Fluid Patents (Class 361/689)
  • Patent number: 10716243
    Abstract: An information processing system (TS) includes: a set of information processing devices forming a plurality of electrical circuits (C1, C2, C3 . . . Cn) supplied with power via a power supply source (S), cooling elements (MR) being placed near at least part of the electrical circuits; at least one Stirling engine, the cooling elements (MR) of which form a hot source and produce a mechanical movement (Mvt) on the basis of a temperature differential (?T) between the hot source and a cold source (SF); and a generator (G) providing an electric current (iG) on the basis of the mechanical movement.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 14, 2020
    Assignee: BULL
    Inventor: Yann Maupu
  • Patent number: 10667443
    Abstract: The present invention provides an electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity. The electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity includes: an electromagnetic wave blocking device body part configured such that an identical material is mixed with shielding and absorbing materials or different materials are arranged on both sides of a boundary of their sides to thus enable electromagnetic wave absorption and electromagnetic wave shielding; and an edge electromagnetic wave absorbing part formed along the boundary of the blocking device body part to thus additionally block electromagnetic waves. Furthermore, the present invention provides a method for manufacturing the electromagnetic wave blocking device.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: May 26, 2020
    Assignees: KOREA E3TEST INSTITUTE INC.
    Inventors: Nam Sic Kim, Hyun Yu Nam
  • Patent number: 10595439
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud
  • Patent number: 10548246
    Abstract: An electric power converter is provided which includes a stack body made of a stack of a plurality of electronic devices and cooling medium flow paths in which cooling medium flows. The electric power converter also includes a housing in which the stack body is disposed. The housing 3 has a stack facing wall which faces the stack body in a stacking direction. The stack facing wall has an in-wall flow path in which the cooling medium flows and which communicates the cooling medium flow paths. This structure enables the electric power converter to be reduced in size thereof.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: January 28, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Takeuchi, Taijiro Momose
  • Patent number: 10523109
    Abstract: An electrified vehicle capacitor assembly including a film capacitor assembly and a support structure is provided. The film capacitor assembly may include a stack of alternating electrodes and film layers. The electrodes may be offset from one another to alternatively contact opposing terminals. The support structure may include coolant channels and may be arranged to orient the film capacitor assembly adjacent an inverter assembly and such that each is in conductive thermal communication with at least one of the coolant channels. The film capacitor assembly further includes a stack of alternating metal foils and film layers disposed between a pair of contact layers, a pair of terminals, and a first thermal plate. Each of the pair of terminals is disposed on an outer side of one of each of the pair of contact layers.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 31, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Jukkrit Noppakunkajorn, Sudhir Kumar
  • Patent number: 10378751
    Abstract: Accroding to the present disclosure, a heat sink, which may be used e.g. for LED lamps or bulbs for motor vehicle lights, includes: a plate-like portion extending along an axis with opposed mounting surfaces for at least one heat source, such as e.g. a LED lighting source, and a finned portion thermally coupled with the plate-like portion and including a plurality of annular fins extending around said axis.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: August 13, 2019
    Assignee: OSRAM GMBH
    Inventors: Alessandro Bizzotto, Marco Munarin, Nicola Schiccheri
  • Patent number: 10288330
    Abstract: In one general aspect, a converging split-flow microchannel evaporator is disclosed. It includes a conductive contact surface to mate to a surface to be cooled, with a core mounted in thermal connection with the conductive surface that defines at least one layer of microchannels. Within the core, one inlet restriction restricts the flow into each microchannel in a first group of the microchannels, and another restricts the flow into each microchannel in a second group. A centrally located fluid outlet receives the flows from opposite ends of the microchannels in the two groups. A check valve can be provided to help ensure ready startup without reverse flow.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: May 14, 2019
    Assignee: QCIP Holdings, LLC
    Inventor: Steven Schon
  • Patent number: 10151778
    Abstract: A voltage sensor housing includes a top portion including a conductive top portion composed of conductive material and non-conductive top portions composed of non-conductive material, a bottom portion composed of non-conductive material, side portions composed of non-conductive material, wherein the top portion the bottom portion and the side portions define an interior area structured to hold a voltage sensor, and conductive side portions composed of conductive material and being disposed adjacent to the side portions. The conductive top portion is electrically floating and the conductive side portions are electrically grounded.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: December 11, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Abhijeet Vikram Kshirsagar, Mark Allan Juds, Gayatri Shashikant Dharne
  • Patent number: 10136552
    Abstract: The present invention provides a water block for a water-cooling CPU radiator. The water block includes an upper shell, a bottom shell, an external pipe and a water pump. The upper shell includes a shell body and an upper cover. The shell body is provided with a first cavity, a side wall of the shell body is provided with a water outlet. The upper cover is provided with a water inlet, and both the water inlet and the water outlet are in fluid communication with the first cavity. The bottom shell is arranged at the lower end of the shell body and is provided with a second cavity, and the two sides of the bottom shell are provided with an upper water port and a water inlet, respectively, which are communicated with the second cavity. The external pipe is arranged outside the upper shell and the bottom shell.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: November 20, 2018
    Assignee: BEIJING DEEPCOOL INDUSTRIES CO., LTD.
