Abstract: Methods and systems include memory devices with multiple access lines arranged in an array to form a multiple intersections. Memory cells are located at the intersections of the multiple access lines. Decoders are configured to drive the multiple memory cells via the multiple access lines. Variable biasing circuitry may bias a voltage on an access line of the multiple access lines to change a variable ramp rate of the voltage on the access line. A control circuit is configured to determine a memory cell of the multiple memory cells to be activated. Based at least in part on a distance from the memory cell to a corresponding decoder, the control circuit may set the variable ramp rate of the biasing circuitry.

Abstract: Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing.

Abstract: The present disclosure relates to an electronic device. A memory device having improved cache program operation performance according to the present technology includes a plurality of memory cells, each programmed in any one of first to n-th program state where n is a natural number greater than, a sensing latch configured to store data sensed from a bit line connected to a selected memory cell among the plurality of memory cells, and a plurality of data latches configured to temporarily store data to be stored in the selected memory cell.

Abstract: A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

Abstract: A storage array controller may receive data to be programmed to a solid-state storage device of a plurality of solid-state storage devices. The storage array controller may identify a type of the data and determine whether to program the data to a low latency portion of the solid-state storage device based on the type of the data. In response to determining to program the data to the low latency portion of the solid-state storage device, the storage array controller may program the data to the low latency portion of the solid-state storage device.

Abstract: A memory system includes a memory device including memory cells, and a controller that performs a write operation, a read operation, and a check operation on the memory device. During the check operation, the controller controls the memory device to read check data from target memory cells of the memory cells by using a check level, compares the check data with original data stored in the target memory cells, and determines a reliability of the target memory cells or the check data based on a result of the comparison.

Abstract: A controller includes a processor suitable for reading target data based on a predetermined main read voltage, and on each of a plurality of candidate read voltages having different voltage values; a memory suitable for storing main coded data and candidate coded data which are obtained by reading the target data; an ECC suitable for decoding the main coded data to generate main decoded data, and decoding each of the candidate coded data to generate candidate decoded data; and a counter suitable for counting the number of error bits corresponding to the main decoded data, and counting each of numbers of error bits corresponding to each of the candidate decoded data; and a voltage setting circuit suitable for setting a candidate read voltage having a minimum number of error bits, among the candidate decoded data, and which is smaller than the number of error bits corresponding to the main decoded data, as the main read voltage.

Abstract: A semiconductor storage device includes a first memory string having first, second, and third memory cells and a first select transistor, a second memory string having fourth, fifth, and sixth memory cells and a second select transistor, a third memory string having seventh, eighth, and ninth memory cells and a third select transistor, a first word line connected to gates of the first, fourth, and seventh memory cells, a second word line connected to gates of the second, fifth, and eighth memory cells, and a third word line connected to gates of the third, sixth, and ninth memory cells. A write operation for writing multi-bit data in the memory cells includes first and second write operations. In the second write operations performed through the first, second, and third word lines, respective ones of the first, fifth, and ninth memory cell are initially selected.

Abstract: A method and resulting structures for a semiconductor device includes forming a source terminal of a semiconductor fin on a substrate. An energy barrier is formed on a surface of the source terminal. A channel is formed on a surface of the energy barrier, and a drain terminal is formed on a surface of the channel. The drain terminal and the channel are recessed on either sides of the channel, and the energy barrier is etched in recesses formed by the recessing. The source terminal is recessed using timed etching to remove a portion of the source terminal in the recesses formed by etching the energy barrier. A first bottom spacer is formed on a surface of the source terminal and a sidewall of the semiconductor fin, and a gate stack is formed on the surface of the first bottom spacer.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a word line connected in common to gates of the memory cells, and a control circuit configured to execute a read operation on the memory cells by applying a first read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the first read voltage and a second read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the second read voltage. The control circuit determines the first read voltage by applying at least first to third voltages to the word line, and determines the second read voltage based on the first read voltage.

