Abstract: A memory array can be arranged with header devices to reduce leakage. The header devices are coupled with a decoder to receive at least a first portion of a memory address indication and are coupled to receive current from a power supply. Each of header devices is adapted to provide power from the power supply to a set of the wordline drivers corresponding to a bank indicated with the first portion of the memory address indication. Each of the logic devices is coupled to receive at least a second portion of the memory address indication from a decoder. Each of the logic devices is coupled to activate the wordline drivers coupled with those of the wordlines indicated with the second portion of the memory address indication.

Abstract: The present invention provides an integrated memory circuit applicable to an S-box of a cryptographic circuit, the integrated memory circuit having a row decoder, a column decoder, and a sense amplifier composed of a domino-RSL circuit, wherein data reading and data writing from/to memory cells of a memory cell array are performed via two complementary bit lines, and the transition probability of a signal line is equalized by input of random-number data supplied from a random-number generating circuit using an arbiter circuit.

Abstract: A stacked semiconductor memory device comprises a semiconductor substrate having a functional circuit, a plurality of memory cell array layers, and at least one connection layer. The memory cell array layers are stacked above the semiconductor substrate. The connection layers are stacked above the semiconductor substrate independent of the memory cell array layers. The connection layers electrically connect memory cell selecting lines arranged on the memory cell array layers to the functional circuit.

Abstract: Circuits, memories, and methods for latching a write command and later provided write data including write command and write data timing circuits. One such timing circuit includes internal write command latch to latch an internal write command in response to write command latch signal. The internal write command latch releases the latched write command in response to the write command latch signal after a latency delay. The timing circuit further includes a write leveling flip-flop (FF) circuit and a write data register. One such method includes generating and latching an internal write command. The latched internal write command is released after a latency delay responsive to the memory clock signal. The internal write command is propagated over an internal write command path. Write data is captured and internal write command latched in response to a write clock signal. The captured write data is released to be written to memory.

Abstract: A data strobe signal output driver includes a trigger block, a predriver block, and a main driver block. The trigger block is configured to receive a first signal, a second signal, a first clock and a second clock, and to output a predrive signal based thereon. The predriver block is configured to receive the predrive signal, a driver off signal and a termination enable signal, and to output a first main drive signal and a second main drive signal based thereon. The main driver block is configured to output a data strobe signal based on the first and second main drive signals.

Abstract: A memory module including a plurality of ranks. Each of the ranks includes a parallel test apparatus for simultaneous testing and a parallel test control unit. In response to a parallel test mode control signal, the parallel test apparatus generates first parity data for write data including a plurality of bits and generating first data obtained by replacing a bit value of at least one bit of the plurality of bits of the write data with the first parity data during a write operation, and generates second parity data for the first data and transmitting the second parity data as read data during a read operation. The parallel test control unit controls the write operation and the read operation in a parallel test mode by generating the parallel test mode control signal. Combinations of read data from the plurality of ranks correspond to different bits of the write data.

Abstract: A word line driver circuit and corresponding methods are disclosed. An apparatus, comprising a decoder circuit coupled to receive address inputs, and having a decoder output; and a word line clock gating circuit coupled to the decoder output and to a word line clock signal, configured to selectively output a word line signal responsive to an edge on the word line clock signal; wherein the address inputs have a set up time requirement relative to the edge of the word line clock signal, and the address inputs have a zero or less hold time requirement relative to the edge of the word line clock signal. Methods for providing a word line signal from a word line driver are disclosed.

Abstract: A method is disclosed for operating a memory device, including providing a timing signal comprising a plurality of clock cycles, providing an activate signal, and providing a bank address signal. An activate command executes on every first duration of clock cycles, and the bank address signal is high for at least a portion of the first duration of clock cycles. In one embodiment, the first duration of the activate signal is at least four clock cycles, and the bank address signal is at least one clock cycle. A memory device having a row decoder and an active driver is also provided.

Abstract: A memory arrangement is provided having a plurality of memory elements, the elements being associated with a memory space that can be addressed in a row and column fashion during a write or a read access. The memory arrangement further includes a first macro bank comprising a first plurality of memory cells comprising a first subset of the memory elements and a second macro bank comprising a second plurality of memory cells comprising a second subset of the memory elements. The memory arrangement further includes an address resolution stage for addressing the memory cells in the respective macro banks. The memory cells are arranged so that the memory space is partitioned into a plurality of non-overlapping basic matrices, whereby each basic matrix is mapped to a given macro bank and wherein the memory cells are arranged logically so that the memory space is partitioned into a plurality of non-overlapping logic matrices of a given size, each logic matrix being of a size equal or larger than a basic matrix.

