Abstract: An integrated circuit memory contains a memory cell connected to a bit line that does not float during a portion or all of the read sensing part of the read cycle. The memory cell includes a data storage device. The data storage device may be a ferroelectric capacitor, a linear capacitor, a floating gate transistor, a magnetic device, a resistive device or other type of data storage device capable of placing a charge on the bit line corresponding to a specific data state of the memory cell. The bit line and a reference bit line are connected to a differential amplifier and precharged to specified voltages. Preferably, a self-nulling sense amplifier circuit is connected to the bit lines that compensates for sense amplifier offset by applying additional charges on the bit lines. Alternatively, charge sources may be connected to the bit lines to provide additional charges on the bit lines during the read cycle.

Abstract: Methods and devices for reading a memory cell using a sense amplifier with split capacitors is described. The sense amplifier may include a first capacitor and a second capacitor that may be configured to provide a larger capacitance during certain portions of a read operation and a lower capacitance during other portions of the read operation. In some cases, the first capacitor and the second capacitor are configured to be coupled in parallel between a signal node and a voltage source during a first portion of the read operation to provide a higher capacitance. The first capacitor may be decoupled from the second capacitor during a second portion of the read operation to provide a lower capacitance during the second portion.

Abstract: Methods, systems, and devices for low voltage ferroelectric memory cell sensing are described. As part of an access operation for a memory cell, gates of two cascodes may be biased to compensate for associated threshold voltages. An extracted signal corresponding to a charge stored in the memory cell may be transferred through a first cascode to charge a first capacitor. Similarly, a reference signal developed at a dummy digit line may be transferred through a second cascode to charge a second capacitor. By comparing the reference signal developed at the dummy digit line to the extracted signal from the memory cell, the effect of variations in memory cell performance on the sense window may be reduced. Additionally, based on biasing the gates of the cascodes, the difference between the signals compared at the sense component may be low compared to other sensing schemes.

Abstract: Methods, systems, and devices for ferroelectric memory plate power reduction are described. A plate line may be coupled with a voltage source, a capacitor, and one or more sections of a bank of ferroelectric memory cells. During a write operation, the capacitor may be discharged onto the plate line and the resulting voltage may be adjusted (e.g., increased) by the voltage source before writing one or more memory cells. During a write-back operation, a capacitor associated with one or more memory cells may be discharged onto the plate line and stored at the capacitor. The charge may be re-applied to the plate line and adjusted (e.g., increased) by the voltage source during the write-back.

Abstract: Methods, systems, and devices for imprint recovery for memory cells are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Abstract: Described herein are ferroelectric memory cells and corresponding methods and devices. For example, in some embodiments, a ferroelectric memory cell disclosed herein includes one access transistor and one ferroelectric transistor (1T-1FE-FET cell). The access transistor is coupled to the ferroelectric transistor by sharing its source/drain terminal with that of the ferroelectric transistor and is used for both READ and WRITE access to the ferroelectric transistor.

Abstract: Methods, systems, and devices for activity-based data protection in a memory device are described. In one example, a memory device may include a set memory sections each having memory cells configured to be selectively coupled with access lines of the respective memory section. A method of operating the memory device may include determining a quantity of access operations performed on a set of sections of a memory device, selecting at least one of the sections for a voltage adjustment operation, such as an equalization operation or a dissipation operation, based on the determined quantity of access operations, and performing the voltage adjustment operation on the selected section. Selecting one of the memory sections for a voltage adjustment operation may also be based on a timer. Equalizing a bias may include biasing a plate line, which may be coupled to a ferroelectric capacitor of a memory cell, to a ground voltage or some non-zero voltage.

Abstract: To make high-level copyright protection of transmission audio data possible. Audio data is sequentially transmitted to a reception side via a predetermined transmission channel for each unit audio data. Audio data to be transmitted is encrypted, and encryption information indicating that the audio data has been encrypted is added to the audio data. For example, the encryption information is added using a predetermined bit area of a channel status of each block that is configured every predetermined number of unit audio data pieces.

