With Housing Or Chassis Patents (Class 361/752)
  • Patent number: 12262499
    Abstract: The invention relates to an assembly of an electric power supply module and of a protective device for said module, said assembly being intended to equip an air-conditioning unit, in particular for a motor vehicle, said power supply module comprising a housing provided with regions allowing penetration of liquid into the housing, the protective device extending at least partially facing said regions so as to cause the liquid to flow beyond said regions, depending on the orientation of said power supply module.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: March 25, 2025
    Assignee: VALEO SYSTEMES THERMIQUES
    Inventors: Sébastien Colinet, Serif Karaaslan
  • Patent number: 12262103
    Abstract: A vehicular camera assembly includes a printed circuit board, a metallic shield element at least partially enclosing the printed circuit board, and a housing at least partially enclosing the shield element. The housing includes a front housing portion accommodating a lens. An imager is disposed at the printed circuit board and is optically aligned with the lens. The camera assembly includes an electrical connector for electrically connecting an electrical connecting element of the printed circuit board to a wire harness of a vehicle. The shield element includes at least one seam, with one or more seams including a respective gap between opposing edge regions of the shield element and an overlapping tab that extends from one of the opposing edge regions that at least partially closes the respective seam. The housing and the shield element are in contact.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: March 25, 2025
    Assignee: Magna Electronics Inc.
    Inventors: Nazar F. Bally, James L Smith, Jonathan D. Conger
  • Patent number: 12262518
    Abstract: A circuit board assembly includes a circuit board, a noise source and a shielding cover. The circuit board has an upper surface, a lower surface and a plurality of grounding areas. The lower surface faces away from the upper surface, and the grounding areas are located at the lower surface. The noise source is located at the upper surface of the circuit board. The shielding cover includes a covering body and a plurality of elastic grounding arms. The covering body is in contact with the upper surface and covers the noise source. The elastic grounding arms are connected to the covering body. The elastic grounding arms are in contact with the lower surface of the circuit board and respectively in electrical contact with the grounding areas.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: March 25, 2025
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Yu Shu Tai, Chih-Cheng Li
  • Patent number: 12255120
    Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: March 18, 2025
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies Corporation
    Inventors: Yoshitaka Kato, Takeshi Endo, Kazuhiro Tsuruta
  • Patent number: 12255581
    Abstract: A rapid shutdown device for rapidly de-energizing a photovoltaic module system is disclosed. The rapid shutdown device includes power lines connected to a photovoltaic string of modules on a roof of a structure. A high voltage switch on a first power line is disconnected when the high voltage switch is open. The rapid shutdown device includes a gate drive circuit that receives an electronic photovoltaic string status signal associated with an operating status of the photovoltaic string. The date drive circuit may determine that the operating status indicates the presence of a hazard based on the electronic photovoltaic string status signal. Based on the presence of the hazard, the rapid shutdown device generates a high voltage switch command signal to cause the high voltage switch to open to disconnect the photovoltaic string from an electrical connection to a grid power supply, thereby enhancing protection of the string and safety for responders.
    Type: Grant
    Filed: September 17, 2024
    Date of Patent: March 18, 2025
    Assignee: GAF Energy LLC
    Inventors: Babak Farhangi, Hasib Amin, Lewis Abra, Richard Perkins
  • Patent number: 12255580
    Abstract: A rapid shutdown device for rapidly de-energizing a photovoltaic module system is disclosed. The rapid shutdown device includes power lines connected to a photovoltaic string of modules on a roof of a structure. A high voltage switch on a first power line is disconnected when the high voltage switch is open. The rapid shutdown device includes a gate drive circuit that receives an electronic photovoltaic string status signal associated with an operating status of the photovoltaic string. The date drive circuit may determine that the operating status indicates the presence of a hazard based on the electronic photovoltaic string status signal. Based on the presence of the hazard, the rapid shutdown device generates a high voltage switch command signal to cause the high voltage switch to open to disconnect the photovoltaic string from an electrical connection to a grid power supply, thereby enhancing protection of the string and safety for responders.