Abstract: A nonvolatile memory device includes a first memory stack including first memory cells vertically stacked on each other, a second memory stack including memory cells vertically stacked on each other, and a control logic configured to set a voltage level of a second voltage applied for a second memory operation to one of the second memory cells in the second memory stack based on a first voltage applied to one of the first memory cells in the first memory stack in a first memory operation. The second memory stack is vertically stacked on the first memory stack. Cell characteristics of the one of the first memory cells is determined using the first voltage.

Abstract: A memory device may include a memory cell array, a program and verify circuit, a verify table storage, and a program fail detector. The memory cell array may include memory cells. The program and verify circuit may perform a program operation of programming the memory cells to a corresponding target state of a plurality of states, and generate verification data including cell count values that respectively correspond to one or more states among the plurality of states. The verify table storage may store, for each program pulse count, reference data including reference cell count values that respectively correspond to the plurality of states. The program fail detector may detect whether the program operation has failed based on a result of a comparison between the verification data and the reference data corresponding to a current program pulse count, and generate program fail information indicating that the program operation has failed.

Abstract: A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent and a third wiring adjacent to the second wiring, a first pillar between the first and second wirings and a second pillar between the second and third wirings, the first and second pillars each extending in a second direction crossing the first direction toward the semiconductor substrate, and first and second bit lines connected to the first and second pillars, respectively. A first voltage is applied to the second wiring during a program operation on a first memory cell at an intersection of the second wiring and the first pillar, and a second voltage higher than the first voltage is applied to the second wiring during a program operation on a second memory cell at an intersection of the second wiring and the second pillar.

Abstract: According to one embodiment, a memory system includes a memory device and a controller. The controller is configured to instruct to apply, to a first word line, a determination voltage that is based on a first value and a first difference value in a case where it is determined whether or not a first data value has been written in a first memory cell, to instruct to apply, to a second word line, a determination voltage that is based on the first value, the first difference value, and a second difference value in a case where it is determined whether or not the first data value has been written in the second memory cell, and to change the first difference value in a case where a first condition is satisfied.

Abstract: A memory system according to an embodiment includes a semiconductor memory, and a memory controller. The semiconductor memory comprises memory cells and word lines. Each of the word lines is connected to the memory cells. The memory controller executes a patrol operation including a read operation of the semiconductor memory. The word lines are classified into one of first and second groups. The memory controller executes patrol operations in which the word lines are respectively selected in a first patrol period and, in a second patrol period subsequent to the first patrol period, executes a patrol operation in which the word line included in the first group is selected and omits a patrol operation in which the word line included in the second group is selected.

Abstract: In service flow capability updating in a guaranteed bandwidth multicast network may be provided. First, a node may determine that a bandwidth requirement of a flow has changed to a new bandwidth value. Then, in response to determining that the bandwidth requirement of the flow has changed to the new bandwidth value, an ingress capacity value may be updated in an interface usage table for a Reverse Path Forwarding (RPF) interface corresponding to the flow. The RPF interface may be disposed on a network device. Next, in response to determining that the bandwidth requirement of the flow has changed to the new bandwidth value, an egress capacity value may be updated in the interface usage table for an Outgoing Interface (OIF) corresponding to the flow. The OIF may be disposed on the network device.

Abstract: Data reading method, device, and storage medium of a non-volatile memory are provided. The method includes obtaining address information and decoding the address information to determine an address of a corresponding memory cell; when the address of the memory cell is in a selected region, adjusting a first determination reference value to obtain a second determination reference value; applying a readout current to the memory cell, and obtaining a determination current outputted by the memory cell; and comparing a value range of the determination current outputted by the memory cell with the second determination reference value and reading out data content stored in the memory cell.

