Abstract: The present invention relates to a power supply system which can provide a dual air flow control and heat reduction in an electronic device having a regular fan. The power supply system has an additional backup fan operating independently from the regular fan and further comprises a thermal control circuit comprising a solid state temperature sensor for detecting ambient temperature changes inside the electronic device and a fan power drive electrically connected to the solid state temperature sensor as well as to the backup fan to turn on or off the backup fan in response to ambient temperature changes. The power supply system also comprises a pair of resistors connected respectively to the solid state temperature sensor to set a low and a high trigger temperatures based that the backup fan is able to make a proper response to ambient temperature changes provided, however, that the high trigger temperature shall be higher than the low trigger temperature.

Abstract: A battery isolator alternator bracket incorporating one or more heat sinks comprising at least one heat sink, the bracket formed of two segments, an upper closure segment, and lower base segment, the heat sinks formed preferably of extruded aluminum are shaped to conform to the interior of the bracket, each heat sink including a finned heat exchanger, having a terminal connecting at its front, being in electrical contact with a button diode, adhered thereto, with the terminals of each heat sink connecting either directly or by cable to the battery post of the alternator, for transmission of charge to the various batteries during alternator electrical generation.

Abstract: A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown includes the steps of computing the cooling air mass flow rate, creating an electronic model of the semiconductor/heat sink combination and estimating the semiconductor junction temperature from the mass flow rate and model. The cooling mass flow rate is determined by measuring the temperature of the cooling air prior to passage over the heat sink, measuring atmospheric pressure of the cooling air, determining the volumetric air flow rate of the cooling air and computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate. Power dissipation in the semiconductors is then computed and heat sink and semiconductor temperatures are estimated from power dissipation and cooling air mass flow rate.

Abstract: A switching power source unit has a constitution that the DC-DC portion 5 in which electronic parts are mounted on a metal core substrate and the AC-DC portion 6 in which electronic parts are mounted on a glass epoxy substrate are mounted in the same metallic outer cabinet 1, for example, the metal core substrate is attached on the heat sink 19 and the heat sink 19 is set in contact with the outer cabinet 1 so as to radiate heat from the metal core substrate.

Abstract: A rectifying unit for an alternator is composed of AC input terminal and cooling fins connected to output ends (including a neutral point) of a multi-phase stator coil, a negative-poled cooling fin which is grounded and fixed to a rear cover of the alternator, diodes whose anodes are soldered to the AC input fins and whose cathodes are welded to a positive output terminal, and diodes whose anodes are soldered to a negative-poled fin and whose cathodes are welded to the AC input fins.

Abstract: A rectifier arrangement for a three-phase generator having at least one power diode allocated to each half-wave of each phase and a cooling arrangement for the power diodes. The power diodes may be designed as diode chips and be arranged between two diametrically opposed heat sinks, while being oriented with respect to polarity and electrically and/or thermally conductive.

Abstract: An electronic variable speed drive including a cabinet having an opening door, a power system supplied with power from an AC line voltage and delivering a voltage under the control of solid state power switches and an electronic control system controlling the solid state switches. The cabinet contains, behind the door, a protective cover which protects the electronic control system and the power system which are disposed behind it. When the door is open, the protective cover protects users from the control and power systems.

Abstract: An indirect feedback type flyback converter that compares favorably with the direct feedback type flyback converter in controllability of secondary output voltage, wherein the converter is arranged so that a switching signal, which is induced in a secondary winding when a direct current input voltage, applied to a primary winding, is turned ON and OFF by a switching element, is smoothed by rectification and fed to a load and that an output voltage is detected using a switching signal induced in an auxiliary winding to transmit a control signal to the switching element for the purpose of stabilizing the output voltage; wherein the primary, secondary and auxiliary windings are formed on respective coil formation surfaces of a coil laminate as convoluted shaped conductor patterns disposed between a core hole at the center of the pattern and the border of the coil formation surface, with the auxiliary winding being disposed to be near the border of the coil formation surface.

