Abstract: A TAB (tape automated bonding) tape of high precision is formed without the deformations of its conductor pattern and the like and which is hermetically sealed with resin. The method for producing a TAB tape includes punching required holes, such as a device hole 14 and the like, in a metal plate 10 coated with an insulating adhesive layer 12 over the area where a conductor pattern is to be formed; and forming a required conductor pattern 24 by bonding a conductor metal foil onto the adhesive layer and by etching the conductor metal foil. Thus, the material cost of this TAB tape can be reduced and the production of this tape is facilitated.

Abstract: A multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer contacting a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer (28 and 30) affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region (32) is produced as between the stacked laminate sections.

Abstract: A composite sheet comprises a first resin film; and a second resin film laminated on the first resin film; wherein two ellipses of coefficient of linear expansion are created on polar coordinates in corresponding parts of the first and second resin films by a predetermined method and the two ellipse are overlapped so as to match in the center point and coordinate axes X and Y, and the maximum value of a linear expansion coefficient difference between the two resin films is equal to or less than a predetermined value.

Abstract: A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-impregnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Abstract: A method for producing a panel of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of coating a circuitized core material that has been cut into panels with a dielectric material and copper cover sheets; forming circuits from the cover sheets by etching; applying an adhesive polymer across the dielectric material covering the entire area of the panel; applying a cover sheet; drilling the panel to form through-holes and vias; seeding and plating the through-holes and vias with joining metal; applying photo-resist to the panels exposed with an image of the area of the panel to be joined and developed; and etching the cover sheet and the photo-resist away in the area of the panel to be joined to expose the adhesive polymer.

Abstract: The assembly comprises a U-shaped frame to which the card may be secured. The frame is defined by spaced parallel side elements and a connecting end element. Intermediate the ends of the frame a tie bar bridges flatly across the top of the frame and is adapted to hold down the card and tie the side elements together. The bar has downward legs at its opposite ends secured to the frame.

Abstract: The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.

Abstract: A metal base board comprising a metal plate, a circuit conductor section, and an insulating layer provided between the circuit conductor and the metal plate wherein the insulating layer comprises an organic insulating material with flaky inorganic fillers added therein and the flaky inorganic fillers are stacked in the insulating layer in a stratified state.

Abstract: A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a PIBO film. A printed wiring board (PWB) having at least one polyimidebenzoxazole (PIBO) dielectric layer wherein the PWB has at least one thin dielectric base material layer, at least one thin conductor, at least one narrow conductor width and at least one small diameter via.

Abstract: The invention relates to a method of manufacturing a composite laminate, preferably a cross-ply laminate, in which process unidirectionally oriented (UD) fibres (3) are provided with matrix material (7) and, together with a pre-formed non-flowing UD composite or cross-ply laminate, passed through a laminating zone (13) in layers of at least two different orientational directions. More particularly, the invention relates to the manufacture of composite material which is pre-eminently suited to be used as a supporting substrate for printed wire boards. The method according to the invention is directed in particular to the utilisation of a double belt press, both for making the preformed non-flowing UD composite and for the manufacture of the final laminate. The invention also comprises printed wire board (PWBs) and multilayer PWBs.

Abstract: The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.

Abstract: A package for mounting a semiconductor device to a circuit board. An insulating substrate is provided, which has at least one layer, and provides rigidity to the package. A plurality of electrically conductive contacts are disposed on the top surface of the substrate, receive the semiconductor device, and make electrical contact between the semiconductor device and the substrate. A plurality of electrically conductive through-holes are formed in the substrate, and extend from the top surface of the substrate to the bottom surface of the substrate. The through-holes make electrical connection between all of the layers of the substrate. Electrical interconnections between the contacts and the through-holes are provided by a plurality of electrically conductive traces. A z-conductive layer is attached to the bottom surface of the substrate.

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

Abstract: A metal base board comprising a metal plate, a circuit conductor section, and an insulating layer provided between the circuit conductor and the metal plate wherein the insulating layer comprises an organic insulating material with flaky inorganic fillers added therein and the flaky inorganic fillers are stacked in the insulating layer in a stratified state.

Abstract: The present invention relates to dielectric materials used in circuit board, radar and microwave applications and methods of making these materials. The dielectric materials of this invention are characterized by having a ground plane, at least two dielectric materials having different dielectric constants and a common conducting layer positioned over the dielectric materials.

