With Housing Or Chassis Patents (Class 361/752)
  • Patent number: 12108555
    Abstract: An interconnecting module configured to be mounted in a High-Performance Computing (HPC) cabinet in order to interconnect a plurality of computing units located in the HPC cabinet. The interconnecting module comprising a chassis configured to be mounted horizontally within housings defined in the computing units, a plurality of connection units spaced vertically, each connection unit being configured to be connected to a motherboard of a computing unit, the connection units being interconnected, each connection unit comprising at least a fastening member configured to cooperate with a housing of a computing unit, a vertical rack cooperating with all the fastening members and at least a main lever mounted pivotally on the chassis, the main lever being configured to move the vertical rack vertically in order to engage/disengage all the fastening members simultaneously.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: October 1, 2024
    Assignee: BULL SAS
    Inventors: Sakthivel Mohanasundaram, Vishwas Bs
  • Patent number: 12108573
    Abstract: An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 1, 2024
    Assignee: KUBOTA CORPORATION
    Inventors: Motohiro Kawanabe, Koji Nakakita, Kenji Nishioka, Misaki Yamada
  • Patent number: 12108581
    Abstract: A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: October 1, 2024
    Inventors: Gustavo Dario Leizerovich, Ivan Quiroz, Claudio Santiago Ribeiro, Cesar Eduardo Nunez, Steven Kenneth Mackiewicz
  • Patent number: 12101111
    Abstract: A small cell access node includes a housing, a radio module, a power supply module, and one or more antennas coupled to the radio module. The housing includes a floor and at least one sidewall extending around a perimeter of the floor. An air intake section of the sidewall is located at a first lengthwise end of the floor and defines an air intake port. An air exhaust section of the sidewall is located at a second lengthwise end of the floor and defines an air exhaust port. The floor includes a two floor portions residing primarily in different planes and an angled transition portion interconnecting the two floor portions. The transition portion defines an air and water exhaust port to allow water that enters the housing through the air intake and air exhaust ports, such as from wind-driven rain, to drain out of the housing.
    Type: Grant
    Filed: September 24, 2022
    Date of Patent: September 24, 2024
    Inventors: Gustavo Dario Leizerovich, Claudio Santiago Ribeiro, Cesar Eduardo Nunez, Fernando Ferrales
  • Patent number: 12089358
    Abstract: A capacitor unit includes: a base portion with a mount surface, and a locking member. The locking member includes a shaft portion to be inserted in a hole provided in the mount surface and a head portion. A first guide member and a second guide member guide along an anteroposterior direction, a first end and a second end of the base portion in a lateral direction, respectively. The hole is located between the capacitor and the first end in the lateral direction, and arranged at a position more distant from an opening than the first guide member in the anteroposterior direction. At a first engagement position, the locking member abuts on the first guide member. At a second engagement position, abutment of the locking member on the first guide member is canceled.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: September 10, 2024
    Assignee: TMEIC CORPORATION
    Inventor: Keishi Yamane
  • Patent number: 12082353
    Abstract: The present application provides a splicing display device, which comprises a box body, a bracket, a plurality of display panels, a plurality of panel fixing members, and a plurality of bracket fixing members. The bracket is detachably disposed on the box body. The plurality of display panels are detachably disposed on the bracket. The plurality of panel fixing members fix the display panel and the bracket. The plurality of bracket fixing members fix the bracket and the box body.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: September 3, 2024
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Guanqiao Zhao, Zhongyin Lu, Lijian Xiao
  • Patent number: 12075574
    Abstract: An electronic control device includes: an electronic circuit board on which an electronic component is packaged; and a housing in which the electronic circuit board is contained, and which is composed of a case and a base. The electronic control device includes: a plurality of claws which is provided in the case of the housing and fixes the electronic circuit board; a fixing groove which is formed in the case on the rear side of the claws, and into which a peripheral edge portion of the base is close-fitted; a cutout which is formed on the rear side of the claws of the housing and is communicated with the fixing groove; and adhesive which is filled on the rear side of the claws via the fixing groove and the cutout.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: August 27, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaaki Tanaka, Fumino Suzuki
  • Patent number: 12074363
    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: August 27, 2024
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Michael B. Wittenberg, Shane Bustle, Duy P. Le
  • Patent number: 12069797
    Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: August 20, 2024
    Assignee: MEIDENSHA CORPORATION
    Inventor: Shota Suzuki
  • Patent number: 12061364
    Abstract: A fiber optic ferrule push includes a main body extending between a front end and a rear end, the main body having a central opening extending between the front end and the rear end to receive a plurality of optical fibers therethrough, a front facing surface configured to engage a rear surface of a fiber optic ferrule, and at least one projection extending outward from the main body to engage a housing configured to receive the fiber optic ferrule, the fiber optic ferrule push may also include a key extending outward from a surface of the main body. The fiber optic ferrule push may be paired with a fiber optic ferrule in a fiber optic assembly.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 13, 2024
    Assignee: US Conec Ltd.
