Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: Apparatus and methods are provided for accessing memory elements. An exemplary memory element includes an array of memory cells and a control module. Each memory cell of the array is coupled to an access line, wherein the control module is configured to assert a first signal for a write duty cycle on the access line to enable writing to a first memory cell of the array of memory cells, and the control module is configured to assert a second signal for a read duty cycle on the access line to enable reading from the first memory cell. The write duty cycle and the read duty cycle are each selected from a plurality of possible duty cycles. In an exemplary embodiment, the read duty cycle and the write duty cycle are chosen to optimize a performance parameter for the memory element.

Abstract: First and second read word lines are provided in each set made of two adjacent rows. First, second, third, and fourth read bit lines are provided in each column. Each of the first and second read word lines is connected to memory cells in a corresponding one of the sets. Each of the first and third read bit lines is connected to a memory cell in one row in each of the sets, out of memory cells in a corresponding one of the columns. Each of the second and fourth read bit lines is connected to a memory cell in the other row in each of the sets, out of the memory cells in the corresponding one of the columns.

Abstract: A memory including a memory cell array, a word line decoder, a first and a second reference bit line generators are provided. The memory cell array has first and last bit lines respectively disposed at two sides of the memory cell array. The word line decoder generates a pre-word line signal. The first and the second reference bit line generators respectively detect voltage level variations of the first and last bit lines according to the pre-word line signal, so as to generate a first and a second cut-back signals. The first reference bit line generator transmits the first cut-back signal to the second reference bit line generator, the second reference bit line generator transmits the first and the second cut-back signals to the word line decoder, and the word line decoder generates a word line signal according to the first and the second cut-back signals and the pre-word line signal.

Abstract: Decoder circuits capable of decoding encoded ROM memory are provided. Embodiments provide several improvements over prior solutions which rely primarily on CMOS logic (e.g., inverters). For example, embodiments provide faster decoding by limiting the number of decoding stages to a single stage. Further, embodiments allow the use of partial swing (as opposed to full swing) on the bit lines, which results in significant power reduction. This, in turn, results in reduced amounts of capacitor discharges when reading the data.

Abstract: A data transfer circuit has a reduced number of lines for transferring a training pattern used in a read training for high speed operation, by removing a register for temporarily storing the training pattern, and a semiconductor memory device including the data transfer circuit. The data transfer circuit includes a latch unit and a buffer unit. The latch unit latches one bit of a training pattern data input together with a training pattern load command whenever the training pattern load command is input. The buffer unit loads a plurality of bits latched in the latch unit, including the one bit of training pattern data, in response to a strobe signal.

Abstract: A sense amplifier is configured to transfer data on a first data I/O line to a second data I/O line or to transfer data on the second data I/O line to the first data I/O line. The first data I/O line is substantially continuously coupled to the second data I/O line during an active operation.

Abstract: Embodiments of a circuit are described. This circuit includes control logic that generates multiple piecewise-erase commands to erase information stored in a storage cell of a memory device formed within another circuit. Note that execution of a single one of the multiple piecewise-erase commands within the memory device may be insufficient to erase the information stored in the storage cell. Moreover, the first circuit includes an interface that receives the multiple piecewise-erase commands from the control logic and that transmits the multiple piecewise-erase commands to the memory device.

Abstract: A block control command generation circuit includes first and second latch units, an input selection unit, a pull-down driving unit, and an output selection unit. The first and second latch units store initial values at different levels in response to initialization signals. The input selection unit selectively transmits a first block control signal to the first latch unit in response to an input enable signal. The pull-down driving unit selectively pull-down drives an input node of the second latch unit in response to a second block control signal and the input enable signal. The output selection unit outputs signals, which are stored in the first and second latch units, as first and second block control command signals in response to an output enable signal, respectively.

Abstract: Various circuits include MOS transistors that have a bulk voltage terminal for receiving a bulk voltage that is different from a supply voltage and ground. The bulk voltage may be selectively set so that some MOS transistors have a bulk voltage set to the supply voltage or ground and other MOS transistors have a bulk voltage that is different. The bulk voltage may be set to forward or reverse bias pn junctions in the MOS transistor. The various circuits include comparators, operational amplifiers, sensing circuits, decoding circuits and the other circuits. The circuits may be included in a memory system.

