Fluid Patents (Class 361/689)
  • Patent number: 11509235
    Abstract: A mounting base can comprise: a group of mounting areas, each mounting area of the group of mounting areas comprising: a respective mechanical connector member of a group of respective mechanical connector members for attaching to a complementary mechanical connector member on each direct-current to direct-current (DC/DC) converter unit of the group of DC/DC converter units, and a respective electrical connector of a group of respective electrical connectors for attaching to a complementary electrical connector on each DC/DC converter unit of the group of DC/DC converter units, a group of electrical conductors attached to the group of respective electrical connectors in each mounting area, and attached to a main connector on the mounting base for connecting to a high-voltage (HV) connector of a main HV supply, and a cooling channel extending in heat conducting contact with the group of mounting areas.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: November 22, 2022
    Assignee: Volvo Car Corporation
    Inventors: Axel Vänerhav, Sofia Lorensson
  • Patent number: 11507017
    Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: November 22, 2022
    Inventor: Yuci Shen
  • Patent number: 11502023
    Abstract: It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: November 15, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventor: Koichi Ushijima
  • Patent number: 11495974
    Abstract: A modular integrated ultracapacitor-based energy storage and power delivery apparatus (UCAP module) is described. In some embodiments, the UCAP module comprises: at least one ultracapacitor cell coupled together in a series, parallel, or combination of both series and parallel configuration; an integrated charging unit; conductive hardware electrically coupling the ultracapacitors cells together; at least one UCAP terminal rod extending throughout the UCAP module and used to route power within the UCAP module and in some embodiments to other UCAP modules; and a protective casing. In some embodiments the UCAP terminal rod couples the UCAP module to at least one additional UCAP module in a series, parallel, or a combination of both series and parallel configurations. In other embodiments, the UCAP module further comprises connector rods that electrically and mechanically couple the UCAP module to at least one additional UCAP module.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 8, 2022
    Assignee: UCAP Power, Inc.
    Inventors: Joshua Hitt, Troy Brandon, Blaine Bynum, Gordon Schenk
  • Patent number: 11472287
    Abstract: An example system includes a motive application having a prime mover, a load, a driveline, and a motor/generator that couples to the driveline. The system includes a number of batteries, and a battery assembly that electrically couples the batteries to the motor/generator. The battery assembly includes a power interface positioned at a first end of the battery assembly, the power interface including a low voltage coupling and a high voltage coupling, and a service electrically interposed between the batteries and the power interface. The service disconnect in a first position couples at least one of the batteries to the first low voltage coupling and couples the batteries to the second high voltage coupling. The service disconnect in a second position de-couples the batteries from the low voltage coupling and the high voltage coupling.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 18, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventor: Thomas Joseph Stoltz
  • Patent number: 11455019
    Abstract: A docking system for facilitating a connection of an electronics module to a mating connector comprises first and second rails. Each rail has an elongated guide slot for receiving a corresponding guide portion of the electronics module during sliding movement of the electronics module toward the mating connector. A first elastic structure is located on the first rail. The first elastic structure has a first engagement portion extending into the elongated guide slot of the first rail. A second elastic structure is located on the second rail. The second elastic structure has a second engagement portion extending into the elongated guide slot of the second rail. The first engagement portion and the second engagement portion are configured to engage the guide portions of the electronics module and to resist movement of the guide portions in a direction generally perpendicular to the sliding movement of the electronics module.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: September 27, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun Chang, Chia-Chun Chen, Ta-Wei Chen, Zhao-Hong Chen
  • Patent number: 11452236
