Abstract: The disclosure provides a light emitting diode projection bulb including a heat dissipation base, a light emitting diode module, and a annular heat dissipation member. The heat dissipation base includes a bottom surface, a sidewall surrounding the bottom surface, and a annular rim. The annular rim is connected to an end of the sidewall to define a first opening facing toward outside. A surface of the annular rim forms a plurality of first convection holes and a plurality of first locating portions. The light emitting diode module is installed on the bottom surface of the heat dissipation base and emits light toward the first opening. The annular heat dissipation member includes a second opening, a plurality of second convection holes, and a plurality of second locating portions.

Abstract: An LED light fixture a housing, a heat sink secured with respect to the housing, the heat sink has a base with front and back surfaces, and an LED arrangement mounted at the front surface of the heat sink The back surface of the heat sink is open to water/air flow thereover. The LED light fixture also includes at least one closed channel extending along the base and spaced therefrom for receiving wire connections for the LED arrangement. The at least one closed channel receives wiring extending to/from the second LED module. The LED arrangement may include at least first and second LED modules, the first LED module being proximal to the housing with the at least one closed channel receiving wiring extending to/from the second LED module. The first and second LED modules may be in end-to-end relationship to one another such that the second LED module is distal from the housing.

Abstract: A lighting module may be provided that includes: a light emitter; a clad metal substrate which is disposed under the light emitter; an insulating structure which insulates the light emitter from the clad metal substrate; an optical structure which is disposed on the light emitter; and a case which is disposed on the optical structure and is coupled to the clad metal substrate, wherein the light emitter includes a semiconductor based light emitting device.

Abstract: A liquid-filled light emitting diode (LED) bulb including a base, a shell connected to the base forming an enclosed volume, a thermally conductive liquid held within the enclosed volume, a support structure connected to the base, and several LEDs attached to the support structure. The thermally conductive liquid has an oxygen content of at least 5 cubic centimeters of oxygen per liter of the thermally conductive fluid.

Abstract: An LED lighting fixture including a housing and an LED assembly secured with respect to the housing to permit air/water-flow over the LED assembly. The LED assembly includes a plurality of LED-array modules on an equal plurality of individual heat sinks. The housing defines an air gap permitting air/water-flow to and from the heat sinks.

Abstract: A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

Abstract: Underwater LED lights with enhanced cooling to allow the use of substantial numbers of high power LEDs. In all embodiments, the majority of the heat given off by the LEDs is transferred to the housing of the underwater light by heat transfer techniques other than by convection of the air or other gases within the enclosure, providing direct heat conveyance from the LEDs to or through the light enclosure walls, by conduction through a thermal conductor or by or as augmented by heat pipes to the inside wall of the enclosure or through the wall of the enclosure to the water. Various embodiments are disclosed.

Abstract: An LED lamp includes a base, a head connected to the base, an LED mounted on the base and a cover fixed on the base and covering the LED. The cover is made of metal and defines a plurality of through holes therein.

Abstract: A linear lamp is provided having one or more light emitting elements provided therein. The light emitting elements are directed to emit light in a direction different from the primary direction of the illumination of the lamp. The light emitting elements may be supported by a supporting optical element. The supporting optical element may permit the transmission of light therethrough. The supporting optical element may be an integral window upon which the light emitting elements are disposed.

Abstract: A sensor module is integrated into a lighting fixture. The sensor module includes one or more environmental sensors and can be readily installed in or removed from the lighting fixture. In one embodiment, a heatsink of the lighting fixture is configured to receive the sensor module. Readings from the environmental sensors may be passed to control electronics associated with the lighting fixture and used to control the light output of the lighting fixture. The readings may also be passed on to other lighting fixtures, which may also use the readings to control their light output.

Abstract: The illumination device includes: a case; a heat sink which has a bottom part in which an LED module is installed, a cylindrical wall part standing upright from the bottom part and disposed such that a clearance is created between the cylindrical wall part and an inner wall surface of the case, and an open end formed at the front end of the cylindrical wall part; a fan which is housed in the case; an air intake passage which guides to the fan, air introduced from the lateral side of the case into the case; and an air discharge passage which is formed along the outer surface of the bottom part and the outer wall surface of the cylindrical wall part in the heat sink and discharges the air sent from the fan from the front end side of the heat sink to the outside.

