Connection Of Components To Board Patents (Class 361/760)
  • Patent number: 10375819
    Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: August 6, 2019
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Kentaro Toda, Kenji Arai, Manabu Miyazawa, Kenichiro Nagatomo, Touru Ueno, Tsuguto Maruko, Hirofumi Ogawa, Tetsuo Oomori
  • Patent number: 10349515
    Abstract: A camera system including an objective, an objective holder carrying the objective, an image sensor and a printed circuit board. The printed circuit board and the image sensor are connected to one another in an electronically conductive manner, and the image sensor and the objective are arranged such that an image is n focus on the image sensor. The printed circuit board has a circuit layer made of an electrically insulating material and a printed circuit board substrate, wherein the printed circuit board substrate is manufactured from a material with a coefficient of thermal expansion aL which deviates by no more than 30% from the coefficient of thermal expansion of a material from which the objective holder is manufactured.
    Type: Grant
    Filed: August 5, 2017
    Date of Patent: July 9, 2019
    Assignee: HEXAGON TECHNOLOGY CENTER GMBH
    Inventor: Jochen Scheja
  • Patent number: 10339090
    Abstract: A video card is disclosed. The video card includes a PCI card, an MXM connector and a LAN converter. The mobile PCI express module (“MXM”) connector is mounted on the PCI card and adapted to physically receive an MXM card having a GPU and to electronically receive a video signal from the GPU. The local area network video converter is mounted on the PCI card for receiving the video signal from the MXM connector and for converting the video signal to a signal suitable for transmission on a local area network (“LAN”) cable.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 2, 2019
    Assignee: ADVOLI LIMITED
    Inventors: Clas Gerhard Sivertsen, Paal Fure Torkehagen
  • Patent number: 10340234
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: July 2, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
  • Patent number: 10317965
    Abstract: One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: June 11, 2019
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Randolph Cruz, Loyde M. Carpenter, Jr., Mark A. Kwoka
  • Patent number: 10319801
    Abstract: Provided is a flexible display apparatus in which flexibility is secured and reliability of products is improved, and a method of manufacturing the same. The flexible display apparatus includes a display panel including a flexible area and a non-flexible area and having one surface and the other surface opposite to the one surface; a protective film attached to the one surface of the display pane; a first adhesive layer interposed between the flexible area of the display panel and the protective film and configured to have a first storage modulus; and a second adhesive layer interposed between the non-flexible area of the display panel and the protective film and configured to have a second storage modulus.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: June 11, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hirotsugu Kishimoto, Youngji Kim, Hyunggyu Park, Soohee Oh, Seonggeun Won
  • Patent number: 10306759
    Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 28, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Natsuko Kitajo, Yuji Yukiiri, Izumi Tanaka
  • Patent number: 10297576
    Abstract: A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 21, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10296483
    Abstract: A fieldbus coupler for coupling a local fieldbus network utilizing a first fieldbus protocol to a foreign field device or foreign fieldbus network through an interconnecting wired or wireless network transmission line that utilizes a second fieldbus protocol different from the first fieldbus protocol includes a first circuit configured to communicate over the local fieldbus network using the first fieldbus protocol, a second circuit configured to connect the fieldbus coupler with the interconnecting network transmission line and communicate over the interconnecting network transmission line using the second fieldbus protocol, and a third circuit configured to communicate with the first and second circuits and capable of transmitting data to and from the first and second circuits to enable communications between the local fieldbus network via the interconnecting network transmission line.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: May 21, 2019
    Assignee: Phoenix Contact Development and Manufacturing, Inc.
    Inventors: Brian Vogt, Michael Colin Cherewka, Brent Helfrick, Aaron Kreider, Davis Mathews
  • Patent number: 10285275
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: May 7, 2019
    Assignee: TT ELECTRONICS PLC
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Patent number: 10269769
    Abstract: A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 23, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10270070
    Abstract: A battery retention system is configured to facilitate insertion and removal of batteries from an electronic device. The electronic device includes a housing that defines a battery cavity for receiving a battery. The battery cavity has a floor. A floor contact extends from the floor. The floor contact is configured to provide a biasing force to push the battery away from the floor of the battery cavity. The housing has tabs extending into the battery cavity to hold the battery in the battery cavity against the biasing force of the floor contact. The battery cavity has a recess that allows the battery to move in a lateral direction along the floor to a position where the battery disengages from at least one of the tabs to allow at least a portion of the battery to be pushed out of the battery cavity by the biasing force of the floor contact.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: April 23, 2019
    Assignee: Roche Diabetes Care, Inc.
    Inventor: Michel Alain Jean Marie Cadio
  • Patent number: 10271430
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10256380
    Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: April 9, 2019
    Assignee: OSRAM Opto Seiconductors GmbH
    Inventors: Wolfgang Moench, Frank Singer, Thomas Schwarz, Jürgen Moosburger, Stefan Illek
  • Patent number: 10256558
    Abstract: A movable member (30) provided in a housing (10) is formed with a cover (32) configured to cover inserting edges (45) on a tip of a circuit board (41) in an inserting direction into a board accommodation space (15) when the circuit board (41) is inserted into the board accommodation space (15) and a receiving surface (34) configured to move the movable member (30) integrally with the circuit board (41) to a back side of the board accommodation space (15) by being pushed by the circuit board (41). The movable member (30) and the circuit board (41) are formed with locks (38, 46) configured to move the movable member (30) integrally with the circuit board (41) in a withdrawing direction from the board accommodation space (15) by locking each other.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: April 9, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd, Sumitomo Electric Industries, Ltd.
    Inventors: Masanori Moriyasu, Masaaki Tabata, Hidetoshi Ishida, Hajime Matsui
  • Patent number: 10233294
    Abstract: Treated liquid crystal polymer powders have been subjected to surface treatment with plasma or ultra violet rays, a paste including the treated liquid crystal polymer powders and a dispersion medium, a liquid crystal polymer sheet comprising the treated liquid crystal polymer powders or the paste including the treated liquid crystal polymer powders and a dispersion medium into a sheet, a stack including the liquid crystal polymer sheet as a resin layer, and a method of manufacturing the treated liquid crystal polymer powders are provided by the present disclosure.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: March 19, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroyuki Ohata
  • Patent number: 10205223
    Abstract: A device communicating wirelessly using internal function components as antenna includes a case, and within the case a circuit board, a camera mechanism, and a wireless communication mechanism. The case includes an upper shell and a lower shell, the lower shell defining a slot is filled with an insulation strip. The camera mechanism and the wireless communication mechanism are arranged on the circuit board. The wireless communication mechanism faces the slot. The wireless communication mechanism and the camera mechanism cooperatively form an antenna. A wireless signal generated by the wireless communication mechanism is enhanced by the antenna and radiates outward from the slot.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 12, 2019
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hao-Ying Chang, Pai-Cheng Huang, Chih-Yang Tsai, Ching-Sung Wang
  • Patent number: 10193012
    Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: January 29, 2019
    Assignee: Goertek, Inc.
    Inventors: Quanbo Zou, Zhe Wang
  • Patent number: 10192833
    Abstract: Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: January 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Wei Kuo, Hui Yu Lee, Huan-Neng Chen, Yen-Jen Chen, Yu-Ling Lin, Chewn-Pu Jou
  • Patent number: 10192855
    Abstract: A semiconductor package is provided. The semiconductor package include a lower semiconductor package including a lower package substrate and a lower semiconductor chip mounted thereon, and an upper semiconductor package provided on the lower semiconductor package to include an upper package substrate and an upper semiconductor chip mounted thereon. The upper package substrate include an upper heat-dissipation pattern, the lower semiconductor chip include a first via connected to the upper heat-dissipation pattern through the lower semiconductor chip, and the first via may provide a pathway for dissipating heat generated in the lower semiconductor chip.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunkyoung Seo, Chajea Jo, Ji Hwang Kim, Taeje Cho
  • Patent number: 10177277
    Abstract: In a flip chip type light-emitting diode, a light-emitting diode structure possesses one unique layer with properties of both thermal conduction and electrical isolation disposed on its second contact metal layer. A first dielectric layer covers the light-emitting diode structure. A first-level metal interconnect is divided into three blocks, which are disposed on the first dielectric layer and are respectively connected to a first contact metal layer, the second contact metal layer, and the insulated heat-transfer layer. A first bonding pad structure, a second bonding pad structure, and a heat-dissipating pad structure, forming a second-level interconnect metal layer, are disposed on a second dielectric layer and respectively connected to the blocks of the first-level metal interconnect.
    Type: Grant
    Filed: January 14, 2018
    Date of Patent: January 8, 2019
    Assignees: DUO POWER LIGHTING TECHNOLOGY
    Inventor: Chang-Hsin Chu
  • Patent number: 10162388
    Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: December 25, 2018
    Assignee: Google LLC
    Inventors: Paul Eremenko, Ara Knaian, Seth Newburg, David Fishman
  • Patent number: 10157881
    Abstract: A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: December 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu
  • Patent number: 10146984
    Abstract: A mobile device with high-accuracy fingerprint identification includes a display panel, a transparent protection layer, and a fingerprint identification device. The transparent protection layer has one surface attached to the display panel. The fingerprint identification device is attached to the surface of the transparent protection layer for detecting a user fingerprint. The fingerprint identification device includes a flexible substrate, a fingerprint sensor, and a detector. The fingerprint sensor is disposed on the flexible substrate for sensing the user fingerprint to generate a fingerprint image. The detector is disposed on the flexible substrate and electrically connected to the fingerprint sensor for distinguishing a minute parasitic capacitance variation generated by the fingerprint sensor.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: December 4, 2018
    Assignee: SUPERC-TOUCH CORPORATION
    Inventors: Hsiang-Yu Lee, Shang Chin, Ping-Tsun Lin
  • Patent number: 10134686
    Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 20, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Ah Ron Lee, Deog Soon Choi, Young Ho Lee, Boon Keat Tan, Jin Ho Choi
  • Patent number: 10134676
    Abstract: A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer includes a two-dimensional (2D) material and a conductive polymer to have high electric conductivity and flexibility. The flexible device includes a flexible interconnect layer of one or more layers, and in this case, includes a low-dielectric constant dielectric layer between the respective layers.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: November 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaeho Lee, Taeho Kim, Seongjun Park
  • Patent number: 10074613
    Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: September 11, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen, Chun-Chi Ke
  • Patent number: 10068857
    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 4, 2018
    Assignee: MEDIATEK INC.
    Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
  • Patent number: 10057680
    Abstract: A gaming machine having an audio channel outputting game sound and an audio channel intaking microphone sound and outputting chat sound is coupled with a headset having earpieces and a microphone and a Bluetooth transceiver in the headset for sending and receiving the microphone and chat sounds. A radio receiver or wired connection in the headset receives the game sounds. Circuitry in the headset is connected between the transceiver and receiver for mixing the microphone, chat, and game sounds and feeding them all to the earpieces.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: August 21, 2018
    Assignee: Voyetra Turtle Beach, Inc.
    Inventor: Carmine J. Bonanno
  • Patent number: 10020420
    Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: July 10, 2018
    Assignee: GoerTek Inc.
    Inventors: Quanbo Zou, Zhe Wang
  • Patent number: 10014136
    Abstract: A light guide body rotates integrally with an operation knob, has an incident surface that is a concavely curved surface recessed to a side opposite to a light source side, and rotates about a rotation shaft located so as to intersect the incident surface of the light guide body. The incident surface of the light guide body is a concavely curved surface recessed toward the side opposite to the light source (toward a Z1 direction) on a cross-section taken along an X-Z plane.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: July 3, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Toru Ito, Yoshiyuki Tagawa, Aya Aizawa
  • Patent number: 9991231
    Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 5, 2018
    Assignee: Invensas Corporation
    Inventors: Charles G. Woychik, Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster, Guilian Gao
  • Patent number: 9985344
    Abstract: Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: May 29, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Bruce Foster Bishop, James Paul Scholz, Jerry L. Moore, Michael A. Oar, Leonard Henry Radzilowski
  • Patent number: 9966023
    Abstract: An LCD device includes: multiple data lines, scanning lines, pixel units and switching elements. First terminals of the switching elements are connected together for receiving a control signal. Second terminals of the switching elements are connected together for receiving a reference voltage signal. Third terminal of each switching element is connected to a corresponding data line. When the control signal is a first control signal, each switching element is turned off, grayscale voltage signals are applied on corresponding pixel units, and a normal image frame is displayed. When the control signal is a second control signal, each switching element is turned on, the reference voltage signal is applied on the pixel units, an inserted black frame is displayed. A simple and power-saving way for an inserted black frame is realized to solve the cross talk in 3D display or a serious image smear problem in low refresh rate.
    Type: Grant
    Filed: December 23, 2017
    Date of Patent: May 8, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Feilin Ji, Jiehui Qin
  • Patent number: 9961792
    Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: May 1, 2018
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Claudio V. Di Leo
  • Patent number: 9961767
    Abstract: A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: May 1, 2018
    Assignee: SHINKO ELECTRIC INDUSTIRES CO., LTD.
    Inventors: Kazuhiro Oshima, Hiroharu Yanagisawa, Kazuhiro Kobayashi, Katsuya Fukase, Ken Miyairi
  • Patent number: 9955586
    Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 24, 2018
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Ting-Ying Wu, Cheng-Lin Wu, Chin-Yuan Lo, Wen-Shan Wang
  • Patent number: 9945526
    Abstract: An optoelectronic lighting module (100) is provided having at least two optoelectronic semiconductor chips (10) with a radiation outlet surface (11) and an electrically non-conductive back side (12) facing away from the radiation outlet surface,—a cooling body (20) with a cooling body top side (21) and a cooling body bottom side (22) facing away from the cooling body top side (21),—two contact strips (30) with a contact top side (31) and a contact bottom side (32) facing away from the contact top side (31), wherein—the optoelectronic semiconductor chips (10) are arranged with the electrically non-conductive back side (12) on the cooling body top side (21),—each optoelectronic semiconductor chip (10) comprises two electric contact points (13) formed in the direction of the radiation outlet surface (11), and—the optoelectronic semiconductor chips (10) are connected in series via the electric contact points (13).
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 17, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Frank Singer, Thomas Schwarz
  • Patent number: 9930783
    Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: March 27, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim
  • Patent number: 9927834
    Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: March 27, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Chanh V Hua, Michael Sterns, Kevin D Conn, Pinche Tsai
  • Patent number: 9911680
    Abstract: Provided is a bidirectional semiconductor package in which the number of processes for manufacturing the bidirectional semiconductor package is reduced. According to present application, a portion between one end and the other end of the buffer wire is in contact with the lower surface of the upper DBC substrate and heat generated by the semiconductor chip is transferred to the upper DBC substrate.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 6, 2018
    Assignee: HYUNDAI MOBIS Co., Ltd.
    Inventor: Jae Hyun Ko
  • Patent number: 9882605
    Abstract: A method for transmitting data advantageously reduces cross-talk in high-speed data transmission. The method comprises receiving an input data word, encoding the input data word into a code word, and driving the code word on to an interconnect for transmission. The code word is generating using a balanced coding scheme, and the interconnect is a single-ended, twisted-wire interposer interconnect. A receiver circuit decodes the code word to generate an output data word.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: January 30, 2018
    Assignee: NVIDIA Corporation
    Inventor: Xi Chen
  • Patent number: 9881903
    Abstract: A structure includes a first package and a second package. The second package is coupled to the first package by one or more connectors. Epoxy flux residue is disposed around the connectors and in contact with the connectors. A method includes providing a first package having first connector pads and providing a second package having corresponding second connector pads. Solder paste is printed on each of the first connector pads. Epoxy flux is printed on each of the solder paste. The first and second connector pads are aligned and the packages are pressed together. The solder paste is reflowed to connect the first connector pads to the second connector pads while leaving an epoxy flux residue around each of the connections.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: January 30, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu, Hsuan-Ting Kuo
  • Patent number: 9873306
    Abstract: A heating, ventilation, and air-conditioning (HVAC) module for a vehicle includes a base, a cover, and a clamp. The base is configured to define a post protruding from a wall of the base. The cover is configured to define a hole that cooperates with the post to couple the cover to the base to form a housing of the module. The base is further configured to define the clamp which is coupled to the wall by a hinge. The clamp is operable between an open position where the hole can be placed around the post and a closed position where the clamp retains the hole around the post.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: January 23, 2018
    Assignee: MAHLE International GmbH
    Inventors: Ronald T. Burns, Steven R. Fraser, David M. Chatt
  • Patent number: 9826628
    Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: November 21, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Huan Yang, Wei-Ting Chen, Chih-Chia Chang
  • Patent number: 9818665
    Abstract: In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: November 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss
  • Patent number: 9806047
    Abstract: A wafer level package, electronic device including the wafer level package, and fabrication methods are described that include forming a cantilever pillar design as a portion of the wafer level package and/or a segmented solder connection for preventing and reducing connection stress and increasing board level reliability. In implementations, the wafer level device that employs example techniques in accordance with the present disclosure includes at least a section of a processed semiconductor wafer including at least one integrated circuit die, a first dielectric layer disposed on the processed semiconductor wafer, a first pillar, a second pillar formed on the first pillar, a second dielectric layer formed on the first dielectric layer and surrounding a portion of the first pillar and the second pillar, and at least one solder ball disposed on the second pillar.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: October 31, 2017
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Karthik Thambidurai, Peter R. Harper, Sriram Muthukumar, Arkadii V. Samoilov
  • Patent number: 9799972
    Abstract: The electrical connector includes a frame to assemble a plurality of socket thereto. Each socket includes a plurality of contacts, two inner sides in confrontation with the neighboring sockets, and two outer sides in confrontation with the frame. The frame includes an exterior peripheral structure and an interior cross structure. The outer sides are attached to the exterior peripheral structure while the inner sides are attached to the interior cross structure.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: October 24, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Po-Yuan Su
  • Patent number: 9796583
    Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: October 24, 2017
    Assignee: Microchips Biotech, Inc.
    Inventors: Jonathan R. Coppeta, Kurt Shelton, Norman F. Sheppard, Jr., Douglas Snell, Catherine M. B. Santini
  • Patent number: 9786610
    Abstract: A semiconductor package is provided, which includes: a circuit structure having a first bottom surface and a first top surface opposite to the first bottom surface; at least a semiconductor element disposed on the first top surface of the circuit structure and electrically connected to the circuit structure; an encapsulant formed on the first top surface of the circuit structure to encapsulate the semiconductor element, wherein the encapsulant has a second bottom surface facing the first top surface of the circuit structure and a second top surface opposite to the second bottom surface; and a strengthening layer formed on the second top surface of the encapsulant, or formed between the circuit structure and the encapsulant, or formed on the first bottom surface of the circuit structure, thereby effectively preventing the encapsulant from warping and the semiconductor element from cracking.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: October 10, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Hui-Chuan Lu, Chun-Hung Lu, Po-Yi Wu