    Abstract: A housing includes a cup-shaped, plastic housing case; a cooling channel guided in the housing case for fluid cooling of an electric or electronic device situated in an interior of the housing case; and a planar shielding body integrated into the housing case and traversing walls of the housing case for shielding from electromagnetic radiation. The shielding body is a metallic wire cage or trough. The cooling channel is a metallic tubing. The shielding body and the cooling channel are connected to form a frame-like, pre-assembled assembly. The pre-assembled assembly, consisting of the shielding body and the cooling channel, is extrusion-coated with a plastic or encapsulated in a plastic to form the housing case.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: September 20, 2022
    Assignee: KOSTAL Automobil Elektrik GmbH & Co. KG
    Inventors: Berthold Esders, Matthias Thiel, Thorsten Puehl, Rene Riedel
  • Patent number: 11435784
    Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: September 6, 2022
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Boyd Drew Allin, Robin Michael Miller
  • Patent number: 11439039
    Abstract: A cold plate includes a first side with a first surface, and a second side, opposite the first side. A coolant cavity is formed between the first side and the second side. A recessed base is machined into the first surface of the first side. The recessed base is bonded to a base copper plate and is a thinnest portion of the first surface.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: September 6, 2022
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Hebri Vijayendra Nayak, Scott C. Wohlfarth, Michael Anthony Futrell
  • Patent number: 11439041
    Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: September 6, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Rakesh Chopra, M. Baris Dogruoz, Mark Nowell, Mandy Hin Lam
  • Patent number: 11387658
    Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: July 12, 2022
    Assignee: Hubbell Incorporated
    Inventor: Nelson Bonilla
  • Patent number: 11388839
    Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: July 12, 2022
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Feng Zhou, Shohei Nagai
  • Patent number: 11375637
    Abstract: A heat sink includes a pipe through which cooled fluid flows and a cooling block having a first face on which the pipe is placed and a second face to which a heat emitting element is attached. The cooling block has a contact region and a noncontact region at positions where the cooling block faces the pipe. In the contact region, the first face contacts the pipe. In the noncontact region, the first face faces the pipe with a gap therebetween. The contact region is included in a projection region defined by projecting a region of attachment of the heat emitting element onto the first face.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: June 28, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Mizutani, Takanori Koike
  • Patent number: 11363738
    Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 14, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11355419
    Abstract: The present invention relates to a power semiconductor module including a first heat dissipation substrate, a semiconductor chip, a lead plate, a PCB, and a heat dissipation plate that are packaged within a casing, wherein dualization of a heat dissipation structure is applied to facilitate superior heat dissipation performance compared to a conventional power semiconductor module.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: June 7, 2022
    Assignee: Amosense Co., Ltd.
    Inventor: Ik-Seong Park
  • Patent number: 11357137
    Abstract: The present invention discloses a one-chambered constant pressure apparatus for liquid immersion cooling of servers, which are submerged within a non-conductive coolant maintained in the apparatus. When servers start to operate, a large amount of heat will be dissipated from servers. The coolant is vaporized into a coolant vapor by absorbing heat dissipated from servers, which enables servers to be cooled. The coolant vapor is condensed into a cooling liquid by a condenser. However, in the process of condensation, the rising coolant vapor tends to scatter in all directions resulting in a failure to condense all of the coolant vapor. Therefore, the uncondensed coolant vapor will cause the pressure in the apparatus to gradually rise, which eventually leads to the ineffective cooling of servers.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 7, 2022
    Inventors: Fang-Shou Lee, Cho-Han Lee
  • Patent number: 11349312
    Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: May 31, 2022
    Assignee: Hubbell Incorporated
    Inventor: Nelson Bonilla
  • Patent number: 11297745
    Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: April 5, 2022
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: William P. King, Nenad Miljkovic, Patricia B Weisensee, Beomjin Kwon, Tianyu Yang
  • Patent number: 11282767
    Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 22, 2022
    Assignee: ADVANCED SEMICONDUTOR ENGINEERING, INC.
