Abstract: A semiconductor package includes a package substrate, a lower chip, an interposer, and an upper chip which are stacked on the package substrate, and bonding wires electrically connecting the lower chip to the package substrate. The lower chip includes first and second lower chip pads spaced apart from each other on an upper surface of the lower chip, wire bonding pads bonded to the bonding wires on the upper surface of the lower chip, and lower chip redistribution lines electrically connecting the second lower chip pad to the wire bonding pad. The interposer includes an upper chip connection pad on an upper surface of the interposer, a lower chip connection pad on a lower surface of the interposer, and a through via electrode electrically connecting the upper chip connection pad to the lower chip connection pad.

Abstract: A method includes writing received data sequentially to a particular location of a cyclic buffer of a memory device according to a first set of threshold voltage distributions. The method further includes performing a touch up operation on the particular location by adjusting the first set of threshold voltage distributions of the data to a second set of threshold voltage distributions in response to a determination that a trigger event has occurred. The second set of threshold voltage distributions can have a larger read window between adjacent threshold voltage distributions of the second set than that of the first set of threshold voltage distributions.

Abstract: The present technology includes a memory device and a method of operating the memory device. The memory device includes a control logic circuit configured to control the peripheral circuit so that the program operation is performed. The control logic circuit controls a peripheral circuit so that memory cells to be programmed to first to (N?1)-th program states are programmed in a double program method using a main verify voltage and a sub verify voltage less than the main verify voltage during a verify operation and memory cells to be programmed to the N-th program state are programmed in a normal program method using the main verify voltage during the verify operation, when the verify operation of the memory cells corresponding to the (N?1)-th program state has failed.

Abstract: A data storage includes a memory array including a plurality of memory cells, and peripheral circuitry disposed underneath the memory array. The peripheral circuitry includes an M-tier sense amplifier (SA) circuit including X stacks of SA latches, wherein each SA latch is respectively coupled to a bit line of a memory cell of the plurality of memory cells; and an N-tier memory cache data (XDL) circuit including Y stacks of XDL latches, wherein M is less than N, and X is greater than Y. The peripheral circuitry further includes data path circuitry coupling (i) each SA latch of the X stacks of SA latches to (ii) a respective XDL latch of the Y stacks of XDL latches.

Abstract: A data storage device includes a memory device and a controller coupled to the memory device. The controller is configured to receive read requests from a host device. When a read request is received corresponding to one or more pages from a first plane and one or more pages from a second plane, the controller is configured to determine a decode time for the pages of the first plane and the pages of the second plane. Based on the decode times for pages of the first plane and pages of the second page, pages of the first plane that have a similar decode time to pages of the second plane are read in parallel.

Abstract: Provided herein may be a memory device capable of completing program operations for multiple pages in one ready/busy period. The memory device may include a plurality of memory cells configured to form a plurality of pages, a peripheral circuit configured to perform a first program operation and a second program operation and control logic configured to control the peripheral circuit to receive least significant bit (LSB) page data of a page adjacent to a selected page, center significant bit (CSB) page data, and most significant bit (MSB) page data of the selected page from a memory controller, and program the LSB page data of the page adjacent to the page adjacent to the selected page and to obtain LSB page data from the selected page, previously stored in the selected page, and program the LSB page data, the CSB page data and the MSB page data of the selected page to the selected page.

Abstract: According to one embodiment, there is provided a non-volatile semiconductor storage device including a non-volatile memory, a monitoring section, a determining section, and a notification processing section. The non-volatile memory includes a plurality of memory cells driven by word lines and a voltage generating section that generates a read voltage to be applied to the word lines. The monitoring section monitors a change in a threshold distribution of the plurality of memory cells upon performing a read processing to read data from the plurality of memory cells by applying the read voltage to the word lines. The determining section determines a degree of deterioration of the non-volatile memory in accordance with a monitoring result by the monitoring section. The notification processing section notifies a life of the non-volatile memory in accordance with a determining result by the determining section.

Abstract: A pixel includes a photo-diode, an integration capacitor arranged to receive a photo current from the photo-diode and to store charge developed from the photo current; and an injection transistor disposed between the photo-diode and the integration capacitor that controls flow of the photo current from the photo-diode to the integration capacitor, the injection transistor having a gate, a source electrically coupled to the photo-diode at a first node, and a drain electrically coupled to the integration capacitor. The injection transistor is a silicon-oxide-nitride-oxide-silicon (SONOS) FET having its gate set to a SONOS gate voltage to control a detector bias voltage of the photo-diode at the first node.