    Type: Grant
    Filed: October 12, 2023
    Date of Patent: March 18, 2025
    Assignee: GAF Energy LLC
    Inventors: Babak Farhangi, Hasib Amin, Lewis Abra, Richard Perkins
  • Patent number: 12256506
    Abstract: A wireless switching controller for media devices is provided, including a main body and a remote controller. The remote controller includes a first housing having a cavity, the main body includes a main device body and a clamping component, and the clamping component is rotatably connected to the main device body through a rotating shaft. The remote controller is communicated with the main device body through a wireless communication manner. The main device body is partially or completely detachably accommodated in the cavity, and a transmission unit is disposed between the remote controller and the main device body for transmitting electrical power.
    Type: Grant
    Filed: August 7, 2024
    Date of Patent: March 18, 2025
    Inventor: Yuanhui Zhang
  • Patent number: 12250765
    Abstract: An anti-interference surface mount electronic component includes a surface mount electronic component body having an outer side adapted to be grounded. An anti-interference layer unit is disposed on the outer side of the surface mount electronic component body. The outer side of the surface mount electronic component body includes two electrodes disposed in two symmetric directions extending along a planar surface. The two electrodes together define a separation area on the outer side of the surface mount electronic component body. The separation area includes a grounding end. The anti-interference layer unit includes a first anti-interference layer formed of an anti-interference coating. The first anti-interference layer is disposed around the separation area and an outer side of the grounding end and is spaced from each of the two electrodes. The first anti-interference layer includes an opening facing the grounding end.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: March 11, 2025
    Assignee: Kaotek Electronic Technology Co., Ltd.
    Inventor: Keng-Kuei Su
  • Patent number: 12235697
    Abstract: Disclosed is a modular energy system that comprises a first module, comprising a first panel, and a first connector attached to the first panel. A portion of the first connector extends past a first edge of the first panel. The modular energy system further comprises a second module, comprising a second panel, and a second connector attached to the second panel. The second connector is aligned with a second edge of the second panel, and the second connector defines a cavity. The second module is coupled to the first module, wherein the portion of the first connector that extends past the first edge of the first panel is positioned within the cavity defined by the second connector.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: February 25, 2025
    Assignee: Cilag GmbH International
    Inventors: Madeleine C. Jayme, Ryan M. Asher, William B. Weisenburgh, II, Joshua M. Henderson
  • Patent number: 12235548
    Abstract: The present application provides a display panel, a manufacturing method thereof, and a display device. The display panel includes an upper substrate and a lower substrate that are arranged opposite to each other, a liquid crystal layer, a first electrode layer, and a second electrode layer, wherein the first electrode layer is disposed on a side of the upper substrate close to or away from the liquid crystal layer, the second electrode layer is disposed on a side of the upper substrate away from the first electrode layer, and the first electrode layer and the second electrode layer are electrically connected to each other.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: February 25, 2025
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Liang Li
  • Patent number: 12230877
    Abstract: Disclosed is an electronic device may include a housing including a plate including a first surface, and a support bracket including a (1-1)th side wall extending from an edge of the first surface and a (1-2)th side wall separated from the (1-1)th side wall by a first segmented portion, a camera bracket electrically connected to the (1-2)th side wall of the housing, and a printed circuit board disposed within the housing. An antenna pattern provided on the support bracket may include a conductive portion forming at least a portion of the (1-1)th side wall, and a ground portion connected to the conductive portion may be located between the camera bracket and the first segmented portion.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: February 18, 2025
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Woongeun Kwak, Jungsik Park, Sunghyup Lee, Heeseok Jung
  • Patent number: 12225700
    Abstract: A display panel, a display module and a manufacture method thereof, and a communication device are provided. The display panel includes a display substrate and a multiplexing circuit arranged on a first surface of the display substrate. The display panel further includes a wave-absorbing material layer arranged on a second surface of the display substrate. The wave-absorbing material layer is configured to absorb electromagnetic wave interference signals. The second surface is a surface opposite to the first surface.
