Abstract: A method and apparatus to reduce read retry operations in a NAND Flash memory is provided. To reduce the number of read retries for future reads, a word line group is assigned an optimal read voltage, the reference voltage that results in eliminating the read error for the word line is selected as the optimal read voltage (also referred to as a “sticky voltage”) for the word line group to be used for a next read of the page. An optimal read voltage per word line group for the page per NAND Flash memory die is stored in the lookup table. Storing an optimal read voltage per word line group instead of per die reduces the number of read retries.

Abstract: A method for optimizing the electrical performance of all or part of a photovoltaic module (11) through breakdown at the metal/oxide/metal interface. The method may include: —Step 1: Illuminating all or part of said photovoltaic module with a luminous flux controlled by a control module (14); —Step 2: Reverse-biasing said photovoltaic module: by subjecting it to a voltage sweep ranging from ?Voc/2, Voc being the open-circuit voltage, to a limit bias voltage VL whose value depends on the mode of interconnection and on the number (NB) of cells forming all or part of said photovoltaic module.

Abstract: A semiconductor apparatus includes a calibration circuit, a selection circuit, and a data circuit. The calibration circuit generates a plurality of calibration signals by being coupled to a plurality of reference resistors. The selection circuit selects at least one signal among the plurality of calibration signals on the basis of an impedance setting signal. The data circuit sets an impedance based on the selected calibration signal.

Abstract: Circuits and methods for compensating mismatches in sense amplifiers are disclosed. In one example, a circuit is disclosed. The circuit includes: a first branch, a second branch, a first plurality of trimming transistors and a second plurality of trimming transistors. The first branch comprises a first transistor, a second transistor, and a first node coupled between the first transistor and the second transistor. The second branch comprises a third transistor, a fourth transistor, and a second node coupled between the third transistor and the fourth transistor. The first node is coupled to respective gates of the third transistor and the fourth transistor. The second node is coupled to respective gates of the first transistor and the second transistor. The first plurality of trimming transistors is coupled to the second transistor in parallel. The second plurality of trimming transistors is coupled to the fourth transistor in parallel.

Abstract: A memory device is provided. The memory device includes a bit cell having a first invertor connected between a first node and a second node and a second invertor connected between the first node and the second node. The first invertor and the second invertor are cross coupled at a first data node and a second data node. The memory device further includes a pull down circuit connected to the second node. The pull down circuit is operative to pull down a voltage of the second node below a ground voltage in response to an enable signal.

Abstract: A method may be performed by a leakage monitoring and compensation system configured to estimate and compensate for leakage current in memory unit cells. The method may include identifying a leakage monitoring component associated with a memory unit cell. Further, the method may include sampling multiple leak events during a first exposure window. The method may include storing a first count representing the plurality of leak events sampled during the first exposure window. Each leak event may correspond to a unit of memory leakage. The method may include sampling multiple sensing events during a second exposure window. The method may include detecting a second count representing the sensing events sampled during the second exposure window. The method may include determining a compensation value representing a difference between the first count and the second count.

Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.

Abstract: A reference generator circuit included in a computer system may employ multiple field-effect transistors to generate a reference voltage whose value is based on the threshold voltages of the multiple field-effect transistors. The reference generator circuit can include a current source that generates a bias current. One of more stages included in the reference generator circuit can generate, using the bias current, respective output voltages whose values are based on differences in threshold voltages of field-effect transistors included in the stages. The output voltages can be combined to generate different reference voltage values.

Abstract: A flash memory system may include a flash memory and a circuit for performing operations on the flash memory. The circuit may be configured to obtain a first soft read sample by performing a first read operation on a location of the flash memory with a first reference voltage. The circuit may be configured to determine a second reference voltage based on the first soft read sample. The circuit may be configured to obtain a second soft read sample by performing a second read operation on the location of the flash memory with the second reference voltage. The circuit may be configured to generate soft information based on the first and second soft read samples. The circuit may be configured to decode a result of a third read operation on the location of the flash memory based on the soft information.

Abstract: Disclosed herein is an adaptive voltage regulator that includes a voltage regulator circuit configured to provide a regulated output voltage at an output node of the adaptive voltage regulator circuit. The adaptive voltage regulator also includes an adaptation circuit coupled to the output node that is configured to adapt a charging characteristic associated with a charging of the output node to a predefined output voltage as a function of a load coupled to the output node. The adaption circuit may be configured to selectively provide additional charging current that charges the output node to the predefined output voltage depending on the load.

