With Particular Conductive Material Or Coating Patents (Class 361/751)
  • Patent number: 11166384
    Abstract: A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 ?m using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 ?m, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: November 2, 2021
    Inventors: Karsten Bruening, Jun Amano
  • Patent number: 11147164
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 12, 2021
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Patent number: 11133262
    Abstract: Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: September 28, 2021
    Inventors: Ji Ah Min, Ye Chung Chung
  • Patent number: 11032650
    Abstract: A display apparatus includes a display module including a display panel configured to display an image and a sound generating module on a rear surface of the display panel, the sound generating module includes a vibration generating device, a circuit board on a lower surface of the vibration generating device, a first adhesive member between the circuit board and the vibration generating device, and a second adhesive member between the vibration generating device and the display panel, an elastic modulus of the second adhesive member differing from an elastic modulus of the first adhesive member.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: June 8, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Kyounghwan Kim, MinHo Sohn, KiDuk Kim, Sung-Jin Kang, Jeonggoo Kang, JaiHyuk Lee
  • Patent number: 10978679
    Abstract: A method of manufacturing a composite film layer applicable to a flexible display panel includes providing a transparent substrate film; forming a deformed state of the transparent substrate film by applying a predetermined degree of tensile stress to the transparent substrate film; forming a hardened layer on the transparent substrate film in the deformed state; and releasing the tensile stress from the transparent substrate film in the deformed state to enable a molecular chain in the hardened layer to contract.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: April 13, 2021
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Chen Zhao
  • Patent number: 10925170
    Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: February 16, 2021
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yuki Ori, Hideta Arai, Atsushi Miki, Ryo Fukuchi
  • Patent number: 10803284
    Abstract: Provided are a display panel and a display device. The display panel includes a display assembly, the display assembly includes an array substrate and a plurality of pixel units disposed on the array substrate; and a fingerprint recognition assembly, the fingerprint recognition assembly disposed on one side of the array substrate facing away from the plurality of pixel units, the fingerprint recognition assembly includes a first substrate and at least one fingerprint recognition unit disposed on the first substrate, the fingerprint recognition unit includes a photosensitive region. The array substrate includes a plurality of transparent regions and a plurality of non-transparent regions. Along a direction perpendicular to the array substrate, at least a portion of the plurality of transparent regions in the array substrate is covered by a photosensitive region of any one of the at least one fingerprint recognition units.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: October 13, 2020
    Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Yang Zeng, Lihua Wang, Haochi Yu, Qing Zhang, Lingxiao Du
  • Patent number: 10487177
    Abstract: Polyamic acid polymers with varying ratios of rigid monomers and solubilizing monomers exhibiting improved thermo-oxidative stability.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: November 26, 2019
    Assignee: Tetramer Technologies, Inc.
    Inventors: Adam T. Haldeman, Tyler L. Duniho, Brad P. Morgan, Margaret Shaughnessy, Kyle A. Berger, Jeffrey R. DiMaio
  • Patent number: 10133387
    Abstract: The present invention is directed to an integrated cable module for force sensors adaptable to a pressure-sensitive touch panel. The module includes an integrated cable and a cable frame. Specifically, the integrated cable has signal lines for transferring sense signals of the force sensors. The integrated cable has a number of branches, and an assembling part that assembles the branches. The cable frame has an opening window, and has a groove used for placing the integrated cable.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: November 20, 2018
    Assignee: TPK Touch Solutions Inc.
