Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Abstract: A node-interlocked server, comprising a chassis and node modules, wherein a linking and interlocking rod is slidably mounted to the chassis; stopping and blocking slots and guiding bevel edges are respectively provided on two sides of the respective node modules; in response to that one of the node modules is being drawn outwardly, the corresponding guiding bevel edge pushes the linking and interlocking rod to move toward another one of the node modules, and the linking and interlocking rod is able to be inserted into the corresponding stopping and blocking slot to block the another one of the node modules from being drawn out; and a reset device is provided at the linking and interlocking rod, and in response to that the linking and interlocking rod is not subjected an acting force applied by the node modules, the linking and interlocking rod is restored to an initial position.

Abstract: The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.

Abstract: A display device includes: a display module including a first substantially flat portion, a first curved portion bent from one portion of the first substantially flat portion, and a second substantially flat portion facing the first substantially flat portion in a thickness direction of the first substantially flat portion; and a cover member including a support to support the display module, the support including a first part disposed under the first substantially flat portion, a second part disposed under the second substantially flat portion, and a third part disposed under the first curved portion. The third part of the support has at least one discontinuity.

Abstract: An information handling system may include a processor, a memory device, a video display device, and a PMU. The information handling system further includes a venturi nozzle cooling system exhaust vent including a base chassis including a top cover to form a first portion upper part of a venturi nozzle and a bottom cover to form a second portion lower part of the venturi nozzle at an exhaust vent at a rear wall of the base chassis and an airflow producing device, operatively coupled to the PMU and processor, to pass air from within the base chassis and through the venturi nozzle at the exhaust vent formed by the c-cover and d-cover to accelerate airflow away from the video display device.

Abstract: A battery module includes a battery module housing and a battery cell package, which has a plurality of battery cells and is arranged in the battery module housing. The battery cell package is supported on an inner face of the battery module housing at least by way of an outer face. A battery cell monitoring unit is connected to the battery cells via a signal line. A protective plate is arranged on the outer face of the battery cell package that is supported on the inner face of the battery module housing. A recess is provided on the side of the protective plate facing toward or facing away from the battery cell package, in which recess at least one portion of the signal line is arranged.

Abstract: Provided are an electronic apparatus and a substrate capable of reducing the size and the cost thereof regardless of whether or not a shielding function is needed. An electronic apparatus includes a substrate including a first substrate portion and a second substrate portion arranged in a position opposite the first substrate portion, and a capacitor component arranged between the first substrate portion and the second substrate portion and attached to at least one of the first substrate portion and the second substrate portion. The capacitor component includes a dielectric, a first electrode located on one side of the dielectric, and a second electrode located through the dielectric on a side opposite to the first electrode. The first substrate portion and the second substrate portion are electrically connected to each other through the first electrode.

Abstract: A method for manufacturing a display device including providing a protection resin having a base resin, a first initiator, and a second initiator to the non-display area, irradiating light having a first wavelength region to the protection resin to form a preliminary protection layer, bending the flexible substrate so that the bending part has a first curvature radius, and additionally curing the preliminary protection layer to form a protection layer.

Abstract: A display device includes a plurality of islands and a bridge connecting the plurality of islands to each other. Each of the plurality of islands includes a flexible substrate, a thin film transistor positioned on a first surface of the flexible substrate, a first electrode connected to the thin film transistor, and a protective mask positioned on a second surface of the flexible substrate.

Abstract: Systems and methods for facilitating temperature regulation of an electronic module. The methods comprise: coupling first heat exchanger modules of a plurality of heat exchanger modules together to form a first set of heat exchanger modules and second heat exchanger modules of the plurality of heat exchanger modules together to form a second set of heat exchanger modules; using frame members to structurally support and maintain the first and second sets of heat exchanger modules in a spaced apart arrangement; and providing at least one slot between corresponding spaced apart modules of the first and second heat exchanger modules, the at least one slot being sized and shaped to receive the electronic module to facilitate the temperature regulation via the plurality of heat exchanger modules.

Abstract: Systems and methods of providing a three-dimensional electronic module having high component density are disclosed. In some cases, the module has improved heat dissipation, reduced weight and size, and increased protection against electromagnetic radiation. In some cases, the module includes a printed circuit board configured to be folded into a convex polyhedron, with the polyhedron's faces formed by sections of the printed circuit board. In some cases, the electronic components face the interior of the circuit board and fall into gaps between the components installed on the other sections.