    Type: Grant
    Filed: January 22, 2024
    Date of Patent: February 11, 2025
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chao Wang, Binfeng Feng, Yonghui Luo, Fei Li, Yupeng Chen, Jiaxiang Wang, Zijie Zhang, Qifeng Li
  • Patent number: 12219721
    Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
    Type: Grant
    Filed: December 5, 2023
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Seon Gyun Baek, Won-Gi Hong
  • Patent number: 12219664
    Abstract: Systems for monitoring a sump pump are provided. A system includes a power adapter designed to receive power from a power source. The power adapter is provided in the form of a controller establishing a wireless connection a wireless network and a housing having a first receptacle and a second receptacle. The first receptacle and the second receptacle are designed to accept a float-switch input and a sump pump input, respectively. The float-switch input and the sump pump input are electrically coupled to controller and the power source when accepted by the first receptacle and the second receptacle, respectively.
    Type: Grant
    Filed: October 12, 2023
    Date of Patent: February 4, 2025
    Assignee: Pentair Flow Technologies, LLC
    Inventors: Hassan Khalid, Nicola Sgambelluri, Brian Broga, Brian Boothe, Dan Featherstone
  • Patent number: 12212085
    Abstract: It is aimed to prevent the damage of terminal fittings. A connector device (A) is provided with a case formed with an opening portion in a front surface and having an open lower surface, and a board connector including L-shaped terminal fittings and a housing to be mounted into the opening portion. The terminal fitting includes a penetrating portion extending in a front-rear direction and a board connecting portion extending downward from a rear end of the penetrating portion and to be accommodated into the case. The housing includes a terminal holding member for holding the penetrating portions penetrating therethrough, the terminal holding member being mounted into the opening portion from behind, and a protecting member separate from the terminal holding member, the protecting member surrounding front end parts of the penetrating portions by being mounted into the opening portion from front.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: January 28, 2025
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kenji Makino, Toshikazu Sakurai
  • Patent number: 12200872
    Abstract: A control device for a motor vehicle is provided. The control device includes a printed circuit board having a first side and an edge. The first side of the printed circuit board is delimited by the edge. The control device includes at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board). The control device also includes a first conductor loop formed as a resistor and arranged on the first side of the printed circuit board. The first conductor loop is arranged between the edge and the electronic component. The control device also includes an encapsulation of the printed circuit board. The encapsulation surrounds at least the first side, the at least one electronic component and the first conductor loop.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: January 14, 2025
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Johannes Bock, Johannes Brunner, Christian Walda, Karin Beart, Jens Heinrich
  • Patent number: 12200856
    Abstract: A circuit board has an upper face and a lower face. The circuit board comprises at least two circuits, with each of the at least two circuits comprising at least one conductor track and at least one current carrying electronic component. The circuit board has at least one through-hole which is provided with at least one insulating unit. The at least one insulating unit is arranged in the at least one through-hole and so is mechanically connected to the circuit board and thus is positioned between a first circuit and at least one second circuit of the circuit board.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: January 14, 2025
    Assignee: HARTING Electric Stiftung &Co. KG
    Inventor: Norbert Kropiewnicki
  • Patent number: 12171081
    Abstract: A crossbar is provided that is operable to be removably installed in a sled for a modular server and/or information handling system, for example a network equipment building system. The crossbar includes a frame, a keystone portion of the frame forming a keystone air duct, and a riser guide extending from the frame. The keystone portion is operable to direct air flow through the keystone air duct towards a heat sink and/or a CPU. The riser guide is operable to align a riser to be plugged into a motherboard installed in the sled. The frame is operable to be a structural component that is substantially coupled to the sled chassis.
    Type: Grant
    Filed: January 17, 2024
    Date of Patent: December 17, 2024
    Assignee: ZT Group Int'l, Inc.
    Inventors: Michael Dennis Marcade, Ellie Elsu, Mark Hammond, Vladimir Igor Lipnevici, Bradley Andrew Jackson
  • Patent number: 12160969
    Abstract: A card support is provided that passively and automatically adapts to variations in the length of an electronic card. When a card is inserted into a slotted bar of the card support, variations in the length of that card are adjusted for by the compression or expansion of a spring disposed between the slot and a supporting face.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: December 3, 2024
    Assignee: ZT Group Int'l, Inc.
