Abstract: A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.

Abstract: A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.

Abstract: An electrical power distribution unit (1) for an electrical system has a printed circuit board (200) with a punched grid (100) arranged thereon. An electrical component (300, 310) is arranged on the printed circuit board on a side of the punched grid (100). An electrical contact (350) of the electrical component projects through a passage opening in the printed circuit board. The punched grid is arranged between the electrical component and the printed circuit board, and an opening is formed in the punched grid in an area (130) around the electrical contact. The punched grid has a current infeed (110) which comprises a plurality of tongues (111, 112; 113). At least one of the tongues is bendable out of a plane of the punched grid in such a way that two of the tongues form a mutually adjacent common portion (115), which is electrically contactable by an electrical plug connector.

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.

Abstract: A display apparatus includes a display panel and a chassis base for supporting the display panel. The chassis base has a plurality of metallic plates on a common plane and an electrically insulating connector between edges of a pair of adjacent metallic plates.

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract: A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card.

Abstract: An inverter apparatus is composed of an insulated metal substrate, a conductive stud, a printed circuit board, a conductive spacer, and a bus bar. An inverter output stage is mounted on the insulated metal substrate. The conductive stud is coupled to a main surface of the insulated metal substrate, and electrically connected with the inverter output stage. The printed circuit board is supported by the stud. The stud is coupled on the rear surface of the printed circuit board. Provided on the main surface of the printed circuit board is a circuit connected to the inverter output stage. The conductive spacer is coupled on the main surface of the printed circuit board, and electrically connected with the stud. The bus bar is coupled to the spacer.

Abstract: A meter spacer unit includes a dial spacer, a lateral spacer flexibly connected to the dial spacer by a joint, and a rear connecting member flexibly connected to the lateral spacer by a joint. The lateral spacer includes a connection member adapted to connect to a printed circuit board.

Abstract: An electronic device structure includes an upper case, a lower case, a main board, a suspending member, and a fixing member. The upper case and the lower case respectively have an upper combining column and a lower combining column. The main board has a through hole, the upper combining column passes through the through hole, and a size of the through hole is larger than a size of the upper combining column, such that a moving gap is kept between the upper combining column and the through hole. The suspending member is combined with a side of the main board and spaced with the main board by a suspending distance. The fixing member passes through the lower combining column and the suspending member and is fixed on the upper combining column, such that the main board is disposed on the lower combining column through the suspending member.

Abstract: A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system.

Abstract: A method for mounting multiple small RFID chips onto larger antenna. The chips are mechanically aligned with an interdigitated gap at the feed point of the antenna by electrostatic or magnetic techniques. In an alternate embodiment RF field coupling between the chips and the antenna is employed.

Abstract: A guide module is provided for connecting a primary circuit board and a secondary circuit board to a common backplane circuit board. The primary and secondary boards are in a tiered arrangement with both the primary and secondary circuit boards having interface connections on the backplane circuit board. The guide module includes a body having a height between opposite top and bottom surfaces. The height of the body establishes a stack height between the primary and secondary boards. Locating elements are formed on the top and bottom surfaces to locate and align the primary and secondary boards with respect to one another.

Abstract: An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.

Abstract: There is disclosed a base member for holding, without screws, a printed circuit board having conductive traces and electronic components and which can fit into an electric outlet box. The base member has walls which define a cavity where at least one wall of the cavity has a rib, the top of which functions as a stop for the printed circuit board. A cap having snap features adapted to engage the walls of the cavity restricts removal of the printed circuit board when snapped into position on top of the printed circuit board. The cap conceals the electronics on the printed circuit board and has at least one rib on its bottom surface to apply pressure to the printed circuit board assembly to help hold it in place. An aperture in the cap provides access to a pin header which is electrically connected to the printed circuit board. A screw terminal block is provided to connect the terminals on the pin header to a sensor.

Abstract: An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.

Abstract: A method for making a multipackage module that has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die.

Abstract: There is provided a control apparatus capable of simply supporting/fixing a board by a board support, reducing a number of integrating steps, reducing cost and downsizing a board size. In a control apparatus constituted by attaching a board to a board support provided at a base attachably and detachably, the board support is constituted by a resin, and includes a guide having a section in an L-like shape provided at one side end portion of the board support, a hook having a section in an L-like shape provided at other side end portion of the board support, and a board mounting portion provided between the guide and the hook for supporting a lower face of the board. The guide includes an engaging portion engaged with one side end portion of the board mounted to the board mounting portion at an upper portion thereof.

Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

Abstract: An electronic ballast provides a ballast housing including a circuit board electrically and mechanically connected to the ballast housing by an electrically conductive spacer. The circuit board includes a ground electrode surrounding a clearance hole through which an electrically conductive fastener is inserted into a fastener hole located in the spacer. An insulating filler is disposed in the ballast housing between the housing interior surface and the circuit board. A lighting fixture including an electronic ballast is also provided.