Abstract: Apparatus and method for decoding addresses of control lines in a semiconductor device, such as a solid state memory (SSM). In accordance with some embodiments, a switching circuit includes an array of switching devices coupled to 2N output lines and M input lines, wherein M and N are respective non-zero integers and each output line has a unique N-bit address. A decoder circuit coupled to the switching circuit divides the N-bit address for a selected output line into a plurality of multi-bit subgroup addresses, and asserts the M input lines in relation to respective bit values of said subgroup addresses to apply a first voltage to the selected output line and to concurrently apply a second voltage to the remaining 2N?1 output lines.

Abstract: A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.

Abstract: A semiconductor memory device and a method of testing the same are provided. In the method, the semiconductor memory device enters a test mode after receiving a mode selection signal. After the semiconductor memory device enters the test mode, a first word line is activated. Test data are then sequentially written into a plurality of memory cells coupled to the first word line. The first word line is deactivated, and data between each pair of bit lines are latched. A second word line is activated. After the second word line is activated, the data latched between each pair of bit lines are directly written into the memory cells coupled to the second word line.

Abstract: A multiple-type memory is disclosed. The multiple-type memory includes memory blocks in communication with control logic blocks. The memory blocks and the control logic blocks are configured to emulate a plurality of memory types. The memory blocks can be configured into a plurality of memory planes that are vertically stacked upon one another. The vertically stacked memory planes may be used to increase data storage density and/or the number of memory types that can be emulated by the multiple-type memory. Each memory plane can emulate one or more memory types. The control logic blocks can be formed in a substrate (e.g., a silicon substrate including CMOS circuitry) and the memory blocks or the plurality of memory planes can be positioned over the substrate and in communication with the control logic blocks. The multiple-type memory may be non-volatile so that stored data is retained in the absence of power.

Abstract: A gate driving circuit that may be capable of improving driving margin and maintaining reliability even after long use, and a display device having the gate driving circuit. The gate driving circuit includes a shift register having a plurality of stages dependently connected to one another, wherein each stage includes a pull-up unit outputting a first clock signal as a gate signal in response to a signal of a first node, to which a first input signal is applied, a pull-down unit discharging the gate signal to a gate-off voltage in response to a second input signal, a discharging unit discharging the signal of the first node to the gate-off voltage in response to the second input signal, and a holding unit maintaining the signal of the first node at the gate-off voltage in response to a delay signal of the first clock signal.

Abstract: A circuit made on a semiconductor-on-insulator substrate. The circuit includes a first transistor having a first channel, a second transistor having a second channel, with the transistors provided in serial association between first and second terminals for applying a power supply potential, each of the transistors comprising a drain region and a source region in the thin layer, a channel extending between the source region and the drain region, and a front control gate located above the channel. Each transistor has a back control gate formed in the base substrate below the channel of the transistor and capable of being biased in order to modulate the threshold voltage of the transistor. At least one of the transistors is configured for operating in a depletion mode under the action of a back gate signal which will sufficiently modulate its threshold voltage.

Abstract: A memory chip includes a memory circuit unit configured to include memory cells for storing data, a data input and output (I/O) buffer unit configured to include a plurality of data I/O buffer circuits, wherein one of the data I/O buffer circuits is operated by default in order to input and output data to and from the memory chip, a plurality of driver control units configured to generate a plurality of driver addition signals to enable corresponding ones of the data I/O buffer circuits depending on whether a power supply voltage has been received, and a controller configured to generate I/O enable signals for controlling an operation of the data I/O buffer unit.

Abstract: A sub-word line driver includes a substrate, a plurality of gate lines and at least one gate tab. The substrate includes a plurality of isolation areas and a plurality of active areas, where the two active areas are separated by each isolation area, and the isolation areas and the active areas are extended in a first direction and are arranged in a second direction perpendicular to the first direction. The plurality of gate lines are formed on the substrate, where the gate lines are extended in a second direction and are arranged in the first direction. The at least one gate tab is formed on the substrate, where the at least one gate tab is extended in the first direction to cover the isolation area. Incorrect operation of the sub-word line driver may be prevented, and a power consumption of the sub-word line driver may be reduced.

