Abstract: A second output wiring and a third output wiring enter into a chip mounting portion while coming across a second side and a third side of the chip mounting portion. The other end portions of the second output wiring and the third output wiring enter into the chip mounting portion are bent toward a fourth side of the chip mounting portion, and are connected to an output pad and an output pad provided along a fourth side of the semiconductor chip. An input wiring extends along the fourth side of the chip mounting portion, is bent from a midstream to enter into the chip mounting portion while coming across the fourth side of the chip mounting portion, and is connected to an input pad provided along the fourth side of the semiconductor chip.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. The flex circuit can include a solder flow barrier to constrain flow of solder. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss.

Abstract: The present invention provides a flexible conductive crosslinked body excellent in durability having a small influence of a reaction residue after the crosslinking on an object to which the conductive crosslinked body adheres, and a production process of the flexible conductive crosslinked body. The conductive crosslinked body is synthesized from a conductive composition containing a rubber polymer, an organic metal compound, and a conducting agent and has a crosslinked structure. The production process of the conductive crosslinked body includes: a mixed solution preparing step for preparing a mixed solution in which the rubber polymer, the conducting agent, and the organic metal compound are mixed in a solvent capable of dissolving the rubber polymer and capable of chelating the organic metal compound; and a crosslinking step for removing the solvent from the mixed solution to allow a crosslinking reaction to proceed.

Abstract: An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.

Abstract: Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.

Abstract: A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.

Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).

Abstract: Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip-scale packages and assemblies are also disclosed.

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract: An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The impedence comprises passives such as resistors, capacitors, diodes or inductors which modify the performance of the package for new semiconductor device characteristics. The impedences may have positive or negative temperature coefficients and are in close thermal communication with the semiconductor die.

Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent.

Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Abstract: A flexible printed circuit board (PCB) for a light emitting diode backlight unit includes a flexible base film; a plurality of metal lines on a first surface of the flexible base film; a cover layer on the metal lines and covering a center portion of the first surface of the flexible base film; a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film; a metal pattern on a second surface of the flexible base film and including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; and a second gold-plating pattern on the metal pattern and including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns, wherein a first groove between a first double-layered pattern of the first sub-pattern and

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: A flexible circuit includes a sprocket opening and electrically conductive lines connected to a print head.

Abstract: A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.

Abstract: The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.

Abstract: Two bezels (BZ1, BZ2) which constitute a housing unit (UT) comprise a FPC board (PB1) for a panel and an FPC board (PB2) for an LED. The FPC hoard (PB1) for a panel and the FPC board (PB2) for an LED are connected to each other through a solder (11). An exposure opening (HL) through which the solder (11) is exposed from the inside of the housing unit (UT) to the outside thereof is formed in the portion (e.g., the rear bezel (BZ2)) of the housing unit (UT) that is located in front of the solder (11).

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A circuit board comprises a center segment distributing power and low-speed signaling, and outer segments for high-speed signaling. The segments use dielectric materials with different dielectric constants, with the outer segments supporting higher-speed signal transmission.

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract: A conductive fabric is provided. The conductive fabric comprises a base layer composed of a synthetic, regenerated or natural fiber, a conductive layer formed on the base layer to be capable of being freely formed by a pre-designed electric pattern, and an insulating layer formed on the conductive layer to protect the conductive layer from damage.

Abstract: A liquid crystal display module includes a liquid crystal display panel and a backlight unit under the liquid crystal display panel. The backlight unit includes at least one light emitting diode. The liquid crystal display module further comprises a bottom frame surrounding the backlight unit. The bottom frame comprises a printed circuit board and the at least one light emitting diode is disposed on the printed circuit board. The liquid crystal display module also includes a main frame surrounding the liquid crystal display panel and a top frame surrounding a front edge of the liquid crystal display panel and combined with the bottom frame through the main frame.

Abstract: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

Abstract: An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.

