Abstract: According to one embodiment, a semiconductor storage device includes a first memory string including a first memory transistor, a first word line connected to a gate electrode of the first memory transistor, a source line connected to one end of the memory string, and a first connection transistor connected between the first word line and the source line.

Abstract: A machine-implemented method for managing a flash storage system includes determining a projected life value for each of a plurality of flash memory devices in the flash storage system, wherein the projected life value for at least one of the plurality of flash memory devices is higher than the projected life value of at least another one of the plurality of flash memory devices. The method also includes determining operating parameters for each of the plurality of flash memory devices based on the respective projected life values for the plurality of flash memory devices. The method also includes configuring the plurality of flash memory devices based on the determined operating parameters.

Abstract: A method of programming a nonvolatile memory device includes performing a single-pulse program operation in a program loop, determining whether a condition is satisfied in the a program loop, and performing a multi-pulse program operation in a next program loop when the condition is satisfied. The single-pulse program operation includes applying a first program pulse and applying plural verification pulses, the multi-pulse program operation includes applying a second program pulse, applying a third program pulse, and applying plural verification pulses, and each of the second program pulse and the third program pulse has a level lower than a level of the first program pulse.

Abstract: The present invention includes apparatus and a method for reading one or more data states from an integrated circuitry memory cell, including the steps of connecting the memory cell to a bit line which is connected to an amplifier having an offset control which introduces an offset during the sensing portion of a read cycle to identify a data state stored in the memory cell.

Abstract: An electrically erasable programmable nonvolatile memory cell includes a semiconductor substrate having a first substrate region and a trench region apart from the first substrate region in a lateral direction, a channel region between the first substrate region and the bottom portion of the trench region, an electrically conductive control gate insulated from and disposed over the first channel portion, an electrically conductive floating gate insulated from the bottom and sidewall portions of the trench region, an insulation region disposed over the second channel portion between the control gate and the second floating gate portion, an electrically conductive source line insulated from the floating gate and electrically connected to the trench region of the substrate, and an electrically conductive erase gate insulated from and disposed over a tip of the floating gate.

Abstract: Apparatus including an array of memory cells, and a controller configured to cause the apparatus to determine a first value indicative of a number of memory cells of a plurality of memory cells that are activated in response to a control gate voltage having a particular voltage level, compare the first value to a plurality of second values, and determine an expected data age of the plurality of memory cells or a plurality of read voltages in response to the comparison of the first value to the plurality of second values.

Abstract: A semiconductor device includes a memory circuit, an error correction code circuit, a register circuit and a write circuit. The memory circuit is configured to output, in response to at least one address signal, first data associated with at least one memory cell in the memory circuit. The error correction code circuit is configured to convert the first data to second data and configured to generate error information when the first data is not identical to the second data. The register circuit is configured to output, based on the error information, reset information corresponding to the at least one address signal. The write circuit is configured to reset the at least one memory cell according to the reset information. A method is also disclosed herein.

Abstract: A semiconductor memory device includes a memory cell unit, word lines, a driver circuit, and first transistors. The word lines are connected to the control gates of 0-th to N-th memory cells. The (N+1) number of first transistors transfer the voltage to the word lines respectively. Above one of the first transistors which transfers the voltage to an i-th (i is a natural number in the range of 0 to N) word line, M (M<N) of the word lines close to the i-th word line pass through a region above the gate electrode by a first level interconnection without passing over the impurity diffused layers.

Abstract: A memory system includes a semiconductor storage device and a memory controller including a storage circuit that stores correction value for read voltages in association with the word line, and a control circuit that reads data from the memory cells, performs a correction operation on the read data to determine a number of error bits therein, determines the correction value for each read voltage based on the number of error bits and a ratio of a lower tail fail bit count and an upper tail fail bit count, and stores the correction values for the read voltages in the storage circuit. The lower tail fail bit count represents the number of memory cells in a first state having threshold voltages of an adjacent state, and the upper tail fail bit count represents the number of memory cells in the adjacent state having threshold voltages of the first state.

Abstract: Methods and architectures for refreshing memory elements in a memory array may initialize a reference array that stores each of the possible values stored in the memory element. The values in the memory array and the reference array will drift in parallel over time. To perform a refresh, the drifted values may be read from the reference array and mapped to the original values that were stored when the reference array was initialized. Next, each value may be read from the memory array and matched with a corresponding value from the reference array. The known original value stored in the reference array can then be used to refresh the corresponding memory element in the memory array.