Abstract: A system and method of operating a memory device is disclosed. In a particular embodiment, an apparatus is disclosed that includes a bit cell coupled to a first bit line and to a second bit line. The apparatus also includes a sense amplifier coupled to the first bit line and to the second bit line. The apparatus includes a loop circuit configured to provide a sense amplifier enable signal to the sense amplifier in response to receiving a first signal. The apparatus also includes a wordline enable circuit configured to provide a wordline enable signal to a wordline driver in response to receiving a second signal. The loop circuit receives the first signal before the wordline enable circuit receives the second signal.

Abstract: An apparatus is provided that includes a memory controller to provide a first on-die termination (ODT) signal and a second ODT signal, a memory channel, a first memory module to couple to the memory channel, and a second memory module to couple to the memory channel. The first memory module may include a first memory having a first ODT circuit to receive the first ODT signal, and a second memory having a second ODT circuit to receive the first ODT signal. The first ODT signal may disable the ODT circuit of the first memory when the first memory is to be ACTIVE.

Abstract: Circuits and methods are described for decoding exemplary memory arrays of programmable and, in some embodiments, re-writable passive element memory cells, which are particularly useful for extremely dense three-dimensional memory arrays having more than one memory plane. In addition, circuits and methods are described for selecting one or more array blocks of such a memory array, for selecting one or more word lines and bit lines within selected array blocks, for conveying data information to and from selected memory cells within selected array blocks, and for conveying unselected bias conditions to unselected array blocks.

Abstract: A semiconductor storage device and control method are provided. The semiconductor storage device includes a storage unit including a plurality of storage elements specified by addresses and divided into a plurality of blocks each corresponding to a plurality of the addresses, a write address decoding circuit that decodes a write address specifying a block to write data, a write buffer provided in a write signal path to input write data including write address to the block specified by the write address and a write buffer control unit that disables a write buffer provided in the write signal path for inputting the write data to blocks other than a block including a write address decoded by the write address decoding circuit.

Abstract: A semiconductor memory device comprises: a memory cell array including a plurality of memory cells; an internal circuit having a function required in a storage operation of the memory cell array; a parameter storage unit configured to store a certain parameter and to have a storage place specified by a parameter address, the certain parameter designating an operation of the internal circuit; a command register configured to store a command instructing an operation of the internal circuit; and a converting circuit configured to adjust at least one of the parameter address and the command that differ between products or between standards to the internal circuit.

Abstract: Various embodiments of a semiconductor apparatus are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a memory block chip and a signal input/output chip. The memory block chip is configured to control a data access size according to specifications. The signal input/output chip is configured to transmit input data from an external device to the memory block chip or transmit output data from the memory block chip to an external device and process the input data or the output data by selectively enabling a clock phase control unit and a signal processing unit according to the specifications.

Abstract: An integrated circuit may include: access circuits that couple first electrodes of a plurality of programmable metallization cells (PMC) to access paths in parallel, each PMC comprising a solid ion conducting material formed between the first electrode and a second electrode; a plurality of write circuits, each coupled to a different access path, and each coupling the corresponding access path to a first voltage in response to input write data having a first value and to a second voltage in response to the input write data having a second value; and a node setting circuit that maintains second electrodes of the PMCs at a substantially constant third voltage while write circuits couple the access paths to the first or second voltages.

Abstract: A semiconductor memory device including a transistor having a vertical channel structure is provided. The device includes a first sub memory cell array including a first memory cell connected to a first bit lines and including a transistor having a vertical channel structure, a second sub memory cell array including a second memory cell connected to a first inverted bit lines and including a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.

Abstract: Disclosed herein a device that includes a memory cell array including plurality of word lines, a plurality of bit lines each intersecting the word lines and a plurality of memory cells each disposed at an associated one of intersections of the word and bit lines, and the device further includes a driver configured to drive a selected one of the word lines from an inactive level to an active and to drive the selected one of the word lines from the active level to an intermediate level at a first rate and from the intermediated level to the inactive level at a second rate. The intermediate level is between the active and inactive levels, and the first rate is greater than the second rate.

Abstract: The present disclosure relates to the fabrication of non-volatile memory devices. In at least one embodiment, a single transistor may be used to drive each address line, either a wordline or a bitline. Both an inhibit voltage and a selection voltage may be driven through these single transistor devices, which may be achieved with the introduction of odd and even designations for the address lines. In one operating embodiment, a selected address line may be driven to a selection voltage, and the address lines of the odd or even designation which is the same as the selected address line are allowed to float. The address lines of the odd or even designation with is different from the selected address lines are driven to an inhibit voltage, wherein adjacent floating address lines may act as shielding lines to the selected address line.

Abstract: A word line driver circuit and corresponding methods are disclosed. An apparatus, comprising a decoder circuit coupled to receive address inputs, and having a decoder output; and a word line clock gating circuit coupled to the decoder output and to a word line clock signal, configured to selectively output a word line signal responsive to an edge on the word line clock signal; wherein the address inputs have a set up time requirement relative to the edge of the word line clock signal, and the address inputs have a zero or less hold time requirement relative to the edge of the word line clock signal. Methods for providing a word line signal from a word line driver are disclosed.

Abstract: A memory includes a local word line driver for a memory array having a first word line and a second word line. The local word line driver includes a first selection transistor, a second selection transistor, and a middle transistor disposed between the first and second selection transistors. The first word line couples to the first selection transistor and the middle transistor, and the second word line couples to the middle transistor and the second selection transistor.

Abstract: A reference voltage selecting unit selectively outputs a first external reference voltage and a second external reference voltage as a selection reference voltage in accordance with whether to perform a wafer test. An address buffer generates an internal address by buffering an external address in accordance with the selection reference voltage. A command buffer generates an internal command by buffering an external command in accordance with the selection reference voltage. A data buffer generates internal data by buffering to an external data in accordance with the second external reference voltage.

Abstract: A semiconductor memory device including: a memory cell array in which memory cells each containing a variable resistive element and a rectifier element connected in series are arranged at intersections of a plurality of first wirings and a plurality of second wirings; and a control circuit for selectively driving said first wirings and said second wirings; wherein said control circuit applies a first voltage to said selected first wiring, and changes said first voltage based on the position of said selected memory cell within said memory cell array to apply a second voltage to said selected second wiring, so that a predetermined potential difference is applied to a selected memory cell arranged at the intersection between said selected first wiring and said selected second wiring.

Abstract: A method of operating magneto-resistive random access memory (MRAM) cells includes providing an MRAM cell, which includes a magnetic tunneling junction (MTJ) device and a word line selector having a source-drain path serially coupled to the MTJ device. A negative substrate bias voltage is connected to a body of the word line selector to increase the drive current of the word line selector. The threshold voltage of the word line selector is also reduced.

Abstract: According to one embodiment, a word line driving circuit includes a driver and a booster circuit. The driver drives a word line based on an output of an inverter. The booster circuit connects a boosting capacitor to a source side of a P-channel field effect transistor of the inverter to boost the potential of the word line.

Abstract: A semiconductor memory device includes a plurality of memory banks each having a plurality of memory cell arrays, a plurality of sense amplification units corresponding to the memory banks, configured to sense data corresponding to a selected memory cell to amplify the sensed data, and a common delay unit configured to delay a plurality of respective bank active signals activated in correspondence with the memory banks by a predetermined time to generate an operation control signal for controlling the sense amplification units.

Abstract: The initial command generation device includes a first flag signal generation unit configured to generate a reset flag signal setting a reset period in response to a reset command, an initial pulse signal generation unit configured to generate a first initial pulse signal and a second initial pulse signal in response to the reset flag signal, a second flag signal generation unit configured to generate a device auto initialization flag signal setting a device auto initialization period in response to the first initial pulse signal and an internal command generation unit configured to generate an internal refresh command enabled within the device auto initialization period in response to the second initial pulse signal.

Abstract: Disclosed herein is a semiconductor device comprising local bit lines, a global bit line, local switch control lines, main switch control lines, hierarchical switches controlling electrical connections between the local bit lines and the global bit line in response to potentials of the local switch control lines, local switch drivers driving the local switch control lines in response to potentials of the main switch control lines, and main switch drivers selectively activating the main switch control lines.

Abstract: Described embodiments provide a static memory system with multiple memory cell that, in response to a reset signal, simultaneously resets or clears a segment of the memory cells in the memory. Clearing the entire memory or a portion thereof is accomplished by sequencing though a subset of address bits while asserting the reset signal.

Abstract: The present invention includes methods, circuits and systems for reading non-volatile memory (“NVM”) cells, including multi-level NVM cells. According to some embodiments of the present invention, there may be provided a NVM cell threshold voltage detection circuit adapted to detect an approximate threshold voltage associated with a charge storage region of a NVM cell, where the NVM cell may be a single or a multi-charge storage region cell. A decoder circuit may be adapted to decode and/or indicate the logical state of a NVM cell charge storage region by mapping or converting a detected approximate threshold voltage of the charge storage region into a logical state value.

Abstract: A nonvolatile memory device using variable resistive element with reduced layout size and improved performance is provided. The nonvolatile memory device comprising: a main word line; multiple sub-word lines, wherein each of the sub-word line is connected to multiple nonvolatile memory cells; and a section word line driver which controls voltage level of the multiple sub-word lines, wherein the section word line driver includes multiple pull-down elements which are connected to each of the multiple sub-word lines and a common node and a selection element which is connected to the common node and the main word line.

Abstract: A semiconductor memory is provided which includes: a first pad; a second pad disposed adjacent to the first pad; a first output buffer coupled to the first pad; and a second output buffer coupled to the second pad. The first pad is coupled to the second pad by metal.

Abstract: A column decoder is for a phase-change memory device provided with an array of memory cells, a reading stage for reading data contained in the memory cells, and a programming stage for programming the data. The column decoder selects and enables biasing of a bitline of the array and generates a current path between the bitline and the reading stage or, alternatively, the programming stage, respectively during a reading or a programming operation of the contents of the memory cells. In the column decoder, a first decoder circuit generates a first current path between the bitline and the reading stage, and a second decoder circuit, distinct and separate from the first decoder circuit, generates a second current path, distinct from the first current path, between the bitline and the programming stage.

Abstract: A gater repeater circuit is disclosed. In one embodiment, the circuit includes an activation circuit coupled to receive an input signal and a clock signal and configured to activate an output circuit. The output circuit is configured to drive an output signal. The output circuit includes first and second devices configured to drive the output signal to first and second states, respectively. A feedback circuit is configured to provide a delayed version of the output signal. A deactivation circuit is coupled to receive the clock signal and the delayed version of the output signal, and is configured to, when the clock signal is in the first state, cause the deactivation of an active one of the first and second devices. When the clock is in the second state, the circuit is configured to cause the second device to drive the output signal to the second state.

Abstract: A semiconductor memory device includes a plurality of wordlines and a driver configured to, when an wordline of the plurality of wordlines is activated by an active command, drive at least one non-activated wordline neighboring the activated wordline and remaining non-activated wordlines with different wordline driving voltage levels during a period of time that the activated wordline is driven to a high voltage level.

Abstract: A memory cell has at least two word lines and at least two bit lines. The cell also has a first select device being connected to at least one word line and one bit line and a gate capacitor element connected to at least one word line and the first select device. The cell also has a sense device being connected in series to the gate capacitor element and the first select device. The sense device is connected to at least two bit lines.

Abstract: A multi-chip package with die having shared input and unique access IDs. A unique first ID is assigned and stored on die in a die lot. A set of die is mounted in a multi-chip package. Free access IDs are assigned by applying a sequence of scan IDs on the shared input. On each die, the scan ID on the shared input is compared with the unique first ID stored on the die. Upon detecting a match, circuitry on the die is enabled for a period of time to write an access ID in nonvolatile memory, whereby one of the die in the multi-chip package is enabled at a time. Also, the shared input is used to write a free access ID in nonvolatile memory on the one enabled die in the set. The unique first IDs can be stored during a wafer level sort process.

Abstract: A nonvolatile semiconductor storage device includes a memory cell array including a plurality of memory cells arranged at intersection positions of word lines and bit lines in a matrix form, and a row decoder including a row sub-decoder to which a lower address for selecting a word line is input, wherein one unit of the row sub-decoder for selecting one word line is constituted of a first transistor of a first conduction type, and a second transistor of a second conduction type, and a gate electrode of each of the first and second transistors is arranged in a direction in which the bit lines are arranged.

Abstract: Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.

Abstract: The addressing circuit of a semiconductor memory device includes a plurality of register units coupled to an input unit and a plurality of memory cell arrays, wherein the plurality of register units are configured to store inputted data in response to register control signals, and a control unit configured to generate the register control signals, using defect information of respective memory cell arrays, to control whether or not the register units store the inputted.