    Inventors: Hsienhsien Kuo, Fushen Chen
  • Patent number: 9660686
    Abstract: A display unit cabinet has a signal conductor through hole through which a flexible substrate for touch panel and a flexible substrate for liquid crystal that function as signal conductors run in a curved manner such that their ends extend toward a main substrate unit. A portion of a reinforcing sheet metal surrounding a peripheral edge of the signal conductor through hole is bent toward the backside, thereby forming a yet-to-be filled recess. The peripheral edge of the opening is covered with a resin material which is injected to fill the recess during insert molding. The front surface of the reinforcing sheet metal is made continuous with the front surface of the resin material with which the recess is filled.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: May 23, 2017
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yoshiyuki Yamaguchi
  • Patent number: 9607306
    Abstract: A method and apparatus for identification of a counterfeit electronic component, subjecting a suspected counterfeit electronic to an analytical method of ambient surface analysis to desorb and ionize compounds directly from a suspected counterfeit electronic surface with no pretreatment, detecting the resultant ions, comparing the identified ions to known standards, and returning a confidence that the suspected counterfeit electronic being analyzed is counterfeit.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: March 28, 2017
    Assignee: Indiana University Research and Technology Corporation
    Inventors: Gary M. Hieftje, Steven J. Ray, Kevin P. Pfeuffer, Jacob T. Shelley, Norris J. Caldwell
  • Patent number: 9391039
    Abstract: A solder ball and a semiconductor device using the same are provided. In a Sn-based solder ball in which a first plating layer and a second plating layer are sequentially formed on a core ball, the second plating layer includes a Sn—Ag—Cu alloy, and Ag3Sn intermetallic compound (IMC) nanoparticles or Ag—Sn compound nanoparticles exist in the second plating layer. The solder balls have high sphericity and stand-off characteristics and connection reliability so that a semiconductor device having a high degree of integration may be implemented.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 12, 2016
    Assignee: MK Electron Co., Ltd.
    Inventors: Jeong Tak Moon, Jae Yeol Son, Santosh Kumar, Eung Jae Kim, Hui Joong Kim, Ho Gun Cha
  • Patent number: 9326382
    Abstract: Provided is a bent printed circuit board for a backlight unit, including: a metal plate including a first part, a second part extending from the first part, and a bending part formed between the first part and the second part; an insulating layer on the metal plate; and through holes passing through at least one of the metal plate and the insulating layer and placed on the bending part.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: April 26, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Hyun Gyu Park
  • Patent number: 9036359
    Abstract: A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: May 19, 2015
    Inventors: Nozomu Nishimura, Nobuhiro Mikami
  • Patent number: 9036358
    Abstract: A transparent substrate including a transmissive electrode area including a plurality of wiring line portions arranged side by side on a substrate formed of a transparent material, a width of each of the wiring line portions being set in accordance with a current to flow through the wiring line portion; and a non-transmissive electrode area disposed on the substrate, the non-transmissive electrode being connected to the wiring line portions of the transmissive electrode area.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: May 19, 2015
    Assignees: Sony Corporation, Sony Mobile Communications AB
    Inventors: Hideaki Shoji, Atsushi Takei
  • Patent number: 9036366
    Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 19, 2015
    Inventors: Shunjiro Takemori, Shigeru Narakino
  • Publication number: 20150131240
    Abstract: The invention concerns a method for production of electronic assembly (1) with 1.1 Supply of an electrically-conducting film (3), especially a support film (3a), 1.2 Supply of at least one electrical component (5) with at least one electrical contact site (5c), 1.3 Application of an adhesive (20) between the electrical component and a surface (30) of the electrically-conducting film, 1.4 Arrangement of the at least one component (5) with the at least one electrical contact site (5c) on the surface (30) of the electrically-conducting film (3) and fastening of the at least one component by formation of an adhesive joint between the electrical component and the surface, 1.5 Supply of the support (9), especially from a flexible material, 1.
    Type: Application
    Filed: May 22, 2012
    Publication date: May 14, 2015
    Applicant: Würth Elektronik Gmbh &Co. KG
    Inventor: Jan Kostelnik
  • Patent number: 9023691
    Abstract: A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. An encapsulation separates respective pairs of coupled first and second connectors from one another and may encapsulate the microelectronic element and fill spaces between the support elements. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: May 5, 2015
    Assignee: Invensas Corporation
    Inventors: Ilyas Mohammed, Belgacem Haba
  • Patent number: 9013885
    Abstract: A method of manufacture of a foldable electrical connector-housing system includes: providing a first end panel having an outer first end panel side with first end panel contacts that substantially span from one edge of the outer first end panel side to an opposite edge of the outer first end panel side; providing a second end panel having an outer second end panel side, the second end panel and the first end panel with the outer second end panel side facing away from the outer first end panel side and the first end panel contacts exposed in a folded configuration; mounting an electronic component between the outer first end panel side and the outer second end panel side; and connecting a conductor to the first end panel contacts and the electronic component.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: April 21, 2015
    Assignee: ClevX, LLC
    Inventors: Simon B. Johnson, Lev M. Bolotin
  • Patent number: 9001517
    Abstract: A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: April 7, 2015
    Assignee: SNU R&DB Foundation
    Inventors: Yongtaek Hong, Sangwoo Kim
  • Publication number: 20150077953
    Abstract: A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa.
