Abstract: A memory array including a plurality of memory cells and a plurality of drivers is disclosed. The plurality of memory cells may be arranged in a plurality of rows and a plurality of columns. Memory cells corresponding to a row of the plurality of rows may be logically grouped into a plurality of memory array segments. The plurality of drivers may be coupled to corresponding first ends of corresponding memory array segments of the plurality of memory array segments. Second ends of the corresponding memory array segments may be coupled to second ends of corresponding adjacent memory array segments of the plurality of memory array segments. The second ends of the corresponding memory array segments and the second ends of corresponding adjacent memory array segments may be coupled to corresponding wordlines of a plurality of wordlines.

Abstract: A memory device includes a first cell block on a substrate at a first level, and a second cell block on the substrate at a second level different from the first level. Each of the first and second cell blocks includes a word line extending in a first direction that is parallel to a top surface of the substrate, a word line contact connected to a center point of the word line, a bit line extending in a second direction that is parallel to the top surface of the substrate and intersects the first direction, a bit line contact connected to a center point of the bit line, and a memory cell between the word and bit lines. The second cell block is offset from the first cell block in at least one of the first and second directions.

Abstract: A memory device includes a first cell block on a substrate at a first level, and a second cell block on the substrate at a second level different from the first level. Each of the first and second cell blocks includes a word line extending in a first direction that is parallel to a top surface of the substrate, a word line contact connected to a center point of the word line, a bit line extending in a second direction that is parallel to the top surface of the substrate and intersects the first direction, a bit line contact connected to a center point of the bit line, and a memory cell between the word and bit lines. The second cell block is offset from the first cell block in at least one of the first and second directions.

Abstract: Permutation coding for improved memory cell operations are described. An example apparatus can include an array of memory cells each programmable to a plurality of states. A controller coupled to the array is configured to determine an encoded data pattern stored by a number of groups of memory cells. Each of the number of groups comprises a set of memory cells programmed to one of a plurality of different collective state permutations each corresponding to a permutation in which the cells of the set are each programmed to a different one of the plurality of states to which they are programmable. The controller is configured to determine the encoded data pattern by, for each of the number of groups, determining the one of the plurality of different collective state permutations to which the respective set is programmed by direct comparison of threshold voltages of the cells of the set.

Abstract: An exemplary method to rank blocks of a non-volatile memory device includes: for each of a plurality of blocks of a memory device, determining a respective erase health metric (EHM) for each of the blocks by combining an erase difficulty metric and an age metric, including: calculating the erase difficulty metric for a respective block based on erase performance metrics obtained during erase phases of an erase operation performed on the respective block, and determining the age metric for the respective block based on a total number of erase operations performed on the respective block during its lifespan. After determining the respective EHM for each of the blocks, the method includes ranking blocks in accordance with the determined respective EHMs, and selecting a block of the plurality of blocks in accordance with the rankings, and writing data to the selected block.

Abstract: A memory device includes a first cell block on a substrate at a first level, and a second cell block on the substrate at a second level different from the first level. Each of the first and second cell blocks includes a word line extending in a first direction that is parallel to a top surface of the substrate, a word line contact connected to a center point of the word line, a bit line extending in a second direction that is parallel to the top surface of the substrate and intersects the first direction, a bit line contact connected to a center point of the bit line, and a memory cell between the word and bit lines. The second cell block is offset from the first cell block in at least one of the first and second directions.

Abstract: Some embodiments include a memory cell having a transistor with a channel region between a first source/drain region and a second source/drain region. A controlled-conductivity region is adjacent the first source/drain region. The controlled-conductivity region has a low-conductivity mode and a high-conductivity mode. The high-conductivity mode has a conductivity at least 106 greater than a conductivity of the low-conductivity mode. The channel region includes a first material having a first bandgap, and the controlled-conductivity region includes a second material having a second bandgap which is greater than the first bandgap. A charge-storage device is electrically coupled to the first source/drain region through the controlled-conductivity region. A bitline is electrically coupled to the second source/drain region.

