With Printed Circuit Boards Patents (Class 361/736)
  • Patent number: 10368465
    Abstract: An electrical unit includes a thermally conductive housing, an electrically insulating frame disposed in the thermally conductive housing, a plurality of bus bars disposed at least partially between a base wall of the thermally conductive housing and a first side of the electrically insulating frame, and a plurality of electrical components connected to a second side of the electrically insulating frame. At least one bus bar of the plurality of bus bars may be connected to the electrically insulating frame via one or more plastic rivets. Thermally conductive material may be disposed between at least one bus bar of the plurality of bus bars and a wall of the housing.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: July 30, 2019
    Assignee: Lear Corporation
    Inventors: Alberto Aragones Carrete, Enric Aparicio Rollan, Jose Gabriel Fernández Bañares
  • Patent number: 10361142
    Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: July 23, 2019
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Don W. Nelson
  • Patent number: 10338753
    Abstract: A flexible multi-layer sensing surface comprises a first flexible layer and a second flexible layer. The first flexible layer is a sensing layer and the second sensing layer is another sensing layer or an output layer. The sensing surface also comprises a calibration module which is configured to use the first flexible sensing layer to detect the relative position of the first and second flexible layers and this detected relative position is then used to update one or more stored operating parameters.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: July 2, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Greg Saul, Daniel Cletheroe, Nicolas Villar, Haiyan Zhang, Oscar Salandin, Christian Holz, Andrew Fitzgibbon, Stephen Edward Hodges
  • Patent number: 10225939
    Abstract: Depending on the orientation by which a breathing filter is mounted in a vehicle, water can accumulate in the breathing filter, and prevent the pressure difference between the space inside a case and the outside air from being adjusted; therefore, the vehicular layout is limited. Also, because the filter is formed in the center of the case, electronic parts cannot be installed on substrates on the upper and lower surfaces of the filter, meaning that the substrate size and the case size will increase. In addition, the costs will increase. The structure of the present invention is characterized in that breathing paths are provided on the surfaces sandwiching a portion where a filter film is welded in the corner of a resin-side case of a vehicle-mounted electronic control device such as an engine control unit or an automatic transmission control unit, and in that the breathing paths are connected inside.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 5, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hitoshi Furudate, Kiyotaka Kanno, Yoshio Kawai, Yoshiyasu Negishi, Takayuki Fukuzawa
  • Patent number: 10214933
    Abstract: Exemplary embodiments are directed to pool cleaners that remove debris from water using a plurality of cyclonic flows, or that include a removable impeller subassembly, a check valve for a debris canister, a particle separator assembly having a handle that locks to the pool cleaner, a modular roller drive gear box, or a roller latch that secures a roller to the pool cleaner. Exemplary embodiments are also directed to the check valve and the roller latch themselves. Exemplary embodiments are directed to a filter medium for pool cleaners that includes embossments providing flow channels for water, and to roller assemblies for pool cleaners. Exemplary embodiments are directed to pool cleaners including alternative pump motor engagements. Exemplary embodiments are directed to pool cleaners power supplies that include a potted and contoured power board assembly, and to kickstands therefor. Exemplary embodiments are directed to a pool cleaner caddy, and removable wheels therefor.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: February 26, 2019
    Assignee: Hayward Industries, Inc.
