Abstract: A non-volatile semiconductor memory device, described herein, comprises a bit line, a source line, a memory string comprising a plurality of memory cells connected in series between the source line and the bit line, and control circuitry coupled to the plurality of memory cells, the source line, and the bit line. The control circuitry is configured to: determine if a program operation is a single-bit program operation or multi-bit program operation; in response to the determination, identify a voltage level to set the source line to during performance of the program operation; and perform the program operation on the memory string, the program operation including setting the source line to the voltage level.

Abstract: A storage device includes a memory device and a controller. The memory device includes a memory region which includes a first sub-region and a second sub-region. The controller reads assist data from a plurality of memory cells according to an assist read voltage during a read voltage adjusting operation on the first sub-region as a target sub-region, and re-utilizes the read assist data during the read voltage adjusting operation on the second sub-region as the target sub-region.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: A method includes receiving signaling indicative of performance of a sanitization operation to a processing device coupled to a memory device and applying a sanitization voltage to a plurality of memory blocks of the memory device. The sanitization voltage can be greater than an erase voltage of the plurality of memory blocks.

Abstract: Described are systems and methods for all level coarse/fine programming of memory cells.

Abstract: An operating method of a non-volatile memory device that includes a plurality of cell strings each including a first stack and a second stack adjacent to the first stack, the operating method include performing a first program operation during a time period in which a plurality of program loops are performed, by applying a program voltage including a first plurality of voltage levels to a select word line connected to the first stack of each of the plurality of cell strings, applying, during the time period, second voltages including a second plurality of voltage levels to a non-select word line connected to the first stack of each of the plurality of cell strings, and maintaining, during the time period, a third voltage at a first level, the third voltage applied to a non-select word line connected to the second stack of each of the plurality of cell strings.

Abstract: Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

Abstract: Methods for storing control information for memory operations within spare physical blocks. During formatting of a data storage device, spare memory blocks may be identified within memory dies and placed into a spare block pool. Upon initiation of a block exchange event for a control block, a controller determines whether a spare block is available in the spare block pool. When a spare block is available, data from the control block is copied to the spare block to generate a debug block. The control block may be a MasterIndexPage block. When a spare block is not available, the controller may erase information stored in an oldest debug memory block and copy data from the control block to the oldest debug memory block.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells each connected to word lines and disposed in strings and configured to retain a threshold voltage. The memory apparatus also includes a charge pump configured to ramp up to a program voltage in a pump setting process and supply the program voltage to the word lines during a program operation and ramp down from the program voltage in a pump resetting process. A control means is configured to successively apply one of a series of pulses of the program voltage from the charge pump to each selected one of the word lines to program the memory cells during the program operation. The control means is also configured to skip the pump setting process and the pump resetting process of the charge pump in between each of the series of pulses of the program voltage.

Abstract: A memory system is provided and includes memory chips in each of which a first state output pin is arranged and a memory controller in which a first state input pin connected to a first channel including first ways respectively connected to the first state output pins arranged in the memory chips is arranged. The memory controller checks a first internal state of each of the memory chips, based on one or more of a chip enable signal and a CE reduction command of the memory chips, and a second signal received through the first state input pin as a result of an AND operation of first signals output through the first state output pins, during a state check interval for checking respective states of the memory chips.

Abstract: A memory system includes a memory controller configured to determine a first best read offset of a first best read reference voltage with respect to a first default read reference voltage, and determine an anchor read reference voltage having a same offset as the first best read offset with respect to a second default read reference voltage. The first and second default read reference voltages are set for reading a page from a set of MLCs in a semiconductor memory device. A first scan range can be determined based on the anchor read reference voltage. A second best read offset of a second best read reference voltage with respect to the second read reference voltage can be determined by searching in the first scan range. A reading process can be performed to read the page from the set of MLCs based on the first and second best read reference voltages.

Abstract: Apparatuses, systems, and methods for buffer threshold monitoring to reduce data loss are provided herein. In a number of embodiments of the present disclosure, a method can include buffering data in a first memory device, writing the buffered data from the first memory device to a second memory device, determining that the first memory device is storing at least a threshold amount of data, and sending a first signal to the second memory device in response to determining that the first memory device is storing at least the threshold amount of data, wherein the first signal causes the second memory device to enter an increased write performance mode.