Abstract: The rectifier arrangement, preferably for a three-phase generator for a motor vehicle, has at least one power diode of positive polarity and at least one power diode of negative polarity assigned to respective half waves of each phase of the three-phase current and a cooling arrangement for the power diodes, the power diodes of like polarity being arranged on respective heat sinks in an electrically and thermally conductive fashion, and the heat sinks being sandwiched together with at least one electrically insulating part (32) which contains the electrical conductors between the diodes and the three-phase winding.

Abstract: A cooling system is provided for an electric vehicle inverter system having an inverter for converting electric power from a battery into alternating current and for supplying the current to a driving motor for driving the vehicle. The cooling system employs a heat sink having an internal coolant flow passage for conducting a liquid coolant which is forced to recirculate. The heat sink is vertically placed on a mounting base, and heat generating parts are placed and fixed on at least one side of said heat sink. In this way, a cooling system for an electric vehicle inverter system which is small in size and large in cooling capacity with a simple construction is easily provided.

Abstract: An inverter device for changing direct current to alternating current for supplying to an electric motor which may be employed in an electric automobile. This inverter device includes a plurality of switching units, a cooling support member, capacitors, and pairs of first and second conductive plates. Each of the switching units has a box-like casing mounted on the cooling support member, and includes a positive switching element, a negative switching element connected in series, and positive and negative terminals. The positive and negative terminals are exposed on the upper wall of the casing. Each of the capacitors is arranged over an upper wall of the casing of a corresponding one of the switching units, and has positive and negative charge/discharge terminals.

Abstract: A design for and method of assembling a power supply or power converter. The design is based on mounting the heat generating elements of the device, such as an integrated circuit or other switching device in a manner which provides a direct thermal coupling between those devices and the inductors or transformers which are part of the power supply or converter Using packaging techniques similar to those used in the semiconductor industry, the inductor or transformer is attached to one side of a lead frame. The heat generating elements are then mounted on top of the inductor or transformer. Passive components, such as capacitors, may be mounted on the lead frame. Additional heat generating components may also be mounted on the inductor or transformer. The resulting combination is then encapsulated in plastic or a molding compound typically used in the industry.

Abstract: A cryogenically cooled circuit, operating at temperatures at which inductors windings of the circuit exhibit superconducting characteristics, provides unique advantages in high performance, preferably high power circuits. Portions of the circuit (or the entire circuit), as opposed to, for example only the superconducting elements (i.e., inductor winding), are refrigerated to cryogenic temperatures. Advantages in the characteristics of not only the superconducting based components but also the diodes, and gating elements such as MOSFET's, yield a uniquely advantageous circuit enabling the operation of, for example, a switching power supplies, frequency converters, and motor speed controllers with increased performance and efficiency. Size, component count, and stability are benefits attained by cryogenically cooling the entire circuit configuration.

Abstract: A filter module for a frequency converter comprises a filter circuit housed in a casing adapted for connection to the converter. The filter module includes an input filter and an output filter so arranged that input terminals for connection to the AC line voltage and output terminals for connection to an electric motor are disposed on a common side of the casing and so that the connections between the frequency converter and the filter module are disposed on a side of the casing which in use faces the converter.

Abstract: The present invention locates the primary winding of a transformer in a configuration where it substantially surrounds the secondary winding of the transformer in order to enhance the efficiency of the electromagnetic coupling. High magnetic permeability material surrounds portions of the primary winding of the transformer. The transformer is designed to efficiently operate at frequencies of approximately 50 kilohertz. In one preferred embodiment, the primary winding of the invention is formed of two U-shapes in which the parallel members of the U are substantially longer than the bottom portion of the U. The two U-shapes form a rectangular shape and the substantially parallel rectangular portions are surrounded by high magnetic permeability material to further enhance the electromagnetic coupling between the primary coil winding and the secondary coil winding. In another embodiment, the primary winding of the invention may be rectangular in shape.