Abstract: The present disclosure includes apparatuses and methods related to sensing operations in memory. An example apparatus can include an array of memory cells; and a controller coupled to the array configured to sense a first memory cell based upon a first input associated with the memory cell and a second input and a third input associated with a second memory cell.

Abstract: A memory cell includes a ferroelectric memory transistor, and a select gate transistor which shares a common semiconductor channel, a common source region and a common drain region with the ferroelectric memory transistor. The select gate transistor controls access between the common source region and the common semiconductor channel.

Abstract: Methods, systems, and devices for memory cell biasing techniques are described. A memory cell may be accessed during an access phase of an access operation. A pre-charge phase of the access phase may be initiated. The memory cell may be biased to a voltage (e.g., a non-zero voltage) after the pre-charge phase. In some examples, the memory cell may be biased to the voltage when a word line is unbiased and the memory cell is isolated from the digit line.

Abstract: Disclosed is a skewed sense amplifier with data and reference sides. The data side has two or more series connected n-type field effect transistors (NFETs) between a data input/output node and a switch to a ground. The reference side has one or more series connected NFETs (but fewer than on the data side) between a reference input/output node and the switch. The data input/output node controls the NFET(s) on the reference side and vice versa. Due to a faster current flow rate through the reference side NFET(s) as compared to the data side NFETs, this amplifier is particularly suited for detecting when, at the initiation of a sensing process, the reference input/output node has a high voltage state and the data input/output node has either a high voltage state or a discharging voltage state. Also disclosed is a memory circuit that incorporates such amplifiers for single-ended read operations.

Abstract: Methods, systems, and devices for periphery fill and localized capacitance are described. A memory array may be fabricated with certain containers connected to provide capacitance rather than to operate as memory cells. For example, a memory cell having one or two transistors, or other switching components, and one capacitor, such as a ferroelectric or dielectric capacitor, may be electrically isolated from one or more containers sharing a common access line, and the isolated containers may be used as capacitors. The capacitors may be used for filtering in some examples. Or the capacitance may be used to boost or regulate voltage in, for example, support circuitry.

Abstract: A memory array comprises vertically-alternating tiers of insulative material and memory cells. The memory cells individually comprise a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. The individual memory cells comprise a capacitor comprising first and second electrodes having a capacitor insulator there-between. The first electrode electrically couples to the first source/drain region. Wordline structures extend elevationally through the insulative material and the memory cells of the vertically-alternating tiers. Individual of the gates that are in different of the memory cell tiers directly electrically couple to individual of the wordline structures. Sense-lines electrically couple to multiple of the second source/drain regions of individual of the transistors. Other embodiments are disclosed.

Abstract: Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

Abstract: The present disclosure includes apparatuses, methods, and systems for current separation for memory sensing. An embodiment includes applying a sensing voltage to a memory cell having a ferroelectric material, and determining a data state of the memory cell by separating a first current output by the memory cell while the sensing voltage is being applied to the memory cell and a second current output by the memory cell while the sensing voltage is being applied to the memory cell, wherein the first current output by the memory cell corresponds to a first polarization state of the ferroelectric material of the memory cell and the second current output by the memory cell corresponds a second polarization state of the ferroelectric material of the memory cell.

Abstract: In some embodiments, the present disclosure relates to a memory structure. The memory structure has a source region and a drain region disposed within a substrate. A select gate disposed over the substrate between the source region and the drain region. A ferroelectric random access memory (FeRAM) device is disposed over the substrate between the select gate and the source region. The FeRAM device includes a ferroelectric material arranged between the substrate and a conductive electrode.

Abstract: Devices and methods for a sensing scheme are described. A device may include a memory array and a column select line configured to couple with a single page of a set of pages within the memory array when the single page is selected during an access operation. The column select line may be isolated from other pages (e.g., unselected pages) of the set. The device may include a set of sense component groups coupled with the single page. Each sense component group of the set may be configured to access one or more memory cells of the single page using the column select line. The device may include a decoding component configured to couple a sense component group of the set with an I/O line of an I/O channel. The device may communicate information with the I/O line during the access operation.