Abstract: Disclosed is a nonvolatile memory device which include a memory cell array including a plurality of memory cells connected to a plurality of word lines, an address decoder that controls a selected word line among the plurality of word lines based on an address received from an external device including a first temperature sensor, a second temperature sensor that measures a read temperature of first memory cells connected to the selected word line from among the plurality of memory cells, and a temperature compensation circuit that calculates a read level offset based on the read temperature and a program temperature of the first memory cells measured by the first temperature sensor and generates a compensation read voltage based on the read level offset. The address decoder is further configured to provide the compensation read voltage to the selected word line.

Abstract: A memory device includes control circuitry that executes a first programming operation and executes a second programming operation after the first programming operation. The first programming operation includes setting a threshold voltage of each of a second set of memory cells in a second section corresponding to write data, and setting a threshold voltage of each of the third set of memory cells in a third section. The second programming operation includes setting the threshold voltage of each of the second set of memory cells in a fifth section corresponding to the write data, and setting the threshold voltage of each of the third set of memory cells in a sixth section or a seventh section among a plurality of fourth sections in accordance with temperature information. The sixth section includes the same voltage range as the third section. The seventh section is higher in voltage than the third section.

Abstract: A semiconductor memory device includes first and second memory cell transistors between first and second select transistors, third and fourth memory cell transistors between third and fourth select transistors, a first word line for first and third memory cell transistors, a second word line for second and fourth memory cell transistors, first to fourth selection gate lines respectively for first through fourth select transistors, a bit line, and a source line. During a read operation, while a voltage applied to the second word line is boosted, voltages applied to the first word line and the third and fourth selection gate line are also boosted, after which the voltage applied to the first word line is lowered, and the third and fourth selection gate lines are discharged. After the time the third and fourth selection gate lines are discharged, voltages applied to the bit line and the source line are boosted.

Abstract: A dynamic temperature compensation trim for use in temperature compensating a memory operation on a memory call of a memory component. The dynamic temperature compensation trim is based on a temperature of the memory component and based on in-service data for the memory operation on the memory cell. A register for the memory operation is modified based on the dynamic temperature compensation trim.

Abstract: A memory device comprising an array of memory cells organized into a set of sub-blocks and a set of wordlines. Control logic is operatively coupled with the array of memory cells, the control logic to perform operations including: receiving a program command from a processing device, the program command including information indicative of a physical address associated with a retired wordline of the set of wordlines; in response to detecting the information within the program command, generating dummy data that is one of pseudo-random data, all one values, or all zero values; and causing the dummy data to be programmed to memory cells of multiple sub-blocks of the set of sub-blocks that are selectively connected to the retired wordline.

Abstract: Aggressor memory cells connected to one or more aggressor wordlines are grouped into aggressor cell groups by performing a read operation with respect to the aggressor wordlines based on one or more grouping read voltages, where the aggressor wordlines are adjacent to a selected wordline corresponding to a read address among wordlines of a memory block. Selected memory cells connected to the selected wordline are grouped into a selected cell groups respectively corresponding to the aggressor cell groups. Group read conditions respectively corresponding to the selected cell groups are determined and group read operations are performed with respect to the plurality of selected cell groups based on the group read conditions. The read errors are reduced by grouping the selected memory cells into the selected cell groups according to the change of operation environments.

Abstract: When programming an MLC memory device, the disturb characteristics of a program block having multiple memory cells are measured, and the threshold voltage variations of the multiple memory cells are then acquired based on the disturb characteristics of the program block. Next, multiple initial program voltage pulses are provided according to a predetermined signal level, and multiple compensated program voltage pulses are provided by adjusting the multiple initial program voltage pulses. Last, the multiple compensated program voltage pulses are outputted to the program block for programming the multiple memory cells to the predetermined signal level.

Abstract: A semiconductor storage device includes a memory string including memory transistors and a control circuit. The control circuit is configured to in response to a first command, perform a first read operation, and in response to a second command received during the first read operation, perform a second read operation. During the first read operation, a voltage of a first selected word line is decreased from a read pass voltage to a first read voltage and then increased to the read pass voltage. During the second read operation, a voltage of a second word line is set to a second read voltage and then increased to the read pass voltage. Voltages of word lines neither selected during the first nor second read operation are maintained between the first and second read operations.

