Abstract: Methods, systems, and apparatus for management of operations in a memory system are described. An example system includes a memory device and a memory controller. The memory device includes a first buffer, a second buffer, and a third buffer including a plurality of data buffers. The memory device receives a first portion of first data of a first request from the memory controller, and stores the first portion of the first data in the first buffer or a first data buffer of the third buffer. The memory controller sends a second request to the memory device. The memory device, in response to the second request, moves the first portion of the first data from the first buffer or the first data buffer to the second buffer. The memory device performs an operation in response to the second request without using the second buffer.

Abstract: Implementations described herein relate to a memory device with a fast write mode to mitigate power loss. In some implementations, the memory device may detect a condition associated with power supplied to the memory device. The memory device may detect one or more pending write operations to be performed to cause data to be written to memory cells of the memory device. The memory device may switch from a first voltage pattern, previously used by the memory device to write data to one or more memory cells of the memory device, to a second voltage pattern based on detecting the condition and based on detecting the one or more pending write operations. The memory device may perform at least one write operation, of the one or more pending write operations, using the second voltage pattern.

Abstract: An operating method of a non-volatile memory device, the method including: receiving a program command from an external device; determining an operating mode in response to the program command; when the operating mode is a surface mount technology (SMT) mode, performing an initial program operation in which a plurality of memory cells are programmed through a plurality of steps to form a first threshold voltage distribution; and when the operating mode is a normal mode, performing a normal program operation in which the plurality of memory cells are programmed through a single step to form a second threshold voltage distribution, wherein the first threshold voltage distribution is narrower in width than the second threshold voltage distribution.

Abstract: A memory system includes a semiconductor memory device including a plurality of memory cells each configured to store data in a non-volatile manner according to a threshold voltage thereof and connected to a word line, and a controller configured to perform an error correction based on hard bit data and soft bit data read from the plurality of memory cells, generate a first table based on corrected data, determine a voltage difference between a first voltage and a second voltage, the first voltage being a voltage applied to the word line when the data being corrected is read, and correct the first table based on the voltage difference.

Abstract: A semiconductor apparatus includes a memory cell array and a control circuit. The control circuit is configured to perform a program operation on target cells within the memory cell array, the program operation including a plurality of loops. The control circuit may be configured to apply a bit line voltage having a predetermined level to bit lines in loops in which a pass voltage having a first level is applied among the plurality of loops, and configured to apply the bit line voltage having a higher level than the predetermined level to the bit lines in loops in which the pass voltage having a second level higher than the first level is applied among the plurality of loops.

Abstract: According to one embodiment, a memory system includes a nonvolatile memory that includes memory cells. The nonvolatile memory outputs, to a memory controller, first hard bit data of the first bit, second hard bit data of the second bit, third hard bit data of the third bit, and fourth soft bit data related to the first bit, the second bit, and the third bit, in response to a first command set. The nonvolatile memory outputs, to the memory controller, the first hard bit data, the second hard bit data, the third hard bit data, first soft bit data related to the first bit, second soft bit data related to the second bit, and third soft bit data related to the third bit, in response to a second command set.

Abstract: Technology is disclosed for testing a 3D memory structure. The 3D memory structure has blocks with layers of word lines. Each word line is connected to control gates of NAND memory cells. The 3D memory structure may be tested while concurrently applying a set of layer dependent voltages to a corresponding set of word lines. The magnitude of each layer dependent voltage may depend on which layer the word line to which the voltage is applied resides. There may be physical differences between the different layers such as differences in the diameters of the memory holes in which NAND string are formed. The layer dependent voltages provide for a more accurate test in view of these and other physical differences between the different layers.

Abstract: Methods, systems, and devices for imprint recovery management for memory systems are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Abstract: A processing device in a memory sub-system detects an occurrence of a triggering event, determines respective levels of charge loss associated with a first representative wordline of a block of a memory device and with a second representative wordline of the block of the memory device, and determines whether a difference between the respective levels of charge loss satisfies a threshold criterion. Responsive to determining that the difference between the respective levels of charge loss satisfies the threshold criterion, the processing device further determines that the block is in a uniform charge loss state.

