Abstract: The semiconductor integrated circuit includes a command decoder, a shift register unit and a command address latch unit. The command decoder is responsive to an external command defining write and read modes and configured to provide a write command or a read command according to the external command using a rising or falling clock. The shift register unit is configured to shift an external address and the write command by a write latency in response to the write command. The column address latch unit is configured to latch and provide the external address as a column address in the read mode, and to latch a write address, which is provided from the shift register unit, and provide the write address as the column address in the write mode.

Abstract: A non-volatile memory device comprises an interface circuit for receiving a plurality of signals. The plurality of signals provides multiplexed address and data and command signals in a serial format. An input buffer stores a plurality of the plurality of signals received in serial format and reconstitutes the address, data and command signals, and has an output. A command circuit receives the output of the input buffer and stores the command signals therefrom. An address circuit receives the output of the input buffer and stores the address signals therefrom. A data buffer circuit receives the output of the input buffer and stores the data signals therefrom. An array of non-volatile memory cells stores data from and provides data to the data buffer in response to address signals from the address decoder. A state machine is connected to the command circuit and controls the array of non-volatile memory cells.

Abstract: A buffered DRAM that can be utilized in a DIMM or RDIMM package to reduce the load on the data lines connected to the package is presented. A buffered DRAM can include a DRAM memory cell; and a buffer coupled to receive data lines and strobe signals, the buffer further coupled to receive address and command signals. If data access is directed to a second DRAM, the buffer buffers the data and strobe signals for access by the second DRAM. If data access is directed to the buffered DRAM the buffer buffers the data and strobe signals for access by the DRAM memory cell.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of memory cell arrays each includes a plurality of memory cells, the plurality of memory cell arrays being stacked on a semiconductor substrate to form a three-dimensional structure, and a data input/output circuit includes a first address buffer and a second address buffer configured to store a first address and a second address of the plurality of memory cells, and a controller configured to perform control to time-divisionally output the first address and the second address to a first address bus and a second address bus in data input/output.

Abstract: A semiconductor memory device is operable in normal and test operation modes. At the test operation, in response to a first active command, a row address signal that is input from the outside is captured in the row decoder, and in response to a first write/read command, a column address signal input from the outside is captured in the column decoder. At this time, a word line and a bit line are not selected. Thereafter, in response to a second active command, a word line corresponding to the row address signal is selected in the row decoder, and, in response to a second write/read command, a bit line that corresponds to the column address signal is selected in the column decoder. The time period from the time at which the second read/write command is input to the time at which the second active command is input, is measured as tRCD.

Abstract: A method for controlling a semiconductor storage device including memory cells each configured to hold data of 2 bits or more, the method includes starting first signal processing, and inputting lower bits into the semiconductor storage device in a ready state, writing the lower bits to the memory cells, changing the semiconductor storage device from the ready state into a busy state, changing the semiconductor storage device from the busy state into the ready state, and finishing the first signal processing, starting second signal processing, and inputting upper bits into the semiconductor storage device in the ready state, and writing the upper bits to the memory cells. A period for the writing the upper bits is longer than a period for the writing the lower bits. A period for performing the second signal processing is longer than a period for performing the first signal processing.

Abstract: A page buffer circuit comprises a bit line selection unit, a latch unit, and a bit line control unit. The bit line selection unit is configured to select a bit line coupled to memory cells. The latch unit comprises a plurality of latch circuits. The plurality of latch circuits is coupled to a sense node and configured to latch data to be programmed into the memory cells or store data from the memory cells. The bit line control unit is coupled to the sense node and configured to temporarily charge a voltage of the selected bit line in response to charge and transfer control signals or transfer the charged voltage to the selected bit line.

Abstract: Arrays of memory elements may have data lines and address lines. Each memory element may have five transistors. An address decoder may receive an undecoded address signal and may produce a corresponding decoded address signal. The decoded version of the address signal may be used in addressing the memory elements in the memory array. The memory array may be loaded with configuration data. Loaded memory elements may each provide a static output control signal that configures a programmable logic transistor in programmable logic. The memory elements may be powered with an elevated voltage during normal operation. Boosted address signals may be used when addressing the memory array. The address decoder may contain circuitry that is responsive to a clear control signal and an address output enable signal. The memory element array may be cleared by asserting the clear control signal and address output enable signal.

