Abstract: Disclosed is a nonvolatile memory device which include a memory cell array including a plurality of memory cells connected to a plurality of word lines, an address decoder that controls a selected word line among the plurality of word lines based on an address received from an external device including a first temperature sensor, a second temperature sensor that measures a read temperature of first memory cells connected to the selected word line from among the plurality of memory cells, and a temperature compensation circuit that calculates a read level offset based on the read temperature and a program temperature of the first memory cells measured by the first temperature sensor and generates a compensation read voltage based on the read level offset. The address decoder is further configured to provide the compensation read voltage to the selected word line.

Abstract: A memory device includes control circuitry that executes a first programming operation and executes a second programming operation after the first programming operation. The first programming operation includes setting a threshold voltage of each of a second set of memory cells in a second section corresponding to write data, and setting a threshold voltage of each of the third set of memory cells in a third section. The second programming operation includes setting the threshold voltage of each of the second set of memory cells in a fifth section corresponding to the write data, and setting the threshold voltage of each of the third set of memory cells in a sixth section or a seventh section among a plurality of fourth sections in accordance with temperature information. The sixth section includes the same voltage range as the third section. The seventh section is higher in voltage than the third section.

Abstract: A semiconductor memory device includes first and second memory cell transistors between first and second select transistors, third and fourth memory cell transistors between third and fourth select transistors, a first word line for first and third memory cell transistors, a second word line for second and fourth memory cell transistors, first to fourth selection gate lines respectively for first through fourth select transistors, a bit line, and a source line. During a read operation, while a voltage applied to the second word line is boosted, voltages applied to the first word line and the third and fourth selection gate line are also boosted, after which the voltage applied to the first word line is lowered, and the third and fourth selection gate lines are discharged. After the time the third and fourth selection gate lines are discharged, voltages applied to the bit line and the source line are boosted.

Abstract: A dynamic temperature compensation trim for use in temperature compensating a memory operation on a memory call of a memory component. The dynamic temperature compensation trim is based on a temperature of the memory component and based on in-service data for the memory operation on the memory cell. A register for the memory operation is modified based on the dynamic temperature compensation trim.

Abstract: A memory device comprising an array of memory cells organized into a set of sub-blocks and a set of wordlines. Control logic is operatively coupled with the array of memory cells, the control logic to perform operations including: receiving a program command from a processing device, the program command including information indicative of a physical address associated with a retired wordline of the set of wordlines; in response to detecting the information within the program command, generating dummy data that is one of pseudo-random data, all one values, or all zero values; and causing the dummy data to be programmed to memory cells of multiple sub-blocks of the set of sub-blocks that are selectively connected to the retired wordline.

Abstract: Aggressor memory cells connected to one or more aggressor wordlines are grouped into aggressor cell groups by performing a read operation with respect to the aggressor wordlines based on one or more grouping read voltages, where the aggressor wordlines are adjacent to a selected wordline corresponding to a read address among wordlines of a memory block. Selected memory cells connected to the selected wordline are grouped into a selected cell groups respectively corresponding to the aggressor cell groups. Group read conditions respectively corresponding to the selected cell groups are determined and group read operations are performed with respect to the plurality of selected cell groups based on the group read conditions. The read errors are reduced by grouping the selected memory cells into the selected cell groups according to the change of operation environments.

Abstract: When programming an MLC memory device, the disturb characteristics of a program block having multiple memory cells are measured, and the threshold voltage variations of the multiple memory cells are then acquired based on the disturb characteristics of the program block. Next, multiple initial program voltage pulses are provided according to a predetermined signal level, and multiple compensated program voltage pulses are provided by adjusting the multiple initial program voltage pulses. Last, the multiple compensated program voltage pulses are outputted to the program block for programming the multiple memory cells to the predetermined signal level.

Abstract: A semiconductor storage device includes a memory string including memory transistors and a control circuit. The control circuit is configured to in response to a first command, perform a first read operation, and in response to a second command received during the first read operation, perform a second read operation. During the first read operation, a voltage of a first selected word line is decreased from a read pass voltage to a first read voltage and then increased to the read pass voltage. During the second read operation, a voltage of a second word line is set to a second read voltage and then increased to the read pass voltage. Voltages of word lines neither selected during the first nor second read operation are maintained between the first and second read operations.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A voltage detecting circuit for a non-volatile memory is provided. When a standby signal is not asserted, a power supply unit of the non-volatile memory provides an array voltage to a first node. The voltage detecting circuit includes an initial voltage generator, a capacitor, a latch and a combinational logic circuit. The initial voltage generator receives an inverted standby signal and an enable signal. An output terminal of the initial voltage generator is connected with a second node. The capacitor is coupled between the first node and the second node. An input terminal of the latch is connected with the second node. An output terminal of the latch is connected with a third node. An input terminal of the combinational logic circuit is connected with the third node. An output terminal of the combinational logic circuit generates the enable signal.

Abstract: A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.

Abstract: Technology is disclosed herein for detecting leaky word lines in a non-volatile storage system. The exact leaky word line may be located very rapidly using a divide and conquer approach. First a determination may be made whether at least one word line in a group such as any of the word lines in a block is leaky. This initial determination can be made very quickly. If no word line in the group is leaky, the search can end. However, responsive to a determination that at least one word line in the group is leaky, a divide and conquer search may be performed in which the group of the word lines is repeatedly divided into smaller sub-groups with selected smaller sub-groups tested for a short circuit until the leaky word line is located.

Abstract: A control method for flash memory and a flash memory are provided. The control method for a flash memory, the flash memory including an external data bus to which flash memory dies are coupled. The control method includes: in a setup stage, under an operation mode of command input, issuing by a host controller a setup command, wherein the setup command includes mapping information that each port of the external data bus is mapped respectively to a status index of each flash memory die; and in a request stage, under the operation mode of command input, issuing by the host controller a request command to each flash memory die, and under the operation mode of data output, in response to the request command, transmitting status of the status index of each flash memory die to the host controller through each port of the external data bus respectively.

Abstract: According to an embodiment of the present disclosure, a memory device, a peripheral circuit configured to perform a program operation, including a plurality of program loops, and a control logic configured to, in some of the plurality of loops of the program operation, control the peripheral circuit to apply a program voltage to a selected word line, apply a first pass voltage to adjacent word lines that are adjacent to the selected word line, and then apply a second pass voltage to adjacent word lines at a predetermined time point, wherein the second pass voltage has a different magnitude compared to the first pass voltage, and in the rest of the plurality of loops of the program operation, control the peripheral circuit to apply the second pass voltage to the adjacent word lines at a time point that is different from the predetermined time point from a selected loop.

Abstract: According to one embodiment, a memory system includes a semiconductor memory device and a controller. The device includes a plurality of memory cells capable of storing at least first to third data and a word line coupled to the plurality of memory cells. The first data is determined by a first read operation including a first read level. The second data is determined by a second read operation including a second read level. The third data is determined by a third read operation including a third read level. The controller controls the semiconductor memory device to perform a forth read operation including the first and second read levels in a search operation for first to third read voltages corresponding to the first to third read levels, respectively.

Abstract: A memory sub-system to track charge loss in memory cells and shifts of voltages optimized to read the memory cells. For example, a memory device can measure signal and noise characteristics of a group of memory cells to calculate an optimized read voltage of the group of memory cells. The memory sub-system having the memory device can determine an amount of charge loss in the group of memory cells, using at least the signal and noise characteristics, the optimized read voltage, and/or the bit error rate of data read using the optimized read voltage. The memory sub-system tracks changes in optimized read voltages of memory cells in the memory device based on the amount of charge loss.

Abstract: A memory device includes: a memory cell array including a first memory cell group including memory cells located within a first physical distance from a reference node and a second memory cell group including memory cells located beyond the first physical distance from the reference node; a peripheral circuit configured to perform a program operation of applying program voltages increasing gradually to memory cells included in the memory cell array through word lines; and control logic configured to determine a time at which a first program permission voltage is applied to the first memory cell group and determine a magnitude of the first program permission voltage on the basis of a magnitude of the program voltages in response to a gradual increase in the program voltages, the control logic is further configured to control the peripheral circuit to apply the first program permission voltage to the first memory cell group through bit lines.

Abstract: A processing device in a memory sub-system determines whether a media endurance metric associated with a memory block of a memory device satisfies one or more conditions. In response to the one or more conditions being satisfied, one or more read margin levels corresponding to a page type associated with the memory device are determined. A machine learning model is applied to the one or more read margin levels to generate a margin prediction value based on the page type and a wordline group associated with the memory device. Based on the margin prediction value, the memory device is assigned to a selected bin of a set of bins. A media scan operation is executed on the memory device in accordance with a scan frequency associated with the selected bin.

Abstract: Numerous embodiments of programming, verifying, and reading systems and methods for use with a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. Selected cells can be programmed and verified with extreme precision to hold one of N different values. During a read operation, the system determines which of the N different values is stored in a selected cell.

