Abstract: An on-board mounting electronic apparatus including an apparatus body 6, made up of a main board 4 and terminal pins 5 for connection with a circuit board 21. The terminal pins 5 extend from an underside of the main board 4. A heat dissipation plate 8 is arranged on an upper surface of heat generating components 2 mounted on the main board 4. The heat dissipation plate 8 is thermally connected with the surface of the heat generating components 2. Such structure may be applied to an on-board mounting electric power supply as well.

Abstract: The present invention relates to a control circuit for a switching power supply device that is adapted to drive two or more loads and can quickly eliminate a voltage difference occurring between the two or more loads. The control circuit for a switching power supply device has an output terminal that is to be connected to a power supply terminal of a first load by a first wiring and a power supply terminal of a second load by a second wiring. The control circuit comprises a first control loop for stabilizing an output voltage appearing at the output terminal and a second control loop for eliminating a difference between a first voltage appearing at the first wiring in a vicinity of the power supply terminal of the first load and a second voltage appearing at the second wiring in a vicinity of the power supply terminal of the second load.

Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: An industrial power supply module includes a heatsinking structure, e.g., an extruded aluminum structure, comprising a plurality of walls joined to define a channel. first and circuit board assemblies comprising respective booster and DC/DC converter circuits are mounted to the heatsinking structure such that at least portions of the circuit board assemblies lie in the channel. First and second end caps are attached to the heatsinking structure at respective first and second ends of the channel. Environmental seals may be provided at the first and second ends of the channel. The booster circuit may be operative to produce a first DC voltage and the DC/DC converter circuit may be operative to produce a second DC voltage from the first DC voltage such that the second DC voltage is at least about ten times less than the first DC voltage.

Abstract: A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom panel delimit a hollow volume partly filled with a cooling liquid and containing a thermally conductive permeable material providing a thermal bridge between the two walls.

Abstract: A self-regulated system and method for cooling switching power supplies that take parasitic effects of switching which would normally be dissipated as heat in a typical RC snubber circuit, and use that waste energy to power a cooling element to automatically cool semiconductor switches of the power supplies and any DC or AC systems. The cooling element can be a variable speed fan, a liquid pump, a Peltier device, or the like, in which case the system and method provide power to the cooling element in proportion to the amount of current delivered to the power supply, and so the cooling system automatically adjusts itself to the level needed to protect the power supply.

Abstract: A power supply module supplies power to a power bus. The module includes a module casing. Within the module casing is a power supply and a means for cooling the power supply. The power bus supplies power to the means for cooling the module as well as to other devices connected to the power bus. Multiple power supply modules are included in a disk drive array system. Each module provides power to the power bus and to each means for cooling. Upon failure of one of the power supplies, the other of the power supplies will provide power to each device connected to the power bus, including the means for cooling the failed power supply.

Abstract: A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.

Abstract: A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes such that plates are selectively negative or positive depending on the plurality of diodes mounted within the plate. A lead integument formed from an insulator material is mounted on a heat sink plate opposing the other heat sink plate and has embedded conductors and connectors that interconnect diode electrodes and other rectifier components.

Abstract: An industrial power supply module includes a heatsinking structure, e.g., an extruded aluminum structure, comprising a plurality of walls joined to define a channel. First and circuit board assemblies comprising respective booster and DC/DC converter circuits are mounted to the heatsinking structure such that at least portions of the circuit board assemblies lie in the channel. First and second end caps are attached to the heatsinking structure at respective first and second ends of the channel. Environmental seals may be provided at the first and second ends of the channel. The booster circuit may be operative to produce a first DC voltage and the DC/DC converter circuit may be operative to produce a second DC voltage from the first DC voltage such that the second DC voltage is at least about ten times less than the first DC voltage.

Abstract: A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.

Abstract: An oil-cooled inverter for an electric traction motor that uses six IGBT switches to generate 3-phase AC electrical current as its output. The switches are mounted on heat sinks that use hot motor oil (hydraulic fluid) as the heat transfer fluid. An interior of each of the heat sinks contains a heat transfer medium. The heat sink housing is made of molybdenum, which has a thermal expansion rate equal to that of silicon. This allows the circuitry of the inverter to be mounted directly on the top surface of the heat sinks, as the expansion and contraction of the heat sink housing will match that of the silicon substrate of the chips. Since both elements, the heat sink housing and the chip substrate, expand and contract at an equal rate during heating and cooling, the problem of the chip substrate cracking and breaking due to thermal flexing is eliminated.