Abstract: A lighting device (1) comprising a driver (7) arranged at a base (2) of the lighting device (1), a heat sink (14) arranged at a portion (3) of the lighting device (1), separate from the driver (7), a light source (13) mounted to the heat sink (14), and a wire (10) arranged to electrically connect the light source (13) to the driver (7), wherein a portion of the wire (10) extending from the base (2) to the portion of the lighting device (1) is arranged to be exposed to light from the light source (13). The present embodiment is advantageous in that the thermal performance is improved and the lifetime of the lighting device (1) is increased. Further, the exposed wire (10) may be illuminated by the light source (13) and visible from outside the lighting device (1), thereby having the appearance of a filament.

Abstract: An LED lamp includes an LED assembly including a plurality of LEDs. The LED lamp includes a circular base plate in thermal communication with the LED assembly. The LED lamp includes an electrical module electrically coupled to the LED assembly and configured to supply power to the LED assembly. The LED lamp includes a lamp body coupled to and in thermal communication with the base plate at a first end and concealing at least a portion of the electrical module at a second end. The lamp body includes a substantially smooth surface extending from the base plate to the electrical module. The Led lamp includes an optic configured to disperse light generated by the LED assembly.

Abstract: An assembling heat dissipating lighting device comprises a lamp socket means and a heat dissipating lighting means. The lamp socket means includes an installing space and an installing hole communicated with the installing space. A periphery of the installing hole is formed with an inserting portion and an engaging portion. The heat dissipating lighting means includes a LED lighting member and a heat dissipating member thermally connected with the LED lighting member, and an outer ring surface of the LED lighting member has an engaging element and a fastening portion. The heat dissipating lighting means is fixed to the lamp socket means by way of engaging the engaging element into the installing space and correspondingly engaging the fastening portion with the engaging portion by way of rotating the heat dissipating lighting means. Thus, the convenience of disassembly and fixation of the assembling heat dissipating lighting device is increased.

Abstract: A light source includes one or more solid state light emitting devices, a heat spreader thermally coupled to the one or more light emitting devices, and a mounting carriage configured to mount the one or more solid state light emitting devices in a lighting fixture light and thermally couple the heat spreader to the lighting fixture.

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

Abstract: A light source module and a projection apparatus including the light source module, an optical engine module, and a projection lens are provided. The light source module includes a lamp holder, a casing, a light source, and a heat dissipation fan. The lamp holder has a cover having a first inlet and a first outlet. The casing is connected to the lamp holder and has a second inlet and at least one second outlet. The light source is fixed to the lamp holder fixed to a housing of the projection apparatus. The heat dissipation fan generates a heat dissipation airflow through an outflow side. A first part of the heat dissipation airflow enters the cover through the first inlet, and leaves the cover through the first outlet. A second part of the heat dissipation airflow enters the casing through the second inlet, and leaves the casing through the second outlet.

Abstract: A holder is configured to support an LED array and includes terminals that have an insulation displacement portion (IDP) and contacts to electrically connect to the LED array. An LED module can be provided that supports a holder and an LED array. The LED module includes a housing with a floor and a wall that extends from the floor to define a first enclosure that receives the holder and LED array. The floor includes one or more channels that allow insulated conductors to extend through the floor and engage the IDP so as to provide power to the LED array.

Abstract: A headlamp disclosed includes: a laser diode for emitting a laser beam; a light emitting section including a fluorescent material which emits light in response to excitation light emitted from the laser diode; a light-transmitting heat conducting member which is provided so as to face a laser beam irradiation surface of the light emitting section and receive heat of the light emitting section; and an adhesive layer filling a gap between the heat conducting member and the laser beam irradiation surface. This arrangement improves efficiency of the heat conducting member in absorbing the heat of the light emitting section, and consequently cools the light emitting section efficiently.

Abstract: An LED light fixture including a housing and an LED assembly secured with respect to the housing. The LED assembly includes a heat sink and an LED illuminator secured with respect to an LED-supporting region of the heat sink with heat-dissipating surfaces extending therefrom. The heat sink having front, rear and lateral sides and being open to ambient-fluid flow to and from the heat-dissipating surfaces along each of the sides.

Abstract: A refrigerator with an ultraviolet LED may be provided that includes: a base disposed on a first member and a second member which are placed within the refrigerator and have one surfaces having facing directions crossing each other; a first fixing member disposed between the base and the first member; a second fixing member disposed between the base and the second member; and an ultraviolet LED being disposed on the top surface of the base and emitting light toward the interior space of the refrigerator.

Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.