    Inventors: Hsin-En Chen, Ian Hu, Jung-Che Tsai
  • Patent number: 11158563
    Abstract: A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 26, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromichi Gohara, Takafumi Yamada, Yuta Tamai
  • Patent number: 11127716
    Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 21, 2021
    Assignee: Analog Devices International Unlimited Company
    Inventors: Rigan McGeehan, Cillian Burke, Alan J. O'Donnell
  • Patent number: 11102911
    Abstract: Dew condensation in a housing of an inverter device can be prevented. The inverter device includes: a housing accommodating a power electronic element and an electrolytic capacitor; an opening formed in the housing; a thermal insulator disposed along a periphery of the opening; and a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, the water jacket being disposed such that a first surface of the body portion closes the opening from an outside of the housing, with the thermal insulator interposed therebetween. The power electronic element is mounted on the first surface of the body portion, and the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: August 24, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hisakazu Yamane, Takaaki Tanaka, Fumino Suzuki, Akihiro Sawada
  • Patent number: 11029730
    Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: June 8, 2021
    Assignee: Facebook Technologies, LLC
    Inventors: Boyd Drew Allin, Robin Michael Miller
  • Patent number: 10917998
    Abstract: A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: February 9, 2021
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, Steven Embleton, Edmond I. Bailey, James D. Curlee
  • Patent number: 10847851
    Abstract: A battery thermal management system includes a battery pack, a heat exchanger in fluid communication with the battery pack, a pump interposed between the heat exchanger and the battery pack to cause a heat exchange fluid to flow in a coolant loop between the heat exchanger and the battery pack. A heat capacitor is disposed downstream from the battery pack with respect to a direction of a flow of the heat exchange fluid through the coolant loop and upstream from the heat exchanger in the direction of the flow of the heat exchange fluid through the coolant loop. A valve is disposed in the coolant loop upstream from the heat capacitor in the direction of the flow of the coolant through the coolant loop. The valve controls at least a portion of the flow of the coolant through at least one of the heat capacitor and the heat exchanger.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 24, 2020
    Assignee: HANON SYSTEMS
    Inventors: L'uboslav Kollár, Guillaume Hébert
  • Patent number: 10765044
    Abstract: An electric power conversion device is provided with a case (60) which includes: a first member (61) having a first region (73) defining therein a first passage (78, 79) in which a cooling medium flows, and a second region (74) disposed on a side of the first region; and a second member (88) disposed so as to at least partly overlap with the second region as seen from a direction orthogonal to the second region in a spaced apart relationship to the second region, and internally defining a second passage (91) connected to the first passage. A reactor (31) is positioned in the first region, and a switching device (33) is positioned on the surface of the second member facing away from the first member while a capacitor (35) is positioned between the second member and the second region of the first member.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 1, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Toshiki Ikeda, Jun Kato, Kosuke Nishiyama, Takanori Sakaguchi, Takaaki Fushimi, Shinnosuke Sato, Ryota Kitamoto, Yusuke Shindo
  • Patent number: 10749220
    Abstract: A slave control apparatus including a receiver and a controller. The receiver is configured to receive a sensed physical quantity of a battery and a sensed output physical quantity of a converter corresponding to the battery. The controller is configured to determine state information of the battery based on the sensed physical quantity and the sensed output physical quantity, transmit the state information to a master control apparatus, and control the converter based on output information from the master control apparatus that corresponds to the state information.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: August 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jinyong Jeon
  • Patent number: 10716243
    Abstract: An information processing system (TS) includes: a set of information processing devices forming a plurality of electrical circuits (C1, C2, C3 . . . Cn) supplied with power via a power supply source (S), cooling elements (MR) being placed near at least part of the electrical circuits; at least one Stirling engine, the cooling elements (MR) of which form a hot source and produce a mechanical movement (Mvt) on the basis of a temperature differential (?T) between the hot source and a cold source (SF); and a generator (G) providing an electric current (iG) on the basis of the mechanical movement.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 14, 2020
    Assignee: BULL
    Inventor: Yann Maupu
  • Patent number: 10667443
    Abstract: The present invention provides an electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity. The electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity includes: an electromagnetic wave blocking device body part configured such that an identical material is mixed with shielding and absorbing materials or different materials are arranged on both sides of a boundary of their sides to thus enable electromagnetic wave absorption and electromagnetic wave shielding; and an edge electromagnetic wave absorbing part formed along the boundary of the blocking device body part to thus additionally block electromagnetic waves. Furthermore, the present invention provides a method for manufacturing the electromagnetic wave blocking device.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: May 26, 2020
    Assignees: KOREA E3TEST INSTITUTE INC.
