With Housing Or Chassis Patents (Class 361/752)
  • Patent number: 10687435
    Abstract: A configurable storage-system drawer may include (1) a chassis, (2) a slide assembly coupled to a side of the chassis that is configured to enable the chassis to be temporarily pulled out of a data-center rack, and (3) a passive drive-plane board housed within the chassis and configured to enable storage-system modules that differ between two or more storage-system configurations of the storage-system drawer to be interchanged. In some examples, the passive drive-plane board may include (1) storage-drive connectors that are each configured to detachably mate with a storage drive, (2) a storage-system-module connector configured to detachably mate with a storage-system module that includes one or more components necessary for one of the two or more storage-system configurations, and (3) electrical interconnects that electrically couple the storage-drive connectors to the storage-system-module connector.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: June 16, 2020
    Assignee: Facebook, Inc.
    Inventors: Jason David Adrian, Dominic Kai Yin Cheng, Austin Joel Cousineau
  • Patent number: 10681439
    Abstract: An electronic device is provided. The electronic device includes a housing including a first plate and at least one first opening; and a speaker structure spaced apart from the first plate and disposed in the housing, wherein the speaker structure includes a first structure which faces in a first direction, opposes the first plate, and forms a space connecting to the at least one first opening along with the first plate; a second opening formed by penetrating through a part of the first structure; at least one component disposed in the speaker structure and emitting heat; a thermal conducting member including a first portion disposed in the speaker structure and being in contact with the at least one component, and a second portion disposed in the second opening; and at least one speaker disposed in a direction different from the first direction.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: June 9, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jinwoo Kim, Sujin Jung, Youngjin Cho, Sungjin Park, Hyunmin Oh, Iksu Jung
  • Patent number: 10681826
    Abstract: Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: June 9, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hideaki Tahara, Kazuyoshi Ohara, Munsoku O, Arinobu Nakamura
  • Patent number: 10681824
    Abstract: A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 9, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Jian-Yi Hao, Yan-Lu Li, Xian-Qin Hu, Ming-Hua Du
  • Patent number: 10680210
    Abstract: A display apparatus may solve roughness and heat dissipation of a display panel. The display apparatus comprises a display panel which includes a first display portion and a second display portion bent from the first display portion, a support plate coupled to a rear surface of the first display portion, and a housing for receiving the support plate, the housing coupled with a rear surface of the second display portion.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 9, 2020
    Assignee: LG Display Co., Ltd.
    Inventor: Moonsun Lee
  • Patent number: 10670245
    Abstract: A light sensor assembly includes a sensor connector configured to be coupled to a receptacle connector mounted to a light fixture. The sensor connector includes a housing having a top and a bottom defining a mating interface configured to be mated to the receptacle connector. The housing has a sealed cavity including a first sensor component in the sealed cavity sensing an environmental characteristic exterior of the sensor connector. The sensor connector includes power contacts held by the housing and extending from the bottom for electrical connection with receptacle power contacts of the receptacle connector. The sensor connector includes a lid assembly at the top of the housing. The lid assembly has a lid defining an unsealed cavity allowing airflow through the unsealed cavity. The lid assembly has a second sensor component in the unsealed cavity sensing an environmental characteristic exterior of the sensor connector.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: June 2, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew Edward Mostoller, Justin Latorre, Christopher George Daily, Charles Raymond Gingrich, III
  • Patent number: 10674633
    Abstract: A plug assembly includes a lower cover, an upper cover mounted on the lower cover, and a circuit board. The upper cover is equipped with a heat-conducting element. The circuit board is mounted between the upper cover and the lower cover. The circuit board has two first contact portions contacting with the lower cover and the upper cover, and a plurality of second contact portions. The circuit board is equipped with a chip. The chip is mounted on and covers the plurality of the second contact portions. The chip contacts with the heat-conducting element. The circuit board opens at least one perforation. At least one of the lower cover and the upper cover protrudes towards the circuit board to form at least one fastening portion passing through the at least one perforation and contacting with the at least one of the upper cover and the lower cover.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: June 2, 2020
    Assignee: Nano Shield Technology Co., Ltd.
