Abstract: An LED lighting device includes an LED light engine and a heat sink including a heat dissipation structure. The heat dissipation structure includes: a plurality of heat conductive rod rows including a plurality of vertical heat conductive rods; a plurality of horizontal heat conductive rods including a plurality of surfaces and attached onto one end of the vertical heat conductive rods; another end of the vertical heat conductive rods vertically attached to a back side of the LED light engine; and a plurality of fin modules attached to any one of the surfaces of the horizontal heat conductive rods. Accordingly, the heat dissipation area is increased and the heat sink is separated from the LED light engine such that heat dose not accumulate thereon and the shortcoming of airflow on the heat sink can be overcome with improvements.

Abstract: An assembling heat dissipating lighting device comprises a lamp socket means and a heat dissipating lighting means. The lamp socket means includes an installing space and an installing hole communicated with the installing space. A periphery of the installing hole is formed with an inserting portion and an engaging portion. The heat dissipating lighting means includes a LED lighting member and a heat dissipating member thermally connected with the LED lighting member, and an outer ring surface of the LED lighting member has an engaging element and a fastening portion. The heat dissipating lighting means is fixed to the lamp socket means by way of engaging the engaging element into the installing space and correspondingly engaging the fastening portion with the engaging portion by way of rotating the heat dissipating lighting means. Thus, the convenience of disassembly and fixation of the assembling heat dissipating lighting device is increased.

Abstract: In an LED lighting apparatus and a heat sink thereof, the heat sink includes a heat dissipation structure for airflows, and the heat dissipation structure includes: a plurality of heat conductive rods arranged spaced apart from each other in rows and attached at a back side of an LED light engine; each heat conductive rod including an extension portion horizontally extended on at least one side of the LED light engine and a plurality of surfaces; and a plurality of fin modules attached to two corresponding surfaces of each one of the extension portions respectively; each fin module including a plurality of fins spaced apart from each other; wherein an air gap is formed between any two of the adjacent fin modules and a fin channel is formed between any two of the adjacent fins such that air flows through these air gaps and fin channels.

Abstract: A light emitting diode (LED) floodlight is described herein. The LED floodlight can include a LED housing assembly coupled to a driver assembly. The LED housing can include a number of LEDs mounted on a front side of a LED housing and a number of heat sink protrusions extending from a back side of the LED housing. The driver assembly can include a driver mounted within a driver housing, where the front side of the driver housing couples to the end of the heat sink protrusions that extend from the back side of the LED housing. The LEDs may be coupled to a number of reflectors. The reflectors can include a reflector body having a top portion and a bottom portion. The top portion can form a shape that is an elongated version of the shape formed by the bottom portion.

Abstract: A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member from which fins extend. Each fin can include one or more straight and/or curved portions. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.

Abstract: A backlight assembly includes a light guiding plate, a light source and a bottom receiving plate. The light source is disposed at a first side of the light guiding plate. The bottom receiving plate includes a bottom surface and a side wall to form a receiving space in which at least a portion of the light guiding plate is placed. The bottom surface is smaller than a lower surface of the light guiding plate and has a plurality of openings formed through the bottom surface. The side wall extends from the bottom surface.

Abstract: An LED lighting apparatus including an LED chip having at least one LED, a light reflector configured to direct light emitted by the LED at a predetermined direction and dispersion angle, a heat sink including a mounting base and cooling fins extending from a first side of the mounting base and with the LED chip secured to an opposite second side of the mounting base, a cooling fan attached to the heat sink adjacent distal ends of the plurality of fins, an electrical regulator electrically connected to the cooling fan to provide regulated power to the cooling fan, an LED driver electrically connected to the LED chip, and a thermal limit switch mounted to the heat sink and configured to cut off power to the LED chip if a sensed temperature of the heat sink exceeds a temperature set point to thereby provide thermal protection to the LED chip.

Abstract: An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.

Abstract: A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.

Abstract: A thermal management and heat transfer system for light fixtures. And in particular, light fixtures comprising LED lights requiring lower temperatures than those required by incandescent of neon based light fixtures. The heat transfer includes taking advantage of the thermal updrafts caused by free convection of waste heat to cool the fixture.