Abstract: A memory array is provided and including a plurality of bit lines and a plurality word lines; a plurality of memory cell units, arranged at cross points of the plurality of bit lines and the plurality of word lines; a bit line switch circuit, coupled to the plurality of memory cell units and being operated to select one of the plurality of bit lines; a word line switch circuit, coupled to the plurality of memory cell units and being operated to select one of the plurality of word lines; and a voltage clamper circuit, provided in at least one of the word line switch circuit and the bit line switch circuit.

Abstract: A memory device includes a plurality of word lines (WLs). The memory device includes a plurality of drivers that are each configured to control a corresponding one of the plurality of WLs and each comprise a first transistor having a first conductive type and a second transistor having a second conductive type. The first transistor of a first one of the drivers is formed in a first well of a substrate, and the second transistor of the first driver is formed in a second well of the substrate. The first well is spaced apart from the second well.

Abstract: A semiconductor memory device capable of reducing failure caused by a source side effect after a large number of W/E cycles is provided. A reading method of a NAND flash memory includes: dividing multiple word lines connected to each memory cell of a NAND string into a group 1 of word lines WL0 to WLi?1, a group 2 of word lines WLi to WLj, . . . , a group y of word lines WLj+1 to WLk?1, and a group x of word lines WLk to WLn, presetting a relationship that each readout voltage (Vread1, Vread2, . . . , Vready, and Vreadx) corresponding to each group increases toward a bit line side, and applying a readout voltage to a selected word line according to the relationship.

Abstract: According to some embodiments, a memory controller may be provided. A compute-in-memory array may be connected to a plurality of word lines of the memory controller, with multiple word lines per word being associated with different temperature coefficients, to facilitate temperature compensation of the compute-in-memory array. In some embodiments, the compute-in-memory array may be associated with parameter floating-gate transistors. Moreover, a plurality of compute-in-memory arrays may be individually programmed to several orders of parameter magnitude.

Abstract: Methods, systems, and devices for deck selection layouts in a memory device are described. In some implementations, a tile of a memory array may be associated with a level above a substrate, and may include a set of memory cells, a set of digit lines, and a set of word lines. Selection transistors associated with a tile of memory cells may be operable for coupling digit lines of the tile with circuitry outside the tile, and may be activated by various configurations of one or more access lines, where the various configurations may be implemented to trade off or otherwise support design and performance characteristics such as power consumption, layout complexity, operational complexity, and other characteristics. Such techniques may be implemented for other aspects of tile operations, including memory cell shunting or equalization, tile selection using transistors of a different level, or signal development, or various combinations thereof.

Abstract: A voltage regulator for providing a word line voltage is provided. The voltage regulator includes a voltage divider, a comparator, a boost circuit and a bypass transistor. The voltage divider is coupled between the word line voltage and a low reference voltage. The voltage divider includes resistive elements connected in series at intermediate nodes. The comparator provides an enable signal according to a divided voltage value on a divided intermediate node among the intermediate nodes. The boost circuit boosts the word line voltage in response to the enable signal. A source terminal of the bypass transistor is connected to a first intermediate node among the intermediate nodes. A drain terminal of the bypass transistor is connected to a second intermediate node among the intermediate nodes. The bypass transistor is turned-off in response to the control signal having an intermediate voltage value on the first intermediate node.

Abstract: Sense amplifier, memory and control method are provided. The sense amplifier includes: amplify module configured to amplify voltage difference between bit line and reference bit line when the sense amplifier is in amplifying stage; write module connected to the bit line and the reference bit line, and configured to pull the voltage difference between the bit line and the reference bit line according to data to be written when the sense amplifier is in write stage; controllable power module connected to the amplify module, configured to provide first voltage to the amplify module when the sense amplifier is in non-write stage, and to provide second voltage to the amplify module when the sense amplifier in write stage. Herein, the second voltage is less than the first voltage, and the second voltage is in positive correlation with the drive capability of the write module.

Abstract: A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.

Abstract: The present disclosure relates to a drive circuit, including: a first module, generating display data based on image information; a second module, generating a display signal based on the display data and a plurality of clock signals; a third module, outputting a constant current based on the display signal; and a fourth module, configured to provide a reference current to the third module, wherein the fourth module includes: a reference voltage generation module, a bias module, a current generation module, and a pre-charging module. Any two adjacent clock signals of the plurality of clock signals differ by M complete clock cycles, where 0?M<1. This circuit can realize relatively high image display accuracy with relatively low system power consumption and chip cost, and meanwhile realize effective low grayscale compensation for image.