Abstract: A 4 pin LED retrofit lamp for replacement of socket fitted CFL lamp driven by fluorescent ballast is provided. The retrofit lamp comprises a plurality of LEDS in connection with the fluorescent ballast. The circuit of the lamp comprises a bridge rectifier that converts the AC waveform into DC and a capacitor to filter the resulting waveform.

Abstract: A high-intensity LED lighting system is presented whereby one or more LED lighting fixtures are affixed to an elevating structure, the elevating structure having a substantially continuous internal pathway. Said pathway can be used as a conduit or duct for pressurized air which is introduced at or near the bottom of the elevating structure and forced upwardly toward the lighting fixtures so to provide cooling of one or more components of the lighting fixtures so to, ultimately, improve the efficacy of the LEDs contained therein. A method of designing lighting systems, including analysis of whether or not to add air cooling to increase light source efficiency is also disclosed.

Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.

Abstract: The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a plurality of U-shaped first heat pipes; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a plurality of U-shaped second heat pipes.

Abstract: The present disclosure relates generally to a modular angled light engine. In one embodiment, the modular angled light engine includes a center portion comprising an interlocking feature to connect to a second modular angled light engine and at least one housing coupled to the center portion. The at least one housing includes a heat sink coupled to a first side of the at least one housing, at least one light emitting diode (LED) coupled to an interior volume of the at least one housing and a lens covering the at least one LED and coupled to a second side of the at least one housing.

Abstract: Various embodiments may relate to a semiconductor retrofit bulb, in particular a retrofit festoon bulb, having connecting elements that are arranged on two sides. The semiconductor retrofit bulb may include at least a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source, in particular a light diode, a driver housing that is introduced into a hollow space of the tubular cooling body. At least one flow channel is provided between the driver housing and the cooling body.

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display module with a light emitting surface and a heat dissipating surface opposite to the light emitting surface. A non-transparent heat dissipating layer is affixed to the heat dissipating surface. A plurality of pre-split lines is formed on the non-transparent heat dissipating layer; the pre-split lines define a plurality of adjacent separable areas on the non-transparent heat dissipating layer. The non-transparent heat dissipating layer is affixed to the heat dissipating surface by an adhesive layer. When the display module needs to be repaired, at least one separable area may be torn off to form a window exposed on the heat dissipating surface.

Abstract: A Light Emitting Diode (LED) illumination device having a pleasant appearance and capable of uniform illumination is provided. The LED illumination device (101) includes a support portion (200) having a first support surface (210) and a second support surface (220), wherein the first support surface (210) faces downward, and the second support surface (220) faces downward, is located at a position higher than the first support surface (210), and surrounds the first support surface (210); a plurality of LED chips (400), including a plurality of first LED chips (411) supported on the first support surface (210) and a plurality of second LED chips (420) supported on the second support surface (220); and a mask (700), located at a lower position with respect to the support portion (200), penetrated by light from the LED chips (400), and including a tilted portion (710) inclining downward toward the center.

Abstract: Some embodiments of the present invention provide a combination lighting and ventilating apparatus for installation in a structure. The apparatus can include a main housing having a first aperture that defines a ventilating inlet and a lighting outlet, a lamp housing recessed within the main housing, having first and second apertures spaced a distance from one another, and having a portion that extends outside of the main housing, and a lamp recessed within the lamp housing and the main housing. In some embodiments, the apparatus further includes a fan positioned to draw air into and through the first aperture of the lamp housing, around the lamp, and through the second aperture of the lamp housing. In another aspect of the invention, a method of lighting and ventilating a room using a combination lighting and ventilating apparatus is provided.

Abstract: A light-emitting module includes: an LED lamp comprising; a flexible board; and a connection member that sandwiches and fixes the LED lamp and the flexible board. An electrode portion of the flexible board is pressed against an external electrode of the LED lamp by the connection member, whereby the external electrode directly contacts and is electrically connected to the electrode portion. A portion of the connection member highest from the substrate is lower than a portion of the sealing body highest from the substrate.

Abstract: A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

Abstract: A heat conductive device is disclosed. The heat conductive device includes at least one collecting frame and at least one conductive plate vertically connected to each other. The collecting frame is for surrounding LEDs and is tightly attached to a mounting surface of the circuit board, and the conductive plate is tightly attached to a back plate. The heat conductive device overcomes the defects that there is no effective heat conductive path between the circuit board and the back plate. The heat accumulated on the circuit board is greatly transmitted to the back plate, and thus the heat conductive efficiency and the heat dissipation efficiency are enhanced.