Abstract: A Light-Emitting Diode (LED) lamp includes a heat sink with a number of passive air flow ducts defined at least partially by fins of the heat sink and a cover plate over the fins. The heat sink includes a body with a cavity, a number of fins radiating outwards from the body, and a cover plate covering the fins. Each passive air flow duct includes top and bottom openings for air flow.

Abstract: A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.

Abstract: A lighting apparatus is disclosed. The lighting apparatus may include a heat sink, an LED module provided on the heat sink, an enclosure provided over the heat sink to surround the LED module, an insulator provided between the heat sink and the enclosure, a power module provided below the heat sink to provide power to the LED module, a housing attached to the heat sink to house the power module, and a power socket mounted to the housing and electrically connected to the electronic module. The heat sink may include a channel formed to correspond to a shape of the enclosure and the insulator may be provided in the channel, the insulator and the enclosure being formed of different materials.

Abstract: A flat-panel display (such as a liquid crystal display) includes one or more features that reduce temperature changes in an array of light valves disposed on a substrate. In particular, heat generated in a light source and/or electronics is conducted away from the light values. For example, a light-source holder, which contains the light source, may include holes that increase the thermal resistance between the light source and the substrate. Alternatively, the light-source holder may include a material having a thermal conductivity that is higher than that of stainless steel. In addition, the flat-panel display may include materials and/or a geometry that increases the thermal resistance along a direction in a plane of the substrate. By reducing temperature changes in the flat-panel display, these features can reduce or eliminate color changes and other visual artifacts that can degrade the quality of displayed images.

Abstract: According to one embodiment, a housing of a lamp device a cylindrical shape, and includes an opening part at one end side, a closing part at the other end side, and an insertion part formed at a center of the closing part. A thermal radiator includes a support part which is inserted through the insertion part, a light-emitting module connection part which is provided at one end side of the support part and to which the light-emitting module is connected to enable heat conduction, and an external thermal radiation part provided at the other end side of the support part. An area of the light-emitting module connection part is smaller than a cross-sectional area of the support part, and the support part, the light-emitting module connection part and the external thermal radiation part are integrally formed.

Abstract: A light emitting diode (LED) system that includes a LED, a heat sink, a fan housing, a fan, and a cover is disclosed. The heat sink is typically coupled to the LED, and the fan housing is typically coupled to the heat sink opposite the LED. The fan housing is sized to fit within an electrical junction box and includes a fan housing aperture that extends through the fan housing. A cover may be coupled to the fan housing opposite the heat sink. The system may include at least one air intake opening and at least one air exhaust opening. When activated, the fan may external air into the fan housing through the air intake opening and direct the air toward the heat sink and ultimately through the air exhaust opening. In so doing, the temperature of the heat sink and the LED is reduced.

Abstract: The present invention provides a light source fixing device for fixing a light emitting element. The light emitting element comprises a light source and a supporting plate for supporting the light source. The light source fixing device comprises a heat dissipating support which comprises a receiving recess. The receiving recess is adapted to receive the supporting plate. The light source fixing device further comprises an elastic element disposed in the receiving recess, and the elastic element is adapted to apply an elastic force on the supporting plate so that the supporting plate is fixed in the receiving recess. The present invention further provides a light source assembly and an assembling method thereof. The light source assembly features a simple assembling process, high reliability and a low cost.

Abstract: In a lamp device 12 using a GX53-type cap 31 and also using an LED 56 as a light source, there is regulated an appropriate configuration of a metallic cover 32. A cap 31 and a lighting device 36 are arranged on an upper surface side of the metallic cover 32, and a substrate 33 on which the LED 56 is mounted is arranged on a lower surface side thereof. The metallic cover 32 has an approximately cylindrical shape with a maximum outer diameter D of 80 to 150 mm, a height H of 5 to 25 mm, and 2? (D/2) H/W, that is, an area of the outer peripheral surface per gross input power W to the lamp device 12 being in a range of 200 to 800 mm2/W. The gross input power W is 5 to 20 W.

Abstract: A lighting module may be provided that includes a light emitting device module including at least one light emitting diode; a heat sink radiating heat generated from the light emitting device module and including at least one partition wall formed on a base; and a cover accommodating the light emitting device module disposed therein and including a connector which is formed in one side of the cover and is connected to a power supplier for driving the light emitting device module, wherein the connector comprises a depression allowing the terminal of the power supplier to be directly inserted into the connector.