    Type: Application
    Filed: July 1, 2014
    Publication date: March 19, 2015
    Inventors: Jun NAMKUNG, Soon-Ryong PARK, Ju-Yeop SEONG, Jung-Ho SO, Eun-Yong JEON, Seok-Gi BAEK, Kwang-Hyeok KIM, Chul-Woo JEONG
  • Publication number: 20150077952
    Abstract: A display device and a manufacturing method thereof. The display device includes a substrate including at least one plastic layer; and a display layer on the substrate and including a plurality of signal lines and a plurality of pixels. The substrate includes at least one antistatic layer.
    Type: Application
    Filed: April 14, 2014
    Publication date: March 19, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hwa-Jeong Kim
  • Patent number: 8973258
    Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: March 10, 2015
    Assignee: Subtron Technology Co., Ltd.
    Inventor: Ching-Sheng Chen
  • Publication number: 20150009638
    Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 8, 2015
    Applicant: Atotech Deutschland GmbH
    Inventor: Boris Alexander Janssen
  • Publication number: 20150009637
    Abstract: A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
    Type: Application
    Filed: June 30, 2014
    Publication date: January 8, 2015
    Inventor: Toshiyuki KAWAGUCHI
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Patent number: 8913395
    Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Scott Myers, Mattia Pascolini, Richard Dinh, Trent Weber, Robert Schlub, Josh Nickel, Robert Hill, Nanbo Jin, Tang Tan
  • Patent number: 8912450
    Abstract: A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
  • Publication number: 20140355229
    Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.
    Type: Application
    Filed: November 11, 2013
    Publication date: December 4, 2014
    Inventors: Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
  • Patent number: 8879276
    Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 4, 2014
    Assignee: Power Gold LLC
    Inventor: James Jen-Ho Wang
  • Patent number: 8877565
    Abstract: A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: November 4, 2014
    Assignee: Intel Corporation
    Inventors: Yonggang Li, Islam Salama, Charan Gurumurthy
  • Patent number: 8867231
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger
  • Patent number: 8853547
    Abstract: A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the carrier foil (1), and several soldering surfaces (2) arranged on a bonding side (12) of the carrier foil (1) opposite the solder side. The soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) is inseparably connected to the carrier foil (1) on the solder side thereof.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: October 7, 2014
    Assignees: Conti Temic microelectronic GmbH, Carl Freudenberg KG
    Inventors: Andreas Voegerl, Tilo Liebl, Gerhard Bauer, Marion Gebhardt, Alexander Wenk, Matthias Wieczorek, Juergen Henniger, Karl-Heinz Baumann
  • Patent number: 8847079
    Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: September 30, 2014
    Assignee: International Business Machines Corporation
    Inventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre
  • Patent number: 8832929
    Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Ho Lee, Se Min Oh, Chang Hwan Choi, Choon Keun Lee, Jeong Yeol Moon, Jong Rip Kim
  • Publication number: 20140254114
    Abstract: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes <100> in a surface of the metal foil.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Inventors: Koichi HATTORI, Keiichi KIMURA, Naoya KUWASAKI
  • Patent number: 8824162
    Abstract: Electronic devices may have housings in which components are mounted. Some of the components may be sensitive to moisture. Other components may be insensitive to moisture and may form openings in a device housing that allow moisture to escape from within the housing. Components may be mounted on substrates such as printed circuit board substrates. Moisture repelling layers and moisture attracting layers may be patterned to form channels and other structures that guide moisture away from sensitive components towards insensitive components. Moisture repelling and attracting layers may also be used to limit the lateral spread of a conformal coating layer when coating components.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: September 2, 2014
    Assignee: Apple Inc.
