Abstract: An electronics equipment cabinet includes multiple cabinet walls defining an interior enclosure space for housing at least one electronic device, an outer wall positioned to shield from solar radiation an outer surface of at least one of the multiple cabinet walls, and at least one divider wall positioned between the outer wall and the cabinet wall to define first and second channels. The cabinet wall has two openings to allow internal cabinet air to flow between the interior enclosure space and the first channel, while inhibiting external ambient air from entering the interior enclosure space and the first channel. The outer wall has two openings positioned to allow external ambient air to flow through the second channel to cool the internal cabinet air in the first channel via heat exchange through the divider wall, while inhibiting the external cabinet air from mixing with the internal cabinet air.

Abstract: A mixed-signal controller for controlling a multiphase average-current-mode voltage regulator having an output connected to a load, which comprises a digital voltage-sampling ADC for converting the output voltage signal from analog to digital representation; a digital current-sampling ADC, for converting the inductor current from analog to digital representation; a digital compensator for generating a current reference signal, based on a digital voltage error signal and for generating a duty-ratio command signal, based on a digital current error signal; a multiphase Digital Pulse Width Modulator (DPWM), for generating a pulse-width-modulated signal (per-phase), to thereby control the per-phase currents and output voltage supplied to the load; an analog front-end, in which single-ended signals are used for steady-state control via ADC measurement and the single-ended output voltage is used for transient detection and output voltage extremum detection during transient; a Transient Suppression Unit (TSU), for ge

Abstract: A system and method of forming integrated power electronic packages includes 3D-printing a cold plate having a hollow interior recess and a plurality of fins. The method includes printing, using a 3D printer, an electrical insulation layer and a conductor substrate onto a top surface of the cold plate, such that the electrical insulation layer and conductor substrate are embedded within the top surface of the cold plate. The method further includes embedding power devices in the conductor substrate, printing, using a 3D printer, a circuit board on and around the power devices, and mounting electronic components on the circuit board.

Abstract: A small cell device includes a housing body, a heat sink, an interface board, a first power amplifier (PA) board, a second PA board, a power board, and a main board. The housing body defines a cavity and has two depthwise ends. The heat sink is coupled to the housing proximate a first depthwise end. The interface board is positioned within the cavity and adjacent to the heat sink. The first PA board is positioned within the cavity and adjacent to the interface board and the heat sink. The second PA board is positioned within the cavity and proximate a second depthwise end. The power board is positioned within the cavity and adjacent to the second PA board. The main board is positioned within the cavity between the interface board and the second PA board. The heat sink dissipates heat generated during operation of at least the first PA board.

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

Abstract: A rail-bound vehicle includes an energy storage device having a traction battery and a cooling device for cooling the traction battery using a coolant circulating in at least one coolant circuit. The energy storage device supplies a traction device of the vehicle with electrical energy. At least one air-conditioning device air conditions a passenger compartment of a car of the vehicle using a refrigerant circulating in a refrigerant circuit, and a control device controls the air-conditioning device. The air-conditioning device has a heat exchanger coupling the refrigerant circuit of the air-conditioning device to the coolant circuit of the cooling device of the energy storage device. The control device controls a flow of the refrigerant through the heat exchanger. An energy storage device, an air-conditioning device, an arrangement for cooling a traction battery and a method for controlling the arrangement are also provided.

Abstract: An electronic device including a substrate, a first electronic component provided on the substrate, a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component, a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component, and a heat sink attached to the substrate, in which the heat sink includes a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate, a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and a length of the first protruding portion in the norm

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

Abstract: A hermetically sealed electronics module includes a core IC installed on a substrate. A collar surrounds the core IC and is sealed to the substrate and to a lid, forming a sealed chamber. A heat spreader bonded to an internal surface of the lid extends downward into proximal thermal contact with the core IC. A thin layer of TIM can be applied between the heat spreader and core IC. The heat spreader does not overlap any tall components that extend above the core IC, and can extend over regions adjacent to the core IC. Tall components can be limited to a periphery of the chamber, and/or the heat spreader can include openings that surround central tall components. The heat spreader can be soldered or welded to the lid over an entire upper surface of the heat spreader. X-ray and/or CSAM scanning can detect heat spreader bonding flaws.

Abstract: Disclosed is a vehicle charging station (1) comprising a first reservoir (5) arranged to contain a first charging fluid and a charging fluid delivery system (3) arranged to deliver at least part of the first charging fluid (5) into a heat exchange relationship with a vehicle thermal energy storage material (108) of a vehicle (100) selectively connected to the vehicle charging station (1), thereby charging the vehicle thermal energy storage material (108) by changing its temperature and/or phase and/or chemistry.