Abstract: Embodiments of the present invention provide a fastening support assembly configured to securely connect a first panel above a second panel. The fastening support assembly includes a shaft having a cap at a first end and a distal tip at a second end. The shaft defines an internal chamber. The distal tip is configured to secure to the first panel. A pin is positioned within the internal chamber, wherein movement of the pin into the internal chamber radially expands the shaft. A portion of the shaft and the pin proximate the cap are configured to substantially fill a hole formed through the second panel when the second panel is secured to the fastening support assembly.

Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract: A spacer or retainer secures two circuit boards in a back-to-back configuration. The spacer has opposite first and second sides, each having a peripheral rim against which the circuit boards fit. Each side is recessed to a depth enabling any component terminals or connections from rear surfaces of the circuit boards to be received in the recesses. Pins on ends of the spacer are received in apertures in the circuit boards to guide the circuit boards into position on the spacer. Two clips are positioned next to each other on one wall forming the peripheral rim. Each clip extends beyond an opposite side, and the clips have resilient tabs biased to press the circuit boards against the rims. The circuit boards are connected by electrical wire extending around an opposite wall of the peripheral rim. The spacer and circuit boards form a subassembly, such as for a vehicle instrument cluster.

Abstract: A spacing device for adapting electronic modules for insertion into a system is disclosed. In one embodiment, the spacing device includes a body and guide features configured to align the body with mating guide features of electronic modules. The spacing device also includes a coupling portion having coupling arms, which is configured to secure the electronic modules to the body.

Abstract: A stand-off having a flange and a projecting portion extending from the flange is integrated with a first substrate, for example, a printed circuit board (PCB), by forming a hole in the PCB, inserting the projecting portion of the stand-off through the hole, and attaching a second substrate to the first substrate with the flange therebetween. The flange can be at least partially received by a relief formed in one of the substrates or in an aperture in an adhesive layer between the two substrates. The stand-off can be further secured to the PCB using one or more of adhesives, interference fit techniques, snap-assembly features, and other applicable techniques. Alternatively, the stand-off can be attached to a substrate using a sliding snap feature or sliding interference fit. An attachable component can be attached to the projecting portion of the stand-off.

Abstract: A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die.

Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier-and connected thereto. The first ground region and the second ground region do not overlap with each other.

Abstract: A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system.

Abstract: The spacer is formed as an elastic member with no ends thereof, which is detachably attached, by exploiting its elastic deformation, onto a printed wiring board to which is fixed an electronic component having a component package, on one of whose surfaces connection terminals are arranged. Since the spacer is attached on the printed wiring board to enclose an electronic component so as to seal a gap formed between the electronic component and a printed wiring board, it is possible to prevent foreign objects entering the gap, so that failures, such as insufficient insulation, caused by such foreign objects are also prevented. Since the spacer is easily removed from the printed wiring board, it is recyclable and economical.

Abstract: A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate, has a ring structure, in which a plurality of holes are separated a predetermined distance from one another. The second substrate, coupling onto the second substrate by inserting the connector, has a circuit pattern, which is electrically connected to a circuit pattern formed on the first substrate using the plurality of holes formed on the connector. A multilayer substrate and a method for producing it in accordance with the present invention can shield the EMI generated by a high-speed switching element.

Abstract: An device including a fastener. In some embodiments, the device is an electronic device that includes a circuit board, a support structure, and a resilient conductive clip. The circuit board may include a slot extending between opposite faces. The resilient conductive clip may couple to the support structure and be removably inserted through the slot so that it is disposed at least partially about the opposite faces. The resilient conductive clip may include lower and upper grounding portions engaged against the opposite faces of the circuit board.

Abstract: A screw-less latching system for securing load boards comprises a frame and a backer plate. The frame includes a loading site for a device under test. The loading site includes a first tee clamp disposed along a first longitudinal axis and a second tee clamp disposed along a second longitudinal axis of the loading site. The loading site further includes a first spring plunger disposed along a first lateral axis of the loading site. The backer plate is configured to attach the device under test. The backer plate includes two lock tabs coupling with the first and second tee clamps. The backer plate further includes a first recess coupling with the first spring plunger.

Abstract: A connecting apparatus adapted in a board module is provided. The board module comprises a first board where the connecting apparatus is placed thereon and a second board. The connecting apparatus comprises a cylindrical main body with a bulge formed thereon and a rotary device. The rotary device comprises a rotary plate, a pivot passing through the main body and a protrusion placed near an edge of the rotary plate. When the protrusion fits with a recession of a curve trench of the bulge, the rotary plate is turned aside to cover part of the bulge, thus to connect the first board with the second board.

