With Cold Plate Or Heat Sink Patents (Class 361/702)
  • Patent number: 11477915
    Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: October 18, 2022
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Patent number: 11428478
    Abstract: Embodiments disclosed herein describe manifold microchannel heat sinks having a gridded microchannel assembly with free-form fin geometries for cooling heat-generating devices in the electronics modules. In an embodiment, a manifold microchannel heat sink includes a target surface and a gridded microchannel assembly comprising a plurality of microchannel cells. Each microchannel cell is surrounded by thermally-conductive sidewalls and includes a fluid inlet, a microchannel structure fluidly coupled to the fluid inlet and a fluid outlet. The microchannel structure extends from the target surface and defines a microchannel extending in a normal direction with respect to the target surface. The microchannel structure includes a base plate disposed on the target surface and a three-dimensional fin structure disposed on the base plate. The three-dimensional fin structure has a shape optimized for thermal performance and fluid performance.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: August 30, 2022
    Inventors: Yuqing Zhou, Ercan M. Dede, Tsuyoshi Nomura
  • Patent number: 11266046
    Abstract: A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: March 1, 2022
    Assignee: Bull SAS
    Inventors: Luc Dallaserra, Marc Raeth
  • Patent number: 11076502
    Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: January 4, 2020
    Date of Patent: July 27, 2021
    Assignee: Juniper Networks, Inc
    Inventors: Alexander I. Yatskov, Stephen Cleeton, Valery Kugel
  • Patent number: 10993351
    Abstract: An electronic device and a heat-dissipation device for an electronic device are provided. The heat-dissipation device comprises an airflow channel; an airflow source located in the airflow channel; a plurality of elongated heat-dissipation fins arranged in the airflow channel; and a plurality of heat-dissipation flow-guiding devices arranged in the airflow channel and between the airflow source and the plurality of elongated heat-dissipation fins, wherein the plurality of heat-dissipation flow-guiding devices include a first heat-dissipation flow-guiding device in a central position of the airflow channel and a second heat-dissipation flow-guiding device on two sides of the airflow channel, and a longitudinal distance between the first heat-dissipation flow-guiding device and the airflow source is less than the distance between the second heat-dissipation flow-guiding device and the airflow source.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: April 27, 2021
    Assignee: Harman International Industries, Incorporated
    Inventors: Wenbing Tang, Guanting Huang, Haifeng Lu, Liang Tan
  • Patent number: 10935742
    Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: March 2, 2021
    Assignee: Ciena Corporation
    Inventors: Eric Maniloff, Victor Aldea, Terence Graham, Bonnie Lynne Mack
  • Patent number: 10873269
    Abstract: An electric power conversion apparatus includes: a heat-generating element; a case having a cooling wall portion on which the heat-generating element is held and accommodating the heat-generating element; a flow passage cover having an opening formed therein and covering a surface of the cooling wall portion on the opposite side to the heat-generating element; a standing portion standing from the cooling wall portion and inserted in the opening; a flow-passage side wall portion formed in one of the cooling wall portion and the flow passage cover to protrude toward the other; a coolant flow passage surrounded by the cooling wall portion, the flow passage cover and the flow-passage side wall portion; and a sealant that seals both a gap between the cooling wall portion and the flow passage cover at a periphery of the coolant flow passage and a gap between the standing portion and the flow passage cover.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: December 22, 2020
    Inventors: Takuro Tsutsui, Daisuke Harada
  • Patent number: 10801789
    Abstract: A heat exchanger for regulating the temperature of objects using coolant includes a top plate, a middle plate, and a bottom plate that are sealedly engaged for circulation of coolant, and collectively form a stacked cooling block. The heat exchanger includes a plurality of coolant flow channels, including sets of feed and return channels, which are formed between the top, middle, and bottom plates, and which operably cool one or more cooling surfaces of the heat exchanger. An inlet manifold of the heat exchanger distributes coolant through a plurality of distribution apertures, into a set of coolant feed channels. The coolant feed channels are fluidly connected with a set of coolant return channels, which in turn direct coolant toward and into an outlet manifold. The inlet manifold is adapted to substantially evenly distribute fluid through the plurality of coolant flow channels, by way of one or more flow-balancing elements integrated therewith.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: October 13, 2020
    Assignee: Senior UK Limited
    Inventors: Ragu Subramanyam, Adrián Loureiro Fernández
  • Patent number: 10770710
    Abstract: A connection module includes bus bars connecting positive and negative electrode terminals of adjacent power storage elements, a first sheet member that is expandable, and second sheet members fixing each of the bus bars independently. Each of the bus bars includes a fitting portion extending from one edge of the plate member with respect to a width direction (an arrow Y-direction) and fitting in a fixing portion of each second sheet member. The first sheet member holds each second sheet member to which each of the bus bars is fixed, and the first sheet member is expandable at sections between adjacent second sheet members in a longitudinal direction of the first sheet member in a distance of a maximum value of tolerance ?L max that is a total value of tolerances of an electrode pitch with respect to an arrangement direction in which the adjacent power storage elements are arranged.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: September 8, 2020
