Abstract: A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module and fixed to the metal casing; a heat dissipating sheet disposed on the metal plate; and a drive circuit board disposed on the heat dissipating sheet and is equipped with a control circuit for controlling the power semiconductor devices.

Abstract: A switching mode power supply and a method for outputting voltage therefrom are provided, where a transformer receives rectified alternating current (AC) voltage and transforms a voltage value or a current value, a switching transistor is connected to one end of a first coil and controls a level of power supplied to the first coil, a heat sink is positioned adjacent to the switching transistor and attenuates electromagnetic wave noise of the switching transistor; and a capacitive device is set up in an electric power line connecting the heat sink to a first side grounding end coupled with the other end of the first coil of the transformer. Accordingly the switching mode power supply can be miniaturized while effectively attenuating the electromagnetic wave noise from the switching transistor.

Abstract: In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC/DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC/DC converter 41 and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply cooling air at low temperature before heat exchange to all the battery module, the DC/DC converter, and the motor driving inverter, thereby enhancing cooling effect.

Abstract: A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having a first heat-receiving part and formed on the opposite side from this a second heat-receiving part; a power module, in firm contact with the first heat-receiving part, containing a power semiconductor element for performing DC-AC conversion and/or AC-DC conversion for one phase; a smoothing condenser, in firm contact with the second heat-receiving part, for suppressing ripple current of the power semiconductor element; and fixing means passing through the power module, the heat sink and the smoothing condenser.

Abstract: A power converter of the present invention is connected between a direct current power source and controls power to a load by switching equipment. The converter is equipped with a first conductor for connecting a negative pole of the power converter and the switching equipment, and a second conductor for connecting a housing of the power converter and the negative pole of the power converter to the first conductor through a resistor.

Abstract: A power conversion system which uses a plurality of transistors to convert DC power to AC power is made more efficient by the use of liquid refrigerant to cool the transistors. A plurality of passages are formed in a cold plate on which the transistors are mounted, and liquid refrigerant is flashed into the passages to cool the cold plate and the transistors. The liquid refrigerant can by derived from a condenser from an organic rankine cycle or a vapor compression cycle.

Abstract: In a rectifying device for a vehicular AC generator, a rectifying element is press-fitted in a positive-side radiation plate. The radiation plate is prepared in a predetermined shape and an engaging hole is punched in the radiation plate. Four grooves are formed in an inner periphery of the radiation plate created by the hole. The rectifying element is press-fitted in the hole while an excess produced between the rectifying element and the inner periphery of the radiation plate is released into the grooves.

Abstract: The difference between internal processes of a power converting apparatus may bring about a heat difference in the apparatus. In the cooling process, it is presumed that the temperature change of the inverter or converter module may be made so great that the power converting apparatus may be less reliable. In order to overcome this shortcoming, the temperature of the internal module is measured and a cooling control of a cooling fan or the like is carried out on the measured result. This cooling control of the cooling fan causes the life of a switching element of the inverter or converter to be longer.

Abstract: A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power attached semiconductor components. DC port conducts are positioned in close proximity to each other and are arranged in at least one partial sector parallel and in close proximity to the surface of the substrate and/or the ribbon connectors and electrically insulated from the same, and at least one AC port conductor is similarly attached. The port conductors include surface elements enabling simplified low-inductance wire bond connection from the port conductors to either the power semiconductor components or ribbon connectors or both.

Abstract: An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A system for supplying electrical power for use when the vehicle engine is shut down and configurations of long-haul trucks employing the system are disclosed. The power system is a battery bank contained within an insulated enclosure. The batteries are heated when the truck is in operation with the insulated enclosure maintaining battery temperature sufficient to provide high battery power capacity for an extended period after the vehicle is shut down. A large capacitor, rather than the batteries, provides current for starting the vehicle engine. A dc-to-dc converter controls the fully charged capacitor voltage and provides capacitor charging current even when the batteries have been discharged to a low-voltage condition. The disclosed long-haul truck configurations include a storage cooler that employs a phase-change medium that is thermally charged to a low temperature while the truck is in operation and is used to provide sleeper unit cooling air.