Abstract: Disclosed herein are methods, apparatuses and systems related to manage memory blocks. A memory system can track a duration while a memory block remains open for programming operations. When the tracked duration meets or exceeds a corresponding threshold, the memory system can implement an internally commanded programming operation to store predetermined data into an open location that is adjacent to an end of the previously-written data in the memory block.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell transistors, a word line connected to a gate of each of the memory cell transistors, a sequencer configured to control an operation of the memory cell array, and an input/output circuit. When the input/output circuit receives a command instructing an operation of continuously reading data of a plurality of pages from the memory cell transistors, the sequencer determines the data of the plurality of pages by continuously applying read voltages corresponding to the plurality of pages to be read, to the word line. In each continuous time period during which the control circuit applies read voltages for determining the data of one of the pages to the word line, the control circuit does not apply any read voltage for determining the data of another one of the pages to the word line.

Abstract: A method includes performing a first operation to program data to a group of memory cells of a memory device, wherein the data comprises host data and a bit pattern indicative of a first temperature of the group of memory cells and receiving a signal to perform a second operation to read the host data from the group of memory cells. The method further includes determining, responsive to receipt of the signal, whether a second temperature of the group of memory cells is outside a threshold temperature differential that is based on the bit pattern indicative of the first temperature of the group of memory cells, applying a voltage offset signal to the group of memory cells responsive to a determination that the second temperature of the group of memory cells is outside the threshold temperature differential, and performing the second operation to read the host data from the group of memory cells subsequent to application of the voltage offset signal to the group of memory cells.

Abstract: A set of blocks of a memory device comprising a plurality of dies is identified. A block within the set of blocks is identified. The identified block is associated with a capability metric that reflects a projected reliability of the die on which the block resides. Responsive to determining that the capability metric satisfies a condition, a cycle threshold associated with the die is identified. Responsive to determining that a cycle count value derived from a program/erase cycle counter associated with the die matches the cycle threshold, the set of blocks is updated by excluding the block from the set of blocks. A program operation is performed with respect to the updated set of blocks.

Abstract: Provided is a non-volatile memory package that is electrically optimized with a plurality of different non-volatile memory chips through a ball map, by fixing positions of buffer chips connected to the plurality of different non-volatile memory chips.

Abstract: The present application discloses a non-volatile memory and an operating method of the non-volatile memory. The non-volatile memory includes a plurality of memory cells, and unselected word lines connected with the memory cells. The method includes applying a first voltage rising at a first slope to unselected word lines to charge the unselected word lines, and stopping applying the first voltage to the unselected word lines in response to that the first voltage rises to a predetermined voltage. The predetermined voltage is higher than a pass voltage of a plurality of memory cells connected with the unselected word lines.

Abstract: A memory system includes a memory device including a memory cell array, a first latch, a plurality of program latches, and a second latch and a memory controller configured to provide a command to the memory device. The memory device may sense first data from a first region of the memory cell array, store the sensed first data in the first latch, transfer the sensed first data to the second latch, output the first data from the second latch to the memory controller, and transfer the first data from the second latch to a first program latch of the plurality of program latches, in response to a first read command.

Abstract: The present disclosure generally relates to utilizing the host clock signal frequency to determine whether to operate in the default pulse width modulation (PWM) link startup sequence (LSS), be changed to high speed (HS) LSS by a host device capable of operating in either PWM LSS or HS LSS, or ignore the data storage device attributes of operating in PWM LSS and instead operate according to HS LSS. In so doing, the data storage device is adaptable to work with older generation UFS host devices as well as current and future generation UFS host devices.

Abstract: A processing device coupled to the memory device can be configured to monitor respective raw bit error rates (RBERs) corresponding to a plurality of groups of memory cells of the memory device. The processing device can also be configured to responsive to determining that an RBER corresponding to a particular group of the plurality of groups of memory cells has met a criteria, adjust a read window budget corresponding to the particular group of memory cells.

Abstract: Methods, systems, and devices for storing parity during refresh operations are described. In some examples, refresh operations may be performed on a memory device when the memory device is idle. For example, a refresh operation may entail performing a logical operation on first data and a first set of parity bits and second data and a second set of parity bits. The logical operation may generate a third set of parity bits which may be used for data retention purposes. Moreover, during a read operation, the third set of parity bits may be used to recover corrupt or otherwise invalid data in the event of an error.

Abstract: According to an embodiment, a circuit in a semiconductor memory device sets threshold voltages of a plurality of memory cells such that two first distributions are formed in a first section on a lowest voltage side in 2N sections. After that, the circuit sets threshold voltages of the plurality of memory cells such that 2(1+M) second distributions are separately formed two by two. The circuit then sets 2N third distributions for the 2N sections.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected word lines. The memory cells are disposed in strings and configured to retain a threshold voltage. A control means is configured to apply a program voltage to selected ones of the word lines while applying pass voltages to unselected ones of the word lines and ramp down both the selected ones of the plurality of word lines and the unselected ones of the word lines to a recovery voltage at a start of a verify phase of each of a plurality of program loops and apply a targeted word line bias to each of the word lines during the verify phase. The control means is also configured to adjust the recovery voltage based on the targeted word line bias applied to each of the plurality of word lines during the verify phase.

Abstract: Memory devices are disclosed. A memory device may include a bonding pad region for coupling command-and-address (CA) input signals and a memory cell region for storing information in memory cells. The memory device may also include a centralized CA interface region including input circuits coupled to the CA input signals. At least two of the input circuits are configured in pairs. Each pair includes a swap circuit configured to select one of a first CA output and a second CA output for a first internal CA signal and select the other of the first CA output and the second CA output for a second internal CA signal responsive to a control signal. Memory systems and systems are also disclosed.

Abstract: Memories might include an array of memory cells including a string of series-connected split-gate memory cells, and a controller configured to cause the memory to selectively activate a first memory cell portion of a selected split-gate memory cell of the string of series-connected split-gate memory cells in response to a data state of the first memory cell portion of the selected split-gate memory cell and deactivate a second memory cell portion of the selected split-gate memory cell, and activate a second memory cell portion of each remaining split-gate memory cell of the string of series-connected split-gate memory cells while selectively activating the first memory cell portion of the selected split-gate memory cell and deactivating the second memory cell portion of the selected split-gate memory cell.

Abstract: An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

Abstract: The present disclosure provides a memory controller including a state detector detecting whether the memory device is in an idle state, a program controller, based on detection information that indicates a state of the memory device, selecting neighboring strings that are adjacent to a string that is coupled to a memory cell, among the memory cells, on which a program operation or a read operation was performed before the detecting, selecting monitoring memory cells that are coupled to at least one word line, the memory cells being a part of the neighboring strings, and controlling the memory device to perform a plurality of loops to program the monitoring memory cells, and a bad block selector selecting a memory block with the monitoring memory cells as a bad block based on a rate of increase in threshold voltage of a threshold voltage distribution of the monitoring memory cells.

Abstract: According to one embodiment, a semiconductor storage device includes a first memory string including a first memory transistor, a first word line connected to a gate electrode of the first memory transistor, a source line connected to one end of the memory string, and a first connection transistor connected between the first word line and the source line.

Abstract: A negative voltage switching device includes a first switching circuit configured to transmit a first negative voltage, a second switching circuit configured to transmit a second negative voltage, and a switching selection circuit configured to select one of the first switching circuit or the second switching circuit for transmitting one of the first negative voltage and the second negative voltage to an output terminal.

Abstract: For a non-volatile memory that uses hard bit and soft bit data in error correction operations, to reduce the amount of soft bit data that needs to be transferred from a memory to the controller and improve memory system performance, the soft bit data can be compressed before transfer. After the soft bit data is read and stored into the internal data latches associated with the sense amplifiers, it is compressed within these internal data latches. The compressed soft bit data can then be transferred to the transfer data latches of a cache buffer, where the compressed soft bit data can be consolidated and transferred out over an input-output interface. Within the input-output interface, the compressed data can be reshuffled to put into logical user data order if needed.

Abstract: Apparatus, methods, media and systems for multiple sets of trim parameters are described. A non-volatile memory device may comprise a first register, a second register, a multiplexer, a first set of I/O lines, each coupled to the first register and the multiplexer, each associated with a particular trim set among multiple trim sets stored in the first register, one or more second I/O lines, each coupled to the second register and the multiplexer. The multiplexer is configured to receive a control signal. The multiplexer is configured to output, based on the control signal, a particular trim set among the multiple trim sets to the second register using the one or more second I/O lines.

Abstract: [Problem] To provide a semiconductor storage device capable of reducing the load on a controller. [Solution] According to one embodiment, a semiconductor storage device 2 includes a memory cell array 110 including a plurality of memory cell transistors MT, a plurality of word lines WL connected to gates of the respective memory cell arrays 110, a voltage generation circuit 43 generating a voltage applied to each of the word lines WL, and a sequencer 41 controlling an operation of the memory cell array 110. The sequencer 41 repeats a loop including a program operation and a verify operation multiple times in a write operation. The sequencer 41 controls an operation of the voltage generation circuit 43 so that a rate increase in a voltage applied to a non-selected word line in the verify operation of a last loop is smaller than the rate increase in the voltage applied to the non-selected word line in the verify operation of a first loop.

Abstract: A semiconductor storage device includes a first word line, a second word line provided in the same layer with the first word line and configured to be controlled independently from the first word line, a plurality of memory pillars between the first word line and the second word line, each of the plurality of memory pillars including a first memory cell facing to the first word line and a second memory cell facing to the second word line, the plurality of memory pillars being arranged in a first direction and a second direction intersecting to the first direction and a control circuit. The control circuit is configured to perform a write operation to the second memory cell included in the plurality of memory pillars after performing a write operation to the first memory cell included in each of the plurality of memory pillars.

Abstract: Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

Abstract: A program effective time (PET) for programming at least a portion of a plurality of memory cells based on one or more program step characteristics is determined. The determined PET and a target PET is compared. In response to the determined PET being different than the target PET, the one or more program step characteristics is adjusted to adjust the determined PET to the target PET.

Abstract: The present technology relates to an electronic device. A memory device according to the present technology includes a plurality of memory cells connected to a word line, an operation controller configured to apply a first or a second read voltage to the word line and to obtain data that is stored in the plurality of memory cells through bit lines that are respectively connected to the plurality of memory cells, and a read voltage controller configured to control the operation controller to read the data that is stored in the plurality of memory cells by using the second read voltage, and to read the data that is stored in the plurality of memory cells by using the first read voltage according to the number of off cells that are counted based on the data that is read by using the second read voltage, in response to a read command.

Abstract: A method for reading data stored in a flash memory. The flash memory comprises a plurality of memory cells and each memory cell has a particular threshold voltage. The method includes: obtaining a first threshold voltage distribution representing threshold voltages of a first group of the memory cells; obtaining a second threshold voltage distribution representing threshold voltages of a second group of the memory cells, wherein the second threshold voltage distribution is different from the first threshold voltage distribution, and the first group of the memory cells comprises at least a part of the second group of the memory cells; and controlling the flash memory to perform at least one read operation upon the first group of the memory cells according to the second threshold voltage distribution.

Abstract: The present disclosure relates to a non-volatile memory device and to a method for generating overvoltage values in such a memory device structured in a plurality of sub-arrays and including at least a decoding and sensing circuitry associated with each sub-array, a charge pump architecture for each sub-array including pump stages for increasing the value of an input voltage and obtaining an overvoltage output value, a control and JTAG interface in the memory device, and at least a registers block coupled to the charge pump architecture and driven by a logic circuit portion for receiving at least an activation signal selecting a specific charge pump architecture associated with a memory sub-array of the plurality of sub-arrays.

Abstract: A memory device includes a memory cell and a controller. The memory cell includes: (a) an array of molecule chains, at least one molecule chain includes: (i) first and second binding sites positioned at first and second ends of the molecule chain, respectively, and (ii) a chain of one or more fullerene derivatives, chemically connecting between the first and second binding sites, (b) source and drain electrodes, electrically connected to the first and second binding sites, respectively, and configured to apply to the array a source-drain voltage (VSD) along a first axis, and (c) a gate electrode, configured to apply to the array a gate voltage (VG) along a second different axis. The controller is configured to perform a data storage operation in the memory cell by (i) applying to the gate electrode a signal for producing the VG, and (ii) applying the VSD between the source and drain electrodes.

Abstract: The present disclosure includes apparatuses and methods related to selectable trim settings on a memory device. An example apparatus can store a number of sets of trim settings and select a particular set of trims settings of the number of sets of trim settings based on desired operational characteristics for the array of memory cells.

Abstract: A three-dimensionally stacked nonvolatile semiconductor memory of an aspect of the present invention including conductive layers stacked on a semiconductor substrate in such a manner as to be insulated from one another, a bit line which is disposed on the stacked conductive layers, a semiconductor column which extends through the stacked conductive layers, word lines for which the stacked conductive layers except for the uppermost and lowermost conductive layers are used and which have a plate-like planar shape, memory cells provided at intersections of the word lines and the semiconductor column, a register circuit which has information to supply a potential suitable for each of the word lines, and a potential control circuit which reads the information retained in the register circuit in accordance with an input address signal of a word line and which supplies a potential suitable for the word line corresponding to the address signal.

Abstract: Three-dimensional semiconductor devices are provided. The three-dimensional semiconductor device includes a substrate, a buffer layer on the substrate. The buffer layer includes a material having an etching selectivity relative to that of the substrate. A multi-layer stack including alternating insulation patterns and conductive patterns is provided on the buffer layer opposite the substrate. One or more active patterns respectively extend through the alternating insulation patterns and conductive patterns of the multi-layer stack and into the buffer layer. Related fabrication methods are also discussed.