Abstract: A semiconductor memory device comprises: a memory cell group, the memory cell including a number of which is 2n, the n being a positive integer; and a first decoder provided with respect to each of the memory cell groups and a second decoder. The first decoder activates a word line by the memory cell group based upon a first address and an n bit in a second address and the second decoder activates a bit line based upon the second address.

Abstract: A decoding circuit withstanding high voltage via a low-voltage MOS transistor, where negative high voltage that can be withstood can be as high as double what the transistor itself can withstand via two-stage CMOS inverters connected serially. When the negative high voltage is withstood, the source of a PMOS transistor in the CMOS inverter is switched to high resistance, and the substrate to the ground; the source of an NMOS transistor in the first CMOS inverter is connected with a half negative high voltage, and the source of an NMOS transistor in the second CMOS inverter with a negative high voltage; the first CMOS inverter, whose output is the half negative high voltage, is grounded at its input terminal, and output of the second CMOS inverter is the negative high voltage.

Abstract: Disclosed is a semiconductor memory device, including a plurality of internal voltage generation units configured to be enabled in response to each of a plurality of decoding signals and to generate an internal voltage, a controller configured to generate a plurality of control signals in response to a power up signal and a test mode signal, and a decoder configured to generate the plurality of decoding signals corresponding to at least one decoding source signal and to simultaneously activate some or all of the plurality of decoding signals in response to the control signals.

Abstract: Disclosed herein is a device that includes: a set of address terminals supplied with a set of address signals, each of the address signals being changed in logic level; memory mats to which address ranges are allocated, respectively, the address ranges being different from each other, each of the memory mats including memory cells; and decoder units each provided correspondingly to corresponding memory mat. Each of the decoder units includes a set of first input nodes and a set of second input nodes, the set of first input nodes of each of the decoder units being coupled to the set of address terminals to receive the set of address signals, the set of second input nodes of each of the decoder units being coupled to receive an associated one of sets of control signals, each of the control signals being fixed in logic level.

Abstract: A memory comprises a row of bit cells, including a first plurality of bit cells and a second plurality of bit cells. A first word line segment driver is connected to the first plurality of bits cells. A second word line segment driver is connected to the second plurality of bits cells. The first and second word line segment drivers are selectively operable for activating one of the first and second pluralities of bit cells at a time to the exclusion of the other plurality of bit cells. A shared sense amplifier is coupled to at least one of the first plurality of bit cells and at least one of the second plurality of bit cells. The shared sense amplifier is configured to receive signals from whichever of the one first or second bit cell is activated by its respective word line segment driver at a given time.

Abstract: A decoding structure employs a main terminal (130), a first memristive switch (112) connected between the main terminal (130) and a first addressable terminal (132), and a second memristive switch (114) connected between the main terminal (130) and a second addressable terminal (134). The second memristive switch (114) is oriented so that a voltage polarity on the main terminal (130) that tends to turn the first memristive switch (112) on tends to turn the second memristive switch (114) off.

Abstract: A dual word-line level shifter circuit and associated SRAM. A circuit is disclosed that includes a first transistor gated by a data input at the lower voltage, and a second transistor gated by a restore input at the higher voltage, wherein the first and second transistors are coupled along a series path to a source at the higher voltage; a control node along the series path; an output node coupled to the control node via a first pair of parallel transistors; and a feedback circuit having a second pair of parallel transistors and a feedback transistor, wherein the feedback transistor couples the second pair of parallel transistors to the control node and is gated by the output node.

Abstract: Various embodiments of a semiconductor memory apparatus are disclosed. In one exemplary embodiment, the semiconductor memory apparatus may include: a column control signal generator configured to generate a column control signal for a pair of bit lines corresponding to a data mask during a data mask operation; and a bit line sense amplifier configured to sense and amplify a voltage difference between the pair of bit lines and electrically couple the pair of bit lines to a pair of segment input/output lines in response to the column control signal.

Abstract: Memory die, stacks of memory dies, memory devices and methods, such as those to construct and operate such die, stacks and/or memory devices are provided. One such memory die includes an identification configured to be selectively coupled to an external select connection node depending on how the die is arranged in a stack. The identification circuit can determine an identification of its respective memory die responsive to how, if coupled, the identification circuit is coupled to the external select connection node.

