Abstract: Methods, systems, and devices for status check using chip enable pin are described. An apparatus may include a memory device, a pin coupled with the memory device, and a driver coupled with the pin and configured to bias the pin to a first a voltage or a second voltage based on a status of the memory device. The status may indicate, for example, whether the memory device is available to receive a command. The driver may bias the pin to a first voltage based on a first status of the memory device indicating that the memory device is busy. Additionally, or alternatively, the driver may bias the pin to a second voltage based on a second status of the memory device indicating that the memory device is available to receive the command. In some cases, the pin may be an example of a chip enable pin.

Abstract: Disclosed herein are related to a memory system including a memory cell and a circuit to operate the memory cell. In one aspect, the circuit includes a pair of transistors to electrically couple, to the bit line, a selected one of i) a voltage source to supply a reference voltage to the memory cell or ii) a sensor to sense a current through the memory cell. In one aspect, the circuit includes a first transistor. The first transistor and the bit line may be electrically coupled between the pair of transistors and the memory cell in series.

Abstract: According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.

Abstract: Provided are a memory controller and memory system having an improved threshold voltage distribution characteristic and an operating method of the memory system. As a write request of data with respect to a first block is received, an erase program interval (EPI) is determined denoting a time period elapsed after erasure of the first block. When the determined EPI is equal to or less than a reference time, data is programmed to the first block based on a first operation condition selected from among a plurality of operation conditions. When the determined EPI is greater than the reference time, the data is programmed to the first block based on a second operation condition selected from among the plurality of operation conditions.

Abstract: Disclosed herein are related to a memory system including a memory cell and a circuit to operate the memory cell. In one aspect, the circuit includes a pair of transistors to electrically couple, to the bit line, a selected one of i) a voltage source to supply a reference voltage to the memory cell and ii a sensor to sense a current through the memory cell. In one aspect, the circuit includes a first transistor. The first transistor and the bit line may be electrically coupled between the pair of transistors and the memory cell in series.

Abstract: A memory device and an operation method thereof is disclosed. The memory device includes a static random access memory (SRAM) cell, a power-supply assist-voltage generator circuit, a source assist-voltage generator circuit, and a word-line assist-voltage generator circuit. The power-supply assist-voltage generator circuit, the source assist-voltage generator circuit, and the word-line assist-voltage generator circuit lower the effective supply voltage for un-accessed rows of memory cells in the hold mode, increase the effective supply voltage for accessed memory cells in the active mode, and lower the effective supply voltage further for all the SRAM cells in the standby mode to achieve a solution for active and standby power reduction besides achieving the stability and noise margins.

Abstract: Structures for a non-volatile memory and methods of forming such structures. A gate electrode and a gate dielectric layer are formed over an active region with the gate dielectric layer between the gate electrode and the active region. A first doped region is formed in the active region, a second doped region is formed in the active region, and a source line is coupled to the second doped region. The first doped region is positioned in the active region at least in part beneath the gate dielectric layer, and the second doped region is positioned in the active region adjacent to the first doped region. The first doped region has a first conductivity type, and the second doped region has a second conductivity type opposite to the first conductivity type.

Abstract: The present disclosure includes multifunctional memory cells. A number of embodiments include a gate element, a charge transport element, a first charge storage element configured to store a first charge transported from the gate element and through the charge transport element, wherein the first charge storage element includes a nitride material, and a second charge storage element configured to store a second charge transported from the gate element and through the charge transport element, wherein the second charge storage element includes a gallium nitride material.

Abstract: Provided is a semiconductor device capable of improving relative accuracy of semiconductor elements and a yield of a semiconductor integrated circuit device. The semiconductor device includes a flat region formed on a surface of a semiconductor substrate, and having an outer peripheral shape formed by regional sides and regional chamfer portions; an outer peripheral region surrounding the flat region, and having a uniform height different from a height of the flat region; a plurality of semiconductor elements having similar shapes or the same shape, and formed on the flat region; and a wiring metal connecting the plurality of semiconductor elements via contact holes formed in a second insulating film on the semiconductor elements.

Abstract: An operating method of an EEPROM cell is provided. The EEPROM cell comprises a transistor structure disposed on a semiconductor substrate and the transistor structure comprises a first electric-conduction gate. The-same-type ions are implanted into the semiconductor substrate between an interface of its source, drain and the first electric-conduction gate, or into the ion doped regions of the source and the drain, so as to increase ion concentrations in the implanted regions and reduce voltage difference in writing and erasing operations. The operating method of the EEPROM cell provides an operating condition that the drain or the source is set as floating during operations, to achieve the objective of rapid writing and erasing of a large number of memory cells. The proposed operating method is also applicable to the EEPROM cell having a floating gate structure in addition to a single gate transistor structure.