Abstract: A semiconductor package having an internal heat distribution layer and methods of forming the semiconductor package are provided. The semiconductor package can include a first semiconductor device, a second semiconductor device, and an external heat distribution layer. The first semiconductor device can comprise a first semiconductor die and an external surface comprising a top surface, a bottom surface, and a side surface joining the bottom surface to the tope surface. The second semiconductor device can comprise a second semiconductor die and can be stacked on the top surface of the first semiconductor device. The external heat distribution layer can cover an external surface of the second semiconductor device and the side surface of the first semiconductor device. The external heat distribution layer further contacts an internal heat distribution layer on a top surface of the first semiconductor die.

Abstract: An electronic apparatus includes a body including a containing cavity, a separation component arranged at the containing cavity to divide the containing cavity into a first cavity and a second cavity, a heat generation assembly arranged at the first cavity, and an air guide component arrange at the second cavity to drive airflow at the second cavity to dissipate the heat of the heat generation assembly through the separation component, wherein the second cavity is configured as an air duct of the electronic apparatus.

Abstract: An electronic control device for suppressing mixing of foreign substances includes a control board including a heat generation component, a housing, a support member that is provided in the housing and supports the board, a heat radiation fin on a surface opposite to a surface of the support member on which the control board is supported, an air cooling fan that intersects an extension direction of the heat radiation fin, and blows wind to the heat radiation fin, a wall portion between the control board and the air cooling fan, and extending from the support member toward the control board, a wiring passage at a top end of the wall portion, a wiring that is laid in the wiring passage, and electrically connects the air cooling fan and the control board, and a cover that covers the housing, and includes a protrusion fitted in the wiring passage.

Abstract: An assembly of an electronic device includes: an electronics housing for accommodating an electronic component; a base strip attachable to the electronics housing and having a plurality of plug receptacles to which plug modules are attachable; and a locking apparatus for locking the plug modules to the plug receptacles of the base strip. The locking apparatus has an actuating part movable in an actuating direction toward the electronics housing in order to remove the plug modules from the base strip. A spring element is arranged on the electronics housing for preloading the actuating part in relation to the electronics housing counter to the actuating direction.

Abstract: An energy module storage module cap includes a plate. It further includes a power output terminal about which the plate is molded. It further includes an auxiliary pin about which the plate is molded. It further includes a gasket disposed on the plate.

Abstract: An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.

Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.

Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: An electronic device includes a substrate having contact pads disposed thereon and traces interconnecting the contact pads. A first integrated circuit (IC) die is mounted on the substrate and includes a predefined set of circuit components arranged on the first IC die in a first geometrical pattern, which is non-symmetrical under reflection about a given axis in a plane of the die. A second IC die is mounted on the substrate and includes the predefined set of circuit components arranged on the second IC die in a second geometrical pattern, which is a mirror image of the first geometrical pattern with respect to the given axis.

Abstract: Two conductive reference layers are embedded in a semiconductor package substrate. The embedded reference layers facilitate low electromagnetic noise coupling between adjacent signals for semiconductor device package.

Abstract: An apparatus includes a substrate, a switching device, a capacitor device, a first via, a second via, a third via and a fourth via. The substrate has a first surface and a second surface and includes a plurality of copper layers including M positive copper layers and N negative copper layers. The M positive copper layers and the N negative copper layers are alternated. The switching device is disposed on the first surface and includes a switching positive terminal and a switching negative terminal. The capacitor device is disposed on the first surface and includes a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor area. The projections of the adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap with each other.

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: In an embodiment, a device includes: a first die array including first integrated circuit dies, orientations of the first integrated circuit dies alternating along rows and columns of the first die array; a first dielectric layer surrounding the first integrated circuit dies, surfaces of the first dielectric layer and the first integrated circuit dies being planar; a second die array including second integrated circuit dies on the first dielectric layer and the first integrated circuit dies, orientations of the second integrated circuit dies alternating along rows and columns of the second die array, front sides of the second integrated circuit dies being bonded to front sides of the first integrated circuit dies by metal-to-metal bonds and by dielectric-to-dielectric bonds; and a second dielectric layer surrounding the second integrated circuit dies, surfaces of the second dielectric layer and the second integrated circuit dies being planar.

Abstract: This disclosure provides a field termination assembly (FTA) providing for ease of mounting to a support rail. The FTA provides a lever on a base that cushions against shocks and vibrations during shipment and operation while a housing is mounted on a base secured to a support rail. The base includes a dampener feature which makes it more capable of meeting operation and transportation vibration and shock requirements even for marine applications while still providing high channel density and cable count.