    Inventors: Mark Alan Hammond, Vladimir Igor Lipnevici, Michael Dennis Marcade
  • Patent number: 12145052
    Abstract: A game controller for a mobile device, the game controller including a first handle, a second handle, a bridge, and a flat, flexible cable. The first handle is configured to contact and support a mobile device. The first handle includes a user-accessible, first hardware interface on a main body portion of the first handle that is configured to accept touch inputs. The second handle is configured to contact and support the mobile device. The second handle includes a user-accessible, second hardware interface on a main body portion of the second handle that is configured to accept touch inputs. The bridge couples the first handle to the second handle. The bridge is in sliding engagement with the first handle and the second handle. The flat, flexible cable is configured to conduct an electrical signal between the first handle and the second handle.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: November 19, 2024
    Assignee: Backbone Labs, Inc.
    Inventors: Maneet Singh Khaira, Atsushi Shirata, Gregory Robert Cerny, Wei-Jun Wang, Jon Lake
  • Patent number: 12150259
    Abstract: A container that has a mechanical tolerance compensatory element includes a housing, an electronic assembly, a cover, and an attachment member. The housing defines an electronic assembly recess. The electronic assembly is disposed within the electronic assembly recess and contacts the housing. The cover is attached to the housing, has a center, and defines an attachment member portion, a slot, and a first projection. The slot is disposed between the attachment member portion and the center of the cover. The first projection extends into the electronic assembly recess and contacts the electronic assembly such that the electronic assembly is retained between the housing and the cover. The attachment member is disposed at the attachment member portion defined by the cover and attaches the cover to the housing.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: November 19, 2024
    Assignee: Lear Corporation
    Inventors: Georg Nickol, Dominik Fischer
  • Patent number: 12150253
    Abstract: A system and method of mounting and electrically contacting a first printed circuit board perpendicularly onto a second printed circuit board within a housing includes inserting the first printed circuit board into an upper part of the housing using a stop surface arranged on an inner side surface of the upper part of the housing and arranged to support the electrical contacting and assembly, locking the first printed circuit board in the upper part of the housing using a locking system, and mounting the upper part of the housing with the locked printed circuit board on a lower part of the housing in which the second printed circuit board is mounted.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: November 19, 2024
    Assignee: ABB AG
    Inventor: Stefan Gutermuth
  • Patent number: 12144144
    Abstract: A cooling device for a vehicle electronic control unit, ECU. The cooling device includes a casing for covering the ECU and having a heat absorbing face for absorbing heat from components of the ECU and a heat dissipating face for dissipating absorbed heat. A plurality of fans are mounted to the heat dissipating face and are arranged to direct airflow over respective regions of the heat dissipating face. The fans are independently controllable for being driven at different speeds to vary the cooling of the respective regions of the heat dissipating face.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: November 12, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Jakub Korta, Klaus Kaufmann
  • Patent number: 12135387
    Abstract: A radar device with a housing, with a shield, with an interconnect device, with an electronic circuit arrangement, and with antennas. A circuit arrangement has electronic components, and at least some of the electronic components are arranged on a first side of the interconnect device. The antennas are arranged on a second side of the interconnect device. The shield and the interconnect device, with the components and antennas arranged on it, are surrounded by the housing. The shield has at least one hole, into which at least one of the first components (arranged on the first side of the interconnect device) protrudes, or through which at least one of the components (arranged on the first side of the interconnect device) protrudes. The remaining components (arranged on the first side of the interconnect device), with the exception of connecting elements, are arranged entirely between the first side of the interconnect device and the shield.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: November 5, 2024
    Assignee: Hella GmbH & Co. KGaA
    Inventor: Michael Schulte
  • Patent number: 12136940
    Abstract: Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: November 5, 2024
    Assignee: IMTECHNOLOGY.CO., LTD
    Inventors: Seung Kyun Ryu, Sook Eun Baek
  • Patent number: 12133342
    Abstract: According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: October 29, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Geuna Lee, Jinho Lim, Minsu Jung, Kwonho Son
  • Patent number: 12122666