    Inventors: Mitchell Cloud, Craig M. Conrad, Jason Higley, Darrell R. Childers
  • Patent number: 12057655
    Abstract: A protector includes a base member and a cover member. The base member includes a pair of guide grooves extending along an attachment direction in which the cover member is attached to the base member and disposed on respective bilateral sides in a width direction perpendicular to the attachment direction, walls facing attachment direction-side ends of guide grooves in the attachment direction, and lock portions facing detachment direction-side ends of the guide grooves in a detachment direction.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: August 6, 2024
    Assignee: YAZAKI CORPORATION
    Inventors: Ryohei Toyoda, YoungHo Jang, Hidetoshi Hamada, Ryo Matsubayashi
  • Patent number: 12052845
    Abstract: A circuit board of an electronic control device has a surface to which a connector is attached and on which a heat generating component is mounted. A metal casing that stores therein the circuit board has an opposing surface that faces the surface of the circuit board on which the heat generating component is mounted. A first fin that protrudes toward the surface on which the heat generating component is mounted is provided on the opposing surface of the casing. The first fin overlaps the heat generating component in the thickness direction of the circuit board.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: July 30, 2024
    Assignee: HITACHI ASTEMO, LTD.
    Inventor: Takanori Sawaki
  • Patent number: 12041195
    Abstract: An electronic apparatus includes a housing; a first structure disposed inside the housing and includes a first surface; a second structure including a second surface facing the one surface of the housing; and a flexible printed circuit board (FPCB) structure disposed inside the housing. The FPCB structure includes: an FPCB including at least one coil; a thermally conductive first layer, including a first portion partially overlapping the FPCB and disposed between the FPCB and the second surface, and a second portion extending from the first portion and partially overlapping the first surface; a second layer having a higher elasticity and tensile strength than the first layer and includes a third portion at least partially overlapping the second portion, and a fourth portion extending from the third portion and at least partially overlapping the first portion; and a third layer disposed between the third portion and the first surface.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Minsoo Kim, Jiwoo Lee
  • Patent number: 12041191
    Abstract: An electronic apparatus is provided. The electronic apparatus includes a housing which comprises a front surface plate, a rear surface plate oriented in the opposite direction to the front surface plate, and a side surface member surrounding the space between the front surface plate and the rear surface plate, at least a portion of the side surface member including at least one conductive section positioned between a first non-conductive section and a second non-conductive section which are spaced apart from each other, a conductive extended portion part extending from at least a partial area of the conductive section to the space, a printed circuit board disposed in the space, and a wireless communication circuit disposed on the printed circuit board and electrically connected a point which is in the conductive section and spaced toward a first location from the first non-conductive section.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongyoun Kim, Jaesung Shim, Myeongsu Oh, Hojin Jung, Duho Chu
  • Patent number: 12041742
    Abstract: An apparatus simulates cable routing for determining signal integrity between electronic components within a computer chassis. The apparatus includes a base plate simulating a computer chassis base. The base plate includes a top surface. The apparatus further includes a plurality of reconfigurable mounting fixtures, each allowing temporary mounting of a printed circuit board assembly (PCBA) to a respective reconfigurable mounting fixture. Each of the plurality of reconfigurable mounting fixtures is temporarily mountable anywhere on the top surface of the base plate. The apparatus further includes a cable having a first end connector that allows a connection to a first PCBA, and a second end connector that allows a connection to a second PCBA.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: July 16, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chen-Chien Kuo, Chen Tseng
  • Patent number: 12041740
    Abstract: A waterproof case for automobile components includes: a case body part that includes a storage space for housing an object and an opening connecting to the storage space; and a lid part that is configured to be attached to the case body part to close the opening. A seal material (made of an adhesive silicone gel is interposed between the case body part and the lid part. An acceptance part is provided in at least one of the case body part and the lid part. An engagement convex part is configured to be locked in the acceptance part at a position corresponding to the acceptance part in the case body part and the lid part.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: July 16, 2024
    Assignees: DENSO CORPORATION, ThreeBond CO., Ltd.
