Abstract: A main housing portion of a portable information handing system. The main housing portion includes: a top cover portion; a bottom cover portion; and, an internal air intake ducting system, the internal air intake ducting system comprising a fan and a thermal channeling component thermally coupled to the fan, the thermal channeling component extending from an interior of a side of the bottom cover portion to the fan, the thermal channeling component and the bottom cover portion defining an air channel between the side of the bottom cover portion and the fan.

Abstract: A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

Abstract: A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.

Abstract: A digital control scheme controls an integrator of a PID filter to implement non-linear control of saturating the duty cycle during which the proportional and derivative terms of the PID filter are set to 0 while the integrator and its internal states (previous values or memory) is set to a duty cycle that is the sum of the current nominal duty cycle plus a deltaD. The deltaD is the maximum duty cycle increment that is used to regulate a voltage regulator from ICCmin to ICCmax and is a configuration register that can be set post silicon. An FSM moves from a non-linear all ON state to an open loop duty cycle which maintains the output voltage slightly higher than the required Vref. After a certain period in this open loop, the FSM then ramps down the open loop duty cycle value until the output voltage is close to the Vref.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: An electric power-steering control device has a substrate, a heat-generating component, and a heat-storing body. The heat-generating component is disposed on one surface of the substrate and generates heat when activated. The heat-storing body is capable of storing the heat from the heat-generating components. The heat-storing body has a main body having a rectangular plate shape and disposed on the one surface of the substrate. The heat-storing body has a notch section or a recess section.

Abstract: Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management.

Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A power adapter includes a housing, an electronic assembly and a protective assembly. The housing has a receiving cavity, and the housing is provided with at least one heat dissipation hole penetrating to the receiving cavity. The electronic assembly comprises a plurality of electronic elements located in the receiving cavity. The protective assembly comprises a connection portion connected to an outer wall of the housing and extending outward, and a protective portion connected to an extension end of the connection portion, the protective portion is spaced apart from the housing. The projection of the protective portion toward the housing covers the heat dissipation hole. The protective portion of the power adapter may shield the heat dissipation hole to prevent external dust from falling into the receiving cavity through the heat dissipation hole. Heat dissipated by the electronic assembly may be dissipated out through the heat dissipation hole.

Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

Abstract: Apparatus and associated methods relate to dynamic bandwidth control of a variable frequency modulation circuit by selective contribution of a crossover frequency tuning engine (XFTE) in response to a transient in a switching frequency. In an illustrative example, the XFTE may generate a transient control signal (Ctrans) in response to a transient in a control output signal trans, (Cout) indicative of switching frequency and received from a feedback control circuit. The XFTE may generate Ctrans, for example, according to a predetermined relationship between a crossover frequency and the switching frequency of the modulation circuit. The feedback control circuit may, for example, generate Cout from a predetermined reference and a control input signal. Cout may, for example, correspond to a pulse-width modulated output delivered to a load through an inductor.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

Abstract: A power conversion device includes a plurality of semiconductor modules, a plurality of coolers, and a frame. The frame pressurizes and holds a stacked body in which the semiconductor modules and the coolers are alternately stacked. The frame includes a first frame and a second frame that sandwich the stacked body therebetween. The first frame is a plate material bent to surround the stacked body from three directions, and includes a pair of side walls extending in the stacking direction of the stacked body, and an abutting wall extending between the side walls and abutting the stacked body. The abutting wall is bent outward from the frame. Each of the side walls is bent inward from the frame.

Abstract: Thermal management systems include an open-circuit refrigeration system featuring a receiver configurable to store a refrigerant fluid, an evaporator configurable to extract heat from a heat load when the heat load contacts the evaporator, and an exhaust line, where the receiver, the evaporator, and the exhaust line are connected to form a refrigerant fluid flow path, and a first control device configurable to control a vapor quality of the refrigerant fluid at an outlet of the evaporator along the refrigerant fluid flow path.

Abstract: A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow.

Abstract: The invention is a small, low-power consuming, projector system. Once programmed and provided with image data, it can be a standalone system for presenting varying length, silent, videos. Its programmability and FPGA-based micro-circuitry allows it to be repurposed with minimal effort to support other embedded-light-system applications.