Abstract: Address decoders and access line drivers are provided. One such row decoder and access line driver receives power supply voltages in a manner that prevents CHC damage and avoids GIDL currents in transistors in the decoder and driver. The row decoder and a latch in the driver are powered by a first supply voltage, and an output stage in the access line driver is powered by a second supply voltage. The first and second supply voltages are maintained at a relatively low level during standby before an address is decoded. Only after an address is decoded to set the latch are the supply voltages increased to levels needed to drive the access line. Further, before resetting the latch, the first and power supply voltages are decreased to their standby levels. By maintaining the first and second voltages relatively low until after the latch is set and reset, GIDL currents may be avoided and CHC damage may be prevented.

Abstract: An integrated circuit device having configurable resources is configured as a memory controller that includes a plurality of bi-directional pins, an input buffer circuit that is operable to receive SSTL-compliant input and an output buffer that is operable to generate SSTL-compliant output. The input buffer circuit includes a first single-ended buffer coupled to a first voltage source and to a ground voltage. The first single-ended buffer has an input coupled to one of the bi-directional pins and has an output coupled to the control logic of the memory controller.

Abstract: A semiconductor IC in which a least significant bit of an external address signal is fixed to a signal level, the semiconductor integrated circuit includes an address control circuit configured to produce a carry signal, when a test mode signal is activated, in response to a column command signal and output an address signal, which is sequentially increased from an initial internal address signal, by latching the external address signal as the initial internal address signal and combining the latched initial internal address signal and the carry signal.

Abstract: A semiconductor memory circuit, comprising: a memory array, the memory array including a plurality of wordlines each connected to a respective row of cells and a plurality of bitlines each connected to a respective column of cells. The semiconductor memory circuit also comprises at least one row decoder for selecting a group of wordlines within the plurality of wordlines; and a plurality of driver circuits for driving the plurality of bitlines respectively and setting the cells connected to the group of wordlines to a predetermined logic state. Also, a method for presetting at least part of a memory array, the memory array comprising a plurality of wordlines each connected to a respective row of cells. The method comprises selecting a group of wordlines within the plurality of wordlines; and simultaneously setting memory cells connected to the group of wordlines to a predetermined logic state.

Abstract: A control circuit for a read operation of a SERDES (SERializer and DESeriallizer) type semiconductor memory apparatus is disclosed that includes a first delay unit that is configured to generate and output a first delay signal to a first global input/output line driver by receiving a sensing-enable signal ‘IOSTB’, and to generate and output a second delay signal to a second global input/output line driver by receiving the sensing-enable signal. The first delay unit generates the second delay signal by delaying the sensing-enable signal in synchronization with a clock. The semiconductor memory apparatus also includes a second delay unit configured to generate a pipe latch control signal in response to the first delay signal and the second delay signal.

Abstract: A method of and apparatus for arbitrating a memory access conflict to a memory array. The apparatus may include selection logic coupled with a plurality of ports and a memory array to arbitrate among a plurality of contending memory access requests and to conditionally block write data from accessing the memory array when write data arrives late in time.

Abstract: The present invention provides a novel wiring method for LR-DIMM of VLP type that conforms to LR-DIMM technology. The LR-DIMM comprises a plurality of DRAMs mounted on a board, two connectors mounted on the board for receiving data, and a buffer device mounted on the board for redriving data applied to the two connectors to supply the data to the plurality of DRAMs. The buffer device is located near the center of the board on which the two connectors are arranged at both ends thereof, and supplies data from each connector to DRAMs arranged on the opposite side to the connector.

Abstract: A signal aligning circuit includes a plurality of pads receiving input signals in parallel 1 bit by 1 bit; a first transferring unit for transferring the input signals as first signals in synchronization with a first clock signal of an internal clock, and transferring the input signals as second signals in synchronization with a second clock signal of the internal clock; a second transferring unit for transferring the first signals in synchronization with the second clock signal of the internal clock; and an aligning unit for aligning the first and second signals transferred from the first and second transferring units and outputting the aligned signal as output signals.