    Inventor: James Cheng Lee
  • Patent number: 10627090
    Abstract: A light sensor assembly includes a sensor connector having a housing including a top and a bottom with power contact channels in the bottom of the housing. The sensor connector includes a circuit board supported by the housing at the top having a sensor component electrically connected to the circuit board sensing an environmental characteristic exterior of the sensor connector. The sensor connector includes power contacts received in corresponding contact channels and extending from the bottom for electrical connection with receptacle power contacts of the receptacle connector. The power contacts include a neutral power contact, a line power contact and a load power contact, where the line power contact and the load power contact are integral as a unitary contact body forming a monolithic line-load power contact.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: April 21, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew Edward Mostoller, Christopher George Daily
  • Patent number: 10629354
    Abstract: An inductive component having a coil with a winding of a wire and a molded body adhering to the coil. The molded body has a surface for the arrangement of a heat sink. A method for producing such a component is also specified, in which, to produce the molded body, a mold is filled with a potting material and the mold is subsequently removed.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 21, 2020
    Assignee: TDK ELECTRONICS AG
    Inventor: Martin Neudecker
  • Patent number: 10624243
    Abstract: An inverter for converting DC voltage into AC voltage, in particular a photovoltaic inverter for high power densities, in particular 250 W/dm3 to 500 W/dm3 power densities, has at least one DC input, an AC output, a heat sink, a printed circuit board, a DC disconnector, a DC-DC converter, an intermediate circuit, a DC-AC converter and a housing with a front cover and a basic shell. The electrical components of the DC-DC converter, intermediate circuit and DC-AC converter are combined into subassemblies. At least the DC disconnector and the subassemblies of the DC-DC converter, intermediate circuit and DC-AC converter are directly arranged on the circuit board in a U-shaped manner corresponding to the energy flow direction from DC input to AC output. The circuit board is arranged with the component side facing the base (65) of the basic housing shell and with the opposite side on the heat sink.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: April 14, 2020
    Assignee: Fronius International GmbH
    Inventors: David Aitzetmueller, Franz Windischbauer, Bernhard Artelsmair, Guenter Achleitner, Ronald Leitgeb
  • Patent number: 10622593
    Abstract: A power module includes a packaging structure having a pair of side-by-side spaced apart busbars, each connected to a corresponding switch. The power module includes a conductive pad, between and electrically isolated from the busbars and the switches, and configured to, responsive to flow of current through the busbars generated by the switches and resulting in power loop magnetic flux between the busbars, generate magnetic flux that partially cancels the power loop magnetic flux.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 14, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Zhuxian Xu, Guangyin Lei, Nevin Altunyurt, Chingchi Chen
  • Patent number: 10615708
    Abstract: An inverter control device to drive a motor includes high-voltage circuitry that receives a power supply current and a power controller that supplies a driving current to a motor. The inverter control device further includes a first input terminal on a front surface portion of a casing of the high-voltage circuitry, a second input terminal on a power module in the power controller, and a first output terminal on a front surface portion of a casing of the power controller. Out of bus bars that electrically connect the first input terminal and the second input terminal to each other, a thickness of a bus bar on the first input terminal side is thicker than a bus bar on the second input terminal side.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: April 7, 2020
    Assignee: NIDEC ELESYS CORPORATION
    Inventors: Naoki Iwagami, Hitoshi Kuroyanagi
  • Patent number: 10617019
    Abstract: A board holding apparatus holds an electric circuit board between a first case and a second case. The board holding apparatus includes locking parts that lock the first case and the second case together in a thickness direction of the electric circuit board such that the first case and the second case are not separated from each other and a bearing surface formed on the second case, the electric circuit board coming into contact with the bearing surface in the thickness direction. The board holding apparatus includes a spring that generates an elastic force, with the locking parts locking the first case and the second case together, the spring being formed on the first case and the elastic force pressing the bearing surface through the electric circuit board.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 7, 2020
    Assignee: AISIN AW CO., LTD.
    Inventors: Hiroyoshi Araki, Yuichi Takeuchi
  • Patent number: 10613271
    Abstract: A backlight module and a display panel. The backlight module comprises a light guide plate, a heat dissipation plate and a light source. The display panel comprises a liquid crystal screen and a circuit board connected with the liquid crystal screen, the liquid crystal screen and the circuit board are arranged parallel to an arrangement direction of the heat dissipation plate main body and are respectively arranged at two sides of the heat dissipation plate. By means of the display device, the heat conducted to the back plate in the region of the heat dissipating plate corresponding to the circuit board can be reduced, and the temperature of the region where the circuit board locates can be reduced, thereby preventing aging of the electronic component and prolonging the lifetime of the circuit board.
    Type: Grant
    Filed: September 6, 2015
    Date of Patent: April 7, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Yuxin Zhang, Xinyin Wu
  • Patent number: 10602627
    Abstract: A key device comprises a housing in which a key hole is formed, a side key unit assembled at the key hole of the housing, and a gap of a predetermined thickness formed between a portion of the assembled side key unit located within the key hole and the key hole, wherein the gap is secured by processing any one or both of the side key unit located within the key hole or the housing in which the side key unit is assembled.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: March 24, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungho Lee, Hyosung Kang, Sangjin Kim, Sungsun Park, Dongchul Song
  • Patent number: 10591959
    Abstract: A bendable displaying apparatus of the present disclosure includes two housings, a supporting device, and a bendable display. The supporting device is fastened to the two housings and is arranged between the two housings. The supporting device includes a retainer, two supporting units, a first supporting plate, and two second supporting plates. The bendable display is disposed on the two housings, the first supporting plate, and the two second supporting plates. When the two housings are moved to stack with each other, the two housings drive the two supporting units to move the two second supporting plates along a direction away from each other and drives the retainer to downwardly move the first supporting plate, so that the two second supporting plates and the first supporting plate jointly form a space that provides the bendable display to deform therein.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: March 17, 2020
    Assignee: FOSITEK CORPORATION
    Inventors: An-Szu Hsu, Way-Han Dai, Shao-Chun Chao, Chun-Han Lin
  • Patent number: 10567938
    Abstract: A ruggedized engine control module (ECU) system includes a plugin-pod, a connector configured to connect the plugin-pod to a connector of an ECU, and signal processing circuitry. The ruggedized ECU system further includes a ruggedized enclosure for the connector and the signal processing circuitry. The ruggedized enclosure is configured to mount the plugin-pod to the ECU. The connection circuit includes signal processing circuitry configured to receive signals from at least one of the connectors, process the signals, and output the processed signals. The ruggedized ECU is configured to dissipate heat from the signal processing circuitry.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: February 18, 2020
    Assignee: Cummins Inc.
    Inventors: Daniel R. Harshbarger, Nikhil Pandey, Joseph L. Gahimer
  • Patent number: 10564749
    Abstract: A display screen assembly, an electronic device and an assembling method for the display screen assembly are provided. The display screen assembly includes a cover plate, a display screen, a bracket and a decoration enclosure. The cover plate includes a side edge. A top surface of the display screen is joined with a lower surface of the cover plate, a width of the display screen is larger than a width of the cover plate, and the side edge of the cover plate is indented inwards relative to the display screen. The bracket includes a top portion joined with a bottom surface of the display screen. The decoration enclosure includes a side surface joined with the side edge of the cover plate and is configured to shield a non-display area of the display screen.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: February 18, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Jiao Cheng
  • Patent number: 10553546
    Abstract: Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: February 4, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joungphil Lee, Yeongseok Kim
  • Patent number: 10545332
    Abstract: A display device including: a plastic window including a light transmittance film and a polymer layer, and a functional film including a touch screen panel film, a polarizing film, or a combination thereof. The light transmittance film, the polymer layer, and the functional film are sequentially stacked on each other, and the light transmittance film, the functional film, and the polymer layer are attached to each other by a plastic. A method of manufacturing the same is also provided.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: January 28, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hwa Jin Oh, Hun Kyo Kim, Hyoung Suk Roh, Dong Jin Seo, Kwan Young Han
  • Patent number: 10536770
    Abstract: A sound producing apparatus is provided. The sound producing apparatus comprises a driving circuit, comprising a pulse amplitude modulation (PAM) module, configured to generate an driving signal according to an audio input signal, wherein the driving signal comprises a pulse amplitude modulated signal generated according to the audio input signal, the pulse amplitude modulated signal comprises a plurality of pulses at a pulse rate, two consecutive pulses among the plurality of pulses are temporally spaced by a pulse cycle, the pulse rate is a reciprocal of the pulse cycle, and the pulse rate is larger than a maximum audible frequency; and a sound producing device, coupled to the driving circuit, configured to produce sound according to the driving signal.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: January 14, 2020
    Assignee: xMEMS Labs, Inc.