Abstract: An LED luminaire assembly which allows for the easy and safe removal and replacement of the PSU and other internal components wherein the heat sink can be folded or pivoted aside to allow access to and removal of the PSU.

Abstract: An LED bulb includes at least one LED mount disposed within a shell. At least one LED is attached to the at least one LED mount. A thermally conductive liquid is held within the shell. The LED and LED mount are immersed in the thermally conductive liquid. A liquid displacer is immersed in the thermally conductive liquid. The liquid displacer is configured to displace a predetermined amount of the thermally conductive liquid to reduce the amount of thermally conductive liquid held within the shell. The liquid displacer is also configured to facilitate a flow of the thermally conductive liquid from the LED mount to an inner surface of the shell.

Abstract: According to one embodiment, a lamp apparatus includes a light-emitting module, housing, and a lighting circuit. The light-emitting module includes a light-emitting element. The housing opens in the direction of irradiation of a light beam and having a cap on a side opposite from the direction of irradiation of the light beam. The cap is provided with a light-emitting module mounting portion projecting in the direction of irradiation of the light beam and the light-emitting module is mounted on the light-emitting module mounting portion. The lighting circuit is accommodated in the housing.

Abstract: A thermal control circuit comprises a positive temperature coefficient thermistor array, a negative temperature coefficient thermistor array, and a resistor array. The positive temperature coefficient thermistor array and the resistor array are electrically connected in parallel to a first terminal of the thermal control circuitry. The negative temperature coefficient thermistor array is electrically connected to a second terminal of the thermal control circuit. The positive temperature coefficient thermistor array, a negative temperature coefficient thermistor array, and the resistor array are all connected by a negative bus to a third terminal of the thermal control circuit.

Abstract: A stage lighting fixture includes a casing; a light source, which is housed inside the casing and is adapted-to emit a light beam along an optical axis; a reflector coupled to the light source; light beam processing means housed inside the casing and adapted to selectively intercept the light beam; at least one heat-shield assembly located inside the casing, between the light source and the light beam processing means, to substantially divide the casing into a first area comprising the light source and the reflector, and a second area comprising the light beam processing means; the heat-shield assembly comprising a heat-shield filter, and a detector for detecting a parameter indicative of the temperature of the heat-shield filter; a cooling assembly for cooling the inside of the casing; a control device configured for regulating the cooling assembly on the basis of the parameter detected by the detector.

Abstract: The present disclosure relates to a heat transfer bracket that is configured to mount to a lighting fixture, which includes a heat spreading structure that is formed from a material that efficiently conducts heat and a light source and control electronics that are thermally coupled to the heat spreading structure. The heat transfer bracket includes a base that is thermally coupled to the heat spreading structure of the lighting fixture and multiple petals that extend from the base, wherein heat generated from the light source and control electronics is transferred to the heat spreading structure and from the heat spreading structure to the base of the heat transfer bracket. The heat is then further transferred along the plurality of petals.

Abstract: The present invention provides an illumination device (100) comprising a light source (110) arranged to generate light, a carrier (120) arranged to support the light source and an envelope (130) enclosing the light source and the carrier. Further, the carrier is arranged in thermal contact with the envelope and both the envelope and the carrier are made of ceramic material. The present invention is advantageous in that it provides an illumination device providing an effective heat transfer.

Abstract: A light-emitting device includes a light emitting portion including a substrate having a mounting surface for mounting an LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate including a ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member including one of aluminum, an aluminum alloy, magnesium, and a magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material.

Abstract: The purpose of the present invention is to provide a device that is small in size and low noise, in which heat from a light emitting element such as an LD or an LED is efficiently dissipated. A light source device includes a first light emitting element, a base plate, and an air flow device for sending out air. The base plate, which is thermally connected to the first light emitting element, has a flat surface formed around the first light emitting element to face the emitting direction of light output from the first light emitting element. The air flow device generates a flow of air toward the flat surface of the base plate in a direction perpendicular to the flat surface.