Abstract: A memory device having an improved operation speed may include a memory block including memory cells, a peripheral circuit configured to perform a program operation of increasing each of threshold voltages of the memory cells, and a control logic configured to control the peripheral circuit to perform the program operation. The program operation may include a plurality of program loops, each of the plurality of program loops may include a program voltage apply operation and a verify operation, and the control logic may control the peripheral circuit to perform verification on a highest program state during a verify operation included in a next program loop of any one program loop, when verification of a next higher program state among the plurality of program states is passed during a verify operation included in the any one program loop among the plurality of program loops.

Abstract: A nonvolatile memory device includes multi-level cells in a memory cell array including a plurality of memory blocks, and each of the memory blocks includes a plurality of pages. A method of operating the nonvolatile memory device includes pre-programming multi-bit data in a pre-program block of the memory blocks, dividing the multi-level cells into a plurality of state groups based on state codes indicating states of the multi-level cells to generate digest data indicating state group codes corresponding to the state groups, and programming the digest data in a digest block of the memory blocks.

Abstract: Methods, systems, and devices for overwriting at a memory system are described. A memory system may be configured to overwrite portions of a memory array with new data, which may be associated with omitting an erase operation. For example, write operations may be performed in accordance with a first demarcation configuration to store information at a portion of a memory array. A portion of a memory system may then determine to overwrite the portion of the memory array with different or updated information, which may include performing write operations in accordance with a second demarcation configuration. The second demarcation configuration may be associated with different cell characteristics for a one or more logic states, such as different distributions of stored charge or other cell property, different demarcation characteristics, different write operations, among other differences, which may support performing an overwrite operation without first performing an erase operation.

Abstract: A memory device includes bit lines coupled to a memory block, a page buffer group selecting the bit lines in response to page buffer signals, applying a precharge voltage to selected bit lines from among the bit lines, and applying a ground voltage to unselected bit lines during a program verify operation, and a page buffer controller outputting the page buffer signals to selectively apply the precharge voltage to the bit lines according to an order of read operations on a logical page during the program verify operation.

Abstract: Methods and apparatuses with counter-based reading are described. A memory cells of a codeword are accessed and respective voltages are generated. A reference voltage is generated and a logic state of each memory cell is determined based on the reference voltage and the respective generated cell voltage. The reference voltage is modified until a count of memory cells determined to be in a predefined logic state with respect to the last modified reference voltage value meets a criterium. In some embodiments the criterium may be an exact match between the memory cells count and an expected number of memory cells in the predefined logic state. In other embodiments, an error correction (ECC) algorithm may be applied while the difference between the count of cells in the predefined logic state and the expected number of cells in that state does not exceed a detection or correction power of the ECC.

Abstract: Technologies for addressing individual bits in memory include a device having a memory that includes partitions that each have tiles, in which each tile stores an individual bit. The device also includes circuitry to receive a request to access (e.g., read or write) a sequence of bits in a partition. The request specifies a logical row or column address. A corresponding tile is determined from the logical row or column address and for each bit in the sequence. The corresponding tile is accessed to read or write the bit therein.

Abstract: A controller including a non-volatile memory interface circuit connected to at least one non-volatile memory device and configured to control the at least one non-volatile memory device; an error correction circuit configured to perform an error correction operation on a codeword received from the non-volatile memory interface circuit according to an error correction decoding level from among a plurality of error correction decoding levels, wherein the non-volatile memory interface circuit is further configured to: receive side information from the at least one non-volatile memory device; predict a distribution of memory cells based on the side information; and select the error correction decoding level from among the plurality of error correction decoding levels according to the predicted distribution.

Abstract: Storage devices include a memory array comprised of a plurality of memory devices arranged in word lines. The word lines are further arranged within memory blocks. When erasing memory blocks, various storage devices may utilize a stripe-erase process that alternates the erasure of word lines within the memory blocks. The stripe-erase process is often carried out in multiple steps. However, an ungraceful shutdown can interrupt the erasing processing between one of these stripe-erase steps. The status of each memory device associated with the aborted erasure needs to be known before operations can continue. Methods and systems described herein properly classify and process memory blocks after an aborted erase command by analyzing both even and odd word lines within each of the memory blocks. By properly categorizing each memory block, overprogramming and other negative effects can be avoided, increasing the overall lifespan of the storage device that utilizes a stripe-erase process.

