Abstract: An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.

Abstract: A multi-winding inductor includes a first foil winding and a second foil winding. One end of the first foil winding extends from a first side of the core and wraps under the core to form a solder tab under the core. One end of the second foil winding extends from a second side of the core and wraps under the core to form another solder tab under the core. Respective portions of each solder tab are laterally adjacent under the magnetic core. A coupled inductor includes a magnetic core including a first and a second end magnetic element and a plurality of connecting magnetic elements disposed between and connecting the first and second end magnetic elements. A respective first and second single turn foil winding is wound at least partially around each connecting magnetic element. Each foil winding has two ends forming respective solder tabs.

Abstract: Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.

Abstract: A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote from a power section mounting the MOSFETs. The present invention reduces the assembly steps required in the prior art wherein the MOSFET and its control circuit were mounted as preassembled units to the board. Moreover, the number of MOSFETs per unit area of board is increased by the present invention.

Abstract: A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, and capacitors is disclosed. Pairs of groups of switching elements are mounted on the substrate. Each of the positive interconnection member and the negative interconnection member has a terminal portion. The terminal portion has a joint portion that is electrically joined to a circuit pattern on the substrate. The switching elements are arranged in the same number on both sides of the joint portion of at least the positive interconnection member of the positive and negative interconnection members.

Abstract: A method for fabricating a point-of-load (POL) power supply system can include providing a circuit board. The circuit board can include a first set of connections configured for coupling a predetermined first portion of components of a voltage regulator down (VRD) system to the circuit board and a second set of connections configured for coupling a replacement module to the circuit board. Each of the first set of connections and the second set of connections is electrically coupled with a third set of connections that is configured for coupling a second portion of components of the VRD system to the circuit board. The second portion of components of the VRD system is connected to the circuit board. The replacement module is connected onto the circuit board via the second set of connections such that the replacement module and the second portion of components of the VRD system cooperate to provide at least a portion of the POL system.

Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.

Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

Abstract: A contact bank, which can be terminated, or is terminated, at least one terminal module serving for signal communication and being adapted to allow telecommunications lines to be connected therewith, or at least one supplementary module, of a telecommunications distribution point, which is connected to a terminal module, whereby the contact bank further is mountable or mounted in the telecommunications distribution point, includes: (a) a plurality of tapping contacts directly and permanently electrically connected to the contacts of the module in the terminated condition of said contact bank; (b) a smaller number of outlet contacts than of tapping contacts; (c) a plurality of remote-controllable switches for selectively electrically connecting said outlet contacts to said tapping contacts; and (d) a control device for controlling the plurality of switches.

Abstract: An electronic apparatus is provided that can include a circuit board; a switch attached to the circuit board; an electronic part mounted on the circuit board; a wiring pattern extending between the switch and the electronic part; and a protrusion protruding from a surface of the wiring pattern. The protrusion may be disposed adjacent to the switch on the circuit board and overlapping the wiring pattern.

Abstract: An electronic apparatus that includes: a circuit board; a switch attached to the circuit board; an electronic part mounted on the circuit board; a wiring pattern extending between the switch and the electronic part; and a protrusion protruding from a surface of the wiring pattern, the protrusion being disposed adjacent to the switch on the circuit board and overlapping the wiring pattern.

Abstract: A circuit breaker includes a housing, a rigid circuit board, and a flexible circuit board. The rigid circuit board is enclosed within the housing and has a main surface for supporting an electronic component. The flexible circuit board has a first end that is directly attached to an edge of the rigid circuit board.

Abstract: A Subsea Electronics Module for a well installation, comprising: a housing; at least two printed circuit boards having control circuitry provided thereon; and a communications component for enabling communication between the control printed circuit boards; wherein the module further comprises a communications handling board operatively connected to the printed circuit boards, the communications component being mounted on the communications handling board.