    Inventors: Shinichi Okamoto, Yuka Taniguchi, Akihisa Kurokawa, Takanori Wachi, Yasutoshi Nogami
  • Patent number: 12019289
    Abstract: A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: June 25, 2024
    Assignee: Nubis Communications, Inc.
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Ron Zhang, Clinton Randy Giles
  • Patent number: 12022626
    Abstract: In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: June 25, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuya Fujisawa, Kohei Ushio, Kazuki Takabatake
  • Patent number: 12021357
    Abstract: An electrical connection box for installation in a vehicle includes a bus bar to electrically and thermally interconnect a plurality of electrical components electrically connected to a power storage device or in-vehicle load installed in the vehicle, a casing to house the plurality of electrical components and the bus bar, and an insulating heat dissipation member thermally connected to the bus bar and the casing, with at least two of the plurality of electrical components being disposed adjacent to each other, and the bus bar dissipating heat from the two electrical components via the heat dissipation member.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 25, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Ayaka Asano, Kazuya Komaki, Hiroki Shimoda, Taiji Yanagida
  • Patent number: 12016122
    Abstract: A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: June 18, 2024
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Xun Wang, Sheng Guo
  • Patent number: 12016125
    Abstract: An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: June 18, 2024
    Assignee: Daikin Industries, Ltd.
    Inventor: Mitsuhiro Tanaka
  • Patent number: 12007130
    Abstract: A control module configured to control operation of a damper assembly includes an air damper configured to be disposed within an air duct and movable between an open end position and a closed end position, the air duct providing conditioned air to a register boot proximate the air duct. The control module includes a control module housing that is securable to the register boot. A controller is disposed within the control module housing and is configured to generate damper position control signals, the controller providing the damper position control signals to the damper assembly via a control cable that operably couples the control module with the damper assembly. An antenna extends from the control module housing and is operably coupled to the controller, and is configured to extend through an opening formed within a wall of the register boot to be positioned exterior to the register boot.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: June 11, 2024
    Assignee: Ademco Inc.
    Inventors: Patrick Gonia, David J. Emmons, Nathan Carlson
  • Patent number: 12007817
    Abstract: A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yeon-Sun Na, Min-Soo Choi
  • Patent number: 12009758
    Abstract: A half-bridge includes a substrate, semiconductor switches, power connections and signal connections. The power and signal connections are formed in a flat conductor frame. The signal connections are electrically connected to the semiconductor switches such that they can be switched via the signal connections and the power connections are electrically connected to the semiconductor switches such that they allow or interrupt electricity transfer between the power connections. The semiconductor switches, signal connections, and power connections are on a first surface of the substrate in a casting compound. First end sections of the signal connections formed in the flat conductor frame each extend from a second surface orthogonal to the first surface, exiting the casting compound. Second end sections of the signal connections, which are separate from the flat conductor frame, are connected to the first end section outside the casting compound and are perpendicular to the first surface.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: June 11, 2024
    Assignee: ZF Friedrichshafen AG
    Inventors: Manuel Raimann, Sebastian Besold, Gerhard Müller, Pengshuai Wang
  • Patent number: 11991850
    Abstract: Securing a riser cage and/or electronic components coupled thereto within an information handling system can be accomplished using a riser cage apparatus. The riser cage may be configured to removably secure the electronic components to a surface of the information handling system using one or more fasteners configured to couple the riser cage to a surface of a chassis. The one or more fasteners may comprise a protrusion configured to engage a pin coupled to the surface. The protrusion of the one or more fasteners may be movable relative to the riser cage between a first locked position in which the pin coupled to the surface is engaged by the protrusion and a second unlocked position in which the pin coupled to the surface is not engaged by the protrusion.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: May 21, 2024
    Assignee: Dell Products L.P.
