Abstract: A semiconductor device according to the invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface, and the die bond material is provided integrally over the plurality of cutouts.

Abstract: A diode pack housing for a rotating rectifier assembly can include a body having an interior surface defining an interior cavity open on a first end and configured to contain a diode pack and a plurality of bus bar channels defined axially on or in the inner surface in the interior cavity. The plurality of bus bar channels can be five or less bus bar channels.

Abstract: A diode pack comprises a plurality of diodes seated in an assembly within a housing. The diode pack also includes a plurality of radial studs extending from an axial end of the housing relative to an axis of rotation extending through the housing. Each of the radial studs is electrically connected to a respective diode within the assembly. The diode pack further includes a center stud captured within the housing between the assembly and the housing and along the axis of rotation. A method of making a diode pack includes forming a housing of an electrically insulate material, removing a portion of the housing along an axis of rotation of the housing, mounting a center stud in the housing where the portion was removed, and assembling an assembly of diodes into the housing.

Abstract: A modular system is described which can provide high frequency monitoring of power use and responsive control as well as enabling network connectivity for centralised monitoring and operation. One modular system consists of a communications bus, end caps, and a combination of the modules providing communications, power metering, relay control and battery backup. Each modular system can be configured with a combination of modular units as needed for the application. A combination of bus communication monitoring and tilt detection provides security against external tampering after installation.

Abstract: An electronics device is disclosed, including: a first printed circuit board having a plurality of through-holes; a second printed circuit board having a plurality of through-holes; a housing in which the first and second printed circuit boards are disposed, the first printed circuit board disposed above the second printed circuit board in the housing; and a connector attached to the housing and including a plurality of pins comprising first pins and a plurality of second pins, a length of the first pins being greater than a length of the second pins. Each of the first pins extends through one of the through-holes of the first printed circuit board and one of the through-holes of the second printed circuit board and thereby makes an electrical connection with the first and second printed circuit boards, and each of the second pins only extends through one of the through-holes of the second printed circuit board and thereby makes an electrical connection with the second printed circuit board.

Abstract: An electrical connector includes an insulative housing and a contact module essentially composed of a plurality of contacts integrally formed within an insulator via an insert-molding process wherein the contact module is assembled to the housing via two steps along different directions perpendicular to each other. The housing forms a plurality of protrusions engaged with the corresponding ribs of contact module in the vertical direction so as to retain the contact module to the housing reliably. All the insulator, the contacts and the housing are arranged in a staggered manner.

Abstract: An attachable monitoring device includes a battery unit, a wiring board unit and a physical condition sensor and an adhesive. The battery unit includes a top surface, a bottom surface and a plurality of side surfaces connecting the top surface and the bottom surface. The wiring board unit covers the top surface, the bottom surface and one of the side surfaces and electrically connected to the battery unit. The wiring board unit includes a printed antenna printed on a first outer surface of the wiring board unit. The physical condition sensor is disposed on a second outer surface of the wiring board unit opposite to the first outer surface. The physical condition sensor includes a sensing region for contacting a user to detecting a physical-condition signal of the user. The adhesive is disposed on the wiring board unit for being attached to the user.

Abstract: The invention relates to a terminal assembly and in particular a series terminal assembly for medium-voltage switchgears. The assembly includes at least two input-side connectors and at least two output-side connectors in addition to a configuration location. The input-side connectors and the output-side connectors are not interconnected in a fixed pre-configured manner. Each of the configuration locations for each input-side connector location and for each output-side connector location has a configuration connector location.

Abstract: An electrical connector for use within a machine case includes an insulator and a plurality of contacts. The insulator defines opposite top and bottom surfaces thereon in a vertical direction. The contacts are retained to the insulator via an insert molding process. Each of said contacts is stamped and bent from sheet metal and unitarily formed with an upper contacting section exposed upon the top surface, and a lower contacting sections exposed upon the bottom surface. Each of said upper contacting section and said lower contacting section extends along a longitudinal direction perpendicular to both said vertical direction and said transverse direction. Each of the upper contacting section and the lower contacting section is planar and stationary. One of said upper contacting section and said lower contacting section has an outer end exposed to an exterior for originally linking to a contact carrier.

Abstract: An electronic circuit, comprising at least three circuit boards (2.1, 2.2, 2.3) fastened at a frame (1) and electrically connected via contact pins (7) arranged therein, and an electric connection (11), connected to a third of the circuit boards (2.1). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards (2.1, 2.2, 2.3) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame (1), with bases (4, 5, 6) being embodied at the faces of the frame (1), with the ends being parallel to the faces of at least two of the bases (4, 5, 6) in one level, arranged in groups, and with the embodiment of the frame (1) and the circuit boards (2.1, 2.2, 2.3) being adjusted to each other.