Abstract: A data storage device includes a nonvolatile memory device including a plurality of memory cells; and a controller suitable for determining whether the memory cells are erased or not, wherein, when it is determined, based on first data read as a read voltage set including a first read voltage is applied to the memory cells, that the memory cells are not erased, the controller determines whether the memory cells are erased or not based on second data read as the read voltage set in which the first read voltage is replaced with a second read voltage is applied to the memory cells, and wherein the first and second read voltages are read voltages of lowest levels among read voltages included in the read voltage set.

Abstract: Methods of operating non-volatile memory devices are provided including receiving program data and a program address. Memory cells that correspond to the program address are selected from among memory cells in an erased state. The selected memory cells are programmed based on the program data such that each of the selected memory cells is programmed to one of a plurality of programmed states, where threshold voltage distributions of the programmed states are different from each other and are higher than a threshold voltage distribution associated with the erased state. By programming all or a portion of the memory cells corresponding to the erased state to have positive threshold voltages, degradation of the data retention capability of the memory cells may be reduced.

Abstract: A semiconductor memory device and a data reading method capable of appropriately reading data stored in memory cells are provided. The semiconductor memory device includes: a memory cell array including multiple memory cells and having a known-data storage area storing determination data used for determining appropriateness or inappropriateness of a value of each of a reading voltage applied to a memory cell when reading data stored in the memory cell and a comparative current used for a comparison with a current flowing through a memory cell according to stored data; a decoder that applies the reading voltage to a memory cell to be read according to an address representing the memory cell to be read; and a sense amplifier including a comparison circuit that outputs a comparison result acquired by comparing a current flowing through the memory cell to be read 66 according to stored data with the comparative current.

Abstract: A method of operating a non-volatile memory device includes receiving program data and a program address. Memory cells that correspond to the program address are selected from among memory cells in an erased state. The selected memory cells are programmed based on the program data such that each of the selected memory cells is programmed to one of a plurality of programmed states, where threshold voltage distributions of the programmed states are different from each other and are higher than a threshold voltage distribution associated with the erased state. By programming all or a portion of the memory cells corresponding to the erased state to have positive threshold voltages, degradation of the data retention capability of the memory cells may be reduced.

Abstract: A method of forming an integrated DMOS transistor/EEPROM cell includes forming a first mask over a substrate, forming a drift implant in the substrate using the first mask to align the drift implant, simultaneously forming a first floating gate over the drift implant, and a second floating gate spaced apart from the drift implant, forming a second mask covering the second floating gate and covering a portion of the first floating gate, forming a base implant in the substrate using an edge of the first floating gate to self-align the base implant region, and simultaneously forming a first control gate over the first floating gate and a second control gate over the second floating gate. The first floating gate, first control gate, drift implant, and base implant form components of the DMOS transistor, and the second floating gate and second control gate form components of the EEPROM cell.

Abstract: A method of forming an integrated DMOS transistor/EEPROM cell includes forming a first mask over a substrate, forming a drift implant in the substrate using the first mask to align the drift implant, simultaneously forming a first floating gate over the drift implant, and a second floating gate spaced apart from the drift implant, forming a second mask covering the second floating gate and covering a portion of the first floating gate, forming a base implant in the substrate using an edge of the first floating gate to self-align the base implant region, and simultaneously forming a first control gate over the first floating gate and a second control gate over the second floating gate. The first floating gate, first control gate, drift implant, and base implant form components of the DMOS transistor, and the second floating gate and second control gate form components of the EEPROM cell.

Abstract: A semiconductor memory device includes a connecting member including a semiconductor material, a first electrode film, a first insulating film, a stacked body and three or more semiconductor pillars. The stacked body includes second electrode films and second insulating films that alternately stacked. The semiconductor pillars are arrayed along two or more directions, extend in a stacking direction, pierce through the stacked body and the first insulating film, and are connected to the connecting member. The device includes a third insulating film provided between the semiconductor pillars and the stacked body and between the connecting member and the first electrode film. A charge storage layer is provided at least between one of the second electrode films and the third insulating film.