Abstract: A memory array includes (a) multiple memory cells arranged into a plurality of bytes, (b) a separate word line connected to each byte, and (b) multiple shared source lines, each connected to at least two bytes, such that each byte in the array is addressable by a separate word line and by the shared source line. Due to this memory array architecture, a program operation on a first byte applies a shared source line voltage on a non-selected second byte (with an inhibit voltage applied to bit lines connected to the second byte), which creates a disturb condition that corresponds with a diagonal (or row) program disturb condition in a conventional memory array. The use of the shared source lines may reduce the required number of source line drivers, which reduces the overhead area of the memory array, and at same time, allow backward compatibility of traditional byte-alterable EEPROM.

Abstract: A memory structure includes a first memory cell, a first word line and a second word line. The first word line includes a first portion, a second portion and a third portion. The first portion extends from an end of the second portion along a first direction, and the third portion extends from an another end of the second portion along a second direction. An angle between the first direction and the second direction is less than 180°. The second word line includes a forth portion, a fifth portion and a sixth portion. The forth portion extends from an end of the fifth portion along a third direction, and the sixth portion extends from an another end of the fifth portion along a forth direction. An angle between the third direction and the forth direction is less than 180°.

Abstract: A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Abstract: Disclosed is a non-volatile memory (NVM) device including an array of NVM cells segmented into at least a first sector and a second sector and at least one sensing circuit to sense a state of a target NVM cell in the first sector using a reference current of the second sector received from at least a dynamic reference cell.

Abstract: A semiconductor memory device includes a memory cell array having first wires, a second wire, and memory cells connected to the first and second wires, and a control circuit that can apply writing voltages to the second wire. One of the memory cells connected to the selected second wire and a selected first wire is a selected memory cell. One of the memory cells connected to the selected second wire and an unselected first wire is a semi-selected memory cell. When writing data into the selected memory cell, the control circuit selects one from the writing voltages and applies the one writing voltage to a third wire connected to the selected second wire. The control circuit selects the one writing voltage, based on a first current flowing through the second wire when each of the memory cells connected to the selected second wire are set as semi-selected memory cells.

Abstract: Nonvolatile memory devices includes a charge storage element having a MOS capacitor structure and including a control gate terminal connected to a word line and a body terminal connected to a body bias line, a first half-MOS transistor having a first selection gate terminal connected to the word line and a first impurity junction terminal connected to a bit line and sharing the body terminal with the charge storage element, and a second half-MOS transistor having a second selection gate terminal connected to the word line and a second impurity junction terminal connected to a source line and sharing the body terminal with the charge storage element. The charge storage element is coupled between the first and second half-MOS transistors so that the first half-MOS transistor, the charge storage element, and the second half-MOS transistor are connected in series.

Abstract: An integrated circuit device includes a first module disposed within a first power domain, a second module disposed in a second power domain that is a sub-domain of the first power domain, first power gating logic, and second power gating logic. The first power gating logic generates a first virtual power supply for the first module. The second power gating logic is powered by the first virtual power supply for generating a second virtual power supply for the second power domain.

Abstract: A lateral MOSFET comprises a plurality of isolation regions formed in a substrate, wherein a first isolation region is of a top surface lower than a top surface of the substrate. The lateral MOSFET further includes a gate electrode layer having a first gate electrode layer formed over the first isolation region and a second gate electrode layer formed over the top surface of the substrate, wherein a top surface of the first gate electrode layer is lower than a top surface of the second gate electrode layer.

Abstract: According to example embodiments, a nonvolatile memory device includes a first memory cell configured to store a first data pattern, a second memory cell configured to be programmed using a program voltage, and a coupling program control unit. The coupling program control unit may be configured to perform a verification operation for verifying whether the first memory cell is programmed with the first data pattern. The verification operation may provide to the first memory cell a verification voltage corresponding to the first data pattern. The coupling program control unit may be configured to end programming the second memory cell when the verification operation on the first memory cell indicates a pass.

Abstract: Memory cells with read assist schemes and methods of use are provided. The memory includes a plurality of rows and columns, each of which include a memory cell having a pull-down device. The memory further includes at least one boost circuit connected to each of the memory cells and which provides a negative boost signal to the pull-down devices during read access.