Abstract: A peripheral circuit of a memory device includes page buffers. Each page buffer includes a main latch, a bias latch, (N?1) data latches, and a cache latch coupled to a data path. The peripheral circuit is further configured to: in the process of programming a first physical page, disable a bit line bias function to release the bias latch to replace one of N page latches to perform a programming verification of memory states; release one of the N page latches to cache program data of one of the N logical pages of a second physical page; and in the process of programming the first physical page, store the program data of the one of the N logical pages of the second physical page in a released page latch.

Abstract: Techniques for adjusting log likelihood ratios in a decoder may include determining an assist read (AR) zone based on performing assist reads (AR) of multibit memory cells of a memory. Soft reads of the multibit memory cells may be performed to determine a bin within the AR zone for each bit of the data stored in the memory cells. Each bin is associated with a log likelihood ratio (LLR) value. Error correction decoding on the data stored in the memory cells may be performed followed by collecting statistics on the decoded data for each bin in each AR zone. A hard error percentage may be computed for each AR zone based on the collected statistics, and one or more LLR values may be adjusted based on the hard error percentage.

Abstract: A first memory device of a memory system is coupled to a memory controller through a first channel, and includes a first memory die set as a metadata memory die including a plurality of memory blocks to which metadata is to be written, and including one or more memory dies set as user data memory dies including a plurality of memory blocks to which user data is to be written. A memory controller of the memory system selects a second memory die among the memory dies set as the user data memory dies, migrates metadata written to the first memory die to the second memory die, migrates user data written to the second memory die to the first memory die, sets the first memory die as a user data memory die, and sets the second memory die as a metadata memory die.

Abstract: Processing logic in a memory device receives a request to execute a programming operation on a set of memory cells of the memory device. A first set of programming pulses corresponding to a first step voltage level are caused to be applied to one or more wordlines associated with the set of memory cells. The processing logic determines that a programming voltage level associated with a programming pulse of the first set of programming pulses satisfies a condition. A second set of programming pulses corresponding to a second step voltage level is caused to be applied to the one or more wordlines associated with the set of memory cells in response to the condition being satisfied.

Abstract: According to one embodiment, three bits stored in one memory cell of a nonvolatile memory correspond to three pages. In first page writing, a threshold voltage becomes within a first or second region base on a bit value. In second page writing, if being within the first region, it becomes within the first or fourth region; and if being within the second region, it becomes within the second or third region. In the third page writing, if being within the first region, it becomes within the first or sixth region; if being within the second region, it becomes within the second or seventh region; if being within the third region, it becomes within the third or eighth region; and if being within the fourth region, it becomes within the fourth or fifth region.

Abstract: A semiconductor memory device includes a semiconductor pillar including first and second memory cells electrically connected in series and formed on opposite sides of the semiconductor pillar, first word lines connected to the first memory cells, respectively, and second word lines connected to the second memory cells, respectively. A verify operation includes a channel clean operation for supplying a reference voltage to a semiconductor channel shared by the first and second memory cells followed by at least first and second sense operation for determining whether a threshold voltage of a target memory cell has reached first and second threshold voltage states, respectively, then a second channel clean operation for supplying the reference voltage to the semiconductor channel, and then at least a third sense operation for determining whether the threshold voltage of the target memory cell has reached a third threshold voltage state.

Abstract: In each of n twin cells of n first sense amplifier, a current path is formed between a power supply line and one memory cell having a small or large cell current in a data readout state of two memory cells. A second sense amplifier generates erase verify information indicating whether all stored data in the memory cells of the n twin cells are in an erase state at the same level, based on a verify current flowing through a power supply line as a sum of currents of the n first sense amplifiers.

Abstract: The present disclosure provides a method of data protection for a NAND memory. The method includes programming first and second pages of a NAND flash memory device according to programming data such that data stored in the first and second pages are redundant. The programming of the first and second pages includes a plurality of programming operations using a plurality of programming voltages and a plurality of verifying operations to determine whether programmed memory cells of the first page have threshold voltage levels according to the programming data. The method also includes determining a completion of the programming of the first and second pages based on each of the plurality of verification operations returning a pass result. The method also includes performing, after the determining, a read operation on the second page by the NAND flash memory device to self-verify the data stored at the second page.

