Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

Abstract: A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold insert, a plurality of heat sinks, and a plurality of longitudinal openings configured for fluidic communication with the fluid channels. The manifold body has fluid channels to permit flow of a fluid coolant. The manifold insert has a plurality of manifold insert fluid channels, and is configured for receipt in the one of the modular body recesses. The heat sinks are configured for receipt in the modular body recesses, and include an impingement surface configured for fluidic communication with the manifold insert fluid channels, and a heat transfer surface for thermal communication with one or more heat generating devices.

Abstract: A rotating electric machine unit including a connector holding six connecting terminals is provided. When viewed from an axial direction, respective one-end parts of first to third connecting terminals are arranged side by side in a row. When viewed from the axial direction, respective one-end parts of fourth and fifth connecting terminals are arranged to offset to a back side of a first row composed of the first to third connecting terminals, and the one-end parts protrude further inside a casing than the one-end parts of the connecting terminals of the first row. When viewed from the axial direction, a one-end part of a sixth connecting terminal is arranged to offset to a back side of a second row composed of the fourth and fifth connecting terminals, and the one-end part protrudes further inside the casing than the one-end parts of the connecting terminals of the second row.

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

Abstract: Embodiments disclosed herein describe manifold microchannel heat sinks having a gridded microchannel assembly with free-form fin geometries for cooling heat-generating devices in the electronics modules. In an embodiment, a manifold microchannel heat sink includes a target surface and a gridded microchannel assembly comprising a plurality of microchannel cells. Each microchannel cell is surrounded by thermally-conductive sidewalls and includes a fluid inlet, a microchannel structure fluidly coupled to the fluid inlet and a fluid outlet. The microchannel structure extends from the target surface and defines a microchannel extending in a normal direction with respect to the target surface. The microchannel structure includes a base plate disposed on the target surface and a three-dimensional fin structure disposed on the base plate. The three-dimensional fin structure has a shape optimized for thermal performance and fluid performance.

Abstract: A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.

Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An electronic device and a heat-dissipation device for an electronic device are provided. The heat-dissipation device comprises an airflow channel; an airflow source located in the airflow channel; a plurality of elongated heat-dissipation fins arranged in the airflow channel; and a plurality of heat-dissipation flow-guiding devices arranged in the airflow channel and between the airflow source and the plurality of elongated heat-dissipation fins, wherein the plurality of heat-dissipation flow-guiding devices include a first heat-dissipation flow-guiding device in a central position of the airflow channel and a second heat-dissipation flow-guiding device on two sides of the airflow channel, and a longitudinal distance between the first heat-dissipation flow-guiding device and the airflow source is less than the distance between the second heat-dissipation flow-guiding device and the airflow source.

Abstract: The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.

Abstract: An electric power conversion apparatus includes: a heat-generating element; a case having a cooling wall portion on which the heat-generating element is held and accommodating the heat-generating element; a flow passage cover having an opening formed therein and covering a surface of the cooling wall portion on the opposite side to the heat-generating element; a standing portion standing from the cooling wall portion and inserted in the opening; a flow-passage side wall portion formed in one of the cooling wall portion and the flow passage cover to protrude toward the other; a coolant flow passage surrounded by the cooling wall portion, the flow passage cover and the flow-passage side wall portion; and a sealant that seals both a gap between the cooling wall portion and the flow passage cover at a periphery of the coolant flow passage and a gap between the standing portion and the flow passage cover.

Abstract: A heat exchanger for regulating the temperature of objects using coolant includes a top plate, a middle plate, and a bottom plate that are sealedly engaged for circulation of coolant, and collectively form a stacked cooling block. The heat exchanger includes a plurality of coolant flow channels, including sets of feed and return channels, which are formed between the top, middle, and bottom plates, and which operably cool one or more cooling surfaces of the heat exchanger. An inlet manifold of the heat exchanger distributes coolant through a plurality of distribution apertures, into a set of coolant feed channels. The coolant feed channels are fluidly connected with a set of coolant return channels, which in turn direct coolant toward and into an outlet manifold. The inlet manifold is adapted to substantially evenly distribute fluid through the plurality of coolant flow channels, by way of one or more flow-balancing elements integrated therewith.

