Abstract: This power conversion device includes: a cooler having a cooling surface; one or a plurality of power modules and thermally connected to the cooling surface; a board placed with a space from the power module; and a board-retention member, the board-retention member including an extending portion which extends in the first direction through the space between the board and the power module, and supports the board, a first fixation portion which is connected to an end on the one side in the first direction of the extending portion and is fixed to the cooler on the one side in the first direction of the power module, and a second fixation portion which is connected to an end on the other side in the first direction of the extending portion and is fixed to the cooler on the other side in the first direction of the power module.

Abstract: An injection device includes: an injection nozzle injecting an injection agent into a target container, and a vibration generating device vibrating the injection nozzle in a plurality of directions during injection of the injection agent.

Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.

Abstract: A liquid cooling static synchronous series compensator (SSSC) system with series connected inverter valve modules that have liquid cooling blocks is described. The inverter valve modules are operable to inject reactive power into a power transmission line. Inverter valve units are attached to liquid cooling blocks, where there is direct impingement of liquid coolant on an exposed portion of an inverter valve unit in an enclosed fluid chamber. Each liquid cooling block has voltage isolation relative to other liquid cooling blocks. Such voltage isolation may limit ionization of liquid coolant in an SSSC system operating in proximity to high voltages.

Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.

Abstract: A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.

Abstract: A liquid cooling plate is configured to be in thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat dissipation part and a second heat dissipation part. The first heat dissipation part is configured to be in thermal contact with the first heat source and has a fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and configured to be in thermal contact with the second heat source. The second heat dissipation part has a fluid channel, and the fluid channel is in fluid communication with the fluid chamber.

Abstract: A battery pack assembly includes a housing, a battery cell assembly, and a fan. The housing having a plurality of sides and defining an internal cavity. The battery cell assembly positioned in the internal cavity. The battery cell assembly includes a plurality of battery cells and a frame supporting the battery cells. The frame includes a first support member, a second support member, and a plurality of leg members connecting the first support member and the second support member. The first support member and the second support member each has a body extending between a first edge and a second edge opposite the first edge. The body defines a plurality of openings configured to align with one of the battery cells. The fan is configured to circulate air within the housing and through the battery cell assembly.

Abstract: A system for controlling operation of a vehicle having a power inverter module includes an alternating current (AC) power bus coupled to the power inverter module. The AC power bus has a plurality of busbars for conducting an AC current having multiple phases. The AC power bus is coupled to a stator in an electric motor configured to generate torque to propel the vehicle. A controller is adapted to determine an estimated temperature of the AC power bus for the multiple phases based on a plurality of factors. The plurality of factors includes an oil flow rate of a motor oil and a coolant flow rate of an inverter coolant that are in respective direct or indirect thermal contact with the plurality of busbars. The controller is adapted to control operation of the vehicle based in part on a highest one of the estimated temperature of the multiple phases.

Abstract: A three-phase transformer configured to transform a three-phase voltage. The transformer includes first, second, and third toroidal transformers. The first toroidal transformer is configured to transform a first phase of the three-phase voltage. The second toroidal transformer is electrically connected to the first toroidal transformer. The second toroidal transformer is configured to transform a second phase of the three-phase voltage. The third toroidal transformer is electrically connected to the first toroidal transformer and the second toroidal transformer. The third toroidal transformer is configured to transform a third phase of the three-phase voltage.

Abstract: A cooling system having a closed cooling duct system between a main inlet and a main outlet for cooling medium, and includes at least one cooling duct section. The cooling system includes individual modular elements, each including at least one partial segment. In a connecting region of the individual modular elements, their respective at least one partial segment connect continuously to form the at least one cooling duct section. Adjacent individual modular elements each have, in the connecting region, a complementary element of a common media coupling, in which, in a detached connection between two adjacent individual modular elements, the respective partial segment contained in an individual modular element is sealed in media-tight fashion at least in its connecting region, and in a coupled connection between the adjacent individual modular elements, in the connecting region, a passage for a flow of cooling medium is opened inside the media coupling.

Abstract: The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.

Abstract: A method of manufacturing a heat exchanger core from glass ceramic matrix composite includes placing one or more reinforcing fibers around one or more mandrels into a mold cavity. A glass matrix material infiltrates the one or more reinforcing fibers to produce an infiltrated core and the one or more mandrels is removed to create one or more passages passing through the infiltrated core.

Abstract: An apparatus is provided for improving the cooling of a heat source. The apparatus includes a deflector mounted in a space between a first heat source and a second heat source. The deflector has a first face at a first angle that is greater than perpendicular from a first plane and a second face at a second angle that is less than perpendicular from a second plane. The apparatus further includes a plurality of vanes that extend from the first face of the deflector and are rotated inwardly with respect to the first face. When the first and second heat sources are immersed in a fluid and oriented with the second heat source above the first heat source, as fluid heated by the first heat source rises, the heated fluid is directed by the deflector away from the second plane and is directed by the plurality of vanes toward a center of the deflector.

Abstract: The invention discloses a dual liquid pump liquid cooling radiator and a liquid cooling heat dissipation device. The dual liquid pump liquid cooling radiator includes two liquid boxes and a plurality of radiator pipe sets arranged side by side between the two liquid boxes. The interior of one liquid box is divided into a hot liquid chamber and a cold liquid chamber by an air heat insulation space, and a first liquid pump is installed therein. The interior of the other liquid box is divided into a hot liquid chamber and a cold liquid chamber by a liquid barrier, and a second liquid pump is installed therein.

Abstract: A mounting structure for an electrical device includes a vehicle electrical device and a supporting member which supports the electrical device. The supporting member includes: a body portion to which the electrical device is supported and fixed; and a front extension portion extending from the body portion toward a vehicle front side further than an end portion of the electrical device at a vehicle front side. The body portion and an end portion of the front extension portion at the vehicle front side are fixed to the vehicle body floor, and a rigidity of the front extension portion in a vehicle front-rear direction is lower than a rigidity of the body portion in the vehicle front-rear direction.

Abstract: A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.

Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Abstract: A multi-component device package comprising an integrated cooling assembly and methods for manufacturing said multi-component device package. A multi-component device package may comprise a plurality of semiconductor devices encapsulated in a mold material. A portion of the mold material may be removed to expose the backside of at least one semiconductor device of the plurality of semiconductor devices. A first dielectric layer may be formed on the exposed backside of the at least one semiconductor device. A cold plate comprising a base plate may be prepared and then the base plate may be directly bonded to the exposed backside of the at least one semiconductor device.

Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is formed in the first cavity. The first stress adjustment layer covers the first dielectric structure. A second substrate is provided. A second dielectric structure is formed on the second substrate. At least one second cavity is formed in the second dielectric structure. A second stress adjustment layer is formed in the second cavity. The second stress adjustment layer covers the second dielectric structure. The first stress adjustment layer and the second stress adjustment layer are bonded.

Abstract: A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

Abstract: A heat sink is provided for a power inverter of an electric motor of a vehicle. The heat sink includes a coolant inlet, a coolant outlet, a first cooling segment and a second cooling segment. The heat sink also includes a coolant channel system for cooling one or more power modules A power inverter including the heat sink and a vehicle including the power inverter are also provided.

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

Abstract: A power conversion apparatus includes a hermetic housing, a power semiconductor module, and dry gas. The hermetic housing includes a gas inlet valve and a gas outlet valve. The power semiconductor module is arranged in an internal space in the hermetic housing. The internal space in the hermetic housing is filled with dry gas.

Abstract: A cooling apparatus for an engine comprising: a) a coolant reservoir comprising a coolant line outlet port; b) a tank for holding an aqueous urea solution for injection into an exhaust system of the engine; c) a coolant line for transferring a coolant fluid discharged from the coolant reservoir via the coolant line outlet port to the tank to enable, in use, heat exchange between the coolant fluid and the aqueous urea solution contained in the tank; d) a coolant control valve located on the coolant line for controlling flow of coolant fluid along the coolant line to the tank; and e) a filter for filtering the coolant fluid being discharged via the coolant line outlet port; wherein the filter comprises a filtering portion that is located within an interior of the coolant reservoir so that the coolant fluid is filtered within the coolant reservoir before the coolant fluid enters the coolant line.