Abstract: The present invention provides a decoding method, a memory controlling circuit unit, and a memory storage device. The decoding method includes: receiving a plurality of commands; reading a first physical programming unit to obtain a plurality of first data respectively by using a plurality of first reading voltage groups of a plurality of reading voltage groups based on a first read command of the plurality of commands and executing a first decoding operation in each of the plurality of first data, wherein a number of the plurality of first reading voltage groups is less than a number of the plurality of reading voltage groups; and executing other commands being different from the first read command of the plurality of commands when unsuccessfully executing the first decoding operation for each of the plurality of first data.

Abstract: A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences.

Abstract: An apparatus may include multiple memory devices. Each memory device may include multiple memory banks. Addresses of accessed word lines for a particular portion of memory and the number of times those word lines are accessed may be tracked by each memory device. When a memory device determines that an accessed word line is an aggressor word line, the memory device alerts other memory devices of the apparatus. The memory devices may then perform targeted refresh operations on victim word lines of the aggressor word line.

Abstract: Apparatuses, methods, and systems for sensing two memory cells to determine one data value are described herein. An embodiment includes a memory having a plurality of memory cells and circuitry configured to sense memory states of each of two memory cells to determine one data value. One data value is determined by sensing the memory state of a first one of the two memory cells using a first sensing voltage in a sense window between a first threshold voltage distribution corresponding to a first memory state and a second threshold voltage distribution corresponding to a second memory state and sensing the memory state of a second one of the two memory cells using a second sensing voltage in the sense window. The first and second sensing voltages are selectably closer in the sense window to the first threshold voltage distribution or the second threshold voltage distribution.

Abstract: According to one embodiment, a memory system includes a first memory and a memory controller. The first memory is nonvolatile and includes a plurality of memory cell transistors, each of which stores data corresponding to a threshold voltage. The memory controller causes the first memory to execute a read operation to acquire data corresponding to the threshold voltage from the plurality of memory cell transistors on the basis of a result of comparison between the threshold voltage and a read voltage. The memory controller selects a first candidate value from among a plurality of candidate values for the read voltage in accordance with a degree of stress that affects the threshold voltage; and causes the first memory to execute the read operation using the first candidate value as the read voltage.

Abstract: A memory device having an error correction function includes: a memory element including multiple memory cells, a reconfiguration logic unit configured to group input data according to data retention properties of each memory cell in which each of the input data will be stored or group storage data stored in the memory element according to data retention properties of each memory cell in which each of the storage data is stored and arrange each of the input data or each of the storage data grouped by identical retention properties to be adjacent to each other, an error correction encoder configured to apply an error correction encoding algorithm with a different intensity to the grouped input data in each group, and an error correction decoder configured to apply an error correction decoding algorithm corresponding to an intensity applied by the error correction encoder to the grouped storage data in each group.

Abstract: A data storage device includes a storage including a first and a second memory region, a buffer memory, and a controller. The controller includes a prewrite component configured to write first chunk data, which is configured of a group of a plurality of pieces of unit data and is at least one of first type chunk data, in the first memory region from the buffer memory, a combination unit configured to, as second chunk data which is new first type chunk data is introduced into the buffer memory, generate at least one second type chunk data by combining at least one of the plurality of pieces of unit data constituting the first chunk data and at least one of a plurality of pieces of unit data constituting the second chunk data, and a main write component configured to write the second type chunk data in the second memory region.

Abstract: Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing.

Abstract: A semiconductor memory device includes a memory cell array, an input/output circuit configured to output read data from the semiconductor memory device, a first data latch configured to latch data read from the memory cell array as the read data, a second data latch to which the read data is transferred from the first data latch and from which the read data is transferred to the input/output circuit, a signaling circuit configured to output a ready signal or a busy signal, and a control circuit configured to control the signaling circuit to output the busy signal while the read data is being latched in the first data latch during a read operation performed on the memory cell array and to output the ready signal while the read data latched in the first data latch is being transferred from the first latch to the second latch.