Abstract: According to an embodiment, a load adjusting circuit adjusts the load of an inverter circuit based on a threshold voltage of a first conductive type transistor provided on the inverter circuit, and a driving force adjusting circuit adjusts the driving force of the inverter circuit based on the threshold voltage of the first conductive type transistor.

Abstract: The present disclosure relates to a BCH encoding, decoding, and multi-stage decoding circuits and method, and an error correction circuit of a flash memory device using the same. The concatenated BCH multi-stage decoding circuit includes: a first stage encoding unit that receives a part or all of data input to a flash memory device, performs BCH encoding, and outputs a first output BCH code or a parity bit thereof; an interleaving unit that receives a part or all of data input to the flash memory device, interleaves, and outputs the data, and a second stage encoding unit that performs BCH encoding of the BCH code or data that is the output of the interleaving unit, and outputs a second output BCH code or a parity bit thereof.

Abstract: Memory cells having split charge storage nodes and methods for fabricating memory cells having split charge storage nodes are disclosed. A disclosed method includes forming a first trench and an adjacent second trench in a semiconductor substrate, the first trench and the second trench each defining a first sidewall and a second sidewall respectively and forming a first source/drain region in the substrate and a second source/drain region in the substrate, where the first source/drain region and the second source/drain region are formed substantially under the first trench and the second trench in the semiconductor substrate respectively. Moreover, a method includes forming a bit line punch through barrier in the substrate between the first source/drain region and the second source drain region and forming a first storage element on the first sidewall of the first trench and a second storage element on the second sidewall of the second element.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: The present invention provides a nonvolatile memory cell string and a memory array using the same. According to the present invention, a wall type semiconductor separated into twin fins and a memory cell string formed with memory cells having a gated diode structure along each fin are enabled to increase the degree of integration and basically prevent the interferences between adjacent cells. And a first semiconductor layer and a depletion region of a PN junction wrapped up by a gate electrode are enabled to remove GSL and CSL by GIDL memory operation and significantly increase the degree of integration for applying to a neuromorphic technology.

Abstract: A memory device includes a memory cell array and a column decoder. The memory cell array includes a plurality of even local bit lines and a plurality of odd local bit lines. The column decoder includes a plurality of even pass transistors, a plurality of even clamp transistors, a plurality of odd pass transistors, and a plurality of odd clamp transistors. Each of the even clamp transistors has a control terminal coupled to an even clamp line, a first terminal coupled to a respective one of the even local bit lines, and a second terminal coupled to a ground voltage. Each of the odd clamp transistors has a control terminal coupled to an odd clamp line, a first terminal coupled to a respective one of the odd local bit lines, and a second terminal coupled to the ground voltage.

Abstract: A flash memory module may include a plurality of flash memory chips. The memory chips may include one or more blocks. Each block may be a unit of erasing data. A flash controller may be coupled to the plurality of flash memory chips. The flash controller may program data to block and erase data from a block. The flash controller may manage a recent programming time for each of the plurality of blocks. The flash controller may erase data stored in a block for which an elapsed programming time is larger than a first value.

Abstract: A Read Only Memory (ROM) bitline cell apparatus and programming method therefore. The programming methodology ensures a ROM structure having open state and/or breaks in the diffusion and/or dummy wordline rows to provide bitline load balancing. The ROM bitline cell apparatus and programming method exhibits improved load balancing for any combination of 1's or all 0's on the bitline. The programming methodology identifies groups of consecutive ‘1’s on the bitline and instead of connecting the ‘1’ devices between BL/BL or GND/GND, those ‘1’ devices can be connected between BL/OPEN, OPEN/BL, GND/OPEN, OPEN/GND or OPEN/OPEN. With little or no variation in bitline loading, timing can be optimized for that single case of bitline loading.

Abstract: A Read Only Memory (ROM) and method for providing a high operational speed with reduced leakage, no core cell standby leakage, and low power consumption. The source of the ROM cell (NMOS) is connected to a virtual ground line (VNGD) instead of VSS. Thus, the ROM cell can be operatively coupled to the bit-line, the word-line, and the virtual ground, which also acts as a column select signal. The arrangement of the ROM is such that the virtual ground of the selected column is pulled down to a ground voltage. Non-selected columns virtual ground can be maintained at a supply voltage to ensure that unwanted columns will not have any sub-threshold current (as Vds=0). Since no pre-charging of bit-line comes in the access time path, the ROM achieves a high operational speed with reduced leakage and low power consumption.

