Abstract: A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is formed in the first cavity. The first stress adjustment layer covers the first dielectric structure. A second substrate is provided. A second dielectric structure is formed on the second substrate. At least one second cavity is formed in the second dielectric structure. A second stress adjustment layer is formed in the second cavity. The second stress adjustment layer covers the second dielectric structure. The first stress adjustment layer and the second stress adjustment layer are bonded.

Abstract: A heat sink is provided for a power inverter of an electric motor of a vehicle. The heat sink includes a coolant inlet, a coolant outlet, a first cooling segment and a second cooling segment. The heat sink also includes a coolant channel system for cooling one or more power modules A power inverter including the heat sink and a vehicle including the power inverter are also provided.

Abstract: A power conversion apparatus includes a hermetic housing, a power semiconductor module, and dry gas. The hermetic housing includes a gas inlet valve and a gas outlet valve. The power semiconductor module is arranged in an internal space in the hermetic housing. The internal space in the hermetic housing is filled with dry gas.

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

Abstract: A cooling apparatus for an engine comprising: a) a coolant reservoir comprising a coolant line outlet port; b) a tank for holding an aqueous urea solution for injection into an exhaust system of the engine; c) a coolant line for transferring a coolant fluid discharged from the coolant reservoir via the coolant line outlet port to the tank to enable, in use, heat exchange between the coolant fluid and the aqueous urea solution contained in the tank; d) a coolant control valve located on the coolant line for controlling flow of coolant fluid along the coolant line to the tank; and e) a filter for filtering the coolant fluid being discharged via the coolant line outlet port; wherein the filter comprises a filtering portion that is located within an interior of the coolant reservoir so that the coolant fluid is filtered within the coolant reservoir before the coolant fluid enters the coolant line.

Abstract: A cooling device, including at least one of following: a casing and a flow channel that is disposed inside the casing, the casing including a metal portion and a resin portion that is bonded to at least a portion of the metal portion; a casing that includes a metal, a flow channel that is disposed inside the casing, and a component that includes a resin and is bonded to a surface of the casing, and a method of manufacturing the cooling device including the steps of a first process of bonding the component to the first metal member by injection molding and a second process of connecting the second metal member with the first metal member to which the component is bonded.

Abstract: A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to th

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: The present disclosure provides for integrated cooling systems including backside power delivery and methods of manufacturing the same. An integrated cooling assembly may include a device and a cold plate. The cold plate has a first side and an opposite second side, the first side having a recessed surface, sidewalls around the recessed surface that extend downwardly therefrom to define a cavity, and a plurality of support features disposed in the cavity. The first side of the cold plate is attached to a backside of the device to define a coolant channel therebetween. The cold plate includes a substrate, a dielectric layer disposed on a first surface of the substrate, a first conductive layer disposed between the first surface and the dielectric layer, a second conductive layer disposed on a second surface of the substrate, and thru-substrate interconnects connecting the first conductive layer to the second conductive layer.

Abstract: A cold plate is couplable with a component for dissipating heat from a component. The cold plate includes a top plate coupled with a bottom plate to receive a cooling medium therebetween. The top plate includes a body and a plurality of walls extending from the body, wherein each wall of the plurality of walls includes a recess extending within the wall. The bottom plate includes a body and a plurality of walls extending from the body such that an end portion of each wall of the bottom plate is inserted within the recess of each wall of the top plate to form an interlocking joint.

Abstract: An electric power conversion apparatus includes a semiconductor module, a control circuit board and a wireless communication unit. The semiconductor module has at least one semiconductor element built therein. The control circuit board is configured to control the semiconductor module. The wireless communication unit is configured to wirelessly communicate electrical signals between the semiconductor module and the control circuit board. The wireless communication unit includes a first communication device provided on the control circuit board so as to face the semiconductor module, and a second communication device provided on the semiconductor module so as to face the control circuit board. Moreover, there are no obstacles on a straight path between the first and second communication devices.