Abstract: A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Abstract: A voltage detecting circuit for a non-volatile memory is provided. When a standby signal is not asserted, a power supply unit of the non-volatile memory provides an array voltage to a first node. The voltage detecting circuit includes an initial voltage generator, a capacitor, a latch and a combinational logic circuit. The initial voltage generator receives an inverted standby signal and an enable signal. An output terminal of the initial voltage generator is connected with a second node. The capacitor is coupled between the first node and the second node. An input terminal of the latch is connected with the second node. An output terminal of the latch is connected with a third node. An input terminal of the combinational logic circuit is connected with the third node. An output terminal of the combinational logic circuit generates the enable signal.

Abstract: Technology is disclosed herein for detecting leaky word lines in a non-volatile storage system. The exact leaky word line may be located very rapidly using a divide and conquer approach. First a determination may be made whether at least one word line in a group such as any of the word lines in a block is leaky. This initial determination can be made very quickly. If no word line in the group is leaky, the search can end. However, responsive to a determination that at least one word line in the group is leaky, a divide and conquer search may be performed in which the group of the word lines is repeatedly divided into smaller sub-groups with selected smaller sub-groups tested for a short circuit until the leaky word line is located.

Abstract: A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.

Abstract: A control method for flash memory and a flash memory are provided. The control method for a flash memory, the flash memory including an external data bus to which flash memory dies are coupled. The control method includes: in a setup stage, under an operation mode of command input, issuing by a host controller a setup command, wherein the setup command includes mapping information that each port of the external data bus is mapped respectively to a status index of each flash memory die; and in a request stage, under the operation mode of command input, issuing by the host controller a request command to each flash memory die, and under the operation mode of data output, in response to the request command, transmitting status of the status index of each flash memory die to the host controller through each port of the external data bus respectively.

Abstract: According to an embodiment of the present disclosure, a memory device, a peripheral circuit configured to perform a program operation, including a plurality of program loops, and a control logic configured to, in some of the plurality of loops of the program operation, control the peripheral circuit to apply a program voltage to a selected word line, apply a first pass voltage to adjacent word lines that are adjacent to the selected word line, and then apply a second pass voltage to adjacent word lines at a predetermined time point, wherein the second pass voltage has a different magnitude compared to the first pass voltage, and in the rest of the plurality of loops of the program operation, control the peripheral circuit to apply the second pass voltage to the adjacent word lines at a time point that is different from the predetermined time point from a selected loop.

Abstract: A memory sub-system to track charge loss in memory cells and shifts of voltages optimized to read the memory cells. For example, a memory device can measure signal and noise characteristics of a group of memory cells to calculate an optimized read voltage of the group of memory cells. The memory sub-system having the memory device can determine an amount of charge loss in the group of memory cells, using at least the signal and noise characteristics, the optimized read voltage, and/or the bit error rate of data read using the optimized read voltage. The memory sub-system tracks changes in optimized read voltages of memory cells in the memory device based on the amount of charge loss.

Abstract: According to one embodiment, a memory system includes a semiconductor memory device and a controller. The device includes a plurality of memory cells capable of storing at least first to third data and a word line coupled to the plurality of memory cells. The first data is determined by a first read operation including a first read level. The second data is determined by a second read operation including a second read level. The third data is determined by a third read operation including a third read level. The controller controls the semiconductor memory device to perform a forth read operation including the first and second read levels in a search operation for first to third read voltages corresponding to the first to third read levels, respectively.

Abstract: A memory device includes: a memory cell array including a first memory cell group including memory cells located within a first physical distance from a reference node and a second memory cell group including memory cells located beyond the first physical distance from the reference node; a peripheral circuit configured to perform a program operation of applying program voltages increasing gradually to memory cells included in the memory cell array through word lines; and control logic configured to determine a time at which a first program permission voltage is applied to the first memory cell group and determine a magnitude of the first program permission voltage on the basis of a magnitude of the program voltages in response to a gradual increase in the program voltages, the control logic is further configured to control the peripheral circuit to apply the first program permission voltage to the first memory cell group through bit lines.

Abstract: A processing device in a memory sub-system determines whether a media endurance metric associated with a memory block of a memory device satisfies one or more conditions. In response to the one or more conditions being satisfied, one or more read margin levels corresponding to a page type associated with the memory device are determined. A machine learning model is applied to the one or more read margin levels to generate a margin prediction value based on the page type and a wordline group associated with the memory device. Based on the margin prediction value, the memory device is assigned to a selected bin of a set of bins. A media scan operation is executed on the memory device in accordance with a scan frequency associated with the selected bin.