    Inventors: Nam Sic Kim, Hyun Yu Nam
  • Patent number: 10595439
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud
  • Patent number: 10548246
    Abstract: An electric power converter is provided which includes a stack body made of a stack of a plurality of electronic devices and cooling medium flow paths in which cooling medium flows. The electric power converter also includes a housing in which the stack body is disposed. The housing 3 has a stack facing wall which faces the stack body in a stacking direction. The stack facing wall has an in-wall flow path in which the cooling medium flows and which communicates the cooling medium flow paths. This structure enables the electric power converter to be reduced in size thereof.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: January 28, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Takeuchi, Taijiro Momose
  • Patent number: 10523109
    Abstract: An electrified vehicle capacitor assembly including a film capacitor assembly and a support structure is provided. The film capacitor assembly may include a stack of alternating electrodes and film layers. The electrodes may be offset from one another to alternatively contact opposing terminals. The support structure may include coolant channels and may be arranged to orient the film capacitor assembly adjacent an inverter assembly and such that each is in conductive thermal communication with at least one of the coolant channels. The film capacitor assembly further includes a stack of alternating metal foils and film layers disposed between a pair of contact layers, a pair of terminals, and a first thermal plate. Each of the pair of terminals is disposed on an outer side of one of each of the pair of contact layers.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 31, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Jukkrit Noppakunkajorn, Sudhir Kumar
  • Patent number: 10378751
    Abstract: Accroding to the present disclosure, a heat sink, which may be used e.g. for LED lamps or bulbs for motor vehicle lights, includes: a plate-like portion extending along an axis with opposed mounting surfaces for at least one heat source, such as e.g. a LED lighting source, and a finned portion thermally coupled with the plate-like portion and including a plurality of annular fins extending around said axis.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: August 13, 2019
    Assignee: OSRAM GMBH
    Inventors: Alessandro Bizzotto, Marco Munarin, Nicola Schiccheri
  • Patent number: 10288330
    Abstract: In one general aspect, a converging split-flow microchannel evaporator is disclosed. It includes a conductive contact surface to mate to a surface to be cooled, with a core mounted in thermal connection with the conductive surface that defines at least one layer of microchannels. Within the core, one inlet restriction restricts the flow into each microchannel in a first group of the microchannels, and another restricts the flow into each microchannel in a second group. A centrally located fluid outlet receives the flows from opposite ends of the microchannels in the two groups. A check valve can be provided to help ensure ready startup without reverse flow.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: May 14, 2019
    Assignee: QCIP Holdings, LLC
    Inventor: Steven Schon
  • Patent number: 10151778
    Abstract: A voltage sensor housing includes a top portion including a conductive top portion composed of conductive material and non-conductive top portions composed of non-conductive material, a bottom portion composed of non-conductive material, side portions composed of non-conductive material, wherein the top portion the bottom portion and the side portions define an interior area structured to hold a voltage sensor, and conductive side portions composed of conductive material and being disposed adjacent to the side portions. The conductive top portion is electrically floating and the conductive side portions are electrically grounded.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: December 11, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Abhijeet Vikram Kshirsagar, Mark Allan Juds, Gayatri Shashikant Dharne
  • Patent number: 10136552
    Abstract: The present invention provides a water block for a water-cooling CPU radiator. The water block includes an upper shell, a bottom shell, an external pipe and a water pump. The upper shell includes a shell body and an upper cover. The shell body is provided with a first cavity, a side wall of the shell body is provided with a water outlet. The upper cover is provided with a water inlet, and both the water inlet and the water outlet are in fluid communication with the first cavity. The bottom shell is arranged at the lower end of the shell body and is provided with a second cavity, and the two sides of the bottom shell are provided with an upper water port and a water inlet, respectively, which are communicated with the second cavity. The external pipe is arranged outside the upper shell and the bottom shell.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: November 20, 2018
    Assignee: BEIJING DEEPCOOL INDUSTRIES CO., LTD.