Abstract: In an OTP memory storing a one-bit of the data by two gate insulating film destruction type nonvolatile memory cells where a same bit line is connected and different word lines are connected, writings and readings of the data for selected two nonvolatile memory cells constituting one-bit are performed by simultaneously selecting the selected two nonvolatile memory cells, and verifications for the selected two nonvolatile memory cells are performed by individually selecting one and the other of the selected two nonvolatile memory cells one by one.

Abstract: A method of forming an integrated DMOS transistor/EEPROM cell includes forming a first mask over a substrate, forming a drift implant in the substrate using the first mask to align the drift implant, simultaneously forming a first floating gate over the drift implant, and a second floating gate spaced apart from the drift implant, forming a second mask covering the second floating gate and covering a portion of the first floating gate, forming a base implant in the substrate using an edge of the first floating gate to self-align the base implant region, and simultaneously forming a first control gate over the first floating gate and a second control gate over the second floating gate. The first floating gate, first control gate, drift implant, and base implant form components of the DMOS transistor, and the second floating gate and second control gate form components of the EEPROM cell.

Abstract: Methods applying a non-zero voltage differential across a memory cell not involved in an access operation can facilitate improved data retention characteristics.

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.

Abstract: A nonvolatile semiconductor memory device according to an aspect includes a semiconductor substrate, a memory cell array, memory strings, drain side selection transistors, source side selection transistors, word lines, bit lines, a source line, a drain side selection gate line, a source side selection gate line, and a control circuit. The control circuit applies a first voltage to a selected bit line, thereby executing an erase operation on a selected memory string connected to the selected bit line, and the control circuit applies a second voltage to a non-selected bit line, thereby prohibiting the erase operation for the selected memory string connected to the non-selected bit line. The first voltage is more than the second voltage.

Abstract: A non-volatile memory system that has junctionless transistors is provided that uses suppression of the formation of an inversion-layer source and drain in the junctionless transistors to cause a discontinuous channel in at least one string. The system may include NAND flash memory cells composed of junctionless transistors, and has a set of wordlines. During program operation, a selected wordline of the set of wordlines is biased at a program voltage, and wordline voltage low enough to suppress the formation of source/drains is applied on at least one word line on a source side of the selected wordline such that a channel isolation occurs thereby causing the discontinuous channel in the at least string.

Abstract: A nonvolatile semiconductor memory device includes memory cells arranged into memory strings with word lines each connected to a different memory cell of the memory strings. The device also includes bit lines each connected to a different memory string and a column decoder connected to the bit lines. The column decoder includes sense amplifiers, data latches, and a data bus connecting sense amplifiers and data latches. The data bus is divided into at least two portions and includes a first portion connected to a second portion by a switch.

Abstract: According to one embodiment, a semiconductor memory device includes memory units each includes a first transistor, memory cell transistors, and a second transistor serially coupled between first and second ends. A memory cell transistor of each memory unit has its gate electrode coupled to each other. A bit line is coupled to the first ends. First and second drivers output voltage applied to selected and unselected first transistors, respectively. Third and fourth drivers output voltage applied to selected and unselected second transistors, respectively. A selector couples the gate electrode of the first transistor of each memory unit to the first or second driver, and that of the second transistor of each memory unit to the third or fourth driver.

Abstract: According to one embodiment, a semiconductor memory device includes n (n being a natural number of 2 or more) data retention circuits connected to a data input/output terminal; n buses connected respectively to the n data retention circuits; m×n data latch circuits connected to the buses, with m (m being a natural number of 2 or more) data latch circuits being connected per one of the buses; and a selection circuit configured to simultaneously perform data transfer from/to the data retention circuits for a plurality of the data latch circuits in units of a group including the plurality of the data latch circuits, the data latch circuits being divided into the groups so that not all the data latch circuits connected to the same bus are included in the same group.