Abstract: A display apparatus may include a base substrate including a first portion and a second portion smaller than the first portion, a plurality of pixels disposed on the first portion, a protection substrate disposed below the base substrate, and a groove disposed in a portion of the protection substrate and overlapped with the second portion. The groove may include a first region extending in a first direction, and a second region and a third region, which are arranged along the first direction, wherein the first region is interposed between the second region and the third region. The first and second portions may be arranged in a second direction crossing the first direction, and a width of each of the second and third regions may be larger than a first width of the first region, when measured in the second direction.

Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.

Abstract: A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

Abstract: A wearable display device includes a device body, a heat dissipation processing module, and an inflation actuation module. The device body includes a front cover, a side cover, a fillable gas bag, a circuit board, and a microprocessor. The heat dissipation processing module includes a first actuator corresponding to the microprocessor for performing heat exchange for the microprocessor. The inflation actuation module includes a base member, a gas communication channel, a second actuator, and a valve component. When the second actuator and the valve component are driven, the valve component is opened to control gas introduction of the second actuator, and the second actuator is actuated to transmit the gas to the gas communication channel for gas collection, and the second actuator further transmits the gas to the fillable gas bag for inflating the fillable gas bag, so as to allow a user to wear the wearable display device stably.

Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.

Abstract: A display device including a display panel having a display area and a non-display area, the non-display area being disposed at a peripheral portion of the display area and having a bending area; an integrated circuit (IC) disposed in the non-display area to drive the display panel; a first layer formed between the display area and the IC and covering the bending area; and a first member covering the IC and the first layer and overlapping with the bending area.

Abstract: A flexible circuit (FC) comprises a primary dielectric layer having a plurality of substantially parallel conductive circuit traces disposed therein and a secondary dielectric layer extending from or attached to the primary dielectric layer, wherein the secondary dielectric layer does not have any conductive circuit traces disposed therein, and wherein at least one of the primary and secondary dielectric layers defines an alignment feature for wrapping and securing the FC about a central structure. A method of wrapping and securing the FC about a central stricture comprises wrapping the FC about the central structure while aligning each alignment feature with a respective complimentary alignment feature such that the FC fully encompasses the central structure and is secured thereabout.

Abstract: An electronic device according to an embodiment of the disclosure may include a housing including a front plate, a back plate disposed to the opposite side of the front plate, and a side member surrounding a space between the front plate and the back plate, wherein at least a part of the back plate is constructed of a conductive material, and the side member includes an opening, a touch screen display disposed between the front plate and the back plate, a female connector disposed inside the opening, constructed to house a meal connector an external male connector, and including a plurality of pins, a Printed Circuit Board (PCB) disposed inside the space and including a ground plane, a circuit electrically coupled to the ground plane and/or mounted thereon to cut off leak current from the PCB, a first conductive path constructed between the circuit and a first point of at least part of the back plate, and a second conductive path constructed between at least one of the pins and a second point of at least part

Abstract: Disclosed is an electronic apparatus including a printed board, a plurality of connectors mounted on the printed board, a plurality of communication control circuits that is mounted on the printed board and that controls communication through corresponding ones of the plurality of connectors, and a shield member disposed to face the printed board, in which an annular ground pattern surrounding, without interruption, a shield area including the plurality of communication control circuits is formed on a front surface of the printed board, the plurality of connectors is all disposed outside the ground pattern surrounding the shield area, and the shield member covers the shield area and is fixed to the printed board such that a portion facing the ground pattern is electrically connected to the ground pattern.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.

Abstract: A system and method are directed to a fan board sled assembly comprising a fan circuit board including a first end and an opposing second end, a fan cage module including a front section for receiving and removably securing the first end of the fan circuit board to the fan cage module, and a guide bracket including a base section for receiving and removably securing the second end of the fan circuit board to the guide bracket. The fan cage module further includes a back section for receiving one or more fan bodies. The combined fan circuit board, fan cage module and guide bracket are a single integrated unit insertable and extractable from a chassis opening of a computer chassis.

Abstract: A higher-current device is implemented by increasing cross-sectional areas of terminals while securing solderability during mounting. The device makes securing of a creepage distance between terminals compatible with a reduction in package size. A semiconductor device 1 is provided with a package 2, a semiconductor circuit 3, a control circuit 6, a plurality of main terminals 7 and control terminals 8. Each main terminal 7 is configured of a plurality of subterminals S1, S2 and S3 arranged at mutually neighboring positions and projecting from the package 2. Distal end portions of the subterminals S1, S2 and S3 making up the same main terminal 7 are bent toward a mounting surface on which the semiconductor device 1 is mounted and the bending positions of the subterminals S1, S2 and S3 are configured to differ between the mutually neighboring subterminals S1 and S2, and subterminals S2 and S3.

Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

Abstract: An electrical connection assembly includes a circuit board and a connector mounted on the circuit board. The connector has a housing and a contact received in the housing. The contact has an elastic arm extending out from a surface of the housing and a connection pin extending out from a side face of the housing. The elastic arm electrically contacts an electrical contact pad on a moving bracket and the connection pin electrically contacts the circuit board.

Abstract: A flexible display device and an electronic device including the same are disclosed. The flexible display device includes a magnetic body group, which is adhered to a lower plate provided under a display panel by the force of magnetic attraction. Therefore, the flexible display device has improved reliability in spite of frequent folding and unfolding operations and is capable of facilitating a rework process.

Abstract: A power converter module includes a multilayer printed circuit board, a switching device, a capacitor device, a first via, a second via, a third via and a fourth via. The multilayer printed circuit board has a first surface and a second surface and includes a plurality of copper layers including a plurality of positive copper layers and negative copper layers. The plurality of positive copper layers and the negative copper layers are disposed in staggered arrangement. The switching device is disposed on the first surface and includes a switching positive terminal and a switching negative terminal. The capacitor device is disposed on the first surface and includes a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor area. The projections of the adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap with each other.

Abstract: Embodiments of the present disclosure relate to a method for manufacturing a display panel. The method includes providing a hardness-variable material layer and a flexible layer on the hardness-variable material layer, and bonding a chip to the flexible layer. The hardness-variable material layer is set to be in a hard state before bonding the chip to the flexible layer. After bonding the chip to the flexible layer, the hardness-variable material layer is peeled off. The hardness-variable material layer is set to be in a flexible state before peeling off the hardness-variable material layer.

Abstract: A system and method for communicating messages over a communication channel is disclosed wherein a user content that would ultimately make a user message is generated by a first user at a first application or widget and sent to a chat server for subsequent sending to a second user for viewing via the second user's application or widget. The refresh frequency of the user content between the first user and the server is at every up to 500 milliseconds while the send rate between the server and the second widget is at or after at least 500 milliseconds. Accordingly, the second user is able to preview the first user's message before the first user's message is ultimately written and manually sent to the second user by the first user. The second user is here able to preview the user content at up to 500 millisecond refresh rates, thereby giving the second user a real-time preview into what is being generated by the first user.

Abstract: A communication module includes: a substrate; a supplementary substrate disposed to surround an electronic element mounted on a lower surface of the substrate; a molding material configured to seal an electronic element mounted on an upper surface of the substrate; and a shielding layer disposed on a side surface and an upper surface of the molding material, a side surface of the supplementary substrate, and a side surface of the substrate. The supplementary substrate includes: a plurality of first pads disposed on an upper surface of the supplementary substrate; a plurality of second pads disposed on a lower surface of the supplementary substrate; a plurality of vias connecting the plurality first pads to the plurality of second pads; and a ground pad disposed on the side surface of the supplementary substrate. The ground pad includes an extender connected to a corresponding first pad and a corresponding second pad.

Abstract: A connection apparatus includes: a housing case, where the housing case includes a first side face and a second side face that are intersected and disposed adjacent to each other; a first connector, disposed on the first side face and configured to be connected to a connector of a first line card, so that the connection apparatus is orthogonally connected to the first line card; and a second connector, disposed on the second side face and connected to the first connector. The second connector is configured to be connected to a connector of a network board. The connection apparatus can improve a capacity of the communications device.

Abstract: Power electronic module comprising a plurality of semiconductor power electronic components electrically connected to an electrical support, and a cooling device in thermal contact with each component, each component being present between the electrical support and the cooling device and being mounted on the electrical support via at least one electrically conductive spring element.

Abstract: A power supply device includes a housing having a socket opening, and a pair of sliding grooves are formed on the socket opening. A guiding piece is formed at a bottom of each sliding groove, and the guiding piece includes a positioning section and a guiding section. A power socket passes through the sliding grooves along the guiding section, and one side of the power socket is abutted against the positioning section so as to contact the socket opening. A cover plate is provided with a pair of clips corresponding to the sliding grooves, and the clips are inserted into the pair of sliding grooves and abutted against a side of the power socket for positioning the power socket.

Abstract: A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

Abstract: The application discloses an electronic device including a motherboard and a housing structure. The motherboard has a first surface and a second surface. The housing structure includes a first casing, a first cushion, a second casing, and a second cushion. The first casing has at least one first fixing member. The first cushion covers the first surface, is accommodated in the first casing and has at least one first through hole. The second casing has at least one second fixing member. The second cushion covers the second surface, is accommodated in the second casing and has at least one second through hole. A peripheral edge of the first cushion is attached to a peripheral edge of the second cushion, and the first fixing member may be fixed to the second fixing member through the first through hole and the second through hole.