Abstract: A motor control unit having a first semiconductor module circuit for converting an alternating current into a direct current, a second semiconductor module circuit consisting of switching elements for converting the direct current into an alternating current of optional voltage and frequency, and a control circuit for controlling the semiconductor module circuits. The unit has a case that is substantially rectangular in cross section, vertically high and laterally thin with respect to a perpendicular installation surface. Two heat sinks are disposed at the outside of the unit case at the back thereof and are thermally connected to a laminar heat plate that is disposed within the case and in contact with the heat dissipating installation surfaces of the semiconductor modules inside the unit case.

Abstract: The inductive charge coupler carrying the transformer primary is supplied with coolant fluid. The inductive charge receptacle mounted on the automobile has interior cooling fluid passages and there is a duct to transfer the cooling fluid from the inductive charge coupler to the cooling fluid passages in the inductive charge receptacle.

Abstract: An inverter apparatus having a compact design and a changeable heat sink. The apparatus includes a power module formed in a case having pairs of parallel sides and containing the respective main circuit semiconductor devices for converting an alternating current input into a direct current and then further into an alternating current of variable frequency. The heat sink also has pairs of parallel sides and interfaces with the case in a plane whereon the projections of the sink and the case are coextensive. The apparatus also has a body with pairs of parallel sides that fasten to the case and constitute part of the enclosure of the inverter apparatus. The body, case, heat sink and associated circuit elements have alignment structures that permit easy and reliable disassembly and assembly of the apparatus.

Abstract: A housing may hold a control device equipped with heat-producing components. A die-cast housing includes a side wall, a rear wall, a bottom, a cover, a front strut, a cooling element and an air guide device, a cover plate and a front cover. The cooling ribs of the cooling element run parallel to the rear wall, end in the plane of the side wall, and are covered with a bulkhead plate. The bottom and the cover are each provided with perforations for removing heat from the front housing half and openings through which connection lines may be passed. The front strut serves as a lateral frame part for the removable cover plate that covers a lateral access opening of the housing, and for the front cover which can close off the front-side opening of the housing. This results in a housing for a control device in book size format, where the number of assembly parts, the assembly effort and the assembly time are significantly reduced.

Abstract: A half-bridge arrangement for switching electrical powers, wherein at least two semiconductor switches (14, 21; 15, 20; 16, 19; 17, 18) forming a half-bridge (12a; 12b; 12c; 12d) are connected in series; each semiconductor switch (14, 21; 15, 20; 16, 19; 17, 18) is provided with a control input (G) which is connected to a driving circuit (23, 24); each first semiconductor switch (14; 15; 16; 17) is at a high voltage potential (V.sub.ss) with its source terminal (S); each second semiconductor switch (18; 19; 20; 21) is at a low voltage potential (V.sub.DD) with its drain terminal (D); the drain terminal (D) of each first semiconductor switch (14; 5; 16; 17) is connected with the source terminal (S) of each respective second semiconductor switch (18; 19; 20; 21) for providing an output terminal (A); and at least one capacitor assembly (30) is arranged between the high and the low voltage potential (V.sub.SS, V.sub.

Abstract: A bypass contactor usable in a solid state motor starter for shunting current around a fully-conducting solid state switching device comprising an electromagnetic contactor housed in a molded insulating enclosure having a plurality of bridging contacts movable into and out of engagement with a pair of stationary contacts to provide plural parallel current paths within the contactor, the stationary contacts having rigid terminal portions projecting externally of the insulating enclosure connectable to the heat sinks of the solid state motor starter in a preferred manner to suspend the contactor above the panel, permitting other components to be mounted below the bypass contacts. Alternate embodiments have the contactor mounted to the same support as the starter power pole component assembly and electrically connected thereto by rigid preformed connectors or flexible braided straps.

Abstract: This device for converting a very-low-amplitude steady voltage signal into an alternating voltage signal, of the type comprising a centre-tapped transformer (1) associated with a transistor (3,4) chopper (2), is characterised in that the transformer (1) and the transistors (3,4) are arranged in a housing (15) held at very low temperature and in which is arranged a material (20) for thermal insulation of the transistors (3,4) with respect to the rest of the housing so as to reduce temperature fluctuations and allow operation of these transistors by self-heating due to their drive current.