Abstract: A device featuring a substrate configured to include an upper surface and an opposing lower surface and, in parallel, a first and an opposing second peripheral edge, the first peripheral edge being smaller in length than the second peripheral edge, one or more semiconductor chip mounted over the upper surface of the substrate, a control semiconductor chip mounted over the upper surface of the substrate, a sealing resin covering the memory and control chips, and a plurality of external terminals provided over the lower surface of the substrate, the external terminals being arranged in a line along the first peripheral edge. The external terminals are used to fit the device to an electronic apparatus. The device may be a memory card having a stacked arrangement of two or more memory chips, and with the control chip being apart from or included in the stacked arrangement.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: The present invention relates to a Network on chip comprising a torus matrix of processing elements formed by a juxtaposition of bricks in rows and columns, each brick comprising a longitudinal extra-connection bus segment connecting two terminals situated on opposite transverse edges of the brick on a first axis; two longitudinal intra-connection bus segments connecting circuits of the brick to respective terminals situated on the opposite transverse edges on a second axis symmetrical to the first axis with respect to the center of the brick; a transverse extra-connection bus segment connecting two terminals situated on opposite longitudinal edges of the brick on a third axis; and two transverse intra-connection bus segments connecting circuits of the brick to respective terminals situated on the opposite longitudinal edges on a fourth axis symmetrical to the third axis with respect to the center of the brick.

Abstract: An enclosure arrangement, with protection against touch, of a power electronics appliance, more particularly of a frequency converter (31, 51) and its additional devices (12, 13), which solution contains an enclosed power electronics appliance and one or more enclosed additional devices installed in connection with it, which enclosed power electronics appliance and additional devices are modules, which can be fitted to be installed in combination one above the other such that the protection against touch of the appliance entity formed is as great as or higher than the protection against touch of the separate appliances.

Abstract: A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that are directly surface mounted, as bare die, to a semiconductor substrate. Other semiconductor substrate assemblies of the stack involve bare memory integrated circuit dice that are directly surface mounted to a semiconductor substrate. Elastomeric connectors interconnect adjacent semiconductor substrates proceeding down the stack. Tines of novel comb-shaped power bus bar assembly structures extend into the stack to supply DC supply voltages. The supply voltages are supplied from bus bars, through vias in the semiconductor substrates, and to the integrated circuits on the other side of the substrates.

Abstract: The present invention provides a highly miniaturized wireless transceiver employing WLAN technology that offers flexible integration with multiple, generic sensing technologies. The developed wireless system can be readily integrated with existing sensing technology to enable direct sensor-to-internet communication in environments where wired connections are too costly, or otherwise impractical.

Abstract: An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of that circuit board, and a heat sink disposed over the front side of that circuit board. The heat sink is configured to provide cooling to that assembly. The electronic apparatus further includes a coupling mechanism that couples the first and second assemblies together in a substantially parallel manner. The sets of connectors of the assemblies form a connection interface to concurrently connect the first and second assemblies to a backplane.

Abstract: An outdoor telecommunications cabinet comprising an electronic compartment adapted to contain heat-generating electrical equipment, having a main electronic compartment including a rear wall panel and two clamshell doors, a floor panel and a cover panel, including access areas and an equipment storage area, the main compartment being adapted to contain heat-generating electrical equipment, at least one rack inside said main electronic compartment for electronic equipment, a base assembly supporting the said electronic compartment, having a width and depth similar to said main electronic compartment capable of being anchored to a base plate or pad, a ventilated sub-compartment in the base assembly containing an environmental cooling system, a pair of clamshell doors, movable between an open position permitting access to both front and back sides of said electrical equipment and a closed position in which the doors maintain a substantially closed environment in the electronic compartment, a cable entry port, ty

Abstract: The present invention is to provide a network device having a parallelepiped housing comprising a plurality of slots on two opposite sides and two opposite edges at each of an underside and a top and a plurality of pads each fastened the slots. This forms a short distance between a supporting surface and the underside of the housing by the projected pad. Also, housings of the same type of network devices can be stacked or horizontally coupled together by fastening the pads in the slots.