    Inventors: Nobuyuki Matsumura, Shinichi Takase, Yusuke Suzuki, Atsushi Yamanaka
  • Patent number: 10741817
    Abstract: A battery connection module is adapted to connect a battery pack, the battery connection module comprises: a carrying tray; a plurality of busbars mounted on the carrying tray and adapted to electrically connect a plurality of batteries of the battery pack; a flexible circuit board mounted on the carrying tray and mechanically and electrically connected to the plurality of busbars, the flexible circuit board having a frame-shaped portion with an opening, a flexible mating portion being provided in the opening of the frame-shaped portion; and a battery management system mounted on the carrying tray, positioned above the flexible circuit board and comprising a flexible circuit board connector; the flexible mating portion extending into the opening and being reversely bent and mated with the flexible circuit board connector on the battery management system. These components are integrated to an integrated module that facilitates subsequent assembling and use.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: August 11, 2020
    Assignees: Molex, LLC, Keihin Corporation
    Inventors: Siow-Pheng Goh, Kian Heng Lim, Shingo Tsuchiya, Seiji Kamata
  • Patent number: 10677539
    Abstract: A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: June 9, 2020
    Inventors: Atsunobu Nakamura, Takuroh Kamimura, Akinori Uchino
  • Patent number: 10498250
    Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element constituting a power converter circuit. A smoothing capacitor is configured to smooth a direct-current voltage applied to the semiconductor module. A pair of positive and negative busbars is configured to electrically connect the semiconductor module and the smoothing capacitor. The positive and negative busbars are arranged to face each other with a predetermined space therebetween. A discharge resistor is connected in parallel with the smoothing capacitor via the positive and negative busbars, and is configured such that an electrical charge stored in the smoothing capacitor flows through the discharge resistor as a discharge current. The positive and negative busbars are interposed between the discharge resistor and the smoothing capacitor.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: December 3, 2019
    Inventors: Nobuaki Takahashi, Yuya Kiuchi, Kenshiro Hida
  • Patent number: 10342152
    Abstract: The invention relates to an electronic device having a multi-part printed circuit board, the printed circuit board parts of which are connected to one another by current-carrying, flexible regions, having a support, around which the printed circuit board bent around the flexible regions of the printed circuit board is arranged and fixed, and having a housing in which the printed circuit board mounted on the support is fixed.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: July 2, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Christian Harrer, Andreas Bernhardt
  • Patent number: 9998055
    Abstract: A multi-stage power module is provided. The multi-stage power module may include at least one heat sink having a first surface, a second surface and an edge, a first set of switches disposed on the first surface of the heat sink, a second set of switches disposed on the second surface of the heat sink, a plurality of capacitors disposed adjacent to the edge of the heat sink, and a bus bar assembly symmetrically coupling the capacitors to each of the first set of switches and the second set of switches.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: June 12, 2018
    Assignee: Caterpillar Inc.
    Inventors: Joshua Wade Dorothy, Corey Allen Kauk
  • Patent number: 9872401
    Abstract: A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 16, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Mitsuhiro Tomikawa, Koji Asano
  • Patent number: 9826655
    Abstract: A mounting assembly for accurately positioning, attaching, and supporting a circuit board such as a midplane board within a chassis. The assembly's design facilitates an improved assembly method that includes fastening the board to the chassis so to provide reliable connector mate and rapid assembly. The mounting assembly includes a clamp member) and a spring assembly that act in combination to secure a circuit board onto datum features provided on a chassis and/or its modified and/or lightweight alignment bulkhead, which is part of the new assembly. The new assembly design enables a tight tolerance loop between mating components while also providing a more consistent connector engagement when compared with many prior device designs. In some embodiments, a single fastener (e.g., a nut) is used to attach the clamped and captured circuit board to the chassis. The board is “captured” as it is sandwiched between the modified bulkhead and the clamp.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: November 21, 2017
    Inventors: Rebecca Di Ricco Kurzava, Eric M. Innes
  • Patent number: 9738976
    Abstract: The present disclosure includes various assemblies to be used with one or more energy storage devices. In one embodiment, an energy storage device assembly can include a plurality of energy storage devices, and each of these energy storage devices can include a first projecting electrode and a second projecting electrode. The energy storage devices can be connected to each other through a weld, which can directly bond the adjacent first and second projecting electrodes of adjacent energy storage devices to one another. This configuration can allow each of the energy storage devices to be connected together in series.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: August 22, 2017
    Assignee: Ioxus, Inc.
    Inventors: Jake Pyzza, Robert Houston Lawler, Jr., Tomas Sadilek, Bryce Gregory, Daniel Alexander Patsos, Daniel Matthew Halbig, Steve Andrew Correll
  • Patent number: 9687943
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: June 27, 2017
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9684024
    Abstract: A group of electric wires of a first wire harness assigned to a first divided region is identified for each pattern as a necessary electric wire having a connection counterpart in a second divided region adjacent to the first divided region among the divided regions and an extra electric wire not having a connection counterpart in the second divided region. It is determined, out of connectors connected to a group of the electric wires of the first wire harness, that a connector is an unmated connector when all electric wires connected to the connector are the extra electric wires.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: June 20, 2017
    Inventors: Jin Watanabe, Shinya Mori
  • Patent number: 9627151
    Abstract: An electrical storage module in which a plurality of electricity storage elements are electrically connected by conductive member, includes: a voltage detection board having voltage detection conductor that detects terminal voltage of the electricity storage element; a first external threaded component that connects the voltage detection conductor of the voltage detection board to the conductive member; and a cover that covers the voltage detection board; wherein: the cover is made from an insulating material; the conductive member has a first internal threaded portion into which the first external threaded component is to be screwingly engaged; and the distance between the inside surface of the cover that faces a head portion of the first external threaded component and an upper surface of the head portion of the first external threaded component is shorter than the distance between an end portion of the first internal threaded portion towards the cover side and an end of shaft portion of the first external
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: April 18, 2017
    Assignees: Hitachi Automotive Systems, Ltd., Nissan Motor Co., Ltd.
    Inventors: Eisuke Sengoku, Toshikazu Maeshima, Hiroshi Hoshi, Akira Kotaki, Shigeyuki Kiyota, Yoshiyuki Tanaka, Toyoki Iguchi, Hiroaki Saitou, Masayoshi Saeki
  • Patent number: 9620292
    Abstract: A direct-current capacitor module is disclosed in this disclosure. The direct-current capacitor module includes a plurality of direct-current capacitors and a laminated busbar structure. The direct-current capacitors are grouped into a first portion and a second portion. The laminated busbar structure is electrically connected to capacitor binding posts of the direct-current capacitors. The laminated busbar structure has a positive terminal and a negative terminal. The laminated busbar structure includes a first busbar layer, a second busbar layer and an insulation layer. The first busbar layer includes a first sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the first portion. The second busbar layer includes a second sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the second portion. The insulation layer is disposed between the first busbar layer and the second busbar layer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: April 11, 2017
    Inventors: Sen-Lin Wen, Jian-Ping Ying, Hong-Jian Gan, She Zhao
  • Patent number: 9568965
    Abstract: Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal, a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: February 14, 2017
    Inventors: Osamu Honmura, Nobuyuki Kojima, Naoto Sakuma
  • Patent number: 9560737
    Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: January 31, 2017
    Inventors: Phillip D. Isaacs, Michael T. Peets, Xiaojin Wei
  • Patent number: 9318406
    Abstract: A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.
    Type: Grant
    Filed: March 4, 2006
    Date of Patent: April 19, 2016
    Inventor: Harald Prautzsch
  • Patent number: 9287656
    Abstract: An electrical connector that includes a terminal adapted to mate with another terminal and at least one heat dissipating element that has opposing ends and an opening therebetween. At least one of the ends includes at least one printed circuit board engagement member configured to engage a printed circuit board for electrical current transfer. The opening receives the terminal such that heat dissipating element substantially surrounds and contacts the terminal.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: March 15, 2016
    Assignee: Amphenol Corporation
    Inventors: Paul M. Crozier, John K. Griffiths
  • Patent number: 9116536
    Abstract: A data center inside a shipping container having computing equipment and associated devices located in its interior. The data center includes computing equipment, an internal network, an external network, power supplies, a lighting system, and a controller. The power supplies and the lighting system connect to the controller, which in turn connects to the internal network. The computing equipment connects to the power supplies. A remote computing device connected to the external network communicates with the controller through the internal network. The remote computing device receives information from the controller and instructs the controller to selectively energize and de-energize the power supplies and the lighting system. The controller may have a user interface configured to display data associated with the computing equipment and other devices and systems located within the container.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: August 25, 2015
    Inventors: Stephen V. R. Hellriegel, Mario L. Jaena, Brian D. Koblenz, David Louis Anderson, David Driggers, Hampton Walker Haddock, Jr.
  • Patent number: 9081054
    Abstract: A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 20 comprises: a first pin electronics card 21; a second pin electronics card 22; and a single intermediate water jacket 23 which is sandwiched between the first pin electronics card 21 and second pin electronics card 22. The intermediate water jacket 23 is in close contact with the first inside main surface 212 of the first pin electronics card 21 which faces the second pin electronics card 22 and is in close contact with the second inside main surface 222 of the second pin electronics card 22 which faces the first pin electronics card 21.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: July 14, 2015
    Inventor: Koei Nishiura
  • Patent number: 9069533
    Abstract: A data center container includes a chassis, a cooling system, a draining mechanism, and a latching member. The chassis includes a front plate with a securing hole. The cooling system includes a water tray and a drainer tray. The water tray communicates with the drainer tray. The draining mechanism communicates with the drainer tray and extends out of the chassis. The latching member is attached to the draining mechanism. The latching member includes an inserting post, and the inserting post being engaged in the securing hole, to position the draining mechanism to the front plate.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: June 30, 2015
    Inventor: Xu Yang
  • Patent number: 9042100
    Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 26, 2015
    Assignee: Aavid Thermalloy, LLC
    Inventor: Sukhvinder S. Kang
  • Patent number: 9036349
    Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: May 19, 2015
    Assignee: Hydac Cooling GmbH
    Inventors: Roland Herber, Claudia Wetzstein
  • Patent number: 9030822
    Abstract: A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: May 12, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Yu Qin, Reshma Rathod, Richard J. Hampo
  • Patent number: 9030823
    Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 12, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Soo Kim, Do Jae Yoo, Young Ho Sohn, Bum Seok Suh, In Wha Jeong
  • Patent number: 9029814
    Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 12, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Ryotaro Matui, Hideaki Yokoyama
  • Publication number: 20150124407
    Abstract: An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity, such as polyetheretherketone. A reflective surface may be disposed on a housing containing the substrate to reduce the absorption of radiation. A heat sink and fluid inlet and outlet may also be arranged to remove heat generated by the electrical components.
    Type: Application
    Filed: February 27, 2014
    Publication date: May 7, 2015
    Applicant: Hamilton Sundstrand Corporation
    Inventor: Leo J. Veilleux, JR.
  • Publication number: 20150116942
    Abstract: A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.
    Type: Application
    Filed: January 9, 2015
    Publication date: April 30, 2015
    Inventors: Junichi TERAKI, Mitsuhiro TANAKA, Noriyuki OKUDA
  • Patent number: 9019704
    Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: April 28, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Roy Zeighami
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9013874
    Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 21, 2015
    Assignee: SK hynix memory solutions inc.
    Inventor: Givargis George Kaldani
  • Patent number: 8995130
    Abstract: In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: March 31, 2015
    Assignee: Denso Corporation
    Inventor: Tsuyoshi Hosoda
  • Patent number: 8995129
    Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: March 31, 2015
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K. K.
    Inventors: Yoshitaka Iwata, Shogo Mori, Tomoya Hirano, Kazuhiko Minami
  • Publication number: 20150077940
    Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
    Type: Application
    Filed: November 20, 2014
    Publication date: March 19, 2015
    Inventor: Carmen Rapisarda
  • Patent number: 8982558
    Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: March 17, 2015
    Assignee: General Electric Company
    Inventors: Richard Alfred Beaupre, Joseph Lucian Smolenski, William Dwight Gerstler, Xiaochun Shen
  • Patent number: 8982552
    Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: March 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arlen L. Roesner, Brandon Rubenstein, John F. Hutton, Richard Stanton Self
  • Publication number: 20150062822
    Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.
    Type: Application
    Filed: July 25, 2014
    Publication date: March 5, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Michimasa AOKI, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
  • Patent number: 8971041
    Abstract: A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors configured in a stack. The coldplate includes a first portion configured for attachment to at least one electronic component, the first portion having a perimeter and for dissipating heat generated by the electronic component. The coldplate includes a second portion oriented along the perimeter of the first portion and forming a conduit, the conduit having a chamber extending from the perimeter of the first portion and between two of the plurality of film capacitors of the DC link capacitor. The conduit has an inlet and an outlet to facilitate circulation of a coolant through the chamber of the conduit for dissipating heat generated by the DC link capacitor.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: March 3, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Slobodan Pavlovic, Dilip Daftuar, Juan Lopez
  • Patent number: 8971038
    Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 3, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Dilip Daftuar, George Kaminski, Venkat Yalamanchili, Richard J. Hampo
  • Patent number: 8964373
    Abstract: A system for cooling portable facilities which include heat generating electronics, interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans pull external air over the outer heat pipe assembly. A first transducer monitors inner air temperature within the portable building, a second transducer monitors the outer heat pipe assembly, and a third transducer is secured proximate to a fin side of the heat sink. A controller is connected to the transducers, fans, and power supply. Computer instructions monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: February 24, 2015
    Inventor: Paul F. Rembach
  • Patent number: 8958208
    Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Shogo Mori, Shinobu Tamura, Shinobu Yamauchi, Taizo Kuribayashi
  • Patent number: 8953321
    Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 10, 2015
    Inventors: Eric A. Knopf, David P. Tarkinton, Matthew D. Rohrbach
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons