With Housing Or Chassis Patents (Class 361/752)
  • Patent number: 10321601
    Abstract: An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: June 11, 2019
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Pasi Jukka Vaananen, Stephen A. Hauser
  • Patent number: 10310556
    Abstract: An information handling system rotationally couples first and second housing portions to each other with a dual axis hinge having proximately located dual axis assemblies with aligned parallel axes. A tensile member routed through each dual axis assembly and coupled to opposing front and rear faces motivate synchronized motion of the parallel dual axis assemblies without a geared mechanism. Torque regions defined by each dual axis assembly coordinate housing portion resistance to rotation at predetermined portions of the relative rotational movement.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: June 4, 2019
    Assignee: Dell Products L.P.
    Inventor: Christopher T. Barnard
  • Patent number: 10283898
    Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: May 7, 2019
    Assignee: Apple Inc.
    Inventors: Ross C. Heyman, Alfredo Castillo, Arun R. Varma
  • Patent number: 10274769
    Abstract: A display device can include a frame; a reflection sheet disposed on the frame; a housing coupled to at least one side of the frame; a substrate disposed on the housing; a light assembly mounted on the substrate; a light guide plate disposed on the reflection sheet and at a side of the light assembly; a guide panel coupled to another side of the frame; and a display panel disposed on the light guide plate, in which the display panel is disposed on the guide panel and overlaps with the housing.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: April 30, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyongil Kil, Sangmin Baek
  • Patent number: 10251276
    Abstract: The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 2, 2019
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Johannes Bock, Thomas Schmidt, Bernhard Schuch
  • Patent number: 10237979
    Abstract: An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: March 19, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Uwe Liskow
  • Patent number: 10216657
    Abstract: Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board (PCB) that includes a printed circuit board defining a length and a width, the length being greater than the width. The apparatus includes a first row of elements on the PCB, including a first memory region configured to receive at least one memory module. The apparatus includes a second row of elements on the PCB, including a first central processing unit (CPU) socket configured to receive a first CPU, and a second CPU socket configured to receive a second CPU, the first CPU socket and the second CPU socket positioned side by side along the width of the PCB. The apparatus also includes a third row of elements on the PCB, including a second memory region configured to receive a at least one memory module, wherein the second row of elements is positioned between the first row of elements and the third rows of elements.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 26, 2019
    Assignee: INTEL CORPORATION
    Inventors: Bruce Querbach, Pete D. Vogt
  • Patent number: 10211561
    Abstract: A micro electronic instrument, wherein said micro electronic instrument includes a baseboard and a cover board; a first electronic circuit and a first contact electrode are arranged on the baseboard, and the first electronic circuit connects the first contact electrode electrically; the cover board covers on the baseboard, but there is a space between them, and the first electronic circuit is in the space between the cover board and the baseboard. A width of the electronic instrument is in a range from 11.95 mm to 12.05 mm, a thickness of the electronic instrument is in a range from 2.4 mm to 2.5 mm. The electronic instrument provided in the present invention is smaller than that in prior art, and it is more portable and more convenient for a user.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: February 19, 2019
    Assignee: Feitian Technologies Co., Ltd.
    Inventors: Zhou Lu, Huazhang Yu
  • Patent number: 10206313
    Abstract: A system may include an information technology rack for holding information technology device modules such that heat generated by the information technology device modules primarily vents in one direction. The information technology rack may be adjacent to both (1) a data center hot aisle into which the information technology rack ventilates air heated by one or more of the information technology device modules and (2) a data center cold aisle that is separated from the data center hot aisle by the information technology rack. The system may also include at least one information technology device module positioned on the information technology rack such that (1) the information technology device module is accessible for removal via the data center hot aisle and (2) at least one cable connected to the information technology device module is positioned in the data center cold aisle. Various other systems and methods are also disclosed.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: February 12, 2019
    Assignee: Facebook, Inc.
    Inventors: Andrew Gold, Scott C. Wiley
  • Patent number: 10194546
    Abstract: A display device includes a display unit provided with a display screen on a front side, and a stand that supports the display unit from below. The stand includes a base that supports the display unit at a rear side of the display unit and extends in a lateral width direction of the display unit, and a pair of legs that supports both longitudinal ends of the base from below respectively and extends across a lower edge of the display unit in a front-rear direction.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: January 29, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Masatoshi Hori
  • Patent number: 10170853
    Abstract: An electrical connector comprises a casing and a connector module. The casing has a retaining member. The connector module has an electrically insulating contact carrier and a plurality of electrically conductive contacts. The connector module is at least partially surrounded by the casing and is retained at the casing by the retaining member. The retaining member exerts a retaining force on the connector module in a direction along a mating direction of the electrical connector. The connector module is removable from the retaining member in a direction transverse to the mating direction.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: January 1, 2019
    Assignees: Connecteurs Electriques Deutsch, TE Connectivity Corporation
    Inventors: Fabien Houvenaghel, Benjamin Michael Grab, Frederic Duval, Thierry Corriou
  • Patent number: 10154607
    Abstract: A cabling module is configured for use within an IT component, the cabling module including an enclosure assembly configured to be received within the IT component. An input connector is configured to receive electrical power from within the IT component. A plurality of output connectors are configured to provide electrical power to a plurality of subcomponents of the IT component.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: December 11, 2018
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Keith C. Johnson, Thomas Thibodeau, Spero Tsefrekas, Kanu D. Patel
  • Patent number: 10152032
    Abstract: A system and method is provided that facilitates controlling and monitoring environmental conditions in buildings. The system may include at least one rack including: a plurality of slidable field panels mounted in a housing. The slidable field panels may be in side-by-side relation in a horizontal direction and may be configured to independently slide at least partially out of a front side opening of the housing via a plurality of slides. The slidable field panels may include a plurality of components mounted to vertical walls thereof, including: transformers and building control modules. The rack may also include a terminal panel including a plurality of connection terminals facing a back side opening of the housing. The connection terminals may be respectively wired to respective terminals of the transformers and building control.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: December 11, 2018
    Assignee: Siemens Industry, Inc.
    Inventors: Douglas Ryan, John A. Hendrix, Jr., Michael S. Schuler, Chad Jason Walker
  • Patent number: 10123435
    Abstract: Disclosed is a display control module including a supporting member including a pair of external coupling parts for attaching to an external surface in a negative Y-axis direction and a pair of guide surfaces configured to form opposite side ends of the external coupling parts in an X-axis direction; and a PCB coupled to the supporting member in a positive Y-axis direction, the PCB being provided at opposite sides of the PCB in the X-axis direction with a pair of connection terminals configured to be connected to a pair of display modules, respectively, and a display device including a pair of display modules; a supporting member positioned between the pair of display modules in an X-axis direction; and a printed circuit board coupled to the supporting member in a positive Y-axis direction, wherein the display modules are connected to opposite sides of the PCB in the X-axis direction.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: November 6, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Daewoon Hong, Sangtae Park, Dongjin Yoon, Jeongsik Choi
  • Patent number: 10114184
    Abstract: An optical connector includes: a receptacle assembly to be coupled to a substrate; a cover coupled to the receptacle assembly; a photoelectric element array coupled to the receptacle assembly; and a plug assembly inserted into a reception groove formed at the receptacle assembly, so as to be movably coupled to the receptacle assembly, wherein the cover includes a support member for supporting the plug assembly connected to the photoelectric element array by pressing the plug assembly.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: October 30, 2018
    Assignee: LS MTRON LTD.
    Inventors: Ick Kyoon Lee, Keon Cheol Park, Dong Hee Kim, Duk Hyun Kim, Seung Hun Lee, Yu Joon Park
  • Patent number: 10111334
    Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 23, 2018
    Assignee: Dell Products, L.P.
    Inventors: Kevin W. Mundt, Sandor Farkas, Bhyrav M. Mutnury, Yeshaswy Rajupalepu
  • Patent number: 10093262
    Abstract: A seatbelt payout measuring device with a rewind spring having a first end connected to a center spool and a second end connected to a rewind spring housing. A dielectric material layered immediately adjacent to the rewind spring forming a first layer and an electrolytic coil with dielectric material layered on both sides forming a second layer, isolating the rewind spring from the electrolytic coil. A capacitive measuring device having a first lead connected to the first end of the rewind spring and a second lead connected to a first end of the electrolytic coil. The capacitive measuring device measuring capacitance with belt pullout.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: October 9, 2018
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Mangala A. Jayasuriya, Mark A. Cuddihy, Mark Allan Lippman, Manoharprasad K. Rao
  • Patent number: 10093249
    Abstract: A mounting structure for an electric device of a vehicle includes a case body configured to accommodate the electric device inside the case body, at least one fixing portion provided continuously with the case body and configured to be fixed to a vehicle body of the vehicle, and at least one hollow portion disposed between the case body and the fixing portion. When a load from the vehicle body is transmitted to the fixing portion, the hollow portion is deformed and/or broken by the load so that the load can be absorbed. Thus, transmission of the load to the case body can be suppressed.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: October 9, 2018
    Assignees: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA, MITSUBISHI JIDOSHA ENGINEERING KABUSHIKI KAISHA
    Inventors: Toshihiko Ando, Yoshio Hiraiwa
  • Patent number: 10077892
    Abstract: A packaging structure for an LED lamp contains: a casing, a substrate, a printed circuit board (PCB), and at least one locking element. The casing, the PCB, and the substrate are stacked and adhered together. The at least one locking element respectively inserts into and retains with two connection gaps between the casing and the substrate so as to fix the casing and the substrate together. The substrate includes a stepped groove defined on a central portion thereof and facing the casing, and the stepped groove of the substrate has a first accommodation part and a second accommodation part. A size, a profile, and a depth of the first accommodation part correspond to a size, a profile, and a thickness of the casing. A size, a profile, and a depth of the second accommodation part correspond to a size, a profile, and a thickness of the PCB.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: September 18, 2018
    Inventor: Feng Li
  • Patent number: 10073502
    Abstract: The invention in at least one embodiment includes a system that includes a chassis having a frame present within a housing where the frame includes at least two plates having a base and two grills running widthwise along and on opposite ends of the base, a plurality of walls between the at least two plates, and at least one baffle running between the plates at an angle to the plates; at least one power supply; and a plurality of fans electrically connected to the at least one power supply; wherein there are at least two air flow paths through the chassis that pass through at least one fan and pass at least one baffle through a duct defined by the housing and the frame. In at least one embodiment, the chassis receives at least one storage drive.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: September 11, 2018
    Assignee: GreenTec-USA, Inc.
    Inventors: Stephen E. Petruzzo, David Hatchett
  • Patent number: 10067155
    Abstract: In a method for fabricating an electrostatic capacitance-type acceleration sensor having a capacitor which electrostatic capacitance between a movable electrode and a fixed electrode changes according to the displacement of the movable electrode, the method includes: a step of forming a groove on at least one of the surface of an insulative substrate and the surface of a semiconductor substrate; a step of forming a hole in the semiconductor substrate so as to penetrate the semiconductor substrate at a position communicating with a passage formed by the groove; and a step of forming an electrode extraction hole in the insulative substrate so as to penetrate the insulative substrate, at a position communicating with the passage formed by the groove.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 4, 2018
    Assignees: AKEBONO BRAKE INDUSTRY CO., LTD., JAPAN OIL, GAS AND METALS NATIONAL CORPORATION
    Inventors: Takahiro Tsunoda, Takashi Kunimi, Toru Sekine
  • Patent number: 10067540
    Abstract: A front module for a desktop computer system includes an interface unit, and a circuit board having a plug, wherein the plug is configured to connect the front module to a mainboard such that there is an electric contact between the mainboard and the interface unit, and the circuit board is dimensioned such that the interface unit terminates with a front chassis side of a casing surrounding the circuit board if the plug is plugged into a socket of a mainboard.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 4, 2018
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventors: Stefan Rau, Lutz Rösler
  • Patent number: 10056204
    Abstract: According to various embodiments, an electronic device comprises a key button that can be assembled to keep the key button in place in the housing of the electronic device and functional without having to completely assemble the housing of the electronic device.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: August 21, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Sung Lee, Sang-In Baek, Hee-Cheul Moon, Na-Young Chu, Kwon-Ho Son
  • Patent number: 10046234
    Abstract: The present disclosure relates to an interactive movement detection system applicable to articles of clothing that allows a user to interact with virtualized controllable environments such as the graphical programming environments of personal computers and/or those generated by video game consoles. Similarly, the system of example implementations of the present disclosure allows feedback of actions to the system in the form of impulses that generate pressure and/or vibration sensations that simulate interaction with elements of the controllable interface.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 14, 2018
    Assignee: OBE Gaming Inc.
    Inventors: Angelo Antonio Perdigón Rodriguez, Linda Paola Lobato Franco, Juan Pedro Gil Alonso, Daniel Fernández de Cordova Shore, Henry Serrano Echeverria, Frederic Zoller Chesler
  • Patent number: 10045454
    Abstract: A circuit board (7) is fixed with a screw (8), using a component attachment part (21) cut and raised from a bottom plate part (20) of a bottom chassis (2) toward the inner side of a casing (1). An opening part (22) formed by cutting and raising of the component attachment part (21) is closed by attachment of a rear chassis (5), and the bottom chassis (2) and the rear chassis (5) come into contact with each other via an elastic piece (52).
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: August 7, 2018
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Fuqiang Han
  • Patent number: 10032709
    Abstract: Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: July 24, 2018
    Assignee: MC10, INC.
    Inventors: Conor Rafferty, Mitul Dalal
  • Patent number: 10021237
    Abstract: An apparatus for connecting a mobile device to a vehicle-based network includes a USB or similar accessory connector enclosed in a protective housing. The connector housing may include a Bluetooth or similar wireless connector for establishing a wireless link between the mobile device and the vehicle-based network via the USB port. The connector housing may include a hinged panel allowing access to the USB connector while open, and securing the USB connector to a USB port of the mobile device while closed. The connector housing may include a flexible impact absorber for isolating the connector from shocks or vibrations conducted by the vehicle mount by which the mobile device is mounted to a dashboard or interior surface of the vehicle.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: July 10, 2018
    Assignee: MobileDemand LC
    Inventors: Matthew Miller, Steven R. Kunert
  • Patent number: 9992895
    Abstract: An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: June 5, 2018
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen
  • Patent number: 9961779
    Abstract: A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: May 1, 2018
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Lothar Biebricher, Michael Schulmeister, Jakob Schillinger, Dietmar Huber, Thomas Fischer, Stefan Günthner, Waldemar Baumung
  • Patent number: 9960584
    Abstract: An electrical junction box includes a circuit structure, a case main body made of a synthetic resin and having an accommodating portion that accommodates the circuit structure, and a cover 30 made of a metal and that is attached to the case main body, covering the accommodating portion thereof. The cover has a covering wall that covers the accommodating portion of the case main body and a side wall that is continuous with the covering wall and that is disposed around the case main body. The case main body is provided with an abutment portion that abuts on a portion of the side wall of the cover, but not on an end portion of the side wall that is located on the side facing away from the covering wall.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: May 1, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takehito Kobayashi, Yoshikazu Sasaki, Shigeki Yamane, Yukinori Kita, Tomohiro Ooi
  • Patent number: 9921616
    Abstract: A riser card is used for inserting into a motherboard module including a casing and a motherboard disposed in the casing, and includes a handle bar, a main body and first and second linkage mechanisms pivoted to the main body. A side wall of the casing corresponding to a slot of the motherboard has first and second support pillars. The handle bar moves between non-pressed and pressed positions with swinging of the first and second linkage mechanisms. When the first and second linkage mechanisms are supported by the first and second support pillars and the handle bar is pressed to the pressed position, the handle bar is collinear with the first and second linkage mechanisms, and the first and second linkage mechanisms abut against the first and second support pillars to move and rotate for generating lever torques to insert a card pin of the riser card into the slot.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: March 20, 2018
    Assignee: Wistron Corporation
    Inventor: Chao-Hsin Yuan
  • Patent number: 9886067
    Abstract: In accordance with embodiments of the present disclosure, a latch may include a pivoting member and a leaf-spring member. The pivoting member may be configured to rotatably couple the latch to a chassis such that the latch may rotate between a first position and a second position relative to the chassis. The leaf-spring feature may be shaped and arranged in order to, as the latch is rotated between the first position and the second position, apply a mechanical force to a first circuit board to mate a first connector of the first circuit board to a second connector of a second circuit board.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: February 6, 2018
    Assignee: Dell Products L.P.
