With Spacer Patents (Class 361/742)
  • Patent number: 5917705
    Abstract: A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: June 29, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Josef Kirschbauer, Erich Hopf, Gunther Gronninger, Jurgen Fischer, Gunter Didschies, Josef Mundigl, Michael Rogalli
  • Patent number: 5917709
    Abstract: A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: June 29, 1999
    Assignee: Eastman Kodak Company
    Inventors: Dean A. Johnson, William R. Laubengayer, Stephen G. Richardson
  • Patent number: 5910885
    Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: June 8, 1999
    Assignee: White Electronic Designs Corporation
    Inventors: Alan M. Gulachenski, Joseph Praino, Jack Seidler
  • Patent number: 5903439
    Abstract: A mezzanine connector assembly includes connectors engageable to a mating connector assembly such as a motherboard. It includes a circuit card having a surface on which a connector is mounted as well as a mezzanine card having a surface on which another connector is mounted. A mounting member is attached for connection between the cards in order to establish relative positions of the card surfaces. The distance between the card surfaces is set at least in part by the distance between end portions of the mounting member. The distance between the card surfaces is independent of the thickness of the cards so that a variation of the thickness of the cards will not result in a variation of the distance between the card surfaces.
    Type: Grant
    Filed: May 18, 1998
    Date of Patent: May 11, 1999
    Assignee: Unisys Corporation
    Inventor: Vladimir K. Tamarkin
  • Patent number: 5894411
    Abstract: A stackable data carrier arrangement including a cardshaped carrier element, at least one integrated semiconductor circuit arranged on the carrier element, at least one external terminal arranged on the carrier element and connected to the semiconductor circuit for making electrical contact therewith, the external terminal being formed so as to circumscribe an edge area of the carrier element and having a respective terminal area on the edge area and adjoining opposite main areas of the carrier element, the terminal areas being electrically connected to one another, includes means defining two slots provided in the carrier element, the slots extending parallel to one another from the edge area into the carrier element to approximately the same extent as the external terminal arranged between the slots, so that a contact tooth bendable perpendicularly to the main areas of the carrier element is formed by the region of the carrier element situated between the slots.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: April 13, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Georges Embo, Edgard Acke, Peter Preiner, Helge Schmidt
  • Patent number: 5886875
    Abstract: A circuit board (10) has a frangible portion (12) for carrying information relating to the circuitry carried on the circuit board. The information is carried in the form of a label (18) or barcode, and identifies the version of the circuitry so that during manufacturing, and later during repair, the circuit can be correctly identified. The frangible portion is broken from the circuit board, but kept with the circuit board. In one embodiment, an adhesive label retains the frangible portion.
    Type: Grant
    Filed: January 2, 1996
    Date of Patent: March 23, 1999
    Assignee: Motorola, Inc.
    Inventors: William C. Phelps, III, John M. Heffernan, Habib Amirzadeh
  • Patent number: 5825631
    Abstract: Two hybrid circuit components are connected to one another by a ceramic block. Electrical connections are made between the hybrid components by conductive vias through the ceramic block. The ceramic block is disposed toward an edge of the hybrid components so that integrated circuits and/or discrete electrical components may be attached to a major portion of both surfaces of each hybrid substrate. The interconnected hybrid components form a compact electrical device, for example, a hearing aid.
    Type: Grant
    Filed: April 16, 1997
    Date of Patent: October 20, 1998
    Assignee: Starkey Laboratories
    Inventor: Dave Prchal
  • Patent number: 5822197
    Abstract: An electrical connection system includes a frame, a main printed circuit "mother board", a series of secondary printed circuit "daughter boards", and interconnecting spacers formed of an insulative material plate with holes in it into each of which is inserted a buffer that is a good conductor of electricity. The frame includes a support plate with series of slides, the mother board resting on the support plate and receiving the interconnecting spacer. The daughter boards are slid into the slides and include, along an edge which cooperates with the interconnecting spacer, a heel-piece on which is mounted and to which is fixed a flexible printed circuit the tracks of which are connected to those of the daughter board and cooperate with the buffers. Arrangements are provided to fix the daughter boards to the frame.
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: October 13, 1998
    Assignee: Connecteurs Cinch
    Inventor: Michel Thuault
  • Patent number: 5777856
    Abstract: The integrated shielding and mechanical support simultaneously addresses the problems of providing RF shielding for an electronic device such as a radio transceiver and providing a rigid mechanical assembly for the electronic device. Two conductive rails (120, 130) hold together multiple printed circuit boards (PCBs) (140, 160) having conductive layers (145, 165) to produce a four-sided shielding box (180) that protects certain electronic circuits on the PCBs from electromagnetic interference. An internal conductive shield (150) subdivides the inside of the shielding box to provide additional protection for sensitive circuitry. The shielding box inserts into an opening in a five-sided housing section (110) using guides (112, 114, 116, 118), which simplifies assembly of PCBs in the housing and facilitates automated assembly. A second housing section (190) attaches to the shielding box (180) once it is inserted into the five-sided housing section (110).
    Type: Grant
    Filed: August 6, 1996
    Date of Patent: July 7, 1998
    Assignee: Motorola, Inc.