Abstract: An LED light bulb has a hollow LED support/heat sink (222, 602, 702, 900, 802, 1002, 1102, 1216, 1404, 1502, 1606, 1906) with fins (234, 406, 604, 706, 804, 904, 906,1008, 1106, 1620) extending internally and openings at two ends (230, 232, 1522). Heat generated by the LEDs (238, 908, 1242, 1624, 2504) is conducted through the heat sink fins and is removed by a convectively driven air flow that flows through the LED support/heat sink. LEDs are mounted on multiple external faces (236, 404, 910, 1524, 1622) of the LED support/heat sink thereby providing illumination in all directions. Lenses (1246, 2102, 2104) are provided for the LEDs to make the illumination highly uniform.

Abstract: An LED light fixture is provided and includes a light engine assembly having a plurality of LED light modules mounted to a printed circuit board. The light engine assembly has a substantially circular periphery. A substantially cylindrical main body portion surrounds the light engine assembly and is sized to define a substantially annular gap between an inner surface of the main body portion and the periphery of the light engine. A plurality of radially extending and circumferentially arrayed fins are positioned rearward of the light engine assembly, and a thermal pad is coupled to and positioned between a rear surface of the light engine assembly and the plurality of fins for transferring heat away from the light engine assembly. The annular gap at least partially defines an air flow path in communication with spaces between the fins. An LED track lighting fixture including the LED light fixture also is provided.

Abstract: A light emitting diode module is produced using at least one LED and at least two selectable components that form a light mixing chamber. First and second selectable components have first and second types of wavelength converting materials with different wavelength converting characteristics. The first and second wavelength converting characteristics alter the spectral power distribution of the light produced by the LED to produce light with a color point that is a predetermined tolerance from a predetermined color point. Moreover, a set of LED modules may be produced such that each LED module has the same color point within a predetermined tolerance. The LED module may be produced by pre-measuring the wavelength converting characteristics of the different components selecting components with wavelength converting characteristics that convert the spectral power distribution of the LED to a color point that is a predetermined tolerance from a predetermined color point.

Abstract: Provided is a lighting apparatus using light emitting diodes (LEDs) having a lateral heat radiation unit structure that can maximize heat radiation effect by employing an air vent structure causing atmospheric pressure difference between both side ends of an air circulation path. The lighting apparatus comprising a housing having a power supply accommodation space therein, a heat radiation unit that comprises an LED module accommodation groove that is installed on the top of the housing and having at least one inclined surface or mounting surface on which the LED module is mounted, and a number of fins that are formed on the outer circumferential surface of the LED module accommodation groove, an air circulation path that is lengthily formed between the housing and the heat radiation unit.

Abstract: A lighting apparatus is disclosed. The lighting apparatus may be an omni-directional LED lamp. The lighting apparatus may include a heat sink and a first substrate disposed over the heat sink. A second substrate may be mounted to a connector provided on the first substrate. The second substrate may include at least one LED mounted on a surface of the second substrate. The second substrate may be mounted in the connector such that the surface of the second substrate is positioned at a prescribed angle with respect to the upper surface of the first substrate. Various types of reflectors are disclosed that reflect light in a prescribed angular range with uniform intensity. A bulb may be provided over the heat sink to surround the LEDs. Moreover, a power module may be electrically connected to the connector to provide power to the LEDs.

Abstract: A lighting module has an array of light-emitting elements that is electrically coupled to a heat sink and a housing having a heat exit. The array of light-emitting elements is positioned in the housing and the heat sink is positioned to dissipate heat generated within the housing so that the heat is expelled through the heat exit. A deflector is secured to the housing and is positioned to extend over some portion of the heat exit. The deflector guides heat away from the housing in a direction. In some configurations, the deflector guides heat away from the housing in a direction that is opposite the direction in which the array of light-emitting elements emit light. Also, some lighting modules have multiple heat exits and may have multiple deflectors extending over a portion of the respective heat exits.

Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

Abstract: Provided are an illumination device and a light fixture including the illumination device. The illumination device includes a body formed of a thermally-conductive material that includes a planar heat transfer surface and a fastener that is compatible with a base that couples the body to the light fixture. A substrate formed, at least in part from a dielectric material supports an array of light emitting diodes and a plurality of contacts electrically connected to the light emitting diodes. A thermally-conductive planar surface is provided to the dielectric material of the substrate to be placed in thermal communication with the heat transfer surface and conduct heat generated by the light emitting diodes to the body.