    Inventors: Lei Liu, Haibo Yu, Edward Xia
  • Patent number: 10077947
    Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: September 18, 2018
    Assignee: ABB Schweiz AG
    Inventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert, Timo Koivuluoma
  • Patent number: 10079197
    Abstract: A power semiconductor device has a metal molded body forming a first connecting conductor. From a first main surface of the metal molded body there is a first recess having a first base in which a first power semiconductor component is arranged which faces the first base and is connected in an electrically conductive manner. From a second main surface of the metal molded body, a second recess has a second base, and a second power semiconductor component is arranged with the first contact surface thereof associated with the second base connected in an electrically conductive manner to this base. An insulating material layer is on both main surfaces, filling and completely covering the recess, wherein the first insulating layer has an electrically conductive first via which connects a second contact surface of the first power semiconductor component in an electrically conductive manner to a first conducting surface arranged on the first insulating layer.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 18, 2018
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventor: Michael Schleicher
  • Patent number: 9999150
    Abstract: An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: June 12, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ken Maeda, Toshiya Satoh
  • Patent number: 9973070
    Abstract: An electric power converter includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked. Each of the semiconductor modules is provided with a main body that has semiconductor elements therein, a plurality of power terminals, and control terminals. Among the plurality of the power terminals respectively included in the two semiconductor modules adjoining in a stacking direction of the stacked body, at least parts of the power terminals are configured so as not to overlap each other when viewed from the stacking direction.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: May 15, 2018
    Assignee: DENSO CORPORATION
    Inventors: Hiroshi Shimizu, Naoki Hirasawa
  • Patent number: 9935035
    Abstract: An interposer structure including a dielectric base material, and a metal based interconnect structure extending through the dielectric base material from a first side of the dielectric base material to an opposing second side of the dielectric base material. At least one metal line of the metal based interconnect structure extends from the first side of the dielectric base material to the second side of the dielectric base material and has a first non-linear portion. A fluidic passage extends through the dielectric base material, wherein the fluidic passage has a second non-linear portion.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: April 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
  • Patent number: 9839164
    Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: December 5, 2017
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, Steven Embleton, Edmond I. Bailey, James D. Curlee
  • Patent number: 9803938
    Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: October 31, 2017
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Patent number: 9756755
    Abstract: An electric power converter includes a semiconductor module, a capacitor, and a DC bus bar that electrically connects them. The capacitor has a capacitor element and a capacitor terminal connected to the capacitor element. The capacitor terminals and the DC bus bar are connected to each other at least at two connecting portions. The DC bus bar has a bus bar main body portion that is connected to the semiconductor module. The two connecting portions are connected by at least a portion of the bus bar main body portion. The capacitor terminal has a terminal main body portion that is connected to the capacitor element. The two connecting portions are connected by at least a portion of the terminal main body portion.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: September 5, 2017
    Assignee: DENSO CORPORATION
    Inventors: Naohisa Harada, Akira Nakasaka
  • Patent number: 9742305
    Abstract: A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The capacitor is a structural member disposed in a direction perpendicular to the frame portion and including a capacitor element electrically connected to the electric circuit element. The capacitor includes a first support surface and a second support surface that are external surfaces facing in opposite directions from each other and parallel to the direction perpendicular to the frame portion. The first frame and the second frame each have an end portion fixed to a connection frame. The first frame includes a first attachment surface fixed to a first support surface. The second frame includes a second attachment surface fixed to a second support surface.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: August 22, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hirokazu Takabayashi