Abstract: In a method of reprogramming data in a nonvolatile memory device including a plurality of pages each of which includes a plurality of memory cells, first page data programmed in a first page is read from among a plurality of page data programmed in the plurality of pages. The plurality of page data have a threshold voltage distribution including a plurality of states. An error correction code (ECC) decoding is performed on the first page data. A reprogram operation is selectively performed on target bits in which an error occurs among a plurality of bits included in the first page data based on a result of performing the ECC decoding on the first page data and a reprogram voltage. The target bits correspond to a first state among the plurality of states. A voltage level of the reprogram voltage is adaptively changed.

Abstract: At least one address scheduling method includes selecting a first bit line, selecting a first string connected to the first bit line, performing address scheduling on N pages of each of multi-level cells in the first string sequentially from a bottom word line to a top word line, and after completing the address scheduling on all word lines in the first string, performing address scheduling on second to k-th strings sequentially in the same manner as performed with respect to the first string, where “k” is 2 or a natural number greater than 2.

Abstract: A method for decoding a 360-degree image includes: receiving a bitstream obtained by encoding a 360-degree image; generating a prediction image by making reference to syntax information obtained from the received bitstream; combining the generated prediction image with a residual image obtained by dequantizing and inverse-transforming the bitstream, so as to obtain a decoded image; and reconstructing the decoded image into a 360-degree image according to a projection format. Here, generating the prediction image includes: checking, from the syntax information, prediction mode accuracy for a current block to be decoded; determining whether the checked prediction mode accuracy corresponds to most probable mode (MPM) information obtained from the syntax information; and when the checked prediction mode accuracy does not correspond to the MPM information, reconfiguring the MPM information according to the prediction mode accuracy for the current block.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes drain-side select gate transistors for coupling to a drain-side of memory holes of memory cells and configured to retain a transistor threshold voltage. The memory holes are arranged in rows comprising strings. A control means is configured to program drain-side select gate transistors of the memory holes to an initial transistor threshold voltage using pulses increasing in magnitude by a first transistor step amount during each of a plurality of foggy loops of a foggy program operation. The control means is also configured to program the drain-side select gate transistors of the memory holes to a target transistor threshold voltage using pulses increasing in magnitude by a second transistor step amount during each of a plurality of fine loops of a fine program operation. The first transistor step amount is greater than the second transistor step amount.

Abstract: A storage array controller may receive data to be programmed to a solid-state storage device of a plurality of solid-state storage devices. The storage array controller may identify a type of the data and determine whether to program the data to a low latency portion of the solid-state storage device based on the type of the data. In response to determining to program the data to the low latency portion of the solid-state storage device, the storage array controller may program the data to the low latency portion of the solid-state storage device.

Abstract: The memory device includes a control circuitry that is communicatively coupled to memory cells are arranged in a plurality of word lines. The control circuitry is configured to perform a first programming pass on a selected word line. The first programming pass includes a plurality of programming loops, each of which includes the application of a programming pulse (Vpgm). The programming pulse voltage is increased between programming loops of the first programming pass by a step size. The step size is a first step size between two programming loops of the first programming pass and is a second step size that is different than the first step size between two other programming loops of the first programming pass. The control circuitry is also configured to perform a second programming pass to further program the memory cells of the selected word line to the plurality of data states.

Abstract: A system can include a processing device operatively coupled with the one or more memory devices, to perform operations that include writing data to the one or more memory devices and performing one or more scan operations on a management unit containing the data to determine a current value of a chosen data state metric. Each scan operation can be performed using a corresponding predetermined read-time parameter value. The operations can include determining whether the current value of the chosen data state metric satisfies a criterion, and can also include, responsive to determining that the current value of the chosen data state metric satisfies the criterion, selecting a remedial operation by determining whether redundancy metadata is included in a fault tolerant data stripe on the one or more memory devices. The operations can also include performing the remedial operation with respect to the management unit.

Abstract: Implementations described herein relate to detecting a memory write reliability risk without using a write verify operation. In some implementations, a memory device may perform a program operation that includes a single program pulse and that does not include a program verify operation immediately after the single program pulse. The memory device may set a flag value based on comparing a transition time and a transition time threshold. The transition time may be a time to transition from a first voltage to a second voltage during the program operation. The memory device may selectively perform a mitigation operation based on whether the flag value is set to a first value or a second value.

