Abstract: A nonvolatile memory device comprises a memory cell array wherein a plurality of memory cell transistors are divided into multiple erase blocks. The multiple erase blocks are separated from each other by dummy word lines. During an erase operation of one of the multiple blocks, a dummy word line separating the one of the multiple blocks from other erase blocks is driven with a coupling inhibition voltage.

Abstract: Two-bit programmable nonvolatile memory devices and methods of operating and fabricating the same are provided. The device comprises a plurality of device isolation layers, a plurality of word lines crossing over the device isolation layers, and a multiple insulation layer intervened between the word line and the active region. The multiple insulation layer includes a charge trap insulation layer. A source/drain region is formed at each region defined by adjacent word lines and the adjacent device isolation layers. The source/drain regions have the same surface area. A write operation of the device comprises applying a first level voltage, a ground voltage, and a write voltage to one bit line, another bit line, and a selected word line, thereby writing data into a charge trap insulation layer. By changing the voltages applied to the bit lines, 2 bits may be stored in one memory cell.

Abstract: A flash memory cell can be read by selecting a local bit line. A read potential is applied to a memory cell transistor associated with the local bit line thereby generating a capacitive loading of the local bit line. The capacitive loading depends upon a magnitude of charge stored on a floating gate of the memory cell transistor. The capacitive loading of the local bit line can then be assessed to determine a state of the memory cell transistor, the state being related to the magnitude of the charge stored on the floating gate.

Abstract: Disclosed are pairs of semiconductor flash memory cells including first and second source lines formed in a semiconductor substrate, semiconductor pillars extending from the substrate between the source lines, first and second charge storage structures formed on opposite side surfaces of the semiconductor pillar and separated by trench isolation structures. The x and y pitch separating adjacent semiconductor pillars in the memory cell array are selected whereby forming the trench isolation structures serves to separate both charge storage structures and conductive structures provided on opposite sides of a semiconductor pillars. Also disclosed are methods of fabricating such structures whereby the density of flash memory devices, particularly NOR flash memory devices, can be improved.

Abstract: An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.

Abstract: A memory cell with a charge storage structure is read by measuring current between the substrate region of the memory cell and one of the current carrying nodes of the memory cell. The read operation decreases the coupling between different parts of the charge storage structure when other parts of the charge storage structure store data that are not of interest. The sensing window of the memory cell can be greatly improved by this read operation. Example arrangements are a single memory cell, a column or NOR-connected memory cells, and a virtual ground array of memory cells.

Abstract: An array of memory cells configured to store at least one bit per one F2 includes substantially vertical structures providing an electronic memory function spaced apart a distance equal to one half of a minimum pitch of the array. The structures providing the electronic memory function are configured to store more than one bit per gate. The array also includes electrical contacts to the memory cells including the substantially vertical structures. The cells can be programmed to have one of a number of charge levels trapped in the gate insulator adjacent to the first source/drain region such that the channel region has a first voltage threshold region (Vt1) and a second voltage threshold region (Vt2) and such that the programmed cell operates at reduced drain source current.

Abstract: A dynamic programming method for a non-volatile storage device is described. Memory cells are provided arrayed in R rows. Sub bit lines are provided coupled to voltage supply lines through select circuits. During program operation, the select circuits are switched such that one or more of the source side sub bit line or the drain side sub bit line is floating when all other program voltages are applied to a selected cell.

Abstract: A programmable logic device (PLD) includes a non-volatile configuration memory. The non-volatile configuration memory is adapted to configure programmable resources (such as programmable logic and programmable interconnect) within the PLD. The non-volatile configuration memory may constitute a variety of memory types, for example, flash memory, erasable programmable read-only memory (EPROM), electrically erasable read-only memory (EEPROM), anti-fuse, and the like.

Abstract: A method for verifying an array cell of a memory device may include determining after each erase pulse or program pulse the threshold of a cell addressed through a selected array word-line and bit-line, by applying an identical voltage ramp to the selected array word-line and to the control gate of a reference cell, while biasing at a certain voltage deselected word-lines through distribution lines of the voltage generated by a charge pump generator. The method may further include temporarily decoupling the deselected word-lines from the distribution lines of the bias voltage for the duration of the voltage ramp.

Abstract: In order to speed up the search for a data item in a content addressable memory and to simplify the circuit structure of the memory having associated with each row of cells a ground control line, a ground line, a match control line, and with every row of cells there is associated a search activation terminal and a match indication terminal; a method of controlling the storage and retrieval of data in the memory utilizing a unique comparison strategy for determining when the content of a comparison register is found in the memory.