    Inventors: Raymond Dewine Heistand, Yen-Lin Wang, Kuang Hsi Lin, Hsu-Chu Wang
  • Patent number: 9877401
    Abstract: A portable electronic device includes at least one electronic module and the electronic module includes, in particular, a main plate provided with a cavity arranged for receiving an electrical energy source, at least one movement associated with a printed circuit, an elastically deformable contact member for ensuring an electrical connection between the electrical energy source and the printed circuit, and a holder for holding the electrical energy source. The holder includes a removable holder made of insulating material arranged to receive the energy source and including a removable clamp for holding the energy source in place. The holder can be inserted inside the cavity.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: January 23, 2018
    Assignee: ETA SA Manufacture Horlogere Suisse
    Inventors: Pascal Lagorgette, Vittorio Zanesco, Raphael Balmer
  • Patent number: 9866662
    Abstract: An electronic device and a method of manufacturing the electronic device is provided. The electronic device includes a housing, a structure that is formed on a surface of the housing and comprises a first pattern having a first at least one through-hole, a first speaker that is arranged in an interior of the housing to be adjacent to a first portion of the first pattern and is configured to output a sound, and a first microphone that is arranged in the interior of the housing to be adjacent to a second portion of the first pattern and is configured to receive a sound.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: January 9, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gi Hoon Lee, Hyun Woo Sim
  • Patent number: 9853403
    Abstract: A board to board connector assembly is disclosed in this invention, which includes a female connector and a male connector. Each female terminal has an elastic engaging section and a first protrusion located on the top of the elastic engaging section. Each male terminal has an elastic arm and a second protrusion located on the top of the elastic arm. When the female connector is matched with the male connector, the second protrusion passes the first protrusion, and a bottom surface of the second protrusion and a bottom surface of the first protrusion are engaged with each other and together form a holding state. The board to board connector assembly can ensure the reliable connection of the two connectors by the engagement of the female and male terminals.
    Type: Grant
    Filed: March 19, 2017
    Date of Patent: December 26, 2017
    Assignee: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventor: Hsin Chih Chen
  • Patent number: 9854077
    Abstract: The present invention relates to a mobile terminal and a method of fabricating the same. The mobile terminal includes a frame made of a metal and provided within a terminal body, a printed circuit board spaced apart from one surface of the frame and having various electronic components mounted thereon, and a shield can disposed on the printed circuit board in a manner of facing the frame, and capable of shielding electromagnetic waves by covering the electronic components, wherein the shield can is provided with a ground unit that is formed at least one region and protruding toward the frame so as to be electrically connected to the frame.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: December 26, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Hoseok Chung, Seyun Hwang, Wonseok Na, Kyungji Lee, Hyunju Yi
  • Patent number: 9841568
    Abstract: Latch mechanisms for modules are disclosed. A module includes a housing and a release slide. The housing includes a first rib located on a first side of the housing and a second rib located on a second side of the housing. The release slide is slidingly positioned on the housing. The release slide includes a release slide base, a first release slide arm extending from the release slide base, and a second release slide arm extending from the release slide base. A first flange extending from the first release slide arm is positioned at least partially over the first rib. A second flange extending from the second release slide arm is positioned at least partially over the second rib.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: December 12, 2017
    Assignee: FINISAR CORPORATION
    Inventors: William H. Wang, Joshua John Edward Moore
  • Patent number: 9839150
    Abstract: A multi-part sealing system is provided for a housing of a motor vehicle control unit. The housing includes a first housing part and at least one additional housing part, with at least one electronic component in the interior of the housing and at least one conducting structure which leads out of the interior of the housing and connects an electronic component in the interior of the housing to components outside the housing in an electrically conductive manner. At least one housing part has at least one device for accommodating at least one part of the multi-part sealing system. A first part of the sealing system is suitable for preventing liquid harmful or noxious substances from penetrating into the interior of the housing and additional parts of the sealing system are suitable for preventing gaseous harmful or noxious substances from penetrating into the interior of the housing.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: December 5, 2017
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Juergen Henniger, Matthias Wieczorek, Andreas Reif, Marion Gebhardt
  • Patent number: 9832542
    Abstract: A jack module includes a chassis, a frame, and jacks. The jack module is configured to releasably hold any of a plurality of types of jacks. Each jack is configured to releasably mount to the frame. The frame is configured to couple to the chassis so that rear portions of the jacks extend rearwardly from the chassis. The jack module mounts to a rear of a patch panel frame by coupling the jack module to a faceplate mounted at a front of the patch panel frame.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: November 28, 2017
    Assignee: COMMSCOPE CONNECTIVITY SPAIN, S.L.
    Inventor: Antonio Carreras Garcia
  • Patent number: 9825416
    Abstract: A composite connector includes an insulative base having a seat and a tongue plate extended forward from the seat, a first insulative board attached onto the seat and arranged in parallel to the tongue and on one side of the first surface, a plurality of first conductive terminal pieces located on an outer side of the first insulative board and away from the tongue, a second insulative board attached onto the base and arranged in parallel to the tongue plate and on one side of the second surface, a plurality of second conductive terminal pieces located on an outer side of the second insulative board and away from the tongue plate, and a plurality of first elastic connecting terminals arranged between the first surface and the first insulative board. Accordingly, the technical effect of transmission for multiple transmission interfaces is achieved.
    Type: Grant
    Filed: April 1, 2017
    Date of Patent: November 21, 2017
    Inventors: Pei-Lun Wang, Xinping Luo
  • Patent number: 9819380
    Abstract: A docking station support system for a portable electronic device is disclosed. The docking station includes a housing with apertures to receive a portable electronic device and provide access to the touch sensitive display of such device. In certain embodiments, the docking station is invertible, and is supported by a leg or clips on top of, or at the edge of a surface, such as a table. The docking station can also be connected to a surface with hook and loop fasteners. The invention includes a gutter and spout system for catching food, beverages and other substances, and directing them away from the portable electronic device.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: November 14, 2017
    Assignee: Comprehensive Prospect Research
    Inventors: Tim Halpern, Dana Halpern
  • Patent number: 9814147
    Abstract: A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: November 7, 2017
    Assignee: ALPINE ELECTRONICS, INC.
    Inventors: Yasuyuki Igari, Shinobu Kida, Tatsuya Watanabe, Takao Okabe
  • Patent number: 9806474
    Abstract: A printed circuit board includes a substrate including a surface layer and a first ground layer; a high-frequency signal generation part provided in the surface layer of the substrate; at least one high-frequency signal connector mounting portion formed in the surface layer of the substrate; at least one high-frequency signal line formed in the surface layer of the substrate, and extend from the high-frequency signal generation part to the at least one high-frequency signal connector mounting portion; and at least one high-frequency signal connector disposed in the at least one high-frequency signal connector mounting portion, wherein an end of the first ground layer is exposed to a side surface of the substrate, and when the high-frequency signal connector is disposed in the at least one high-frequency signal connector mounting portion, a ground of the high-frequency signal connector is in contact with the end of the first ground layer.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 31, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Yong-hee Cho
  • Patent number: 9801298
    Abstract: A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate (26), a second substrate (28) that is so disposed as opposed to the other principal surface (48b) of the first substrate (26), and a housing (12) that has accommodation sections (38) and (54) for accommodating the first substrate (26) and the second substrate (28). Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate (26) and the second substrate (28), are formed on inner wall surfaces (40) and (56) of the accommodation sections (38) and (54) in the housing (12).
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: October 24, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Kawano, Naofumi Enkyo, Koki Kato
  • Patent number: 9755383
    Abstract: The present specification relates to an electronic control apparatus for a vehicle, and the electronic control apparatus for a vehicle according to the present specification includes: an electronic control board which electrically controls respective parts in the vehicle; a connector which is electrically connected with the electronic control board; and a housing which is provided with a cover and a base in order to accommodate the electronic control board, in which the cover includes an upper support portion which supports an upper portion of the connector, and the base includes a lower support portion which supports a lower portion of the connector.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: September 5, 2017
    Assignee: HYUNDAI AUTRON CO., LTD.
    Inventors: Man Ho Seok, Wan Kyu Lee
  • Patent number: 9754631
    Abstract: Certain exemplary aspects of the present disclosure are directed towards a disc drive apparatus. A base deck and a cover are joined to one another by a friction-stir weld along a lip of the cover that extends along a periphery of the cover and over a surface of the base deck. The base deck and cover enclose a cavity, which is hermetically sealed by the weld.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: September 5, 2017
    Assignee: Seagate Technology LLC
    Inventors: Samuel Edward Severson, David G. Fitzgerald, David Ray Lapp, Jerome Thomas Coffey, Robert M. Gibbs
  • Patent number: 9748671
    Abstract: A terminal connection structure for electrically connecting a conductor and at least one terminal electrode of an electronic component, wherein the terminal electrode includes a plurality of connection terminals, the terminal connection structure includes a male part that includes a hole portion into which a fastening member, which may be threaded, is inserted, and a female part into which the male part is inserted and that includes hole portions equivalent in number to the connection terminals, the conductor is secured by being sandwiched between the female part and the male part and swaging the hole portion of the male part, and the conductor is secured to the electronic component with the fastening member inserted into the hole portion of the male part and fastening mechanisms, which may be threaded, provided to the respective connection terminals.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: August 29, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hirokazu Takabayashi
  • Patent number: 9746882
    Abstract: Disclosed herein is an electronic device with a curved display module. A housing has a first surface adjacent to the display module and the first surface is formed to have a curvature corresponding to the curvature of the display module. At least one electronic component is disposed in a second surface of the housing that is opposite to the first surface.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: August 29, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan-Keun Song, Jong-Chul Choi
  • Patent number: 9743548
    Abstract: Housing for an electronic card includes a chassis that has a base, a cover, and an insertion wall. The base has a female element and a pocket. The electronic card can be introduced/extracted through a window of the insertion wall. The electronic card also includes guide walls, each including: a guide groove to receive the electronic card; a male element to cooperate with the female element; a tongue disposed at an end of the guide wall oriented on a side opposing the insertion wall and forming an arm having a stud to be inserted in the pocket; a clip disposed at the guide wall end and forming an elastic blade with a tooth oriented towards the base, and a face of the blade is oriented towards the cover and is designed to abut the latter; and a backplane electronic card to be inserted between the blade and the arm.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: August 22, 2017
    Assignee: ENENSYS TECHNOLOGIES
    Inventors: Eric Deniau, Laurent Roul, Jacques Sisomsack
  • Patent number: 9736956
    Abstract: An electronic device is provided comprising a display module comprising a display area and a peripheral area abutting on a side of the display area, wherein the display module comprises a glass layer extending across the display area and the peripheral area, and wherein the glass layer comprises a first recess positioned over the peripheral area.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: August 15, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee-Cheul Moon, Sang-Hun Kim, Yong-Seok Lee