Abstract: A heat radiation module comprises: a bracket having an upper surface, a lower surface, and a first side surface for connecting the upper surface and the lower surface, and a second side surface facing the first side surface; and a heat dissipation passage disposed in the bracket, wherein the bracket includes a groove formed on at least one surface among the upper surface and the lower surface, the heat dissipation passage includes a first passage disposed between one side of the groove and the first side surface and a second passage disposed between the other side of the groove and the second side surface, and a part of the first passage overlaps the groove extending in a direction from the first side surface toward the second side surface.

Abstract: In one aspect, a chiller/heater component of a thermo-electric cooler pump system comprising: wherein the chiller/heater component comprises: a wetted side of the chiller/heater component comprising a regularly-spaced plurality of parallel rows of elongated elements between which the liquid flows, wherein the plurality of rows of elongated elements are oriented perpendicular to both the flow of the liquid and the wetted side of the chiller/heater component, wherein the plurality of rows of elongated elements extends into the liquid from a single surface of the wetted side of the chiller/heater component, and wherein the wetted side of the chiller/heater component is in contact with the liquid, and a dry side of the chiller/heater component comprising a plurality of parallel sheets, and wherein the chiller/heater component comprises an electron flow through the plurality of parallel sheets to facilitate a thermal heat transfer by a Peltier effect.

Abstract: A manifold system includes a supply manifold and a return manifold. The supply manifold delivers fluid to cold plates to cool processing units of a computing system. The return manifold receives the fluid from the cold plates. The supply manifold has supply fluid ports equidistantly spaced about the side surface of the supply manifold, and the return manifold has return fluid ports equidistantly spaced about the side surface of the return manifold.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: A two-phase or hybrid immersive cooling system is converted to a one-phase immersive cooling system, by (1) modifying a structure of the two-phase immersive cooling system such that a cooled portion of a substitute operating fluid flows into the operating fluid reservoir from a direction other than from above the reservoir, and (2) using a high boiling point composition as the substitute operating fluid. In some embodiments the tube condensers of the two-phase or hybrid immersive cooling system are retained, and in other embodiments at least portions of the regions previously occupied by tube condensers are used for heat exchangers, and optionally fluid pumps. In still other embodiments at least portions of the regions previously occupied by tube condensers are used for hot fluid holding tanks.

Abstract: A die-cast cooling device for protecting a computer assembly is disclosed. The die-cast cooling device includes a cooling plate, a plurality of die-cast fins, an opening formed on the cooling plate, and a cover coupled to the cooling plate. The cooling plate extends between two side walls, and the cooling plate and the side walls are arranged to form a protective space for computing components. The plurality of die-cast fins are formed on the cooling plate, extending away from the protective space. The opening provides access to the protective space. The cover is movable between a closed position and an open position, the cover preventing access to the protective space in the closed position, and the cover providing access to the protective space in the open position.

Abstract: The present application discloses a power cabinet, which is designed as a form of cabinet. All devices in the power cabinet are categorized into two types, and the two types of devices can have their own heat-dissipation channels or share a same heat-dissipation channel, which has a compact overall structure and high heat-dissipation efficiency compared with an air duct layout solution in the conventional technology.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

Abstract: In one aspect, the present disclosure relates to a manufactured utility apparatus that includes a base module, an ice bridge module attached to the base module, and an equipment cabinet module attached to the base module. The manufactured utility apparatus may include a cable securing module attached to the base module. The cable securing module may be configured to electrically connect the utility apparatus and a utility resource. The manufactured utility apparatus may further include an H-frame module attached to the base module, and an antenna module attached to the base module, the antenna module being operatively connected to the utility resource. The manufactured utility apparatus may include a grounding module configured to electrically ground the utility apparatus and the utility resource.

Abstract: Embodiments of a dock with an actively controlled heatsink for a multi-form factor Information Handling System (HS) are described. In some embodiments, a dock may include: a base, a plateau configured to receive an IHS, and an arm coupling a distal edge of the base to a proximal edge of the plateau, where the plateau comprises a heatsink configured to cool a heatpipe disposed within the IHS via a bottom surface of the IHS.