    Inventors: Mark Peastrel, Omar Enrique Osuna, Scott Teuscher
  • Patent number: 10170395
    Abstract: A semiconductor device including a semiconductor module 10A, a semiconductor module 10B that has a lower switching voltage threshold than the semiconductor module 10A, and busbars 331 and 32 that connect the semiconductor module 10A and the semiconductor module 10B in parallel to a common terminal. The semiconductor module 10B is connected at a connection point on the busbar 32 at which the inductance relative to the common terminal is higher than that of the semiconductor module 10A. The semiconductor module 10B with the low threshold voltage is turned ON faster than the semiconductor module 10A with the high threshold voltage for input of a common switching voltage, but can restrict the rising of the current due to the high inductance of the busbar 32, thereby enabling restriction of the current imbalance.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: January 1, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hayato Nakano, Hideyo Nakamura
  • Patent number: 10141856
    Abstract: A magnetic device assembly is provided for maximizing the size of the magnetic components for a predetermined power converter module by co-locating and sharing input, output, and auxiliary terminals between the substrates for the power converter and the magnetic components. Wherein complete power module is the result of constructing the separate constituent parts which include an integrated magnetic substrate, magnetic elements mounted therein, a power converter substrate, associated incorporated components located top and bottom on the power converter substrate, a composite mechanical footprint as defined by the mechanical extents of the integrated magnetic substrate and power converter substrate, and a composite electrical pinout as defined by the input-output pins which are coincident to and co-located as those of the integrated magnetic and power converter substrates.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: November 27, 2018
    Inventors: Harold Eicher, James Lee
  • Patent number: 10136539
    Abstract: An electronic component having plural lead terminals protruding from side surfaces of a component main body is inserted and accommodated in a housing member, and the lead terminals are brought into contact with plural terminal fittings held in the housing member to assemble the electronic component into the housing member. Each of the lead terminals includes a base end protruding from at least one side surface of the component main body and a contact portion connected to the base end to droop along the side surface. The component main body is provided with an insulating member which is located to contact or face the base ends from a side of an end surface of the component main body which is most distant from a bottom wall of the housing member in assembling the electronic component into the housing member. Accordingly, it is possible to suppress deformation of the lead terminals.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: November 20, 2018
    Assignee: YAZAKI CORPORATION
    Inventor: Yukihiro Kawamura
  • Patent number: 10085654
    Abstract: A display assembly includes a liquid crystal display (LCD) frame, a printed circuit board (PCB), and a front housing. The LCD frame includes at least one LCD frame obround boss. The PCB includes at least one PCB obround slot, where the PCB obround slot is sized to be larger in length and diameter than the at least one LCD frame obround boss. The LCD frame is secured to a printed circuit assembly. The front housing includes a display opening and an elastomeric bezel positioned on the front housing, where the elastomeric bezel is configured to position a liquid crystal display within the display opening.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: October 2, 2018
    Assignee: WELCH ALLYN, INC.
    Inventor: Alan S. Knieriem
  • Patent number: 10071696
    Abstract: An embodiment of a camera module comprises: a lens part; a housing for coupling the lens part; a plurality of substrates which are disposed at an interval from each other inside the housing; and an electromagnetic field shielding part, disposed inside the housing, for preventing the occurrence of external leakage of electromagnetic field from each of the substrates, wherein the electromagnetic field shielding part may comprise a coupling means for coupling the plurality of substrates at an interval from each other in the optical axial direction of the lens part.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: September 11, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Seung Ryong Park
  • Patent number: 10058003
    Abstract: An electronic device storage apparatus with an enhanced self-locking mechanism in communication with a slidable cover is provided. The apparatus includes an electronic assembly having a connector coupled to a circuit board, an enclosure disposed around the circuit board such that the connector protrudes outside the enclosure, the enclosure having a pair of collapsible brackets mounted to the enclosure and designed to pivotably adjust to an open position away from the circuit board or a closed position against the circuit board, and a protective sheath slidably mounted to a portion of the enclosure and having an end opening. The collapsible brackets in the closed position slidably adjust relative to the protective sheath to a first locking position to extend the electronic assembly's connector through the end opening of the protective sheath for an exposure or a second locking position to retract the electronic assembly's connector within the protective sheath.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 21, 2018