Abstract: A semiconductor device, such as a memory device or radiation detector, is disclosed, in which data storage cells are formed on a substrate. Each of the data storage cells includes a field effect transistor having a source, drain, and gate, and a body arranged between the source and drain for storing electrical charge generated in the body. The magnitude of the net electrical charge in the body can be adjusted by input signals applied to the transistor, and the adjustment of the net electrical charge by the input signals can be at least partially cancelled by applying electrical voltage signals between the gate and the drain and between the source and the drain.

Abstract: A one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. Access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.

Abstract: A compact dynamic random access memory (DRAM) cell and highly efficient methods for using the DRAM cell are disclosed. The DRAM cell provides reading, writing, and storage of a data bit on an ASIC chip. The DRAM cell includes a first transistor acting as a pass gate and having a first source node, a first gate node, and a first drain node. The DRAM cell also includes a second transistor acting as a storage device and having a second drain node that is electrically connected to the first drain node to form a storage node. The second transistor also includes a second source node and a second gate node. The second source node is electrically floating, thus increasing the effective storage capacitance of the storage node.

Abstract: A nonvolatile semiconductor memory device of a split gate structure having a gate of low resistance suitable to the arrangement of a memory cell array is provided. When being formed of a side wall spacer, a memory gate is formed of polycrystal silicon and then replaced with nickel silicide. Thus, its resistance can be lowered with no effect on the silicidation to the selection gate or the diffusion layer.

Abstract: A method of operating a non-volatile memory is provided, wherein the non-volatile memory at least includes: a gate structure formed by stacking a tunneling dielectric layer, charge trapping layer, a dielectric layer and a gate conducting layer sequentially, and a source region and a drain region. When the operating method is carried out, a ultraviolet is irradiated to the non-volatile memory to inject electrons into the charge trapping layer to erase the non-volatile memory, and a negative voltage is applied to the gate conductive layer and a positive voltage is applied to the drain region to program the non-volatile memory by band-to-band induced hot hole injection.

Abstract: An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.

Abstract: NVM arrays include rows and columns of NVM cells comprising a floating gate, dual transistor, inverter storage element. Supply voltage for selected storage elements is turned off during a programming and an erase mode. Isolation transistors for each NVM cell or for each row of NVM cells may be used to control the supply voltage.

Abstract: In a gate driving unit and a display apparatus, a first gate driving circuit is connected to a first end of a plurality of gate lines, a second gate driving circuit is connected to a second end of the gate lines, and they are substantially simultaneously turned on. The first and second gate driving circuits apply a first gate signal having a first pre-charging period and a first active period, which is adjacent to the first pre-charging period, to odd-numbered gate lines and apply a second gate signal having a second pre-charging period and a second active period, which is adjacent to the second pre-charging period, to even-numbered gate lines.

Abstract: There is disclosed a semiconductor integrated circuit device including a memory cell array having a plurality of blocks, a first non-volatile semiconductor memory cell which is arranged in the memory cell array and has an electric charge storage layer, and a second non-volatile semiconductor memory cell which is arranged in the memory cell array to be adjacent to the first non-volatile semiconductor memory cell and has an electric charge storage layer. Regular data writing is performed with respect to the second non-volatile semiconductor memory cell after regular data writing is carried out with respect to the first non-volatile semiconductor memory cell. Additional data writing is performed with respect to the first non-volatile semiconductor memory cell after regular data writing is carried out with respect to the second non-volatile semiconductor memory cell.

Abstract: An integrated circuit device comprising a memory cell array including a plurality of memory cells wherein each memory cell includes at least one electrically floating body transistor having source, drain and a body regions, wherein the body region is electrically floating and disposed between the source and drain regions; a gate is disposed over the body region. Each memory cell includes a first data state representative of a first charge in the body region and a second data state representative of a second charge in the body region. The integrated circuit device further includes operating characteristics adjustment circuitry, coupled to the memory cell array, to adjust one or more operating or response characteristics of one or more memory cells to improve the uniformity of operation/response characteristics of the memory cells of the memory cell array relative to the other memory cells of the array.

Abstract: The present invention relates to a floating-gate MOS transistor, comprising drain and source regions implanted into a silicon substrate, a channel extending between the drain and source regions, a tunnel oxide, a floating gate, a gate oxide and a control gate extending according to a determined gate length. According to the present invention, the control gate comprises a small gate and a large gate arranged side by side and separated by an electrically insulating material. Application to the production of memory cells without access transistor, and to the implementation of an erase-program method with reduced electrical stress for the tunnel oxide.