Abstract: This nonvolatile semiconductor memory device comprises: a memory cell array configured having a plurality of blocks arranged therein, each of the blocks configured as an arrangement of NAND cell units, each of the NAND cell units configured having a plurality of electrically rewritable memory cells and a select transistor connected in series; and a row decoder configured to select anyone of the blocks of the memory cell array and supply to any one of said blocks a voltage required in various kinds of operations. The row decoder comprises: a plurality of first transfer transistors each disposed in a first region and connected to any one of the memory cells; and a plurality of second transfer transistors each disposed in a second region and connected to the select transistor, the second region being a residual region of the first region.

Abstract: A semiconductor memory device according to an embodiment includes a memory cell array that includes a plurality of cell columns each configured by a plurality of memory cells, and a column control circuit that includes a plurality of sense amplifier-data latch units each including a plurality of sense amplifiers that detect and amplify data of the memory cells and a plurality of data latches. One of the plurality of sense amplifier-data latch units is a first sense amplifier-data latch unit and another of the plurality of sense amplifier-data latch units is a second sense amplifier-data latch unit, the first sense amplifier-data latch unit and the second sense amplifier-data latch unit having different numbers of the cell columns capable of being handled.

Abstract: A semiconductor memory device includes stacked memory strings in which at least some adjacent memory strings share a common source line. During a read operation for a selected memory string, a first current path is formed from a bit line of the selected memory string to the common source line through the selected memory string. A second current path is formed from the bit line of the selected memory string, through the common source line, to a bit line of an adjacent unselected memory string. This reduced path resistance enhances device reliability in read mode.

Abstract: A memory device includes an array of memory cells arranged as a plurality of rows and columns, each row being coupled to an associated read word line, and each column forming at least one column group, where the memory cells of each column group are coupled to an associated read bit line. Each column group includes circuitry to precharge the associated read bit line to a first voltage level prior to the read operation. Each memory cell has coupling circuitry connected between the associated read bit line and a second voltage level different to the first voltage level. During read operation the coupling circuitry associated with the activated memory cell selectively discharges the associated read bit line towards the second voltage level dependent on the data value stored within that activated memory cell. The clamping circuitry connects the associated read bit line to the second voltage level.

Abstract: According to one embodiment, a configuration memory includes first and second data lines, a first memory string which comprises at least first and second nonvolatile memory transistors which are connected in series between a common node and the first data line, a second memory string which comprises at least third and fourth nonvolatile memory transistors which are connected in series between the common node and the second data line, and a flip-flop circuit which comprises a first data holding node connected to the common node and a second data holding node connected to a configuration data output node.

Abstract: A semiconductor memory device includes a stacked structure including a plurality of wordline structures sequentially stacked that each include: a plurality of wordlines with sidewalls and extending in a first direction on the substrate, and a connecting pad extending in a second direction on the substrate and being connected in common to the plurality of wordlines. A plurality of interconnections at a height over the substrate are connected to the connecting pads of the wordline structures, respectively. The device further includes bitlines substantially vertical to a top surface of the substrate and crossing one of the sidewalls of the plurality of wordlines, and memory elements between the bitlines and the plurality of wordlines, respectively. A length of the connecting pad in the second direction is substantially equal to a product of a minimum pitch between the interconnections and a stack number of one of the plurality of wordlines.

Abstract: In non-volatile memory devices, a write typically consists of an alternating set of pulse and verify operations. At the end of a pulse, the device must be biased properly for an accurate verify, after which the device is re-biased for the next pulse. The intervals between the pulse and verify phases are considered. For the interval after a pulse, but before establishing the verify conditions, the source, bit line, and, optionally, the well levels can be equalized and then regulated at a desired DC level. After a verify phase, but before applying the biasing the memory for the next pulse, the source and bit line levels can be equalized to a DC level.

Abstract: Embodiments of present invention relate to a nonvolatile memory device that includes a first page buffer controlling any one of a first even bit line and a first odd bit line; a second page buffer controlling any one of a second even bit line and a second odd bit line; wherein the second page buffer operates the second odd bit line according to program when the first page buffer operates the first even bit line according to program, and the second page buffer operates the second even bit line according to program when the first page buffer operates the first odd bit line according to program.