Abstract: In non-volatile memory devices, a write typically consists of an alternating set of pulse and verify operations. At the end of a pulse, the device must be biased properly for an accurate verify, after which the device is re-biased for the next pulse. The intervals between the pulse and verify phases are considered. For the interval after a pulse, but before establishing the verify conditions, the source, bit line, and, optionally, the well levels can be equalized and then regulated at a desired DC level. After a verify phase, but before applying the biasing the memory for the next pulse, the source and bit line levels can be equalized to a DC level.

Abstract: An embodiment of the invention provides a semiconductor device that includes: a memory cell array that includes non-volatile memory cells; a first selecting circuit that connects or disconnects a source and a drain of a transistor that forms one of the memory cells, to or from a data line DATAB connected to a first power supply; and a second selecting circuit that connects or disconnects the source and drain to or from a ground line ARVSS connected to a second power supply. In this semiconductor device, the first selecting circuit and the second selecting circuit are arranged on the opposite sides of the memory cell array. One embodiment of the invention also provides a method of controlling the semiconductor device.

Abstract: A circuit includes a memory array comprising K number of rows. The circuit further including a reference column. The reference column includes M cells of a first cell type configured to provide a first leakage current, K-M cells of a second cell type different from the first cell type, the K-M cells are configured to provide a second leakage current, and a reference data line connected to the cells of the first cell type and the cells of the second cell type. The circuit further includes a sensing circuit configured to determine a value stored in a memory cell of the memory array based on a voltage of the reference data line.

Abstract: A memory device comprises a main memory array having a plurality of bit lines, and a select array having a plurality of transistors coupled to the bit lines. Wherein one of the plurality of transistors is electrically programmed to a threshold voltage greater than a threshold voltage of another one of the plurality of transistors.

Abstract: A semiconductor memory has main bit lines paralleled by fixed potential lines in an alternating arrangement. Each main bit line is switchably connected to two sub-bit lines. The memory cells connected to one of the two sub-bit lines are placed below the main bit line. The memory cells connected to the other one of the two sub-bit lines are placed below an adjacent fixed potential line. The fixed potential lines prevent parasitic capacitive coupling between the main bit lines and thereby speed up read access to the memory cells without taking up extra layout space.

Abstract: Bit lines connected to each nonvolatile memory cell are selected by corresponding selective transistors. A first drive circuit for driving the gate of one of the selective transistors receives a voltage selected by a first voltage switch, and a second drive circuit for driving the gate of the other selective transistor receives a voltage selected by a second voltage switch. A transistor constituting the first drive circuit is different in structure from a transistor constituting the second drive circuit.

Abstract: A semiconductor storage apparatus stores management information comprising, for each block of a nonvolatile semiconductor memory, information denoting at least one of a recent programming time, which is a time at which data is recently programmed to a block, and a recent erase time, which is a time at which an erase process is recently carried out with respect to a block. The semiconductor storage apparatus (b1) controls a timing at which data is programmed to a block based on at least one of the recent programming time and the recent erase time of this block, and/or (b2) controls a timing at which an erase process is carried out with respect to a block based on the recent programming time of this block.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A memory device includes a memory cell array including a plurality of memory cells, a common source line to which sources of the plurality of memory cells are commonly connected, and a second electrical connection path further connecting the common source line to a ground voltage using erase-mode memory cells when the common source line forms a first electrical connection path and is connected to the ground voltage.

Abstract: Memory devices are disclosed, such as those that include a semiconductor-on-insulator (SOI) NAND memory array having a boosting plate. The boosting plate may be disposed in an insulator layer of the SOI substrate such that the boosting plate exerts a capacitive coupling effect on a p-well of the memory array. Such a boosting plate may be used to boost the p-well during program and erase operations of the memory array. During a read operation, the boosting plate may be grounded to minimize interaction with p-well. Systems including the memory array and methods of operating the memory array are also disclosed.

Abstract: A method of programming a nonvolatile memory device comprises applying positive pulses and negative pulses simultaneously to a memory cell array to program at least one memory cell included in the memory cell array.