Abstract: A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

Abstract: An electrical device to be electrically mounted to a cooling mounting structure so that the electrical device is in intimate physical contact with the mounting structure for cooling the electrical device. The electrical device having a first pivot allowing contact for allowing the electrical device to be pivoted as it is mounted to the cooling mounting structure so that the electrical device is in intimate physical contact with the cooling mounting structure and for providing an electrical connection to the cooling mounting structure and the electrical device further having a second nonpivot allowing contact having a shape for providing electrical contact with the mounting structure when the electrical device is in intimate physical contact with the cooling mounting structure.

Abstract: A plurality of high power semiconductor devices are connected in circuit with at least one electric traction motor for controlling electric power to the motor. The semiconductor devices are each thermally connected between a pair of generally hollow heat sinks adapted for passing cooling air therethrough for extracting heat therefrom. An anode terminal of the devices is coupled to one of the heat sinks of a pair and a cathode terminal of the devices is connected to the other heat sink of the pair. Each of the heat sinks are mounted in a cantilever fashion to a common air plenum forming one wall of an electrical circuit area of a vehicle. The distal ends of the heat sinks of a pair are coupled together by an air flow conduit thus forming a continuous air passage through the pair of heat sinks which begins and ends at the surface containing the air supply plenum. One end of one of the pair of heat sinks, preferably the heat sink coupled to the cathode terminal, is connected to an exhaust conduit.

Abstract: An ac drive controller including a phase assembly for each phase of a polyphase supply to a motor, each phase assembly including an invertor module and a corresponding filter module. The electrical interconnections between each filter module and each invertor module occur through electrically conductive clips and corresponding bus bars to which the electronic switching devices in the invertor are also connected. The filter and invertor module interconnections are located as close as possible to the points where the electronic switching devices are connected to the buses to minimize stray reactances while allowing for simplified assembly and servicing of the controller.

Abstract: An apparatus for driving a plurality of motors at different variable speeds. The apparatus includes a rectifier for supplying direct current power to a dc bus circuit. A plurality of inverters are connected to the dc bus circuit and each inverter drives a respective motor. Each inverter is controlled by an individual controller connected thereto for controlling the frequency of the output of the inverter to thereby control the speed of the associated motor. The inverters are preferably mounted on a common heat sink to reduce electrical and mechanical complexity. The apparatus permits the rectifier and the dc bus circuit to be sized to handle a maximum rating of less than the sum total of maximum loads of each of the motors. The dc bus circuit also serves to distribute energy generated by a slowing motor, for example, to other motors driven from the bus circuit. A chopper resistor may be included and switched across the dc bus circuit to provide braking to the motors.

Abstract: Power supplies are known, in particular power supplies under primary clock-pulse control, that comprise a closed housing for the primary and secondary circuits, and a forced-air cooling means to cool the heat-producing components of the circuits. A power supply is proposed in which additionally there is a ventilation conduit in communication with the air outside the housing to serve as a cooling medium. The cooling means also comprises at least one cooling-unit element, on which the heat-producing components are mounted, and a portion of said element projects into the ventilation conduit and is electrically isolated by insulating means.

Abstract: A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet. Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

Abstract: A power supply has a stack formed by a first bus plate, a gate take off (GTO) thyristor, a second bus plate, a bypass diode and a third bus plate all mounted to a heat sink by a single clamp, with the anode of the thyristor closest to the heat sink. Preferably, the bus plates are sized and of a material to provide local thermal storage. The heat sink then can be sized to handle only the average heat dissipation requirements, rather than the peak requirements, and the total power supply can be very compact.