  • Patent number: 9661740
    Abstract: An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 23, 2017
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Roland Bittner, Marco Lederer, Sven Teuber, Matthias Spang
  • Patent number: 9587769
    Abstract: A connecting structure includes a housing, a cooler, an inner refrigerant pipe, an outer refrigerant pipe, and a joint pipe. The joint pipe is attached to a through hole of the housing. The inner refrigerant pipe is fitted to the joint pipe from a housing inner side. The outer refrigerant pipe is fitted to the joint pipe from a housing outer side. A tip of the inner refrigerant pipe and a tip of the outer refrigerant pipe define a gap inside the joint pipe. An end surface of a flange or a rib of the outer refrigerant pipe in a refrigerant-pipe axis direction abuts with an end surface of a flange or a rib of the joint pipe in the refrigerant-pipe axis direction.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: March 7, 2017
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Keitaro Ishikawa
  • Patent number: 9536671
    Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: January 3, 2017
    Assignee: TELSA MOTORS, INC.
    Inventors: Robert James Ramm, Dino Sasaridis, Colin Campbell, Wenjun Liu
  • Patent number: 9507378
    Abstract: An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: November 29, 2016
    Assignee: NVIDIA CORPORATION
    Inventor: Shuang Xu
  • Patent number: 9488673
    Abstract: Chassis for an automated test system including a housing and at least a first and a second backplane in the housing. The first backplane provides electrical connections for at least one functional module of a first type when engaged with the first backplane, while the second backplane provides electrical connections for at least one functional module of a second type different than the first type when engaged with the second backplane. The first and second backplanes include electrical circuitry to enable signals to be provided for the functional modules when engaged therewith. A bottom of the housing includes ducts to enable cooling of both types of functional modules when engaged with the housing.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: November 8, 2016
    Assignee: Advanced Testing Technologies, Inc.
    Inventors: Richard Engel, Eli Levi, Robert Spinner, Thomas Leddy
  • Patent number: 9354255
    Abstract: An output stage module for a power amplifier device (e.g., for a power amplifier device of a transmit unit of a magnetic resonance device) includes a housing and a carrier that is arranged within the housing. The carrier is made of a non-electrically-conducting, thermally-conducting material with low electrical losses (e.g., a ceramic carrier). At least two transistor dies are arranged on the carrier. At least one transistor, in each case, is assigned to a phase of a symmetrical input signal. In and/or on the carrier, a first conductor structure connecting (e.g., inductively) a drain output of the at least two transistor dies to an output signal and to second conductor structures each conducting an input signal to at least one gate input of the at least two transistor dies are provided. At least one cooling channel routed adjacent to at least one transistor die of the at least two transistor dies is provided.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: May 31, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventor: Adam Albrecht
  • Patent number: 9295169
    Abstract: Arrangement in an automated test system to connect to a plurality of functional modules of different forms including a common chassis defining a plurality of identical connectors and a backplane associated with the chassis and providing electrical connections for functional modules when engaged with the connectors. A set of adapters is provided including a first adapter having a coupling at an attachment end and a module receiving end configured to mate with one or more functional modules each having a first form, and a second adapter having a coupling at an attachment end and a module receiving end configured to mate with one or more functional modules each having a second form different than the first form. The couplings of the adapters are the same such that the adapters are freely insertable via their attachment ends into engagement with any of the connectors.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: March 22, 2016
    Assignee: Advanced Testing Technologies, Inc.
    Inventors: Robert Spinner, Eli Levi, Richard Engel
  • Patent number: 9282685
    Abstract: Flux concentration cores that encircle bus bars are arranged at different heights. When viewed from an extending direction (a Z-direction) of the bus bars, the first flux concentration core and the second flux concentration core that are adjacent to one another partially overlap each other, and the second flux concentration core and the third flux concentration core that are adjacent to each other partially overlap each other. Therefore, the flux concentration cores are able to be arranged around the bus bars even when the spaces between the bus bars are narrow.
    Type: Grant
    Filed: January 7, 2013
    Date of Patent: March 8, 2016
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aisin AW CO., LTD.
    Inventors: Yusuke Seo, Yutaka Hotta
  • Patent number: 9247675
    Abstract: A power converter includes an inverter in an inverter case, and a DC/DC converter in a converter case detachably fixed to the inverter case. The inverter includes power semiconductor modules, and the DC/DC converter includes a down-converter circuit and/or a boost converter circuit. The inverter case includes first and second path-forming members thermally contacting the converter case. In the first path-forming member, the power semiconductor module is inserted into a first coolant path. In the second path-forming member, the power semiconductor module inserted into the second coolant path, which is parallel to the first coolant path. The DC/DC converter includes an inductance device, and a switching device board on which a switching device con rolling electric current in the inductance device is mounted. The inductance and switching devices are in an area of the converter case thermally contacting first and second path forming members.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 26, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Katsuhiro Higuchi, Akira Ishii, Hidenori Shinohara
  • Patent number: 9161477
    Abstract: A hydraulic distributor capable of distributing a liquid coolant to a plurality of cooling devices, includes a liquid coolant inlet conduit into the hydraulic distributor; a plurality of supply conduits for the cooling devices by the liquid coolant, each of the supply conduits being hydraulically connected to the inlet conduit through a supply duct; a liquid coolant outlet conduit from the distributor; a plurality of liquid coolant return conduits in the distributor, each of the return conduits being hydraulically connected to the outlet conduit by a return duct; wherein at least one of the liquid coolant supply or return conduits can be fitted with a floating connector allowing for a hydraulic connection with at least one of the cooling devices among the plurality of cooling devices.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: October 13, 2015
    Assignee: BULL SAS
    Inventors: Fabien Demange, Jean-Christophe Bonnin
  • Patent number: 9111900
    Abstract: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: August 18, 2015
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Ingo Bogen, Markus Beck, Hartmut Kulas, Alexander Popescu, Reinhard Helldörfer
  • Patent number: 9042147
    Abstract: A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: May 26, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Akira Ishii, Keisuke Fukumasu
  • Patent number: 9042100
    Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 26, 2015
    Assignee: Aavid Thermalloy, LLC
    Inventor: Sukhvinder S. Kang
  • Patent number: 9009971
    Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Publication number: 20150103489
    Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 16, 2015
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: David AUCHERE, Yvon IMBS
  • Patent number: 9007768
    Abstract: A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: April 14, 2015
    Assignee: Thales
    Inventor: Martin Raynaud
  • Patent number: 9007771
    Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: April 14, 2015
    Assignee: ABB Research Ltd.
    Inventor: Bruno Agostini
  • Publication number: 20150092347
    Abstract: A cooling device includes a cooling member connected with a cooling pipe through which a cooling medium flows, a first fastening mechanism part provided at a first position on the cooling member and configured to fasten the cooling member and a substrate in a state where an electronic part to be cooled is sandwiched between the cooling member and the substrate, and a second fastening mechanism part provided at a second position on the cooling member that is different from the first position, the second position being located at a position where a first load exerted on the cooling member and a second load exerted on the cooling member maintain a balance in the electronic part, the first load being applied by the cooling pipe and the first fastening mechanism part, the second load being applied by the second fastening mechanism part.
    Type: Application
    Filed: September 12, 2014
    Publication date: April 2, 2015
    Inventors: Tsuyoshi So, Keita Hirai, Yoshinori Uzuka
  • Publication number: 20150070841
    Abstract: A cooling structure for an inverter (31) controls a motor (6) to drive an automobile. This inverter device (22) includes a power circuit section (28) having an inverter (31) to convert a DC power of a battery (19) to an AC power for the motor (6), and a casing (39) enclosing the power circuit section (28). A fin (41) is provided in an outer surface of the casing (39), a coolant path (42) for the flow of a cooling medium is provided within the casing (39) or in the outer surface thereof, and a pump (43) circulating the cooling medium in the coolant path (42) is disposed in the casing (39). With this structure, the flow resistance for cooling the inverter (31) is reduced to allow the pump (43) to be downsized and a proper cooling can be accomplished to the amount of heat by the inverter (31).