    Inventor: Jemm Yue Liang
  • Patent number: 10524374
    Abstract: An electric device includes a substrate on which electronic components are mounted, and a metal plate to which the substrate is fixed. The metal plate includes first bosses provided at positions corresponding to four corners of the substrate, a second boss provided inside a rectangle that connects the four first bosses, and a slit that is provided adjacent to the second boss, and extends in non-parallel with any side of the rectangle. The substrate is fixed to each of the four first bosses with a first male screw, such that a rubber washer is sandwiched between the substrate and the first male screw. The substrate is fixed to the second boss with a second male screw, such that no rubber washer is sandwiched between the substrate and the second male screw.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: December 31, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Shoji Tsutsui, Hiroki Umeda, Masatoshi Shinohara, Keisuke Hata, Daisuke Harada
  • Patent number: 10505355
    Abstract: Provided is an electrical junction box with which it is possible to reliably prevent exposure to the outside of the entire L-shaped terminal that is fastened to a stud bolt conductively connected to a conductive member of a box body even when an upper cover is removed, while making it easier to fasten the L-shaped terminal to the stud bolt. A terminal cover is hingedly connected to a box body, is pivotable about hinge portions between an open state and a closed state, and includes a top cover that covers a bolt fastening portion, and a side cover that covers a wire connection portion. The side cover includes a front-surface cover wall that covers a wire connection portion from an outer circumference side of a first peripheral wall portion, and a side-surface cover wall that covers a front side surface of two side surfaces of the wire connection portion.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: December 10, 2019
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Daisuke Matsuura
  • Patent number: 10483738
    Abstract: An electrical connection box applied to a wire harness includes a substrate assembly and a housing the substrate assembly. The housing includes a first flexible rib that is extended along an extending direction Z, elastically deformable along a first support direction X, and supports the substrate assembly with respect to one side in the first support direction X, second flexible ribs that are extended along the extending direction Z, elastically deformable along the first support direction X, and supports the substrate assembly with respect to the other side in the first support direction X, and boss portions that are extended along the extending direction Z and position the substrate assembly with respect to the both sides in the first support direction X.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: November 19, 2019
    Assignees: YAZAKI CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Teppei Doi, Kimihiro Ishii, Tomohiko Saito, Takayoshi Furukawa, Tadashi Fujita, Yasuhiro Yamazaki, Takashi Maruyama, Atsushi Kawamura, Akihito Tsukamoto, Takumi Matsumoto
  • Patent number: 10477675
    Abstract: Various embodiments of the disclosure relate to an electronic device including a capacitive structure.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minsoo Kim, Hyuntae Jung, Jiwoo Lee
  • Patent number: 10455745
    Abstract: Disclosed is a power conversion device comprising: a case; a switching unit comprising a plurality of switches which are disposed on one side of the case; a transformer disposed on one side of the case; and a clip for fixing the plurality of switches. The clip comprises: a body part which is fixed to the case; and elastic parts which extend from the body part and are for pressing the plurality of switches to the case. The body part comprises a plurality of first through holes into which screws are coupled. And the first through holes are disposed between two adjacent elastic parts.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: October 22, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Shin Young Jang
  • Patent number: 10451645
    Abstract: A remote sensor module includes a housing comprising a first cavity and a second cavity. A pocket in the first cavity may be configured to hold a sensor package. A side of the pocket may be formed by a portion of a wall between the first and second cavities, and provides an alignment surface for the sensor package. A port communicates through the wall between the pocket and the second cavity. A plurality of terminals extend through the wall between the first cavity and the second cavity. Each of the terminals extends into the first cavity, is positioned such that the sensor package, when present, is between the ends of the terminals and a recessed surface of the pocket, and is configured to form an electrical and mechanical connection with the sensor package, which may hold the sensor package in contact with the alignment surface.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: October 22, 2019
    Assignee: VEONEER US INC.