Abstract: The inverter module according to the present invention includes a component support for supporting components attached thereto, an AC/DC converter attached to the support for converting input AC into DC, inverter switches attached to the support for inverting the DC into single-phase output AC, a switch controller attached to the support for controlling the inverter switches, and connectors for interconnecting the AC/DC converter, the inverter switches, and the switch controller so that input AC is converted to a single phase of output AC.

Abstract: An ignition coil unit comprising within an electrically insulating casing (31) an ignition coil (A) and a packaged power switch circuit (E). The packaged power switch circuit (E), which comprises a plurality of electric and electronic components (F) hermetically sealed within a mold resin (G) to form a single compact unitary piece, is disposed within a power switch cavity (31d) of the casing (31). An aluminum heat dissipating plate (30) may be attached at its first end (30a) to said packaged power switch circuit (E) in a thermally conductive relationship and exposed at its second end (30b) to the exterior of said casing (31).

Abstract: An improved DC to AC electrical inverter has a new and improved method and apparatus with forced air ventilation cooling that significantly increases sustainable AC power output. The methods include the steps of forcing an air flow out of the inverter enclosure and over an external heat sink, and forcing an air flow through a special power transformer between the windings and the core. The apparatus has at least one fan, an air outlet and structure for guiding and directing a forced air flow to and over an external heat sink for the power switches. A structure to continuously force cooling air through the power transformer is also provided.

Abstract: With respect to their connection to snubber capacitors (C1, C2), a discharge resistor (12) connecting these snubber capacitors, and a link capacitor bank (3), inverter circuits with GTO thyristors (T1, T2) connected in series have parasitic leakage inductances which limit the level of the permissible link direct voltage. In order to reduce the leakage inductances, the snubber capacitors (C1, C2) are surrounded by effectively conducting capacitor covers (17). Sheet-metal shielding covers are fitted over the two ends of the discharge resistor (12). Parallel and series connected capacitors of the link capacitor bank (3) are connected to the positive/negative terminals (23, 24) of the GTO thyristors (T1, T2) in the middle of a heat sink connecting strainer (33), the supply leads being guided essentially parallel and the capacitors being arranged in opposite planes.

Abstract: A power semiconductor bridge assembly for an alternator-fed DC power source, including positive and negative parallel spaced DC bus bars and a plurality of disk device phase modules disposed therebetween for interconnecting the bus bars with the alternator phase windings. The modules are mounted within the bus bars so as to facilitate their installation and removal. Each phase module includes a pair of disk-type power semiconductor devices separated by an inner heat sink which is connected to a motor phase winding, and sandwiched between first and second outer heat sinks. The semiconductor devices and various heat sinks are aligned along a mutual longitudinal axis which substantially coincides with a longitudinal axis of the bus bar cavity. The outer heat sinks are staggered or offset along a transverse axis of the cavity such that the first outer heat sink engages the positive DC bus bar, and the second outer heat sink engages the negative DC bus bar.

Abstract: An inverter unit for driving a motor with multi-phased currents, each of the phases being derived from a.c. input voltages that are applied to respective input terminals, rectified and smoothed by capacitors before being applied to parallel-connected switching elements to develop each of the phased a.c. outputs. The capacitors may be connected in series and/or in parallel together with the switching elements. In order to reduce the effect of the distributed inductance contributed by the conductors used to connect the capacitances and switches, and thus the need for large snubber capacitances to compensate for the distributed inductances, the connectors are given a geometry and an orientation that causes the inductances to be minimized. Specifically, the conductors are of a bus-plate form, having a large area for improving heat dissipation, and an orientation so that the magnitude and direction of currents flowing through the bus-plates tend to minimize the effect of the distributed inductances.

Abstract: This invention relates to an electronic power switch in the form of a half bridge circuit for switchable outputs greater than 1 kW, having a series circuit of two power semiconductor groups between two direct current connections. At least one power semiconductor group comprises a parallel circuit of a plurality of the same kind of individual power semiconductors of smaller current load ability. All power semiconductors of both groups are fastened on a common printed circuit board and the power semiconductors are used in the switching operation. By means of a special structure of the printed circuit board, cooling bars and power semiconductors, a power switch with a clearly reduced leakage inductance is obtained, which can be designed in a space saving manner as a fully, as well as, semi-controlled half bridge circuit for very high currents.