Abstract: A control system suitable for use with a bathing unit system having a water receptacle is provided. The control system comprises a heating module, a power source and a controller in communication with the heating module and the power source. The power source includes an energy storage member for storing energy collected from a solar panel, and is operative for supplying power generated from solar energy to the heating module. The controller is operative for causing the power source to supply power to the heating module at least in part based on first information derived from a temperature of the water within the water receptacle and second information derived from a condition associated with the power source. The controller is further operative for selecting between a first power source and a second power source for supplying power to the heating module.

Abstract: A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, and capacitors is disclosed. Pairs of groups of switching elements are mounted on the substrate. Each of the positive interconnection member and the negative interconnection member has a terminal portion. The terminal portion has a joint portion that is electrically joined to a circuit pattern on the substrate. The switching elements are arranged in the same number on both sides of the joint portion of at least the positive interconnection member of the positive and negative interconnection members.

Abstract: A push button switch includes a base part (22) provided with a snap dome (23b) and a fixed contact (23a), a cover member (24) disposed to cover the base part (22) and having at one side surface an opening (42), an operating controller (25) disposed to slide inside the opening (42) in a lateral direction and configured to press the snap dome (23b) downwardly. The cover member (24) includes side extended potions (36) provided to extend downwardly from the cover member (24) along side surfaces of the base part across the operating controller (25) in a direction perpendicular to a sliding direction of the operating controller (25). Lower end portions of the side plate portions (36) are provided with extensions (38) disposed adjacent to some of the solder pad portions (41) provided on a lower surface of the base part (22).

Abstract: A wiring board for use in mounting an electronic component includes a switch element portion interposed in a signal transmission line including a wiring layer linked to an electrode terminal of the electronic component. The switch element portion has such a structure as to change the shape thereof depending on a temperature, and to disconnect the signal transmission line when the temperature exceeds a predetermined temperature. A conductor layer which constitutes a portion of the signal transmission line is formed at the bottom of a cavity formed in an electronic component mounting surface side of the wiring board. One end of the switch element portion is fixedly connected to the wiring layer, and another end thereof is in contact with the conductor layer when the temperature is equal to or lower than the predetermined temperature.

Abstract: An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to the AC path and the DC path.

Abstract: An exemplary patch panel includes a printed circuit board having a plurality of input terminals and output terminals. An amount of the input terminals is equal to an amount of the output terminals. The input terminals are connected to the output terminals respectively. The printed circuit board further includes a plurality of standby terminals. Each of the input terminals is connected to the standby terminals via switches respectively. The standby terminals can be used to selectively replace a number of the input terminals or the output terminals, should they become inoperable, by operating the switches.

Abstract: A capacitive touch switch having a printed circuit board and a capacitive electrode connected to the circuit board is disclosed. The printed circuit board is transparent and is interposed between a planar light guide provided with a light source and a non-conductive transparent cover, the electrode being icon-shaped and supported by the printed circuit board.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: An electronic apparatus has a sensing mechanism and is disposed to a circuit board having a sensing switch, including a receptacle housing having an opening disposed at one side thereof, the opening having a top portion and a bottom portion, the top portion having a stopping end portion; an action member disposed in the opening and having a stopping flange abutting against the stopping end portion; an elastic member disposed between the stopping flange and the top of the bottom portion of the opening so as to make the top of the action member protrude to a region outside of the top of the receptacle housing; and a lid body for covering the receptacle housing and meanwhile pressing the action member so as to make the action member start the sensing switch, thereby confirming that the receptacle housing is covered by the lid body.

Abstract: A manipulation input device includes a base, a printed-circuit board adhered to the base, a manipulation member, a pressing projection, and a manipulation dial. A plurality of push-button switches and a magnetic-field detection element are mounted on the printed-circuit board. The manipulation member has a ring-shape plate spring and a pedestal portion. The pressing projection press-contacts the push-button switch by fixing a mounting portion to an outer circumferential edge of the upper surface of the base. The pressing projection is provided toward a lower surface of the pedestal portion. The mounting portion is extended downward from an outer circumferential edge portion of the ring-shape plate spring. A ring magnet is assembled in a lower surface of the manipulation dial. N poles and S poles are alternatively arranged in the ring magnet. The manipulation dial is rotatably assembled in an upper surface of the pedestal portion.