Abstract: Integrated circuit memory devices include an array of memory cells electrically coupled to a plurality of word lines and a word line driver circuit. The word line driver circuit includes a variable-width pulse generator having a first delay unit therein. The word line driver circuit is configured to drive a selected one of the plurality of word lines with a first word line signal having a leading edge synchronized with a leading edge of a clock signal and a trailing edge synchronized with a trailing edge of the clock signal when a one-half period of the clock signal is greater than a length of delay provided by the first delay unit.

Abstract: A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in a dual column addressing mode. The integrated circuit memory device includes an interface and column decoder to access a row of storage cells or a page in a memory bank. During a first mode, a first row of storage cells in a first memory bank is accessible in response to a first column address. During a second mode, a first plurality of storage cells in the first row of storage cells is accessible in response to a second column address during a column cycle time interval. A second plurality of storage cells in the first row of storage cells is accessible in response to a third column address during the column cycle time interval. The first and second pluralities of storage cells are concurrently accessible from the interface.

Abstract: A static random access memory (SRAM) is provided. The SRAM structure includes an SRAM array, a word line decoder, and a reference bit line device. The SRAM array comprises at least one SRAM bit cell made up of six transistors. The word line decoder is used for decoding a word line of the SRAM bit cell array such that the word line is activated at a starting time and is deactivated at a ending time. The reference bit line device is connected between the SRAM array and the word line decoder and is used for pre-deactivating the word line at a predetermined time before the ending time such that a voltage difference between a bit line and a bit line bar of the SRAM bit cell is equal to a predetermined voltage.

Abstract: System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption.

Abstract: A memory system including a plurality of memory cells configured to receive digital signals includes an address decoder, a data bus, and a sense amplifier configured to receive data output from memory cells activated by addresses from the address decoder. The pre-charging the data bus and evaluating previous data by the sense amplifier occurs substantially simultaneously during a first period. The data bus and the sense amplifier are isolated from each other during the first period.

Abstract: A device for storing error information of a memory device includes a plurality of parent memories and a plurality of child memories. Each of the parent memories stores a row address and a column address of one defective cell. Each of the child memories stores a column address of a defective cell, having a row address identical to a row address stored in the corresponding parent memory, or a row address of a defective cell, having a column address identical to a column address stored in the corresponding parent memory. Herein, each of the parent memories stores information about information about whether a row repair must be performed to repair a defective cell stored in the parent memory and information about whether a column repair must be performed to repair a defective cell stored in the parent memory.

Abstract: A method, system, and apparatus magnetically coupled electrostatically shiftable memory device and method are disclosed. In one embodiment, a method includes electrostatically decoupling a separate structure and a surface that are magnetically coupled (e.g., an electrostatic force to decouple the separate structure and the surface is generated with an electrode), shifting the separate structure between the surface and a other surface with the electrostatic force (e.g., shifting the separate structure moves the entire separate structure), and magnetically coupling the separate structure to the other surface.

Abstract: A bitline sense amplifier includes a pre-sensing unit and an amplification unit. The pre-sensing unit is connected to a first bitline and a second bitline, and is configured to perform a pre-sensing operation by controlling a voltage level of the second bitline based on at least one pre-sensing voltage and variation of a voltage level of the first bitline. The amplification unit is configured to perform a main amplification operation by amplifying a pre-sensed voltage difference based on a first voltage signal and a second voltage signal. The pre-sensed voltage difference indicates a difference between the voltage level of the first bitline and the voltage level of the second bitline after the pre-sensing operation.

Abstract: A memory circuit with a word line driver and control circuitry is disclosed. The word line driver receives a first voltage reference signal, a second voltage reference signal, and an input signal. The word line driver has an output coupled to a word line. The control circuitry is configured to deselect the word line by applying the input signal to the input of the word line driver. For example, in a program operation the word line is deselected to indicate that the word line is not programmed, and another word line is selected to be programmed. During an operation in which the word line is deselected and another word line is selected, the word line discharges through both of a first p-type transistor and a first n-type transistor of the word line driver.

Abstract: Disclosed is a semiconductor device which is intended to reduce the total number of storage element blocks that constitute a desired logic circuit. The semiconductor device includes N address lines (N is an integer equal to two or more), N data lines, and a plurality of storage sections. Each of the storage sections includes an address decoder for decoding an address supplied via the N address lines to output a word select signal to word lines; and a plurality of storage elements which are connected to the word lines and the data lines, each store data that constitute a truth table, and input or output the data via the data lines in accordance with the word select signal supplied via the word lines. The semiconductor device is adapted such that the N address lines for the storage sections are connected to the respective data lines of other N ones of the storage sections, while the N data lines for the storage sections are connected to the respective address lines of other N ones of the storage sections.