Abstract: Apparatuses and techniques are described for detecting and compensating for a set of memory cells having a slow program speed, based on a comparison between the number of program loops used to complete programming for different data states. A program loop (PL) number is stored when programming is completed for memory cells of each assigned data state. The PL number of an nth state is then compared to the PL number of another state such as the n?1st state. If the difference between the PL numbers exceeds a threshold, the set of memory cells is considered to be slow programming and a compensation is triggered. The compensation can involve increasing the program pulse width in each remaining program pulse of the program operation. In another approach, the compensation can be triggered and subsequently deactivated in the program operation.

Abstract: The disclosure relates to an operating method of controller, and memory system having the same, the method controls a semiconductor memory device including a plurality of memory blocks. The method includes: receiving read data output according to a first read operation performed on a selected memory block; selecting a read voltage set group from a read retry table based on a read error related indicator providing an indication that an error correction failure has occurred; and selecting a read voltage set from the selected read voltage set group based on whether the read error related indicator is greater than or equal to a predetermined reference value. The selected read voltage set has a minimum average distance with respect to a read voltage set used for the first read operation, and has a minimum first read voltage distance with respect to the read voltage set used for the first read operation.

Abstract: In general, according to an embodiment, a memory system includes a memory device including a memory cell; and a controller. The controller is configured to: receive first data from the memory cell in a first data reading; receive second data from the memory cell in a second data reading that is different from the first data reading; convert a first value that is based on the first data and the second data, to a second value in accordance with a first relationship; and convert the first value to a third value in accordance with a second relationship that is different from the first relationship.

Abstract: A method of operating a semiconductor device includes applying a first voltage to a first source select line coupled to first source select transistors of memory strings included in an unselected memory block, among memory blocks, floating the first source select line after the first voltage is applied thereto, applying a second voltage having a lower voltage level than the first voltage to a second source select line coupled to second source select transistors of the memory strings included in the unselected memory block, applying a precharge voltage to a common source line, and applying a program voltage to a word line coupled to selected memory cells of memory strings included in a selected memory block, among the memory blocks.

Abstract: A write method for a resistive memory including a storage array, a control circuit and an access circuit is provided. The control circuit receives an external command to activate the access circuit to access the storage array. The write method includes determining whether the external command is ready to perform a write operation for the storage array; generating a first operation voltage group to the access circuit when the external command does not perform the write operation for the storage array; reading a count value of a block that corresponds to a write address when the external command performs the write operation for the storage array, wherein the count value indicates the number of times that the block corresponding to the write address performs the write operation; and generating a second operation voltage group to the access circuit according to the count value of the block.

Abstract: Electronic systems might include a plurality of groups of memory cells and a controller for access of the plurality of groups of memory cells that is configured to cause the electronic system to determine whether a reliability of a particular group of memory cells having a particular reliability rank allocated for storing data of a particular data level at a particular memory density is less than a target reliability, and, if so, determine whether the reliability of the particular group of memory cells at a reduced memory density is less than the target reliability, and, in response to determining that the reliability of the particular group of memory cells at the reduced density is less than the target reliability, allocate the particular group of memory cells for storing data of a lower data level and allocate a different group of memory cells for storing data of the particular data level.

Abstract: There are provided a semiconductor memory device and a method for operating the same. The semiconductor memory device includes: a memory cell array with a plurality of memory cells programmed to a plurality of program states; a peripheral circuit configured for performing a program operation on selected memory cells among the plurality of memory cells through a plurality of program loops; a current sensing circuit for determining a verify result of each of the plurality of program states by performing an individual state current sensing operation on the selected memory cells among the memory cells; and a control logic for controlling the current sensing circuit to perform the individual state current sensing operation, based on a number of program loops, among a plurality of program loops, that are performed.