Abstract: Techniques are provided for sensing a signal associated with a memory cell capable of storing three or more logic states. To sense the memory cell (e.g., a signal associated with the memory cell), a charge may be transferred between a digit line and a node coupled with a plurality of sense components using a charge transfer device. Once the charge is transferred, at least some if not each of the plurality of sense components may sense the charge using one of a variety of sensing schemes. For example, the charge may be sensed by each sense component at a same time using a single fixed reference value, or at different times using different fixed reference values. Based on the charge being transferred or transferred with the node (e.g., using the charge transfer device) and each sense component sensing the charge, a logic state associated with the memory cell may be determined.

Abstract: A complementary magnetic memory cell includes: a heavy metal film or an antiferromagnetic film, a first magnetic tunnel junction, a second magnetic tunnel junction, a first electrode, a second electrode, a third electrode, a fourth electrode, and a fifth electrode; wherein the first magnetic tunnel junction and the second magnetic tunnel junction are fabricated above the heavy metal film or the antiferromagnetic film; the first electrode, the second electrode and the third electrode are fabricated under the heavy metal film or the antiferromagnetic film; the fourth electrode is fabricated above the first magnetic tunnel junction, and the fifth electrode is fabricated above the second magnetic tunnel junction; to store one bit of data, the first magnetic tunnel junction and the second magnetic tunnel junction are arranged in a pair of complementary resistance states, wherein one magnetic tunnel junction is set to a high resistance state and the other remains unchanged.

Abstract: A memory system includes a nonvolatile memory and a memory controller. The memory controller is configured to execute a process to adjust a temperature of the nonvolatile memory upon determining that the temperature is outside a preferred range.

Abstract: A capacitor includes a shallow trench isolation (STI) layer disposed on top of a substrate. The capacitor also includes a first dielectric layer disposed on top of the STI layer. The capacitor further includes a metallization diffusion (MD) layer disposed within both of the STI layer and the first dielectric layer.

Abstract: Some embodiments include apparatuses, and methods of forming and operating the apparatuses. Some of the apparatuses include a conductive line, non-volatile memory cells of a first memory cell type, the non-volatile memory cells coupled in series among each other, and an additional non-volatile memory cell of a second memory cell type coupled to the conductive line and coupled in series with the non-volatile memory cells of the first memory cell type. The second memory cell type is different from the first memory cell type.

Abstract: Apparatuses and methods for accessing a memory cell are described. An example apparatus includes a first voltage circuit coupled to a node and is configured to provide a first voltage to the node and includes a second voltage circuit coupled to a node and is configured to provide a second voltage to the node. A memory cell is coupled to first and second access lines. A decoder circuit is coupled to the node and the first access line, and is configured to selectively couple the first access line to the node. The first voltage circuit is configured to provide the first voltage to the node before the second voltage circuit provides the second voltage to the node, and the second voltage circuit stops providing the second voltage before the node reaches the second voltage.

Abstract: A semiconductor circuit includes first (IV1, IV3) and second (IV2, IV4) circuits, first (31) and second (32) transistors, a first storage element (35), and a driver (22, 23, 52, 53). The first (IV1, IV3) and second (IV2, IV4) circuits, respectively, apply inverted voltages of voltages at first (N1) and second (N2) nodes to the second (N2) and first (N1) nodes. The first transistor (31) is turned on to couple the first (N1) and third nodes. The second transistor (32) includes a gate coupled to the first node (N1), a drain and a source. One of the drain and the source is coupled to the third node, and another is supplied with a first control voltage (SCL1). The first storage element (35) includes a first end coupled to the third node and a second end supplied with a second control voltage (SCTRL). The first storage element (35) is able to take a first or second resistance state.

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. A capacitor coupled with an access line may be precharged and then boosted such that the charge stored in the capacitor is elevated to a higher voltage with respect to a memory cell. The boosted charge in the capacitor may support sensing operations that would otherwise require a relatively higher voltage. Some embodiments may employ charge amplification between an access line and a sense component, which may amplify signals between the memory cell and the sense component, and reduce charge sharing between these components. Some embodiments may employ “sample-and-hold” operations, which may re-use certain components of a sense component to separately generate a signal and a reference, reducing sensitivity to manufacturing and/or operational tolerances. In some embodiments, sensing may be further improved by employing “self-reference” operations that use a memory cell to generate its own reference.