Abstract: A control method for a flash memory, a flash memory die and the flash memory are provided. The control method includes: in a setup stage, under an operation mode of a command input, issuing by a host a setup command to map each port of an external data bus of each flash memory die respectively to a status index of each flash memory die; and in a request stage, under the operation mode of the command input, issuing by the host a request command to each flash memory die, and under the operation mode of a data output, a status of the status index of each flash memory die is transmitted to the host through the ports of the external data bus respectively.

Abstract: A memory apparatus and method of operation is provided. The apparatus has blocks each including non-volatile storage elements. Each of the non-volatile storage elements stores a threshold voltage representative of an element data. The apparatus also includes one or more managing circuits configured to erase at least one of the blocks in an erase operation and program the element data in a program operation. The one or more managing circuits are also configured to proactively identify ones of the blocks as potential bad blocks and selectively apply stress to the ones of the blocks identified as the potential bad blocks and determine whether the potential bad blocks should be retired from the erase and program operations and put in a grown bad block pool or released to a normal block pool used for the erase and program operations based on a judgment after selectively applying the stress.

Abstract: Memory devices may have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices uses an electrical distance calculator to determine an electrical distance from a memory cell to a respective driver of the plurality of drivers. The memory device also uses a driver modulator to modulate the corresponding signal based at least in part on the electrical distance.

Abstract: A system including a memory device having blocks of memory cells and a processing device operatively coupled to the memory device. The processing device to perform operations comprising: detecting an error event triggered within a source block of the memory cells; reading data from the source block; writing the data into a mitigation block that is different than the source block; and replacing, in a mapping data structure, a first identifier of the source block with a second identifier of the mitigation block.

Abstract: A memory device includes a memory array comprising a plurality of memory elements and a memory controller coupled to the memory array. The memory controller when in operation receives an indication of a defect in the memory array determines a first location of the defect when the defect is affecting only one memory element of the plurality of memory elements, determines a second location of the defect when the defect is affecting two or more memory elements of the plurality of memory elements, and performs a blown operation on a defective memory element at the second location when the defect is affecting two or more memory elements of the plurality of memory elements.

Abstract: A non-volatile memory system adjusts the speed of a memory operation for a subset of non-volatile memory cells. For example, during a GIDL based erase process, the GIDL generation can be dampened for a subset of memory cells (e.g., for a set of NAND strings, or one or more sub-blocks).

Abstract: A storage device includes NVM package and a controller connected to the NVM package through a channel and controlling operation of the NVM package. The NVM package includes an interface chip, first NVM devices connected to the interface chip through a first internal channel and second NVM devices connected to the interface chip through a second internal channel. The interface chip selects the first internal channel in response to an operation request received from the controller and connects the first internal channel to the channel. The interface chip also determines whether retraining is necessary in relation to the second internal channel and transmits a retraining request to the controller when retraining is necessary.

Abstract: A memory device according to the present technology includes a memory cell array configured to include planes having a plurality of memory cells, a page buffer connected to at least one memory cell among the memory cells through a bit line and configured to perform a sensing operation of reading data stored in the at least one memory cell connected to the bit line, a common reference voltage generator configured to generate a common reference voltage, a plurality of merged buffers configured to generate a reference signal using the common reference voltage, and control logic configured to control an operation of the common reference voltage generator and the merged buffers so that page buffer control signals generated based on the reference signal are supplied to the page buffer.

Abstract: Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A first data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. In response to determining the first indicator of data integrity is greater than a current maximum value, the current maximum value is set to the first indicator of data integrity. In response to determining the current maximum value satisfies a threshold value, a size of a subsequent set of read operations is set to a second number, which less than the first number.

Abstract: To improve programming performance for a non-volatile memory , the verification of multiple programming levels can be performed based on a single discharge of a sensing capacitor through a selected memory cell by using different voltage levels on a second plate of the sensing capacitor: after discharging a first plate of the sensing capacitor through the selected memory cell, a result amount of charge is trapped on the first plate, which is then used to set first and second control gate voltages on a sensing transistor whose control gate is connected to the first place of the sensing capacitor based on respectively setting the second plate of the sensing capacitor to first and second voltage levels. To further improve programming performance, when the non-volatile memory stores in a multistate format, after the next to highest data state finishes programming, the next programming pulse can use a larger step size.

Abstract: An approach is provided in which an information handling system performs multiple tests on a memory device using different supply voltage levels. The information handling system identifies a set of memory cells in the memory that produce a same set of results during each of the memory tests at the different supply voltage levels, and generates a random number based on a set of data values collected from the set of memory cells. In turn, the information handling system uses the random number generator in one or more processes executed by the information handling system.