Abstract: A high dielectric (K'.gtoreq.5), comparatively low thermal coefficient (absolute value of TCK'.ltoreq.200 ppm/.degree.C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.

Abstract: A printed circuit board having foamed substrates of low dielectric constant and low dissipation factor and techniques for making printed circuit boards and printed circuits using such substrates. The substrate has a dielectric constant less than 1.5 and a dissipation factor less than 10.sup.-2, most preferably, polymethylacrylimide. A conductive layer is placed on the substrate surface using chemical deposition or by use of appropriate adhesives. The printed circuit may be imprinted by conventional techniques such as etching with appropriate etching materials.

Abstract: A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film substrate is bent into a U-shape, laminated, and encapsulated with a resin. The package of the device is miniaturized.

Abstract: A heat-resistant, electrical insulating layer which is suitable for use as an insulating substrate in printed circuit boards and as an insulating film for semiconductor devices and which surpasses a polyimide-based insulating layer with respect to heat resisting properties, dielectric properties, and water absorption. The insulating layer comprises a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst. The starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent. The crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents.

Abstract: A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).

Abstract: A flexible circuit board device for connecting to an electronic device comprised of a flexible circuit board made from flexible resistive film, an adhesive layer formed on the flexible resistive film, electrical conductive circuits formed on the adhesive layer and cured films filling the gaps between the conductive circuits. The electrical conductive circuits are formed of conductor metal foil and a plating film covering the surface of the conductor.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.

Abstract: A semiconductor package applicable to integrated circuits and other semiconductor devices of the kind needing high integration and high speed operation. The package has a printed circuit board implemented by a glass cloth impregnated with epoxy, bismaleimide-triazine (BT) or similar resin, a power source layer provided in the circuit board in a plate structure, a ground layer formed on the surface of the circuit board in a plate structure, and a thin film laminate wiring formed on the ground layer in a plate structure and consisting of copper and benzocyclobutene. The package desirably shields leakage currents and matches a characteristic impedance with accuracy, thereby noticeably reducing noise and enhancing high speed signal transmission.

Abstract: A circuit sub-assembly as a mounting for an electronic component such as Josephson device, i.e., a superconducting element, comprises a ceramic insulating substrate, an oxygen-shielding barrier layer formed on the insulating substrate, and a circuit film of niobium, as a superconducting material formed on the barrier layer according to a desired pattern. The barrier layer prevents oxidation of the circuit layer by shielding it from oxygen present in the insulating substrate. Due to the barrier layer, the circuit film is scarcely subject to superconductivity-impairing oxidation. The circuit film is thus capable of high-speed electronic signal conduction.

Abstract: A circuit board resists shear stress caused by the unequal thermal coefficients of expansion of a mounted electronic component and a circuit board upon which it is mounted. The circuit board is defined by a support layer, a shear stress-relieving layer and a conductive layer. The shear stress-relieving layer comprises a layer of expanded polytetrafluoroethylene having a compressive modulus of less than 50,000 pounds per square inch.

Abstract: An electronic device, such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board, with which it is thermal expansion mismatched, by three or more localized rigid support elements. The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel that is held in place by a rigid plastic half-shell cover that is epoxy-bonded in place along its perimeter (edge).

Abstract: According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.

Abstract: A liquid crystal display device using a tape carrier packaged semiconductor device, which is designed to prevent a crack from developing in part of its resin mold. The semiconductor device is provided with a film-like substrate, a group of electrodes including a plurality of parallel electrodes, each of which is formed with its leading end conforming to one side of the film-like substrate and being elongated in the direction perpendicular to the one side thereof, a semiconductor chip mounted on the film-like substrate in such a manner that it abuts on the group of electrodes, located close to the one side thereof and connected via a wiring layer to the respective electrodes, and a resin mold for use in covering the semiconductor chip. Notches extending in the direction of the parallel electrodes are cut in the film-like substrate beneath the group of electrodes and wherein the leading and trailing ends of each electrode serves to link the electrode and the film-like substrate.

Abstract: A system and method for providing a controlled impedance flex circuit includes providing an insulative flexible substrate having opposed first and second surfaces and having through holes extending from the first surface to the second surface. A pattern of conductive traces is formed on the first surface of the flexible substrate. A film of conductive adhesive is applied to the second surface and to the through holes. The through holes are aligned to contact ground traces in the pattern of conductive traces on the first surface. Thus, a ground plane is established for creating an environment for high frequency signal propagation. The conductive adhesive may be a b-stage epoxy or a thermoplastic material. In the preferred embodiment, a tape automated bonding frame is fabricated.