    Inventor: Stan Yuming Wang
  • Patent number: 10044122
    Abstract: An electrical plug-type connector consisting of an electrically nonconductive material includes a plug housing with an inner wall and at least one plug-type contact. The inner wall delimits a first space. The at least one plug-type contact has a first end with which contact can be made by a mating plug-type contact, and a second end, which is opposite the first end. The second end is connected to a printed circuit board by solder. The plug housing is moved from the first end in a direction of the second end via the at least one plug-type contact in the axial direction into a predetermined position. In the predetermined position, the plug-type contact has a lack of force-fitting connection transversely to the axial direction. In the predetermined position, the printed circuit board is fixedly connected to the plug housing. In the predetermined position, the first end protrudes into the first space.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: August 7, 2018
    Assignee: Robert Bosch GmbH
    Inventor: Uwe Liskow
  • Patent number: 10021803
    Abstract: A power supply includes a metal case, a power conversion module and an insulation connecting plate. The power conversion module is arranged in the metal case and at interval with the metal case. The power conversion module includes a circuit board. The insulation connecting plate is respectively connected with the circuit board and the metal case. The insulation connecting plate is isolated between at least a portion of the circuit board and at least a portion of the metal case. A creepage distance between the metal case and a high voltage area of the circuit board are extended by the insulation connecting plate so as to fulfill the safety requirements.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 10, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Yu-Chi Jen
  • Patent number: 10001610
    Abstract: A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: June 19, 2018
    Assignee: OCLARO JAPAN, INC.
    Inventors: Kazuhiro Komatsu, Daisuke Noguchi
  • Patent number: 9958915
    Abstract: A slot assembly configured for being inserted by a workpiece. The slot assembly comprises a holder body, a substrate, a push member and a heat spreader. The substrate and the holder body together form an accommodating space therebetween. The push member is movable between a released position and a pressed position. The push member is configured for being moved from the released position to the pressed position by being pushed by the workpiece. The heat spreader is movably disposed on the substrate and located in the accommodating space. The heat spreader has a thermal contact surface facing away from the substrate. The thermal contact surface is configured for being in thermal contact with the workpiece. When the push member is located at the pressed position, the heat spreader is located at a thermal contact position where the thermal contact surface is in thermal contact with the workpiece.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: May 1, 2018
    Assignee: ELITEGROUP COMPUTER SYSTEMS CO., LTD.
    Inventors: Jiun-Kai Wu, Chi-Ming Chung, Yu-Tang Zeng
  • Patent number: 9958911
    Abstract: An Information Handling System (IHS) includes a chassis having a base panel, a selected modular cover, and a latching structure. The base panel has an upper chassis surface to receive selected compute components and infrastructure components that vary in height desired for the fully assembled IHS or rack in which the IHS will be inserted. The selected modular cover can have peripheral sides of a vertical height to complement a vertical height of the lateral guides of the base panel to create either a first height enclosure of a first height to house compute components of less than the first height or a second height enclosure of a second height to house compute components of less than the second height but greater than the first height. The latching structure is formed between the peripheral sides of the selected one of the first and second modular cover and the lateral guides of the base panel.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: May 1, 2018
    Assignee: Dell Products, L.P.
    Inventors: Daniel Alvarado, Edmond I. Bailey, Walter R. Carver
  • Patent number: 9915972
    Abstract: In accordance with embodiments of the present disclosure, a bezel configured to mechanically couple to a housing for housing components of an information handling system may include one or more mechanical features for mechanically coupling the bezel to the housing, an information handling resource mechanically coupled to a mechanical structure of the bezel, and a bezel connector having a plurality of pins communicatively coupled to the information handling resource. The bezel connector may be configured to communicatively couple the information handling resource to a second information handling resource of the information handling system housed within the housing when the bezel is mechanically coupled to the housing.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: March 13, 2018
    Assignee: Dell Products L.P.
