Abstract: A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal. The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal.

Abstract: A semiconductor device avoids the disturb problem and the collision between write and read operations in a DP-SRAM cell or a 2P-SRAM cell. The semiconductor device 1 includes a write word line WLA and a read word line WLB each coupled to memory cells 3. A read operation activates the read word line WLB corresponding to the selected memory cell 3. A write operation activates the write word line WLA corresponding to the selected memory cell 3. The selected write word line WLA is activated after activation of the selected read word line WLB in an operation cycle that performs both read and write operations.

Abstract: In embodiments of the invention, a memory circuit includes a static random access memory (SRAM), rows of M sense amplifiers, a global read precharge tracking control circuit controlling a precharge of global read lines, a sense amplifier output tracking circuit generating a reset sense amplifier signal for the sense amplifier control circuits, and a read delay circuit generating a trigger signal for the global read precharge tracking control circuit and the sense amplifier output tracking circuit and performing a fixed delay tracking of a read operation in a read cycle. A dummy global read line is coupled to the global read precharge tracking control circuit and returns from a half way to the top of the SRAM forming a tracking dummy global read line that determines a completion of the precharge of the global read lines before the sense amplifiers start discharging the global read lines in the read cycle.

Abstract: A semiconductor memory device includes a plurality of memory cell blocks including a first memory cell block having bit lines, an edge sense amplifier block including edge sense amplifiers coupled to a portion of the bit lines of the first memory cell block, and a balancing capacitor unit coupled to the edge sense amplifiers.

Abstract: A semiconductor device includes a sense amplifier, transistors selectively establishing electrical connection between the sense amplifier and a data bus, depending on address; a write amplifier connected to the data bus, an external terminal outputting data from a memory cell to outside via the sense amplifier, the transistors, and the data bus in a first operation mode and supplying data from outside to the sense amplifier via the write amplifier, the data bus, and the transistors in a second operation mode, and a control circuit supplying an electric potential to gate electrodes of first transistors that establish the electrical connection depending on the address.

Abstract: A memory includes a module and a demultiplexer. The module is configured to monitor outputs of sense amplifiers. Each of the outputs of the sense amplifiers is configured to be in a first state or a second state. The module is configured to determine that two or more of the outputs of the sense amplifiers are in a same state. The same state is the first state or the second state. The module is configured to output the state of the two or more outputs of the sense amplifiers. The demultiplexer is configured to provide the state of the two or more outputs of the sense amplifiers to a latch.

Abstract: A data split between a first data line and a second data line is caused to develop. At least one of the following sets of steps is performed: 1) a first power supply line of a sense amplifier is caused to rise towards a first power supply voltage value, and when the first power supply line reaches a first predetermined voltage value, the first power supply is caused to rise above the first power supply voltage value; and 2) a second power supply line of the sense amplifier is caused to fall towards a second power supply voltage value, and when the second power supply line reaches a second predetermined voltage value, the second power supply line is caused to fall below the second power supply voltage value.

Abstract: A memory device uses a global input/output line or a pair of complementary global input/output lines to couple write data signals and read data signals to and from a memory array. The same input/output line or pairs of complementary global input/output lines may be used for coupling both write data signals and read data signals.

Abstract: A semiconductor apparatus with an open bit line structure includes a memory bank including a plurality of memory cell blocks and dummy mats, in which a plurality of bit lines are formed, a bit line sense amplifier configured to be arranged between the plurality of memory cell blocks and the dummy mats, compare a voltage difference between a bit line and a complementary bit line, and amplify the difference, and a dummy word line driving unit configured to selectively activate a dummy word line of the dummy mat in response to a test mode.

Abstract: In a multiple port SRAM, a first bit cell is coupled to first and second word lines and a first and second bit line pair. A first data line pair is coupled to the first bit line pair via first switching logic. A second data line pair is coupled to the first bit line pair via second switching logic and to the second bit line pair via third switching logic. If a row address match but not a column address match exists between a first and second access address, the second switching logic selectively connects the second data line pair with the first bit line pair based on a first decoded signal generated from the column address of the second access address and the third switching logic decouples the second data line pair from the second bit line pair.

Abstract: In a multiple port SRAM, a first bit cell is coupled to first and second word lines and a first and second bit line pair. A second bit cell is coupled to the first and second word lines and a third and fourth bit line pair. A first data line pair is coupled to the first bit line pair via first switching logic and to the third bit line pair via second switching logic, and a second data line pair is coupled to the second bit line pair via third switching logic and to the fourth bit line pair via fourth switching logic. If a match exists between at least portions of a first and second access address, a state of the third and forth switching logic is set such that the second bit line pair and the fourth bit line pair remains decoupled from the second data line pair.

Abstract: A sense amplifier includes a first transistor. The first transistor includes a gate connected to a bit line, and a first source/drain (S/D) electrically coupled with a global bit line. The sense amplifier further includes a second transistor. The second transistor includes a gate connected to a first signal line, and a first S/D coupled to the global bit line, wherein the second transistor is configured to pre-charge the bit line.

Abstract: The present invention relates to a semiconductor device, and more particularly, to a semiconductor memory device capable of supplying and measuring an electric current through a pad. The semiconductor device includes a memory cell, a data pad configured to receive data to be programmed into the memory cell or a write current to be supplied to the memory cell from an external device, and output data read out from the memory cell or a cell current flowing from the memory cell to the external device, and a path switching unit configured to set up a path so that the memory cell and the data pad are directly coupled when a test operation is performed.

Abstract: A sense amplifier includes a first inverter including a first input node and a first output node, the first input node coupled to a first bitline through a first capacitor, the first output node coupled to a second bitline through a second capacitor, a second inverter including a second input node and a second output node, the second input node coupled to the second bitline through the second capacitor, the second output node to the first bitline through the first capacitor, a first transmission gate switch coupled between the first input node and the second input node, a second transmission gate switch coupled between a first common node of the first and second inverters and a second common node of the first and second inverters. The sense amplifier is maintained at a maximum gain point in a read cycle.

Abstract: In an exemplary aspect, the present invention provides a semiconductor memory device including sense amplifiers that drive bit lines to which memory cells are connected, and driver transistors that supply a power supply to the sense amplifiers, wherein the sense amplifiers are arranged in rows and constitutes a first sense-amplifier row in which transistors of a first conductive type are arranged and a second sense-amplifier row in which transistors of a second conductive type are arranged, and the driver transistors constitutes at least one transistor row including a first driver transistor of the first conductive type corresponding to the first sense-amplifier row and a second driver transistor of the second conductive type corresponding to the second sense-amplifier row between the first sense-amplifier row and the second sense-amplifier row.

Abstract: A device and a method for a sense circuit have been disclosed. In an implementation, the sense circuit includes a sense amplifier and at least one decoupling device. The decoupling device is coupled to the sense amplifier through at least one reference line. The sense amplifier reads a data value and the decoupling device decouples the sense amplifier from a power supply during a read operation.

Abstract: A semiconductor device and a method of operating the same, the semiconductor device including a sense amplifier connected between a bit line and a complementary bit line; a first power supply circuit configured to select between supplying a power supply voltage to the first node and blocking the power supply voltage from the first node in response to a first control signal; a second power supply circuit configured to select between supplying a ground voltage to the second node and blocking the ground voltage from the second node in response to a second control signal; and a first boosting circuit configured to boost a voltage at the first node in response to a third control signal.

Abstract: According to one embodiment, a configuration memory includes first and second data lines, a first memory string which comprises at least first and second nonvolatile memory transistors which are connected in series between a common node and the first data line, a second memory string which comprises at least third and fourth nonvolatile memory transistors which are connected in series between the common node and the second data line, and a flip-flop circuit which comprises a first data holding node connected to the common node and a second data holding node connected to a configuration data output node.

Abstract: A method is provided for programming a memory cell having a first terminal coupled to a word line and a second terminal coupled to a bit line. During a first predetermined time interval, the word line is switched from a first standby voltage to a first voltage, the bit line is switched from a second standby voltage to a predetermined voltage, and a voltage drop across the first and second terminals is a safe voltage that does not program the memory cell. During a second predetermined time interval, the word line is switched from the first voltage to a second voltage, and a voltage drop across the first and second terminals is a programming voltage that is sufficient to program the memory cell. Numerous other aspects are provided.

Abstract: A sense amplifier includes a cross latch, a first pass gate, a second pass gate, a first data line, a second data line, a first circuit, and a second circuit. The cross latch has a first input/output (I/O) node and a second I/O node. The first pass gate is coupled between the first data line and the first I/O node. The second pass gate is coupled between the second data line and the second I/O node. The first circuit is coupled with the first I/O node and the second data line. The second circuit is coupled with the second I/O node and the first data line. The first circuit is configured to be turned off when the second data line has a first logical value and to be at least lightly turned on when the second data line has a voltage level between the first logical value and a second logical value different from the first logical value.

Abstract: A sensing amplifier for a memory device includes first and second nodes, an input device and an output device. The memory device includes first and second bit lines, and at least one memory cell coupled to the bit lines. The first and second nodes are coupled to the first and second bit lines, respectively. The input device is coupled to the first and second nodes and generates a first current pulling the first node toward a predetermined voltage in response to a first datum read out from the memory cell, and to generate a second current pulling the second node toward the predetermined voltage in response to a second datum read out from the memory cell. The output device is coupled to the first node to output the first or second datum read out from the memory cell. The first current is greater than the second current.

Abstract: A sense amplifier (100) includes first and second inverters (112 and 113). The first inverter has an input terminal (116) and an OUT_B output node and a first transistor (124). The second inverter (113) has an input terminal (115) and an OUT output node and a second transistor (125). The OUT_B output node of the first inverter is coupled to an input terminal of the second inverter, and the OUT node of the second inverter is coupled to an input terminal of the first inverter. The sense amplifier does not use a reference current; therefore, the sense amplifier does not need a reference current generator. The sense amplifier needs only one enable signal to reset a latch (110) of the sense amplifier. When coupled to a non-volatile memory element, voltages at the output nodes are indicative of a logic level of a bit stored in the non-volatile memory element.

Abstract: In described embodiments, a circuit for providing a margin free PVT tolerant fast self-timed sense amplifier reset includes a sense amplifier coupled between a complementary pair of first and second bitlines in a memory cell, a first and second PMOS drivers connected to internal nodes of the sense amplifier, respectively, and outputting a first and second output signals, wherein the second output signal is inverted by an inverter to form an inverted output signal, a read detect block receiving the first and inverted output signals and generating a transition detect signal that is latched by a cross-coupled inverters and employed to generate a sense amplifier enable signal with a global sense amplifier enable signal, and a push-pull logic formed by a NMOS and a PMOS in series to generate an output of the circuit.

Abstract: According to one embodiment, a semiconductor storage device includes cells, and a sense amplifier. Each of the cells is connected to a bit line. The sense amplifier reads out data. The sense amplifier includes a first transistor to third transistor, and a switch. The first transistor has one end of a current path, the other end, and a gate. The second transistor has one end, and the other end. The second transistor has one of a first and a second supply ability. The third transistor has one end, and the other end. The third transistor has one of a third and a fourth supply ability. The switch grounds the second and the third transistors. The sense amplifier turns off the first transistor after transferring the data to an outside, and supplies the second signal to the switch to set gates of the second transistor and third transistor to ground.

Abstract: Methods and systems for time-based cell decoding for PCM memory. Generally, the higher the PCM element resistance, the longer it takes for a read output to change state. PCM memory output is determined using differentiated timings of read outputs changing state, rather than differentiated values of read outputs. In some single-bit single-ended sensing embodiments, a reference, with resistance between the resistances corresponding to a pair of adjacent logical states, is stored in multiple reference cells; a “vote” unit emits a clock signal when a majority of the reference cell read outputs transition at the vote unit. Timing units produce different binary outputs depending on whether a data read output or the clock signal changes state first at the timing unit. Time-based decoding provides advantages including improved temperature and drift resilience, improved state discrimination, improved reliability of multibit PCM, and fast and reliable sensing.

Abstract: A dynamic random access memory device is described. A first array has a first plurality of bitlines, each coupled to a column of memory cells. A second has a second plurality of bitlines, each coupled to a column of memory cells. Sense amplifiers are selectively connectable in an open bitline configuration to at least one bitline of the first plurality of bitlines and at least one complementary bitline of the second plurality of bitlines. A voltage supply having a voltage VBL corresponding to a bitline precharge voltage is selectively connectable to each bitline. Logic selectively connects each bitline and the complementary bitline to one of a sense amplifier and the voltage supply during a read operation. Each bitline connected to the sense amplifier is adjacent to a bitline concurrently connected to the voltage supply. A method is also described.

Abstract: In a semiconductor device performing pipeline processing with the use of a reading portion reading an instruction and an arithmetic portion performing an operation in accordance with the instruction, the instruction held in the reading portion is transmitted from the flip-flop to the memory when branch prediction turns out to be wrong. Note that the arithmetic portion controls transmission and reception of the instruction between the flip-flop and the memory which are included in the reading portion. This enables elimination of redundant operations in the reading portion in the case where an instruction read by the reading portion after the branch prediction turns out to be wrong is a subroutine, or the like. That is, the instruction held in the memory is transmitted back to the flip-flop without rereading of the same instruction by the reading portion, whereby the instruction can be output to the arithmetic portion.

Abstract: A compact, low-power, asynchronous, resistor-based memory read circuit includes a memory cell having a plurality of consecutive memory states, each of said states corresponding to a respective output voltage. A sense amplifier reads the state of the memory cell. The sense amplifier includes a voltage divider configured to receive the output voltage of the memory cell and to output a settled voltage an amplifier having a voltage threshold between the settled voltages associated with two of said consecutive memory states, configured to discriminate between said two consecutive memory states.

Abstract: A semiconductor device may comprise a first bit line, a second bit line, a memory cell connected to the first bit line, a bit line sense amplifier circuit and a control circuit. The bit line sense amplifier circuit may be coupled to the memory cell. The bit line sense amplifier circuit may include a first inverter having an input node coupled to the first bit line and an output node coupled to the second bit line, and a second inverter having an input node coupled to the second bit line and an output node coupled to the first bit line. The control circuit may be configured to activate the first inverter without activating the second inverter during a first time period and to activate the first inverter and the second inverter at the same time during a second time period after the first time period.

Abstract: The memory device includes a memory cell array, an access control circuit configured to access the memory cell array, a control signal generation circuit configured to generate a control signal for controlling an operation of the access control circuit, and a variable delay circuit configured to generate a delay signal by variably delaying a clock signal according to an external signal. The control signal generation circuit adjusts an activation timing of the control signal in response to the delay signal.

Abstract: Memories, current mode sense amplifiers, and methods for operating the same are disclosed, including a current mode sense amplifier including cross-coupled p-channel transistors and a load circuit coupled to the cross-coupled p-channel transistors. The load circuit is configured to provide a resistance to control at least in part the loop gain of the current mode sense amplifier, the load circuit including at least passive resistance.

Abstract: An electronic storage device includes a bit cell circuit, feedback circuit, and read accelerator circuit. The bit cell circuit is adapted for connection with true and complementary bit lines. The feedback circuit includes a first transistor which is coupled to a first voltage potential and responsive to the complementary bit line. The read accelerator circuit includes second, third, and fourth transistors coupled between the feedback circuit and a second voltage potential. The second transistor is responsive to a read line, the third transistor is responsive to the true bit line, and the fourth transistor is responsive to the complementary bit line. The read accelerator circuit is configured to provide a discharge path for at least one of the true bit line and the complementary bit line during a read access of the bit cell. Embodiments of a corresponding electronic read access accelerator device and method are also provided.

Abstract: A semiconductor device with a memory unit of which the variations in the operation timing are reduced is provided. For example, the semiconductor device is provided with dummy bit lines which are arranged collaterally with a proper bit line, and column direction load circuits which are sequentially coupled to the dummy bit lines. Each column direction load circuit is provided with plural NMOS transistors fixed to an off state, predetermined ones of which have the source and the drain suitably coupled to any of the dummy bit lines. Load capacitance accompanying diffusion layer capacitance of the predetermined NMOS transistors is added to the dummy bit lines, and corresponding to the load capacitance, the delay time from a decode activation signal to a dummy bit line signal is set up. The dummy bit line signal is employed when setting the start-up timing of a sense amplifier.

Abstract: At least one example embodiment discloses a semiconductor device. The semiconductor device includes a first sense amplifier selectively connected between a first bit line and a second bit line, a second sense amplifier selectively connected between the first bit line and the second bit line, a first power supply circuit configured to provide a power supply voltage to the first sense amplifier in response to a first control signal, a second power supply circuit configured to provide a ground voltage to the second sense amplifier in response to a second control signal, and a switching circuit configured to selectively connect the first power supply circuit with the second power supply circuit in response to a third control signal.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell including one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. Data stored in memory cells of the device can be refreshed within a single clock cycle.

Abstract: Embodiments of the invention provide a sense amplifier, a SRAM chip comprising the sense amplifier and a method for conducting read operation on a SRAM cell. The sense amplifier according to an embodiment of the invention comprises a cross coupling circuit, a tail current transistor and an output stage, wherein source of the tail current transistor is connected to a negative level. With the scheme according to embodiments of the invention, speed of the sense amplifier can be enhanced, thereby increasing read speed of the SRAM chip.

Abstract: Some embodiments relate to a sense amplifier output buffer configured to buffer an output of a sense amplifier. The sense amplifier output buffer includes a first pull-up element having a source coupled to a first DC supply terminal and having a drain coupled to an output terminal of the sense amplifier output buffer. A first pull-down element is in series with the first pull-up element and has a source coupled to a second DC supply terminal and has a drain coupled to the output terminal. A miller capacitance decoupling circuit is coupled between the drain of the first pull-up element and the drain of the first pull-down element. The miller capacitance decoupling circuit is configured to decouple miller capacitance associated with the drains of the pull-up and pull-down elements from the output terminal. Other embodiments are also disclosed.

Abstract: Described embodiments provide a memory having at least one sense amplifier. The sense amplifier has a first capacitor, an inverting amplifier, a switch, an amplifier, and a second capacitor. The first capacitor is coupled between the input of the sense amplifier and a first node. The inverting amplifier has an input coupled to the first node and an output coupled to an internal node and the switch is coupled between the input and output of the inverting amplifier. The amplifier has an input coupled to the internal node and an output coupled to an output of the sense amplifier and the second capacitor is coupled between the internal node and a control node. When data is to be read from the memory, the second capacitor forces a small voltage reduction onto the intermediate node, helping the sense amplifier resolve the data value stored in the memory cell.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines, wherein the m drivers each comprise a write one circuit and a write zero circuit. The m drivers are operable to write all ones into a row of bit cells in response to a first control signal coupled to the write one circuits and to write all zeros into a row of bit cells in response to a second control signal coupled to the write zero circuits.

Abstract: In described embodiments, a memory circuit includes a static random access memory (SRAM) including N banks of memory cells, rows of M sense amplifiers, a controlled feedback latch storing a previous state of input data in a read cycle, a pull down select block coupled to the controlled feedback latch and the dummy sense amplifier, a dummy output latch coupled to the pull-down select block to store the read data, and a SRAM reset generation circuit coupled to the sense amplifier control circuits and the controlled feedback latch. The dummy output latch is a latch that is the same as a sense amplifier latch used in the local input/output circuit, thereby, no margin is involved between a reset of the sense amplifiers and the read data latched at the dummy output latch in the read cycle.

Abstract: A system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete.

Abstract: A semiconductor integrated circuit includes a plurality of output transistors each controlling the magnitude of an output voltage relative to the magnitude of a load current according to a control value indicated by an impedance control signal applied to a control terminal, a voltage monitor circuit outputing an output voltage monitor value indicating a voltage value of the output voltage, and a control circuit controling the magnitude of the control value according to the magnitude of an error value between a reference voltage indicating a target value of the output voltage and the output voltage monitor value, and controls based on the control value whether any of such transistors be brought to a conducting state. The control circuit increases a change step of the control value relative to the error value during a predetermined period according to prenotification signals for notifying a change of the load current in advance.

Abstract: A semiconductor memory device, including: a memory cell connected to a first bitline and associated with a second bitline; a sense amplifier, including a first input/output node and a second input/output node; and an isolator connected to the bitlines and to the input/output nodes, the isolator being configured to carry out bitline isolation during a refresh operation of the memory cell, where the bitline isolation includes electrically disconnecting the first bitline from the first input/output node and electrically disconnecting the second bitline from the second input/output node, followed by: electrically re-connecting the first bitline to the first input/output node while the second bitline remains electrically disconnected from the second input/output node.

Abstract: A method for sensing data in an open bit line dynamic random access memory includes activating a word line in a first memory block of a first memory mat to transfer charge from memory cells to first sub-bit lines, the first memory mat being between a second memory mat and a third memory mat, activating first hierarchy switches corresponding to the first memory block to transfer charge from first sub-bit lines to global bit lines of the first memory mat, and activating second hierarchy switches corresponding to a second memory block in a second memory mat, to connect sub-bit lines to global bit lines of the second memory mat, the first memory block and the second memory block being equidistant from a first sense amplifier array located between the first memory mat and the second memory mat.

Abstract: A memory array with co-planar waveguide based memory selection includes a first set of parallel conductive lines placed perpendicular to a second set of parallel conductive lines, memory elements disposed at intersections between the first set of conductive lines and the second set of conductive lines, and selection circuitry to apply an reading electrical condition to a selected one of the conductive lines and to ground conductive lines adjacent to the selected conductive line to form a co-planar waveguide.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: To handle multiple concurrent memory requests, a dual-port six transistor (6T) SRAM bit cell is proposed. The dual-port 6T SRAM cell uses independent word lines and bit lines such that the true side and the false side of the bit cell may be accessed independently. Single-ended reads allow the memory system to handle two independent read operations concurrently. Single-ended writes are enabled by adjusting the VDD power voltage supplied to a memory cell when writes are performed such that a single word line and bit line pair can be used write either a logical “0” or logical “1” into either side of the bit cell. Thus, single-ended operation with a voltage assist allows a memory system to handle two concurrent write operations. A write buffer may be added to the memory system to prevent conflicts and thus enable concurrent read operations and write operations in a single cycle.

Abstract: A sense amplifier includes a first inverter responsive to a first output of a latch. The first inverter is powered by a sense enable signal. The sense amplifier also includes a second inverter responsive to a second output of the latch. The second inverter is also powered by the sense enable signal.

Abstract: A sense amplifier control circuit according to the present invention is disposed in a bit line sense amplifier (BLSA) array region including a plurality of BLSAs and is configured to supply a precharge voltage to the plurality of BLSAs in response to a control signal.

Abstract: A semiconductor memory device includes a switching unit coupled between a local sense amplifier and a bit line sense amplifier and configured to be turned on in response to a switching signal which is enabled in synchronization with an enable signal for enabling the local sense amplifier and disabled at a time point where a preset period passes after a first power for enabling the bit line sense amplifier is precharged.