Abstract: Spin Hall Effect (SHE) magneto junction memory cells (e.g., magnetic tunneling junction (MTJ) or spin valve based memory cells) are used to implement high entropy physically unclonable function (PUF) arrays utilizing stochastics interactions of both parameter variations of the SHE-MTJ structures as well as random thermal noises. An apparatus is provided which comprises: an array of PUF devices, wherein an individual device of the array comprises a magnetic junction and an interconnect, wherein the interconnect comprises a spin orbit coupling material; a circuitry to sense values stored in the array, and to provide an output; and a comparator to compare the output with a code.

Abstract: Methods, systems, and devices for biasing techniques, such as open page biasing techniques, are described. A memory cell may be accessed during an access phase of an access operation, for example, an open page access operation. An activate pulse may be applied to the memory cell during the access phase. The memory cell may be biased to a non-zero voltage after applying the activate pulse and before a pre-charge phase. The pre-charge phase of the access phase may be initiated after biasing the memory cell to the non-zero voltage.

Abstract: Methods, systems, and devices for access line disturbance mitigation are described to, for example, reduce voltage disturbances on deselected digit lines during a read or write operation. Memory cells of a memory device may be couplable with a write circuit including a level shifter circuit, such that changes in voltage on a selected digit line may be controlled via a level shifter circuit of a write circuit associated with a selected memory cell. The write circuit may write a logic state to the memory cell after completing a read operation. One or more write voltages may be applied to or removed from the memory cell via the level shifter circuit, which may control a slew rate of one or more voltage changes on the selected digit line. The slew rate(s) may be controlled via a current driver circuit coupled with a pull-up circuit or a pull-down circuit of the level shifter circuit.

Abstract: A hemostatic device includes a band configured to be wrapped around a wrist, and to be secured in a state where the band is wrapped around the wrist, and an inflatable portion that interlocks with the band and that is inflated by injecting gas. The inflatable portion has a first region formed of a thermoplastic material and a second region formed of a thermosetting elastomer whose gas permeability is higher than that of the thermoplastic material. The band has an interlock region which is formed of the thermoplastic material, and with which the inflatable portion interlocks. The first region of the inflatable portion is welded to the interlock region of the band. The compressing force of the inflatable portion can be reduced over time to inhibit vascular occlusion.

Abstract: A technique relates to a semiconductor device. A gate stack is formed on a fin, the gate stack being formed to have a length in a vertical direction. A gate contact is formed adjacent to the gate stack for the length of the gate stack in the vertical direction.

Abstract: Devices, system and methods a circuit, including a resistor, a normal capacitor and a ferroelectric capacitor connected in series. An input terminal to provide an input voltage across the circuit. An output terminal to deliver an output voltage taken across the normal capacitor. The circuit comprises a ferroelectric layer sandwiched between a first buffer layer and a second buffer layer. The first buffer layer contacts a portion of a first metal layer and first metal layer extends beyond the first buffer layer. A dielectric layer sandwiched between a second metal layer and a third metal layer. Such that the second metal layer extends beyond the dielectric layer and in contact with the second buffer layer. Wherein the ferroelectric capacitor is formed by the first metal layer. The ferroelectric layer sandwiched between the first buffer layer and the second buffer layer, and the second metal layer.

Abstract: Disclosed herein is an apparatus that includes a rust buffer circuit, a plurality of first driver circuits configured to drive the first buffer circuit, and a plurality of first switch circuits configured to supply an operation voltage to the first driver circuits, respectively. The first driver circuits are collectively arranged in a first region in a matrix, and the first switch circuits are collectively arranged in a second region different from the first region.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Abstract: A method of storing a number of data values in a plurality of flash memory cells wherein each flash memory cell has a plurality of storage states and each data value is selected from a set of possible data values. The method comprises programming the number of data values to the plurality of flash memory cells using a mapping which uniquely associates each combination of storage states for the plurality of flash memory cells with a concatenated data value from a set of concatenated data values wherein the set of concatenated data values comprises a concatenated data value for every combination of possible data values for the number of data values, the concatenated data value has a position for each data value in the number of data values and the mapping is such that between adjacent storage states all but one data values are identical and each position in the concatenated data value changes the data value it represents between the same storage states on each flash memory cell.