Abstract: In certain aspects, a memory device includes memory cells coupled to a same word line and bit lines, respectively, and a peripheral circuit coupled to the memory cells through the word line and the bit lines. Each of the memory cells is in one of states. The peripheral circuit is configured to determine a first number of a first set of the memory cells and a second number of a second set of the memory cells. Threshold voltages of the first set of the memory cells are between a first voltage and a second voltage larger than the first voltage. Threshold voltages of the second set of the memory cells are between the second voltage and a third voltage larger than the second voltage. The peripheral circuit is also configured to estimate a valley voltage corresponding to a first state of the states based, at least in part, on a comparison between the first number and the second number.

Abstract: According to one embodiment, a memory system includes a nonvolatile memory and a controller. The nonvolatile memory is correspond to a first mode of writing data of N bits per unit area and a second mode of writing data of M bits (M>N) per unit area. When receiving a first command issued prior to a write command to instruct writing write data to the nonvolatile memory, the controller selects one or both of the first mode and the second mode for writing the write data to the nonvolatile memory, to allow writing the write data to the nonvolatile memory to be executed in the first mode as much as possible, based on a capacity of the write data specified by the first command and a capacity of a free area of the nonvolatile memory.

Abstract: A memory device includes: a memory cell array including a plurality of memory cells; a peripheral circuit coupled to the memory cell array through word lines and bit lines, and suitable for performing one or more program loops on memory cells that are coupled to a selected word line of the word lines, each program loop including a program voltage application operation and a program verification operation; and a program control circuit suitable for controlling the peripheral circuit to decrease a level of a precharge voltage that is applied to the bit lines during the program verification operation when the number of program loops that are performed is greater than a reference number.

Abstract: Described are systems and methods for performing partial block erase operations. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines; and a controller coupled to the memory array, the controller to perform operations comprising: identifying, in a memory device, a block comprising a plurality of memory cells; estimating, in the block, a number of pages having a predefined program state; determining, based on the number of pages having the predefined program state, an erase verify voltage to be applied to the block; causing an erase operation to be performed with respect to the block; and causing an erase verify operation to be performed, using the erase verify voltage, with respect to the block.

Abstract: Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations comprising performing a write operation to program first data to a first set of memory cells addressable by a first wordline of a first plurality of wordlines of a block of the memory device; performing a read operation on a second wordline of the plurality of wordlines, wherein the second wordline is adjacent to the first wordline; determining a number of bits programmed in a first logical level in the second wordline; and responsive to determining that the number of bits set satisfies a threshold criterion, copying second data from the first block to a second block.

Abstract: The memory device that includes a memory block memory cells arranged in word lines. A controller is in electrical communication with the memory cells and is configured to program the memory cells to a first set of data states in a first programming pass and then to a greater second set of data states in a second programming pass. During programming of a first set of memory cells in at least one of the first and second programming passes, the controller is further configured to determine programming statuses of a second set of memory cells that is adjacent the first set of memory cells. The controller is further configured to read the first set of memory cells using a read voltage that is adjusted from a base read voltage based on the determined programming statuses of the second set of memory cells.

Abstract: An apparatus disclosed herein comprises: a plurality of memory cells and a control circuit coupled to the plurality of memory cells. The control circuit is configured to: determine whether the apparatus is in low power mode; in response to determining that the apparatus is in low power mode, perform a normal order read operation on a set of memory cells of the plurality of memory cells; and in response to determining that the apparatus is not in low power mode, perform a reverse order read operation on the set of memory cells of the plurality of memory cells.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines. The memory cells are disposed in memory holes and grouped into a plurality of tiers. The memory cells are configured to retain a threshold voltage corresponding to one of a plurality of data states to store one bit as single-level cells and a plurality of bits as multi-level cells. The apparatus also includes a control means coupled to the word lines and the memory holes and configured to select a predetermined strobe quantity of the plurality of tiers of the memory cells separately for the memory cells operating as the single-level cells and the memory cells operating as the multi-level cells. The control means is also configured to trigger sensing of the predetermined strobe quantity of the plurality of tiers of the memory cells during a verify operation.

Abstract: Embodiments disclosed can include selecting a target read window budget (RWB) increase and identifying a set of aggressor memory cells. They can also include generating a list of programming level states for the set of aggressor memory cells and identifying, in the list, an entry associated with a maximum RWB increase that is greater than or equal to the target RWB increase. They can further include responsive to identifying the entry with the total number of bits associated with a maximum RWB increase that is greater than or equal to the target RWB increase, modifying a parameter of the memory access operation with the adjustment associated with the identified entry.