Abstract: Numerous embodiments of programming, verifying, and reading systems and methods for use with a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. Selected cells can be programmed and verified with extreme precision to hold one of N different values. During a read operation, the system determines which of the N different values is stored in a selected cell.

Abstract: Disclosed herein are methods, apparatuses and systems related to manage memory blocks. A memory system can track a duration while a memory block remains open for programming operations. When the tracked duration meets or exceeds a corresponding threshold, the memory system can implement an internally commanded programming operation to store predetermined data into an open location that is adjacent to an end of the previously-written data in the memory block.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell transistors, a word line connected to a gate of each of the memory cell transistors, a sequencer configured to control an operation of the memory cell array, and an input/output circuit. When the input/output circuit receives a command instructing an operation of continuously reading data of a plurality of pages from the memory cell transistors, the sequencer determines the data of the plurality of pages by continuously applying read voltages corresponding to the plurality of pages to be read, to the word line. In each continuous time period during which the control circuit applies read voltages for determining the data of one of the pages to the word line, the control circuit does not apply any read voltage for determining the data of another one of the pages to the word line.

Abstract: A set of blocks of a memory device comprising a plurality of dies is identified. A block within the set of blocks is identified. The identified block is associated with a capability metric that reflects a projected reliability of the die on which the block resides. Responsive to determining that the capability metric satisfies a condition, a cycle threshold associated with the die is identified. Responsive to determining that a cycle count value derived from a program/erase cycle counter associated with the die matches the cycle threshold, the set of blocks is updated by excluding the block from the set of blocks. A program operation is performed with respect to the updated set of blocks.

Abstract: A method includes performing a first operation to program data to a group of memory cells of a memory device, wherein the data comprises host data and a bit pattern indicative of a first temperature of the group of memory cells and receiving a signal to perform a second operation to read the host data from the group of memory cells. The method further includes determining, responsive to receipt of the signal, whether a second temperature of the group of memory cells is outside a threshold temperature differential that is based on the bit pattern indicative of the first temperature of the group of memory cells, applying a voltage offset signal to the group of memory cells responsive to a determination that the second temperature of the group of memory cells is outside the threshold temperature differential, and performing the second operation to read the host data from the group of memory cells subsequent to application of the voltage offset signal to the group of memory cells.

Abstract: Provided is a non-volatile memory package that is electrically optimized with a plurality of different non-volatile memory chips through a ball map, by fixing positions of buffer chips connected to the plurality of different non-volatile memory chips.

Abstract: The present application discloses a non-volatile memory and an operating method of the non-volatile memory. The non-volatile memory includes a plurality of memory cells, and unselected word lines connected with the memory cells. The method includes applying a first voltage rising at a first slope to unselected word lines to charge the unselected word lines, and stopping applying the first voltage to the unselected word lines in response to that the first voltage rises to a predetermined voltage. The predetermined voltage is higher than a pass voltage of a plurality of memory cells connected with the unselected word lines.

Abstract: A memory system includes a memory device including a memory cell array, a first latch, a plurality of program latches, and a second latch and a memory controller configured to provide a command to the memory device. The memory device may sense first data from a first region of the memory cell array, store the sensed first data in the first latch, transfer the sensed first data to the second latch, output the first data from the second latch to the memory controller, and transfer the first data from the second latch to a first program latch of the plurality of program latches, in response to a first read command.

Abstract: The present disclosure generally relates to utilizing the host clock signal frequency to determine whether to operate in the default pulse width modulation (PWM) link startup sequence (LSS), be changed to high speed (HS) LSS by a host device capable of operating in either PWM LSS or HS LSS, or ignore the data storage device attributes of operating in PWM LSS and instead operate according to HS LSS. In so doing, the data storage device is adaptable to work with older generation UFS host devices as well as current and future generation UFS host devices.

Abstract: Methods, systems, and devices for storing parity during refresh operations are described. In some examples, refresh operations may be performed on a memory device when the memory device is idle. For example, a refresh operation may entail performing a logical operation on first data and a first set of parity bits and second data and a second set of parity bits. The logical operation may generate a third set of parity bits which may be used for data retention purposes. Moreover, during a read operation, the third set of parity bits may be used to recover corrupt or otherwise invalid data in the event of an error.