Abstract: Nonvolatile memory devices, operating methods thereof, and memory systems including the same. A nonvolatile memory device may include a memory cell array and a word line driver. The memory cell array may include a plurality of memory cells. The word line driver may be configured to apply word line voltages to a plurality of word lines connected to the plurality of memory cells, respectively. Magnitudes of the word line voltages may be determined according to locations of the plurality of word lines.

Abstract: A representative circuit device includes a local control circuit having a level shifter, wherein in response to receipt of a first address signal the level shifter shifts the first address signal from a first voltage level to a second voltage level, providing a level shifted first address signal; and a word-line driver having at least one input for receiving a plurality of address signals, wherein the at least one input includes a first input that is coupled to the local control circuit to receive the level shifted first address signal, and an output that is electrically coupled to a word line of a memory cell array.

Abstract: A setting circuit includes a selection unit configured to select one of a predefined code and an external code in response to a test signal, and a setting information generation unit configured to generate setting information in response to the code selected by the selection unit.

Abstract: A nonvolatile memory device comprises a first mat, a second mat, a third mat, a first address decoder, a second address decoder, and a third address decoder. The first mat comprises first memory blocks, the second mat comprises second memory blocks, and the third mat comprises third memory blocks. The first address decoder selects one of the first memory blocks according to a first even address, the second address decoder selects one of the second memory blocks according to a second even address or a first odd address, and the third address decoder selects one of the third memory blocks according to a second odd address.

Abstract: Address transforming methods are provided. The methods may include generating a power-up signal when a semiconductor memory device is powered-up. The methods may further include generating a randomized output signal in response to the power-up signal. The methods may additionally include transforming bits of a first address in response to the randomized output signal to generate a second address.

Abstract: A memory integrated circuit has control circuitry that accesses memory cells of the memory integrated circuit. The control circuitry is responsive to commands including a first command and a second command. The first command specifies a high order set of address bits. The second command specifies a low order set of address bits. The high order set of address bits and the low order set of address bits constitute a complete access address of the memory integrated circuit. The first command and the second command have different in command codes.

Abstract: Disclosed herein is a device that includes a command decoder and a latency counter. The command decoder generates a first internal command in response to a first internal clock signal. The latency counter includes: a gate control signal generation unit generating output gate signals in response to a second internal clock signal; delay circuits each receiving an associated one of the output gate signals and generating an associated one of input gate signals; and a command signal latch unit fetching the first internal command in response to one of the input gate signals and outputting the first internal command in response to one of the output gate signals. Each of the delay circuit includes a first delay element that operates on a first power supply voltage and a second delay element that operates on a second power supply voltage different from the first power supply voltage.

Abstract: A semiconductor device, including a plurality of control signal generation units each generating a control signal that is enabled when a column enable signal and a row enable signal are enabled, and a plurality of local sense amplifiers each sensing and amplifying data transmitted via a pair of local input/output (I/O) lines and then outputting the amplified data via a pair of global I/O lines, in response to a read or write signal and a corresponding control signal.

Abstract: To provide a semiconductor device including a pair of antifuse elements at either a high level or a low level, an OR circuit that outputs different logic information for a case that at least one of the antifuse elements is at a high level and a case that both of the antifuse elements are at a low level, and an exclusive OR circuit that outputs different logic information for a case that the logic states are different from each other and a case that they are same as each other.

Abstract: Example embodiments provide a semiconductor memory device that may include: a cell array arranged in pluralities of rows and columns; and a sense amplifier conducting writing and reading operations to the cell array in response to writing and reading commands in correspondence with an access time, which may be variable in period. The sense amplifier adjusts pulse widths of write-in and read-out data in accordance with a period of the access time.

Abstract: A memory controller includes: a first generating unit that generates a read-address to read a data element sequence having a plurality of data elements from a bank of a memory; a second generating unit that generates a position signal indicating a position of a data element to be selected from the data element sequence, and an order signal indicating a storing order for storing the data element to be selected into a register; and a selector unit that selects, according to the position signal, the data element to be selected from the data element sequence read out from each of the plurality of the banks, and stores the selected data element in the storing order indicated by the order signal into the register, wherein the data element stored in the register is processed in the storing order by a vector processor.

Abstract: A word line driver circuit for providing a suppressed word line voltage includes a switch configured to selectively load a word line to a suppressed word line voltage node and a word line charging circuit coupled between a high power supply node and the suppressed word line voltage node. The word line charging circuit includes a first transistor device responsive to a control pulse for charging the suppressed word line voltage node to a suppressed word line voltage and a second transistor device for maintaining the suppressed word line voltage.