Abstract: A connection module includes bus bars connecting positive and negative electrode terminals of adjacent power storage elements, a first sheet member that is expandable, and second sheet members fixing each of the bus bars independently. Each of the bus bars includes a fitting portion extending from one edge of the plate member with respect to a width direction (an arrow Y-direction) and fitting in a fixing portion of each second sheet member. The first sheet member holds each second sheet member to which each of the bus bars is fixed, and the first sheet member is expandable at sections between adjacent second sheet members in a longitudinal direction of the first sheet member in a distance of a maximum value of tolerance ?L max that is a total value of tolerances of an electrode pitch with respect to an arrangement direction in which the adjacent power storage elements are arranged.

Abstract: A battery connection module is adapted to connect a battery pack, the battery connection module comprises: a carrying tray; a plurality of busbars mounted on the carrying tray and adapted to electrically connect a plurality of batteries of the battery pack; a flexible circuit board mounted on the carrying tray and mechanically and electrically connected to the plurality of busbars, the flexible circuit board having a frame-shaped portion with an opening, a flexible mating portion being provided in the opening of the frame-shaped portion; and a battery management system mounted on the carrying tray, positioned above the flexible circuit board and comprising a flexible circuit board connector; the flexible mating portion extending into the opening and being reversely bent and mated with the flexible circuit board connector on the battery management system. These components are integrated to an integrated module that facilitates subsequent assembling and use.

Abstract: A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element constituting a power converter circuit. A smoothing capacitor is configured to smooth a direct-current voltage applied to the semiconductor module. A pair of positive and negative busbars is configured to electrically connect the semiconductor module and the smoothing capacitor. The positive and negative busbars are arranged to face each other with a predetermined space therebetween. A discharge resistor is connected in parallel with the smoothing capacitor via the positive and negative busbars, and is configured such that an electrical charge stored in the smoothing capacitor flows through the discharge resistor as a discharge current. The positive and negative busbars are interposed between the discharge resistor and the smoothing capacitor.

Abstract: The invention relates to an electronic device having a multi-part printed circuit board, the printed circuit board parts of which are connected to one another by current-carrying, flexible regions, having a support, around which the printed circuit board bent around the flexible regions of the printed circuit board is arranged and fixed, and having a housing in which the printed circuit board mounted on the support is fixed.

Abstract: A multi-stage power module is provided. The multi-stage power module may include at least one heat sink having a first surface, a second surface and an edge, a first set of switches disposed on the first surface of the heat sink, a second set of switches disposed on the second surface of the heat sink, a plurality of capacitors disposed adjacent to the edge of the heat sink, and a bus bar assembly symmetrically coupling the capacitors to each of the first set of switches and the second set of switches.

Abstract: A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate.

Abstract: A mounting assembly for accurately positioning, attaching, and supporting a circuit board such as a midplane board within a chassis. The assembly's design facilitates an improved assembly method that includes fastening the board to the chassis so to provide reliable connector mate and rapid assembly. The mounting assembly includes a clamp member) and a spring assembly that act in combination to secure a circuit board onto datum features provided on a chassis and/or its modified and/or lightweight alignment bulkhead, which is part of the new assembly. The new assembly design enables a tight tolerance loop between mating components while also providing a more consistent connector engagement when compared with many prior device designs. In some embodiments, a single fastener (e.g., a nut) is used to attach the clamped and captured circuit board to the chassis. The board is “captured” as it is sandwiched between the modified bulkhead and the clamp.

Abstract: The present disclosure includes various assemblies to be used with one or more energy storage devices. In one embodiment, an energy storage device assembly can include a plurality of energy storage devices, and each of these energy storage devices can include a first projecting electrode and a second projecting electrode. The energy storage devices can be connected to each other through a weld, which can directly bond the adjacent first and second projecting electrodes of adjacent energy storage devices to one another. This configuration can allow each of the energy storage devices to be connected together in series.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A group of electric wires of a first wire harness assigned to a first divided region is identified for each pattern as a necessary electric wire having a connection counterpart in a second divided region adjacent to the first divided region among the divided regions and an extra electric wire not having a connection counterpart in the second divided region. It is determined, out of connectors connected to a group of the electric wires of the first wire harness, that a connector is an unmated connector when all electric wires connected to the connector are the extra electric wires.

Abstract: An electrical storage module in which a plurality of electricity storage elements are electrically connected by conductive member, includes: a voltage detection board having voltage detection conductor that detects terminal voltage of the electricity storage element; a first external threaded component that connects the voltage detection conductor of the voltage detection board to the conductive member; and a cover that covers the voltage detection board; wherein: the cover is made from an insulating material; the conductive member has a first internal threaded portion into which the first external threaded component is to be screwingly engaged; and the distance between the inside surface of the cover that faces a head portion of the first external threaded component and an upper surface of the head portion of the first external threaded component is shorter than the distance between an end portion of the first internal threaded portion towards the cover side and an end of shaft portion of the first external

Abstract: A direct-current capacitor module is disclosed in this disclosure. The direct-current capacitor module includes a plurality of direct-current capacitors and a laminated busbar structure. The direct-current capacitors are grouped into a first portion and a second portion. The laminated busbar structure is electrically connected to capacitor binding posts of the direct-current capacitors. The laminated busbar structure has a positive terminal and a negative terminal. The laminated busbar structure includes a first busbar layer, a second busbar layer and an insulation layer. The first busbar layer includes a first sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the first portion. The second busbar layer includes a second sub-busbar layer, which is electrically connected between at least two direct-current capacitors of the second portion. The insulation layer is disposed between the first busbar layer and the second busbar layer.

Abstract: Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal, a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.

Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Abstract: A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.

Abstract: An electrical connector that includes a terminal adapted to mate with another terminal and at least one heat dissipating element that has opposing ends and an opening therebetween. At least one of the ends includes at least one printed circuit board engagement member configured to engage a printed circuit board for electrical current transfer. The opening receives the terminal such that heat dissipating element substantially surrounds and contacts the terminal.

Abstract: A data center inside a shipping container having computing equipment and associated devices located in its interior. The data center includes computing equipment, an internal network, an external network, power supplies, a lighting system, and a controller. The power supplies and the lighting system connect to the controller, which in turn connects to the internal network. The computing equipment connects to the power supplies. A remote computing device connected to the external network communicates with the controller through the internal network. The remote computing device receives information from the controller and instructs the controller to selectively energize and de-energize the power supplies and the lighting system. The controller may have a user interface configured to display data associated with the computing equipment and other devices and systems located within the container.

Abstract: A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 20 comprises: a first pin electronics card 21; a second pin electronics card 22; and a single intermediate water jacket 23 which is sandwiched between the first pin electronics card 21 and second pin electronics card 22. The intermediate water jacket 23 is in close contact with the first inside main surface 212 of the first pin electronics card 21 which faces the second pin electronics card 22 and is in close contact with the second inside main surface 222 of the second pin electronics card 22 which faces the first pin electronics card 21.

Abstract: A data center container includes a chassis, a cooling system, a draining mechanism, and a latching member. The chassis includes a front plate with a securing hole. The cooling system includes a water tray and a drainer tray. The water tray communicates with the drainer tray. The draining mechanism communicates with the drainer tray and extends out of the chassis. The latching member is attached to the draining mechanism. The latching member includes an inserting post, and the inserting post being engaged in the securing hole, to position the draining mechanism to the front plate.

Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.

Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.

Abstract: A cooling system is operable to facilitate cooling a power module or other electronic assembly. The cooling system may be configured to facilitate cooling a DC/AC inverter or other electronic assembly where two power modules may be arranged in an opposing relationship relative to a coolant passageway. The opposing relationship may be suitable to minimizing a packaging size and footprint required to facilitate interacting both power modules with the coolant flow.

Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.

Abstract: An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity, such as polyetheretherketone. A reflective surface may be disposed on a housing containing the substrate to reduce the absorption of radiation. A heat sink and fluid inlet and outlet may also be arranged to remove heat generated by the electrical components.

Abstract: A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.

Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Abstract: A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors configured in a stack. The coldplate includes a first portion configured for attachment to at least one electronic component, the first portion having a perimeter and for dissipating heat generated by the electronic component. The coldplate includes a second portion oriented along the perimeter of the first portion and forming a conduit, the conduit having a chamber extending from the perimeter of the first portion and between two of the plurality of film capacitors of the DC link capacitor. The conduit has an inlet and an outlet to facilitate circulation of a coolant through the chamber of the conduit for dissipating heat generated by the DC link capacitor.

Abstract: A system for cooling portable facilities which include heat generating electronics, interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans pull external air over the outer heat pipe assembly. A first transducer monitors inner air temperature within the portable building, a second transducer monitors the outer heat pipe assembly, and a third transducer is secured proximate to a fin side of the heat sink. A controller is connected to the transducers, fans, and power supply. Computer instructions monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.