    Inventors: Felix Alvarez, Kyle H. Yeates
  • Patent number: 8824150
    Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JungYoul Kang, SeongHun Kim
  • Patent number: 8802998
    Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: August 12, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiko Okada, Osamu Chikagawa, Hidekiyo Takaoka, Shodo Takei
  • Patent number: 8804350
    Abstract: Disclosed is a control device for use in woven article, which includes a conductive fabric that includes conductive warps, conductive wefts, and insulation warps, which are arranged so as to form a plurality of conduction sites; a first woven flat cable, which includes a plurality of conductor lines, the first woven flat cable being set to overlap the conductive fabric, two of the conductor lines being electrically and respectively connected to the conductive warp and the conductive weft of one of the conduction sites; and a processor unit, to which the conductor lines of the first woven flat cable is electrically connected.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 12, 2014
    Assignee: King's Metal Fiber Technologies Co., Ltd.
    Inventors: Hong-Hsu Huang, I-Chen Su, Shun-Tung Yang
  • Publication number: 20140218875
    Abstract: An aqueous polyimide precursor solution composition, in which a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.
    Type: Application
    Filed: September 6, 2012
    Publication date: August 7, 2014
    Applicant: C/O UBE INDUSTRIES, LTD.
    Inventors: Takeshige Nakayama, Susumu Takasaki, Tomonori Nakayama, Kensuke Hiroshige
  • Publication number: 20140198466
    Abstract: An improved multi-functional flexible printed circuit (FPC) assembly 142 is provided for use in an electronic communications device 100. The FPC assembly 142 can comprise a curved FPC 144 a flexible substrate 156 and components thereon and can be positioned against a portion of an interior surface 137 of the housing 106 so as to share common wall surfaces for improved volumetric space utilization. The FPC assembly 142 can have a curved contour which matches a curvature of the curved housing 106. The components can include flexible metal conductors 158, multiple antennas 160 and 162, speaker felt 150 and/or a seal or gasket 146.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Inventors: Michael J. Sawadski, Jacob D. Wilson, Jason P. Wojack
  • Patent number: 8779296
    Abstract: A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: July 15, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiromitsu Katsui, Kenichi Kitoh, Wataru Nakamura
  • Patent number: 8780568
    Abstract: A flexible display device comprises a device substrate and a flexible circuit substrate, and achieves high reliability of electrical connection. The device substrate includes a flexible substrate, a display unit and a first terminal part. The flexible circuit substrate includes a second terminal part. An ACF including conductive particles connects the first and second terminal parts. Each conductive particle consists of a core part covered by a metal layer. An electrode layer and a cushioning layer are provided between the flexible substrate and the first terminal part. A quotient of a sum of a product of average particle diameter and elastic modulus for the core part, and a product of double average thickness and elastic modulus for the metal layer, divided by a sum of products of average thickness and elastic modulus for the first terminal part, the cushioning layer and the electrode layer, is no greater than 1.5.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 15, 2014
    Assignee: Panasonic Corporation
    Inventors: Takashi Osako, Yuji Tanaka
  • Patent number: 8759677
    Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Patent number: 8759884
    Abstract: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: June 24, 2014
    Assignees: Nederlandse Organisatie voor toegepast—natuurwetenschappelijk onderzoek TNO, Koninklijke Philips Electronics N.V.
    Inventors: Jeroen van den Brand, Andreas Heinrich Dietzel, Edward Willem Albert Young, Herbert Lifka, Erik Dekempeneer
  • Patent number: 8742260
    Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: June 3, 2014
    Assignee: NEC Corporation
    Inventor: Junya Sato
  • Patent number: 8737085
    Abstract: Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: May 27, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Kenji Sasaoka
  • Publication number: 20140140021
    Abstract: An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 22, 2014
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Gregory N. Stephens, Michael B. Wittenberg
  • Patent number: 8693202
    Abstract: A flexible printed circuit includes a first flexible film; a first interconnection layer on the first flexible film, wherein the first interconnection layer includes a first end portion to be connected to a first electrode of a touchscreen, and a second end portion; a second flexible film; a second interconnection layer on the second flexible film, wherein the second interconnection layer includes a first end portion to be connected to a second electrode of the touchscreen, and a second portion; an adhesive layer that bonds the first flexible film and the second flexible film; a first cover film on the first interconnection layer with the first and second end portions of the first interconnection layer being exposed; and a second cover film on the second interconnection layer with the first and second end portions of the second interconnection layer being exposed.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 8, 2014
    Assignee: Fujitsu Component Limited
    Inventor: Kazuyuki Yoshifusa