis wall includes a bypass opening that is normally blocked by the second fan module. In response to removal of the second fan module, the bypass opening is unblocked, to fluidly couple the two cooling regions. A redundant fan module is optionally included in fluid communication with the first cooling region, to either generate airflow through the first cooling region in response to failure or removal of the first fan module, or to supplement the airflow capacity of the first fan module in response to removal of the second fan module.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: March 24, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Kevin M. Cash, David J. Jensen, Jared E. Schott, Brian A. Trumbo
  • Patent number: 8982540
    Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 17, 2015
    Assignee: Panduit Corp.
    Inventors: Rey Bravo, John C. Senese