Abstract: Methods and apparatus are disclosed for managing the storage of static and dynamic neural network data within a non-volatile memory (NVM) die for use with deep neural networks (DNN). Some aspects relate to separate trim sets for separately configuring a static data NVM array for static input data and a dynamic data NVM array for dynamic synaptic weight data. For example, the static data NVM array may be configured via one trim set for data retention, whereas the dynamic data NVM array may be configured via another trim set for write performance. The trim sets may specify different configurations for error correction coding, write verification, and read threshold calibration, as well as different read/write voltage thresholds. In some examples, neural network regularization is provided within a DNN by setting trim parameters to encourage bit flips to avoid overfitting. Some examples relate to managing non-DNN data, such as stochastic gradient data.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a memory cell array including a plurality of memory cells, a peripheral circuit configured to program the plurality of memory cells to a plurality of program states, and a control logic configured to control the peripheral circuit so that program operations corresponding to the plurality of program states are performed, wherein the control logic controls the peripheral circuit so that, during a program operation for a target program state, among the plurality of program states, memory cells to be programmed to an immediately higher program state than the target program state are programmed to the target program state.

Abstract: A memory device includes a memory array of memory cells and control logic, operatively coupled with the memory array. The control logic is to perform operations, which include causing the memory cells to be programmed with an initial voltage distribution representing multiple logical states; causing the memory cells to be programmed with a subsequent voltage distribution representing a subset of the multiple logical states at a higher voltage than that of the initial voltage distribution, wherein the subset of the multiple logical states is compacted above a program verify voltage level for the subsequent voltage distribution; and causing a first program verify operation of the subsequent voltage distribution to be performed on the memory cells to verify one or more voltage levels of the subsequent voltage distribution.

Abstract: According to one embodiment, a memory system includes a nonvolatile semiconductor memory device, a voltage generation unit and a control unit. The nonvolatile semiconductor memory device includes a memory cell array having a plurality of blocks each including a plurality of memory cells, and a voltage generation unit configured to change a read level of the memory cell. The control unit controls write, read, and erase of the nonvolatile semiconductor memory device. The control unit changes the read level between a start of use of the nonvolatile semiconductor memory device and a timing after an elapse of a time.

Abstract: Aspects of a storage device including a controller are provided which identifies a bad, open block that causes subsequent erase operations to fail in closed blocks due to charge leakage following a previous program operation in the open block. Each time the controller programs an open block, the controller attempts to erase a plurality of closed blocks following each programming of the open block. When the closed blocks fail to erase, the controller determines whether a number of consecutive erase failures after programming the open block meets a threshold, after which the controller re-attempts to erase the closed blocks. After a successful re-attempt, the controller stores a list of open blocks in memory. In response to repeating these steps a number or plurality of times, the controller stores multiple lists of open blocks in memory, and identifies the single common open block between the multiple lists as a bad block.

Abstract: Various examples described herein are directed to systems and methods for generating data values using a NAND flash array. A memory controller may read a number of memory cells at the NAND flash array using an initial read level to generate a first raw string. The memory controller may determine that a difference between a number of bits from the first raw string having a value of logical zero and a number of bits from the first raw string having a value of logical one is greater than a threshold value and read the number of memory cells using a second read level to generate a second raw string. The memory controller may determine that a difference between a number of bits from the second raw string having a value of logical zero and a number of bits from the second raw string having a value of logical one is not greater than a threshold value and applying a cryptographic function using the second raw string to generate a first PUF value.

Abstract: Provided herein may be a memory system and a method of operating the memory system. The memory system may include a memory device including a plurality of memory blocks, and a memory controller configured to: manage an accumulated erase count value and an open block erase count value of each of the plurality of memory blocks, and select a target memory block on which a program operation is to be performed based on the accumulated erase count value and the open block erase count value of each of the plurality of memory blocks.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells and a plurality of select transistors; a peripheral circuit for performing a program operation on selected select transistors among the plurality of select transistors in a select transistor program operation; and a control logic for controlling the peripheral circuit to perform the select transistor program operation. The peripheral circuit applies a coupling voltage having a positive potential to a source line of the memory block in the select transistor program operation.

Abstract: Provided is a memory device. The memory device may include a voltage code controller configured to generate a voltage code that generates a program voltage and pass voltages based on a number of times a program loop is performed, and a voltage generator configured to generate the program voltage and the pass voltages in response to the voltage code, transmit the program voltage to a selected word line, and transmit the pass voltages to unselected word lines, wherein the voltage generator is configured to sequentially increase the pass voltage that is applied to the unselected word lines in order of proximity to the selected word line as the number of times a program loop is performed increases.