Abstract: A driver circuit for operating a memory cell, adapted to be coupled to at least one memory cell through a respective output node, said driver circuit including: a first circuit for supplying the memory cell with a first read reference voltage through the output node; a second circuit for supplying the memory cell with a second read reference voltage through the output node; and a third circuit for controlling an operation of the second circuit, wherein a range of the second read reference voltage at the output node is wider than a range of the first read reference voltage at the output node during a read operation on the memory cell.

Abstract: A semiconductor memory device includes a memory cell, a word line connected to the memory cell, a source line connected to the memory cell, a bit line connected to the memory cell, and a control circuit configured to perform a read operation on the memory cell. During the read operation, the control circuit applies to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage, and applies to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage.

Abstract: Methods and devices to reduce or remove slumps in power supplies are disclosed. The disclosed teachings can serve various applications, such as applications implementing RF switches. Using such teachings, an integrated method can benefit from two different modes of operation where either an external or an internal charge pump can be used to provide a desired negative voltage to various components within the integrated circuit. This can be done by disposing a larger load capacitor outside the integrated circuit and without compromising any die space requirement.

Abstract: A semiconductor apparatus includes a command decoding circuit and an enable signal generation circuit. The command decoding circuit generates an operation code and a strobe pulse based on a command signal and a clock signal. The enable signal generation circuit generates a seed signal based on the operation code and the strobe pulse and generates an enable signal by shifting the seed signal. The enable signal generation circuit generates a plurality of guard keys based on a plurality of operation codes and the strobe pulse and prevents the generation of the enable signal for a predetermined time when the plurality of guard keys are not sequentially enabled.

Abstract: Methods, systems, and devices for an improved power supply for a memory device are described. An apparatus may include a memory device, one or more voltage detectors, and one or more voltage converters. A voltage detector may generate an output indicating whether a voltage at a first pin of the apparatus satisfies a threshold. A voltage converter may be coupled with the voltage detector and may be configured to selectively output a second voltage depending on the output of the voltage detector. Circuitry within the memory device may be coupled with one or more voltage detectors and one or more voltage converters and configured to select a supply voltage for another component of the memory device from among the first voltage (e.g., received from the first pin) and the second voltage (e.g., selectively generated and output by the voltage converter) based on the output from the voltage detector.

Abstract: Methods, systems, and devices for current budget adaption are described. A controller may be coupled with a set of memory devices. The controller may receive current consumption information from the set of memory devices and update a current consumption budget for the set of memory devices based on the current consumption information.

Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.

Abstract: A NAND flash memory according to an embodiment includes a memory array, a detection circuit, and a drive circuit. The drive circuit is a circuit for driving a plurality of linearly arranged memory cells through a linear word line connected to the plurality of memory cells. The drive circuit has a function of generating a drive voltage in which a pre-pulse having a predetermined amplitude value is set at a timing corresponding to rising of a voltage signal, which rises stepwise by a voltage value, and applying the drive voltage to the word line and a function of detecting a voltage value at a predetermined position of the word line and setting a time width of the pre-pulse according to the detected voltage value.

Abstract: Methods of operating a memory, and memory configured to perform similar methods, may include determining a memory cell age of a plurality of memory cells, determining a desired programming step voltage for programming memory cells having the determined memory cell age, and performing a programming operation on the plurality of memory cells using the desired programming step voltage corresponding to the determined memory cell age. Methods may further include configuring a memory, including characterizing a read window budget for a programming operation of the memory as a function of a programming step voltage for a plurality of memory cell ages.

Abstract: The disclosure provides an anti-fuse device including an anti-fuse unit and a sensing circuit. The anti-fuse unit includes a first anti-fuse and a second anti-fuse serially connected between a first terminal of the anti-fuse unit and a second terminal of the anti-fuse unit. The sensing circuit is coupled to the first terminal and the second terminal of the anti-fuse unit for sensing a blown state of the anti-fuse unit.

Abstract: A memory system for storing data that includes providing a memory module having one or more memory devices and a voltage regulator for controlling voltage levels supplied to the one or more memory devices, wherein the voltage regulator has a first state that permits write and read operations with the one or more memory devices, and a second state where the voltage regulator prevents at least read operations with the one or more memory devices the system configured to store an encryption key in ROM on the voltage regulator; copy the encryption key value from the ROM to a voltage regulator register; set a voltage regulator encryption timer for a period of time; and transition the voltage regulator to the second state in response to the voltage regulator encryption timer expiring.

Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum voltage signal from among the multiple voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum voltage signal from among the multiple voltage signals to minimize power consumption.

Abstract: A memory device includes a charge pump connected to a power supply voltage and including a plurality of stages to output an output voltage, a stage counter configured to output a count value that incrementally increases to a number of the stages, and a regulator configured to compare the output voltage with a reference output voltage of the charge pump that is generated using the incrementally increasing count value obtained by the stage counter, and to output a pump operation signal at a time when the reference output voltage becomes greater than or equal to the output voltage, wherein the charge pump operates in response to the pump operation signal.

Abstract: Technology for sensing non-volatile memory cells in which one or more sense nodes are charged to a sense voltage having a magnitude that improves sensing accuracy. One sense node may be charged to different sense voltages when sensing different memory cells at different times. Multiple sense nodes may be charged to a corresponding multiple different sense voltages when sensing different memory cells at the same time. The one or more sense nodes are allowed to discharge based on respective currents of memory cells for a pre-determined time while applying a reference voltage to the memory cells. The Vts of the selected memory cells are assessed based on respective voltages on the one or more of sense nodes after the pre-determined time. Different sensing voltages may be used based on bit line voltage, bit line resistance, distance of memory cells from the sense node, or other factors.

Abstract: Methods, systems, and devices for deck selection layouts in a memory device are described. In some implementations, a tile of a memory array may be associated with a level above a substrate, and may include a set of memory cells, a set of digit lines, and a set of word lines. Selection transistors associated with a tile of memory cells may be operable for coupling digit lines of the tile with circuitry outside the tile, and may be activated by various configurations of one or more access lines, where the various configurations may be implemented to trade off or otherwise support design and performance characteristics such as power consumption, layout complexity, operational complexity, and other characteristics. Such techniques may be implemented for other aspects of tile operations, including memory cell shunting or equalization, tile selection using transistors of a different level, or signal development, or various combinations thereof.

Abstract: Energy consumption is reduced within an Internet of Things (IoT) device, without degrading operating performance of the corresponding internal circuitry. A first internal supply voltage (VDDa) used to supply the internal circuitry is reduced from a VDD supply voltage to a lower voltage during an idle state, thereby reducing leakage currents in the internal circuitry. The first internal supply voltage (VDDa) may be reduced to a voltage that is one threshold voltage (Vtp) lower than the VDD supply voltage. A second internal supply voltage (VSSa) used to supply the internal circuitry is increased from the VSS supply voltage to a voltage higher than the VSS supply voltage during the idle state, thereby further reducing leakage currents in the internal circuitry. The second internal supply voltage (VSSa) may be increased to a voltage that is one threshold voltage (Vtn) higher than the VSS supply voltage.

Abstract: Various embodiments of high voltage generation circuits, high voltage operational amplifiers, adaptive high voltage supplies, adjustable high voltage incrementor, adjustable reference supplies, and reference circuits are disclosed. These circuits optionally can be used for programming a non-volatile memory cell in an analog neural memory to store one of many possible values.

Abstract: Apparatus and methods are disclosed for providing a bias, comprising a bias generator circuit including a high voltage (HV) circuit configured to generate a regulated high voltage (HV) from an HV line and provide the regulated HV at an HV regulated line and a low voltage (LV) circuit configured to generate a low voltage (LV) differential from the HV line and to provide the LV differential at an LV line.

Abstract: Apparatuses, systems, and methods for voltage based random number generation. A memory may include a number of different voltages, which may be used to power various operations of the memory. During access operations to the memory, the voltage may vary, for example as word lines of the memory are accessed. The variability of the voltage may represent a source of randomness and unpredictability in the memory. A random number generator may provide a random number based on the voltage. For example, an analog to binary converter (ADC) may generate a binary number based on the voltage, and the random number may be based on the binary number.

Abstract: Numerous embodiments are disclosed for providing temperature compensation in an analog memory array. A method and related system are disclosed for compensating for temperature changes in an array of memory cells by measuring an operating temperature within the array of memory cells and changing a threshold voltage of a selected memory cell in the array of memory cells to compensate for a change in the operating temperature.

Abstract: Disclosed is a memory device for cancelling a sneak current. The memory device according to the exemplary embodiment of the present disclosure includes a memory cell array which includes a plurality of word lines and a plurality of bit lines intersecting each other and memory cells disposed at intersections of the word lines and the bit lines; and a sensing circuit which supplies a bit line current to all or some of the bit lines, cancels a sneak current based on the bit line current by at least one switching control, and senses and amplifies data stored in the memory cell to output the sensed and amplified data.

Abstract: Aspects described herein include a method of generating three-dimensional (3D) spikes. The method comprises receiving a signal comprising time-series data and generating a first two-dimensional (2D) grid. Generating the first 2D grid comprises mapping segments of the time-series data to respective positions of the first 2D grid, and generating, for each position, a spike train corresponding to the respective mapped segment. The method further comprises generating a second 2D grid including performing, for each position, a mathematical operation on the spike train of the corresponding position of the first 2D grid. The method further comprises generating a third 2D grid including performing spatial filtering on the positions of the second 2D grid. The method further comprises generating a 3D grid based on a combination of the first 2D grid, the second 2D grid, and the third 2D grid. The 3D grid comprises one or more 3D spikes.

Abstract: Technologies relating to crossbar array circuits with a 2T1R RRAM cell that includes at least one NMOS transistor and one PMOS transistor for low voltage operations are disclosed. An example apparatus includes a word line; a bit line; a first NMOS transistor; a second PMOS transistor; and an RRAM device. The first NMOS transistor and the second PMOS transistor are in parallel as a pair, wherein the pair connects in series with the RRAM device. The apparatus may further include an inverter, via which the second gate terminal of the second PMOS transistor is connected to the first gate terminal.

Abstract: A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.

Abstract: A semiconductor memory device includes a memory cell, a word line connected to the memory cell, a source line connected to the memory cell, a bit line connected to the memory cell, and a control circuit configured to perform a read operation on the memory cell. During the read operation, the control circuit applies to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage, and applies to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage.

Abstract: According to one embodiment, a memory device includes first and second wiring lines, a memory cell connected between the first and second wiring lines and including a resistance change memory element and a switching element connected in series to the resistance change memory element, and a determination circuit determining a determination object resistance state set in advance to the resistance change memory element based on a determination object voltage applied to the second wiring line when the switching element makes a transition from an on-state to an off-state.

Abstract: A shift register unit circuit includes an input sub-circuit, a pull-up sub-circuit, a pull-down control sub-circuit, a pull-down sub-circuit, and a voltage regulating sub-circuit. The input sub-circuit receives an input signal from a signal input terminal to control a potential of a pull-up node. The pull-up sub-circuit outputs a gate driving signal to an output terminal under control of the potential of the pull-up node and a signal from a first signal terminal. The pull-down control sub-circuit conducts a pull-down node with a first node under control of a signal from the second signal terminal. The pull-down sub-circuit conducts the pull-up node with the first node and the turn-down signal terminal with the output terminal under control of a potential of the pull-down node. The voltage regulating sub-circuit conducts the first node with the turn-down signal terminal under control of a potential of the first node.

Abstract: A method of programming a resistive memory device, and a corresponding resistive memory device, which includes the resistive memory device, in response to a write command, applying a write pulse to a selected memory cell arranged in a region where a selected word line intersects with a selected bit line; and after the applying the write pulse, applying a dummy pulse to at least one unselected memory cell. The at least one unselected memory cell is connected to at least one of the selected word line, the selected bit line, a first word line adjacent to the selected word line, and a first bit line adjacent to the selected bit line.

Abstract: In a computing-in-memory chip and a memory cell array structure, a memory cell array therein includes a plurality of memory cell sub-arrays arranged in an array. Each memory cell sub-array comprises a plurality of switch units and a plurality of memory cells arranged in an array; and first terminals of all memory cells in each column are connected to a source line, second terminals of all the memory cells are connected to a bit line, third terminals of all memory cells in each row are connected to a word line through a switch unit, a plurality of rows of memory cells are correspondingly connected to a plurality of switch units, control terminals of the plurality of switch units are connected to a local word line of the memory cell sub-array, and whether to activate the memory cell sub-array is controlled by controlling the local word line.

Abstract: A memory device and methods for programming and reading a memory device are provided. The memory device includes a memory array and a memory controller. The memory array includes a plurality of one-time programmable (OTP) cells, in which the OTP cells comprises a plurality of data cells for storing data, a plurality of supplementary cells in parallel to the data cells, and one or more redundant cells for each of a plurality of sets of the data cells. The memory controller is configured to program the data cells. The memory controller verifies and records a state of each data cell in a set of the data cells in the corresponding supplementary cell after the programming, and stores the data to be programmed to the data cell using the one or more redundant cells reserved for the set of the data cells when the data cell is verified as failed.

Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.