Abstract: A storage device is disclosed herein. The storage device comprises: a non-volatile memory, where the non-volatile memory includes a block of N wordlines partitioned into a plurality of sub-blocks; and control circuitry coupled to the N wordlines. The control circuitry is configured to: determine a program status of an unselected sub-block of the plurality of sub-blocks before performing an operation on a selected sub-block of the plurality of sub-blocks; based on determining that the program status of the unselected sub-block is programmed, perform a precharge operation including applying a first precharge time; and based on determining that the program status of the unselected sub-block is not programmed, perform a precharge operation including applying a second precharge time, wherein the first precharge time is for a longer period than the second precharge time.

Abstract: A method of operating a semiconductor memory device includes performing a plurality of program loops for programming selected memory cells among a plurality of memory cells. Each of the plurality of program loops includes a program phase and a verify phase. The program phase includes setting a state of a select line connected to a selected memory block including the selected memory cells, wherein setting the state of the select line connected to the selected memory block comprises applying a voltage to the select line based on a program progress state of the selected memory cells, setting a state of a bit line connected to the selected memory block, applying a program voltage to a selected word line among word lines connected to the selected memory block and applying a pass voltage to an unselected word line.

Abstract: A memory system includes a plurality of memory cells, and the memory cells are multiple-level cells. The memory system performs program operations to program the memory cells. After each program operation, at least one threshold voltage test is performed to determine if threshold voltages of the memory cells are greater than the verification voltage. When the threshold voltage of a first memory cell is determined to be greater than a first verification voltage, the first memory cell will be inhibited from being programmed during the next program operation. When the threshold voltage of a second memory cell is determined to newly become greater than a second verification voltage, where the second verification voltage is greater than the first verification voltage, the second memory cell will be programmed again during the next program operation.

Abstract: A semiconductor memory includes a first memory cell configured to be set with a first threshold voltage, the first threshold voltage being one of different threshold voltage levels, a second memory cell configured to be set with a second threshold voltage, the second threshold voltage being one of different threshold voltage levels, a first word line coupled to the first memory cell, a second word line coupled to the second memory cell, and a controller configured to read data of one of different bits based on a combination of the first threshold voltage of the first memory cell and the second threshold voltage of the second memory cell.

Abstract: To provide a data processing system that includes a nonvolatile memory device capable of storing multilevel data and enables increasing storage capacity of a main memory device when the data processing system is activated. The data processing system includes an arithmetic processing device, a main memory device, and a nonvolatile memory device. The main memory device includes a volatile memory device, and the nonvolatile memory device is configured to store multilevel data in one memory cell. When the data processing system is deactivated, the nonvolatile memory device stores binary data, whereby the stored data can be held for a long time. Upon activation, the nonvolatile memory device stores multilevel data, whereby increasing storage capacity. When the storage capacity is increased, a free space is generated in the nonvolatile memory device, which can be used as a part of the main memory device of the data processing system.

Abstract: An exemplary embodiment of the invention provides a read voltage control method for a rewritable non-volatile memory module. The method includes: sending a first read command sequence which instructs a reading of a plurality of first memory cells by using a first voltage level to obtain first data; obtaining first adjustment information of a read voltage according to the first data and a channel parameter of the first memory cells, and the channel parameter reflects a channel status of the first memory cells; and adjusting a voltage level of the read voltage from the first voltage level to a second voltage level according to the first adjustment information.

Abstract: Systems and methods are provided for performing error recovery using LLRs generated from multi-read operations. A method may comprise selecting a set of decoding factors for a multi-read operation to read a non-volatile storage device multiple times. The set of decoding factors may include an aggregation mode for aggregating read results of multiple reads. The method may further comprise issuing a command to the non-volatile storage device to read user data according to the set of decoding factors, generating a plurality of Log-Likelihood Ratio (LLR) values using a mapping engine from a pre-selected set of LLR value magnitudes based on the set of decoding factors, obtaining an aggregated read result in accordance with the aggregation mode and obtaining an LLR value from the plurality of LLR values using the aggregated read result as an index.

Abstract: A semiconductor storage device includes a memory transistor and a word line connected to a gate electrode of the memory transistor. When a write sequence is interrupted before a k+1th verification operation is ended after a kth verification operation is ended in the nth write loop of the write sequence, a voltage equal to or higher than a verification voltage corresponding to a first verification operation in the nth write loop is supplied to the word line before start of the k+1th verification operation after resumption of the write sequence. A time from the resumption of the write sequence to the start of the k+1th verification operation is shorter than a time from start of the first verification operation to end of the kth verification operation in the nth write loop.

Abstract: Provided is a ferroelectric semiconductor device including a source and a drain having different polarities. The ferroelectric semiconductor may include a ferroelectric including zirconium oxide (ZrO2), hafnium oxide (HfO2), and/or hafnium-zirconium oxide (HfxZr1-xO, 0<x<1). The semiconductor device may have memory-like characteristics.

Abstract: To remedy short term data retention issues, a non-volatile memory performs a multi-pass programming process to program data into a set of non-volatile memory cells and identifies non-volatile memory cells that experienced downward threshold voltage drift after a first pass of the multi-pass programming process and prior to a final pass of the multi-pass programming process. The final pass of the multi-pass programming process comprises programming non-volatile memory cells not identified to have experienced the downward threshold voltage drift to a set of final target threshold voltages and purposefully overprogramming non-volatile memory cells identified to have experienced the downward threshold voltage drift to threshold voltages greater than respective final target threshold voltages by one or more offsets.

Abstract: A memory system identifies memory cells connected to a common word line that have had their threshold voltage unintentionally drift lower than programmed by determining whether memory cells meet two criteria: (1) the memory cells have threshold voltages within an offset of a read compare voltage of a data state; and (2) adjacent memory cells (connected to word lines that are adjacent to the common word line) are in one or more low data states. For those memory cells meeting the two criteria, the memory system performs some amount of programming on the memory cells to refresh the data stored in those memory cells to be as originally intended.

Abstract: The repair circuit is disposed in a memory including a normal memory area and a redundant memory area including a target repair unit immediately adjacent to the normal memory area, and the repair circuit being configured to control the target repair unit to repair an abnormal memory cell in the normal memory area. The repair circuit includes: a first control circuit, configured to receive signals at a target number of bits from low to high in a row address, process the received signals to obtain a control result, and output the control result, where the target number is associated with a number of Word Lines in the target repair unit; and a repair determination circuitry, connected to an output terminal of the first control circuit, and configured to receive the control result and output, in combination with the control result, a repair signal indicating whether to perform a repair operation.

Abstract: A memory device includes a memory cell array including a select transistor and a plurality of memory cells connected in series, each memory cell including a cell transistor and a variable resistance layer connected in parallel. During a write operation, a voltage setting circuit is controlled to apply a first voltage to a selected word line and a second voltage to non-selected word lines. The time period for applying the first voltage to the selected word line starts later than the time period for applying the second voltage to the non-selected word lines and ends earlier than the time period for applying the second voltage to the non-selected word lines.

Abstract: The memory device includes a memory block with a plurality of memory cells, which are programmed to multiple bits per memory cell, arranged in a plurality of word lines. Control circuitry is provided and is configured to read the memory cells of a selected word line. The control circuitry separates the memory cells of the selected word line into a first group of memory cells, which are located on a side of the word line are near a voltage driver, and a second group of memory cells, which are located on an opposite side of the word line from the voltage driver. The control circuitry reads the memory cells of the first group using a first read mode and reads the memory cells of the second group using a second read mode that is different than the first read mode to reduce a fail bit count during read.

Abstract: A semiconductor memory apparatus includes: a page buffer circuit, a pass/fail determination circuit, and an operation control circuit. The page buffer circuit may include a sensing latch circuit and a data latch circuit. The pass/fail determination circuit determines a pass/fail for a memory cell. The operation control circuit controls a program operation and a program verify operation to be performed on the memory cell.

Abstract: A semiconductor memory device includes i first word lines connected to the i first memory cells, i second word lines connected to the i second memory cells, a driver capable of supplying voltage to each of the i first word lines and each of the i second word lines, and a logic control circuit controlling both a write operation including a verify operation and a read operation including a verify operation. In the semiconductor memory device, when an order of performing a sense operation for determining whether or not a threshold voltage of the k-th first memory cell has reached a j-th threshold voltage in the verify operation is different from that of in the read operation, a voltage applied to the k-th first word line in the verify operation is different from a voltage applied to the k-th first word line in the read operation.