Connection Of Components To Board Patents (Class 361/760)
  • Patent number: 10784208
    Abstract: The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component area. The first antenna is formed on the antenna area. The second antenna extends from the antenna area and over the first antenna. The second antenna is electrically connected to the first antenna. The package body includes a first portion covering the component area and a second portion covering the antenna area. The first shield is conformally formed on the first portion of the package body and exposes the second portion of package body.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 22, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Cheng-Nan Lin, Chieh-Chen Fu
  • Patent number: 10785874
    Abstract: A technique includes coupling a resistor network to a plurality of card edge connectors. The resistor network has a resistance, and each card edge connector includes electrical contacts to couple a resistor of a circuit card assembly, when inserted into the card edge connector, to the resistor network to alter the resistance of the resistor network. The technique includes determining a state of the plurality of card edge connectors based on a signal that is provided by the resistor network.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: September 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: Nilashis Dey
  • Patent number: 10784191
    Abstract: A stacked and electrically interconnected structure is disclosed. The structure can comprise a first element and a second element directly bonded to the first element along a bonding interface without an intervening adhesive. A filter circuit can be integrally formed between the first and second elements along the bonding interface.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 22, 2020
    Assignee: Invensas Bonding Technologies, Inc.
    Inventors: Shaowu Huang, Belgacem Haba, Javier A. DeLaCruz
  • Patent number: 10772196
    Abstract: According to one embodiment, a display device includes a display panel including pad portions, a flexible printed circuit, the flexible printed circuit includes a base member with a first surface and a second surface, wiring lines, and a protective layer, and including a bend area, and a first edge and a second edge, the base member includes a groove portion located in the bend area and formed in the second surface, a first frame region between the first edge and the groove portion, and a second frame region between the second edge and the groove portion, a thickness of the base member in a position where the groove portion is formed is less than a thickness of the base member in a position which overlaps the first frame region and the second frame region.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 8, 2020
    Assignee: Japan Display Inc.
    Inventors: Kota Uogishi, Koji Hiramoto, Kengo Kowata
  • Patent number: 10756316
    Abstract: A device for mounting an electrical energy source in portable electronic equipment is provided, including a cavity and a cover configured to close the cavity, the cover including a housing configured to receive the energy source, the cover and the portable electronic equipment having complementary fixing means in order to retain the cover on the portable electronic equipment and to seal the cavity, and the cover including means for retaining the energy source in the housing of the cover.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 25, 2020
    Assignee: ETA SA Manufacture Horlogere Suisse
    Inventors: David Benjamin Kraehenbuehl, Martin Jufer
  • Patent number: 10757801
    Abstract: A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: August 25, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David W. Engler, Stephen F. Contreras
  • Patent number: 10736217
    Abstract: A surface mounting component module according to one embodiment of the present invention comprises: a multi-layer substrate; a side via formed by penetrating the multi-layer substrate, and electrically connecting the multi-layer substrate; a side via pad positioned on at least one layer of the multi-layer substrate, and formed in the vicinity of the side via; and an RF pattern connected to the side via pad by a signal line, wherein all of the RF pattern, the side via, and the side via pad are electrically connected.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Dong Woo Kim
  • Patent number: 10723920
    Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: July 28, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: 10716211
    Abstract: A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via conductor disposed outside a first region, a second region, and a third region in a plan view, and a first conductor pattern extending from the first via conductor to the first region. The plurality of second wirings each include a second via conductor disposed outside the first region, the second region, and the third region, and a second conductor pattern extending from the second via conductor to the first region. A fourth region overlaps with a fifth region in the plan view, the fourth region being a region in which a plurality of first conductor patterns are disposed, the fifth region being a region in which a plurality of second conductor patterns are disposed.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 14, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takashi Numagi, Shoji Matsumoto, Hiroyuki Yamaguchi, Youhei Tazawa
  • Patent number: 10715031
    Abstract: In order to achieve small noise and small vibration, as well as a small size and a low cost in a power converter including a capacitor module, there is provided a power converter including a power module and a capacitor module. The capacitor module includes: a plurality of capacitor elements each having a flat wound surface; an exterior case; a resin filler; and a restraint point. The exterior case has arranged therein an inclusion serving as a beam in a direction orthogonal to a flat wound surface of at least one capacitor element of the plurality of capacitor elements, and the at least one capacitor element, and the restraint point is arranged substantially in front of the flat wound surface via the inclusion.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 14, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kengo Nishimura, Satoshi Ishibashi, Masahiro Noguchi
  • Patent number: 10709043
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Patent number: 10658276
    Abstract: A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: May 19, 2020
    Assignee: Tesla, Inc.
    Inventors: William Thomas Chi, Mehmet Ozbek, Satish Thuta
  • Patent number: 10622241
    Abstract: A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: April 14, 2020
    Inventors: Chan-Long Shieh, Gang Yu
  • Patent number: 10622761
    Abstract: A movable floating connector is disclosed. In an embodiment, an apparatus includes a fixed structure coupled to a chassis, a movable floating connector assembly, and an elastic object. The movable floating connector assembly includes a receiving connector configured to engage with a module connector of an insertable module removable from the chassis. The elastic object is interfaced between at least a portion of the fixed structure and at least a portion of the movable floating connector assembly. The elastic object is configured to provide a force on the movable floating connector assembly against a direction of insertion of the insertable module to maintain a consistent engagement between the receiving connector of the movable floating connector assembly and the module connector of the insertable module across a variation in length in the direction of insertion.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: April 14, 2020
    Assignee: Facebook, Inc.
    Inventors: Joshua Held, Michael Haken, Tiffany Jin
  • Patent number: 10624216
    Abstract: A wiring board includes, a base plate that has a first surface, a second surface opposite to the first surface, and a side surface coupled to the first surface and the second surface, a conductor provided on the side surface, and a protrusion provided over the side surface. The protrusion partitions the conductor into a first portion on the side surface that extends to the first surface and a second portion on the side surface that extends to the second surface. The protrusion has a solder wettability lower than the conductor and protrudes from the conductor.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 14, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Nobuo Taketomi, Takahiro Kitagawa, Mitsunori Abe, Shigeru Sugino, Kiyoyuki Hatanaka, Shigeo Iriguchi, Ryo Kanai
  • Patent number: 10607952
    Abstract: In accordance with embodiments disclosed herein, there is provided a high density triple diamond stripline interconnect. An interconnect includes a first reference layer, a second reference layer disposed below the first reference layer, and a dielectric disposed between the first reference layer and the second reference layer. The interconnect further includes a first pair of conductors including a first conductor and a second conductor that are in a broadside-facing orientation within the dielectric below the first reference layer and above the second reference layer. The interconnect further includes a second pair of conductors including a third conductor and a fourth conductor that are in an edge-facing orientation within the dielectric below the first conductor and above the second conductor.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: March 31, 2020
    Assignee: Intel Corporation
    Inventor: Albert Sutono
  • Patent number: 10593636
    Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: Georgios C. Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid
  • Patent number: 10580742
    Abstract: A method of manufacturing a wafer level fan-out package includes preparing a base substrate having a protrusion, providing a chip on a surface of the base substrate adjacent to and spaced from the protrusion, forming an encapsulation layer on the base substrate to encapsulate the chip and the protrusion, removing the base substrate to expose a surface of the chip and to form a recess corresponding to the protrusion in the encapsulation layer, and providing a passive element in the recession. The method obviates a problem of displacement of the passive element by thermal expansion of the encapsulation layer while it is being formed because the passive element is incorporated into the package after the encapsulation layer is formed.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: March 3, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Peng Zhang
  • Patent number: 10568216
    Abstract: A composite sheet includes a resin layer including a liquid crystal polymer as a main material and a first surface and a second surface facing away from each other, a conductor foil disposed on the first surface, and a powder layer including a powder of a liquid crystal polymer as a major component and located on an entirety of the second surface.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: February 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroyuki Ohata
  • Patent number: 10535614
    Abstract: A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant encapsulates the dies and the wall structure. A first portion of the encapsulant penetrates through the wall structure. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Po-Hao Tsai
  • Patent number: 10535637
    Abstract: Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: January 14, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10529666
    Abstract: A semiconductor structure includes a first die; a first molding encapsulating the first die; a second die disposed over the first molding, and including a first surface, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface; and a second molding disposed over the first molding and surrounding the second die, wherein the first surface of the second die faces the first molding, and the second die is at least partially covered by the second molding.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: January 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chen-Hua Yu, Kai-Chiang Wu, Chun-Lin Lu
  • Patent number: 10517465
    Abstract: A cable connection structure includes: a cable having a core and a jacket made of an insulating material to cover the core; and a substrate connected with the cable. The substrate includes: a base material made of an insulating material; an external connection electrode formed on a surface of the base material and connected with the core; and a via provided in the base material and having an end exposed from a mounting surface of the substrate on which the cable is mounted, the via being connected with the external connection electrode. The via is provided at least at one of both ends of a surface of the external connection electrode perpendicular to an axial direction of the cable, on a proximal end side of the cable.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: December 31, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Masato Mikami
  • Patent number: 10512171
    Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: December 17, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Bo Ra Shin, Kyungjun Kim, Ji Eun Myung, Yong Goo Son
  • Patent number: 10491728
    Abstract: A key module for a mobile terminal, and which includes a key having a neck part and a head key pressed to enter an input to the mobile terminal; a circuit support configured to support a circuit board having a dome terminal to be pressed when the key head is pressed for entering the input to the terminal; and a waterproof member positioned between the key and the circuit support and configured to block a moisture penetration path along a hole in a case member of the mobile terminal into which the key module is inserted.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: November 26, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Ikhyun Jo, Sehoon Chun, Jangwoo Hong, Chalkee Jung
  • Patent number: 10475551
    Abstract: An electric coupler includes a body, a first electrical path through the body having a first resistance to electric current within a first frequency range and a second electrical path through the body having a second resistance to electric current within a second frequency range.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: November 12, 2019
    Assignee: GE ENERGY POWER CONVERSION TECHNOLOGY LTD
    Inventors: Jun Wang, Fan Zhang, Richard S. Zhang, Yingqi Zhang, Brian Eric Lindholm, Lin Lan, Yazhu Zhao
  • Patent number: 10461446
    Abstract: A welding column combination includes at least two metal welding columns and at least one insulator block. Each metal welding column has a first end and a second end opposite to the first end, wherein at least one of the metal welding columns has welding surfaces at the first end and the second end respectively. The at least one insulator block assembles the at least two metal welding columns as a unitary physical combination.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: October 29, 2019
    Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
    Inventors: Shao-Jun Chen, Da Jin, Ya-Hong Xiong
  • Patent number: 10450637
    Abstract: A conductive element of a cable or a wire is formed of an improved aluminum-zirconium alloy. The aluminum-zirconium alloy further includes an inoculant. The aluminum-zirconium alloy exhibits excellent ultimate tensile strength values and resistance to heat. Bonding wires formed from an improved aluminum-zirconium alloy exhibiting certain ultimate tensile strength values, fatigue resistance and/or creep rates are also described. Methods of forming cables and wires are also further disclosed.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: October 22, 2019
    Assignees: General Cable Technologies Corporation, NanoAl, LLC
    Inventors: Srinivas Siripurapu, Cornelius A. Muojekwu, Janusz Stanislaw Sekunda, Richard Stephen Baker, Nicholas John Duer, Nhon Q. Vo
  • Patent number: 10440811
    Abstract: An active device lid for a device base. The device lid includes a heatsink proximate to a circuit assembly and configured to remove heat generated by the device base, the circuit assembly configured to generate an operating signal voltage for the device base, and a connector configured to connect the circuit assembly to the device base, where the device base is configured to connect to a device mounting substrate on a substrate side of the device base, and where the circuit assembly is configured to be at least partially located on an opposing side of the device base, the opposing side opposing the substrate side.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 8, 2019
    Assignee: Ciena Corporation
    Inventors: Sebastien Gareau, Marc Leclair, Hugues Tournier
  • Patent number: 10433431
    Abstract: A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: October 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson
  • Patent number: 10396002
    Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: August 27, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Sentaro Yamamoto, Youji Furukubo, Masanori Okamoto, Yuhei Matsumoto
  • Patent number: 10375819
    Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: August 6, 2019
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Kentaro Toda, Kenji Arai, Manabu Miyazawa, Kenichiro Nagatomo, Touru Ueno, Tsuguto Maruko, Hirofumi Ogawa, Tetsuo Oomori
  • Patent number: 10349515
    Abstract: A camera system including an objective, an objective holder carrying the objective, an image sensor and a printed circuit board. The printed circuit board and the image sensor are connected to one another in an electronically conductive manner, and the image sensor and the objective are arranged such that an image is n focus on the image sensor. The printed circuit board has a circuit layer made of an electrically insulating material and a printed circuit board substrate, wherein the printed circuit board substrate is manufactured from a material with a coefficient of thermal expansion aL which deviates by no more than 30% from the coefficient of thermal expansion of a material from which the objective holder is manufactured.
    Type: Grant
    Filed: August 5, 2017
    Date of Patent: July 9, 2019
    Assignee: HEXAGON TECHNOLOGY CENTER GMBH
    Inventor: Jochen Scheja
  • Patent number: 10340234
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: July 2, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
  • Patent number: 10339090
    Abstract: A video card is disclosed. The video card includes a PCI card, an MXM connector and a LAN converter. The mobile PCI express module (“MXM”) connector is mounted on the PCI card and adapted to physically receive an MXM card having a GPU and to electronically receive a video signal from the GPU. The local area network video converter is mounted on the PCI card for receiving the video signal from the MXM connector and for converting the video signal to a signal suitable for transmission on a local area network (“LAN”) cable.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 2, 2019
    Assignee: ADVOLI LIMITED
    Inventors: Clas Gerhard Sivertsen, Paal Fure Torkehagen
  • Patent number: 10319801
    Abstract: Provided is a flexible display apparatus in which flexibility is secured and reliability of products is improved, and a method of manufacturing the same. The flexible display apparatus includes a display panel including a flexible area and a non-flexible area and having one surface and the other surface opposite to the one surface; a protective film attached to the one surface of the display pane; a first adhesive layer interposed between the flexible area of the display panel and the protective film and configured to have a first storage modulus; and a second adhesive layer interposed between the non-flexible area of the display panel and the protective film and configured to have a second storage modulus.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: June 11, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hirotsugu Kishimoto, Youngji Kim, Hyunggyu Park, Soohee Oh, Seonggeun Won
  • Patent number: 10317965
    Abstract: One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: June 11, 2019
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Randolph Cruz, Loyde M. Carpenter, Jr., Mark A. Kwoka
  • Patent number: 10306759
    Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 28, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Natsuko Kitajo, Yuji Yukiiri, Izumi Tanaka
  • Patent number: 10297576
    Abstract: A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 21, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10296483
    Abstract: A fieldbus coupler for coupling a local fieldbus network utilizing a first fieldbus protocol to a foreign field device or foreign fieldbus network through an interconnecting wired or wireless network transmission line that utilizes a second fieldbus protocol different from the first fieldbus protocol includes a first circuit configured to communicate over the local fieldbus network using the first fieldbus protocol, a second circuit configured to connect the fieldbus coupler with the interconnecting network transmission line and communicate over the interconnecting network transmission line using the second fieldbus protocol, and a third circuit configured to communicate with the first and second circuits and capable of transmitting data to and from the first and second circuits to enable communications between the local fieldbus network via the interconnecting network transmission line.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: May 21, 2019
    Assignee: Phoenix Contact Development and Manufacturing, Inc.
    Inventors: Brian Vogt, Michael Colin Cherewka, Brent Helfrick, Aaron Kreider, Davis Mathews
  • Patent number: 10285275
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: May 7, 2019
    Assignee: TT ELECTRONICS PLC
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Patent number: 10269769
    Abstract: A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 23, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10270070
    Abstract: A battery retention system is configured to facilitate insertion and removal of batteries from an electronic device. The electronic device includes a housing that defines a battery cavity for receiving a battery. The battery cavity has a floor. A floor contact extends from the floor. The floor contact is configured to provide a biasing force to push the battery away from the floor of the battery cavity. The housing has tabs extending into the battery cavity to hold the battery in the battery cavity against the biasing force of the floor contact. The battery cavity has a recess that allows the battery to move in a lateral direction along the floor to a position where the battery disengages from at least one of the tabs to allow at least a portion of the battery to be pushed out of the battery cavity by the biasing force of the floor contact.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: April 23, 2019
    Assignee: Roche Diabetes Care, Inc.
    Inventor: Michel Alain Jean Marie Cadio
  • Patent number: 10271430
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10256380
    Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: April 9, 2019
    Assignee: OSRAM Opto Seiconductors GmbH
    Inventors: Wolfgang Moench, Frank Singer, Thomas Schwarz, Jürgen Moosburger, Stefan Illek
  • Patent number: 10256558
    Abstract: A movable member (30) provided in a housing (10) is formed with a cover (32) configured to cover inserting edges (45) on a tip of a circuit board (41) in an inserting direction into a board accommodation space (15) when the circuit board (41) is inserted into the board accommodation space (15) and a receiving surface (34) configured to move the movable member (30) integrally with the circuit board (41) to a back side of the board accommodation space (15) by being pushed by the circuit board (41). The movable member (30) and the circuit board (41) are formed with locks (38, 46) configured to move the movable member (30) integrally with the circuit board (41) in a withdrawing direction from the board accommodation space (15) by locking each other.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: April 9, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd, Sumitomo Electric Industries, Ltd.
    Inventors: Masanori Moriyasu, Masaaki Tabata, Hidetoshi Ishida, Hajime Matsui
  • Patent number: 10233294
    Abstract: Treated liquid crystal polymer powders have been subjected to surface treatment with plasma or ultra violet rays, a paste including the treated liquid crystal polymer powders and a dispersion medium, a liquid crystal polymer sheet comprising the treated liquid crystal polymer powders or the paste including the treated liquid crystal polymer powders and a dispersion medium into a sheet, a stack including the liquid crystal polymer sheet as a resin layer, and a method of manufacturing the treated liquid crystal polymer powders are provided by the present disclosure.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: March 19, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroyuki Ohata
  • Patent number: 10205223
    Abstract: A device communicating wirelessly using internal function components as antenna includes a case, and within the case a circuit board, a camera mechanism, and a wireless communication mechanism. The case includes an upper shell and a lower shell, the lower shell defining a slot is filled with an insulation strip. The camera mechanism and the wireless communication mechanism are arranged on the circuit board. The wireless communication mechanism faces the slot. The wireless communication mechanism and the camera mechanism cooperatively form an antenna. A wireless signal generated by the wireless communication mechanism is enhanced by the antenna and radiates outward from the slot.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 12, 2019
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hao-Ying Chang, Pai-Cheng Huang, Chih-Yang Tsai, Ching-Sung Wang
  • Patent number: 10193012
    Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: January 29, 2019
    Assignee: Goertek, Inc.
    Inventors: Quanbo Zou, Zhe Wang
  • Patent number: 10192833
    Abstract: Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: January 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Wei Kuo, Hui Yu Lee, Huan-Neng Chen, Yen-Jen Chen, Yu-Ling Lin, Chewn-Pu Jou