Abstract: A nonvolatile memory device comprises a memory cell array comprising a plurality of memory blocks, an address decoder that selects one of the memory blocks in response to an input address and generates a first control signal and a second control signal, a plurality of metal lines connected with the memory blocks and extending along a first direction, a plurality of pass transistors that connect the address decoder with a first subset of the metal lines connected with the selected memory block in response to the first control signal, and a plurality of ground transistors that supply a low voltage to a second subset of the metal lines connected with unselected memory blocks in response to the second control signal. The ground transistors have channels that extend along a second direction perpendicular to the first direction.

Abstract: The invention provides a flash memory array structure and a method for programming the same, which relates to a technical field of nonvolatile memories in ultra large scale integrated circuit fabrication technology. The flash memory array of the present invention includes memory cells, word lines and bit lines connected to the memory cells, wherein the word lines connected to control gates of the memory cells and the bit lines connected to drain terminals of the memory cells are not perpendicular to each other but cross each other at an angle; the control gates of two memory cells adjacent to each other along the channel direction between every two bit lines are controlled by two word lines, respectively, drain terminals thereof are controlled by two bit lines, respectively, and source terminals thereof are shared. The present invention also provides a method for programming the flash memory array structure, which can realize a programming with low power consumption.

Abstract: A method includes minimizing current leaking through a virtual ground pipe during access of NROM memory cells. The minimizing includes operating two neighboring memory cells generally together, which includes connecting an operation voltage to a shared local bit line of the two neighboring memory cells and connecting the external local bit lines of two neighboring memory cells to a receiving unit, such as a ground supply or two sense amplifiers. Also included is an array performing the method.

Abstract: A processor includes a first virtual terminal, a second virtual terminal, circuitry coupled to the first virtual terminal for providing current to the first virtual terminal, a first regulating transistor coupled between the first virtual terminal and the second virtual terminal, a first disabling transistor coupled in parallel with the first regulating transistor for selectively disabling the first regulating transistor by directly connecting the second virtual terminal to the first virtual terminal, a second regulating transistor coupled between the second virtual terminal and a first power supply voltage terminal, and a second disabling transistor coupled in parallel with the second regulating transistor for selectively disabling the second regulating transistor by directly connecting the second virtual terminal to the first power supply voltage terminal.

Abstract: A semiconductor memory apparatus includes a write control code generation unit configured to generate a write control code which is updated at each pulsing timing of an external test pulse signal applied through a pad; and a data write unit configured to output a programming current pulse which has a magnitude corresponding to the code value of the write control code.

Abstract: A multi-dot flash memory includes active areas arranged in a first direction, which extend to a second direction crossed to the first direction, the first and second direction being parallel to a surface of a semiconductor substrate, floating gates arranged in the first direction, which are provided above the active areas, a word line provided above the floating gates, which extends to the first direction, and bit lines provided between the floating gates, which extend to the second direction. Each of the floating gates has two side surfaces in the first direction, shapes of the two side surfaces are different from each other, and shapes of the facing surfaces of the floating gates which are adjacent to each other in the first direction are symmetrical.

Abstract: Regardless of data values stored on data memory cells, all read operations on the data memory cells are disallowed. For example, current flow is disallowed through a string of the data memory cells and one or more select line memory cells. The particular select value stored in a first select line memory cell in the string, for example coupled to a ground select line or a string select line, determines whether the string is enabled or disabled.

Abstract: A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array.

Abstract: An embodiment of the invention provides a semiconductor device that includes: a memory cell array that includes non-volatile memory cells; a first selecting circuit that connects or disconnects a source and a drain of a transistor that forms one of the memory cells, to or from a data line DATAB connected to a first power supply; and a second selecting circuit that connects or disconnects the source and drain to or from a ground line ARVSS connected to a second power supply. In this semiconductor device, the first selecting circuit and the second selecting circuit are arranged on the opposite sides of the memory cell array. One embodiment of the invention also provides a method of controlling the semiconductor device.

Abstract: In a system having a plurality of non-volatile memory cells, a method includes performing hot carrier injection on a first non-volatile memory cell in a first mode of programming. In the first mode, current flows from a first current electrode to a second electrode of the first non-volatile memory cell and charge is transferred from the current to a floating gate of the first non-volatile memory cell at a location nearer the first current electrode than the second current electrode. The method further includes performing hot carrier injection on the first non-volatile memory cell in a second mode of programming. In the second mode, current flows from the second current electrode to the first electrode of the first non-volatile memory cell and charge is transferred from the current to the floating gate of the first non-volatile memory cell at a location nearer the second current electrode than the first current electrode.