Abstract: An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an impedance larger than that of the exclusive source line. Similarly, the electronic control apparatus includes an exclusive ground line for the charge pump circuit which is discriminated from a common ground line. The exclusive ground line is connected to the common ground via an additional via-hole vb. Furthermore, a noise-suppressing capacitor C is connected between the exclusive power source and around lines.

Abstract: In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS switches of the back surface are lying over the photo MOS switches of the front surface. Each of pairs of photo MOS switches connects a pair of surface lines with first and second floating lines to transmit an output voltage of each cell of a battery pack connected with the surface lines to a differential amplifier through a flying capacitor connected with the floating lines. Because of the division of the photo MOS switches on the surfaces of the circuit substrate, temperatures of the photo MOS switches have less dispersion, and an S/N ratio of each signal indicating the output voltage can be improved.

Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

Abstract: A memory card includes: a main body of the memory card in which a notched section is formed; a semiconductor memory; and a write/nonwrite setting element for setting the write/nonwrite state of data in the semiconductor memory, the write/nonwrite setting element being slidably fitted in the notched section, wherein the main body of the memory card includes an upper main body and a lower main body; at least one of the upper main body and the lower main body has an elastic guide formed within the notched section; the write/nonwrite setting element slides along the elastic guide so as to set the write/nonwrite state of the data in the semiconductor memory; and the elastic guide has an engagement portion for engagedly stopping the write/nonwrite setting element so as to select the position of the write/nonwrite setting element with respect to the elastic guide.

Abstract: Power supply switching regulator electrical circuit trimming methods. A trimming method includes assembling one or more components of a power supply switching regulator electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the power supply switching regulator electrical circuit is then trimmed after the assembling of the one or more components of the power supply switching regulator electrical circuit onto the printed circuit board. The trimming of the electrical parameter of the power supply switching regulator electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board.

Abstract: An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the motherboard, at least one second memory module slot is disposed on one side of the substrate, and a plurality of third memory module slots is disposed on the other side of the substrate. The third memory module slots are electrically connected to the second memory module slot, and two ends of the circuit switch board are plugged into one of the first memory module slots and the second memory module slot. When memory modules are plugged in the third memory module slots, the memory modules are electrically connected to the first memory module slots respectively through the circuit switch board and then transmit data and signals with the motherboard.

Abstract: A switch or circuit board having a first conductive area on a first side of the board, a second conductive area on a second side of the board, several tiny holes running through the board from the first side to the second side, and a conductive material substantially filling the holes by capillary force, where the conductive material forms an electrical connection between the first conductive area and the second conductive area.

Abstract: An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth.

Abstract: An integrated bus bar structure plate in which a plurality of bus bars are arranged on substantially the one plain face to form an electric power circuit, wherein after the bus bar structure plate having a whole shape in which a plurality of types of electric power circuits are formed by selecting any of the connection parts of the bus bars is separated is adhered to the control circuit board whereby, for example, a desired electric power circuit is formed among the connection parts of bus bars.

Abstract: A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit. Contact-side terminals of each relay switch are mounted on the bus bar group while coil-side terminals thereof are mounted on the control circuit board. The opening and closing of relay contacts are controlled by a control circuit incorporated in the control circuit board.

Abstract: Electrical circuit trimming methods. In one aspect of the invention, a trimming method includes assembling one or more components of an electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the electrical circuit is then trimmed. The trimming of the electrical parameter of the electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board. In another aspect of the invention, the trimming the electrical parameter of the electrical circuit includes electrical programming of the electrical circuit.

Abstract: Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate having board leads and a plurality of electrical connectors arranged adjacent a component site. Selectively configurable circuitry may be carried by the substrate and adapted to selectively couple selected ones of the electrical connectors to selected ones of the board leads. One or more trace may be associated with each of the electrical connectors and one or more of these traces may include a thermally actuatable switch that can be selectively closed. The thermally actuatable switch may comprise a gap between two conductive lengths of the conductive trace, an exposed switch surface, and a thermally responsive member that may wet the exposed switch surface when selectively heated above an activation temperature.

Abstract: A transformer of a switching power-supply circuit is placed and mounted nearly in the middle area of a circuit board. The transformer is of a low-profile type, and a broad and flat upper surface of the transformer functions as a suction surface for a suction nozzle. When a surface-mount type switching power-supply unit is mounted in a mother board, firstly, the upper surface of the above transformer is held by the suction nozzle, the surface-mount type switching power-supply unit is transferred to a target mounting area on the mother board by the suction nozzle, and the surface-mount type switching power-supply unit is surface mounted in the mother board. Because it is not required to provide a nozzle suction surface for the suction nozzle's exclusive use, transfer molding is not needed, and accordingly a low-profile and low-cost surface-mount type switching power-supply unit can be facilitated.

Abstract: A conductor detecting switch is provided in which the occupied area on an operating panel can be reduced and high detection sensitivity to a conductor can be realized even when the occupied area is thus reduced. An electrode provided on a control board, and a control IC chip having an electrostatic capacity detector circuit for detecting electrostatic capacity stored in the electrode are provided on the inner side of an operating panel. On the electrode, an LED, which is a dielectric member, and a dielectric member made of synthetic resin are provided to overlap each other. The control board is attached to the inner side of the operating panel, sandwiching the dielectric member between them.

Abstract: A compact card connector having reduced width and thickness is provided for receiving an information card whereby the information card has a narrow step-like recess along one of its side edges and a sliding identifier mechanism provided in a concave cut in the step. The card connector includes a frame that receives the information card, and an identifier detecting means for detecting a sliding position of the identifier. The identifier detecting means includes a suitably placed fixed contact member and a movable contact member which are mounted on the frame, with part of the movable contact member forming a projection for detecting the sliding position of the identifier, whereby the projection lies in an area within the housing space through which the step-like recess of the card is to pass. As the information card is inserted into the housing space, the projection touches an upper surface of the step-like recess and/or that of the identifier and works in the concave cut in the step.

Abstract: Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate having board leads and a plurality of electrical connectors arranged adjacent a component site. Selectively configurable circuitry may be carried by the substrate and adapted to selectively couple selected ones of the electrical connectors to selected ones of the board leads. One or more trace may be associated with each of the electrical connectors and one or more of these traces may include a thermally actuatable switch that can be selectively closed. The thermally actuatable switch may comprise a gap between two conductive lengths of the conductive trace, an exposed switch surface, and a thermally responsive member that may wet the exposed switch surface when selectively heated above an activation temperature.

Abstract: A switch to be mounted on a design element in the passenger room of a motor vehicle includes a haptic element that functions as a mechanical operater and a visual element. Electrical and/or electronic switch elements are mounted on a flexible conductor element and optionally further electrical and electronic components. A zone of the flexible conductor element which carries the switch elements and an allocated zone of the haptic element are configured such that the corresponding zones can be positioned and fixated in relation to one another and do not establish a permanent electrical connection.

Abstract: Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate having board leads and a plurality of electrical connectors arranged adjacent a component site. Selectively configurable circuitry may be carried by the substrate and adapted to selectively couple selected ones of the electrical connectors to selected ones of the board leads. One or more trace may be associated with each of the electrical connectors and one or more of these traces may include a thermally actuatable switch that can be selectively closed. The thermally actuatable switch may comprise a gap between two conductive lengths of the conductive trace, an exposed switch surface, and a thermally responsive member that may wet the exposed switch surface when selectively heated above an activation temperature.