    Inventors: Lei Liu, Haibo Yu, Edward Xia
  • Patent number: 10079197
    Abstract: A power semiconductor device has a metal molded body forming a first connecting conductor. From a first main surface of the metal molded body there is a first recess having a first base in which a first power semiconductor component is arranged which faces the first base and is connected in an electrically conductive manner. From a second main surface of the metal molded body, a second recess has a second base, and a second power semiconductor component is arranged with the first contact surface thereof associated with the second base connected in an electrically conductive manner to this base. An insulating material layer is on both main surfaces, filling and completely covering the recess, wherein the first insulating layer has an electrically conductive first via which connects a second contact surface of the first power semiconductor component in an electrically conductive manner to a first conducting surface arranged on the first insulating layer.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 18, 2018
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventor: Michael Schleicher
  • Patent number: 10077947
    Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: September 18, 2018
    Assignee: ABB Schweiz AG
    Inventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert, Timo Koivuluoma
  • Patent number: 9999150
    Abstract: An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: June 12, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ken Maeda, Toshiya Satoh
  • Patent number: 9973070
    Abstract: An electric power converter includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked. Each of the semiconductor modules is provided with a main body that has semiconductor elements therein, a plurality of power terminals, and control terminals. Among the plurality of the power terminals respectively included in the two semiconductor modules adjoining in a stacking direction of the stacked body, at least parts of the power terminals are configured so as not to overlap each other when viewed from the stacking direction.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: May 15, 2018
    Assignee: DENSO CORPORATION
    Inventors: Hiroshi Shimizu, Naoki Hirasawa
  • Patent number: 9935035
    Abstract: An interposer structure including a dielectric base material, and a metal based interconnect structure extending through the dielectric base material from a first side of the dielectric base material to an opposing second side of the dielectric base material. At least one metal line of the metal based interconnect structure extends from the first side of the dielectric base material to the second side of the dielectric base material and has a first non-linear portion. A fluidic passage extends through the dielectric base material, wherein the fluidic passage has a second non-linear portion.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: April 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
  • Patent number: 9839164
    Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: December 5, 2017
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, Steven Embleton, Edmond I. Bailey, James D. Curlee
  • Patent number: 9803938
    Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: October 31, 2017
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Patent number: 9756755
    Abstract: An electric power converter includes a semiconductor module, a capacitor, and a DC bus bar that electrically connects them. The capacitor has a capacitor element and a capacitor terminal connected to the capacitor element. The capacitor terminals and the DC bus bar are connected to each other at least at two connecting portions. The DC bus bar has a bus bar main body portion that is connected to the semiconductor module. The two connecting portions are connected by at least a portion of the bus bar main body portion. The capacitor terminal has a terminal main body portion that is connected to the capacitor element. The two connecting portions are connected by at least a portion of the terminal main body portion.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: September 5, 2017
    Assignee: DENSO CORPORATION
    Inventors: Naohisa Harada, Akira Nakasaka
  • Patent number: 9742305
    Abstract: A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The capacitor is a structural member disposed in a direction perpendicular to the frame portion and including a capacitor element electrically connected to the electric circuit element. The capacitor includes a first support surface and a second support surface that are external surfaces facing in opposite directions from each other and parallel to the direction perpendicular to the frame portion. The first frame and the second frame each have an end portion fixed to a connection frame. The first frame includes a first attachment surface fixed to a first support surface. The second frame includes a second attachment surface fixed to a second support surface.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: August 22, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hirokazu Takabayashi
  • Patent number: 9661740
    Abstract: An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 23, 2017
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Roland Bittner, Marco Lederer, Sven Teuber, Matthias Spang
  • Patent number: 9587769
    Abstract: A connecting structure includes a housing, a cooler, an inner refrigerant pipe, an outer refrigerant pipe, and a joint pipe. The joint pipe is attached to a through hole of the housing. The inner refrigerant pipe is fitted to the joint pipe from a housing inner side. The outer refrigerant pipe is fitted to the joint pipe from a housing outer side. A tip of the inner refrigerant pipe and a tip of the outer refrigerant pipe define a gap inside the joint pipe. An end surface of a flange or a rib of the outer refrigerant pipe in a refrigerant-pipe axis direction abuts with an end surface of a flange or a rib of the joint pipe in the refrigerant-pipe axis direction.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: March 7, 2017
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Keitaro Ishikawa
  • Patent number: 9536671
    Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: January 3, 2017
    Assignee: TELSA MOTORS, INC.
    Inventors: Robert James Ramm, Dino Sasaridis, Colin Campbell, Wenjun Liu
  • Patent number: 9507378
    Abstract: An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: November 29, 2016
    Assignee: NVIDIA CORPORATION
    Inventor: Shuang Xu
  • Patent number: 9488673
    Abstract: Chassis for an automated test system including a housing and at least a first and a second backplane in the housing. The first backplane provides electrical connections for at least one functional module of a first type when engaged with the first backplane, while the second backplane provides electrical connections for at least one functional module of a second type different than the first type when engaged with the second backplane. The first and second backplanes include electrical circuitry to enable signals to be provided for the functional modules when engaged therewith. A bottom of the housing includes ducts to enable cooling of both types of functional modules when engaged with the housing.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: November 8, 2016
    Assignee: Advanced Testing Technologies, Inc.
    Inventors: Richard Engel, Eli Levi, Robert Spinner, Thomas Leddy