    Abstract: A microelectronics H-frame device includes: a stack of two or more substrates wherein the substrate stack comprises a top substrate and a bottom substrate, wherein bonding of the top substrate to the bottom substrate creates a vertical electrical connection between the top substrate and the bottom substrate, wherein the top surface of the top substrate comprises top substrate top metallization, wherein the bottom surface of the bottom substrate comprises bottom substrate bottom metallization; mid-substrate metallization located between the top substrate and the bottom substrate; a micro-machined top cover bonded to a top side of the substrate stack; and a micro-machined bottom cover bonded to a bottom side of the substrate stack.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: October 22, 2024
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Dah-Weih Duan, Elizabeth T. Kunkee, Martin E. Roden, Laura M. Woo
  • Patent number: 12126147
    Abstract: Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: October 22, 2024
    Assignee: Legrand DPC, LLC
    Inventors: Carrel W. Ewing, Andrew J. Cleveland, James P. Maskaly
  • Patent number: 12127359
    Abstract: An object is to provide a technique capable of increasing waterproofness of an electronic unit. An electronic unit includes: a case including an opening; a circuit board housed in the case through the opening; and a cover attached to the opening, wherein a protruding portion is provided on at least one side wall of the case, and the protruding portion includes a step that causes an opening side portion of the side wall to protrude further outward relative to a rear side portion of the side wall, and is provided so as to extend along the periphery of the opening.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: October 22, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Tatsuya Sumida
  • Patent number: 12119344
    Abstract: Multi-layer etch stop layers are described. In an example, an integrated circuit structure includes a conductive line in a first interlayer dielectric material above a substrate. A first dielectric etch stop layer, a second dielectric layer and a third dielectric layer are on the conductive line and the first interlayer dielectric material. A second interlayer dielectric material is on the third dielectric etch stop layer. An opening is in the second interlayer dielectric material, in the third dielectric etch stop layer, and in the second dielectric etch stop layer, in the first dielectric etch stop layer. A conductive structure is in the opening, the conductive structure in direct contact with the conductive line.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: October 15, 2024
    Assignee: Intel Corporation
    Inventors: Anthony V. Mule', David J. Towner, Dragos Seghete, Christopher R. Ryder, Angel Aquino Gonzalez
  • Patent number: 12114462
    Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: October 8, 2024
    Assignee: National Instruments Corporation
    Inventors: Richard G. Baldwin, Jr., Michael H. Singerman
  • Patent number: 12108555
    Abstract: An interconnecting module configured to be mounted in a High-Performance Computing (HPC) cabinet in order to interconnect a plurality of computing units located in the HPC cabinet. The interconnecting module comprising a chassis configured to be mounted horizontally within housings defined in the computing units, a plurality of connection units spaced vertically, each connection unit being configured to be connected to a motherboard of a computing unit, the connection units being interconnected, each connection unit comprising at least a fastening member configured to cooperate with a housing of a computing unit, a vertical rack cooperating with all the fastening members and at least a main lever mounted pivotally on the chassis, the main lever being configured to move the vertical rack vertically in order to engage/disengage all the fastening members simultaneously.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: October 1, 2024
    Assignee: BULL SAS
    Inventors: Sakthivel Mohanasundaram, Vishwas Bs
  • Patent number: 12108581
    Abstract: A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: October 1, 2024
    Inventors: Gustavo Dario Leizerovich, Ivan Quiroz, Claudio Santiago Ribeiro, Cesar Eduardo Nunez, Steven Kenneth Mackiewicz
  • Patent number: 12108573
    Abstract: An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 1, 2024
    Assignee: KUBOTA CORPORATION
    Inventors: Motohiro Kawanabe, Koji Nakakita, Kenji Nishioka, Misaki Yamada
  • Patent number: 12101111
    Abstract: A small cell access node includes a housing, a radio module, a power supply module, and one or more antennas coupled to the radio module. The housing includes a floor and at least one sidewall extending around a perimeter of the floor. An air intake section of the sidewall is located at a first lengthwise end of the floor and defines an air intake port. An air exhaust section of the sidewall is located at a second lengthwise end of the floor and defines an air exhaust port. The floor includes a two floor portions residing primarily in different planes and an angled transition portion interconnecting the two floor portions. The transition portion defines an air and water exhaust port to allow water that enters the housing through the air intake and air exhaust ports, such as from wind-driven rain, to drain out of the housing.