Abstract: Disclosed herein are related to a memory system and a method of operating the memory system. In one aspect, resistances of a first memory cell, a second memory cell, a third memory cell, and a fourth memory cell are individually set. In one aspect, the first memory cell and the second memory cell are coupled to each other in series between a first line and a second line, and the third memory cell and the fourth memory cell are coupled to each other in series between the second line and a third line. In one aspect, current through the second line according to a parallel resistance of i) a first series resistance of the first memory cell and the second memory cell, and ii) a second series resistance of the third memory cell and the fourth memory cell is sensed. According to the sensed current, multi-level data can be read.

Abstract: Embodiments of the present disclosure describe multi-threshold voltage devices and associated techniques and configurations. In one embodiment, an apparatus includes a semiconductor substrate, a channel body disposed on the semiconductor substrate, a first gate electrode having a first thickness coupled with the channel body and a second gate electrode having a second thickness coupled with the channel body, wherein the first thickness is greater than the second thickness. Other embodiments may be described and/or claimed.

Abstract: A storage system and method for a hybrid quad-level cell (QLC) write scheme for reduced random access memory (RAM) footprint and better performance are provided. In one example, a storage system includes a volatile memory and a non-volatile memory. A Foggy program operation is performed in a QLC memory in the non-volatile memory by writing two pages of data into the QLC memory. Then, a Fine program operation is performed in the QLC memory by reading the two pages of data written to the QLC memory in the Foggy program operation, reading two other pages of data from the volatile memory, and writing the two pages of data read from the QLC memory and the two other pages of data read from the volatile memory in the QLC memory.

Abstract: In a compute-in-memory (“CIM”) system, current signals, indicative of the result of a multiply-and-accumulate operation, from a CIM memory circuit are computed by comparing them with reference currents, which are generated by a current digital-to-analog converter (“DAC”) circuit. The memory circuit can include non-volatile memory (“NVM”) elements, which can be multi-level or two-level NVM elements. The characteristic sizes of the memory elements can be binary weighted to correspond to the respective place values in a multi-bit weight and/or a multi-bit input signal. Alternatively, NVM elements of equal size can be used to drive transistors of binary weighted sizes. The current comparison operation can be carried out at higher speeds than voltage computation. In some embodiments, simple clock-gated switches are used to produce even currents in the current summing branches. The clock-gated switches also serve to limit the time the cell currents are on, thereby reducing static power consumption.

Abstract: According to one embodiment, a memory device, includes a first memory cell, and a second memory cell adjacent to the first memory cell; and a sequencer configured to, when data is read from the first memory cell: perform a first read operation on the second memory cell; perform a second read operation on the first memory cell; perform a third read operation on the first memory cell by applying a voltage different from that applied in the second read operation to a gate of the second memory cell; and generate first data stored in the first memory cell and second data for correcting the first data, based on results of the first to third read operations.

Abstract: A semiconductor storage device includes a plurality of gate electrodes, a semiconductor layer facing the plurality of gate electrodes, a gate insulating layer arranged between each of the plurality of gate electrodes and the semiconductor layer. The gate insulating layer contains oxygen (O) and hafnium (Hf) and has an orthorhombic crystal structure. A plurality of first wirings is connected to the respective gate electrodes. A controller is configured to execute a write sequence and an erasing sequence by applying certain voltages to at least one of the first wirings. The controller is further configured to increase either a program voltage to be applied to the first wirings in the write sequence or an application time of the program voltage in the write sequence after a total number of executions of the write sequence or the erasing sequence has reached a particular number.

Abstract: A semiconductor storage device includes a first plane storing user data and system information, a second plane storing the user data and the system information, a first latch circuit storing even-numbered bit data of the system information read from the first plane, a second latch circuit storing odd-numbered bit data of the system information read from the second plane, and a sequencer. The sequencer executes in parallel a first process of reading out the even-numbered bit data of the system information from the first plane and storing the read data in the first latch circuit and a second process of reading out the odd-numbered bit data of the system information from the second plane and storing the read data in the second latch circuit.

Abstract: A memory system includes a nonvolatile memory device and a controller configured to control the nonvolatile memory device. The nonvolatile memory device includes a first data storage region in which a memory cell stores one-bit data in a first mode and a second data storage region in which a memory cell stores two-bit or more data in a second mode. The controller controls the nonvolatile memory device to perform a read operation on the first data storage region and the second data storage region in the second mode. The controller decodes first data read from the first data storage region, and decodes second data read from the second data storage region. The controller controls the nonvolatile memory device to perform the read operation on the first data storage region in the second mode.