Abstract: A semiconductor device comprising at least one power device, at least one control element for controlling the power device(s), a plurality of first terminals connected to the power device(s), a plurality of second terminals connected to the control element(s), a support member having a heat sink disposed on a lower surface of the support member and the power device(s), control element(s), and first and second terminals arranged on the upper surface of the support member, and a package including the support member for sealing the devices and one end of the terminals such that first and second terminals protrude from different sides of the package. The arrangement allows a reduced size three-phase motor drive controller, a reduction in noise interference to the control element, and reduction in terminal pitch size.

Abstract: Method and apparatus for utilizing heat-energy produced as a by-product from a DC to DC converter for productive purposes. The method includes providing a DC to DC converter adapted to be installed into an incorporating arrangement, such as a transport vehicle. The DC to DC converter produces heat-energy as a by-product of operation. The DC to DC converter is arranged in thermal communication with a receiving arrangement, such as a windshield assembly, for transferring heat from the DC to DC converter to the receiving arrangement. The receiving arrangement is of a nature that is advantageously affected by heat transferred thereto from the DC to DC converter. The receiving arrangement is utilized as a heat sink for accepting heat-energy produced as a by-product from the DC to DC converter during operation and the heat sink advantageously cools the DC to DC converter during operation.

Abstract: A cooling system and method for cooling a heat sensitive element in an enclosure, such as a CPU, the cooling system including a high power active cooling unit having at least one Thermo Electric Cooler (TEC) component having a cooling liquid circuit passing through a cold side heat sink therein, the cooling liquid circuit being coupled to a heat sink coupled to the heat sensitive element and having a cooling liquid circuit therethrough; a dedicated power supply; and a controller for controlling the TEC components and the cooling liquid pump.

Abstract: In the railway vehicle power conversion device, an air flow passage is formed by providing an L-shaped partition plate whose long side is in the rail direction, in the interior of a box suspended below the floor of the vehicle. On one side of this partition plate, there are included, in order of the rail direction, a high-speed circuit breaker, relay unit, interface unit and control device. On the other side of partition plate, a pair of smoothing reactors are included on the short side of L-shaped partition plate, and a semiconductor cooling unit is included on the other side of the smoothing reactors and partition. A heat-radiating part of this semiconductor unit projects at the side of air inlet port of air flow passage. Electrically driven fans are fixed within an airflow passage at the smoothing reactors.

Abstract: An energy conversion apparatus comprising a heat conductive base, a heat insulating cover operable to mate with the base so as to form a sealed space bounded by the cover and the base to prevent ingress of moisture, and a mount inside the space, for securing an energy conversion circuit to at least one of the cover and the base.

Abstract: The invention provides a bridge assembly for a three-phase motor. The assembly includes a first subassembly having a first terminal plate, a second subassembly having a second terminal plate, a third subassembly having a third terminal plate and a fourth subassembly having a bus terminal plate. Each of the terminal plates is electrically isolated from the other terminal plates, and at least one of the first, second, third and bus terminal plates acts as a heat sink. The assembly further includes first, second, third, fourth, fifth and sixth switching devices interconnected to at least one of the terminal plates. Each switching device has a heat generating surface in thermal communication with one of the first, second, third and bus terminal plates. The assembly further includes a fifth subassembly interconnected with the first, second, third, and fourth subassemblies.

Abstract: A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes. Each diode has a diode electrode. One plate is selectively negative or positive depending on the plurality of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive. The diode mounting holes not receiving diodes therein provide diode electrode clearance and ventilation.

Abstract: A power converter includes a housing, heat generating circuitry in the housing, and a heat conducting metal sheath on the outside of the housing. The housing has an elongated-box shape including two relatively smaller ends and four relatively larger sides and a heat-conducting metal sheath on the outside of the housing. The heat conducting sheath covers substantially all of the four relatively larger sides.