Abstract: The present disclosure relates to an IED configured for use as a protection relay in an electric power system. The IED comprises a plurality of cassettes connected to a backplane, with at least two cassettes mounted adjacent each other. Each of the cassettes comprises a housing profile in the form of a rectangular tube having an envelope wall of a heat conducting material, and at least one electronic card arranged in a card slot within the tube formed by the housing profile, which at least one card is electrically connected to the backplane. Adjacent cassettes are separated a distance such that air canals are formed between their respective housing profiles.

Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system.

Abstract: Embodiments are disclosed of an IT rack and a server including a cooling module. An integrated fluid distribution manifold set with a supply manifold is on the front of the rack and a return manifold is on the rear of the rack. The supply manifold extends from the front to the rear and rack connectors, which fluidly couple the rack to a data center facility system, are on the top of the rack. Supply and return connectors are positioned so that the connectors face each other within the rack. Each server includes a cooling module with a movable connector set that can extend outside the server chassis to connect with the manifolds. The cooling module's connector set includes a transmission structure that allows the supply and return connectors of the connector set to engage with connectors on the supply and return manifolds.

Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.

Abstract: A circuit structure includes a plurality of semiconductor elements arranged side by side, and each semiconductor element includes source terminals and at least one gate terminal arranged side by side with the source terminals. The circuit structure includes: a first bus bar connected to the source terminals of the semiconductor elements; connection portions that connect the source terminals and the first bus bar and are arranged side by side along the arrangement direction of the semiconductor elements and whose one ends are connected to the source terminals of the respective semiconductor elements; an insulating portion provided so as to be present between each adjacent pairs of the connection portions; and conductive portions provided in the insulating portion and connected to the gate terminals.

Abstract: A structure for forming inductor windings includes a first portion and a second portion of a clamshell casing. The first portion includes a first set of electrically conductive segments, a first inner carrier, and a first outer carrier. The second portion includes a second set of electrically conductive segments, a second inner carrier, and a second outer carrier. An inductor core is mountable between the first inner carrier and the first outer carrier within the first portion. A control assembly aligns and joins the first portion to the second portion of the clamshell casing such that the first set of electrically conductive segments arranged in the first pattern that correspond to first half-turns of the inductor windings, are attached to the second set of electrically conductive segments arranged in the second pattern that correspond to second half-turns of the inductor windings, to form continuous turns around the inductor core.

Abstract: The invention relates to electrical/electronic equipment, such as a high-powered lamp, switching device, control device, transformer, signaling device, display device, or the like, having a housing (2) and at least one cooling fluid supply apparatus (3) arranged in the housing or allocated thereto. Said cooling fluid supply apparatus has a cooling fluid inlet apparatus and a cooling fluid discharge apparatus on the housing and a cooling fluid guide apparatus within the housing. In order to improve such equipment such that safe actuating of the equipment is possible, together with a compact and competitive design, with simultaneously efficient cooling, in particular also in potentially explosive areas, at least the cooling fluid inlet apparatus is allocated a safety switching apparatus for interrupting the cooling fluid supply, in particular in the case of a pressure drop in the cooling fluid. The invention also relates to a corresponding method.

Abstract: A vehicle having: two front wheels; two rear wheels; two electric motors, which are connected to the two wheels of a same axle; and an electronic power converter to control both electric motors. The electronic power converter has: two groups of power modules; at least one capacitor, which is connected in parallel to a DC input; a container, which houses the two groups of power modules and the capacitor and is provided with a cup-shaped body provided with a lower wall; and a cooling system provided with a chamber, which is configured to be flown through by a cooling liquid. The chamber of the cooling system is delimited, on one side, by the lower wall of the cup-shaped body of the container and, on the other side, by a containing wall, which is arranged at a given distance from the lower wall.