Abstract: A framed collectible for displaying a continuously-looping playback of a digital video file is provided, wherein a display panel is controlled by a display controller to play at least one video file in a continuous loop on the display panel only while an output signal from a magnet sensor indicates no proximity to a magnet proximal to the back side of the display panel. The display controller has a printed circuit board that incorporates at least one processor and at least one memory that contains at least one video file. The memory, which in an embodiment can be flash memory, is factory programmed and therefore the memory content cannot be changed by an end user. Packaging for storage and shipping of the framed collectible is also provided, which incorporates a magnet that is sensed by the magnet sensor to keep continuously-looping video playback switched off while the device is stored.

Abstract: An example apparatus for garbage collection can include a memory including a plurality of mixed mode blocks. The example apparatus can include a controller. The controller can be configured to write a first portion of sequential host data to the plurality of mixed mode blocks of the memory in a single level cell (SLC) mode. The controller can be configured to write a second portion of sequential host data to the plurality of mixed mode blocks in an XLC mode. The controller can be configured to write the second portion of sequential host data by performing a garbage collection operation. The garbage collection operation can include adding more blocks to a free block pool than a quantity of blocks that are written to in association with writing the second portion of sequential host data to the plurality of mixed mode blocks.

Abstract: A semiconductor memory device includes a bit line, a first memory cell electrically connected to the bit line, and a sense amplifier connected to the bit lin. The sense amplifier includes a first capacitor element having an electrode that is connected to a first node electrically connectable to the bit line, a first transistor having a gate connected to the first node and a first end connectable to a second node, a second transistor having a first end connected to the second node and a second end connected to a third node, a second capacitor element having an electrode connected to the third node, and a latch circuit connected to the second node.

Abstract: A processing device determines a measured slope value of a portion of a programming voltage distribution of memory cells of a memory sub-system. The measured slope value of the portion of the programming voltage distribution is compared to a threshold slope value to generate a comparison result. An adjusted program voltage level is determined in view of the comparison result. A programming process is executed using the adjusted program voltage level as a starting voltage level.

Abstract: A semiconductor memory device includes a plurality of memory cells, a word line connected to gates of the memory cells, a bit line electrically connected to one ends of the memory cells through a plurality of select gate transistors, respectively, the select gate transistors including two outer select gate transistors and one or more inner select gate transistors between the two outer select gate transistors, two outer select gate lines connected to gates of the two outer select gate transistors, respectively, one or more inner select gate lines connected to gates of the one or more inner select gate transistors, respectively, and a voltage generation circuit configured to independently control supply of voltages to the outer select gate lines and the inner select gate lines during an operation to read data stored in the memory cells.

Abstract: A data storage device having a reduced overhead according to an embodiment of the disclosed technology may include a plurality of memory chips each including a plurality of planes, and a memory controller configured to perform recovery algorithms that recover data corresponding to failed read operations among read operations performed on the plurality of memory chips, and the memory controller may generate a read voltage to be used in a first recovery algorithm using an address related to a selected read operation among the failed read operations and perform the first recovery algorithm on a memory location associated with the failed read operations using the read voltage.

Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.

Abstract: A memory device includes a memory cell array including M memory cells connected to one bit line and configured to distributively store N-bit data, where N is a natural number of 2 or more and M is a natural number of 2 or more and less than or equal to N, the M memory cells including a first memory cell and a second memory cell having different sensing margins, and a memory controller including a page buffer, the memory controller configured to distributively store the N-bit data in the M memory cells and to sequentially read data stored in the M memory cells to obtain the N-bit data, and an operation logic configured to execute an operation using the N-bit data, the memory controller configured to provide different reading voltages to the first memory cell and the second memory cell.

Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.

Abstract: According to an embodiment, a semiconductor memory, on receiving a first command, applies a voltage within a first range and a voltage within a second range to a word line and reads a first bit from a memory cell, and, on receiving a second command, applies a voltage within a third range to the word line and reads a second bit from the memory cell. The controller issues the first command a plurality of times and changes the voltages to be applied to the word line within the first range and the second range in accordance with the plurality of first commands, specifies a first and second voltage within the first and the second range, respectively, and estimates a third voltage within the third range. The voltage applied to read the second bit is the estimated third voltage.