    Type: Grant
    Filed: September 24, 2022
    Date of Patent: September 24, 2024
    Inventors: Gustavo Dario Leizerovich, Claudio Santiago Ribeiro, Cesar Eduardo Nunez, Fernando Ferrales
  • Patent number: 12089358
    Abstract: A capacitor unit includes: a base portion with a mount surface, and a locking member. The locking member includes a shaft portion to be inserted in a hole provided in the mount surface and a head portion. A first guide member and a second guide member guide along an anteroposterior direction, a first end and a second end of the base portion in a lateral direction, respectively. The hole is located between the capacitor and the first end in the lateral direction, and arranged at a position more distant from an opening than the first guide member in the anteroposterior direction. At a first engagement position, the locking member abuts on the first guide member. At a second engagement position, abutment of the locking member on the first guide member is canceled.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: September 10, 2024
    Assignee: TMEIC CORPORATION
    Inventor: Keishi Yamane
  • Patent number: 12082353
    Abstract: The present application provides a splicing display device, which comprises a box body, a bracket, a plurality of display panels, a plurality of panel fixing members, and a plurality of bracket fixing members. The bracket is detachably disposed on the box body. The plurality of display panels are detachably disposed on the bracket. The plurality of panel fixing members fix the display panel and the bracket. The plurality of bracket fixing members fix the bracket and the box body.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: September 3, 2024
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Guanqiao Zhao, Zhongyin Lu, Lijian Xiao
  • Patent number: 12075574
    Abstract: An electronic control device includes: an electronic circuit board on which an electronic component is packaged; and a housing in which the electronic circuit board is contained, and which is composed of a case and a base. The electronic control device includes: a plurality of claws which is provided in the case of the housing and fixes the electronic circuit board; a fixing groove which is formed in the case on the rear side of the claws, and into which a peripheral edge portion of the base is close-fitted; a cutout which is formed on the rear side of the claws of the housing and is communicated with the fixing groove; and adhesive which is filled on the rear side of the claws via the fixing groove and the cutout.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: August 27, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaaki Tanaka, Fumino Suzuki
  • Patent number: 12074363
    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: August 27, 2024
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Michael B. Wittenberg, Shane Bustle, Duy P. Le
  • Patent number: 12069797
    Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: August 20, 2024
    Assignee: MEIDENSHA CORPORATION
    Inventor: Shota Suzuki
  • Patent number: 12061364
    Abstract: A fiber optic ferrule push includes a main body extending between a front end and a rear end, the main body having a central opening extending between the front end and the rear end to receive a plurality of optical fibers therethrough, a front facing surface configured to engage a rear surface of a fiber optic ferrule, and at least one projection extending outward from the main body to engage a housing configured to receive the fiber optic ferrule, the fiber optic ferrule push may also include a key extending outward from a surface of the main body. The fiber optic ferrule push may be paired with a fiber optic ferrule in a fiber optic assembly.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 13, 2024
    Assignee: US Conec Ltd.
    Inventors: Mitchell Cloud, Craig M. Conrad, Jason Higley, Darrell R. Childers
  • Patent number: 12057655
    Abstract: A protector includes a base member and a cover member. The base member includes a pair of guide grooves extending along an attachment direction in which the cover member is attached to the base member and disposed on respective bilateral sides in a width direction perpendicular to the attachment direction, walls facing attachment direction-side ends of guide grooves in the attachment direction, and lock portions facing detachment direction-side ends of the guide grooves in a detachment direction.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: August 6, 2024
    Assignee: YAZAKI CORPORATION
    Inventors: Ryohei Toyoda, YoungHo Jang, Hidetoshi Hamada, Ryo Matsubayashi
  • Patent number: 12052845
    Abstract: A circuit board of an electronic control device has a surface to which a connector is attached and on which a heat generating component is mounted. A metal casing that stores therein the circuit board has an opposing surface that faces the surface of the circuit board on which the heat generating component is mounted. A first fin that protrudes toward the surface on which the heat generating component is mounted is provided on the opposing surface of the casing. The first fin overlaps the heat generating component in the thickness direction of the circuit board.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: July 30, 2024
    Assignee: HITACHI ASTEMO, LTD.