Abstract: The invention relates to a novel recreational or occupational modulating light headlamp which works in conjunction with the mechanics of human vision to provide effective path lighting in very low light or dark. Applying flicker fusion rate and factoring in the acuity of the eye's rods and cones, lighting is applied to the range and capability of the ocular abilities and optimized for low light or dark.

Abstract: An LED-based lamp assembly with a driver assembly having a base portion rotatably engageable with the socket of a light fixture to make a first electrical contact with the light fixture. The driver assembly makes electrical contact with the light fixture. A lamp housing assembly operably connected to the driver assembly has a lamp housing connected to the driver assembly. The lamp housing is coupled to an integrated circuitry arrangement with at least one LED light thereon. The integrated circuitry arrangement is connected to, or is an integral part of, a heat sink that carries heat away from the substrate and/or LED light. The heat sink and the integrated circuitry arrangement have apertures hat allows heated air from the heat sink to pass therethrough and away from the LED light.

Abstract: A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

Abstract: A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.

Abstract: A manufacturing method of heat conductive device for an LED has steps of forming a heat sink and an engagement recess in the heat sink by cold forge, punching a heat-conducting disc to form an LED carrier having a mounting portion and a heat-conducting wall formed around the mounting portion, soldering multiple LEDs on the LED carrier, and heating the heat sink to thermally expand the heat sink and assembling the LED carrier and the heat sink so that the heat-conducting wall is assembled with the engagement recess and further chilling the heat sink to thermally retract and tightly hold the LED carrier. The manufacturing method increases contact area and reduces air gaps between the LED carrier and the heat sink to effectively enhance the heat-conducting efficiency of the LED carrier so that the LEDs are operated at a suitable operating temperature to secure a prolonged life duration.

Abstract: An illumination tool has an LED light source; and a light reflecting part which is provided at a front of the LED light source. The light reflecting part is given a slant so as to approach the LED light source toward a center.

Abstract: A lighting device (100) has a support structure having lighting elements (422) arranged thereon. The support structure has an internal cooling duct having a duct wall. At least a part of duct wall is in thermal contact with the lighting elements. The cooling duct is configured to allow a natural air flow absorbing heat generated by the lighting elements from the duct wall. The cooling duct extends through the support structure from a first opening having a first cross-sectional area to a second opening having a second cross-sectional area. The cooling duct contains a filler body (412) having a substantially bi-conical shape. The filler body and the duct wall form a cooling duct portion with a third cross-sectional area greater than the first cross-sectional area and/or the second cross-sectional area. The lighting device is part of a lighting system. The system comprises a control unit (700) coupled to the lighting device.

Abstract: A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.

Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.

Abstract: A modular lighting fixture assembly. Multiple light pods can be removably mounted on both lateral sides of a mechanical thermal element, such as an elongated heat sink. The pods can be easily removed for cleaning, maintenance, and transport, for example. A light strip including multiple LEDs can be mounted to a surface of the heat sink on both sides. Each pod has a portion cutaway such that when the pods are mounted to the heat sink, the cutaway portions align with the light strips. Thus, when mounted, the light strip can be adjacent to or protrude into an interior cavity of the pod. The interior surfaces of the pods are shaped to redirect light in a particular output profile. The assembly may be mounted to a ceiling and used as an overhead fixture designed to efficiently light an aisle in a retail space or a storage facility, for example.

Abstract: A backlight assembly includes a first light emitting unit having a first light emitting diode, a second light emitting unit having a second light emitting diode, a third heat conduction member, and a receiving container accommodating the first light emitting unit and the second light emitting unit. The first light emitting unit includes a first heat conduction member connected to the first light emitting diode to absorb a heat from the first light emitting diode, and the second light emitting unit includes a second heat conduction member connected to the second light emitting diode to absorb a heat from the second light emitting diode. A third heat conduction member is connected to the first and second heat conduction members to discharge the heats from the first and second light emitting diodes.

Abstract: A lighting module has an array of light emitters, a heat sink having a first surface, the array of light emitters being mounted to the first surface, a microchannel cooler arranged on a second surface of the heat sink on an opposite side of the heat sink from the first surface, the microchannel cooler arranged to transport a liquid through a channel on the second surface of the heat sink, and a cooling unit thermally coupled to a microchannel cooler and arranged to remove heat from the liquid.

Abstract: A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.

Abstract: A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.