    Inventor: Jacob Pusheck
  • Patent number: 10432106
    Abstract: A power conversion device includes a printed wiring board on which an alternating-current power-supply input part, a converter circuit part to convert alternating-current power to direct-current power, an inverter circuit part to convert direct-current power converted by the converter circuit part to alternating-current power, an alternating-current power-supply output part to output alternating-current power converted by the inverter circuit part, and a conductive pattern to electrically connect the alternating-current power-supply input part, the converter circuit part, the inverter circuit part, and the alternating-current power-supply output part to one another are provided, and a busbar that has a plate-like shape with a plane direction thereof perpendicular to a plane direction of the printed wiring board, is arranged to overlap the conductive pattern in plan view, and includes two or more connecting portions that are in contact with the conductive pattern.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: October 1, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventor: Shinya Matsushita
  • Patent number: 10431697
    Abstract: A bidirectional Zener diode includes a substrate. A first conductivity type base region is formed in a surficial portion of the substrate. A second conductivity type first impurity region is formed in a surficial portion of the base region so as to form a pn junction with the base region. A second conductivity type second impurity region is formed in a surficial portion of the base region in a manner spaced apart from the first impurity region so as to form a pn junction with the base region. A first electrode is arranged at the surface of the substrate. A second electrode is arranged at the surface of the substrate. A dimension of the base region along the surface of the substrate between the first impurity region and the second impurity region is equal to or greater than 4.0 ?m and equal to or smaller than 12.5 ?m.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: October 1, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Hiroki Yamamoto
  • Patent number: 10423555
    Abstract: A data storage device includes a case and a connector housed within the case. The connector includes a first connection interface having a plurality of connection fingers and a second connection interface having a plurality of springs. The case is positionable within a data storage device port such that the data storage device is completely disposed within the data storage device port when used.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: September 24, 2019
    Inventor: Martin Kuster
  • Patent number: 10376928
    Abstract: Disclosed is a cleaning blade, having an elastic body formed of a rubber base material molded product, and a surface treatment layer on at least an area of the elastic body to be brought into contact with a cleaning object. The surface treatment layer is formed by impregnating a surface portion of the elastic body with a surface treatment liquid containing an isocyanate compound and an organic solvent, and hardening the liquid. The surface treatment layer has an indentation elastic modulus of 21 MPa to 56 MPa. The elastic body has an indentation elastic modulus greater than 20 MPa and 35 MPa or less. The difference in indentation elastic modulus between the surface treatment layer and the elastic body is 1 MPa to 21 MPa.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: August 13, 2019
    Assignee: SYNZTEC CO., LTD.
    Inventors: Takeshi Osajima, Shuang Wang, Shuji Abe, Hiroyuki Sato
  • Patent number: 10383245
    Abstract: A power supply chassis has at least one accommodating slot therein. Two side walls of the accommodating slot of the power supply chassis are provided with a first left guiding and fixing block and a first right guiding and fixing block. The guiding and fixing blocks have a first left guiding bevel and a first right guiding bevel facing a front side of the accommodating slot, a first left fixing plane and a first right fixing plane corresponding in position to the middle of the accommodating slot. When a power supply is placed into the accommodating slot, the first left guiding bevel and the first right guiding bevel guide the power supply to a middle position of the accommodating slot, and the power supply is clamped by the first left fixing plane and the first right fixing plane to enhance the stability of the power supply.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: August 13, 2019
    Assignee: CHYNG HONG ELECTRONIC CO., LTD.