    Type: Application
    Filed: April 3, 2013
    Publication date: March 12, 2015
    Applicant: NTN CORPORATION
    Inventors: Minoru Suzuki, Tetsuya Yamamoto, Koichi Okada
  • Publication number: 20150073509
    Abstract: Devices, systems, and techniques for managing heat generated in coils for wireless energy transmission are disclosed. Inductive coupling between two coils (e.g., a primary coil and a secondary coil) may be used to recharge the power source of an implantable medical device. A phase change material may be thermally coupled to the primary coil to absorb heat generated during the inductive coupling and reduce temperature increases of the primary coil. In one example, the phase change material may be configured to absorb heat from an energy transfer coil. A housing may be configured to contain the phase change material and a coupling mechanism may be configured to removably attach the housing to the energy transfer coil.
    Type: Application
    Filed: November 14, 2014
    Publication date: March 12, 2015
    Inventors: Todd A. Kallmyer, John E. Kast, David P. Olson, Randy S. Roles, Venkat R. Gaddam
  • Patent number: 8964384
    Abstract: Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component. The chip socket may include a first channel and a second channel. The first channel may act as an ingress channel while the second channel may act as an egress channel. The ingress and egress channels may be configured to facilitate cooling of the component.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: February 24, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B Leigh, George D Megason
  • Publication number: 20150042342
    Abstract: An apparatus for cooling an electrical component includes a circuit board with the electrical component disposed on the circuit board. The apparatus includes a cover disposed on the circuit board. The cover and the circuit board form a closed cavity in which the electronic component is disposed. The cavity has a first opening for introduction of a fluid and a second opening for discharge of a fluid.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 12, 2015
    Inventor: Adam Albrecht
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8953319
    Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 10, 2015
    Assignee: Asustek Computer Inc.
    Inventor: Cheng-Yu Wang
  • Patent number: 8953314
    Abstract: A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: February 10, 2015
    Assignee: Georgia Tech Research Corporation
    Inventor: Andrei G. Fedorov
  • Patent number: 8947880
    Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 3, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Ptd. Ltd.
    Inventors: Matthew R. Archibald, Jerrod K. Buterbaugh
  • Patent number: 8933860
    Abstract: A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal conductivity of 10-20,000 W/m*K and comprising one or more mechanically controlled oscillating heat pipes, employing supporting integrating structure including a surface bonded to the IR dome or RF radome that matches the coefficient of thermal expansion the dome or radome material and that of said one or more mechanically controlled oscillating heat pipes, and operating the heat pipe system to cool the IR dome or RF radome while the missile is in flight.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: January 13, 2015
    Assignees: Integral Laser Solutions, Inc., The Curators of the University of Missouri
    Inventors: LaVerne Arthur Schlie, Hongbin Ma
  • Patent number: 8929074
    Abstract: Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: January 6, 2015
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede
  • Patent number: 8929071
    Abstract: A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: January 6, 2015
    Assignee: General Electric Company
    Inventors: Richard Alfred Beaupre, Ljubisa Dragoljub Stevanovic, Daniel Jason Erno, Charles Gerard Woychik
  • Publication number: 20150003012
    Abstract: An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.
    Type: Application
    Filed: May 16, 2014
    Publication date: January 1, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Shunji BABA, Kenji FUKUZONO, Yuki HOSHINO
  • Patent number: 8921702
    Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: December 30, 2014
    Assignee: HRL Laboratories, LLC
    Inventors: William B. Carter, Peter D. Brewer, Adam F. Gross, Jeffrey L. Rogers, Keith V. Guinn, Alan J. Jacobsen
  • Patent number: 8922998
    Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: December 30, 2014
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Eric J. McKeever, Robert E. Simons