Abstract: The present technology includes a memory device and a method of operating the memory device. The memory device includes a memory block including a plurality of memory cells connected to word lines, peripheral circuits configured to generate operation voltages to be applied to the word lines, and control logic configured to control the peripheral circuits in response to a program command, a read command, or an erase command. The peripheral circuits include a voltage generator that adjusts a section of threshold voltage distributions of memory cells to be programmed among the memory cells, according to a distance between the word lines.

Abstract: A storage device having a wide range of operating temperatures is disclosed. Techniques disclosed herein may be used to operate MLC cells at higher temperatures before resorting to thermal throttling. Techniques disclosed herein may be used to operate MLC cells at lower temperatures without needing to pre-heat the storage device. SLC data stored in a first group of memory cells is folded to MLC data stored in a second group of memory cells while an operating temperature is outside a first temperature range. After the operating temperature is within a second temperature range, the data integrity of the MLC data is checked. The SLC data in the first group is folded to MLC data in a third group of memory cells responsive to the MLC data in the second group failing the data integrity check. The foregoing permits the storage device to increase its range in operating temperatures.

Abstract: A memory device and a reading method thereof are provided. During a second reading period, a second bit line voltage is provided to a bit line having a read finished memory cell. Thus, a voltage difference between a bit line voltage and a pass voltage of memory cells on unselected word lines is reduced. A data value stored in the memory cells on a selected word line is determined according to whether the memory cells on the selected word line enter a preset state during a first reading period and the second reading period.

Abstract: A data writing method, a memory control circuit unit and a memory storage apparatus are provided. The method includes: receiving first data and second data from a host system; generating a first array error correcting code based on the first data, and generating a second array error correcting code based on the second data; programming a first group including the first array error correcting code into a first chip enable group by using a first programming mode; and programming a second group including the second array error correcting code into a second chip enable group by using a second programming mode.

Abstract: An information handling system includes a memory array and a memory controller. The memory array stores data within the information handling system. The memory controller writes the data to the memory array. The memory controller also determines whether a temperature of the memory array is above a threshold temperature. The memory controller tags a plurality of memory locations within the memory array written with data while the temperature is above the threshold temperature. While a refresh operation is being executed, the memory controller determines whether the temperature of the memory array is below the threshold temperature. In response to the temperature of the memory array being below the threshold temperature and while the refresh operation is being executed, the memory controller rewrites the data in the tagged memory locations within the memory array.

Abstract: Provided herein may be a controller, a memory system including the controller, and a method of operating the memory system. The controller may include a processor configured to control a read operation of a memory device in response to a read command received from a host and an error correction circuit configured to perform an error correction operation on read data received from the memory device during the read operation. The processor may determine deterioration characteristics of the memory device during the read operation, and control the memory device to select and perform any one of a re-program operation and a reclaim operation on memory cells on which the read operation has been performed.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The memory system is capable of executing a first operation and a second operation. In the first operation, the controller issues a first command sequence, the semiconductor memory applies a first voltage to a first word line and applies a second voltage to a second word line to read data from the first memory, and the read data is transmitted to the controller from the semiconductor memory. In the second operation, the controller issues a second command sequence, the semiconductor memory applies a third voltage to the first word line and applies a fourth voltage to the second word line, and data held in the memory cell array is left untransmitted to the controller.

Abstract: A memory includes first and second select gate transistors, memory cells, a source line, a bit line, a selected word line which is connected to a selected memory cell as a target of a verify reading, a non-selected word line which is connected to a non-selected memory cell except the selected memory cell, a potential generating circuit for generating a selected read potential which is supplied to the selected word line, and generating a non-selected read potential larger than the selected read potential, which is supplied to the non-selected word line, and a control circuit which classifies a threshold voltage of the selected memory cell to one of three groups by verifying which area among three area which are isolated by two values does a cell current of the selected memory cell belong, when the selected read potential is a first value.

Abstract: Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes multiple layers of memory, a layer including sub-layers of semiconductor material. The integrated circuit also includes an access signal generator configured to generate an access signal to facilitate an access operation, and a characteristic adjuster configured to adjust the access signal for each layer in the multiple layers of memory.