Abstract: The invention relates to a half-bridge module which is arranged in an electrically insulating cooling liquid and in which two semiconductor switches form a half-bridge; the first semiconductor switch is capable of being connected by its source terminal to a high voltage potential, and the second semiconductor switch is capable of being connected by its drain terminal to a low voltage potential; the drain terminal of each first semiconductor switch is connected to the source terminal of the respective second semiconductor switch; whereby respective first semiconductor switches are arranged with their source terminal on a common first metallic conductor rail which is capable of being connected to the high voltage potential; respective second semiconductor switches are arranged with their source terminal on a second metallic conductor rail constituting the output which is arranged alongside the first conductor rail, spaced therefrom; each second semiconductor switch is connected by its drain terminal to a common

Abstract: A heat removal system of the present invention includes a fan (30) of a power supply (20), a heat sink (50) mounted to the fan, and a heat pipe (60) connecting the heat sink to a CPU (24). The heat sink includes a cylindrical base (52) and a plurality of radial fins (54) around the base. Four bolts (40) attach the heat sink and the fan to the power supply. A central bore (58) is defined in the base of the heat sink, for receiving one end of the heat pipe. The other end of the heat pipe is attached to a top surface of the CPU. Heat generated by the CPU is thereby conducted to the heat sink via the heat pipe, and then dissipated outside of a computer enclosure by forced convection of the fan.

Abstract: A compact multiple output power supply which has a circuit architecture with distinct primary and secondary circuit domains. Within the secondary circuit domain, a distribution bus of relatively low constant voltage supplies power inputs to d.c.-to-d.c. converters providing regulated outputs and operating independently of each other. Because of the secondary circuit domain topology, surface mount components are made available in conjunction with relatively simple converter circuitry. Heat management within the compact housing of the power supply is achieved through the utilization of linear driven air flows in combination with employment of heat sinks extending to the heat sink configured cover of the housing. Additionally, the highest heat generation components are positioned rearwardmost within the driven air path.

Abstract: A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and lead from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inside or outside the second seal.

Abstract: A rectifier device for a three-phase dynamo of motor vehicles has a cooling body, with at least one circuit carrier arranged on the cooling body and having a surface with an electrically conductive structure, having at least a first diode which is arranged on the electrically conductive structure of the surface of a circuit carrier and which is designed to rectify a first half wave, and having at least a second diode arranged on the cooling body and designed to rectify a second half wave.

Abstract: A DC to DC converter having a flange attached to the housing. The flange configured to electrically isolate, insulate and shield the DC to DC converter from an underlying circuit board. The flange may be further configured to meet creepage distances and air clearances required by various regulatory and certification agencies.

Abstract: A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.

Abstract: A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.

Abstract: The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

Abstract: A hybrid semiconductor device comprises four identical semiconductor diode chips each having top and bottom surfaces. Each chip is mounted on a respective mounting pad all of which lie in a common plane and, for ease of assembly, the four chips are mounted in identical top to bottom orientation, e.g., bottom surface down and electrically connected to the mounting pads. In one embodiment, the mounting pads for the chips and terminals for the device are integral with leads of a single (“component”) lead frame and various electrical connectors for the chips comprise bonding wires or stamped metal jumpers added to the workpiece after the chips are mounted on the lead frame. The metal jumpers can be provided on a separate “jumper” lead frame used in cooperation with the component lead frame, or the jumpers can comprise portions of leads of the single component lead frame. Printed circuit boards embodiments are also disclosed.

Abstract: A power electronics device for controlling an electric machine including a power section arranged within a housing which can be closed via a cover element. The power section has a plurality of capacitors and a plurality of power semiconductors which are connected to a power bus bar. In addition, a control device is provided for controlling the power electronics device. The capacitors, power semiconductors, and control device are cooled via a cooling device which is formed as a profile having an essentially U-shaped cross section. The cooling device has two lateral limbs and a base region through which cooling ducts are arranged. A suitable cooling medium flows through the cooling ducts and the ends of the cooling ducts opposite the housing cover are closed by a covering element. The capacitors, the power semiconductors and the control device are connected to the cooling device such that thermal exchange occurs between these components and the cooling device.