Abstract: [Object] To provide a device substrate and a production method therefor, which device substrate has a film having a reflection function and can be formed by a production process that does not require a vacuum process inviting increased production cost.

Abstract: A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to prevent noise pickup. The two internal layers carry printed circuit lines between various elements of the array and terminals of the connector. The various arrays are sequentially scanned. All of the lines except the one selected are connected to ground to prevent crosstalk and noise pickup.

Abstract: An interchangeable printed circuit board having electrical components is attached externally proximate to the base of a switch to customize switch performance. The circuit board includes openings which slide over and electrically engage the terminals of the switch proximate the base, leaving the remainder of the terminals exposed and available for plug-in or solder electrical connection within an electrical system. The openings may be copper contact members having fingers which engage and electrically connect to the switch terminals.

Abstract: The invention relates to a circuit substrate assembly comprising a left-hand (1) and a right-hand (1′) circuit substrate mirror-symmetrical thereto, each including electrical and/or electronic and/or electromechanical components (2-6 or 2′-6′) and circuitry (7 or 7′) electrical connecting said components. All components (2-6) are positioned symmetrically mirrored on the left-hand (1) and right-hand (1′) circuit substrate respectively when the left-hand (1) and right-hand (1′) circuit substrate is oriented mirror-symmetrical along a mirror plane (P). However, the circuit functional plug assignments (A-F) of at least one circuit functional mirror-invariant component 2 or 2′) on the left-hand (1) and on the right-hand (1′) circuit substrate are not mirror-symmetrical to each other.

Abstract: A switching device and a method for the configuration thereof is disclosed. A first aspect of the present invention comprises a switching device. The switching device comprises at least one line card and at least one switching card. The device includes a mid-plane coupled to the at least one line card and the at least one switching card. The A second aspect of the invention comprises a method for configuring a switching device. The method for configuring a switching device comprises providing a mid-plane, and providing at least one switching card and at least one line card on the mid-plane. The at least one switching card and the at least one line card are perpendicular to each other. Through the use of the present invention, line cards and/or switch cards can be connected to a mid-plane via a plurality of connectors wherein the line cards and switching cards are perpendicular to each other.

Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.

Abstract: A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to prevent noise pickup. The two internal layers carry printed circuit lines between various elements of the array and terminals of the connector. The various arrays are sequentially scanned. All of the lines except the one selected are connected to ground to prevent crosstalk and noise pickup.

Abstract: A standard circuit unit (200) for a vehicle door includes a first flexible printed circuit member (220a), having a standard switch circuit portion for controlling the operation of a power window drive mechanism, an input/output signal wire (220b), which forms a lead portion for connecting the first flexible printed circuit member (220a) to a host door control unit, and an input/output signal wire (220c) which forms a lead portion for connecting the first flexible printed circuit member (220a) to a courtesy lamp mechanism (13) on a door trim (10). The first flexible printed circuit members (220a) and the input/output signal wires (220b, 220c) are produced separately from each other, and thereafter are fixedly secured to each other by piercing terminals, and therefore are electrically connected together.

Abstract: An array antenna includes a first ceramic layer and a second ceramic layer. A metal layer is disposed between the first and second ceramic layers. A plurality of radiating elements are mounted on the first ceramic layer, and a plurality of control circuits are mounted on the second ceramic layer. The control circuits are coupled to the radiating elements through a plurality of conductive vias which feed through the metal layer. The array antenna may also include a switch having a plurality of poles formed in the second ceramic layer and coupled to one of the radiating elements through one or more conductive vias. A plurality of phase delay elements may be coupled at a first end to a signal source and coupled at a second end to the respective plurality of poles of the switch to provide phase-delayed signals. A waveguide may also be formed within the ceramic layers. Conductive vias or coaxial transmission lines may be used to connect elements within the array antenna.