Abstract: A lighting device may be provided that comprises: a light emitting module; a heat sink disposed on the light emitting module; a heat radiating fan disposed on the heat sink; and a housing which receives the light emitting module, the heat sink and the heat radiating fan, and includes an air inlet port and an air outlet port which are separated from each other and formed in a direction in which the lighting emitting module irradiates light, wherein the air inlet port and the air outlet port are disposed on the circumference of the housing, and wherein the air inlet port and the air outlet port are alternately disposed.

Abstract: A lamp comprising a light source comprising at least one solid state emitter. The lamp comprises a heat sink body in thermal communication with said light source. At least one air flow nozzle is present in the lamp to direct air flow across at least a portion of the heat sink body. The lamp further comprises an active cooling device, in which the active cooling device is in fluid communication with the at least one air flow nozzle and is configured to provide a flow of air to the at least one air flow nozzle. The lamp further comprises driver electronics configured to provide power to each of the light source and the active cooling device, wherein the driver electronics are remote from the active cooling device.

Abstract: Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion. Accordingly, since the heat sink for a chip mounting substrate in which a heat dissipation material is embedded is manufactured by injection molding, a manufacturing process can be simplified.

Abstract: An illuminating ventilator including a fan, a connecting frame, a lamp seat and a cover is provided. The fan has a housing and a fan wheel, wherein the housing has a first coupling portion, an inlet, an outlet and an inner space communicating with said inlet and outlet, and the fan wheel is received in the inner space. The connecting frame couples with the housing and has an opening in alignment with the inlet of the housing, wherein the connecting frame has a second coupling portion coupling with the first coupling portion of the housing. The lamp seat is mounted on one of the connecting frame and housing and has a receiving portion for receiving a lamp. The cover is coupled with the connecting frame and has a plurality of apertures communicating with the opening.

Abstract: A cover for a recessed light fixture includes a base plate mounted on a surface such that an outer perimeter of the base plate surrounds the recessed light fixture. A lens frame is removably secured to the base plate. The lens frame includes a recess that receives an onyx lens that is sized and shaped to fit within the recess. The onyx lens is secured between a lens border of the lens frame and the outer perimeter of the base plate so that the onyx lens is positioned over the recessed light fixture. Light from a lamp within the recessed light fixture passes through the onyx lens and is emitted from a polished surface of the onyx lens to provide a pleasing decorative glow for illuminating a step or other passageway.

Abstract: An air cooled double ended high pressure sodium lamp fixture for growing plants in confined indoor spaces. The fixture seals the lamp and heat generated by the same to a reflector interior. Flow disruptors create turbulence in a cooling chamber thereby enhancing thermal transfer into a cooling air stream that flows over and around the reflector's exterior side thereby convectively cooling the lamp using the reflector as a heat sink. The lamp is effectively maintained at operational temperatures and the fixture housing is insulated from the hotter reflector by a gap of moving cooling air, allowing use of the double ended HPS lamp in confined indoor growing spaces.

Abstract: An LED luminaire includes a thermal management system and features minimal glare while allowing for use of traditional luminaire housing. The luminaire of the depicted embodiments comprises a luminaire housing, an LED light module, an LED driver, a diffuser, and reflectors. The LED light module comprises at least one LED array, a primary thermal interface, and a secondary thermal interface. These thermal interfaces, particularly when used in conjunction with a conductive housing, allow for optimal thermal management by utilizing both natural convection and conduction to remove the heat from inside the luminaire into the surrounding air. Additionally, in certain embodiments, the position of the LED arrays within the housing in combination with the reflector design creates an optical path resulting in an indirect light source that minimizes glare, while providing a uniform distribution of light, unlike traditional LED luminaires.

Abstract: An illustrative light fixture includes an emitter housing and airflow cooling channels. The airflow cooling channels are defined in the space between opposite edges of the emitter housing and a rim around the periphery of at least the opposite edges of the emitter housing. The airflow channels are further defined by fins spanning between the rim and opposite edges and spanning across a side of the housing opposite the illumination side.

Abstract: An LED light bulb includes a thermally conductive base and at least one LED assembly disposed on the base. The LED assembly includes at least one LED configured to emit light. A thermal optical diffuser defines an interior volume of the LED light bulb. The LED is arranged to emit light into the interior volume and through the thermal optical diffuser. The thermal optical diffuser extends from the base to a terminus on a light emitting side of the LED assembly. The thermal optical diffuser includes one or more openings. An array of optical elements is disposed within the interior volume and is configured to focus the emitted light toward the openings. The thermal optical diffuser and the array of optical elements are arranged to allow convective air flow between the interior volume of the thermal optical diffuser and ambient environment.

Abstract: A phosphor wheel heat-dissipating module for a laser projection system is provided. The phosphor wheel heat-dissipating module includes a phosphor wheel, a plurality of air vents and an impeller. At least one phosphor agent is coated on an outer-ring portion of a first surface of the phosphor wheel. The air vents run through the phosphor wheel. The impeller is disposed on a second surface of the phosphor wheel, and includes an inlet and a first outlet. A laser beam is projected on the outer-ring portion of the phosphor wheel. When the phosphor wheel is rotated at a high rotating speed, an airflow is inhaled into the impeller through the inlet. A first portion of the airflow is blown out through the first outlet, and a second portion of the airflow is transferred to the first surface of the phosphor wheel through the air vents.

Abstract: An adjusting unit disposed between a housing including at least one or more semiconductor optical devices and a case accommodating an SMPS, so as to adjust the height of the casing. At least one or more light emitting modules are mounted on the bottom surface of the housing, and a position determining unit is disposed in the housing in correspondence to an edge of the light emitting module. A heat sink unit is provided in correspondence to the top surface of the housing. Therefore, transport costs can be significantly reduced by securing the loading space. The semiconductor optical devices serving as a light source can be appropriately arranged, and the semiconductor optical devices can be mounted at accurate positions. Furthermore, products can be rapidly mass-produced due to a simplified manufacturing process thereof.

Abstract: The present invention relates to a LED lamp with a fan and manufacturing method thereof. A lamp body of the LED lamp has an upper lamp body and a lower lamp body connected together; an external wall of a facet of a prism of the upper lamp body is covered with a LED aluminum substrate connected to a LED PCB, a capacitor is soldered at the center of the bottom of the PCB, a LED driving circuit and a fan both are received in a cavity of a lamp holder; air flows into the LED lamp from an air inlet of the lower lamp body and a window of the lamp holder, then passes through an air outlet, a penetrating hole and an air flow channel, and finally an air outlet flue opened in a lamp cover and matching the penetrating hole dissipates heat away from the LED lamp.

Abstract: A lamp that emits light and includes: a mounting board on which a light-emitting element is provided; a support disposed on a side opposite a light-emission-side of the mounting board; and a case connected to a support. The case includes a securing part which is disposed on the light-emission-side of the mounting board, and secures the mounting board to the support by sandwiching the mounting board between the securing part and the support.

Abstract: A lighting assembly including a shell, wherein the shell includes an inner wall defining an inner lumen, an outer wall encircling the inner wall, a set of radial fins connecting the inner and outer walls, the set of fins cooperatively defining a set of cooling channels between adjacent fins, the inner wall, and the outer wall; an insert removably mounted within the inner lumen, the insert defining a power storage lumen; a power storage unit arranged within the power storage lumen; a circuit board coupled to the power storage unit, the circuit board comprising a processor and communication module; a lighting module electrically connected to the circuit board, wherein the lighting module includes a substrate and a set of light emitting elements mounted to a first broad face of the substrate.

Abstract: A lighting device is described. In one example, the lighting device comprises a first and second light sources disposed opposing the first light source, both the first and second light sources configured to generate light, a first and second electrically insulating heat sink elements comprises ovelapping portions separated by a distance, and a first and second flexible electrically conducting layers. The first and second light sources are arranged in contact with the first and second electrically conducting layers, respectively. The first and second electrically conducting layers are mounted to the first and second heat sink elements, respectively. The first and second heat sink elements each include a recess having shape of the first and second electrically conducting layers, respectively.

Abstract: Disclosed are a light source heat dissipation structure and a backlight module. The light source heat dissipation structure comprises at least one light bar having two lateral faces; and a heat dissipation base, comprising: a frame having an inner space, at last one open and a upper surface, and the open is formed on the frame and connected to the inner space, and the open comprises at least one open edge; and at least one elastic abutting wall having an attached surface; wherein the elastic abutting wall is fixed on the open edge, and the light bar is embedded in the open, and the attached surface is attached to the lateral face of the light bar to enlarge the contact area between the light bar and the heat dissipation base. The heat dissipation efficiency and the usage lifetime of the LED packaged structure can be improved accordingly.