Abstract: A device for coupling a printed circuit board assembly to a computer chassis is described. The device may include a base. The device may include at least two posts. The posts may be located on opposite sides of the base. The posts may couple the device to the computer chassis. The device may include at least one prong. The prong may extend upward from the base. The prong may couple the device to the printed circuit board assembly.

Abstract: An electronic appliance to achieve an increased rigidity thereof with a simplified manner without any change in design and configuration and a method for manufacturing the same. The electronic appliance includes a case defining the outer appearance of the electronic appliance, and a printed circuit board disposed in the case and having electronic elements mounted thereon. A resin is filled between the case and the printed circuit board.

Abstract: An electrical junction box reduces the number of components to be contained in an electrical junction box and simplifies a structure of the box. The electrical junction box has a casing assembly including an upper casing and a lower casing. A laminated unit including bus bars and insulation plates is contained in the upper casing, while a first printed circuit board, a second printed circuit board and a spacer made of an insulation resin material are contained in the lower casing. The first printed circuit board is disposed on one side of the spacer, while the second printed circuit board is disposed on the other side of the spacer. Shorter size fixing bars and longer size fixing bars project from an inner surface on a top wall of the upper casing. The shorter size fixing bars penetrate the laminated unit, first printed circuit board and spacer.

Abstract: A frame bracket for a printed board assembly including a pair of long side parts having wall parts contacting a lower surface of a printed board assembly, a pair of short side parts forming a gap with the lower surface of the printed board assembly and extending substantially perpendicular to the long side parts, a first stud groove connecting a first long side part with a first short side part and accommodating a stud fixed on the chassis base, and a protrusion part protruding from an outer, lower surface of a long side part or a short side part to be inserted into an inserting part formed on the chassis base.

Abstract: An electronic control unit presenting: a printed circuit board, which supports an electric circuit, a plurality of electric/electronic components electrically connected to the electric circuit, and at least one connector electrically connected to the electrical circuit; a housing, which accommodates therein the printed circuit board and comprises a base which inferiorly supports the printed circuit board and a lid which superiorly closes the base; and at least one deformable, elastic, expanded blocking block, which is fixed to an internal surface of the lid near at least one electric/electronic component, presents a sufficient thickness so as to determine a vertical interference with the first electric/electronic component to be compressed between the lid and the first electric/electronic component, and presents a larger area than the first electric/electronic component to laterally encompass the first electric/electronic component.

Abstract: An optical module cage mounting structure is disclosed. In the module cage mounting structure, an optical module cage including a cage body with a box shape into which an optical module is inserted is mounted on a printed circuit board such that the cage body is spaced apart from a face of the printed circuit board.

Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded.

Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

Abstract: A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) have one end(s) and are brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) are brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42). Each support pin is held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin (42), held in the direction substantially perpendicular to the surface of the support table (27), is brought into contact with the bottom face of the circuit board (14), and thereby, the support pins support the circuit board (14).

Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Abstract: A positioning assembly is used for positioning a circuit board on a case. The circuit board shifts relative to a case along a integrate direction or a release direction. The positioning assembly includes a fixed member, a movable member, and a latching member. The latching member is disposed on a side surface of the circuit board, and the fixed member is disposed to the case, for the latching member to pass through in a single direction along a integrate direction, such that the latching member is stopped at one end of the fixed member, thereby positioning the circuit board case. The movable member makes the fixed member spread and deform, such that the latching member passes through the fixed member in an opposite direction along a release direction, so that the circuit board may fixed on or detached from the case.

Abstract: A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is installed at one end of the first circuit board and is electrically connected with the first circuit board so as to form a transmitting interface port. On a first surface of the second circuit board, there are a plurality of interface connecting points. On a second surface of the second circuit board, part of the second surface is hollowed out. A space formed between the hollowed out area and the corresponding first circuit board increases the area for circuit layouts and the mounting components for the first circuit board. Therefore, quantity of accommodated memory components may be increased so as to increase the total storage capacity of the memory card under limitation of small dimensions.

Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.

Abstract: A circuit board device comprises a first wiring board (79) having plural first electrode terminals (73, 75, 77) for connection row-arranged on a surface layer, a second wiring board (87) having plural second electrode terminals (81, 83, 85) for connection row-arranged on a surface layer, and an anisotropic conductive member (89) disposed therebetween to the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of each of the wiring boards (79, 87) has a step difference to divide and dispose the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of the anisotropic conductive member (89) corresponding to the step difference has a step shape that is capable of contacting with the step difference. A laminate comprising respective wiring boards (79, 87) and the anisotropic conductive member disposed therebetween is pressed and held in a lamination direction.