Abstract: A connection body for use with an endoscope that provides an electrical connection between at least one electrical component arranged in a proximal end region of the endoscope and an internal electrical connection provided in the proximal end region. The connection body including: a dimensionally stable three-dimensional circuit carrier: and a flexible elongate circuit board. Where, in a first region of the circuit carrier, the electrical component is mechanically directly connected to the circuit carrier and is contacted by conductor tracks provided in the circuit carrier; in a second region different from the first region, a first end of the circuit board is mechanically directly connected to the circuit carrier and contacts the conductor tracks for electrical connection to the electrical component and a second end of the circuit board opposite the first end in a longitudinal direction of the circuit board, contacts the internal electrical connection.

Abstract: A heat exchanger for thermal management of an electronic device includes a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source. The heat exchanger also includes an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars. Each hollow pillar has an evaporation surface and a pore configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface. The evaporation surface being configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95% and the contact line has a length of less than about 0.0314 mm.

Abstract: An electric power module system (1) for use in an electrically operated vehicle (21), comprising: —a base module comprising a cooling passage for fluid coolant and coolant connections for supplying fluid coolant to the cooling passage, the base module further comprising at least one external electrical connection for power input to and/or power output from the electric power module system, —an add-on module configured to be mounted to and electrically connected to the base module, so that the add-on module, when mounted, can be cooled and powered via the base module. When the add-on module is mounted, the cooling passage is delimited by at least a first delimiting surface provided on the base module and a second delimiting surface provided on the add-on module, so that fluid coolant supplied via the coolant connections of the base module comes into contact with both of said delimiting surfaces.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) is provided to determine a change in a power state or a coolant state of at least one server and to enable a coolant response from an overhead cooling unit (OCU) to dissipate heat from secondary coolant of a secondary cooling loop.

Abstract: The present invention provides a microchannel heat sink with plural microchannels, each having a respective inlet and outlet to permit flow, in particular two-phase flow, of a working fluid. The plural microchannels are arranged such that adjacent microchannels accommodate flow of working fluid in opposite directions and are thermally coupled to each other to enable heat exchange between the corresponding adjacent microchannels. In one aspect, a microchannel inlet is positioned at an angle (e.g., 90 degrees) with respect to its outlet. The plural microchannels define parallel longitudinal axes that are optionally arranged on the same plane and/or side-by-side in a single layer. Further, in one aspect, each microchannel cross-sectional area increases as the channel length progresses from an upstream end (e.g., adjacent to the inlet) to a downstream end (e.g., adjacent to the outlet) of the corresponding microchannel.

Abstract: An electrical appliance that can be fastened to a support element, in particular a wall, includes a heat sink, circuit boards, and a housing. The circuit boards are fastened to the heat sink in each case and the heat sink is able to be fastened or is fastened to the support element. The housing surrounds the circuit boards and is fastened to the heat sink.

Abstract: Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.

Abstract: With an objective of obtaining a temperature control unit capable of highly uniform temperature control, provided is a temperature control unit (1) having a heat transfer medium introduction port (2) configured to introduce a heat transfer medium from outside, a temperature control mechanism (3) through which the heat transfer medium from the heat transfer medium introduction port (2) passes, and a heat transfer medium discharge port (4) configured to discharge the heat transfer medium from the temperature control mechanism (3) to outside, wherein: the temperature control mechanism (3) is provided with a porous metal body and a housing (5) configured to house the porous metal body; at least one main surface of the housing (5) is exposed to an outer side of the temperature control mechanism (3), and an inner side of the main surface contacts the porous metal body, thereby exchanging heat between the porous metal body and outside; and a heat transfer medium dispersion area (10) is provided between the heat tran

Abstract: An electronics equipment cabinet includes multiple cabinet walls defining an interior enclosure space for housing at least one electronic device, an outer wall positioned to shield from solar radiation an outer surface of at least one of the multiple cabinet walls, and at least one divider wall positioned between the outer wall and the cabinet wall to define first and second channels. The cabinet wall has two openings to allow internal cabinet air to flow between the interior enclosure space and the first channel, while inhibiting external ambient air from entering the interior enclosure space and the first channel. The outer wall has two openings positioned to allow external ambient air to flow through the second channel to cool the internal cabinet air in the first channel via heat exchange through the divider wall, while inhibiting the external cabinet air from mixing with the internal cabinet air.

Abstract: A mixed-signal controller for controlling a multiphase average-current-mode voltage regulator having an output connected to a load, which comprises a digital voltage-sampling ADC for converting the output voltage signal from analog to digital representation; a digital current-sampling ADC, for converting the inductor current from analog to digital representation; a digital compensator for generating a current reference signal, based on a digital voltage error signal and for generating a duty-ratio command signal, based on a digital current error signal; a multiphase Digital Pulse Width Modulator (DPWM), for generating a pulse-width-modulated signal (per-phase), to thereby control the per-phase currents and output voltage supplied to the load; an analog front-end, in which single-ended signals are used for steady-state control via ADC measurement and the single-ended output voltage is used for transient detection and output voltage extremum detection during transient; a Transient Suppression Unit (TSU), for ge

Abstract: A system and method of forming integrated power electronic packages includes 3D-printing a cold plate having a hollow interior recess and a plurality of fins. The method includes printing, using a 3D printer, an electrical insulation layer and a conductor substrate onto a top surface of the cold plate, such that the electrical insulation layer and conductor substrate are embedded within the top surface of the cold plate. The method further includes embedding power devices in the conductor substrate, printing, using a 3D printer, a circuit board on and around the power devices, and mounting electronic components on the circuit board.

Abstract: A small cell device includes a housing body, a heat sink, an interface board, a first power amplifier (PA) board, a second PA board, a power board, and a main board. The housing body defines a cavity and has two depthwise ends. The heat sink is coupled to the housing proximate a first depthwise end. The interface board is positioned within the cavity and adjacent to the heat sink. The first PA board is positioned within the cavity and adjacent to the interface board and the heat sink. The second PA board is positioned within the cavity and proximate a second depthwise end. The power board is positioned within the cavity and adjacent to the second PA board. The main board is positioned within the cavity between the interface board and the second PA board. The heat sink dissipates heat generated during operation of at least the first PA board.

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Abstract: A rail-bound vehicle includes an energy storage device having a traction battery and a cooling device for cooling the traction battery using a coolant circulating in at least one coolant circuit. The energy storage device supplies a traction device of the vehicle with electrical energy. At least one air-conditioning device air conditions a passenger compartment of a car of the vehicle using a refrigerant circulating in a refrigerant circuit, and a control device controls the air-conditioning device. The air-conditioning device has a heat exchanger coupling the refrigerant circuit of the air-conditioning device to the coolant circuit of the cooling device of the energy storage device. The control device controls a flow of the refrigerant through the heat exchanger. An energy storage device, an air-conditioning device, an arrangement for cooling a traction battery and a method for controlling the arrangement are also provided.

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

Abstract: A hermetically sealed electronics module includes a core IC installed on a substrate. A collar surrounds the core IC and is sealed to the substrate and to a lid, forming a sealed chamber. A heat spreader bonded to an internal surface of the lid extends downward into proximal thermal contact with the core IC. A thin layer of TIM can be applied between the heat spreader and core IC. The heat spreader does not overlap any tall components that extend above the core IC, and can extend over regions adjacent to the core IC. Tall components can be limited to a periphery of the chamber, and/or the heat spreader can include openings that surround central tall components. The heat spreader can be soldered or welded to the lid over an entire upper surface of the heat spreader. X-ray and/or CSAM scanning can detect heat spreader bonding flaws.

Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

Abstract: An electronic device including a substrate, a first electronic component provided on the substrate, a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component, a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component, and a heat sink attached to the substrate, in which the heat sink includes a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate, a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and a length of the first protruding portion in the norm

Abstract: Disclosed is a vehicle charging station (1) comprising a first reservoir (5) arranged to contain a first charging fluid and a charging fluid delivery system (3) arranged to deliver at least part of the first charging fluid (5) into a heat exchange relationship with a vehicle thermal energy storage material (108) of a vehicle (100) selectively connected to the vehicle charging station (1), thereby charging the vehicle thermal energy storage material (108) by changing its temperature and/or phase and/or chemistry.