    Inventors: Corey Dean Hartman, Salvador D. Jimenez, III, Syed S. Ahmed
  • Patent number: 9893341
    Abstract: A device for connecting tabs of battery cells includes an isolation board defining a first through slot seated on the surfaces of the battery cells from which the tabs extending out; a metal plate mounted on a surface of the isolation board afar from the battery cells, the metal plate defining a second through slot corresponding to the first through slot of the isolation board; and a metal conductive plate secured to the metal plate. The tabs of the battery cells extending through the first through slot and the second through slot are bent and seated on a surface of the metal plate afar from the isolation board, and the metal conductive plate is detachably fastened to the metal plate so that the tabs of the battery cells are securely sandwiched between the metal plate and the metal conductive plate.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: February 13, 2018
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY LIMITED
    Inventors: Yajie Chen, Weibo Zou, Yangang Yang
  • Patent number: 9860971
    Abstract: An electronic device includes a housing comprising a first plate, a second plate, and a side member, a printed circuit board arranged inside the housing and comprises a first surface, a second surface, and at least one side surface t, a first electronic component mounted on the first surface, a second electronic component mounted on the second surface, a first shield frame formed on the first surface and has a first opening, a second shield frame formed on the second surface and has a second opening, and a first shield cover comprising a first cover part and a first side part. The first cover part is supported by the first shield frame and covers the first electronic component. The first side part extends from the first cover part to the second shield frame and is covers the printed circuit board, the first opening, and a portion of the second opening.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seung Bo Shim
  • Patent number: 9825385
    Abstract: According to one embodiment, a holder includes a recessed portion and including an opening, and includes a contact exposed from part of a bottom surface of the recessed portion. A lid covers the holder from the recessed portion side, makes a space in the recessed portion airtight in an engaged state in which the opening of the recessed portion is closed, and includes an elastic member pushing down a contained object contained in the recessed portion. And a lock mechanism forms the engaged state between the lid and the holder.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: November 21, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira Tanaka, Masaya Hirashima, Shukuyo Yamada
  • Patent number: 9807905
    Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: October 31, 2017
    Assignee: General Electric Company
    Inventors: Bernd Sporer, Klaus Weinmann, Oleg Schneider
  • Patent number: 9781855
    Abstract: An electronic apparatus includes a first cover, a second cover, and a cable assembly. The second cover covers the first cover and has at least one first engaging portion. The cable assembly includes a cable body and a cover plate. The cover plate is sleeved onto the cable body and covers the first cover. The cover plate has at least one second, engaging portion. The first cover, the second cover, and the cover plate form an apparent surface of the electronic apparatus and form an accommodating space therein. The first engaging portion and the second engaging portion are engaged with each other in the accommodating space.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: October 3, 2017
    Assignee: XAVi Technologies Corp.
    Inventor: Cheng-Ming Fan
  • Patent number: 9763343
    Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface directed in the first direction, a second surface directed in a second direction opposite to the first direction, and a lateral side that surrounds, at least in part, a space formed between the first surface and the second surface, a display, an antenna radiating body, a printed circuit board including a first hole and a metal member positioned in the first hole, a flexible connecting member disposed between a portion of the antenna radiating body and a portion of the metal member, a conductive plate configured for contacting the connecting member, or being formed by a portion of the connecting member to include a second hole, and a coupling member for coupling the conductive plate to the printed circuit board by passing through the second hole and contacting with the metal member.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: September 12, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeon-Woo Kim, Jeong Woo, Jung-Sik Park
  • Patent number: 9747954
    Abstract: Provided is a video recorder including a case body comprising a space for housing a plurality of electronic parts, the plurality of electronic parts including: an optical disk drive (ODD) holder attached to an ODD; and a hard disk drive (HDD) holder attached to an HDD; a front panel on which a front printed circuit board (PCB) is mounted and which covers a front side of the case body; and a rear panel on which a rear PCB is mounted and which covers a rear side of the case body.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: August 29, 2017
    Assignee: Hanwha Techwin Co., Ltd.
