Abstract: A light emitting device includes: a heat dissipating plate having first and second regions, the first region having a mesa with a first top surface, the second region having a second top surface, the first top surface being higher than the second top surface; a circuit board disposed above the heat dissipating plate, and including a first area that has a through hole to permit the mesa to extend therethrough and that directly contacts the second top surface of the second region of the heat dissipating plate, and a second area that does not contact the heat dissipating plate; and a light emitting element disposed on the mesa of the heat dissipating plate and electrically connected to the conductive layer.

Abstract: The lighting module includes: a case including an opening from which light is emitted, a base portion corresponding to the opening, and a seat on at least one side of the base portion; a light source unit disposed on the seat; a light guide plate placed within the case and optically connected with the light source unit; and a diffusing plate placed within the case and placed below the light guide plate, wherein the lighting source unit includes a substrate, a plurality of light emitting diodes (LEDs) disposed on the substrate, and a sub-reflector which is disposed on the substrate and covers the plurality of the LEDs, and wherein at least 90% of the light emitted from the LEDs is directly irradiated onto the light guide plate.

Abstract: A lighting apparatus is shown and described. In one aspect, the lighting apparatus includes a light source, a plate, and frame. The light source can include one or more lighting elements that are in thermal communication with the light source. The plate can have a dissipative portion extending outward from a point of thermal communication between the plate and the light source. The frame can at least partially enclose the light source and may also be in thermal communication therewith.

Abstract: The present invention provides an illuminating device and heat-dissipating structure thereof. The heat-dissipating structure includes a plurality of heat-dissipating units stacked together. Each heat-dissipating unit includes a cone-like portion with an opening and a plurality of protrusions connected to the cone-like portion, wherein at least one of the protrusions of one heat-dissipating unit is coupled to that of the adjacent heat-dissipating unit to form one or more zonal planes for allowing a light source to be disposed thereon to constitute the illuminating device, and the openings of the heat-dissipating units are liked together to form an airflow passage.

Abstract: An LED lamp includes a base, an encapsulation, a substrate and a light distribution board. A number of light emitting diodes are mounted on the substrate. The encapsulation, the substrate and the light distribution board are all fixed to the base. Opposite sides of the light distribution board respectively face the encapsulation and the substrate. The light distribution board includes a number of protrusions. The protrusions totally reflect the incident light beams from the light emitting diodes perpendicular to or substantially perpendicular to the light distribution board.

Abstract: A flashlamp cartridge (10) comprises an cartridge portion for a flashlamp (1), cooling device components for a cooling device (11, 12) for the flashlamp, one or more thermal cartridge terminals (13) for the cooling device for thermally connecting the flashlamp cartridge to a socket, and one or more electrical cartridge terminals (14) for the flashlamp for electrically connecting the flashlamp cartridge to a socket. A flashlamp assembly comprises such flashlamp cartridge (10) and a flashlamp (1) accommodated in the flashlamp cartridge. A socket for a flashlamp assembly comprises corresponding electric socket terminals (24) and thermal socket terminals (23). An electrical device comprises such socket.

Abstract: A display panel includes an airtight casing and a thermally conductive member. A thermal conductivity of the thermally conductive member in a longitudinal direction of spacers is higher than a thermal conductivity of the thermally conductive member in a direction in which the spacers are provided side by side, and the thermal conductivity of the thermally conductive member in the direction in which the spacers are provided side by side is higher than a thermal conductivity of the thermally conductive member in a thickness direction.

Abstract: Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.

Abstract: In one embodiment, a solid-state luminaire has a strip of high power LEDs, where each LED emits light into an optical coupler. Light from the optical coupler is then coupled into a light guide. Light coupled into the light guide is mixed and guided to an exit aperture of the light guide. An optical extractor proximate the exit aperture of the light guide redirects light outward, which is optionally redirected generally downward by a secondary reflector that extends outwardly along the length of the light guide. The secondary reflector may be configured to create a variety of light-emission patterns. The luminaire may be hung from a ceiling, in track lighting, used as a pendant or pedestal fixture, or in other applications.

Abstract: A structure of light tube includes a cover, a heat dissipation element, at least one lighting unit, and two caps. The cover forms therein a receiving chamber. The cover has a wall which forms at least one heat dissipation opening in communication with the receiving chamber. The heat dissipation element is arranged inside the receiving chamber. The lighting unit includes a substrate and at least one light-emitting diode. The light-emitting diode is coupled to and electrically connected with the substrate. The substrate is coupled to the heat dissipation element. The two caps are respectively fit to opposite ends of the cover, and each of the caps forms therein a receiving chamber and at least one projection. The projection is formed on an inside surface of the cap and projects into the receiving chamber of the cap to be corresponding to and engageable with the heat dissipation opening.

Abstract: An illumination apparatus comprises a base, a heat sink group, and at least one fastening arm. The base is made of material with high heat conductivity and has a first surface and an opposite second surface for receiving a light source. The heat sink group is placed on the first surface and comprises three types of heat sinks arranged in three lines extending along a lengthwise direction of the base. The fastening arm has a recess defined therein. First and second heat sinks are alternately arranged on each of outer two lines of the heat sink group. Third heat sinks are arranged on the middle line. Each third heat sink is positioned between two first heat sinks at one side thereof and two second heat sinks at the other side thereof.

Abstract: A rectangular luminaire includes a rectangular fixture defining at least one cavity having a plurality of light engines. A heat flange is disposed about a distal end region of the rectangular fixture and includes a hollow, generally pyramidal frustum shape with a generally rectangular cross-section. A distal-most end of the heat flange is configured to be disposed a distance D from a support surface when the rectangular fixture is received in a recess of the support surface, the distance D being greater than or equal to 0.4 times the fixture half-width W. Thermal energy is conductively transferred from the light engine, through the rectangular fixture, to the heat flange where the thermal energy is convectively transferred from the heat flange to surrounding air to create air currents flowing along the support surface thereby reducing the junction temperature.

Abstract: An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

Abstract: In one embodiment, a fluorescent lamp type light-emitting device lamp includes a substantially cylindrical main body having one end portion and the other end portion; a light-emitting device disposed in the main body; and a pair of ferrules provided in the one end portion and the other end portion and connected to a socket, respectively. The main body of the fluorescent lamp type light-emitting device lamp is connected to earth via one of the pair of ferrules.

Abstract: The invention provides systems and methods for providing illumination. A lighting unit may have a support structure, and one or more light emitting elements supported by a circuit board contacting the support structure. A first optical element and a second optical element may be provided. A remote luminescent material may be provided on one or more optical elements. Light emitting elements configured to excite the luminescent material such as highly efficient light emitting diodes may be directed towards the luminescent material. The support structure may be a heat dissipating element, which may conduct heat from a heat source to a surface of the support structure. The heat dissipating element may have a passageway permitting the formation of a convection path to dissipate heat from the support structure. Such lighting units may be used to replace conventional fluorescent light tubes or other lighting devices, or may be provided as standalone lighting units.

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a plurality of light-emitting elements, and pressure member. The substrate includes a first surface in contact with a thermally radiative member, a second surface positioned in a side opposite to the first surface, and an outer circumferential surface which bridges outer circumferential edges of the first surface and the second surface. The light-emitting elements are mounted on the second surface of the substrate. The pressure member elastically press the substrate toward the thermally radiative member. A gap is provided between the pressure member and the outer circumferential surface of the substrate.

Abstract: A LED-based replacement light for a fluorescent socket is constructed such that an entirety of a radially outer portion of a tubular housing at least partially defined by a high-dielectric light transmitting portion is formed of a high-dielectric material. Forming a radially outer portion of the tubular housing of a high-dielectric material prevents a person handling the light from being shocked as a result of capacitive coupling occurring when the LED-based replacement light is installed one end at a time. A circuit board is in thermally conductive relation with the tubular housing, allowing for conduction of heat generated by the LEDs from a side of circuit board opposite the LEDs to the tubular housing for dissipation to the ambient environment.

Abstract: A lighting apparatus includes a light source module and a heat dissipation module. The light source module emits light and generates heat. The heat dissipation module dissipates at least a portion of the heat, and includes a base portion to which the light source module is physically coupled. The heat dissipation module also includes a plurality of heat dissipation fins. At least two of the fins that are immediately adjacent to one another form an air channel having a first opening and a second opening between the at least two of the fins. The air channel has a generally decreasing cross-sectional area with respect to air rising up the air channel in a generally vertical direction with respect to a horizontal plane as the air enters the air channel through the first opening and exits the air channel through the second opening.

Abstract: A modular troffer-style fixture particularly well-suited for use with solid state light sources. The fixture comprises a reflector that includes parallel rails running along its length, providing a mount mechanism and structural support. An exposed heat sink is disposed proximate to the reflector. The portion of the heat sink facing the reflector functions as a mount surface for the light sources. The heat sink is hollow through the center in the longitudinal direction. The hollow portion defines a conduit through which electrical conductors can be run to power light emitters. One or more light sources disposed along the heat sink mount surface emit light toward the reflector where it can be mixed and/or shaped before it is emitted from the troffer as useful light. End caps are arranged at both ends of the reflector and heat sink, allowing for the easy connection of multiple units in a serial arrangement.

Abstract: A lamp device includes: a housing formed with heat-dissipating holes; a conductive connecting head mounted on a first side of the housing; a heat-conducting member mounted on a second side of the housing opposite to the first side, and having opposite first and second side surfaces; a lighting unit thermally contacting and mounted on the first side surface of the heat-conducting member, and covered by a transparent body; and a heat-dissipating layer made of an infrared radiating material. The heat-dissipating layer is disposed on and is in thermal contact with the second side surface of the heat-conducting member. Heat generated by the lighting unit is transmitted by the first heat-conducting member to the heat-dissipating layer, and is dissipated by the heat-dissipating layer through the heat-dissipating holes in the housing.

Abstract: A streetlight installed on a street or a sidewalk in order to radiate light includes a base plate detachably fixed to a streetlight body using a clamp and a reflector fixed to one side of the base plate. The reflector has a first slope having a plurality of LEDs mounted thereon, and a second slope having a reflective film mounted thereon, the reflective film arranged opposite the LEDs. The reflector provides illumination by reflecting light, emitted from the LEDs, to the outside. A heat dissipation pad is disposed between the base plate and the reflector. The heat dissipation pad insulates the LEDs from external high-voltage EMS. A cover made of a translucent material has a recess in the central portion thereof to house the reflector therein, and fixes both the reflector and the heat dissipation pad to the base plate. Heat dissipation fins are fixed to the base plate.

Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.

Abstract: An arrangement for cooling semiconductor light sources (5), wherein the semiconductor light sources (5) are arranged on a heat-conducting module (11), which is operatively connected to an evaporator zone (27) of a heat pipe (20), wherein a first condensation zone (23) of the heat pipe (20) is connected to a first heat sink (33), wherein the heat pipe (20) is connected to at least one second condensation zone (25) with at least one second heat sink (25), and a heat flow can be switched over between the condensation zones (23, 25) or the second condensation zone (25) can be switched in.

Abstract: Disclosed herein is a method of forming a LED-based light for replacing a conventional fluorescent bulb in a fluorescent light fixture including providing a heat sink of highly thermally conductive material having opposing longitudinally extending edges, mounting a plurality of LEDs in thermally conductive relation with the heat sink and enclosing the plurality of LEDs within a light transmitting cover such that the longitudinally extending edges engage an Interior of the cover to support the heat sink within the light transmitting cover.

Abstract: Embodiments of the invention provide an optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube; a linear slit formed on the light-transmitting tube in a longitudinal direction thereof; and at least one bar-shaped optical semiconductor module secured to the light-transmitting tube, with edges of the slit fitted into side surfaces of the bar-shaped optical semiconductor module. Here, the optical semiconductor module includes a heat sink, a PCB attached to the heat sink, and an array of semiconductor optical devices arranged on the PCB. The heat sink is partially exposed from the light-transmitting tube through the slit.

Abstract: A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5?S1/S2?3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.

Abstract: A linear light-emitting diode (LED)-based solid-state lamp having a double safety mechanism that comprises at least three shock protection switches, fully protects a person from possible electric shock during re-lamping or maintenance. One protection switch provided at each end of the lamp is able to cut off power when the associated end of the lamp is not inserted into the lamp socket. A third protection switch can be used to turn off the power from the AC main for additional shock protection.

Abstract: A heat sink is provided. The heat sink may include an open cavity formed by a cavity wall, a cavity bottom wall thereof including a light source region adapted to have a light source mounted thereon and a lateral cavity wall thereof including a reflection region adapted to reflect light emitted from the light source; a heat spreading and dissipation structure covering at least part of an exterior of the heat sink including a bottom region and a lateral region, the heat spreading and dissipation structure including a plurality of vertically aligned fins; an air guidance structure adapted to separate the heat sink from an air flow generator; and at least one mounting column for attaching the heat sink to a lighting device.

Abstract: Embodiments of the invention provide optical semiconductor-based tube type lighting apparatuses. The optical semiconductor-based tube type lighting apparatus includes an elongated light-transmitting tube, and a plurality of optical semiconductor modules arranged along a circumference of the light-transmitting tube and separated from each other in a cross-sectional view of the light-transmitting tube. Here, each of the optical semiconductor modules is placed so as not to face another optical semiconductor module at an opposite side thereof.

Abstract: The present invention relates to an operation lamp, consists of a plurality of illumination units, a fastening seat, a focus adjusting device and a lamp housing. The illumination units are designed to be modularized, so a plurality of LED light source sets and reflection mirrors can be processed with a rapid focus adjustment for allowing each illumination unit reflecting and concentrating and focusing light for forming a concentrated light beam. Moreover, after the plural illumination units and the lamp housing are assembled, through adjusting the height difference between at least two pivot parts at the outer end of each illumination unit and supporting members, the left/right oblique angle of the illumination unit is able to be adjusted, such that each concentrated light beam can be precisely adjusted to pass through the lamp center.

Abstract: The invention relates to a lamp (1), especially a suspended lamp, comprising a housing (2) that is provided with a first light emitting area (4) with a first light influencing element (9) on one side thereof while being fitted with a second light emitting area (21) with a second light influencing element (22) on another side for direct illumination. In order to improve indirect illumination of the lamp, the second light influencing element (22) can be moved into at least two different positions (S1, S2, S3).

Abstract: An LED lamp includes a light engine. The light engine includes a substrate including a transparent or translucent thermally conductive material, a plurality of LED semiconductor devices mounted to the substrate, a plurality of conductive traces formed over the substrate to electrically interconnect each of the plurality of LED semiconductor devices, and conductive leads connected to the substrate for supplying electrical energy to the plurality of LED semiconductor devices. The substrate of the light engine may include an aluminum nitride (AlN), or diamond film material. A thermally conductive rod is connected to the light engine. A heatsink is formed by an extrusion or die casting process. The heatsink includes a fin structure for dissipating heat energy into the environment. The thermally conductive rod and the heatsink are thermally connected. An optional optical envelope is mounted to the heatsink. The optional optical envelope is disposed over the light engine.

Abstract: A lighting device includes a first cover, a heat dissipating structure, and a lightbar device. A plurality of first guide slots is formed on the first cover. The heat dissipating structure is disposed in the first cover and has a plurality of heat dissipating fins. A plurality of second guide slots is formed on positions between adjacent heat dissipating fins respectively corresponding to the plurality of first guide slots. The lightbar device is disposed on the heat dissipating structure. Light generated by the lightbar device is emitted out of the first cover. Liquid is drained out through at least one of the plurality of first guide slots and the corresponding second guide slot.

Abstract: An illuminating system includes a system casing and a plurality of illuminating modules. The system casing has a first air-hole area and a plurality of second air-hole areas. One of the adjacent second air-hole areas keeping a first distance from each other keeps a second distance from the first air-hole area. The other one of the adjacent second air-hole areas keeps a third distance from the first air-hole area. The first distance is smaller than or equal to the second distance and smaller than or equal to the third distance. Each illuminating module disposed at the system casing includes a diversion casing having a third air-hole area and a fourth air-hole area. The third air-hole areas are located within the system casing and communicate with the first air-hole area. The adjacent second air-hole areas are respectively corresponding to and respectively communicate with the fourth air-hole areas of different illuminating modules.

Abstract: An LED floodlight fixture includes a housing, an LED heat sink secured to the housing and an LED arrangement mounted on the heat sink in non-water/air-tight condition with respect to the housing. The heat sink including (i) a base having an LED-adjacent surface and an opposite surface and (ii) a heat-dissipating section having heat-dissipating surfaces extending from the opposite surface. The LED arrangement is mounted to the LED-adjacent surface in non-water/air-tight condition with respect to the housing. The housing preferably forms at least one venting gap to provide cool-air ingress to and along the heat-dissipating surfaces by upward flow of heated air therefrom. The base of the heat sink has one or more venting apertures to provide cool-air ingress to and along the heat-dissipating surfaces by upward flow of heated air therefrom.

Abstract: An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

Abstract: Provided is a light source device capable of effectively cooling a bulb included therein. The light source device includes: a luminous tube having a bulb to seal a pair of electrodes that generates light by electric discharging; a reflector formed into a concave surface shape and configured to emit light from the bulb; and an air blowing device that generates a flow of gas to cool the luminous tube.

Abstract: A lighting apparatus comprising: an elongated-shaped LED unit provided with a plurality of lighting units on one surface in the thickness direction thereof, each of said lighting units having a LED chip; a reflective plate held by a main body; a lighting device for lighting the LED unit; and a heat radiation block to which said LED unit being replaceably attached, configured to dissipate the heat generated in the LED unit, and arranged at the other surface side in the thickness direction of the LED unit. The reflective plate has an installation portion for installing the LED unit. The heat radiation block is held by the reflective plate. The LED unit has a flat portion at light extracting surface from the lighting unit. The flat portion has the same plane with a surrounding area of the installation portion in a reflective surface of the reflective plate.

Abstract: A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation.

Abstract: An air-handling luminaire comprises a recessed troffer housing having a first pair of opposed walls and a second pair of opposed walls, the housing having a light output opening and a lens extending across the light output opening, at least one of the walls of the first pair of opposed walls and the second pair of opposed walls being substantially vertical and having at least one flow through opening for fluid communication from a volume beneath the recessed troffer housing to a plenum above the recessed troffer housing and, a rail extending from near a lower edge of the recessed troffer housing upwardly within the recessed troffer housing and adjacent the at least one flow through and concealing the at least one flow through opening.

Abstract: The present invention provides an illumination module comprising one or more light-emitting elements which are thermally coupled to one or more heat extraction elements. The one or more heat extraction elements are configured to transfer heat in substantially a first direction. One or more optical elements are further integrated into the illumination module, wherein the one or more optical elements are optically coupled to the one or more light-emitting elements and configured to redirect the light emitted by the one or more light-emitting elements in substantially the first direction.

Abstract: The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

Abstract: The present invention relates to LED bar modules where the LED groups are placed at a pixel board. The present invention further concerns a method for calibration of LEDs. It is the object of the invention to achieve a highly efficient LED bar for generating a bar of light. A further object of the invention is to store calibration data for each LED both electrically and mechanically close to the actual LED. Preferably, the main printed circuit is placed inside a heat conductive tube, where the pixel board is placed outside the heat conductive tube in a longitudinal recess, where the main printed circuit is placed inside an isolation cover. Hereby, it is achieved that the LEDs are placed on the outside of the tube in a way where heat generated from the LEDs is conducted downwards to the tube. Inside the tube, the rest of the power electronics and also the light controlling electronics are placed.

Abstract: A method of forming a LED-based light for replacing a conventional fluorescent bulb in a fluorescent light fixture includes forming a heat sink by shaping an elongate sheet of highly thermally conductive material to increase a surface area to width ratio thereof mounting LEDs in thermally conductive relation with the heat sink, and enclosing the LEDs within a light transmitting cover.

Abstract: A connector includes: one terminal having a part-connecting portion to be connected to an anode of an LED; and the other terminal having the part-connecting portion to be connected to a cathode of the LED; and a housing in which the terminals are embedded. The connector is made by insert-molding. The terminals are arranged in a cavity formed between upper and lower dies so that the part-connecting portions are arranged in the same plane with a gap. An outer shape of the cavity corresponds to an outer shape of the connector. After a projection formed on the upper die is interposed between the part-connecting portions, the cavity is filled with melted synthetic resin to mold the housing.

Abstract: Provided is a lamp using LED which has a heat sink and an air-flowing part formed in a body and is equipped with a heat pipe to make higher a heat-conductive efficiency and thereby to make higher a heat-generation performance considerably so that the light emitting diode can be applied to a high-output illumination device to increase a life-time.

Abstract: Vehicle-mounted auxiliary lighting systems adapted to provide primary or auxiliary vehicle lighting using light emitting diodes (LEDS) are disclosed.

Abstract: A cover and a lamp structure. The cover whose curvature has a light incident surface and a light outgoing surface, and includes a plurality of 3D micro-structures disposed thereon and arranged in the form of an array. When a light is emitted into the light outgoing surface from the light incident surface, the light emitting angle of the light outgoing surface is increased through the refraction of the 3D micro-structures, so that the occurrence of mura or spots due to uneven distribution of the light is avoid.

Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Abstract: A lighting system comprises a row of light emitting diodes (“LEDs”) receiving electricity and producing light and heat. The row of LEDs can be located in a channel or a groove of a piece of material, such as an aluminum extrusion or a bent piece of metal. The channel can have an optically reflective lining, for example, providing either diffuse or specular reflection. Accordingly, the channel can reflect light emitted by the LEDs. The piece of material can also include a heat sink for transferring heat from the LEDs to air via convection or air flow. The heat sink can comprise fins or protrusions that facilitate convection.