Abstract: A cooling device, including at least one of following: a casing and a flow channel that is disposed inside the casing, the casing including a metal portion and a resin portion that is bonded to at least a portion of the metal portion; a casing that includes a metal, a flow channel that is disposed inside the casing, and a component that includes a resin and is bonded to a surface of the casing, and a method of manufacturing the cooling device including the steps of a first process of bonding the component to the first metal member by injection molding and a second process of connecting the second metal member with the first metal member to which the component is bonded.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to th

Abstract: A cold plate is couplable with a component for dissipating heat from a component. The cold plate includes a top plate coupled with a bottom plate to receive a cooling medium therebetween. The top plate includes a body and a plurality of walls extending from the body, wherein each wall of the plurality of walls includes a recess extending within the wall. The bottom plate includes a body and a plurality of walls extending from the body such that an end portion of each wall of the bottom plate is inserted within the recess of each wall of the top plate to form an interlocking joint.

Abstract: The present disclosure provides for integrated cooling systems including backside power delivery and methods of manufacturing the same. An integrated cooling assembly may include a device and a cold plate. The cold plate has a first side and an opposite second side, the first side having a recessed surface, sidewalls around the recessed surface that extend downwardly therefrom to define a cavity, and a plurality of support features disposed in the cavity. The first side of the cold plate is attached to a backside of the device to define a coolant channel therebetween. The cold plate includes a substrate, a dielectric layer disposed on a first surface of the substrate, a first conductive layer disposed between the first surface and the dielectric layer, a second conductive layer disposed on a second surface of the substrate, and thru-substrate interconnects connecting the first conductive layer to the second conductive layer.

Abstract: An electric power conversion apparatus includes a semiconductor module, a control circuit board and a wireless communication unit. The semiconductor module has at least one semiconductor element built therein. The control circuit board is configured to control the semiconductor module. The wireless communication unit is configured to wirelessly communicate electrical signals between the semiconductor module and the control circuit board. The wireless communication unit includes a first communication device provided on the control circuit board so as to face the semiconductor module, and a second communication device provided on the semiconductor module so as to face the control circuit board. Moreover, there are no obstacles on a straight path between the first and second communication devices.

Abstract: In one aspect, a chiller/heater component of a thermo-electric cooler pump system comprising: wherein the chiller/heater component comprises: a wetted side of the chiller/heater component comprising a regularly-spaced plurality of parallel rows of elongated elements between which the liquid flows, wherein the plurality of rows of elongated elements are oriented perpendicular to both the flow of the liquid and the wetted side of the chiller/heater component, wherein the plurality of rows of elongated elements extends into the liquid from a single surface of the wetted side of the chiller/heater component, and wherein the wetted side of the chiller/heater component is in contact with the liquid, and a dry side of the chiller/heater component comprising a plurality of parallel sheets, and wherein the chiller/heater component comprises an electron flow through the plurality of parallel sheets to facilitate a thermal heat transfer by a Peltier effect.

Abstract: A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.

Abstract: A heat radiation module comprises: a bracket having an upper surface, a lower surface, and a first side surface for connecting the upper surface and the lower surface, and a second side surface facing the first side surface; and a heat dissipation passage disposed in the bracket, wherein the bracket includes a groove formed on at least one surface among the upper surface and the lower surface, the heat dissipation passage includes a first passage disposed between one side of the groove and the first side surface and a second passage disposed between the other side of the groove and the second side surface, and a part of the first passage overlaps the groove extending in a direction from the first side surface toward the second side surface.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: A die-cast cooling device for protecting a computer assembly is disclosed. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two side walls, and the cooling plate and the side walls are arranged to form a protective space for computing components. The plurality of die-cast fins are formed on the cooling plate, extending away from the protective space. The opening provides access to the protective space. The cover is movable between a closed position and an open position, the cover preventing access to the protective space in the closed position, and the cover providing access to the protective space in the open position.

Abstract: A two-phase or hybrid immersive cooling system is converted to a one-phase immersive cooling system, by (1) modifying a structure of the two-phase immersive cooling system such that a cooled portion of a substitute operating fluid flows into the operating fluid reservoir from a direction other than from above the reservoir, and (2) using a high boiling point composition as the substitute operating fluid. In some embodiments the tube condensers of the two-phase or hybrid immersive cooling system are retained, and in other embodiments at least portions of the regions previously occupied by tube condensers are used for heat exchangers, and optionally fluid pumps. In still other embodiments at least portions of the regions previously occupied by tube condensers are used for hot fluid holding tanks.

Abstract: The present application discloses a power cabinet, which is designed as a form of cabinet. All devices in the power cabinet are categorized into two types, and the two types of devices can have their own heat-dissipation channels or share a same heat-dissipation channel, which has a compact overall structure and high heat-dissipation efficiency compared with an air duct layout solution in the conventional technology.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

Abstract: In one aspect, the present disclosure relates to a manufactured utility apparatus that includes a base module, an ice bridge module attached to the base module, and an equipment cabinet module attached to the base module. The manufactured utility apparatus may include a cable securing module attached to the base module. The cable securing module may be configured to electrically connect the utility apparatus and a utility resource. The manufactured utility apparatus may further include an H-frame module attached to the base module, and an antenna module attached to the base module, the antenna module being operatively connected to the utility resource. The manufactured utility apparatus may include a grounding module configured to electrically ground the utility apparatus and the utility resource.

Abstract: Embodiments of a dock with an actively controlled heatsink for a multi-form factor Information Handling System (HS) are described. In some embodiments, a dock may include: a base, a plateau configured to receive an IHS, and an arm coupling a distal edge of the base to a proximal edge of the plateau, where the plateau comprises a heatsink configured to cool a heatpipe disposed within the IHS via a bottom surface of the IHS.

Abstract: The present disclosure relates to an IED configured for use as a protection relay in an electric power system. The IED comprises a plurality of cassettes connected to a backplane, with at least two cassettes mounted adjacent each other. Each of the cassettes comprises a housing profile in the form of a rectangular tube having an envelope wall of a heat conducting material, and at least one electronic card arranged in a card slot within the tube formed by the housing profile, which at least one card is electrically connected to the backplane. Adjacent cassettes are separated a distance such that air canals are formed between their respective housing profiles.

Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system.

Abstract: Embodiments are disclosed of an IT rack and a server including a cooling module. An integrated fluid distribution manifold set with a supply manifold is on the front of the rack and a return manifold is on the rear of the rack. The supply manifold extends from the front to the rear and rack connectors, which fluidly couple the rack to a data center facility system, are on the top of the rack. Supply and return connectors are positioned so that the connectors face each other within the rack. Each server includes a cooling module with a movable connector set that can extend outside the server chassis to connect with the manifolds. The cooling module's connector set includes a transmission structure that allows the supply and return connectors of the connector set to engage with connectors on the supply and return manifolds.

Abstract: A circuit structure includes a plurality of semiconductor elements arranged side by side, and each semiconductor element includes source terminals and at least one gate terminal arranged side by side with the source terminals. The circuit structure includes: a first bus bar connected to the source terminals of the semiconductor elements; connection portions that connect the source terminals and the first bus bar and are arranged side by side along the arrangement direction of the semiconductor elements and whose one ends are connected to the source terminals of the respective semiconductor elements; an insulating portion provided so as to be present between each adjacent pairs of the connection portions; and conductive portions provided in the insulating portion and connected to the gate terminals.

Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.

Abstract: A structure for forming inductor windings includes a first portion and a second portion of a clamshell casing. The first portion includes a first set of electrically conductive segments, a first inner carrier, and a first outer carrier. The second portion includes a second set of electrically conductive segments, a second inner carrier, and a second outer carrier. An inductor core is mountable between the first inner carrier and the first outer carrier within the first portion. A control assembly aligns and joins the first portion to the second portion of the clamshell casing such that the first set of electrically conductive segments arranged in the first pattern that correspond to first half-turns of the inductor windings, are attached to the second set of electrically conductive segments arranged in the second pattern that correspond to second half-turns of the inductor windings, to form continuous turns around the inductor core.

Abstract: A vehicle having: two front wheels; two rear wheels; two electric motors, which are connected to the two wheels of a same axle; and an electronic power converter to control both electric motors. The electronic power converter has: two groups of power modules; at least one capacitor, which is connected in parallel to a DC input; a container, which houses the two groups of power modules and the capacitor and is provided with a cup-shaped body provided with a lower wall; and a cooling system provided with a chamber, which is configured to be flown through by a cooling liquid. The chamber of the cooling system is delimited, on one side, by the lower wall of the cup-shaped body of the container and, on the other side, by a containing wall, which is arranged at a given distance from the lower wall.