Abstract: A semiconductor memory has main bit lines paralleled by fixed potential lines in an alternating arrangement. Each main bit line is switchably connected to two sub-bit lines. The memory cells connected to one of the two sub-bit lines are placed below the main bit line. The memory cells connected to the other one of the two sub-bit lines are placed below an adjacent fixed potential line. The fixed potential lines prevent parasitic capacitive coupling between the main bit lines and thereby speed up read access to the memory cells without taking up extra layout space.

Abstract: Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide.

Abstract: A three dimensional stacked nonvolatile semiconductor memory according to examples of the present invention includes a memory cell array comprised of first and second blocks disposed side by side and a driver disposed between the first and second blocks. At least two conductive layers having the same structure as that of the at least two conductive layers in the first and second blocks are disposed on the driver, and select gate lines in the first and second blocks are connected to the driver through the at least two conductive layers on the driver.

Abstract: The present invention discloses a multilevel resistive memory having large storage capacity, which belongs to a field of a fabrication technology of a resistive memory. The resistive memory includes an top electrode and a bottom electrode, and a combination of a plurality of switching layers and defective layers interposed between the top electrode and the bottom electrode, wherein, the top electrode and the bottom electrode are respectively contacted with a switching layer (a film such as Ta2O5, TiO2, HfO2), and the defective layers (metal film such as Ti, Au, Ag) are interposed between the switching layers. By using the present invention, a storage capacity of a resistive memory can be increased.

Abstract: At least one data-line pair has a first data line aligned with a first column of memory cells and a second data line aligned with a second column of memory cells. The first data line is coupled to the second column of memory cells and the second data line is coupled to the first column of memory cells.

Abstract: Three-dimensional (3D) nonvolatile memory devices include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region. A recess is provided, which extends partially (or completely) through the common source region. A vertical stack of nonvolatile memory cells are provided on the substrate. This vertical stack of nonvolatile memory cells includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess. Gate dielectric layers are provided, which extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region.

Abstract: A nonvolatile semiconductor memory device includes memory cells arranged into memory strings with word lines each connected to a different memory cell of the memory strings. The device also includes bit lines each connected to a different memory string and a column decoder connected to the bit lines. The column decoder includes sense amplifiers, data latches, and a data bus connecting sense amplifiers and data latches. The data bus is divided into at least two portions and includes a first portion connected to a second portion by a switch.

Abstract: According to one embodiment, a nonvolatile memory device includes a substrate, a first electrode, a second electrode, a third electrode, a first memory portion and a second memory portion. The first electrode extends in a first direction and is provided on the substrate. The second electrode extends in a second direction crossing the first direction and is provided on the first electrode. The third electrode extends in a third direction crossing the second direction and is provided on the second electrode. The first memory portion is provided between the first and the second electrodes and has a first oxygen composition ratio and a first layer thickness. The second memory portion is provided between the second and the third electrodes and has at least one of a second oxygen composition ratio different from the first oxygen composition ratio and a second layer thickness different from the first layer thickness.

Abstract: In a NAND non-volatile memory system, a sensing process accounts for a relative position of a selected non-volatile storage element in a NAND string. In one approach, the storage elements are assigned to groups based on their position, and each group receives a common sensing adjustment during a verify or read process. A group which is closest to a source side of the NAND string may be the largest of all the groups, having at least twice as many storage elements as the other groups. The adjusting can include adjusting a sensing parameter such as body bias, source voltage, sensing time or sensing pre-charge level, based on the position of the sensed storage element or its associated word line position. The adjusting of the sensing may also be based on the control gate voltage and the associated data state involved in a specific sensing operation.