Abstract: Apparatus and methods are described to program memory cells and control bit line discharge schemes during programming based on the data pattern. The memory controller can predict program data pattern based on SLC pulse number and TLC data completion signals and use these signals to adjust when the inhibited bit lines can discharge. Once a TLC program operation have more one data, the memory controller will enable EQVDDSA_PROG to equalize to VDDSA, and then discharge. In SLC program, the memory controller will enable EQVDDSA_PROG only in first program pulse and disable it thereafter.

Abstract: An electronic circuit may be operated based on two or more supply voltages ramped in accordance with a digital control scheme, the digital control scheme may include ramping a voltage value of a first output voltage generated via a first digitally controlled voltage converter from a first target voltage value to a third target voltage value such that the voltage value of the first output voltage matches a second target voltage value during a first ramp interval and the third target voltage value during a second ramp interval; and ramping a voltage value of a second output voltage generated via a second digitally controlled voltage converter from the first target voltage value to the second target voltage value such that the voltage value of the second output voltage matches the second target voltage value during the first ramp interval, and the second target voltage value during the second ramp interval.

Abstract: A memory system includes a semiconductor storage device including a memory cell array including a plurality of groups of memory cells, and a control circuit configured to perform, upon receipt of a write command, a write operation on one of the groups of memory cells, and a memory controller is configured to, when transmitting the write command to perform the write operation on the one of the groups of memory cells, determine a first write voltage value for the write operation based on a total number of write operations or erase operations that have been performed on the one of the groups of memory cells, and transmit the write command to the semiconductor storage device together with the determined first write voltage value.

Abstract: A write operation performed on a first memory unit of a memory device is detected, wherein the first memory unit comprises one or more memory cells. Responsive to detecting the write operation, a value of a counter associated with the first memory unit is incremented. It is determined whether the value of the counter satisfies a threshold criterion, wherein the threshold criterion is based on a random or pseudo-random number within a defined range. Responsive to determining that the value of the counter satisfies the threshold criterion, a refresh operation is performed on a second memory unit.

Abstract: An operating method for a non-volatile memory device includes; performing a read operation on adjacent memory cells connected to an adjacent word line proximate to a target word line to determine adjacent data, classifying target memory cells connected to the target word line into groups according to the adjacent data, setting a read voltage level for each of the groups by searching for a read voltage level for target memory cells in at least one of the groups, and performing a read operation on target memory cells using the read voltage level set for each of the groups.

Abstract: A transistor comprises a base layer that includes a channel region, wherein the base layer and the channel region include group III-V semiconductor material. A gate stack is above the channel region, the gate stack comprises a gate electrode and a composite gate dielectric stack, wherein the composite gate dielectric stack comprises a first large bandgap oxide layer, a low bandgap oxide layer, and a second large bandgap oxide layer to provide a programmable voltage threshold. Source and drain regions are adjacent to the channel region.

Abstract: The present technology includes a test system. The test system includes a memory device configured to store an initial setting value for performing normal operations, and a test device configured to generate an operation command set including a test value that is a result of a test operation of the memory device, and configured to transmit the operation command set to the memory device. The memory device performs an operation by using the test value based on the operation command set, replaces the initial setting value with an operation value that is generated as a result of the operation, and stores the operation value.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes a plurality of memory cells. Each of the plurality of memory cells is connected to one of a plurality of word lines and is arranged in one of a plurality of blocks. Each of the plurality of memory cells is configured to retain a threshold voltage corresponding to one of a plurality of data states. A control circuit is coupled to the plurality of word lines and is configured to detect at least one use characteristic of the memory apparatus. The control circuit adjusts a verify voltage level by one of a plurality of verify level offsets based on the at least one use characteristic that is detected. The verify voltage level is applied to the one of the plurality of word lines selected for programming following an application of a program voltage during a program operation.

Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.

Abstract: A plurality of physically unclonable function (PUF) bit cells are surveyed by supplying a plurality of threshold control values to the PUF bit cells. Survey results associated with each of the threshold control values are evaluated to determine a threshold control pair having a positive threshold control value and a negative threshold control value among the plurality of threshold control values that results in a desired number PUF bit cells that are strong ones and that are strong zeros.