Abstract: The present invention relates to an electronic assembly and, more particularly, to a computing assembly comprising a computing platform and an external power supply. The computing platform has an internal cooling mechanism which generates an externally directed flow of air. The external power supply is disposed relative to the cooling mechanism such that the outwardly directed flow of air, or at least a portion thereof, passes through the power supply and exerts a cooling influence on the external power supply.

Abstract: A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub substrates 22, each the sub substrate 22 having an identical pattern of circuit developed thereon, and mounting electronic components on the sub substrate 22; a step 64 of, after the step 62, providing slits for electrically isolating signal terminals formed integrally; a laser trimming step 66 of, after the step 64, engaging pins 39 of an inspection tooling in direct contact with the signal terminals to conduct an inspection; and a separating step 72 of, after the step 66, separating the sub substrates 22 from the master substrate 21. Accordingly, the productivity for the high-frequency modules will be improved.

Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.

Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate.

Abstract: An electrical distribution center has a circuit board interposed between an upper housing and a lower housing. The upper housing has a panel provided with a universal cavity design by a multiplicity of terminal-receiving slots. The slots are arranged in laterally spaced parallel rows with the slots in each row in equally spaced apart relation to one another. Raised rails on the top side of the panel are parallel to the rows of slots and respectively occupy the spaces between the rows of slots. The circuit board has terminals extending into selected slots through the bottom side of the panel. The slots are adapted to receive the terminals of relays and fuses inserted through the top side of the panel for contact with the terminals of the circuit board. When the terminals of a relay are inserted in any of the slots, the relay body will be supported on rails on opposite sides of those slots.

Abstract: Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first solder bumps between the first and second microelectronic substrates, adjacent an edge of the second microelectronic substrate, that connect the second microelectronic substrate to the first microelectronic substrate and that are confined to within the edge of the second microelectronic substrate. The edge of the second microelectronic substrate is adjacent the vertex of the acute angle. A third microelectronic substrate also may be provided on the first microelectronic substrate that laterally overlaps the second microelectronic substrate. Second solder bumps connect the third microelectronic substrate to the first microelectronic substrate. The second and third microelectronic substrates may be oriented parallel to one another at the acute angle relative to the first microelectronic substrate.

Abstract: A heat conducting device for providing a thermal path between a circuit board and a missile airframe includes a thermal plane that is adapted to receive a circuit board and a collar that encompasses at least a portion of the thermal plane. The collar has a first position that disengages the heat conducting device from at least a portion of the airframe and a second position that engages the heat conducting device with at least a portion of the airframe to provide a thermal path between the circuit board and the airframe.

Abstract: A modular circuit breaker system includes a plurality of modules mounted side-by-side. The modules include electrical terminals for connection to live and neutral conductors of an electrical supply. Rigid metallic conductors extend between the modules for connecting electrical circuitry of one module to the electrical circuitry of the other module. Each conductor is removably engaged with electrical contacts mounted within the respective modules.

Abstract: The invention relates to an area of electronic equipment assembly using packaged and unpackaged electronic components. The invention solves a problem of creating an all-purpose construction of three-dimensional electronic modules with the possibility of employing practically any kind of packaged and unpackaged electronic components, providing high packing density, effecting heat removal and allowing good accessibility for repair. This is provided due to the arrangement of both packaged and unpackaged components in three-dimensional space in combination with effective heat removal directly from heat emitting components. Use of corrugated commutation boards and ordinary tools allows repair of any alternative design of the module without dismounting other components. This constructive solution allows an increased packing density of electronic equipment by 2-10 times in comparison with conventional constructions and increases mean time between failures (MTBF).

Abstract: A semiconductor mounting system of the present invention includes a first semiconductor chip in which a first semiconductor integrated circuit is packaged and a second semiconductor chip in which a second semiconductor integrated circuit is packaged. The first semiconductor chip includes a plurality of first pins provided on a first surface and a plurality of second pins provided on a second surface. The second semiconductor chip includes a plurality of third pins provided on a third surface and a plurality of fourth pins provided on a fourth surface. The semiconductor mounting system further includes: a plurality of first lines for electrically connecting the first pins with the third pins; and a plurality of second lines for electrically connecting the second pins with the fourth pins. A length of the first lines is substantially equal to a length of the second lines.

Abstract: A Universal Serial Bus docking station is provided in which a USB hub includes a housing which may receive at least one additional USB module which is connected to the USB hub without the use of an additional cable. In a preferred embodiment of the invention, up to three USB modules may be inserted into the housing in stacked arrangement. In addition, each USB module maybe used as a stand alone unit by snapping a sleeve onto the rear of the module. Still further, a USB connector is adapted for use standing vertically from a circuit board and being retained by spring clips extending through the circuit board in a direction substantially parallel to the longitudinal axis of the connector.