Abstract: A storage device according to the disclosure includes a first transistor and a second transistor each including a first diffusion layer, a second diffusion layer, and a gate, and that are each able to store a threshold state, a first signal line, a second signal line, a first switch transistor that is turned on and couples the first signal line and the first diffusion layer of the first transistor, a second switch transistor that is turned on and couples the second diffusion layer of the first transistor and the first diffusion layer of the second transistor, and a third switch transistor that is turned on and couples the second diffusion layer of the second transistor and the second signal line.

Abstract: A sensing circuit for sensing an analog signal includes a level shifter that shifts the analog signal from a high voltage domain to a low voltage domain. The signal originates from the high voltage domain, and is passed to the low voltage domain through the level shifter. A source line provides the analog signal, which can be selectively switched into a sense amplifier circuit. The sense amplifier is in the low voltage domain and generates a digital output to represent the sensed analog signal.

Abstract: A weight cell and device are herein disclosed. The weight cell includes a first field effect transistor (FET) and a first resistive memory element connected to a drain of the first FET, and a second FET and a second resistive memory element connected to a drain of the second FET. The drain of the first FET is connected to a gate of the second FET and the drain of the second FET is connected to a gate of the first FET.

Abstract: Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells are disclosed. The apparatus includes a first memory cell including first and second ferroelectric capacitors configured to store charges representing complementary logical values, a second memory cell including first and second dielectric capacitors configured to store charges representing complementary logical values, a first bit line selectably coupled to the first ferroelectric capacitor of the first memory cell and to the first dielectric capacitor of the second memory cell, a second bit line selectably coupled to the second ferroelectric capacitor of the first memory cell and to the second dielectric capacitor of the second memory cell, and a sense amplifier coupled to the first and second bit lines.

Abstract: Methods, systems, and devices for protecting stored data in a memory device are described. In one example, a memory device may include a set of memory cells coupled with a digit line and a plate line. A method of operating the memory device may include performing an access operation on a selected memory cell of the set of memory cells, and performing an equalization operation on a non-selected memory cell of the plurality of memory cells based on performing the access operation. The equalization operation may include applying an equal voltage to opposite terminals of the non-selected memory cell via the digit line and the plate line, which may allow built-up charge, such as leakage charge resulting from the access operation, to dissipate. Such an equalization operation may reduce a likelihood of memory loss in non-selected memory cells after access operations.

Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a cell array including a plurality of resistive storage cells; a current code generation block suitable for generating a current code which has a value corresponding to an average value of current amounts of test currents respectively flowing through at least two first resistive storage cells among the plurality of resistive storage cells, in a test operation; and a sensing block suitable for comparing a read current flowing through a second resistive storage cell selected among the plurality of resistive storage cells with a reference current, and thereby sensing data of the second resistive storage cell, wherein the semiconductor memory is operable to adjust a current amount of at least one current flowing through the sensing block based on the value of the current code.

Abstract: Methods, systems, and apparatuses for full bias sensing in a memory array are described. Various embodiments of an access operation of a cell in a array may be timed to allow residual charge of a middle electrode between the cell and a selection component to discharge. Access operations may also be timed to allow residual charge of middle electrodes associated with other cells to be discharged. In conjunction with an access operation for a target cell, a residual charge of a middle electrode of another cell may be discharged, and the target cell may then be accessed. A capacitor in electronic communication with a cell may be charged and a logic state of the cell determined based on the charge of the capacitor. The timing for charging the capacitor may be related to the time for discharging a middle electrode of the cell or another cell.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. An electronic memory device may include a plurality of plate portions separated by a plurality of segmentation lines, which may be oriented in a plane parallel to rows of a memory array or columns of the memory array, or both. The segmented plate may be employed instead of a single plate for the array. The one or more plate portions may be energized during access operations of a ferroelectric cell in order to create a voltage different across the cell or to facilitate changing the charge of the cell. Each of the plate portions may include one or more memory cells. The memory cells on a plate portion may be read from or written to after the plate portion is activated by a plate driver.