Abstract: Apparatuses and techniques are described for reducing the program time for a set of memory cells by using an enhanced step up of a program bias. A program operation includes a first pass in which memory cells are programmed to intermediate states and a second program pass in which the memory cells are programmed from an erased state and the intermediate states to final states. In the first program pass, program time can be reduced by applying an enhanced program bias step up to memory cells of the highest intermediate state in a single program loop, for example. The enhanced program bias step up can be achieved by applying a negative bit line voltage and can be triggered when the memory cells assigned to the second highest intermediate state reach a program milestone such as completing programming.

Abstract: Various implementations described herein are related to a device having memory circuitry activated by a power-gated supply. The device may include level shifting circuitry that receives a switch control signal in a first voltage domain, shifts the switch control signal in the first voltage domain to a second voltage domain, and provides the switch control signal in the second voltage domain. The device may include power-gating circuitry activated by the switch control signal in the second voltage domain, and the power-gating circuitry may provide the power-gated supply to the memory circuitry to trigger activation of the memory circuitry with the power-gated supply when activated by the switch control signal in the second voltage domain.

Abstract: Systems and methods for improving the reliability of non-volatile memory by reducing the number of memory cell transistors that experience excessive hole injection are described. The excessive hole injection may occur when the threshold voltage for a memory cell transistor is being set below a particular negative threshold voltage. To reduce the number of memory cell transistors with threshold voltages less than the particular negative threshold voltage, the programmed data states of the memory cell transistors may be reversed such that the erased state comprises the highest data state corresponding with the highest threshold voltage distribution. To facilitate programming of the memory cell transistors with reversed programmed data states, a non-volatile memory device structure may be used in which the bit line connections to NAND strings comprise direct poly-channel contact to P+ silicon and the source line connections to the NAND strings comprise direct poly-channel contact to N+ silicon.

Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.

Abstract: Examples herein relate to determining a number of defective bit lines in a memory region prior to applying a program or erase voltages. If a threshold number of bit lines that pass during a program or erase verify operation is used to determine if the program or erase operation passes or fails, the determined number of defective bit lines can be used to adjust the determined number of passes or fails. In some cases, examples described herein can avoid use of extra bit lines and look-up table circuitry to use in place of defective bit lines and save silicon space and cost associated with the use of extra bit-lines. In some examples, a starting magnitude of a program voltage signal can be determined by considering a number of defective bit lines.

Abstract: A semiconductor memory device includes first and second memory string including first and second memory cell, respectively, and first and second bit line connected to first and second memory string, respectively. In a first program operation, a first bit line voltage is supplied to the first and the second bit line. In a second program operation, a second bit line voltage larger than the first bit line voltage or a third bit line voltage larger than the second bit line voltage is supplied to the first and the second bit line. In a third program operation, the second and the third bit line voltage is supplied to the first and the second bit line, respectively. In a fourth program operation, the third and the second bit line voltage is supplied to the first and the second bit line, respectively.

Abstract: The present technology relates to an electronic device. According to the present technology, a method of operating a memory device including a program operation speed in which an effect of a disturbance is reduced, and including a plurality of memory blocks each including a plurality of memory cell strings each including a plurality of memory cells connected in series between a bit line and a source line, a plurality of source select transistors connected in series between the source line and the plurality of memory cells, and a plurality of drain select transistors connected in series between the bit line and the plurality of memory cells, includes applying a precharge voltage to the source line, and applying the precharge voltage to a first source select line connected to a source select transistor adjacent to the source line among source select transistors included in an unselected memory block among the plurality of memory blocks.

Abstract: A semiconductor storage device includes a memory cell unit which includes memory cell arrays including a plurality of memory cells; a peripheral circuit which performs voltage transmission control including a write operation, a read operation, and an erasing operation with respect to the memory cell unit; and signal lines which connect the peripheral circuit to the memory cell unit, and at least a portion of the signal lines is formed in a non-facing region, the non-facing region being a region where the memory cell unit does not face the peripheral circuit, the non-facing region being in a peripheral region formed around a periphery of the memory cell arrays of the memory cell unit.

Abstract: A method for operating a memory system includes: performing a read operation in response to a first tag; performing a read operation in response to a second tag; performing a defense code operation corresponding to the first tag; performing an error correction code (KC) operation on data output through the defense code operation corresponding to the first tag; and performing a defense code operation corresponding to the second tag, wherein the read operation in response to the second tag is started before the ECC operation corresponding to the first tag is completed, and wherein the defense code operation corresponding to the second tag is performed using a result of the defense code operation corresponding to the first tag.

Abstract: A storage device is provided. In relation to the storage device operating in an active mode and a low power mode, the storage devices includes a nonvolatile memory including a plurality of nonvolatile memory cells, and a storage controller configured to process commands inputted from a host device in the active mode, wherein the storage controller includes a power mode manager that adjusts the plurality of power modes, wherein, when a first command is inputted, the power mode manager predicts an input prediction time for a second command to be inputted from the host device after the first command, changes from the active mode to the low power mode when a processing operation of the first command is completed, and returns to the active mode from the low power mode when a set return time elapses according to the input prediction time.

Abstract: A memory system includes a memory device and a controller. The controller determines a target word line group to which a target word line corresponding to a read command belongs. The controller identifies a reference voltage corresponding to the target word line group. The controller controls the memory device to perform a read operation on a target page coupled to the target word line, using the reference voltage.

Abstract: A dynamic temperature compensation trim for use in temperature compensating a memory operation on a memory call of a memory component. The dynamic temperature compensation trim is based on a temperature of the memory component and based on in-service data for the memory operation on the memory cell. A register for the memory operation is modified based on the dynamic temperature compensation trim.

Abstract: A method of performing an operation on a non-volatile memory (NVM) cell of a memory device is disclosed. The pass transistor of the NVM cell is an asymmetric transistor including a source with a halo implant. The source of the pass transistor is coupled to a common source line (CSL) that is shared among NVM cells of a sector of NVM cells. The operation may be performed by applying a first signal to a word line (WLS) coupled to a gate of a memory transistor of the NVM cell and applying a second signal to a bit line (BL) coupled to a drain of the memory transistor of the NVM cell.

Abstract: Methods, systems, and devices for operational modes for reduced power consumption in a memory system are described. A memory device may be coupled with a capacitor of a power management integrated circuit (PMIC). The memory device may operate in a first mode where a supply voltage is provided to the memory device from the PMIC. The memory device may operate in a second mode where it is isolated from the PMIC. When isolated, a node of the memory device (e.g., an internal node) may be discharged while the capacitor of the PMIC remains charged. When the memory device resumes operating in the first mode, a supply voltage may be provided to it based on the residual charge of the capacitor.

Abstract: A plurality of semiconductor layers have longitudinally a first direction, have a peripheral area surrounded by the plurality of control gate electrodes, and are arranged in a plurality of rows within the laminated body. A controller controls a voltage applied to the control gate electrodes and bit lines. The controller, during a writing operation, applies a first voltage to a first bit line connected to the semiconductor layer positioned in a first row closer to the insulation separating layer, and applies a second voltage larger than the first voltage to a second bit line connected to the semiconductor layer positioned in a second row positioned further from the insulation separating layer with respect to the first row, among the plurality of rows.

Abstract: A memory device that controls a floating time point of word lines connected to a sub block adjacent to a sub block on which an erase operation is performed includes a plurality of memory blocks each including a plurality of sub blocks, a voltage generator configured to generate a plurality of voltages to perform an erase operation on any of the plurality of sub blocks, and control logic configured to divide a plurality of word lines connected to an adjacent sub block neighboring a sub block on which the erase operation is performed into a plurality of groups, and configured to control the voltage generator to differently set a floating time point of word lines included in each group for each of the plurality of groups, during the erase operation.

Abstract: A controller optimizes a read threshold value for a memory device using model-less regression. The controller performs read operations on cells using read threshold voltage values. The controller measures probability values for the multiple read threshold voltage values, and estimates a threshold voltage distribution curve based on the multiple read threshold voltage values and the measured probability values using a set regression formula. The controller determines a read threshold voltage value corresponding to a set point on the threshold voltage distribution curve, and performs a read operation on the cells using the read threshold voltage value.

Abstract: Some embodiments include apparatuses and methods using first and second select gates coupled in series between a conductive line and a first memory cell string of a memory device, and third and fourth select gates coupled in series between the conductive line and a second memory cell string of the memory device. The memory device can include first, second, third, and fourth select lines to provide first, second, third, and fourth voltages, respectively, to the first, second, third, and fourth select gates, respectively, during an operation of the memory device. The first and second voltages can have a same value. The third and fourth voltages can have different values.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a substrate, a stacked body, a semiconductor pillar, a charge storage film, and a drive circuit. The stacked body is provided on the substrate. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. A through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in an interior of the through-hole. The charge storage film is provided between the electrode film and the semiconductor pillar. The drive circuit supplies a potential to the electrode film. The diameter of the through-hole differs by a position in the stacking direction. The drive circuit supplies a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases.