Abstract: A data training method of a storage device, which includes a storage controller and a nonvolatile memory device, includes transmitting a read training command to the nonvolatile memory device, receiving a first training pattern output from the nonvolatile memory device in response to the read training command, receiving a second training pattern output from the nonvolatile memory device in response to the read training command, comparing the received first training pattern and the received second training pattern with a reference pattern, and determining a read timing offset of the storage controller depending on the comparison result.

Abstract: A sense amplifier circuit comprising a pair of cross-coupled inverters and a data line charging circuit is disclosed. The cross-coupled inverters comprise a first inverter and a second inverter. The first inverter has a first pull-up transistor with a first pull-up terminal. The second inverter has a second pull-up transistor with a second pull-up terminal. The output of the first inverter is coupled to the input of the second inverter at a first sense amp node. The output of the second inverter is coupled to the input of the first inverter at a second sense amp node. The data line charging circuit has a first node connected to a data line and the first pull-up terminal. The data line charging circuit also has a second node connected to a complementary data line and the second pull-up terminal. The first and second pull-up transistors are coupled to different voltage levels when a sense amplifier enable signal is activated.

Abstract: A random access memory includes a data signal line, a data-synchronization signal line for a data synchronization signal which provides a synchronization signal when data is transmitted to the data signal line, and a setting module. The setting module determines whether the data signal line is set to be a data signal line for common input/output use, a data signal line for output-only use, or a data signal line for input-only use, and further determines whether the data-synchronization signal line is set to be a data-synchronization signal line for common input/output use, a data-synchronization signal line for output-only use, or a data-synchronization signal line for input-only use.

Abstract: A semiconductor integrated circuit includes a write path coupled to a pad, a read path coupled to the pad, and a reference voltage output control block configured to apply a reference voltage to the pad through the write path in response to a reference voltage monitoring signal. The read path is electrically isolated from the pad in response to the reference voltage monitoring signal.

Abstract: Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.

Abstract: Systems and methods are disclosed for increasing the performance of static random access memory (SRAM). Various systems herein, for example, may include or involve dual- or multi-pipe, multi-bank SRAMs, such as Quad-B2 SRAMs. In one illustrative implementation, there is provided an SRAM memory device including a memory array comprising a plurality of SRAM banks and pairs of separate and distinct pipes associated with each of the SRAM banks, wherein each pair of pipes may provide independent access to its associated SRAM bank.

Abstract: A write circuit in a memory array includes a global data line, a switching circuit, and a first local data line coupled with the switching circuit and with a first plurality of memory cells. The global data line is configured to receive data to be written to the memory cell from outside of the memory array. The switching circuit is configured to electrically couple the global data line with the first local data line to transfer the data to be written to a memory cell of the first plurality of memory cells to the first local data line. The memory cell of the first plurality of memory cells is configured to receive data on the first local data line.

Abstract: Disclosed are various apparatuses and methods for a memory with a multiple read word line design. A memory may include a plurality of bit cells arranged in a row, a first read word line connected to a first subset of the plurality of bit cells, and a second read word line connected to a second subset of the plurality of bit cells, wherein the first and second subsets are located in the same row of bit cells. A method may include asserting, during a first read operation, a first read word line connected to a first subset of a plurality of bit cells arranged in a row of bit cells, and asserting, during a second read operation, a second read word line connected to a second subset of the plurality of bit cells, wherein the first and second subsets are located in the same row of bit cells.

Abstract: A memory system includes a memory array and a read/write module. The memory array includes bit lines, word lines, and memory cells. Each of the memory cells is located at an intersection of a respective one of the bit lines and a respective one of the word lines. The memory cells include a first memory cell and a second memory cell. The first memory cell is located at the intersection of a first bit line of the bit lines and a first word line of the word lines. The second memory cell is located at the intersection of a second bit line of the bit lines and a second word line of the word lines. The read/write module is configured to concurrently activate the first memory cell and the second memory cell to simultaneously access both the first memory cell and the second memory cell.

Abstract: A memory cell and array and a method of forming a memory cell and array are described. A memory cell includes first and second pull-up transistors, first and second pull-down transistors, first and second pass-gate transistors, and first and second isolation transistors. Drains of the first pull-up and first pull-down transistors are electrically coupled together at a first node. Drains of the second pull-up and second pull-down transistors are electrically coupled together at a second node. Gates of the second pull-up and second pull-down transistors are electrically coupled to the first node, and gates of the first pull-up and first pull-down transistors are electrically coupled to the second node. The first and second pass-gate transistors are electrically coupled to the first and second nodes, respectively. The first and second isolation transistors are electrically coupled to the first and second nodes, respectively.

Abstract: An integrated circuit with SRAM cells containing dual passgate transistors and a read buffer, all connected to one word line is disclosed. The read buffer and one passgate transistor may be variously configured to a separate read data line and write data line, or a combined data line, in different embodiments. The read buffer in addressed SRAM cells may be biased during read operations. The read buffer in half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line. The read buffer in addressed and half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line.

Abstract: A memory apparatus includes a plurality of memory arrays, each memory array including a plurality of memory cells. The apparatus includes a plurality of global bit lines and each one of the global bit lines is connected to a plurality of local bit lines, which are in turn connected to a plurality of memory cells. The apparatus includes a plurality of global bit line (GBL) latches and each GBL latch is located along a separate global bit line to latch a signal along the respective global bit line. The apparatus further includes a plurality of solar bit lines configured to connect the global bit lines to an output latch via a plurality of logic gates.

Abstract: A voltage generator includes a high voltage generator configured to include a plurality of pump circuits for generating various levels of a high voltage in response to clock signals, wherein the plurality of pump circuits are configured to receive enable signals corresponding to a level of voltage to be generated, where the enable signals are generated in response to internal operation signals. And a clock transfer circuit configured to generate a clock enable signal by comparing the high voltage and a reference voltage and to selectively provide the clock signals to each of the pump circuits in response to the clock enable signal and each of the enable signals.

Abstract: A nonvolatile semiconductor memory quickly and precisely accumulates a desired amount of charges corresponding to data-to-be-written in a charge accumulating part of a memory cell. When charges are injected into the charge accumulating part of the memory cell by applying a writing voltage corresponding to the data-to-be-written to the drain or source region of the memory cell, the writing voltage is reduced on the basis of an increase in the amount of charges accumulated in the charge accumulating part.

Abstract: Provided are a nonvolatile memory device and a read method of the same. The read method applying one of a plurality of unselected read voltages to unselected wordlines adjacent to a selected word line. The voltage applied to the unselected word lines being based on which of a plurality of selected read voltages is applied to the selected wordline.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: A system and method to manage leakage of a complementary metal-oxide-semiconductor (CMOS) read transistor in a memory cell. In a particular embodiment, a memory cell is disclosed that includes a storage element and a complementary metal-oxide-semiconductor (CMOS) read transistor. The CMOS read transistor includes a first terminal coupled to a read word line, a second terminal coupled to a read bit line, and a third terminal coupled to the storage element. During a non-read operating time, the read word line and the read bit line are both maintained at substantially the same voltage level. During a read operation, the read word line is maintained at a particular voltage level until after a voltage representing data stored at the storage element is sensed by the CMOS read transistor.

Abstract: Technique of operating a non-volatile memory are presented so that in case data that would otherwise be lost in the case of a word line to word line short is preserved. Before writing a word line, the data from a previously written adjacent is word line is read back and stored in data latches associated with the corresponding bit lines, but that are not being used for the data to be written. If a short occurs, as the data for both word lines is still in the latches, it can be written to a new location. This technique can also be incorporated into cache write operations and for a binary write operation inserted into a pause of a multi-state write.

Abstract: Based on a continuous erase start signal outputted, in response to an inputted continuous erase command, from a continuous erase control circuit, a shift circuit outputs a control signal for giving instructions to execute respective data erase operation to a plurality of non-volatile memory circuits sequentially, and when the data erase operation in all of the non-volatile memory circuits has been completed, the shift circuit outputs a continuous erase completion signal. Thereby, the data erase operation in all of the non-volatile memory circuits built in one chip can be continuously executed by one continuous erase command as is also the case where a single non-volatile memory circuit is built in.

Abstract: A method can include storing bank addresses, if received, on at least rising and falling edges of a same clock cycle; and if addresses stored on the rising and falling edges of the same clock cycle correspond to different banks of a memory device, starting accesses to both banks after the falling edge of the clock cycle; wherein any of the banks can be accessed in response to an address stored on a rising edge of a next clock cycle. Devices and additional methods are also disclosed.

Abstract: According to one embodiment, there is provided a semiconductor memory device including a memory cell array, a plurality of signal lines, and a plurality of signal-line-lead-out portions. In the memory cell array, a plurality of memory cells are arranged. The plurality of signal lines connected to the plurality of memory cells. The plurality of signal-line-lead-out portions are arranged in a periphery of the memory cell array and are connected to the plurality of signal lines. Each of the plurality of signal-line-lead-out portions includes a plug as an electrode whose upper surface and side surface are covered with a passivation film.

Abstract: A memory cell and array and a method of forming a memory cell and array are described. A memory cell includes first and second pull-up transistors, first and second pull-down transistors, first and second pass-gate transistors, and first and second isolation transistors. Drains of the first pull-up and first pull-down transistors are electrically coupled together at a first node. Drains of the second pull-up and second pull-down transistors are electrically coupled together at a second node. Gates of the second pull-up and second pull-down transistors are electrically coupled to the first node, and gates of the first pull-up and first pull-down transistors are electrically coupled to the second node. The first and second pass-gate transistors are electrically coupled to the first and second nodes, respectively. The first and second isolation transistors are electrically coupled to the first and second nodes, respectively.

Abstract: A semiconductor device is formed using a material which allows a sufficient reduction in off-state current of a transistor; for example, an oxide semiconductor material, which is a wide-gap semiconductor, is used. When a semiconductor material which allows a sufficient reduction in off-state current of a transistor is used, the semiconductor device can hold data for a long time. Transistors each including an oxide semiconductor in memory cells of the semiconductor device are connected in series; thus, a source electrode of the transistor including an oxide semiconductor in the memory cell and a drain electrode of the transistor including an oxide semiconductor in the adjacent memory cell can be connected to each other. Therefore, the area occupied by the memory cells can be reduced.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has a maximum variation width of a threshold voltage for memorizing an information set larger than that of the second nonvolatile memory area. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information, and the second nonvolatile memory area can be prioritized to guarantee the number of times of rewrite operation of memory information.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.

Abstract: A charge pump system uses a dynamic switching approach, where the pump connections are independent of the load for each output. One large pump is designed to be shared between all of the outputs for use during the ramp up during recovery, with each output level also have one designated pump to maintain its level when under regulation. Each small pump is designed with capability that can maintain its output at its regulation level. Each of these pumps can be tailored to the corresponding output level, such as the number of stages being higher in the pump to supply the higher output level. The large pump unit is constructed to be ample to provide sufficient drive to be able to assist in the ramp up phase for all of the outputs and has as many switches needed to connect the pump with all the needed outputs.

Abstract: In a semiconductor device and a write control circuit, a voltage detection unit detects a write voltage supplied to a storage element (electrical fuse element) in which only single writing is electrically performed and, when the write voltage is equal to or more than a predetermined threshold voltage, allows the write control unit to stop writing to the electrical fuse element regardless of the write signal. The above processing permits the write control circuit to suppress false writing caused by the fact that abnormality occurs in a write voltage and it becomes an overvoltage.

Abstract: A method and system for determining a respective threshold voltage of each of a plurality of transistors in a memory array. The method includes: applying a ramp voltage to gates of the plurality of transistors, wherein the ramp voltage is configured to increase based on an incrementing digital code; as the ramp voltage is being applied, generating a respective control signal in response to sensing a predetermined threshold current along a respective bitline in the memory array, wherein each transistor in the memory array is in communication with a respective bitline in the memory array; and for each transistor in the memory array, latching a current value of the incrementing digital code in response to the respective control signal corresponding to the transistor being generated. The current value of the incrementing digital code latched by each register corresponds to the threshold voltage of the corresponding transistor.

Abstract: A memory system includes a plurality of bit lines, a plurality of word lines, a plurality of memory cells, and a read/write module. The bit lines include a first bit line and a second bit line. The word lines include a first word line and a second word line. Each memory cell is located at an intersection of a respective one of the bit lines and a respective one of the word lines. The memory cells include a first memory cell and a second memory cell. The first memory cell is located at the intersection of the first bit line and the first word line. The second memory cell is located at the intersection of the second bit line and the second word line. The read/write module is configured to concurrently activate the first memory cell and the second memory cell for (i) a read operation or (ii) a write operation.

Abstract: Systems and methods are disclosed for increasing the performance of static random access memory (SRAM). Various systems herein, for example, may include or involve dual- or multi-pipe, multi-bank SRAMs, such as Quad-B2 SRAMs. In one illustrative implementation, there is provided an SRAM memory device including a memory array comprising a plurality of SRAM banks and pairs of separate and distinct pipes associated with each of the SRAM banks, wherein each pair of pipes may provide independent access to its associated SRAM bank.

Abstract: In one aspect, an electronic memory array includes overlapping, generally parallel sets of conductors, and includes storage elements near each point of overlap. One set of conductors has a non-negligible resistance. An address path for each storage element traverses a portion of one each of the first and second sets of conductors and a selectable resistance element. All storage element address paths have substantially equivalent voltage drops across the corresponding storage elements.

Abstract: A semiconductor device including a plurality of memory cells arranged in a matrix pattern, a write amplifier which writes write data to the memory cell in synchronization with a clock, a sense amplifier which reads out the write data written in the memory cell in synchronization with the clock, a plurality of column select switches which connect the plurality of the memory cells with the sense amplifier and the write amplifier, a column address decoder which makes the column select switch corresponding to one column among the plurality of the memory cells a conductive state based on a column address, a row address decoder which activates the memory cell of one row based on a row address, and a test write circuit which writes data corresponding to a logical level of a test signal to the memory cell based on a test mode signal.

Abstract: Disclosed is a semiconductor device including: a first switch controlling connection between a first data line pair a second data line pair; a first amplifier connected to the first data line pair; a second switch controlling the connection between the second data line pair and a third data line pair; a second amplifier amplifying data on the second data line pair and delivering the amplified data to the third data line pair; a third amplifier connected to the third data line pair; and a switch control circuit controlling the second switch. Based upon a first control signal that controls precharging and equalization of the first data line pair, the switch control circuit renders the second switch conductive when precharging and equalization of the first data line pair is not carried out, and renders the second switch non-conductive when precharging and equalization of the first data line pair is carried out.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: Dual I/O data read is performed in an integrated circuit which includes a serial peripheral interface memory device. In one example, a second page read address is transmitted to the memory device using a first input pin and a second input pin concurrently, while transferring data from the memory device associated with a first page read address using a first output pin and a second output pin concurrently. The first page read address is associated with a first location in the memory device and the second page read address is associated with a second location in the memory device.

Abstract: During programming of storage elements, channel-to-floating gate coupling effects are compensated to avoid increased programming speed and threshold voltage distribution widening. In connection with a programming iteration, unselected bit lines voltages are stepped up to induce coupling to selected bit lines, and the amount of coupling which is experienced by the selected bit lines is sensed. When a program pulse is applied, voltages of the selected bit lines are set based on the amount of coupling. The bit line voltage is set higher when more coupling is sensed. The amount of coupling experience by a given selected bit line is a function of its proximity to unselected bit lines. One or more coupling thresholds can be used to indicate that a given selected bit line has one or two adjacent unselected bit lines, respectively.

Abstract: A system for programming non-volatile storage is proposed that reduces the impact of interference from the boosting of neighbors. Memory cells are divided into two or more groups. In one example, the memory cells are divided into odd and even memory cells; however, other groupings can also be used. Prior to a first trigger, a first group of memory cells are programmed together with a second group of memory cells using a programming signal that increases over time. Subsequent to the first trigger and prior to a second trigger, the first group of memory cells are programmed separately from the second group of memory cells using a programming signal that has been lowered in magnitude in response to the first trigger. Subsequent to the second trigger, the first group of memory cells are programmed together with the second group of memory cells with the programming signal being raised in response to the second trigger.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: A memory system including a memory array, and a read write/module. The memory includes a plurality of bit lines, a plurality of word lines, and a plurality of memory cells, in which each memory cell is formed at a corresponding intersection of a bit line and a word line in the memory array. The read/write module is configured to control activation of at least two memory cells in the memory array during a read operation or a write operation, wherein the at least two memory cells activated by the read/write module are located on a different word line and a different bit line in the memory array, and wherein each memory cell coupled to a same bit line of the plurality of bit lines is configured to be written to or read from based on selection of the bit line.

Abstract: In one embodiment of the invention, a memory integrated circuit is provided including an address decoder to selectively access memory cells within a memory array; a mode register with bit storage circuits to store an enable bit and at least one sub-channel select bit; and control logic. The control logic is coupled to a plurality of address signal lines, the address decoder, and the mode register. In response to the enable bit and the at least one sub-channel select bit, the control logic selects one or more of the address signal lines to capture independent address information to support independent sub-channel memory accesses into the memory array. The control logic couples the independent address information into the address decoder.

Abstract: Memory devices and methods of operating a memory cell are disclosed in which a bitline can be grounded after charge sharing with an electrically floating ground line and before writing data to the memory cell. An electric potential of an upper power supply node of a memory cell can be lowered and an electric potential of a lower power supply node of the memory cell can be raised before writing data to the memory cell.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed In an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior In a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited.

Abstract: A nonvolatile semiconductor memory device comprising: a memory cell array in which two bit lines are provided to each one bit of input data, and memory cells each including an anti-fuse element are arranged at an intersection point between one of the two bit lines and an even address word line, and an intersection point between the other one of the two bit lines and an odd address word line, respectively; a plurality of booster circuits which are arranged in a plurality of memory banks, respectively, and each of which generates a write voltage and a read voltage to be supplied to a corresponding one of the anti-fuse elements of the respective memory banks, each of the memory banks obtained by dividing the memory cell array; a booster circuit controller to issue an instruction to generate the write voltage and the read voltage to the plurality of booster circuits; a word line selector to activate a different word line at the time of writing from one to be activated at the time of reading, with respect to the s

Abstract: A memory structure is described. In one embodiment, the memory structure comprises a memory controller configured to receive a clock signal and to be coupled to a plurality of memory modules via a single address/control bus. The memory controller couples to each of the plurality of memory modules via a separate chip select signal for each memory module. The memory controller issues commands across the address/control bus to the memory modules in an interleaved fashion in accordance with the timing supplied by the clock. During a waiting period after issuance of a command to one memory module, the memory controller can issue commands to a different memory module.

Abstract: To provide an input/output circuit that includes a write path to which write data is supplied and a read path to which read data is supplied and first and second data lines that connect the input/output circuit to a memory cell array. The input/output circuit includes a write buffer that supplies the write data on the write path to the first data line, a read amplifier that supplies the read data supplied to the read path through the second data line, and a bypass circuit that supplies the write data on the write path to the read path in response to detection of matching between a write address and a read address. Thus, data collisions can be avoided.

Abstract: A semiconductor integrated circuit device includes a data circuit and a group of bit line application voltage terminals to which different voltages are applied. The data circuit holds program data to be programed into a memory cell and changes the data held according to a verify result from the memory cell. Then, the data circuit selects one of the bit line application voltage terminals based on the data held therein and applies voltage of the selected bit line application voltage terminal to a bit line BLe or BLo.

Abstract: An integrated circuit device includes a serial peripheral interface adapted for receiving a first command supporting an address of a first configuration, wherein the serial peripheral interface supports an address of a second configuration upon receipt of a second command, the second configuration being different from the first configuration. In a specific embodiment, the first and the second configurations are different in address length. In another embodiment, a second address cooperated with the second command has a first part and a second part, the second part comprising a plurality of byte addresses, each of the byte addresses being associated with a corresponding byte of data. In another embodiment, integrated circuit device also includes a mode logic circuit for controlling operations of the first command and the second command. Various other embodiments are also described.

Abstract: An integrated circuit device includes a first word-line; a second word-line; a first bit-line; and a static random access memory (SRAM) cell. The SRAM cell includes a storage node; a pull-up transistor having a source/drain region coupled to the storage node; a pull-down transistor having a source/drain region coupled to the storage node; a first pass-gate transistor comprising a gate coupled to the first word-line; and a second pass-gate transistor including a gate coupled to the second word-line. Each of the first and the second pass-gate transistors includes a first source/drain region coupled to the first bit-line, and a second source/drain region coupled to the storage node.