Abstract: An exemplary flexible printed circuit board (2) includes a substrate (221), a plurality of connecting fingers (225, 227) and at least one alignment mark (229). The connecting fingers and the at least one alignment mark are located on a surface of the substrate. The at least one alignment mark is disposed between two of the connecting fingers.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

Abstract: Provided is a process for producing a glass plate with a conductive printed wire, which does not require a screen plate for each model, facilitates adjustments for desired heat generation performance or antenna performance, has an excellent adhesion to a glass plate surface, and minimizes surface roughness. The process for producing a glass plate with a conductive printed wire is characterized in that a laminate comprising a layer obtained by electro printing a first conductive toner having a number standard average particle size (D50) of 10 ?m<D50?50 ?m and a layer obtained by electro printing a second conductive toner having a particle size (D50) of 5 ?m?D50?10 ?m is formed on a surface of a glass plate and the glass plate is heated to fire the toners to thereby form a conductive printed wire having a predetermined pattern on the surface of the glass plate.

Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: Disclosed are thick film silver compositions comprised of silver flake and organic medium useful in radio frequency identification devices (RFID). The invention is further directed to method(s) of antenna formation using RFID circuits or other circuits using polymer thick film (PTF).

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract: The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.

Abstract: Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.

Abstract: An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such as IC chips and LSI chips. The flexible printed wiring board of the present invention includes an insulating layer; a wiring pattern formed of a plurality of wirings being juxtaposed, which wiring pattern is formed through patterning a conductor layer stacked on at least one surface of the insulating layer and on which wiring pattern a semiconductor chip is to be mounted; and grid-like dummy patterns formed in a blank area where the wiring pattern is not provided, wherein the dummy patterns are formed in a width direction generally symmetrically with respect to the longitudinal direction of the flexible printed wiring board.

Abstract: In order to prevent stress caused by bending a flexible wiring board from being applied to the connection section between the flexible wiring board and a driving IC, solder is deposited as a reinforcement member, on both sides of the driving IC connected onto the flexible wiring board.

Abstract: Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

Abstract: The disclosure relates to a signal transmitting apparatus. The signal transmitting apparatus includes a conductor, a first and a second circuit boards, and a signal transmitting medium that is electrically interconnected between the first circuit board and the second circuit board. The signal transmitting medium includes a ground wire and an insulating layer wrapping the ground wire, wherein at least an end portion of the ground wire is not wrapped by the insulating layer and is bent to overlap the insulating layer and electrically connected to the conductor via a conductive adhesive material so as to conduct the electrostatic charges accumulated in the signal transmitting medium to the conductor as a ground.

Abstract: Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses.

Abstract: An electronic device (1) has a base plate (2) and an electronics housing (3) connected thereto, with a bonding contact terminal (5). The latter is supported relative to the base plate (2) via a supporting body (6) in such a manner that the supporting body (6) exerts a pre-stressing force onto the bonding contact terminal (5). Due to this support of the bonding contact terminal (5), its position is well defined during the bonding procedure. A secure bond is the result.

Abstract: An image display apparatus of the present invention has a display panel which has a plurality of wirings and a plurality of display devices connected to the plurality of wirings, a control circuit substrate which outputs a control signal, a flexible printed circuit board which has a flexible substrate and wirings formed on the flexible substrate and electrically connects the display panel and the control circuit substrate, and a conductive cover which covers the flexible printed circuit board from a portion connected to the control circuit substrate to a portion connected to the display panel and is connected to the control circuit substrate.

Abstract: A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with an upper top electrode (9); the substrate (2) is comprised of a printed circuit board (2) known per se and including an insulation-material base body (3) and a metal coating as the conductor layer (5), wherein the conductor layer (5) forms the base electrode (4) and, to this end, is smoothed at least on the location of the thin-film component (8), and wherein a contact layer (18) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer (5) and the superimposed thin-film layers (21) of the thin-film component (8), which contact layer is physically or chemically adsorbed on the surface of the base electrode (4).

Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 ?m. The reason is as follows. If the diameter of the mesh hole is less than 75 ?m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 ?m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 ?m. The reason is as follows. If the distance is less than 100 ?m, the solid layer cannot function. If the distance exceeds 2000 ?m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract: An electronic component includes conductive pattern (2) on insulating substrate (1), a metal film formed by a plating method on a surface of conductive pattern (2), and metal oxide layer (3) formed by oxidizing the metal film on the surface of conductive pattern (2). This structure allows forming a thin and uniform insulating film on conductive pattern (2), so that the highly reliable electric component is obtainable although its conductive pattern (2) has a high aspect ratio.

Abstract: An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board.

Abstract: A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.