Abstract: A connector is provided which can simplify the path for heat radiation between electronic devices, ease restrictions in the structures of the electronic devices and in the arrangement of parts on the printed circuit boards, and reduce work for the highly precise setting of mounting intervals between connecting components. A connecting structure between electronic devices using the above connector is also provided. Heat from electronic parts 71 on a printed circuit board 61 which is provided in an electronic device 11 is conducted to a radiating plate 41. The heat is conducted to a male connecting component 20 by metallic portions 51 which are provided in the back of the male connecting component 20. Then, the heat is conducted from the male connecting component 20 to a female connecting component 30. The heat is conducted from the female connecting component 30 to a radiating plate 42 by metallic portions 52 which are provided in the back of the female connecting component 30, and radiated.

Abstract: An expandable modular container system. A plurality of coupling pads supporting container modules are disposed between two supporting stands, wherein the coupling pads and supporting stands are coupled together, and the supporting stands are provided with supporting units to provide lateral support to the plurality of container modules. The container modules can be quickly and securely coupled side by side and in series by means of the plurality of coupling pads, thereby achieving a stable and space saving arrangement.

Abstract: A hot-pluggable hard disk drive is supported on a carrier structure for removable insertion into a sheet metal cage structure in a manner such that an SCA connector on the rear end of the drive is releasably mateable with a corresponding backplane connector within the cage. The carrier has a bottom side with opposite side edge portions from which resilient shock-absorbing foot members downwardly project to protect the carrier-supported disk drive from non-operational shock when the bottom of the carrier is inadvertently permitted to downwardly strike a horizontal support surface such as a table or workbench. Upwardly projecting side wall portions of the carrier are positioned generally over the protective feet, on opposite sides of the supported disk drive, and have top side edges downwardly offset from the top side of the disk drive.

Abstract: A modular home information center includes a number of processing modules having substantially identical housings with each of the modules having an operating structure and a multi-bus connector within the housing of the module. Each multi-bus connector is connected to the operating structure within the housing and is engagable and disengageable to form a multi-bus network interface when engaged. The housings and the connectors are interchangeable relative to other housings and connectors, and the connectors when engaged constrain the housings to maintain a uniform parallel relation with each other.

Abstract: A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Abstract: A standoff for mounting two or more printed circuit boards to a chassis in which one keyhole cut printed circuit board may be slidably mounted on the keyhole mount of the standoff and a second printed circuit board may be mounted on the top portion of the standoff spaced away from the first printed circuit board. The second printed circuit board may be affixed to the standoff by either a screw mount, snap lock mount, adhesive, bolt and nut, clamp or other method.

Abstract: An electronic assembly is made up of a number of rigid manufactured on the same or different substrates or panels and with the same materials separated from each other electrically and physically. One of the rigid circuit boards has a comb of printed tabs, or fingers, at the edge, which connects the assembly physically and electrically to a motherboard. Flexible wire jumpers bridges the comb to form electrical connections between the boards. Both boards have printed circuit tabs placed in alignment to each other on both boards across a gap which separates both boards. These tabs facilitate electronic interconnection of both boards via the flexible jumpers, which are groups or clusters of wires separated from each other via a flexible insulator. A method for manufacturing the assembly is also disclosed, in which two boards are created by cutting gaps from a substrate, leaving the two boards separated by a gap and connected by snap-offs.

Abstract: The invention is component module (20) for combining a plurality of components (21, 23, 25, 27 and 29)into a single module (20) for use with a printed wiring board. A plurality of components, each component having a pair of contacts (21a,21b), are formed into the module with a plurality of insulating spacers (2,24,26 and 28). There is one spacer between adjacent components, said spacers serving to insulate adjacent components from each other and to secure the components together to form the module.

Abstract: The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

Abstract: A cascadable modem apparatus includes a modem housing having a top and a bottom. A plurality of angled feet are attached to the housing bottom in cantilever fashion to define a distal portion of each foot. The feet serve both to support the modem on an platform as well as to attach the modem to a similarly configured, adjacent modem assembly. In the preferred embodiment, a plurality of receiving slots are defined in the housing top and are correspondingly disposed to receive the distal portions of a plurality of angled feet from an adjacent modem housing. In this way, insertion of the distal portions of the feet snugly into the receiving slots of an adjacent modem effectively attaches the two adjacent modem assemblies. Preferably, a resilient locking tab is attached to the housing bottom in cantilever fashion to define a distal portion directed away from the housing bottom. As a result, the tab is responsive to force applied to the distal portion to flex inwardly toward the housing bottom.

Abstract: In a module mounting structure, a plurality of lead frames are affixed to an affixing block of resin and then respectively soldered to a plurality of input/output pads provided on a daughter board. Subsequently, lugs protruding from both end portions of the affixing block are inserted in reference holes formed in the daughter board in order to prevent the block from being displaced. Input/output pads are provided on both sides of the daughter board, and electronic parts are mounted on both sides of the daughter board. The lead frames affixed to the affixing block are inserted in through holes formed in a mother board, and then soldered to the mother board. The structure is adaptive to an increase in the number of pins of the daughter board and an increase in module mounting density.

Abstract: Stackable ball grid array packages are disclosed, wherein a plurality of separate ball grid array packages may be stacked, one on top of another, and interconnected by conductive terminals located on opposite surfaces of each of the ball grid array packages. Thus, the mounting of ball grid array packages on a printed circuit board may be conducted in three dimensions rather than two dimensions, requiring considerably less printed circuit board surface area and reducing parasitic inductances and capacitances between the terminals of the stacked ball grid array packages. An air gap is formed between adjacent, stacked packages for cooling. Connections between adjacent packages are made by conductive epoxy and noble metal balls.

Abstract: A press-fit or compliant section or deformable pin electrical connector. The connector is designed to be inserted into several plated through holes in printed circuit boards. Specifically, the pin connector can electrically and mechanically connect two or more printed circuit boards (PCBs). Uniquely, it is possible to have a single pin that is both electrically and mechanically connected to two PCBs and have the pin extending through a plated through hole of a third PCB without establishing any electrical or mechanical contact with the third PCB. Additionally, the pin has at least two compliant sections for press fitting into a plated through-hole in a PCB or the like. Each compliant section has a different size diameter. Specifically, the top compliant section is the smallest, the bottom compliant section is the largest in diameter, and the remaining compliant sections will gradually increase in size as they are located from the tip to the base of the pin.

Abstract: Each flat package is provided with locking elements of snap fasteners that allow several packages to be assembled into a stack so as to align the leads of each package with respect to the leads of other packages. The leads projecting from both edges of the stack package assembly are inserted into a pair of PC boards having holes arranged so as to accommodate the leads of the assembly. The leads of the PC boards are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly.

Abstract: An electronic assembly of two planar electronic devices for insertion into a shelf for back plane connection. Each device may be a printed circuit board or a circuit pack incorporating such a board. A flexible flat cable extends between front ends of the devices to interconnect their circuitry. This cable is torsionally flexible to allow relative pivoting movement of the electronic devices in their respective planes. The cable is also bendably flexible to allow movement towards each other or apart of the rears of the electronic devices. A movement limiting device restricts the degree of relative movement of the electronic devices. The relative movement overcomes tolerance issues between terminal positions of one device relative to the other during connection into the back plane and damage to terminals and connectors is avoided.

Abstract: Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or "tub" of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules.

Abstract: Semiconductor structures and associated methods for limiting electromigration at wiring interfaces. Increased cross-sectional contact sections are employed, with conducting studs in contact therewith. Methods for fabrication and use are disclosed. Contacts for stackable integrated circuit chips and three-dimensional electronic modules particularly are modified with the disclosed structures and methods.

Abstract: A printed circuit board (PCB) subassembly of first and second PCB's disposed back to back, a group of jumper pins extending through the PCB's to electrically connect the circuit elements of the first and second PCB's and supporting the second PCB from the first PCB in back to back relationship, a cutout defined in the first PCB, and an electro-optic sensor disposed on the second PCB and extending through the cutout in the first PCB.

Abstract: A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction, relative to prior art OMPAC devices. The MCM tile includes an interconnection substrate with peripheral metallizations and at least one chip or integrated circuit (IC) mounted on the substrate by solder reflow or conductive adhesive technology. The PWB which may be a single level or a multilevel, is provided with an aperture for accommodation of at least one chip therein. Depending on the type of interconnection between the substrate and the PWB, the aperture may be larger than the substrate of the MCM tile for wire bonding interconnection or smaller than the substrate for solder reflow or conductive adhesive interconnection. In the wire bonding case, the MCM tile is positioned within the aperture resting on the surface of the PWB or of a structural member or of a heat sink which encloses one end of the aperture.

Abstract: A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.