    Inventors: James P. Phillips, Thomas J. Walczak, Michael W. Schellinger, Scott Semenik, Thomas Carey Reardon, deceased
  • Patent number: 5754406
    Abstract: A card guide assembly for isolating printed circuit boards from each other during insertion and removal from a mounting array. The assembly includes first and second isolation channels that are configured to permit the receipt of a variety of PC board sizes therein and a securement cap for receipt thereover. The cap may be adjustably positioned within the isolation channels for establishing a secured mounting for a variety of PC board sizes. A locking mechanism is provided between the cap and the channels for secured engagement therebetween. The channels are mounted on opposite sides of the PC board connector region permitting conventional mounting of the PC board into a mounting connector.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: May 19, 1998
    Assignee: Compaq Computer Corp.
    Inventors: Thomas T. Hardt, Karl N. Walker
  • Patent number: 5754404
    Abstract: A frameless IC card is provided, with front and rear support structures that each includes an electrical connector, with a sheet metal cover mounted on the front and rear board supports without requiring a separate plastic frame to tie the components together. The rear support structure includes at least one rear connector (11', 12', FIG. 3) fixed to the circuit board rear end (104') and an end cap (16') at the rear of the IC card. The end cap has upper and lower flanges (126T, 126B) that form a recess therebetween that closely receives the rear of the rear connector housing to fix their relative vertical positions. The rear end cap has forwardly-extending legs (47, 48) at opposite sides, with each leg having a lug (51, 52) forming a rearwardly-facing shoulder (150) that fits into a cutout (53) at a side of the circuit board, to prevent forward movement of the connector and circuit board out of the rear end cap.
    Type: Grant
    Filed: September 25, 1996
    Date of Patent: May 19, 1998
    Assignee: ITT Cannon GmbH
    Inventors: Werner Biermann, Jan Zeyfang, Gary Cain Bethurum
  • Patent number: 5751559
    Abstract: An apparatus capable of housing PC cards including a PC card with a connector and PC card guide, a housing having an insertion opening for inserting the PC card and a circuit board mounted in the housing. The connecting direction between the PC card and the circuit board is perpendicular to the insertion direction of the PC card. The apparatus further includes guides arranged on the housing having two cam plates which are separated by spacers and supported by a shaft. Each cam plate has a continuously recessed guide path for guiding the PC card. The guide path has a guiding portion and a stop portion wherein the transition of the pivot pin from the guiding portion to the stop portion causes a defined rotation of the plug-in package about the pivot point wherein the plug-in package is rotatably arranged at the pivot point. This allows the PC card to make a pivot motion in order to accomplish the connection between the plug-in package and the circuit board.
    Type: Grant
    Filed: October 8, 1996
    Date of Patent: May 12, 1998
    Assignee: International Business Machines Corporation
    Inventors: David John Jensen, Charles Steven Lingafelt
  • Patent number: 5721671
    Abstract: In a subrack, electronic circuit boards are connected to mother boards disposed in at least two planes parallel to the front face of the subrack. Each plane contains one or more mother boards. The planes are superposed to form a stack of compartments the general exterior envelope of which is generally pyramid shaped.
    Type: Grant
    Filed: October 24, 1995
    Date of Patent: February 24, 1998
    Assignee: Gec Alsthom Transport SA
    Inventor: Christian Ruque
  • Patent number: 5695872
    Abstract: A glued connection suitable for attaching high power electronic components to a mounting location, such as on a cooling element, has an electrically insulating base layer of unfilled adhesive applied onto at least one surface of the parts to be glued. An adhesive filled with an electrically insulating powder that has good thermal conductivity is applied onto at least one part surface. Grains of the powder puncture the base layer, and the thickness of the glued connection thus essentially corresponds to the size of the grains.
    Type: Grant
    Filed: January 12, 1995
    Date of Patent: December 9, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Karl-Heinz Ideler, Dieter Dlugosch, Winfried Arz
  • Patent number: 5671124
    Abstract: A circuit board locating device for fastening a circuit board to a frame, having two pairs of symmetrical flat legs at four sides inserted through a cross slot in a frame, a screw hole at the top connected to a circuit board by a screw, four pairs of side boards respectively raised from two opposite lateral sides of each leg and stopped at the top side of the frame, four horizontal bottom plates respectively outwardly extend from the legs at the bottom and stopped at the bottom side of the frame, and two inward projecting portions respectively raised from two opposite legs and stopped against the periphery of the screw to hold it in the screw hole.