    Inventor: Mu-Chun Lin
  • Patent number: 10375461
    Abstract: Disclosed is a mounting assembly for use in a mobile terminal. The mobile terminal includes a main frame on which a motherboard is mounted. The mounting assembly includes a rack for mounting thereon at least one of a speaker or a vibrator, and the rack is detachably connectable to the main frame. By means of the mounting assembly, the speaker or the vibrator is not directly mounted on the motherboard of the mobile terminal.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: August 6, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Jianbo Xian, Yong Qiao
  • Patent number: 10372659
    Abstract: A device may include a connector to connect the device to a chassis. The device may include chassis type circuitry to determine a type of the chassis. The device may further include mode configuration circuitry to configure the device to use a particular mode appropriate for the type of the chassis.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sompong Paul Olarig, Son T. Pham, Fred Worley
  • Patent number: 10347587
    Abstract: The disclosure provides an electronic device including an electronic assembly, a heat dissipating component, an electromagnetic shielding structure and an electromagnetic shielding shed. The electronic assembly includes a circuit board, a processor, a memory and a bus. The processor, the memory and the bus are stacked on the circuit board. The bus is located between and electrically connected to the processor and the memory. The heat dissipating component is staked on the processor. The electromagnetic shielding structure covers the memory. A side of the electromagnetic shielding shed is connected to the electromagnetic shielding structure, another side of the electromagnetic shielding shed is connected to the heat dissipating component, and the electromagnetic shielding shed covers at least part of the bus.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: July 9, 2019
    Assignee: WISTRON CORP.
    Inventor: Wen-Chao Chung
  • Patent number: 10337700
    Abstract: A bolt locking structure for a waterproof LED lamp contains: a first casing and a second casing. The first casing includes multiple first protrusions and multiple first recesses which are arranged on each of four peripheral walls thereof respectively. The second casing includes multiple second protrusions and multiple second recesses which are arranged on each of four peripheral walls thereof respectively. The multiple first protrusions retain with the multiple second recesses, and the multiple first recesses retain with the multiple second protrusions. Multiple through holes are coaxial and form on each peripheral wall of each of the first casing and the second casing respectively, wherein each of the multiple through holes passes through each of the multiple first protrusions and the multiple second protrusions, such that each of multiple connection bolts inserts into the multiple through holes, thus locking the first casing and the second casing together.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: July 2, 2019
    Inventor: Feng Li
  • Patent number: 10340217
    Abstract: A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: July 2, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Oya, Satoshi Yokota
  • Patent number: 10334744
    Abstract: An electronic subassembly for a personal care product with a housing defining a chamber having an open end. A first circuit board having a rigid end is positioned within the chamber and a flexible portion is positioned outside the chamber. A second circuit board is positioned within the chamber. The second circuit board has a connector dimensioned to receive the rigid end of the first circuit board.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: June 25, 2019
    Assignee: The Gillette Company LLC
    Inventors: Juergen Behrendt, Norbert Broemse, Yvonne Scholl, Klaus Heubach, Fred Schnak
  • Patent number: 10321601
    Abstract: An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: June 11, 2019
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Pasi Jukka Vaananen, Stephen A. Hauser
  • Patent number: 10310556
    Abstract: An information handling system rotationally couples first and second housing portions to each other with a dual axis hinge having proximately located dual axis assemblies with aligned parallel axes. A tensile member routed through each dual axis assembly and coupled to opposing front and rear faces motivate synchronized motion of the parallel dual axis assemblies without a geared mechanism. Torque regions defined by each dual axis assembly coordinate housing portion resistance to rotation at predetermined portions of the relative rotational movement.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: June 4, 2019
    Assignee: Dell Products L.P.
    Inventor: Christopher T. Barnard
  • Patent number: 10283898
    Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: May 7, 2019
    Assignee: Apple Inc.