Abstract: A power supply for a computer includes a base having a bottom panel and two end panels being respectively provided with a plurality of first and second fastening sections; a fan assembly having a first frame provided with a plurality of third fastening sections located corresponding to the first fastening sections, and a heat dissipation fan fixed to the first frame; an internal part assembly including a second frame located on the bottom panel and provided with a plurality of fourth fastening sections located corresponding to the second fastening sections, and an internal part unit mounted on the second frame; and a cover being configured complementary to and covered on the base. All the fastening sections are located in a receiving space defined between the base and the cover, and the cover and the bottom panel of the base are free of any fastening holes for fastening purpose.

Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Abstract: A microprocessor is attached to a cooling plate. The cooling plate is formed of two identical shells, each shell having a fluid chamber therein in communication with one or more fluid channels and a fluid port. The two shells are attached to each other such that the open top of each fluid cavity faces the other open top, so that the two fluid cavities form one large cavity. Fins are positioned inside the fluid cavity so as to form fluid passages between each two fins for the cooling fluid to flow and remove heat from the fins. Fluid chambers formed by the two shells are divided into multiple fluid channels among fins by the fins.

Abstract: A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: A mounting base can comprise: a group of mounting areas, each mounting area of the group of mounting areas comprising: a respective mechanical connector member of a group of respective mechanical connector members for attaching to a complementary mechanical connector member on each direct-current to direct-current (DC/DC) converter unit of the group of DC/DC converter units, and a respective electrical connector of a group of respective electrical connectors for attaching to a complementary electrical connector on each DC/DC converter unit of the group of DC/DC converter units, a group of electrical conductors attached to the group of respective electrical connectors in each mounting area, and attached to a main connector on the mounting base for connecting to a high-voltage (HV) connector of a main HV supply, and a cooling channel extending in heat conducting contact with the group of mounting areas.

Abstract: It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.

Abstract: A modular integrated ultracapacitor-based energy storage and power delivery apparatus (UCAP module) is described. In some embodiments, the UCAP module comprises: at least one ultracapacitor cell coupled together in a series, parallel, or combination of both series and parallel configuration; an integrated charging unit; conductive hardware electrically coupling the ultracapacitors cells together; at least one UCAP terminal rod extending throughout the UCAP module and used to route power within the UCAP module and in some embodiments to other UCAP modules; and a protective casing. In some embodiments the UCAP terminal rod couples the UCAP module to at least one additional UCAP module in a series, parallel, or a combination of both series and parallel configurations. In other embodiments, the UCAP module further comprises connector rods that electrically and mechanically couple the UCAP module to at least one additional UCAP module.

Abstract: An example system includes a motive application having a prime mover, a load, a driveline, and a motor/generator that couples to the driveline. The system includes a number of batteries, and a battery assembly that electrically couples the batteries to the motor/generator. The battery assembly includes a power interface positioned at a first end of the battery assembly, the power interface including a low voltage coupling and a high voltage coupling, and a service electrically interposed between the batteries and the power interface. The service disconnect in a first position couples at least one of the batteries to the first low voltage coupling and couples the batteries to the second high voltage coupling. The service disconnect in a second position de-couples the batteries from the low voltage coupling and the high voltage coupling.

Abstract: A docking system for facilitating a connection of an electronics module to a mating connector comprises first and second rails. Each rail has an elongated guide slot for receiving a corresponding guide portion of the electronics module during sliding movement of the electronics module toward the mating connector. A first elastic structure is located on the first rail. The first elastic structure has a first engagement portion extending into the elongated guide slot of the first rail. A second elastic structure is located on the second rail. The second elastic structure has a second engagement portion extending into the elongated guide slot of the second rail. The first engagement portion and the second engagement portion are configured to engage the guide portions of the electronics module and to resist movement of the guide portions in a direction generally perpendicular to the sliding movement of the electronics module.