Abstract: A reference voltage selecting unit selectively outputs a first external reference voltage and a second external reference voltage as a selection reference voltage in accordance with whether to perform a wafer test. An address buffer generates an internal address by buffering an external address in accordance with the selection reference voltage. A command buffer generates an internal command by buffering an external command in accordance with the selection reference voltage. A data buffer generates internal data by buffering an external data in accordance with the second external reference voltage.

Abstract: In a semiconductor memory device and an internal data transmission method thereof, the device includes a memory controller, a pair of data lines, and a plurality of memory banks. During an internal data transmission operation, the memory controller externally receives and stores a source address and a target address in response to an externally applied command and outputs an internal control signal and an internal address signal using the source address and the target address. The internal control signal includes an internal write signal and an internal read signal. Transmission data is transmitted on the pair of data lines during the internal data transmission operation. The plurality of memory banks read the transmission data stored in a region corresponding to the source address in response to the internal read signal, transmit the transmission data on the pair of data lines, and write the transmission data transmitted on the pair of data lines in response to the internal write signal.

Abstract: A semiconductor memory device of the claimed invention, having an active state for performing a read or write operation and an inactive state except for the active state includes a data input/output (I/O) line; a pull-up latch unit for pulling-up the data I/O line when the semiconductor memory device is in the inactive state; a pull-down latch unit for pulling-down the data I/O line when the semiconductor memory device is in the inactive state; and a selection unit for selectively driving one of the pull-up latch unit and the pull-down latch unit.

Abstract: The semiconductor integrated circuit includes a command decoder, a shift register unit and a command address latch unit. The command decoder is responsive to an external command defining write and read modes and configured to provide a write command or a read command according to the external command using a rising or falling clock. The shift register unit is configured to shift an external address and the write command by a write latency in response to the write command. The column address latch unit is configured to latch and provide the external address as a column address in the read mode, and to latch a write address, which is provided from the shift register unit, and provide the write address as the column address in the write mode.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation; and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.

Abstract: A semiconductor memory device can output data according to a predetermined data output timing, in spite of a high frequency of system clock, even when a delay locked loop is disabled. The semiconductor memory device includes a delay locked loop configured to perform a delay locking operation on an internal clock to output delay locked clock, and a data output control unit configured to determine a data output timing, according to whether the delay locked loop is enabled or disabled, in response to a read command.

Abstract: A semiconductor memory device includes: a first address buffer configured to be used in a test mode and a normal mode and to receive more addresses in the test mode than in the normal mode; and a second address buffer configured to be used in the normal mode and disabled in the test mode.

Abstract: A semiconductor memory device is capable of controlling an address and data mask information through the use of a common part, thereby reducing chip size. The semiconductor memory device for receiving the addresses and data mask information via a common pin includes a buffer unit and a shift register unit. The buffer unit receives the addresses and data mask information. The shift register unit is comprised of a plurality of latch stages connected in series, for sequentially latching the addresses and data mask information being inputted in series, and an address output unit and a data mask information output unit for outputting information from different latch stages.

Abstract: A phase-change memory device performs a buffer program operation in response to a buffer program command sequence. The phase-change memory device includes a page buffer unit configured to store a plurality of input data corresponding to a word count value of a buffer program command sequence and selectively output the stored input data in response to a selection signal, and a page buffer control unit configured to generate the selection signal determined by counting a value representing the word count value.

Abstract: A semiconductor memory device has a command decoder responsive to a plurality of commands to set the semiconductor memory device to a normal mode, for generating control signals corresponding to the commands, respectively, and a row address prelatch circuit for holding a row address except for a bank address input together with a precharge command, and outputting the row address to a row address latch circuit, when the semiconductor memory device is in a test mode. The row address latch circuit holds the row address output from the row address prelatch circuit in synchronism with a control signal which is generated when an active command is input. The column address latch circuit holds the column address which has already been input when the active command is input, in synchronism with a control signal which is generated when either a read command or a write command is input.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a control pulse generation unit configured to generate a control pulse following a time corresponding to a predetermined multiple of cycles of a clock after a read write pulse is inputted; and a delay unit configured to output internal addresses when the control pulse is inputted, wherein the internal addresses are input as external addresses.