    Inventors: Ross C. Heyman, Alfredo Castillo, Arun R. Varma
  • Patent number: 10274769
    Abstract: A display device can include a frame; a reflection sheet disposed on the frame; a housing coupled to at least one side of the frame; a substrate disposed on the housing; a light assembly mounted on the substrate; a light guide plate disposed on the reflection sheet and at a side of the light assembly; a guide panel coupled to another side of the frame; and a display panel disposed on the light guide plate, in which the display panel is disposed on the guide panel and overlaps with the housing.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: April 30, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyongil Kil, Sangmin Baek
  • Patent number: 10251276
    Abstract: The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 2, 2019
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Johannes Bock, Thomas Schmidt, Bernhard Schuch
  • Patent number: 10237979
    Abstract: An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: March 19, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Uwe Liskow
  • Patent number: 10216657
    Abstract: Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board (PCB) that includes a printed circuit board defining a length and a width, the length being greater than the width. The apparatus includes a first row of elements on the PCB, including a first memory region configured to receive at least one memory module. The apparatus includes a second row of elements on the PCB, including a first central processing unit (CPU) socket configured to receive a first CPU, and a second CPU socket configured to receive a second CPU, the first CPU socket and the second CPU socket positioned side by side along the width of the PCB. The apparatus also includes a third row of elements on the PCB, including a second memory region configured to receive a at least one memory module, wherein the second row of elements is positioned between the first row of elements and the third rows of elements.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 26, 2019
    Assignee: INTEL CORPORATION
    Inventors: Bruce Querbach, Pete D. Vogt
  • Patent number: 10211561
    Abstract: A micro electronic instrument, wherein said micro electronic instrument includes a baseboard and a cover board; a first electronic circuit and a first contact electrode are arranged on the baseboard, and the first electronic circuit connects the first contact electrode electrically; the cover board covers on the baseboard, but there is a space between them, and the first electronic circuit is in the space between the cover board and the baseboard. A width of the electronic instrument is in a range from 11.95 mm to 12.05 mm, a thickness of the electronic instrument is in a range from 2.4 mm to 2.5 mm. The electronic instrument provided in the present invention is smaller than that in prior art, and it is more portable and more convenient for a user.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: February 19, 2019
    Assignee: Feitian Technologies Co., Ltd.
    Inventors: Zhou Lu, Huazhang Yu
  • Patent number: 10206313
    Abstract: A system may include an information technology rack for holding information technology device modules such that heat generated by the information technology device modules primarily vents in one direction. The information technology rack may be adjacent to both (1) a data center hot aisle into which the information technology rack ventilates air heated by one or more of the information technology device modules and (2) a data center cold aisle that is separated from the data center hot aisle by the information technology rack. The system may also include at least one information technology device module positioned on the information technology rack such that (1) the information technology device module is accessible for removal via the data center hot aisle and (2) at least one cable connected to the information technology device module is positioned in the data center cold aisle. Various other systems and methods are also disclosed.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: February 12, 2019
    Assignee: Facebook, Inc.
    Inventors: Andrew Gold, Scott C. Wiley
  • Patent number: 10194546
    Abstract: A display device includes a display unit provided with a display screen on a front side, and a stand that supports the display unit from below. The stand includes a base that supports the display unit at a rear side of the display unit and extends in a lateral width direction of the display unit, and a pair of legs that supports both longitudinal ends of the base from below respectively and extends across a lower edge of the display unit in a front-rear direction.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: January 29, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Masatoshi Hori
  • Patent number: 10170853
    Abstract: An electrical connector comprises a casing and a connector module. The casing has a retaining member. The connector module has an electrically insulating contact carrier and a plurality of electrically conductive contacts. The connector module is at least partially surrounded by the casing and is retained at the casing by the retaining member. The retaining member exerts a retaining force on the connector module in a direction along a mating direction of the electrical connector. The connector module is removable from the retaining member in a direction transverse to the mating direction.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: January 1, 2019
    Assignees: Connecteurs Electriques Deutsch, TE Connectivity Corporation
    Inventors: Fabien Houvenaghel, Benjamin Michael Grab, Frederic Duval, Thierry Corriou
  • Patent number: 10154607
    Abstract: A cabling module is configured for use within an IT component, the cabling module including an enclosure assembly configured to be received within the IT component. An input connector is configured to receive electrical power from within the IT component. A plurality of output connectors are configured to provide electrical power to a plurality of subcomponents of the IT component.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: December 11, 2018
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Keith C. Johnson, Thomas Thibodeau, Spero Tsefrekas, Kanu D. Patel