    Inventors: Hsiang-Yin Hung, Kuang-Hsi Lin, Yi-Hsin Kuan
  • Patent number: 11983356
    Abstract: A control device configured for use in a load control system to control one or more electrical loads may comprise an actuation member having a front surface defining a touch sensitive surface configured to detect a point actuation along at least a portion of the front surface, a touch sensitive circuit, and a control circuit. The touch sensitive device may comprise one or more receiving capacitive touch pads located behind the actuation member and arranged in a linear array adjacent to the touch sensitive surface. The control circuit may be configured to operate using different filtering techniques based on the state/mode of the control device and/or based on whether the positions of point actuations by a user along the touch sensitive surface indicate a fine tune or gross adjustment by the user. For example, the control circuit may generate an output signal using light/no filtering or using heavy filtering.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: May 14, 2024
    Assignee: Lutron Technology Company LLC
    Inventors: Dinesh Sundara Moorthy, Christoph Porwol, James P. Steiner
  • Patent number: 11983129
    Abstract: A Baseboard Management Controller (BMC) that may configure itself is disclosed. The BMC may include an access logic to determine a configuration of a chassis that includes the BMC. The BMC may also include a built-in self-configuration logic to configure the BMC responsive to the configuration of the chassis. The BMC may self-configure without using any BIOS, device drivers, or operating systems.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sompong Paul Olarig, Son T. Pham
  • Patent number: 11983059
    Abstract: The present disclosure includes apparatuses and methods related to a memory expansion card suitable for, relative to other memory solutions, a high-speed interface and low power consumption. The memory expansion card can have on-die error correction code (ECC) circuitry and, in some examples, additional on-board circuitry, components, or capability to manage, relative to other memory solutions, a large number of volatile or non-volatile memory devices. A memory expansion card may have a controller with a host interface capable of using or defined according to a quantity of bits (i.e., a bit width), which may be eight bits. The controller may coupled to memory devices via several channels, and each channel may have the bit width of the interface.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: May 14, 2024
    Assignee: Micron Technology, Inc.
    Inventor: Brent Keeth
  • Patent number: 11985782
    Abstract: A data storage device includes an enclosure and a Printed Circuit Board Assembly (PCBA) extending in a basal plane, and a plurality of semiconductor memory packages electromechanically bonded to the PCBA and coupled to the enclosure with thermal interface material. The data storage device further includes a first fitting coupled to a first end of the PCBA and the enclosure, restricting movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane. The data storage device further includes a second fitting coupled to a second end of the PCBA, allowing movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: May 14, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Bo Yang, Warren Middlekauff, Sean Lau, Ning Ye, Shrikar Bhagath, Yangming Liu
  • Patent number: 11955786
    Abstract: Provided is an electrical junction box that has a novel structure capable of stably preventing water from intruding into a case while simplifying the operation for connecting the electrical junction box and an external apparatus. An electrical junction box includes a circuit structure that includes a connection terminal for connection to an external apparatus, a case that has an insertion hole and houses the circuit structure, a relay terminal that is connected to the connection terminal, and includes an external connection portion that is inserted into the insertion hole and is exposed to the outside of the case, and a sealing member that is compressed between opposing surfaces of the insertion hole and the relay terminal and seals the insertion hole.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: April 9, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yusuke Isaji, Kenji Nakagawa
  • Patent number: 11953190
    Abstract: A controller (100) for mounting onto a socket (20) of an outdoor device (10) is disclosed. The controller comprises an inner body (110) comprising a first bottom surface from which an annular arrangement of electrical connection pins (102) for engaging with said socket extends, said inner body further housing control circuitry (132) for said outdoor device, said control circuitry being electrically connected to at least some of said electrical connection pins; and an outer body (120) rotationally mounted around the inner body, the outer body comprising a further bottom surface (122) around the first bottom surface and an outer cover (105) extending from said further bottom plate covering the control circuitry, the further bottom surface carrying an annular compressible gasket (104) for providing a weatherproof seal between the further bottom surface and the socket by rotational displacement of the outer body relative to the inner body.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 9, 2024
    Assignee: SIGNIFY HOLDING, B.V.