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract: Apparatus, methods, and computer-readable media for programming, reading, and servicing non-volatile storage device to improve data retention time and data density are disclosed. According to one embodiment, a method of managing a non-volatile memory storage device includes generating output values based on an expected pattern of discrete states stored in memory cells of the storage device, comparing output values for the memory cells to expected output values using a pre-selected threshold, and based on the comparing, programming other memory cells of the storage device to refresh the programming of the other memory cells. Methods of performing service and management operations for interrupting a host system coupled a non-volatile memory storage device are also disclosed.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive a request for data, wherein the request is received on a system that regularly stores data in a cache and provide the requested data without causing the data or an address of the data to be cached or for changes to the cache to occur. In an example, the requested data is already in a level 1 cache, level 2 cache, or last level cache and the cache does not change its state. Also, a snoop request can be broadcasted to acquire the requested data and the snoop request is a read request and not a request for ownership of the data. In addition, changes to a translation lookaside buffer when the data was obtained using a linear to physical address translation is prevented.

Abstract: A computer-implemented method, according to one approach, includes: using a first calibration scheme to calibrate the given page in the block by calculating a first number of independent read voltage offset values for the given page. An attempt is made to read the calibrated given page, and in response to determining that an error correction code failure occurred when attempting to read the calibrated given page, a second calibration scheme is used to recalibrate the given page in the block. The second calibration scheme is configured to calculate a second number of independent read voltage offset values for the given page. An attempt to read the recalibrated given page is also made. In response to determining that an error correction code failure did occur when attempting to read the recalibrated given page, one or more instructions to relocate data stored in the given page are sent.

Abstract: A resistive memory including a storage array, a storage circuit, a control circuit, a voltage generation circuit and an access circuit is provided. The storage array includes a plurality of blocks. Each block includes a plurality of memory cells. The storage circuit stores a plurality of count values. Each of the count values indicates the number of times that a corresponding block performs a write operation. The control circuit generates a control signal according to the count values when an external command is a write command. The voltage generation circuit provides an operation voltage group according to the control signal. The access circuit accesses the storage array according to the operation voltage group.

Abstract: A memory device and a write method thereof are provided. A control circuit performs a first write operation and a first write verification operation on a plurality of memory cells of a non-volatile memory, and after the plurality of memory cells pass the first write verification operation, the control circuit performs a second write verification operation on target memory cells corresponding to at least one target threshold voltage in the plurality of memory cells, and when a failure bit count of the target memory cells is not less than a preset number of bits, the control circuit performs a second write operation and a third write verification operation on the plurality of memory cells.

Abstract: A semiconductor memory device includes a memory cell array, a peripheral circuit, and a control logic. The memory cell array may include a plurality of memory cells. The peripheral circuit may program shared page data on selected memory cells among the plurality of memory cells. The control logic may control, during the program operation on the selected memory cells, the peripheral circuit to program first partial data of the shared page data to memory cells coupled to a first word line among the selected memory cells, and to program second partial data of the shared page data to memory cells coupled to a second word line different from the first word line among the selected memory cells.

Abstract: Methods and apparatus for NAND flash memory are disclosed. In an embodiment, a method is provided for programming a NAND flash memory includes setting programming conditions on word lines to set up programming of multiple memory cells associated with multiple bit lines, and sequentially enabling bit line select gates to load data from a page buffer to the multiple bit lines of the memory. After each bit line is loaded with selected data, an associated bit line select gate is disabled so that the selected data is maintained on the bit line using bit line capacitance. The method also includes waiting for a programming interval to complete after all the bit lines are loaded with data to program the multiple memory cells associated with the multiple bit lines. At least a portion of the multiple memory cells are programmed simultaneously.