Abstract: A charging system includes an alternator body, rotor coil and stator windings. A bridge rectifier is positioned within the alternator body and connected to the stator windings for rectifying the electrical output from the stator windings. The rectifier includes a positive and negative heat sinks each having a top surface and spaced from each other with cooling fins on an outer surface of each heat sink. A plurality of diodes are positioned at each top surface of positive and negative heat sinks. A terminal assembly interconnects respective pairs of positive and negative diodes. At least one pair of interconnected positive and negative diodes are positioned offset from each other at an angle to provide a maximum surface area for the cooling fins.

Abstract: A switch assembly and method includes a heat sink with two switch modules coupled thereto. Both of the switch modules are used in switching operations to make use of the entire heat sink, providing improved heat dissipation. The switch modules each have first and second switch devices, with each switch device having a gate terminal. A source voltage is applied to the switching modules and a positive portion of the source voltage is conducted through one switch device of the first switching module. A negative portion of the source voltage is conducted through one of the switching devices of the second switching module.

Abstract: In a semiconductor device for generating complementary PWM signals for, for example, controlling an inverter, a dead time is flexibly added by using a simple architecture. A dead time addition unit adds time elapsing until a value of a timer reaches a set value of a register as a first dead time at a rise of a first PWM signal. On the other hand, time elapsing until the value of the timer reaches a set value of another register is added as a second dead time at a rise of a second PWM signal.

Abstract: Hermetically sealed high-voltage assemblies are made up of series-connected diodes. Exposed tabs bonding adjacent diodes allow for greater thermal dissipation than previous products. This allows higher current-carrying capacity especially if used in oil.

Abstract: A power switching module is provided having at least one power switch placed above at least one other power switch, each power switch in turn including an upper wall and a lower wall, each of which is cooled through thermal conduction by a cooling medium that circulates in channels and voids that are provided along the walls for this purpose.

Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: The invention relates to a cooling arrangement in a frequency converter, the arrangement being configured to convey heat generated at the frequency converter to a space surrounding the frequency converter, comprising a power part (10) of the frequency converter, a control part (20) and cooling means, comprising a cooling motor (31) and a transfer means (32) for producing cooling. In accordance with the invention, a cooling frequency converter is arranged in connection with the frequency converter to control the cooling means. The power part of the cooling frequency converter comprises a rectifier (11) of the frequency converter, an intermediate circuit (12) of the frequency converter as well as a unique power unit (43) of the cooling frequency converter.

Abstract: A power converter may employ a planar transformer to minimize winding conduction loss, and the switching devices of the power converter may be aligned in lines parallel to an edge of the planar transformer to minimize the termination leakage inductance. The windings of the planar transformer may be thermally conductively coupled to one or more heat sinks carried by a circuit board which are with respective ones of the switching devices, to provide a cooling path for the planar transformer.

Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Abstract: An electric-power supply incorporates an electronic card with at least one rectifier and one output line of the rectifier. The output line is formed of at least one first bar made of conductive material, terminating with one first output end, and at least one second bar made of conductive material, terminating with one second output end. The two output ends form the positive and negative output poles of the power supply for connection to a load. Means are provided for electrical and mechanical connection for the first bar and the second bar to the card, and on at least one of the two bars is carried at least one electronic component of said rectifier.

Abstract: The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: The invention concerns a current-rectifying arrangement for rotary electrical machines of the type comprising a support (50, 51, 51?) for a plurality of positive diodes (66), a support for a plurality of negative diodes, forming part of the rear bearing of the machine, and a device for cooling by the creation of a forced axial flow of a cooling fluid through the rectifying arrangement, the support for the positive diodes carrying radial cooling fins (60) on its front face oriented towards the axis of the machine; the positive diode support device (66) being produced in the form of at least one moulded piece (50, 51, 51?), whose face oriented towards the aforementioned axis carries fine cooling fins (60). The invention can be used in alternators for motor vehicles.