Abstract: A heat-dissipating structure for a switching power supply characterized in that the respective portions of the power supply lines on the hot side and the cold side connected respectively to the output terminals after a switching element are formed by plate conductors, and connected to said power supply lines, and that the heat generating circuit elements placed at the top, thereunder the plate conductor on one side, a heat conductive insulator, the plate conductor on the other side, and another heat conductive insulator are sequentially overlaid and fixed on a box member.

Abstract: An electronic power component circuit comprising low level electronic control circuits mounted on a platform over electronic power circuits constituted as a hybrid circuit, in which the low level electronic control circuits are also constituted as a hybrid circuit, being formed on a substrate of aluminum nitride.

Abstract: A three-dimensional integrated power distribution and regulation apparatus for providing regulated power to a plurality of chips mounted on a module. The apparatus has a busbar mounted on the module, this busbar receiving high voltage power as an input. A plurality of power regulators are mounted on the busbar and are electrically coupled to this busbar. The power regulators are point-of-load regulators that receive high voltage power as an input and produce regulated power to the busbar. The busbar is electrically coupled to the chips and provides the chips with the regulated power. Heat and losses are reduced since the power regulators are mounted on the module, close to the chips themselves.

Abstract: A high performance, high current, miniaturized low voltage power supply is disclosed which employs a thick copper-ceramic film primary board, a direct bonded copper secondary, flexible printed circuit power inductors, the power supply has high power leadless chip carriers, hybrid rectifier packages and various electrical circuits including application specific integrated circuits for control, a turn on protection and current sharing.

Abstract: An electrical isolator device which comprises at least one heat sink (steel plate), and a non-conductive housing which partially encases the heat sink, such that at least one surface of the heat sink is in contact with the non-conductive housing; whereby the surfaces of the heat sink which are not in contact with the non-conductive housing are exposed to the atmosphere to allow dissipation of heat therefrom.

Abstract: An electronic power supply which employs energy storage capacitors has an enclosure defining a housing including a base and a cover. The capacitors are resiliently supported within the enclosure on a carrier. Integral receivers extend from the underside of the top of the cover in registration with the carrier and engage the capacitors to clamp the capacitors in a fixed position within the housing. The housing exterior includes a thermal radiator consisting of multiple fins which extend outwardly from the receivers for dissipating heat generated in the capacitors.

Abstract: A magnetic amplifier package (1) comprises a diode rectifier (6) and a plurality of saturable reactors in the form of toroids (2) having cores (3), gate windings (4) and control windings (5). The diode rectifier and the saturable reactors are located within a housing (7) of the package. The housing has an inlet (18) and outlet (19) for cooling fluid and a passage (20) within the housing for circulating coolant between the inlet and the outlet for cooling both the diode rectifier and the saturable reactors. The magnetic amplifier package is compact, lightweight and efficiently cooled to facilitate its use in aircraft.

Abstract: In an electrical device for supplying x-ray tubes, the primary and secondary windings of the transformer are wound on circular coil forms which are adapted to fit within two half-shells. The half-shells are constituted by a recessed annular structure in which capacitors are housed. The output terminals of the secondary windings are placed on one side in order to be connected to the capacitors and to diodes over very short distances.

Abstract: A converter with an intermediate d.c. circuit includes power components grouped together in a plurality of modules. Bus bars are provided to which the modules are connected.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract: A power converter comprises a plurality of modular circuit boards assembled in a stacked relationship. The circuit boards include heat exchangers which are interconnected and cooling fluid is provided thereto to remove heat generated by high power devices.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract: A power module contains IGBT die along with integrated circuit driver chips and opto isolators or isolation transformers within the same module housing. Output terminals are provided which can be interfaced directly to control logic or microprocessors for operating the module. The IGBTs may have current-sensing electrodes to simplify current measurement and control functions.