    Inventor: Takanori Sawaki
  • Patent number: 12041195
    Abstract: An electronic apparatus includes a housing; a first structure disposed inside the housing and includes a first surface; a second structure including a second surface facing the one surface of the housing; and a flexible printed circuit board (FPCB) structure disposed inside the housing. The FPCB structure includes: an FPCB including at least one coil; a thermally conductive first layer, including a first portion partially overlapping the FPCB and disposed between the FPCB and the second surface, and a second portion extending from the first portion and partially overlapping the first surface; a second layer having a higher elasticity and tensile strength than the first layer and includes a third portion at least partially overlapping the second portion, and a fourth portion extending from the third portion and at least partially overlapping the first portion; and a third layer disposed between the third portion and the first surface.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Minsoo Kim, Jiwoo Lee
  • Patent number: 12041742
    Abstract: An apparatus simulates cable routing for determining signal integrity between electronic components within a computer chassis. The apparatus includes a base plate simulating a computer chassis base. The base plate includes a top surface. The apparatus further includes a plurality of reconfigurable mounting fixtures, each allowing temporary mounting of a printed circuit board assembly (PCBA) to a respective reconfigurable mounting fixture. Each of the plurality of reconfigurable mounting fixtures is temporarily mountable anywhere on the top surface of the base plate. The apparatus further includes a cable having a first end connector that allows a connection to a first PCBA, and a second end connector that allows a connection to a second PCBA.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: July 16, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chen-Chien Kuo, Chen Tseng
  • Patent number: 12041740
    Abstract: A waterproof case for automobile components includes: a case body part that includes a storage space for housing an object and an opening connecting to the storage space; and a lid part that is configured to be attached to the case body part to close the opening. A seal material (made of an adhesive silicone gel is interposed between the case body part and the lid part. An acceptance part is provided in at least one of the case body part and the lid part. An engagement convex part is configured to be locked in the acceptance part at a position corresponding to the acceptance part in the case body part and the lid part.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: July 16, 2024
    Assignees: DENSO CORPORATION, ThreeBond CO., Ltd.
    Inventors: Shinichi Okamoto, Yuka Taniguchi, Akihisa Kurokawa, Takanori Wachi, Yasutoshi Nogami
  • Patent number: 12041191
    Abstract: An electronic apparatus is provided. The electronic apparatus includes a housing which comprises a front surface plate, a rear surface plate oriented in the opposite direction to the front surface plate, and a side surface member surrounding the space between the front surface plate and the rear surface plate, at least a portion of the side surface member including at least one conductive section positioned between a first non-conductive section and a second non-conductive section which are spaced apart from each other, a conductive extended portion part extending from at least a partial area of the conductive section to the space, a printed circuit board disposed in the space, and a wireless communication circuit disposed on the printed circuit board and electrically connected a point which is in the conductive section and spaced toward a first location from the first non-conductive section.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongyoun Kim, Jaesung Shim, Myeongsu Oh, Hojin Jung, Duho Chu
  • Patent number: 12021357
    Abstract: An electrical connection box for installation in a vehicle includes a bus bar to electrically and thermally interconnect a plurality of electrical components electrically connected to a power storage device or in-vehicle load installed in the vehicle, a casing to house the plurality of electrical components and the bus bar, and an insulating heat dissipation member thermally connected to the bus bar and the casing, with at least two of the plurality of electrical components being disposed adjacent to each other, and the bus bar dissipating heat from the two electrical components via the heat dissipation member.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 25, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Ayaka Asano, Kazuya Komaki, Hiroki Shimoda, Taiji Yanagida
  • Patent number: 12019289
    Abstract: A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: June 25, 2024
    Assignee: Nubis Communications, Inc.
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Ron Zhang, Clinton Randy Giles
  • Patent number: 12022626
    Abstract: In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: June 25, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuya Fujisawa, Kohei Ushio, Kazuki Takabatake