Abstract: A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circuitized substrate being secured thereto.

Abstract: A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

Abstract: A printed circuit board on the rear of an automotive instrument cluster is covered by a flat panel of polystyrene in contact with the circuit board to protect circuit components against electrostatic discharge. Openings in the panel allow large components which are not sensitive to ESD to protrude beyond the panel.

Abstract: Disclosed herein is a flexible wiring cable being provided on its forward end with a connecting portion to be connected with a connector, which comprises a base film, a wiring conductor provided on the base film, a dielectric member electrically connected with the wiring conductor in the connecting portion of the base film, and a ground electrode electrically connected with the dielectric member for forming a capacitor with the wiring conductor.

Abstract: A low-profile printed circuit board has discrete components mounted within openings provided in a rigid substrate forming art of the board. The components are mounted with leads soldered to mounting pads on the surface of the board, and arranged around the periphery of the openings. The stand-off design of discrete components for mounting to the surfaces of boards allows such components to be mounted within openings simply by reversing the orientation of the components relative to the board. In a preferred embodiment a DRAM card is a four-level board with circuitry on each side of a thin, flexible substrate and each side of a rigid substrate, the two substrates spaced apart by a thin, insulating layer. The rigid substrate has openings with DRAM modules mounted within the openings, and further modules are mounted on the opposite surface in the conventional manner.

Abstract: A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.

Abstract: Enhanced thermal and electrical properties of ceramic for high-power integrating substrates are provided by focused thermal energy sources such as by laser processing. A thin ceramic layer, such as alumina, is plasma spray deposited on a relative thick metal substrate, such as copper or alloy thereof, as a heat sink for improved dielectric and thermal properties which are produced by laser-reflow and recrystallization so as to convert and provide a different ceramic of higher dielectric and denser structure. Laser-reflow and recrystallization causes a purification or purging and conversion process that vaporizes deleterious impurities and changes the crystalline structure while densifying the resulting structure of the ceramic layer. After conversion of the ceramic layer a metal coating may be plasma spray deposited thereon and electrical circuit elements and wiring patterns may be formed thereon by laser etching for high power applications, such as heat-sinks, electronic control modules, or heating panels.

Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof.

Abstract: A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as tungsten (W) on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the conductive material layers. Thick film conductor layers are formed on the copper-plated layers, to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

Abstract: The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in opposition to and connected to each other, the wiring pattern 2 is connected to the projection electrodes 5 while penetrated through an adhesive and thermosetting thin film member 3 covering the wiring pattern 2; and the integrated circuit 4 is held onto the circuit substrate 1 by a hardening force of the adhesive and thermosetting thin film member 3.

Abstract: A high dielectric constant (K'.gtoreq.4), low thermal coefficient of dielectric constant (TCK'.ltoreq.150 ppm/.degree. C.) electrical substrate material comprises a fluoropolymer (preferably PTFE) filled with particulate ceramic material (powder) which exhibits low loss, comparatively high K' and acceptable TCK'. Examples of such ceramic powders include "class 1" capacitor ceramics. In accordance with an important feature of this invention, it has been discovered that it is insufficient to use only a low TCK' filler (e.g., class 1 capacitor ceramic powder) in the fluoropolymeric binder in order to achieve the desired TCK'. Instead, it has been discovered that the coefficient of thermal expansion (CTE) of the composite must also be sufficiently low (e.g.,.ltoreq.35 ppm/.degree. C.) to result in a composite which consistently maintains a low TCK'. This low CTE is achieved by adding one or more additional particulate ceramic fillers.

Abstract: An array of dielectric vias formed in the insulating layers of a unitized multilayer circuit structure wherein the dielectric vias have a dielectric constant different from the dielectric constant of the insulating layers in which they are formed.

Abstract: Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.

Abstract: A method of manufacturing a printed wiring board is disclosed. The method comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, coating a shield layer on at least a part of the insulating layer, and forming the shield layer by a halftone dot.

Abstract: Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Abstract: A base board for a printed circuit board panel which permits easy inspection of a printed circuit by means of a fluorescence-applied circuit pattern inspection machine used for the inspection of printed circuit patterns and which is not altered in the properties as a printed circuit board, the base board having an insulating layer containing 5.0 to 0.

Abstract: Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

Abstract: A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.