Abstract: A three-dimensional semiconductor device includes stacked structures arranged two-dimensionally on a substrate, a first interconnection layer including first interconnections and disposed on the stacked structures, and a second interconnection layer including second interconnections and disposed on the first interconnection layer. Each of the stacked structures has a lower region including a plurality of stacked lower word lines, and an upper region including a plurality of stacked upper word lines disposed on the stack of lower word lines. Each of the first interconnections is connected to one of the lower word lines and each of the second interconnections is connected to one of the upper word lines.

Abstract: A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column.

Abstract: A multi-level cell NOR flash memory device includes a plurality of gate lines, a plurality of source regions, a plurality of drain regions, a plurality of source lines, a plurality of bitlines, and a plurality of power lines. The bitlines each have a specific sheet resistance. A specific number of the bitlines are disposed between two adjacent ones of the power lines. Accordingly, the multi-level cell NOR flash memory device is of a high transconductance and uniformity and thereby features an enhanced conforming rate.

Abstract: Program disturb is reduced in a non-volatile storage system by programming storage elements on a selected word line WLn in separate groups, according to the state of their WLn?1 neighbor storage element, and applying an optimal pass voltage to WLn?1 for each group. Initially, the states of the storage elements on WLn?1 are read. A program iteration includes multiple program pulses. A first program pulse is applied to WLn while a first pass voltage is applied to WLn?1, a first group of WLn storage elements is selected for programming, and a second group of WLn storage elements is inhibited. Next, a second program pulse is applied to WLn while a second pass voltage is applied to WLn?1, the second first group of WLn storage elements is selected for programming, and the first group of WLn storage elements is inhibited. A group can include one or more data states.

Abstract: A low-voltage EEPROM array, which has a plurality of parallel bit lines, parallel word lines and parallel common source lines is disclosed. The bit lines include a first bit line. The word lines include a first word line and a second word line. The common source lines include a first common source line and a second common source line. The low-voltage EEPROM array also has a plurality of sub-memory arrays. Each sub-memory array includes a first memory cell and a second memory cell. The first memory cell connects with the first bit line, the first common source line and the first word line. The second memory cell connects with the first bit line, the second common source line and the second word line. The first and second memory cells are symmetrical and arranged between the first and second common source lines.

Abstract: Memory cells utilizing dielectric charge carrier trapping sites formed in trenches provide for non-volatile storage of data. The memory cells of the various embodiments have two control gates. One control gate is formed adjacent the trench containing the charge carrier trap. The other control gate has a portion formed over the trench, and, for certain embodiments, this control gate may extend into the trench. The charge carrier trapping sites may be discrete formations on a sidewall of a trench, a continuous layer extending from one sidewall to the other, or plugs extending between sidewalls.

Abstract: A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

Abstract: A nonvolatile semiconductor memory device includes a first stack unit with a first selection transistor and a second selection transistor formed on a semiconductor substrate and a second stack unit with first insulating layers and first conductive layers stacked alternately on the upper surface of the first stack unit. The second stack unit includes a second insulating layer formed in contact with side walls of the first insulating layer and the first conductive layer, a charge storage layer formed in contact with the second insulating layer for storing electrical charges, a third insulating layer formed in contact with the charge storage layer, and a first semiconductor layer formed in contact with the third insulating layer so as to extend in a stacking direction, with one end connected to one diffusion layer of the first selection transistor and the other end connected to a diffusion layer of the second selection transistor.

Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.

Abstract: Program disturb is reduced in a non-volatile storage system by programming storage elements on a selected word line WLn in separate groups, according to the state of their WLn?1 neighbor storage element, and applying an optimal pass voltage to WLn?1 for each group. Initially, the states of the storage elements on WLn?1 are read. A program iteration includes multiple program pulses. A first program pulse is applied to WLn while a first pass voltage is applied to WLn?1, a first group of WLn storage elements is selected for programming, and a second group of WLn storage elements is inhibited. Next, a second program pulse is applied to WLn while a second pass voltage is applied to WLn?1, the second first group of WLn storage elements is selected for programming, and the first group of WLn storage elements is inhibited. A group can include one or more data states.