    Inventor: Zhi Pei Wang
  • Patent number: 11953750
    Abstract: The present disclosure relates to individual parking units or connector holders that have an interlock interface on each side thereof that tallow the connector holders to be directly connected together in a ganged relationship. The connector holders can include a detachable connection at a front end thereof to removable mount over a post to form a frictional engagement therewith. The post can be configured to attach to another structure with the connector holders.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: April 9, 2024
    Assignee: CommScope Technologies LLC
    Inventors: Erik David Bishop, Harry L Vaswani
  • Patent number: 11951727
    Abstract: A carbon decorative panel includes a carbon-toned irregular surface. The carbon-toned irregular surface has a plurality of unit patterns that constitute a weave of pseudo carbon fiber bundles presenting carbon fiber bundles in a pseudo manner, as the protrusions and depressions that form the carbon-toned pattern. A plurality of unit patterns each have a top portion positioned at the center in the extending direction of the pseudo carbon fiber bundle and a pair of curved portions positioned on both sides of the top portion in the extending direction and formed in a curved shape. The curvature of a pair of curved portions in the section along the extending direction of a pair of curved portions is greater on the center portion side than on the end portion side in the crossing direction that crosses the extending direction.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: April 9, 2024
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuya Hattori, Teruomi Sano
  • Patent number: 11953954
    Abstract: A variable holder module secures a variety of different expansion cards that may be installed within a computer or other information handling system. The holder module has a multi-sided component that is orientable according to which expansion card is to be secured within the computer. Each side of the component may thus correspond to a different one of the expansion cards. Once the expansion card is determined, a human or robotic picker need only orient component to the side that corresponds to the make/model of the expansion card. The holder module is thus adaptable to secure many different expansion cards that may be installed within the computer.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: April 9, 2024
    Assignee: Dell Products L.P.
    Inventors: Jing-Tang Wu, Tung-Yi Chen, Andrew O. Ingalls
  • Patent number: 11952054
    Abstract: There is provided an electric power steering apparatus in which at least one of a motor housing and a control unit has a respiratory apparatus that performs a respiratory action, based on an inner pressure change in at least one of the motor housing and the control unit.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 9, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshihito Asao, Yoshihiko Onishi, Toyoaki Udo
  • Patent number: 11942999
    Abstract: In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: March 26, 2024
    Assignee: Google LLC
    Inventors: Massimiliano Salsi, Shuang Yin
  • Patent number: 11923781
    Abstract: Provided is a power conversion device capable of suppressing an increase in cost and an increase in size of the device. A control board 113 that includes a connection unit 140 to which a signal connector 114 which transmits a signal is connected, a base member 120 that supports the control board 113 and has conductivity, and a case 110 that accommodates the control board 113 and the base member 120 and is connected to a ground is provided. The base member 120 includes a supporting portion 141 that is connected to one surface of the control board 113, and a first extending portion 130 of which one end is connected to the supporting portion 141 and the other end extends to the case 110 to be connected to the case 110. An electronic component 113a that generates noise is mounted on the control board 113, and the first extending portion 130 and the supporting portion 141 form an electrical path.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: March 5, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yoichiro Furuta, Kenichirou Nakajima, Yuta Numakura
  • Patent number: 11924981
    Abstract: A display device includes a display module, a back plate, and a bracket; a side face of the display module facing away from a display side is fixed on a first side face of the back plate, the bracket is fixed on a second side face of the back plate facing away from the first side face; the display module includes a display panel and a first frame, the first frame being disposed on a part of the display panel close to an edge, the bracket includes a second frame, and the display panel is positioned on an inner side of a frame body formed by the first frame and the second frame.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: March 5, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventor: Zifeng Wang
  • Patent number: 11903165
    Abstract: A fluid distribution system is incorporated into a server chassis. Connector plates have fluid connectors designed to connect with fluid cooling receptacles on server boards. A linkage system can be manually manipulated to translate the connector plates so as to engage the electronics boards and connect the fluid connectors to the receptacle. A pair of main connectors connect to the rack's fluid manifold to circulate cooling fluid to cool devices mounted onto the server boards. A locking mechanism can be included to mechanically lock the chassis to the rack to prevent accidental dismount of the chassis from the rack. Also, an anchor mechanism may be provided to apply counter force when engaging the connector plates with the server boards so as to prevent accidental dismount of the server board by the moving connector plate.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 13, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11901116
    Abstract: There is provided an internal-combustion-engine ignition coil apparatus in which an igniter in a connector assembly is contained in the case of the ignition coil apparatus, in which an adhesive bonds the igniter to a heat sink inserted into the case through an opening window of the case and an adhesive bonds the heat sink to the inner circumferential surface of the opening window, and in which the exposed portion of the heat sink is exposed to the outside of the case through the opening window.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: February 13, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenta Moriyama, Nobuyuki Sawazaki, Mitsuharu Hashiba
  • Patent number: 11889973
    Abstract: A vacuum cleaner of the present invention comprises: a main body having a suction motor for generating suction force; a main PCB capable of generating a control command for the suction motor; a handle part capable of accommodating the main body PCB; and a connector provided at the main body, and to which the main PCB is connected in a process of coupling the handle part to the main body. The main PCB includes a plurality of pads and a slit, and the connector includes: a plurality of connecting pins for making contact with the plurality of pads; and a slit insertion protrusion inserted into the slit.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 6, 2024
    Assignee: LG Electronics Inc.