    Inventors: Sung Jin Kwon, Nam Il Kim, Pil Jip Kim
  • Patent number: 9722195
    Abstract: A display device is disclosed. In one aspect, the display device includes a flexible substrate capable of being bent in a first direction and an insulating layer including a first opening pattern positioned on the flexible substrate and extending in a second direction crossing the first direction.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: August 1, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae Woong Kim, Hyun Woo Koo, Young Gug Seol
  • Patent number: 9678162
    Abstract: Some embodiments relate to a load control module that includes an enclosure and a plurality of power switching devices within the enclosure. The load control module further includes an interface mounted on an exterior of the enclosure and a switch connected to the interface. The switch is connected to the interface such that the switch selectively activates the interface to permit testing of the power switching devices upon operation of the interface. In some embodiments, the load control module may include a display that provides information relating to whether the interface is activated by the switch. Other embodiments relate to a load control module that includes a generator having a controller which controls operation of the generator and provides commands to the switch to selectively activate the interface to permit testing of the power switching device upon operation of the interface.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: June 13, 2017
    Assignee: Kohler Co.
    Inventors: Michael T. Little, Isaac S. Frampton
  • Patent number: 9668388
    Abstract: An electronic unit (1) having a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7 and having a first housing part (6) and a second housing part (7), where the first housing part (6) is at least partly electrically conducting. The PCB (2) having a first outer layer (3), a second outer layer (4), and a ground plane (5). The first outer layer (3) faces the first housing part (6) and the second outer layer (4) faces the second housing part (7) The ground plane (5) is in electrical contact with the first housing part (6) forming a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4). The chambers (29, 30) are separated by the ground plane (5), providing electromagnetic shielding between the chambers (29, 30).
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: May 30, 2017
    Assignee: AUTOLIV DEVELOPMENT AB
    Inventor: Laurent Caclard
  • Patent number: 9651808
    Abstract: A display device includes a display frame and a display module. The display frame includes multiple side frame pieces, multiple corner frame pieces and a back cover. Each side frame piece has a predetermined length. The multiple corner frame pieces are connected to the multiple side frame pieces, for forming an accommodating space surrounded by the multiple side frame pieces and the multiple corner frame pieces. The back cover is assembled with a side of the multiple side frame pieces and a side of the multiple corner frame pieces, and covers the accommodating space. The display module is disposed inside the accommodating space of the display frame.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: May 16, 2017
    Assignee: AOPEN INC.
    Inventors: Te-An Lin, Jing-Woei Teng
  • Patent number: 9648769
    Abstract: The invention relates to a power unit having a housing (1) in which at least one power electronics module (2), preferably a plurality of power electronics modules (2) is or are housed, positioned on a plane of the housing (1), the or each power electronics module (2) comprising at least one power electronics component (16), and being connected to at least one electronic control board (6) by at least one connection element (5). The power unit is characterized in that it comprises at least one member (7, 8) supporting the at least one electronic control board facing the power module (2) over at least one expanse of the board (6), the support member being the beam (7, 8) substantially parallel to said plane of the housing.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: May 9, 2017
    Assignee: Valeo Systemes de Controle Moteur
    Inventors: Guillaume Tramet, Roger Deniot, Benjamin Morliere, Fabrice Herault
  • Patent number: 9632112
    Abstract: An intelligent electronic device (100) for metering a characteristic of electricity that has a rear opening (214) and a side opening (216) in a housing of the device for accepting a connector of an expansion module through one or the other opening. The device can be configured with an integrated display module (120) that protrudes through a panel of an enclosure, and in this configuration, the expansion module connects to the device through the rear opening of the housing. The device can also be configured to be mounted on a DIN rail, and in this configuration, the expansion module connects through the side opening of the housing. The same module can be used in either configuration, without requiring that different versions of the module be made for the different configurations and without having to mount the device in an awkward orientation that makes it difficult to access external connections around the housing.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 25, 2017
    Assignee: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Stewart John Harding, Darrin Graham Marr, Colin Murray Slade, Marc Alan Ricci, David Andrew Hanke
  • Patent number: 9577392
    Abstract: A USB Type-C connector module includes a circuit board, a configuration-channel (CC) chip and a plurality of conductive terminals electrically connected with the circuit board. One end of the circuit board has a tongue, which a plurality of golden-fingers are arranged at two sides thereon. A USB Type-C connector is constituted by the tongue and the golden-fingers. CC golden-fingers of the USB Type-C connector are electrically connected to the CC chip for accepting a CC operation. Power golden-fingers of the USB Type-C connector are electrically connected to a power control chip of an external mainboard through the plurality of conductive terminals for receiving power. Data golden-fingers of the USB Type-C connector are electrically connected to a PCH of the external mainboard for transmitting data.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: February 21, 2017
    Assignees: NICECONN TECHNOLOGY CO., LTD.