Abstract: Rewriteable electronic fuses include latches and/or logic gates coupled to one or more nonvolatile memory elements. The nonvolatile memory elements are configured to be programmed to memory values capable of causing associated electronic circuits to settle to predetermined states as power-up or reset signals are applied to the fuses. Although not required, the nonvolatile memory elements used in the rewriteable electronic fuses may comprise floating-gate transistors. An amount of charge stored on the floating gate of a given floating-gate transistor determines the memory value and, consequently, the state to which a fuse settles upon power-up or reset of the fuse.

Abstract: A semiconductor device, such as a memory device or radiation detector, is disclosed, in which data storage cells are formed on a substrate. Each of the data storage cells includes a field effect transistor having a source, drain, and gate, and a body arranged between the source and drain for storing electrical charge generated in the body. The magnitude of the net electrical charge in the body can be adjusted by input signals applied to the transistor, and the adjustment of the net electrical charge by the input signals can be at least partially cancelled by applying electrical voltage signals between the gate and the drain and between the source and the drain.

Abstract: A ground potential is applied to a first word line coupled to a control gate of a selected ferroelectric memory cell in an array of ferroelectric memory cells. A fraction of a programming voltage is applied to other word lines coupled to control gates of non-selected memory cells not associated with the first word line. The programming voltage is applied to a first program line coupled to a first source/drain region of the selected memory cell and to a first bit line coupled to a second source/drain region of the selected memory cell. A fraction of the programming voltage is applied to other program lines coupled to first source/drain regions of non-selected memory cells not associated with the first program line and to other bit lines coupled to second source/drain regions of non-selected memory cells not associated with the first bit line.

Abstract: A programming technique for a flash memory causes electrons to be injected from the substrate into charge storage elements of the memory cells. The source and drain regions of memory cells along a common word line or other common control gate line being programmed by a voltage applied to the common line are caused to electrically float while the source and drain regions of memory cells not being programmed have voltages applied thereto. This programming technique is applied to large arrays of memory cells having either a NOR or a NAND architecture.

Abstract: The integration period of an imaging cell, or the time that an imaging cell is exposed to light energy, is substantially increased by utilizing a single-poly, electrically-programmable, read-only-memory (EPROM) structure to capture the light energy. Photogenerated electrons are formed in the channel region of the EPROM structure from the light energy. The photogenerated electrons are then accelerated into having ionizing collisions which, in turn, leads to electrons being injected onto the floating gate of the EPROM structure at a rate that is proportionate to the number of photons captured by the channel region.

Abstract: Various embodiments address the problem of efficiently reading data from nonvolatile memory. Nonvolatile memory circuit, method, and manufacturing method embodiments relate to a virtual ground array of nonvolatile memory cells which are read by precharging the drains of multiple nonvolatile memory cells and measuring the resulting currents. Power consumption and read margins are improved by reading multiple cells. Unnecessary bit line precharging can be avoided.

Abstract: Methods for neutralizing holes in tunnel oxides of floating-gate memory cells and devices using a decrease in magnitude of a source voltage of a first polarity to increase the magnitude of a control gate voltage of a second polarity.

Abstract: An erasable programmable non-volatile memory cell encompasses an ion well; a first select transistor including a select gate, source/drain formed in the ion well, and a channel region formed between its source and drain; a first floating gate transistor having a drain, a source coupled to the drain of the first select transistor, a first floating gate channel region formed between its drain and source, and a common floating gate overlying the floating gate channel region; a second select transistor including a select gate, source/drain formed in the ion well, and a channel region formed between its source and drain; and a second floating gate transistor having a drain, a source coupled to the drain of the second select transistor, a second floating gate channel region formed between its drain and source, and the common floating gate overlying the second floating gate channel region.

Abstract: A one time programmable (OTP) memory has two-bit cells for increasing density. Each cell has two select transistors and a programmable transistor in series between the two select transistors. The programmable transistor has two independent storage locations. One is between the gate and a first source/drain region and the second is between the gate and a second source/drain region. The storage locations are portions of the gate dielectric where the sources or drains overlap the gate and are independently programmed by selectively passing a programming current through them. The programming current is of sufficient magnitude and duration to permanently reduce the impedance by more than three orders of magnitude of the storage locations to be programmed. The programming current is limited in magnitude to avoid damage to other circuit elements and is preferably induced at least in part by applying a negative voltage to the gate of the programming transistor.

Abstract: When an input voltage determining circuit 24 determines that an input voltage exceeds a prescribed voltage, a control circuit 25 of a positive polarity power selector circuit 22 turns on a first switch SW1 and turns off second and third switches SW2 and SW3, thereby supplying the input voltage to a memory cell array 21 via the first switch SW1. When the input voltage determining circuit 24 determines that the input voltage is not higher than the prescribed voltage, the control circuit 25 turns off the first switch SW1 and turns on the second and third switches SW2 and SW3, thereby supplying a voltage from a charge pump 23 via the second and third switches SW2 and SW3. By this operation, the memory element is able to retain storage of two bits or more even if miniaturized, to execute stable operation with a small circuit area and to prevent circuit malfunction attributed to a small current supplied to the memory cell array.

Abstract: The invention is directed to a layout of nonvolatile memory device. The memory cell has a gate electrode, a first doped electrode, and a second doped electrode. The first doped electrode is coupled to the bit line. The gate electrode is coupled to one separated word line. A shared coupled capacitor structure is coupled between all of memory cells of the adjacent bit lines from the second doped electrode. The capacitor structure has at least two floating-gate MOS capacitors. Each floating-gate MOS capacitor has a floating-gate transistor having a floating gate, a first S/D region and a second S/D region; and a MOS capacitor coupled to the floating gate. The first S/D region is coupled to the second doped electrode of the corresponding one of the transistor memory cells, and the second S/D region is shared with an adjacent one of the floating-gate transistor.

Abstract: A split NROM flash memory cell is comprised of source/drain regions in a substrate. The split nitride charge storage regions are insulated from the substrate by a first layer of oxide material and from a control gate by a second layer of oxide material. The nitride storage regions are isolated from each other by a depression in the control gate. In a vertical embodiment, the split nitride storage regions are separated by an oxide pillar. The cell is programmed by creating a positive charge on the nitride storage regions and biasing the drain region while grounding the source region. This creates a virtual source/drain region near the drain region such that the hot electrons are accelerated in the narrow pinched off region. The electrons become ballistic and are directly injected onto the nitride storage region that is adjacent to the pinched off channel region.

Abstract: A memory cell includes an N-type well, three P-type doped regions formed on the N-type well, a dielectric layer formed on the N-type well and between a first doped region and a second doped region of the three P-type doped regions, a first gate formed on the dielectric layer, a charge storage structure formed on the N-type well and between the second doped region and a third doped region of the three P-type doped regions, and a second gate formed on the charge storage structure. Data is stored in the memory cell by injecting electrons based on the channel-hot-hole induced hot-electron injection mechanism, the band-to-band tunneling induced electron injection mechanism and the Fowler-Nordheim tunneling mechanism. Data is erased from the memory cell by ejecting electrons based on the Fowler-Nordheim tunneling mechanism. Whether data is stored in the charge storage structure or not can be distinguished by read operation.

Abstract: Structures and methods for programmable memory address and decode circuits with low tunnel barrier interpoly insulators are provided. The decoder for a memory device includes a number of address lines and a number of output lines wherein the address lines and the output lines form an array. A number of logic cells are formed at the intersections of output lines and address lines. Each of the logic cells includes a floating gate transistor which includes a first source/drain region and a second source/drain region separated by a channel region in a substrate. A floating gate opposes the channel region and is separated therefrom by a gate oxide. A control gate opposing the floating gate. The control gate is separated from the floating gate by a low tunnel barrier intergate insulator. The low tunnel barrier intergate insulator includes a metal oxide insulator selected from the group consisting of PbO, Al2O3, Ta2O5, TiO2, ZrO2, Nb2O5 and/or a Perovskite oxide tunnel barrier.

Abstract: A semiconductor memory device includes: a memory cell array having word lines and bit lines disposed to cross each other, and memory cells disposed at crossings thereof; a controller configured to control operations of the memory cell array; and a word line drive circuit configured to set at least one of unselected word lines in an electrically floating state while driving a selected word line, based on input address and control signals output from said controller.

Abstract: A semiconductor integrated device having a plurality of memory cells, each including a floating gate, a control gate and an auxiliary gate formed over a side surface of the floating gate through an insulator film. Auxiliary gates coupled to selected memory cells function to generate hot electrons and are alternately arranged with other auxiliary gates functioning to prevent write errors in the non-selected memory cells.

Abstract: Operating voltages to a group of memory cells in an array are supplied via access lines such as word lines and bit lines. The capacitance of associated nodes of the memory cells can latch some of these voltages. Memory operation can continue using the latched voltages even when the access lines are disconnected. In a memory have an array of NAND chains, the capacitance of the channel of each NAND chain can latch a voltage to either enable or inhibit programming. The bit lines can then be disconnected during programming of the group and be used for another memory operation. In one embodiment, the bit lines are precharged for the next verifying step of the same group. In another embodiment, two groups of memory cells are being programmed contemporarily, so that while one group is being programmed, the other group can be verified with the use of the bit lines.

Abstract: A nonvolatile semiconductor memory includes a transistor, one or two resistance-change portions, and one or two charge accumulation portions. The transistor has a control electrode, first main electrode region, and second main electrode region. Each resistance-change portion is of a second conductivity type having impurity concentration lower than that of the first and second main electrode regions. The charge-accumulation portions are provided on the associated resistance-change portions. Each charge accumulation portion has an insulating layer, and is capable of accumulating charge.

Abstract: A string of memory cells with a charge trapping structure is read, by selecting part of a memory cell selected by a word line. Part of the memory cell is selected by turning on one of the pass transistors on either side of the string of memory cells. The charge storage state of the selected part is determined by measuring current in a bit line tied to both pass transistors.

Abstract: In one embodiment, a method for discharging a semiconductor device includes providing a semiconductor substrate, forming a hole blocking dielectric layer over the semiconductor substrate, forming nanoclusters over the hole blocking dielectric layer, forming a charge trapping layer over the nanoclusters, and applying an electric field to the nanoclusters to discharge the semiconductor device. Applying the electric field may occur while applying ultraviolet (UV) light. In one embodiment, the hole blocking dielectric layer comprises forming the hole blocking dielectric layer having a thickness greater than approximately 50 Angstroms.

Abstract: In accordance with an embodiment of the present invention, a semiconductor structure includes an undoped polysilicon layer, a doped polysilicon layer in contact with the undoped polysilicon layer, and an insulating layer in contact with the undoped polysilicon layer. The undoped polysilicon layer is sandwiched between the doped polysilicon layer and the insulating layer.

Abstract: A memory device includes a memory array of thin film transistor (TFT) memory cells. The memory cells include a floating gate separated from a gate electrode portion of a gate line by an insulator. The gate electrode portion includes a diffusive conductor that diffuses through the insulator under the application of a write voltage. The diffusive conductor forms a conductive path through the insulator that couples the gate line to the floating gate, changing the gate capacitance and therefore the state of the memory cell. The states of the memory cells are detectable as the differing current values for the memory cells. The memory cells are three terminal devices, and read currents do not pass through the conductive paths in the memory cells during read operations. This renders the memory cells robust, because read currents will not interfere with the storage mechanism in the memory cells. The memory array can be fabricated using multiple steps using the same mask.

Abstract: An integrated DRAM-NVRAM, multi-level memory cell is comprised of a vertical DRAM device with a shared vertical gate floating plate device. The floating plate device provides enhanced charge storage for the DRAM part of the cell through the shared floating body in a pillar between the two functions. The memory cell is formed in a substrate with trenches that form pillars. A vertical wordline/gate on one side of a pillar is used to control the DRAM part of the cell. A vertical trapping layer on the other side of the pillar stores one or more charges as part of the floating plate device and to enhance the DRAM function through the floating body between the DRAM and floating plate device. A vertical NVRAM wordline/control gate is formed alongside the trapping layer and is shared with an adjacent floating plate device.

Abstract: A fast low voltage ballistic program, ultra-short channel, ultra-high density, dual-bit multi-level flash memory is described. The structure and operation of this invention is enabled by a twin MONOS cell structure having an ultra-short control gate channel of less than 40 nm, with ballistic injection which provides high electron injection efficiency and very fast program at low program voltages of 3˜5V. The ballistic MONOS memory cell is arranged in the following array: each memory cell contains two nitride regions for one word gate, and ½ a source diffusion and ½ a bit diffusion. Control gates can be defined separately or shared together over the same diffusion. Diffusions are shared between cells and run in parallel to the side wall control gates, and perpendicular to the word line.

Abstract: A microelectronic programmable structure and methods of forming and programming the structure. The programmable structure generally include an ion conductor and a plurality of electrodes. Electrical properties of the structure may be altered by applying a bias across the electrodes, and thus information may be stored using the structure.

Abstract: A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.

Abstract: A system and method for column selection in a non-volatile memory cell array is disclosed. A group of memory cells is arranged in a rectangular array having rows (X-dimension) and columns (Y-dimension). Within a row, the sources and drains of the memory cells are connected to form a linear chain. A common word line is coupled to each gate in the row. A separate column line is coupled to each node between adjacent memory cells of the chain. A four column Y-decoder is used to select column lines for sense operations. A voltage source is applied to two of the four column lines during the sense operation. Current on one of the column lines may be sensed to provide a measurement for read or verification.

Abstract: A nonvolatile memory cell with a charge trapping structure coupled in series is read, by measuring current that flows between the body region of the nonvolatile memory cell and the contact region of the nonvolatile memory cell. The charge storage state of the charge trapping structure affects the measured current.