Abstract: A housing includes a cup-shaped, plastic housing case; a cooling channel guided in the housing case for fluid cooling of an electric or electronic device situated in an interior of the housing case; and a planar shielding body integrated into the housing case and traversing walls of the housing case for shielding from electromagnetic radiation. The shielding body is a metallic wire cage or trough. The cooling channel is a metallic tubing. The shielding body and the cooling channel are connected to form a frame-like, pre-assembled assembly. The pre-assembled assembly, consisting of the shielding body and the cooling channel, is extrusion-coated with a plastic or encapsulated in a plastic to form the housing case.

Abstract: A cold plate includes a first side with a first surface, and a second side, opposite the first side. A coolant cavity is formed between the first side and the second side. A recessed base is machined into the first surface of the first side. The recessed base is bonded to a base copper plate and is a thinnest portion of the first surface.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.

Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: A heat sink includes a pipe through which cooled fluid flows and a cooling block having a first face on which the pipe is placed and a second face to which a heat emitting element is attached. The cooling block has a contact region and a noncontact region at positions where the cooling block faces the pipe. In the contact region, the first face contacts the pipe. In the noncontact region, the first face faces the pipe with a gap therebetween. The contact region is included in a projection region defined by projecting a region of attachment of the heat emitting element onto the first face.

Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Abstract: The present invention discloses a one-chambered constant pressure apparatus for liquid immersion cooling of servers, which are submerged within a non-conductive coolant maintained in the apparatus. When servers start to operate, a large amount of heat will be dissipated from servers. The coolant is vaporized into a coolant vapor by absorbing heat dissipated from servers, which enables servers to be cooled. The coolant vapor is condensed into a cooling liquid by a condenser. However, in the process of condensation, the rising coolant vapor tends to scatter in all directions resulting in a failure to condense all of the coolant vapor. Therefore, the uncondensed coolant vapor will cause the pressure in the apparatus to gradually rise, which eventually leads to the ineffective cooling of servers.

Abstract: The present invention relates to a power semiconductor module including a first heat dissipation substrate, a semiconductor chip, a lead plate, a PCB, and a heat dissipation plate that are packaged within a casing, wherein dualization of a heat dissipation structure is applied to facilitate superior heat dissipation performance compared to a conventional power semiconductor module.

Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.

Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.

Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.

Abstract: A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.

Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.

Abstract: Dew condensation in a housing of an inverter device can be prevented. The inverter device includes: a housing accommodating a power electronic element and an electrolytic capacitor; an opening formed in the housing; a thermal insulator disposed along a periphery of the opening; and a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, the water jacket being disposed such that a first surface of the body portion closes the opening from an outside of the housing, with the thermal insulator interposed therebetween. The power electronic element is mounted on the first surface of the body portion, and the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Abstract: A battery thermal management system includes a battery pack, a heat exchanger in fluid communication with the battery pack, a pump interposed between the heat exchanger and the battery pack to cause a heat exchange fluid to flow in a coolant loop between the heat exchanger and the battery pack. A heat capacitor is disposed downstream from the battery pack with respect to a direction of a flow of the heat exchange fluid through the coolant loop and upstream from the heat exchanger in the direction of the flow of the heat exchange fluid through the coolant loop. A valve is disposed in the coolant loop upstream from the heat capacitor in the direction of the flow of the coolant through the coolant loop. The valve controls at least a portion of the flow of the coolant through at least one of the heat capacitor and the heat exchanger.

Abstract: An electric power conversion device is provided with a case (60) which includes: a first member (61) having a first region (73) defining therein a first passage (78, 79) in which a cooling medium flows, and a second region (74) disposed on a side of the first region; and a second member (88) disposed so as to at least partly overlap with the second region as seen from a direction orthogonal to the second region in a spaced apart relationship to the second region, and internally defining a second passage (91) connected to the first passage. A reactor (31) is positioned in the first region, and a switching device (33) is positioned on the surface of the second member facing away from the first member while a capacitor (35) is positioned between the second member and the second region of the first member.

Abstract: A slave control apparatus including a receiver and a controller. The receiver is configured to receive a sensed physical quantity of a battery and a sensed output physical quantity of a converter corresponding to the battery. The controller is configured to determine state information of the battery based on the sensed physical quantity and the sensed output physical quantity, transmit the state information to a master control apparatus, and control the converter based on output information from the master control apparatus that corresponds to the state information.