    Inventor: Nai-Chien Chang
  • Patent number: 9575517
    Abstract: A reversible I/O apparatus for a POS terminal includes a housing with a motherboard sled removable from the housing to reverse the I/O peripheral ports of the motherboard to a front orientation or a rear orientation.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: February 21, 2017
    Assignee: NCR Corporation
    Inventors: Gregory Scott Egan, Seng Chan, Adonis Cala Codera, Michael Andrew Kleppinger, Lucky Nino Jalalon Abing
  • Patent number: 9474178
    Abstract: The invention describes an electronics device housing having two side wall elements, which are spaced apart from one another, for forming a housing having a housing interior for accommodating at least one printed circuit board, wherein at least one fitting location for conductor connection plug connectors is provided on at least one of the end faces in the intermediate space between the side wall elements. The electronics device housing has receiving devices in the region of the at least one fitting location, the receiving devices being designed to selectively receive—an ejector element, which can be pivotably mounted on the electronics device housing by the receiving devices, for ejecting a conductor connection plug connector from a fitting location, or—a locking element, which can be fixedly latched to the electronics device housing by of the receiving devices, for locking a conductor connection plug connector at a fitting location.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: October 18, 2016
    Assignee: WAGO VERWALTUNGSGESELLSCHAFT MBH
    Inventor: Lars Binner
  • Patent number: 9468117
    Abstract: A memory device having heterogeneous terminals easily connects the memory device to a computer or a portable terminal without a specific gender. When a memory unit is connected to a computer, the memory unit slides out of the body and the first terminal of the memory unit is inserted into a USB connector of the computer, and when the memory unit is connected to a portable terminal, the connection unit slides out of the body and the second terminal of the connection unit is inserted in a mini-USB connector of the portable terminal, so it is possible to easily connect the memory unit to the portable terminal without a specific gender.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: October 11, 2016
    Assignee: DUIN DIGITECH CO., LTD.
    Inventor: Jin-Woo Lee
  • Patent number: 9408324
    Abstract: A modular chassis includes a first casing module, a second casing module and a back plate module. The second casing module and the back plate module are disposed inside the first casing module. The first casing module includes a first outer box and a second outer box, in which the second outer box is capable of sliding relative to the first outer box and joining to the first outer box such that the length of the first casing module is adjustable.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: August 2, 2016
    Assignee: QUANTA COMPUTER INC.
    Inventors: Maw-Zan Jau, Chao-Jung Chen, Chih-Ming Chen
  • Patent number: 9381898
    Abstract: An actuator for brake fluid pressure control includes a block formed with a brake pipe, an electric component provided on a surface of the block, a circuit board formed with an electric circuit for driving the electric component, and a case that houses the circuit board and includes a first open part in which the electric component is accommodated, the case having a top surface opposite the surface of the block across the circuit board and being fixed to the block at the side opposite to the top surface. An insertion hole is formed in a side surface of the case at a position corresponding to a plane position of the circuit board. The insertion hole is sized to enable inserting the circuit board into the case therethrough to be fixed to the case.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: July 5, 2016
    Assignees: DENSO CORPORATION, ADVICS CO., LTD.
