Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Abstract: A radio frequency identification tag is made with printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent the antenna coil for carrying circuit elements. The radio frequency identification tag is designed to be sufficiently robust to withstand the rigors of mail efficiency processing measurement applications.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A multi-layered printed circuit board (PCB) for use in items of portable electronic equipment which use a housing having a convex-concave part and/or a bent part, includes a PCB section having a uniformly thick PCB, and a resin board formed over the PCB in a part matching the internal space of the housing. By installing the multi-layered PCB having such a configuration within the housing, the internal space of the housing can be efficiently utilized.

Abstract: To inhibit the migration of conductive layers in a multilayer chip carrier, e.g., a multilayer printed circuit board, an optically cured layer 13, which is an anti-migration layer, is formed in an insulating layer 12 located between a first conductive layer 8 and a second conductive layer 6. Such a structure is formed by thinning, e.g., grinding down, a first insulating layer, leaving about half the thickness of the first insulating layer. This first insulating layer is selectively optically irradiated with actinic radiation to form an optically cured layer. Via holes are etched into the non-irradiated portions of the first insulating layer. Thereafter, a second insulating layer is formed on the first insulating layer, and it too is selectively optically irradiated with actinic radiation. Via holes are etched into the non-irradiated portions of the second insulating layer, directly over the via holes in the first insulating layer, and the second insulating layer is also thinned.

Abstract: Described is a printed wiring board comprising a composite of an electrically conductive core laminated with layers of dielectric material and electrically conductive material.

Abstract: For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive manner with a contact surface on the circuit board that surrounds the components.

Abstract: A case houses a portable telephone apparatus having a display portion, an operating portion, a speaker portion and a microphone portion provided with respect to two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, and the main portion is formed of a hard resin and integral with the hinge portion. A wiring member for provide an electric connection between the main portions extend through the hinge portion.

Abstract: An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) comprises a case body (13) and a flat plate-shaped lid (17) positioned properly with respect to the case body (13) to seal the interior space. A vent hole (20) is formed in the bottom wall of the case body (13) for communicating the interior of the case body (13) with ambient atmosphere. A cover member is attached to the case body (13) to cover the vent hole hermetically. By using a cover member, the interior space of the case body (13) is sealed for protecting electronic components (12) on the electronic circuit board (11) from moisture and rainwater and, for absorbing a pressure fluctuation therein. A mounting flange extends from the case body and surrounds the vent hole. The cover member is a flexible diaphragm with a circumferential bulge.

Abstract: A case for housing an electronic apparatus has two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, and the main portion is formed of a hard resin and integral with the hinge portion. A wiring member for provide an electric connection between the main portions extend through the hinge portion. The wiring member passes at a center of rotation on which the hinge portion is turned.

Abstract: The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond substrate, and loose or lost via elements, are minimized. A form of the disclosure is directed to a method for producing a circuit board having a multiplicity of conductive vias. A generally planar diamond substrate is provided. A multiplicity of via holes are formed through the substrate. The holes are loaded with a conductive reactive braze material. The braze material and the substrate are heated to a temperature which causes the braze material to melt and to react with the inner surface of the via holes and bond thereto.

Abstract: Low temperature, co-fired ceramic (LTCC) modules (10, 80, 82, 110, 102, 140, 160) are interconnected to one another, stacked and automatically connected to other modules by rigid LTCC interconnecting modules (104), or provided with covers or hermetically sealed covers (130, 166) that automatically register and make electrical or mechanical connections between the cover and the protected module. The various types of connections are achieved by forming in the LTCC modules, during the lamination process, patterns of frictionally interfitting bumps (60, 62, 66, 84a, 84b, 84c) on one side and depressions (70, 72, 76, 81a, 81b, 81c) on the other, whereby a pattern of bumps on one side of one module will connect both mechanically and electrically to a mating pattern of depressions on the other module to stack and automatically lock vertical packages of LTCC modules.

Abstract: A removable self-contained rigid disk drive has a head and disk assembly (HDA) and controller enclosed by a top and bottom cover. The industry standard form factor drive is externally dimensioned to be removably installable in a disk bay of the same form factor. HDA components are mounted on one side a composite plastic-steel base, and the controller is attached to the other side. The controller is proved with an industry standard electrical interface for connecting the drive with a host computer system with a complementary electrical interface. The covers of the drive are made of metal to reduce electromagnetic interference when the drive is in operation.