Abstract: An electronic converter assembly comprising a first heat sink member having at least a first mounting surface and a length dimension, a plurality of power switching device modules wherein each module includes at least four separate power switching devices, the modules mounted to the first sink mounting surface such that the switching devices are aligned along the length of the sink member, each switching device including inter-converter connection terminals linkable to at least one of a load and a source and intra-converter connection terminals linkable, each intra-converter connection terminal linkable to at least one of a positive and a negative DC bus, first, second and third bus bars, each bus bar linked to the inter-converter connection terminals of at least first and second pairs of the power switching devices where the at least first and second pairs of power switching devices linked to specific ones of the bus bars are from different switching device modules and a linkage assembly including a pluralit

Abstract: A vehicle AC generator having a rectifier unit with cooling plates for the positive-electrode and negative-electrode sides, each having principal planes opposing each other; and a diode package disposed between the cooling plates for the positive-electrode and negative-electrode sides. The diode package has a base for the positive-electrode side formed of a metallic plate and joined to a cathode face of the unidirectionally conducting element for the positive-electrode side; a base for the negative-electrode side formed of a metallic plate and joined to an anode face of the unidirectionally conducting element for the negative-electrode side; and an insulating resin provided so that the unidirectionally conducting elements for the positive-electrode and negative-electrode sides are embedded therein.

Abstract: A modular converter unit and a power converter assembly having at least one modular converter unit are described. The converter unit includes a two-sided cooling device and an intermediate circuit capacitor battery with several capacitors that are arranged one on top of the other in a mounting frame. A power module with a control component and a conductor rail system is arranged on one or more mounting plates. The mounting frame is finished with metal sheets for forming channel. A compact converter unit can thus be produce a series of universal modular converter assemblies at low cost.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An alternator having a plurality of positive and negative diodes, is disclosed. The alternator further includes a plurality of stator windings each of the plurality of stator windings has a first end and a second end, and a first diode plate for fixing one of the plurality of positive and plurality of negative diodes in a first orientation. Further, the alternator includes a second diode plate for fixing the other of the plurality of negative and plurality of positive diodes in a second orientation. Each of the anodes of the positive diodes are connected to each of the cathodes of the negative diodes and to at least one end of each of the plurality of stator windings to form a rectifier bridge circuit.

Abstract: A motor-driven welding gun has a servomotor (34) for displacing a movable electrode tip (30) toward and away from a fixed electrode (32). The servomotor (34) has a motor housing (38) with a copper pipe (72) which is inserted therein when the motor housing (38) is cast. The copper pipe (72) provides a coolant passage (70) in the motor housing (38) for supplying a coolant therethrough. When the coolant passage (70) is supplied with the coolant, the motor housing (38) is forcibly cooled, reducing the amount of heat generated by the servomotor (34).

Abstract: A switching power supply includes a switching circuit, a main transformer, a rectifier circuit, and an output smoothing circuit, which are mounted on a base plate. Voltage transformation of an inputted direct current voltage is performed through collaboration among the above. A pedestal portion is formed on the base plate, and a channel to cool down electronic parts such as a diode is formed inside the pedestal portion. Since the channel is thus formed inside the pedestal portion, the device will not be larger-sized even when the channel is formed. Moreover, at least any of a switching element and a diode is mounted on the pedestal portion, and a choke coil is mounted in a region other than a region where the pedestal portion is formed. Therefore, even with the pedestal portion, it is significantly suppressed for the device to be larger-sized.

Abstract: A power converter includes at least one capacitor and at least two semiconductor power switches. Each capacitor includes a pair of connectors for connecting the capacitor to the at least two semiconductor power switches. Moreover, each capacitor includes at least one other pair of connectors in order to connect the capacitor to at least two semiconductor power switches or a direct current network.

Abstract: A self-regulated system and method for cooling switching power supplies that take parasitic effects of switching which would normally be dissipated as heat in a typical RC snubber circuit, and use that waste energy to power a cooling element to automatically cool semiconductor switches of the power supplies and any DC or AC systems. The cooling element can be a variable speed fan, a liquid pump, a Peltier device, or the like, in which case the system and method provide power to the cooling element in proportion to the amount of current delivered to the power supply, and so the cooling system automatically adjusts itself to the level needed to protect the power supply.

Abstract: In a rectifying device for a vehicular AC generator, a rectifying element is press-fitted in a positive-side radiation plate. The radiation plate is prepared in a predetermined shape and an engaging hole is punched in the radiation plate. Four grooves are formed in an inner periphery of the radiation plate created by the hole. The rectifying element is press-fitted in the hole while an excess produced between the rectifying element and the inner periphery of the radiation plate is released into the grooves.

Abstract: The present invention provides a variable-speed control system which is capable of estimating saturation voltages of respective switching elements in the inverter operation to execute the saturation voltage compensation and thus getting an inverter output voltage indicated by a command value.

Abstract: A refrigerating apparatus comprises: a first substrate, on one surface of which an active converter and an inverter are mounted, and on a reverse surface of which a radiation fin is closely fixed; a second substrate, on which a microcomputer, a current detecting mechanism, and a terminal block are mounted; a resin casing covering sides of the first and second substrates and provided with a step permitting the terminal block to be arranged thereon; and a third substrate, on which an interface connector and a photo-coupler are mounted. The first substrate, the second substrate, and the third substrate are layered in this order on a bottom surface of the casing. Gel is filled up to a power semiconductor surface of the first substrate, and a resin is filled up to an upper surface of the second substrate.

Abstract: An apparatus for sinking heat away from a plurality of power switching devices where each power switching device includes a heat dissipating surface having a dissipating width dimension and having a device length dimension perpendicular to the dissipating width dimension, the apparatus comprising a heat sink member having a sink length dimension between inlet and outlet ends, forming an internal channel that extends substantially along the entire sink length dimension and also forming inlet and outlet ports that open into the channel at the inlet and outlet ends, respectively, the sink including first and second oppositely facing surfaces, the second surface for receiving the heat dissipating surfaces of the power switching devices, the second surface having a receiving width dimension that is substantially perpendicular to the sink length dimension and that is less than twice the device dissipating width dimension.

Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: An industrial power supply module includes a heatsinking structure, e.g., an extruded aluminum structure, comprising a plurality of walls joined to define a channel. first and circuit board assemblies comprising respective booster and DC/DC converter circuits are mounted to the heatsinking structure such that at least portions of the circuit board assemblies lie in the channel. First and second end caps are attached to the heatsinking structure at respective first and second ends of the channel. Environmental seals may be provided at the first and second ends of the channel. The booster circuit may be operative to produce a first DC voltage and the DC/DC converter circuit may be operative to produce a second DC voltage from the first DC voltage such that the second DC voltage is at least about ten times less than the first DC voltage.

Abstract: A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.

Abstract: The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical holding devices. In addition, the capacitor comprises at least one additional mechanical holding device for fastening at least one electronic terminal of the converter and of at least one measuring sensor, especially of a current transformer and/or of a voltage transformer. The inventive capacitor module makes it possible to realize a construction of a converter which is compact and has a reduced weight.

Abstract: A rectifier protection arrangement of a vehicle rotary electric machine is disposed where conductive liquid may be splashed on thereon. The arrangement includes a positive conductor member that is connected to a positive terminal of a battery and has a higher normal electrode potential than hydrogen and an insulation member disposed in contact with a ground potential conductor member to insulate the positive conductor member, a sacrificing metal member that has a lower normal electrode potential than the positive potential conductor member is disposed between the positive conductor member and the insulation member. The sacrificing metal member has a higher electric resistance than the positive potential conductor member if oxidized.

Abstract: A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes. Each diode has a diode electrode. One plate is selectively negative or positive depending on the plurality of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive. The diode mounting holes not receiving diodes therein provide diode electrode clearance and ventilation.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements.

Abstract: The present invention provides a power converter system in which forward conversion capacities and reverse conversion capacities of semiconductor power converter apparatuses connected to a D.C. capacitor can be different from one another. The more suitable semiconductor power converter apparatuses can be selected in accordance with various loads. A power converter system includes semiconductor power converter apparatuses including a D.C. capacitor and power devices cooled by a cooling elements having an output terminal connected to a load. The semiconductor power converter apparatuses are connected in parallel with one another through the D.C. capacitor. Each of the power devices includes self-arc-suppressing semiconductor devices and diodes connected in anti-parallel with the self-arc-suppressing semiconductor devices. All of the semiconductor power converter apparatuses have the same circuit configuration.

Abstract: A radiation container where a noise filter unit is sealed and accommodated with a resinous insulation material having a thermal conductive characteristic nearly equal to that of the radiation container, and a driving unit are directly installed on a radiating fin, whereby heat generated by the noise filter unit is efficiently dissipated on the radiating fin, and a necessary insulation characteristic is obtained.