    Inventor: Fumitoshi Koyama
  • Patent number: 9363915
    Abstract: A system and method for building an electronic system with line-replaceable units (LRUs) is presented. The system includes a first LRU electronic module with a first connector on a side of the first LRU electronic module and a second LRU electronic module with a second connector on a side of the second LRU electronic module. To build the electronic system, the first connector on the first LRU electronic module is connected to the connector on the second LRU electronic module to form a first LRU electronic module and a second LRU electronic module combination with the first connector and the second connector interior to the module combination formed by the first LRU electronic module and the second LRU electronic module. The first connector and the second connector cannot be seen from outside the module combination formed by the first LRU electronic module and the second LRU electronic module.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: June 7, 2016
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Richard E. Berkenbush, Edward D. O'Neill, Christopher Errick
  • Patent number: 9320166
    Abstract: A system includes a rack, a plurality of shelves, a plurality of shelf-mountable electrical systems, and an inter-shelf power-pooling bus. The inter-shelf power-pooling bus is coupled to a power output of a shelf power supply mechanism on each of the shelves and a power input of a shelf computing device on each of the shelves. The inter-shelf power-pooling bus supplies pooled power from the shelf power supply mechanisms coupled to the inter-shelf power bus to the shelf computing devices coupled to the inter-shelf power-pooling bus.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: April 19, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael David Marr, Peter George Ross, David Edward Bryan
  • Patent number: 9298662
    Abstract: Settings are provided by a chassis management controller to an expansion card in a multi-slot server chassis. The chassis management controller in a multi-slot server chassis provides an operating parameter to a server management controller in a server, and the server management controller writes the operating parameter to a port expander of an expansion card installed on the server. The operating parameter is written to the port expander prior to expansion card power up, and the expansion card uses the operating parameter after power up to derive one or more SERDES value. The SERDES value is used to program an ASIC chip comprising a SERDES converter on the expansion card. In one example, the operating parameter is determined by the capabilities of a chassis midplane at the slot where the compute node is installed.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: March 29, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Keith M. Campbell, Patrick L. Caporale, Caroline M. Metry, Pravin Patel
  • Patent number: 9253030
    Abstract: A fiber channel switching module can include an integrated trace buffer memory, a crossbar switch and a control processor disposed on a single line replaceable module (LRM). The trace buffer memory may be adapted to capture selected data traffic transiting the switch fabric based on pre-selected triggers. The selected data can be read out of the trace buffer memory and used for selected diagnostics.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: February 2, 2016
    Assignee: Lockheed Martin Corporation
    Inventors: Bernard J. Letner, Kenneth R. Twigg
  • Patent number: 9234914
    Abstract: An apparatus for electrical safety is disclosed. A system and an alternate apparatus also perform the functions of the apparatus. The apparatus includes a test point accessible from an exterior of an enclosure while the enclosure is in a closed state. The enclosure houses one or more electrical components and the closed state prevents a user from touching the one or more electrical components. The apparatus includes a test conductor connected to a point on a conductor connected to an electrical component of the one or more electrical components where the test conductor is within the enclosure. The apparatus includes an impedance connecting the test point to the test conductor. The impedance is within the enclosure. The test point meets an Ingress Protection code rating of 20.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 12, 2016
    Assignee: Rockwell Automation Technologies Incorporated
    Inventors: Mark Innes, Roger Alan Plemmons
  • Patent number: 9147621
    Abstract: A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: September 29, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Eitaro Miyake, Masashi Aizawa
  • Patent number: 9136193
    Abstract: A semiconductor device includes a package 1, a block-module 2, and a control board 3 for controlling power semiconductor elements 11a. The block-module 2 has embedded power semiconductor elements 11a and second leads 4b and first leads 4a that are drawn from the block-module 2. The package 1 has external connection terminals 6a in contact with the first leads 4a of the block-module 2. The second leads 4b are connected to the control board 3 while the first leads 4a are joined to the external connection terminals 6a.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: September 15, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Masanori Minamio, Zyunya Tanaka
  • Patent number: 9130065
    Abstract: Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: September 8, 2015
    Assignee: Fairchild Korea Semiconductor, Ltd
    Inventors: Seungwon Im, O-Seob Jeon, Joon-seo Son, Keun-hyuk Lee, Yun-hwa Choi
  • Patent number: 9107331
    Abstract: An intelligent power module includes a power circuit board having a plurality of power devices and fixed on a base plate of a case body able to be closed with a lid to form a protective case of the intelligent power module. The intelligent power module also includes a control circuit board suitable to drive the power devices of the power circuit board. The control circuit board is associated with the lid in such a way that the control circuit board is comprised within the case body. The control circuit board and the lid thus realizing an intelligent lid of the intelligent power module.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 11, 2015
    Assignee: STMicroelectronics S.r.l.