    Type: Grant
    Filed: February 8, 1996
    Date of Patent: September 23, 1997
    Inventor: Hsin Chien Ho
  • Patent number: 5668408
    Abstract: A module technology allows a PGA like package architecture to be used in microwave instruments and other high frequency systems where high isolation, low reflection, and low cost multi-chip modules are needed.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: September 16, 1997
    Assignee: Hewlett-Packard Company
    Inventor: Dean B. Nicholson
  • Patent number: 5608611
    Abstract: An electronic module includes a Printed Circuit Board (PCB) which contains a plurality of circuit elements. The electronic module is electrically connected to other electrical components in a vehicle by a connector. The PCB is contained within an electrically conductive housing which includes a box and a cover. A ground trace printed on the PCB extends to a mounting hole in the PCB and provides a ground path for the circuit elements. An electrically conductive metal ferrule which elevates the PCB above the box and the cover above the PCB, extends through the mounting hole in the PCB and contacts the cover and box when the cover is fitted onto the box. A mounting bolt extends through the cover inside the ferrule through the box and into a nut mounted into a metal portion of the vehicle.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: March 4, 1997
    Assignee: United Technologies Automotive, Inc./Ford Motor Company
    Inventors: Robert G. Szudarek, Yew T. Yeow, Arnold D. Nielsen, Roger Cook
  • Patent number: 5497291
    Abstract: A power semiconductor device having power chips mounted on a metal insulating substrate and terminal plates corresponding to inner connection wiring for a main circuit of the device. Electronic parts forming a control circuit are mounted on a second substrate disposed over the first substrate and supported by the terminal plates. Additionally, it is preferable to use a copper plate as wiring material for the main circuit.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: March 5, 1996
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Toru Hosen
  • Patent number: 5477421
    Abstract: An IC card is described which has a housing that is of low cost and which provides very good shielding against ESD/EMI (electrostatic discharge and electromagnetic interference), while securely holding a circuit board assembly and providing good contact with a ground conductor of the board. The housing comprises lower and upper housing halves (22, 24, FIG. 2), each molded of an electrically conductive polymer. The lower housing, half includes a bottom cover portion (90) and a pair of upstanding flanges (92, 94) that each forms part of a side of the housing. The upper housing half forms a top cover portion (100) and a pair of downwardly extending flanges (102, 104). The circuit board has a ground conductor (70) at its periphery which is trapped between the upper and lower housing halves to securely hold the circuit board in place and to electrically ground its ground conductor. Each housing half has platform parts (114, 116, 120, 122) that engage corresponding surfaces of the circuit board.
    Type: Grant
    Filed: November 18, 1993
    Date of Patent: December 19, 1995
    Assignee: ITT Corporation
    Inventor: Gary C. Bethurum
  • Patent number: 5444601
    Abstract: An electronic device, such as a personal computer, has a rectangular main body including a bottom wall and a side wall which has an opening. A circuit board is arranged in the main body to oppose the bottom wall within a predetermined distance. The circuit board and the bottom wall define a mounting space therebetween. An expansion board is mounted in the mounting space and detachable through the bottom wall and the side wall. A connector is fixed to and electrically connected to the circuit board and located between the circuit board and the bottom wall. The connector has a connecting portion opposing the opening and allowing connection of the expansion board thereto. The connector also supports the circuit board. A restraining system is provided for restraining movement of the connector with respect to the bottom wall.
    Type: Grant
    Filed: October 26, 1994
    Date of Patent: August 22, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masami Honda, Masaaki Takada, Yousuke Miura
  • Patent number: 5442520
    Abstract: An apparatus for interconnection of two personal computer style processor printed circuit boards comprises a bridge printed circuit board having edge connectors on opposing edges thereof and support member for supporting the processor printed circuit boards in facing parallel arrangement with each edge connector of the bridge printed circuit board engaged in a mating socket on one of the processor boards. The support member advantageously provides pivotable support of at least one of the processor boards to permit insertion and removal of an edge connector of the bridge board into and from the mating socket of a processor board. The support member further advantageously comprises an enclosure and the pivotable support advantageously comprises a support bracket having notched end panels for engagement with pivot pins fixed to opposing surfaces of the enclosure.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: August 15, 1995
    Assignee: Cincinnnati Milacron Inc.
    Inventors: James J. Kemp, John L. DeJager, Thomas L. Allgeyer, Jack E. Schenkel
  • Patent number: 5400222
    Abstract: An extensible bus assembly provides very short, uniform stub lengths from a bus transceiver to the bus assembly. The extensible bus assembly includes a bus termination cap, a plurality of extenders and an anchor. Each bus assembly element is L-shaped so that the bus transceiver, or some similar bus driver, may be positioned in close proximity to the bus assembly by placing the bus transceiver in the "corner" of the L; this ensures short, uniform stub lengths. Conductive surfaces are vertically positioned within the termination cap and plurality of extenders. The conductive surfaces may be compliant pins and/or spring-loaded wire conductors.
    Type: Grant
    Filed: February 8, 1993
    Date of Patent: March 21, 1995
    Assignee: Hewlett-Packard Company
    Inventors: Stephen P. Nelsen, Samuel M. Babb
  • Patent number: 5373104
    Abstract: A control module having an integral fastening and locking case assembly whereby a support spacer frame for circuit boards and case members are assembled to create a single unit without the use of conventional fasteners. The structure of the housing and the support spacer frame provides an arrangement whereby the sectional equipment may securely snapped together to form a single unit without the use of conventional fasteners.
    Type: Grant
    Filed: July 12, 1993
    Date of Patent: December 13, 1994
    Assignee: Delco Electronics Corporation
    Inventor: Eric A. Brauer