Abstract: Some embodiments include an integrated assembly. The integrated assembly has a first transistor with a horizontally-extending channel region between a first source/drain region and a second source/drain region; has a second transistor with a vertically-extending channel region between a third source/drain region and a fourth source/drain region; and has a capacitor between the first and second transistors. The capacitor has a first electrode, a second electrode, and an insulative material between the first and second electrodes. The first electrode is electrically connected with the first source/drain region, and the second electrode is electrically connected with the third source/drain region. A digit line is electrically connected with the second source/drain region. A conductive structure is electrically connected with the fourth source/drain region.

Abstract: An example memory circuit for reading and/or writing FRAM memory includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: A semiconductor device is provided with normal memory cells constituted so as to store user data, reference memory cells constituted so as to generate a reference signal for reading out the normal memory cells, and a control circuit that carries out a defect detecting operation for detecting whether or not the reference memory cell and data stored in the reference memory cell are coincident with expected values on the stored data read out from the reference memory cells. Moreover, it is also provided with a control circuit for executing a defect correcting operation for correcting data to be stored in the reference memory cells that are detected as defective. Furthermore, it is also provided with a control circuit that is configured so as to cut off the reference memory cell detected as defective from the sense amplifier.

Abstract: The present disclosure provides an improved enhancement mode field effect transistor (FET) having an oxide (AlxTi1-xO) emulating p-type gate. The present disclosure provides a novel enhancement mode High Electron Mobility Transistor (HEMT) structure with AlxTi1-xO Gate Oxide Engineering as Replacement of p-GaN Gate. In an aspect, the present disclosure provides a hybrid gate stack that combines p-GaN technology with the proposed oxide for e-mode operation. The HEMT structure with AlxTi1-xO Gate oxide provides a threshold voltage tuning from negative to positive by changing p-doping composition. Using a developed p-type oxide, e-mode device shows ON current ˜400 mA/mm, sub-threshold slope of 73 mV/dec, Ron=8.9 ?mm, interface trap density <1010 mm?2eV?1 and gate leakage below 200 nA/mm at the OFF-state breakdown.

Abstract: A static random access memory device includes a write circuit, a read port circuit, and a substrate. The write port circuit includes a first inverter, a second inverter cross-coupled with the first inverter, a first pass-gate transistor coupled to the first inverter, and a second pass-gate transistor coupled to the second inverter. The read port circuit includes a read pull-down transistor and a read pass-gate transistor that are coupled in series to each other. The substrate includes a standard threshold voltage (STV) region and a low threshold voltage (LVT) region abutting the STV region. The write port circuit is formed within the STV region, and the read port circuit is formed within the LVT region. The LVT region has a first boundary at an edge of a gate of the first pass-gate transistor, or approaching the edge of the gate of the first pass-gate transistor.

Abstract: A magnetoresistance element assembly has two stacks of material layers with respective reference layers and respective bias layers that have relative magnetic directions that are not perpendicular to each other. Bias layers in the two stacks have bias magnetic directions that oppose each other. Linear range is increased.

Abstract: Integrated circuits with memory interface circuitry may be provided. Prior to calibration, a number of samples may be determined by computing probability density function curves as a function of timing window edge asymmetry for different degrees of oversampling. During calibration, duty cycle distortion in data strobe signals may be corrected by selectively delaying the data strobe rising or falling edges. A data clock signal that is used for generating data signals may also suffer from duty cycle distortion. The rising and falling edges of the data clock signal may be selectively delayed to correct for duty cycle distortion. The data path through which the data signals are routed may be adjusted to equalize rising and falling transitions to minimize data path duty cycle distortion. Multi-rank calibration may be performed by calibrating to an intersection of successful settings that allow each memory rank to pass memory operation tests.