Abstract: The power drive apparatus comprises a main circuit board including an input terminal block for connection to power-source wires mounted on a major surface of the main circuit board; a power module including a converter unit having diodes and an inverter unit having switching devices and diodes, the power module, mounted on the other major surface of the main circuit board, being for converting and outputting electric power supplied through the input terminal block; a heat-dissipating plate, connected with the power module in contact with a surface of the power module opposite to the main circuit board, for dissipating heat generated by the power module; and a filter module including a filter substrate, provided with a filter circuit and being disposed in the middle of an interconnecting path between the input terminal block and an input section of the converter unit, for suppressing the transmission of noise generated by the switching devices to a power source side, wherein the heat-dissipating plate provides

Abstract: A power rectifier includes a heat dissipation base, a hollow hexagonal gasket soldered to the heat dissipation base around a flat, circular projection of the heat dissipation base, a conducting rod member, a chip unit soldered between the conducting rod member and the flat, circular projection of the heat dissipation base, a resin molded on the chip unit and the heat dissipation base, and a cover shell soldered to the hexagonal gasket and covered over the chip unit and the conducting rod member, the hexagonal gasket having an upright contact flange press-fitted into the bottom open side of the cover shell to protect the chip unit against radiation of fusion upon the process of soldering the cover shell to the hexagonal gasket.

Abstract: A power adapter for a digital information appliance includes an integral thermal cooling assembly for providing supplemental cooling to electronic components within the digital information appliance. The power adapter is comprised of a power supply suitable for conditioning electrical power supplied to the digital information appliance from an external source, a thermal cooling assembly and a coupling assembly capable of operably coupling power adapter to the digital information appliance. The thermal cooling assembly is suitable for providing cooling to the digital information appliance while the power adapter is operably coupled thereto by the coupling assembly.

Abstract: The invention relates to a half-bridge module which is arranged in an electrically insulating cooling liquid and in which two semiconductor switches form a half-bridge; the first semiconductor switch is capable of being connected by its source terminal to a high voltage potential, and the second semiconductor switch is capable of being connected by its drain terminal to a low voltage potential; the drain terminal of each first semiconductor switch is connected to the source terminal of the respective second semiconductor switch; whereby respective first semiconductor switches are arranged with their source terminal on a common first metallic conductor rail which is capable of being connected to the high voltage potential; respective second semiconductor switches are arranged with their source terminal on a second metallic conductor rail constituting the output which is arranged alongside the first conductor rail, spaced therefrom; each second semiconductor switch is connected by its drain terminal to a common

Abstract: A power supply apparatus includes a power supply unit disposed within a casing. The power supply unit includes power semiconductor devices. A fan is provided in the casing for cooling the power semiconductor devices. The power supply unit is operated in a plurality of contiguous cycles each including a running and pausing modes of operation. Each cycle lasting a relatively short time period. The power supply unit operates in the running mode and the pausing mode, respectively in response to the closing and opening of a start switch. In association with the closing and opening of the start switch, a switch for the cooling fan causes the fan to rotate and stop, respectively, which results in minimizing the difference between the highest and lowest temperatures of the power semiconductor devices so that the lifetime of the power semiconductor devices can be prolonged.

Abstract: A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and leads from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inn or outside the second seal.

Abstract: An AC generator for a vehicle includes a rotor, a stator having a three-phase stator winding, a three-phase full-wave rectifier unit, an insulation cover, and a frame for rotatably supporting the rotor. The rectifier unit includes a cooling fin structure having at least three positive diodes and three negative diodes fixed thereto and a terminal member having a wiring member connecting the positive and negative diodes to form the three-phase full-wave rectifier unit and three first partition members. The wiring member has first connecting portions connected to the positive and negative diodes and second connecting portions connected to three output leads of the stator winding. Each of the first partition members extend toward the insulation cover between one of the first connecting portions and the cooling fin structure.

Abstract: A motor driving inverter comprises a first printed circuit board provided with electronic components, a heat conduction plate made of a metal with high heat conductivity and adhered at one surface to the printed circuit board, thereby supporting the printed circuit board, a heat conduction member made of a material with high heat conductivity and connected to the heat conduction plate, thereby supporting the heat conduction plate, and a box made of a metal with high heat conductivity, accommodating the printed circuit board, the heat conduction plate and the heat conduction member, and connected to the heat conduction member, thereby supporting the heat conduction member.

Abstract: A power converter apparatus, including a DC power source, a semiconductor stack, connected to the DC power source in parallel, having a plurality of semiconductor devices and a cooler for refrigerating the semiconductor devices, the semiconductor devices and the cooler are stacked and pressured to each other, and a snubber circuit, connected to the DC power source in parallel, having a serial circuit of a capacitor and a diode, and a resistor connected in parallel to the diode, one terminal of the capacitor is disposed adjacent to the semiconductor stack so that magnetic flux generated by current flowing in the terminal cancels magnetic flux caused by current flowing in the semiconductor stack.

Abstract: An air-cooled power converter with gate turn-off power semiconductors, is described in which the cooling capacity is such that the temperature of the gate turn-off power semiconductor does not exceed a critical temperature limit, the power converter having optimized heat sinks, at least some of which are thermally connected in parallel, and the power converter is designed to operate at a continuous load of 1 to 20 megawatts, preferably of 2 to 10 megawatts.

Abstract: Electric bus arrangement (1) for DC-supply of power components, particularly for an inverter, having a first and a second plate (2, 3), arranged in parallel with each other, separated by an isolating layer (4), by which the first plate (2) connects first connections of power components (13) of a first group with first connections (23) of power components (14) of a second group, and the second plate (3) connects second connections of the power components (13) of the first group with second connections of the power components (14) of the second group. In such a bus arrangement an increase of the switching frequency is desired, however without the risk of damaging components due to overvoltage.

Abstract: An electronic power device including at least one sub-system supporting power modules, a capacitor battery connectable to an electrical power supply and being connected to the power modules. The capacitor battery includes one or more capacitors which when a plurality are provided are disposed in parallel between first and second connection plates. Each sub-system has a first face supporting at least one first power module and a second face for supporting at least one second power module and wherein the first plate is connected to each first power module and the second plate is connected to each second power module.

Abstract: An arrangement for connection between motor controller electronic components and silicon controlled rectifiers (SCR) contained within the controller circuit is presented with line and load straps being arranged on the bottom surface of the motor controller compartment at opposite ends thereof. The SCR's are positioned under the compartment on an elongated heat-sink support plate. Intermediate block connectors interconnect the SCR's with the controller line and load straps.

Abstract: A self-commutated power converter of a voltage-impressing converter having n high-power modules is described. These high-power modules are joined phasewise to a phase heat sink, respectively, in a detachable manner, and joined, one over another, to a partition in such a manner that their cooling fins protrude through openings of this partition into a ventilation space and each run horizontally, an air-discharge duct being arranged in the ventilation space, the air-discharge duct being designed in such a manner that the cooling air of the ventilation space flows laterally, in each case on both sides of the phase heat sinks, between the cooling fins into the air-discharge duct. Thus, a self-commutated power converter of a voltage-impressing converter is obtained whose size, weight and cost are considerably reduced compared to a power converter having a conventional design, and whose high-power modules are each fully utilized in terms of capacity.

Abstract: In order to keep constant an outlet temperature of a refrigerant for cooling a semiconductor power device, continuous and variable control of flow rate of the refrigerant is performed. At the same time, a variable speed fan is continuously and variably controlled in response to a temperature control so that an inlet temperature of the refrigerant is kept constant.

Abstract: A multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, comprising an optional heat sink, a plurality of conducting substrates forming several electrically insulated current conductors, a thermally conductive, electrically insulating first layer, bonding each conducting substrate and the heat sink, and a plurality of electronic or electric components bonded to the substrates.

Abstract: An improved commutator heat dissipating device for alternators, the commutator including a heat dissipating plate, a base plate, a top cover, terminals, and diodes. The heat dissipating plate has a body including a plurality of recesses for receiving the diodes, and a plurality of integrally connected wavy cooling fins on an opposite side thereof. An insulation plate is disposed between a bottom side of the body and the base plate. Securing posts pass through through holes in the heat dissipating plate to secure the heat dissipating plate and the base plate. The terminals include insulating elements and conductive plates. The insulating elements are capable of positioning the terminals by means of limiting blocks and posts of the heat dissipating plate to enable the conductive plates to be soldered with the diodes. The commutator has excellent heat dissipating effects and enhanced structural strength to achieve smooth operation of machine elements.