    Inventors: Matteo Lo Presti, Nunzio Abbate, Agatino Minotti, Mario Di Guardo
  • Patent number: 9099236
    Abstract: A reactor 1 of the present invention includes: a combined product 10 provided with a coil 2 and a magnetic core 3 where the coil 2 is disposed; and a case 4 storing the combined product 10. The case 4 includes: a bottom plate portion 40 fixed to a fixation target when the reactor 1 is installed in the fixation target; a side wall portion 41 attached to the bottom plate portion 40 to surround the combined product 10; and a heat dissipation layer 42 formed on the inner face of the bottom plate portion 40 to be interposed between the bottom plate portion 40 and the coil 2. The bottom plate portion 40 is made of aluminum, and the side wall portion 41 is made of an insulating resin. The heat dissipation layer 42 is made of an adhesive agent whose thermal conductivity is high and which exhibits an excellent insulating characteristic.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: August 4, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasushi Nomura, Atsushi Ito, Akinori Ooishi, Takahiro Onizuka, Yoshiaki Matsutani
  • Publication number: 20150138735
    Abstract: A semiconductor memory device is included. The semiconductor device includes a semiconductor memory device, comprising: a first substrate including a first semiconductor device mounted on the first substrate and a first connection terminal disposed at an edge of the first substrate; a second substrate including a second semiconductor device mounted on the second substrate and a second connection terminal at an edge of the second substrate; and an interface connector including a first socket portion configured to receive the first connection terminal and a second socket portion configured to receive the second connection terminal. The interface connector further includes: first socket terminals of the first socket portion are connected with the first connection terminals; second socket terminals of the second socket portion are connected with the second connection terminals; and an internal wiring for electrically connecting the first socket terminals with the second socket terminals.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 21, 2015
    Inventors: Teck-su OH, Sung-ki LEE
  • Publication number: 20150138734
    Abstract: A power module for a motor traction inverter system of a vehicle includes a body portion configured to be inserted into a cooling device and having circuitry established thereat that generates heat during operation of the power module. The body portion has a surface area that is disposed in the cooling device and provides 360 degree direct cooling of the power module around the body portion for cooling the circuitry during operation of the power module. The power module may be transfer molded into a shape with a head terminal for sealing at the cooling device, and electrical connections of the power module share only one side surface or end of the power module, with all other sides and surfaces of the power module being disposed in the cooling device and used for cooling. The power module may not include thermal grease layers and may or may not be insulated.
    Type: Application
    Filed: November 7, 2014
    Publication date: May 21, 2015
    Inventor: Yuanbo Guo
  • Patent number: 9027238
    Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: May 12, 2015
    Assignee: Ibiden Co., Ltd.
    Inventors: Sotaro Ito, Michimasa Takahashi, Yukinobu Mikado
  • Publication number: 20150124409
    Abstract: A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 7, 2015
    Inventors: Koji Kawano, Naofumi Enkyo, Koki Kato