Abstract: Systems and methods for increasing cycling endurance and minimizing over programming of non-volatile memory cells by modulating the programming voltage applied to the non-volatile memory cells over time as the number of program/erase cycles increases are described. A bit count ratio based on bit counts within two threshold voltage zones may be used to determine the amount of voltage reduction in the programming voltage applied during subsequent programming operations. For example, if the bit count ratio is between 0.02 and 0.05, then the reduction in the programming voltage may be 100 mV; if the bit count ratio is between 0.05 and 0.10, then the reduction in the programming voltage may be 200 mV. The modulation (e.g., the reduction) of the programming voltage may be performed at varying cycle intervals depending on the total number of program/erase cycles for a memory block and/or the bit count ratio.

Abstract: According to one embodiment, a memory system includes a NAND flash memory that has a first area, a second area, and a third area, and a controller that controls data transfer between a host device and the memory system. The controller writes data transmitted from the host device to the first area by a first method of storing 1-bit data per memory cell, and at a first timing, reads at least a part of data stored in the first area to generate one unit data, compresses the unit data, and writes the compressed unit data to the second area. At a second timing, the controller decompresses the read compressed unit data from the second area, and writes the decompressed unit data to the third area by a second method of storing a plurality of bits of data per memory cell.

Abstract: A memory controller includes: a read operation controller for controlling the plurality of memory devices to perform read operation on a plurality of pages included in one stripe; an over-sampling read voltage determiner for determining over-sampling read voltages, based on soft read data of a selected page among at least two pages, when read operations on the at least two pages among the plurality of pages fail; an error bit recovery for recovering error estimation bits included in read data of the selected page, based on an over-sampling read data of the selected page, which is acquired using the over-sampling read voltages; and an error corrector for performing error correction decoding on conversion data obtained by recovering the error estimation bits included in the read data of the selected page. The plurality of pages included in one stripe is included in different memory devices among the plurality of memory devices.

Abstract: A measurement device includes a sensor unit capable of measuring a state of a measurement target, and a control unit configured to control the sensor unit. The sensor unit includes a measurement unit capable of measuring a voltage corresponding to the state of the measurement target, a first voltage comparison unit configured to determine whether or not the measured voltage is changed beyond a lower limit value of a predetermined voltage change, and a second voltage comparison unit configured to determine whether or not the voltage change is changed beyond an upper limit value of the voltage change. The control unit stops power supply to the sensor unit in a case in which it is determined in the first and second voltage comparison units that the measured voltage is not changed beyond the voltage change.

Abstract: A memory system includes a semiconductor memory device including a memory block; and a scrambler and ECC block configured to generate program data using data received from a host, generate one or more data sets using the program data and page information data, and output the one or more data sets, during a write operation; and a memory controller configured to output the one or more data sets to the semiconductor memory device and to control the semiconductor memory device, wherein the semiconductor memory device is configured to read the page information data stored in each of the plurality of pages and detect, from among the plurality of pages, an erased page or a program-interrupted page in which a sudden power-off (SPO) has occurred during a boot operation.

Abstract: A nonvolatile memory device includes multi-level cells in a memory cell array including a plurality of memory blocks, and each of the memory blocks includes a plurality of pages. A method of operating the nonvolatile memory device includes pre-programming multi-bit data in a pre-program block of the memory blocks, dividing the multi-level cells into a plurality of state groups based on state codes indicating states of the multi-level cells to generate digest data indicating state group codes corresponding to the state groups, and programming the digest data in a digest block of the memory blocks.

Abstract: An apparatus comprising non-volatile memory is configured to access a selected unit of encoded SLC data in the non-volatile memory during a first programming phase of a process of folding data stored at a single bit per memory cell to data stored at multiple bits per memory cell. The apparatus recovers the selected unit of SLC data based on redundancy data formed from units of SLC data that data include the selected unit of SLC data. The apparatus saves the recovered selected unit of SLC data to memory. The apparatus uses the saved recovered unit of SLC data during a second programming phase of folding the data stored at a single bit per memory cell to the data stored at multiple bits per memory cell, thereby saving considerable time in not having to again recover the SLC data using the redundancy data.