    Inventors: Changjun Lee, Philjae Hwang, Mantae Hwang, Jungbae Hwang, Eunji Sung, Taekgi Lee
  • Patent number: 11882645
    Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, James Busby, Philipp K Buchling Rego, Steven Paul Ostrander, Thomas Anthony Wassick, William Santiago-Fernandez, Nihad Hadzic
  • Patent number: 11874712
    Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: January 16, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Herman Tan, Tien-Juei Chuang
  • Patent number: 11874163
    Abstract: The present application discloses an apparatus configured to measure characteristics of high power beams of laser energy used in material processing. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment separated from each other to reduce the transfer of thermal energy between them. Optical modules having optical sensors configured to measure characteristics of the high power beam are mounted in the first compartment. An optical window operative to allow a significant portion of the beam to propagate therethrough is mounted in an intermediate housing member separating the first and second compartments. A removable and replaceable beam dump configured to absorb most of the high power beam is positioned in the second compartment. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: January 16, 2024
    Assignee: OPHIR OPTRONICS SOLUTIONS, LTD.
    Inventors: Oleg Zinoviev, Karol Sanilevici, Alexandr Superfin
  • Patent number: 11867812
    Abstract: Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device comprises a secondary device and a coupling device coupled to the secondary device. The coupling device comprises a plurality of conductive members, including a first conductive member and a second conductive member. Each of the conductive members comprises a first end configured to electrically and mechanically couple to a primary circuit board and a second end electrically and mechanically coupled to the secondary device. Each of the plurality of conductive members has an attribute adjustable in response to a condition being added to the respective conductive member, and is configured to maintain the adjusted attribute after the condition is removed.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: January 9, 2024
    Assignee: Velodyne Lidar USA, Inc.
    Inventors: David S. Hall, Anand Gopalan, Cristhian Octavio Reyes, Thomas Richardson Tewell, Mathew Noel Rekow
  • Patent number: 11862570
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Joo Kim, Sun Chul Kim, Min Keun Kwak, Hyun Ki Kim, Hyung Gil Baek, Yong Kwan Lee
  • Patent number: 11863695
    Abstract: A flexible substrate has a first dynamic region separated from a second dynamic region along a central axis by a central region. One or both of the first dynamic region and/or the second dynamic region define at least one aperture having a major axis oriented substantially parallel with the central axis.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: January 2, 2024
    Assignee: Motorola Mobility LLC
    Inventors: Ngee J Lee, Caleb Smith, Keith J Pump, Robert Murdock
  • Patent number: 11864337
    Abstract: Systems involve implementations including an electronic hub device with electronic device interface ports and with protrusions for coupling with a base assembly of a stand system wherein the electronic hub device is positioned in an internal cavity of the base assembly when the electronic hub device is coupled to the base assembly. Other aspects are described in the claims, drawings, and text forming a part of the present disclosure.
    Type: Grant
    Filed: August 15, 2023
    Date of Patent: January 2, 2024
    Assignee: Pioneer Square Brands, Inc.
    Inventors: Riley Edwin Lynch, Sudeep Balkrishna Agalgaonkar
  • Patent number: 11852931
    Abstract: A display unit of the present disclosure includes: a first plate-like member including a display device; a second plate-like member including a drive circuit, the drive circuit configured to control the display device; and one or two or more wiring sections having flexibility, the wiring sections configured to connect the first plate-like member and the second plate-like member to each other, in which a curvature of the second plate-like member is larger than 0 and equal to or smaller than a curvature of the first plate-like member.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: December 26, 2023
    Assignee: SATURN LICENSING LLC
    Inventor: Seiji Shibahara
  • Patent number: 11854978
    Abstract: An integrated circuit includes a device, a first interconnect structure disposed above the device and a second interconnect structure positioned below the device. The first interconnect structure includes multiple frontside metal layers. The second interconnect structure includes multiple backside metal layers, where each backside metal layer includes metal conductors routed according to diagonal routing. In some embodiments, a backside interconnect structure can include another backside metal layer that includes metal conductors routed according to mixed-Manhattan-diagonal routing. A variety of techniques can be used to route signals between metal conductors in the backside interconnect structure and cells on one or more frontside metal layers.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng-Hsiung Chen, Jerry Chang Jui Kao, Kuo-Nan Yang, Jack Liu