Abstract: A processing device coupled to the memory device can be configured to monitor respective raw bit error rates (RBERs) corresponding to a plurality of groups of memory cells of the memory device. The processing device can also be configured to responsive to determining that an RBER corresponding to a particular group of the plurality of groups of memory cells has met a criteria, adjust a read window budget corresponding to the particular group of memory cells.

Abstract: According to an embodiment, a circuit in a semiconductor memory device sets threshold voltages of a plurality of memory cells such that two first distributions are formed in a first section on a lowest voltage side in 2N sections. After that, the circuit sets threshold voltages of the plurality of memory cells such that 2(1+M) second distributions are separately formed two by two. The circuit then sets 2N third distributions for the 2N sections.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected word lines. The memory cells are disposed in strings and configured to retain a threshold voltage. A control means is configured to apply a program voltage to selected ones of the word lines while applying pass voltages to unselected ones of the word lines and ramp down both the selected ones of the plurality of word lines and the unselected ones of the word lines to a recovery voltage at a start of a verify phase of each of a plurality of program loops and apply a targeted word line bias to each of the word lines during the verify phase. The control means is also configured to adjust the recovery voltage based on the targeted word line bias applied to each of the plurality of word lines during the verify phase.

Abstract: Memory devices are disclosed. A memory device may include a bonding pad region for coupling command-and-address (CA) input signals and a memory cell region for storing information in memory cells. The memory device may also include a centralized CA interface region including input circuits coupled to the CA input signals. At least two of the input circuits are configured in pairs. Each pair includes a swap circuit configured to select one of a first CA output and a second CA output for a first internal CA signal and select the other of the first CA output and the second CA output for a second internal CA signal responsive to a control signal. Memory systems and systems are also disclosed.

Abstract: Memories might include an array of memory cells including a string of series-connected split-gate memory cells, and a controller configured to cause the memory to selectively activate a first memory cell portion of a selected split-gate memory cell of the string of series-connected split-gate memory cells in response to a data state of the first memory cell portion of the selected split-gate memory cell and deactivate a second memory cell portion of the selected split-gate memory cell, and activate a second memory cell portion of each remaining split-gate memory cell of the string of series-connected split-gate memory cells while selectively activating the first memory cell portion of the selected split-gate memory cell and deactivating the second memory cell portion of the selected split-gate memory cell.

Abstract: An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

Abstract: A negative voltage switching device includes a first switching circuit configured to transmit a first negative voltage, a second switching circuit configured to transmit a second negative voltage, and a switching selection circuit configured to select one of the first switching circuit or the second switching circuit for transmitting one of the first negative voltage and the second negative voltage to an output terminal.

Abstract: The present disclosure provides a memory controller including a state detector detecting whether the memory device is in an idle state, a program controller, based on detection information that indicates a state of the memory device, selecting neighboring strings that are adjacent to a string that is coupled to a memory cell, among the memory cells, on which a program operation or a read operation was performed before the detecting, selecting monitoring memory cells that are coupled to at least one word line, the memory cells being a part of the neighboring strings, and controlling the memory device to perform a plurality of loops to program the monitoring memory cells, and a bad block selector selecting a memory block with the monitoring memory cells as a bad block based on a rate of increase in threshold voltage of a threshold voltage distribution of the monitoring memory cells.

Abstract: A three-dimensionally stacked nonvolatile semiconductor memory of an aspect of the present invention including conductive layers stacked on a semiconductor substrate in such a manner as to be insulated from one another, a bit line which is disposed on the stacked conductive layers, a semiconductor column which extends through the stacked conductive layers, word lines for which the stacked conductive layers except for the uppermost and lowermost conductive layers are used and which have a plate-like planar shape, memory cells provided at intersections of the word lines and the semiconductor column, a register circuit which has information to supply a potential suitable for each of the word lines, and a potential control circuit which reads the information retained in the register circuit in accordance with an input address signal of a word line and which supplies a potential suitable for the word line corresponding to the address signal.

Abstract: Three-dimensional semiconductor devices are provided. The three-dimensional semiconductor device includes a substrate, a buffer layer on the substrate. The buffer layer includes a material having an etching selectivity relative to that of the substrate. A multi-layer stack including alternating insulation patterns and conductive patterns is provided on the buffer layer opposite the substrate. One or more active patterns respectively extend through the alternating insulation patterns and conductive patterns of the multi-layer stack and into the buffer layer. Related fabrication methods are also discussed.