Abstract: In one embodiment, a bit-line driver has a first driver having a source terminal coupled to a high-voltage supply bus and a drain terminal coupled to the bit-line, and a second driver having a source terminal coupled to a high-voltage return bus and a drain terminal coupled to the bit line. The bit-line driver also has a first pre-driver coupled to a gate terminal of the first driver and a second pre-driver coupled to a gate terminal of the second driver. The first and second drivers use a first type of transistor, and the first and second pre-drivers use a second type of transistor. The first type of transistor is rated at a higher voltage than the second type of transistor.

Abstract: Cross-point memory cells, non-volatile memory arrays, methods of reading a memory cell, methods of programming a memory cell, and methods of writing to and reading from a memory cell are described. In one embodiment, a cross-point memory cell includes a word line extending in a first direction, a bit line extending in a second direction different from the first direction, the bit line and the word line crossing without physically contacting each other, and a capacitor formed between the word line and the bit line where such cross. The capacitor comprises a dielectric material configured to prevent DC current from flowing from the word line to the bit line and from the bit line to the word line.

Abstract: A semiconductor memory device includes a main word line shared by a plurality of mats. Each of the mats includes a plurality of sub word lines. A decoding unit is configured to decode a row address bit and output a word line driving signal. A plurality of sub word line driving units are each configured to activate one of the sub word lines according to the word line driving signal. In the semiconductor memory device each neighboring sub word line driving units is connected to a different main word line to remove parasitic coupling capacitance.

Abstract: A tri-state NAND circuit includes a first input connected to receive a first input signal and a second input connected to receive a second input signal. The tri-state NAND circuit is connected to operate in accordance with a first clock signal and a second clock signal. A logic state of the second clock signal is opposite a logic state of the first clock signal. The tri-state NAND circuit is connected to transmit an output signal to a first node. A tri-state latch circuit is connected to hold a signal present at the first node in accordance with the first clock signal and the second clock signal. A pulse generating NAND circuit includes a first input connected to the first node and a second input connected to receive the first clock signal. The pulse generating NAND circuit is connected to transmit an output signal to a second node.

Abstract: Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided. Further, the memory cell array is constituted of even-numbers of subbanks, and the application of the erasing voltage pulse in one subbank and the application of the programming voltage pulse in the other subbank are alternately performed.

Abstract: Various embodiments of a three-dimensional, stacked semiconductor integrated circuit are disclosed. In one exemplary embodiment, the circuit may include a master slice, a plurality of slave slices, and a plurality of through-silicon vias for connecting the master slice to the plurality of slave slices. At least one of the plurality of through-silicon vias may be configured to transmit an operation control signal from the master slice to the plurality of slave slices. The at least one of the plurality of through-silicon vias is configured to be shared by the plurality of slave slices.

Abstract: A memory and method for charging a word line thereof are disclosed. The memory includes a first word line driver, a first word line and a first switch. The first word line driver is connected to a first operational voltage for receiving a first control signal. The first word line comprises a start terminal connected to an output terminal of the first word line driver. The first switch is connected to a second operational voltage and an end terminal of the first word line. The second operational voltage is not smaller than the first operational voltage. When the first word line driver is controlled by the first control signal to start charging up the first word line, the first switch is simultaneously turned on to provide another charging path for the first word line until the first word line is charged to the first operational voltage.

Abstract: A semiconductor device includes a memory cell array comprising a plurality of banks and a page size controller. The page size controller decodes a part of a bank selection address or a power supply voltage and a remaining part of the bank selection address to enable one of the plurality of banks or enable two of the plurality of banks to set a page size of the semiconductor device.

Abstract: Disclosed herein is a semiconductor device that includes a command receiver receiving the command signal to generate a first internal command signal, and a latency control circuit activating a second internal chip select signal after elapse of first cycles of a clock signal since a first internal chip select signal is activated. The latency control circuit activates a second control signal when the chip select signal is maintained in an inactive state during second cycles of the clock signal that is larger than the first cycles. The command receiver is activated based on a first control signal. The first control signal is activated in response to the first internal chip select signal. The first control signal is deactivated in response to the second control signal.

Abstract: A clock signal generation apparatus for generating a reference clock signal for outputting data in synchronization with an external clock signal from a semiconductor memory device, including: a clock signal generation unit for receiving an internal clock signal to generate the reference clock signal according to a control signal; and a control unit for generating the control signal based on a read command, a write command and an external address.