Abstract: An air directing device for thermal management in side breathing equipment includes at least three vertical panels disposed in generally parallel relationship and horizontally spaced a fixed distance from one another. Each panel defines a fin arranged orthogonally relative to an airflow path for deflection of cooling air into side breathing equipment. At least one of the panels is an inner panel that is wider than two outer panels. The air directing device further includes at least one connection member connecting the outer panels to one another.

Abstract: A device for removal of heat from a plurality of heat sources includes a first manifold to receive a working fluid, and a plurality of elongated intermediate frame members each in thermal communication with at least one of the plurality of heat sources. Each intermediate frame member includes a microchannel in fluid communication with the first manifold to receive the working fluid from the first manifold. Each elongated intermediate frame member includes a slot extending along a longitudinal axis of the heat transfer device. The device further includes a second manifold spaced from the first manifold and in fluid communication with the plurality of intermediate frame members to receive the working fluid from each microchannel in the plurality of intermediate frame members. The second manifold is configured to transfer the working fluid away from the plurality of heat sources.

Abstract: The inverter includes: a main body case accommodating main circuit terminal block and a control terminal block, high-voltage wire and low-voltage wire being respectively connected to the main circuit terminal block and the control terminal block; a wire cover detachably attached to the main body case to cover the main circuit terminal block; and a front cover detachably attached to the wire cover to cover the control terminal block, the front cover being fixed to the main body case with a fastening member requiring a tool for removal. The front cover includes a stopper, and, in a state where the front cover is attached to the wire cover, the stopper is located on a path through which the wire cover moves when removing the wire cover from the main body case.

Abstract: A battery charger for electric or hybrid motor vehicles having one container body installable on a motor vehicle and defining one housing compartment, one electronic appliance housed inside the housing compartment, connectable to one electric battery of the motor vehicle and configured to recharge the battery, one closing body of the container body associated in a removable manner with the latter to close the housing compartment, and the closing body being adapted to protect the electronic appliance housed inside the housing compartment whereby the closing body includes a reinforcing device/structure/component which are shaped and arranged so as to prevent the deformation of the closing body itself.

Abstract: A power converter apparatus for a vehicle includes: a cooling block provided with a refrigerant inlet and a refrigerant outlet, and with two cooling baths connected to the refrigerant inlet in parallel and each having a shape open to an outside, the cooling block being configured to allow refrigerants passing through the two cooling baths to be merged prior to being discharged through the refrigerant outlet; two cooling plates, wherein each of the two cooling plates covers an opening of an associated one of the cooling baths to provide a cooling chamber and includes a plurality of cooling fins protruding into the cooling chamber; and two cooling tubes, wherein each of the cooling tubes is coupled to the cooling block to provide a space for accommodating a power module between the cooling tube and an associated one of the cooling plates.

Abstract: A server chassis for a server rack can include a connector assembly. The connector assembly can include a first pair of connectors to fluidly connect to one or more cold plates that are thermally coupled to one or more electronic server components, and a second pair of connectors, to fluidly connect to a supply line and return line of the server rack. The connector assembly may further include a mobile plate upon which the second pair of connectors are attached to. The mobile plate may be attached as part of the connector assembly and movable to and from a direction that connects or disconnects the second pair of connectors to the supply line and the return line of the server rack.

Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Abstract: A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structures, the one or more first mounting structures are mounted onto the cooling unit, where the one or more first mounting structures are movable along a first direction. The cooling unit includes one or more cooling devices mounted to the one or more first mounting structures, where each of the one or more cooling devices is coupled to the one or more liquid distribution channels to receive cooling liquid to cool one or more peripheral devices of a server system. The cooling unit includes one or more liquid distribution channels to distribute cooling liquid within the server system, between the server system and other server systems, and/or between the server system and a liquid distribution system of an electronic rack.

Abstract: An inverter assembly for a motor vehicle includes a housing with an inlet end for receiving a flow of coolant and an outlet end for discharging the flow of coolant. The assembly further includes a first plurality of power transistors conducting and switching an electrical current and generating a first amount of heat. The assembly further includes a second plurality of power transistors conducting and switching the electrical current and generating a second amount of heat that is less than the first amount of heat. A heat sink includes a plate with a first section adjacent to the first plurality of power transistors and a second section adjacent to the second plurality of power transistors. The heat sink further includes a first plurality of fins for drawing the first amount of heat from the first section and a guide vane directing the flow of coolant toward the first plurality of fins.

Abstract: An apparatus comprising chips mounted to a substrate, wherein one or more of the chips comprises a first height and one or more of the chips comprises a second height, wherein the first height is taller than the second height. A cold plate located above the plurality of chips, wherein the cold plate includes a bottom wall and a top wall, wherein the cold plate includes a plurality of cooling fins that are attached to the bottom wall of the cold plate, wherein the cold plate accommodates the plurality of chips, wherein the chips includes chips having the first height and the second height.

Abstract: Proposed is an electronic apparatus with which it is possible to increase design freedom concerning a wall section formed with vent holes. A rear wall section (20D) includes a rectilinear wall section (21i) spaced rearward from a rear edge (41c) of a circuit board (41), and an inclined wall section (21j) located on the rear side relative to the rectilinear wall section (21i). An inner wall section (42e) is located between the inclined wall section (21j) and the rear edge (41c) of the circuit board (41), and is not located between the rectilinear wall section (21i) and the rear edge (41c) of the circuit board (41).

Abstract: The present disclosure discloses a three-dimensional stacked package structure with a micro-channel heat dissipation structure and a packaging method thereof. The three-dimensional stacked package structure includes a chip package portion comprising a multi-layered structure with stacked chips, wherein the stacked chips are provided with through silicon vias and packaged in a three-dimensional stacked packaging manner and a silicon substrate package portion comprising a silicon substrate. The silicon substrate is provided with micro bumps which are to be interconnected with external lead wires. The chip package portion is assembled on the silicon substrate by bonding with the micro bumps. The stacked chips are etched with micro-channels and through holes corresponding to each other. The micro-channels are for coolant flowing in a horizontal direction, and the through holes are for coolant flowing in upper and lower layers. Sealing rings are arranged around the micro-channels and the through holes.

Abstract: A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.

Abstract: Package assemblies with a molded substrate comprising fluid conduits. The fluid conduits may be operable for conveying a fluid (e.g., liquid and/or vapor) through some portion of the package substrate structure. Fluid conduits may be at least partially defined by an interconnect trace comprising a metal. The fluid conveyance may improve thermal management of the package assembly, for example removing heat dissipated by one or more integrated circuits (ICs) of the package assembly.

Abstract: An enclosure for providing liquid film cooling to heat generating components includes a chassis, a sump, a first pump, a plumbing system, tube plates, and a heat exchanger. The chassis includes cassettes that hold one or more heat generating components. The sump stores a liquid to be supplied to the heat generating components. The first pump draws the liquid from the sump and supplies the liquid to the tube plates through the plumbing system. Each tube plate is positioned between two cassettes to deliver the liquid to the heat generating components. The tube plates directly spray the liquid onto the heat generating components by way of nozzles embedded on the tube plates. The liquid is evaporated into vapors upon contact with the plurality of heat generating components. The heat exchanger condenses the vapors into condensed liquid upon contact. The condensed liquid is collected in the sump to be re-circulated.

Abstract: A battery charger for vehicles comprises one outer container, one electronic appliance housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, and one cooling circuit of the electronic appliance, wherein the electronic appliance comprises one electronic board provided with an insulated metal substrate associated with the cooling circuit, with a layer of electrically insulating material made on one portion of the insulated metal substrate, and with one electronic circuit made on the layer of electrically insulating material, in which the electronic board comprises one conductive metal bar for the transport and the distribution of current, electrically connected to the electronic circuit and provided with one portion arranged in direct contact with one surface portion of the electronic board, for the cooling of the conductive metal bar by the cooling circuit.

Abstract: A main housing portion of a portable information handing system. The main housing portion includes: a top cover portion; a bottom cover portion; and, an internal air intake ducting system, the internal air intake ducting system comprising a fan and a thermal channeling component thermally coupled to the fan, the thermal channeling component extending from an interior of a side of the bottom cover portion to the fan, the thermal channeling component and the bottom cover portion defining an air channel between the side of the bottom cover portion and the fan.

Abstract: A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.

Abstract: A digital control scheme controls an integrator of a PID filter to implement non-linear control of saturating the duty cycle during which the proportional and derivative terms of the PID filter are set to 0 while the integrator and its internal states (previous values or memory) is set to a duty cycle that is the sum of the current nominal duty cycle plus a deltaD. The deltaD is the maximum duty cycle increment that is used to regulate a voltage regulator from ICCmin to ICCmax and is a configuration register that can be set post silicon. An FSM moves from a non-linear all ON state to an open loop duty cycle which maintains the output voltage slightly higher than the required Vref. After a certain period in this open loop, the FSM then ramps down the open loop duty cycle value until the output voltage is close to the Vref.

Abstract: A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management.

Abstract: An electric power-steering control device has a substrate, a heat-generating component, and a heat-storing body. The heat-generating component is disposed on one surface of the substrate and generates heat when activated. The heat-storing body is capable of storing the heat from the heat-generating components. The heat-storing body has a main body having a rectangular plate shape and disposed on the one surface of the substrate. The heat-storing body has a notch section or a recess section.

Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A power adapter includes a housing, an electronic assembly and a protective assembly. The housing has a receiving cavity, and the housing is provided with at least one heat dissipation hole penetrating to the receiving cavity. The electronic assembly comprises a plurality of electronic elements located in the receiving cavity. The protective assembly comprises a connection portion connected to an outer wall of the housing and extending outward, and a protective portion connected to an extension end of the connection portion, the protective portion is spaced apart from the housing. The projection of the protective portion toward the housing covers the heat dissipation hole. The protective portion of the power adapter may shield the heat dissipation hole to prevent external dust from falling into the receiving cavity through the heat dissipation hole. Heat dissipated by the electronic assembly may be dissipated out through the heat dissipation hole.

Abstract: Apparatus and associated methods relate to dynamic bandwidth control of a variable frequency modulation circuit by selective contribution of a crossover frequency tuning engine (XFTE) in response to a transient in a switching frequency. In an illustrative example, the XFTE may generate a transient control signal (Ctrans) in response to a transient in a control output signal trans, (Cout) indicative of switching frequency and received from a feedback control circuit. The XFTE may generate Ctrans, for example, according to a predetermined relationship between a crossover frequency and the switching frequency of the modulation circuit. The feedback control circuit may, for example, generate Cout from a predetermined reference and a control input signal. Cout may, for example, correspond to a pulse-width modulated output delivered to a load through an inductor.

Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

Abstract: A power conversion device includes a plurality of semiconductor modules, a plurality of coolers, and a frame. The frame pressurizes and holds a stacked body in which the semiconductor modules and the coolers are alternately stacked. The frame includes a first frame and a second frame that sandwich the stacked body therebetween. The first frame is a plate material bent to surround the stacked body from three directions, and includes a pair of side walls extending in the stacking direction of the stacked body, and an abutting wall extending between the side walls and abutting the stacked body. The abutting wall is bent outward from the frame. Each of the side walls is bent inward from the frame.

Abstract: Thermal management systems include an open-circuit refrigeration system featuring a receiver configurable to store a refrigerant fluid, an evaporator configurable to extract heat from a heat load when the heat load contacts the evaporator, and an exhaust line, where the receiver, the evaporator, and the exhaust line are connected to form a refrigerant fluid flow path, and a first control device configurable to control a vapor quality of the refrigerant fluid at an outlet of the evaporator along the refrigerant fluid flow path.

Abstract: A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow.

Abstract: The invention is a small, low-power consuming, projector system. Once programmed and provided with image data, it can be a standalone system for presenting varying length, silent, videos. Its programmability and FPGA-based micro-circuitry allows it to be repurposed with minimal effort to support other embedded-light-system applications.

Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Abstract: A power supply for a computer includes a base having a bottom panel and two end panels being respectively provided with a plurality of first and second fastening sections; a fan assembly having a first frame provided with a plurality of third fastening sections located corresponding to the first fastening sections, and a heat dissipation fan fixed to the first frame; an internal part assembly including a second frame located on the bottom panel and provided with a plurality of fourth fastening sections located corresponding to the second fastening sections, and an internal part unit mounted on the second frame; and a cover being configured complementary to and covered on the base. All the fastening sections are located in a receiving space defined between the base and the cover, and the cover and the bottom panel of the base are free of any fastening holes for fastening purpose.

Abstract: A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.

Abstract: A microprocessor is attached to a cooling plate. The cooling plate is formed of two identical shells, each shell having a fluid chamber therein in communication with one or more fluid channels and a fluid port. The two shells are attached to each other such that the open top of each fluid cavity faces the other open top, so that the two fluid cavities form one large cavity. Fins are positioned inside the fluid cavity so as to form fluid passages between each two fins for the cooling fluid to flow and remove heat from the fins. Fluid chambers formed by the two shells are divided into multiple fluid channels among fins by the fins.