Abstract: A semiconductor disk wherein a flash memory into which data is rewritten in block unit is employed as a storage medium, the semiconductor disk including a data memory in which file data are stored, a substitutive memory which substitutes for blocks of errors in the data memory, an error memory in which error information of the data memory are stored, and a memory controller which reads data out of, writes data into and erases data from the data memory, the substitutive memory and the error memory. Since the write errors of the flash memory can be remedied, the service life of the semiconductor disk can be increased.

Abstract: A semiconductor memory device is provided that is capable of reading out mode register information stored in a register adapted for LPDDR2 (Low Power DDR2), through DQ pads. The semiconductor memory device includes a mode register control unit configured to receive address signals, a mode register write signal and a mode register read signal and generate a flag signal and at least one output information signal, and a global I/O line latch unit for transferring the output information signal to a global I/O line in response to the flag signal.

Abstract: A command processing circuit for generating internal command signals corresponding to a plurality of unit internal command signals sequentially applied during a plurality of command cycles, the command processing circuit includes a first command latching unit configured to latch a first unit internal command signal applied in a first command cycle and a second command latching unit configured to latch a second unit internal command signal in response to the first unit internal command signal latched in the first command latching unit in a second command cycle after the first command cycle, and output an internal command signal corresponding to the first unit internal command signal and the second unit internal command signal.

Abstract: A semiconductor memory device includes a strobe signal generator for receiving a write command and generating a write strobe signal that defines an activation period variably according to an operation frequency, and a data transfer unit for transferring data from an external device to an internal data line in response to the write strobe signal.

Abstract: Circuits, memories, and methods for latching a write command and later provided write data including write command and write data timing circuits. One such timing circuit includes internal write command latch to latch an internal write command in response to write command latch signal. The internal write command latch releases the latched write command in response to the write command latch signal after a latency delay. The timing circuit further includes a write leveling flip-flop (FF) circuit and a write data register. One such method includes generating and latching an internal write command. The latched internal write command is released after a latency delay responsive to the memory clock signal. The internal write command is propagated over an internal write command path. Write data is captured and internal write command latched in response to a write clock signal. The captured write data is released to be written to memory.

Abstract: A semiconductor memory includes an address converting circuit which latches an address and a bank signal and generates a latch address for activating a data access path of a second bank group, and converts the latch address according to a level of the bank signal and generates a variable address for activating a data access path of a first bank group, a first column decoder which decodes the variable address and generates a first output enable signal for activating the data access path of the first bank group, and a second column decoder which decodes the latch address and generates a second output enable signal for activating the data access path of the second bank group.

Abstract: A dual function serial and parallel data register with integrated program verify functionality. The master and slave latching circuits of the dual function data register can concurrently store two different words of data. In a program verify operation, the master latch stores program data and the slave latch will receive and store read data. Comparison logic in each register stage will compare the data of both latches, and integrate the comparison result to that of the previous register stage. The final single bit result will indicate the presence of at least one bit that has not been programmed. Automatic program inhibit logic in each stage will prevent successfully programmed bits from being re-programmed in each subsequent reprogram cycle. Either data word can be serially clocked out by selectively starting the shift operations on either the low or high active logic level of a clock signal.

Abstract: An electronic circuit (200) for use with an accessing circuit (110) that supplies a given address and a partial write data portion and also has dummy cycles. The electronic circuit (200) includes a memory circuit (230) accessible at addresses, an address buffer (410), a data buffer (440) coupled to the memory circuit (230), and a control circuit (246) operable in the dummy cycles to read data from the memory circuit (230) to the data buffer (440) from a next address location in the memory circuit (230) and to store that next address in the address buffer (410).

Abstract: An interface of the present invention includes a first inverter circuit that inverts a logic level of an input signal given to an external input terminal and outputs the inverted logic level, a second inverter circuit that outputs a potential in which a logic level of an output signal of the first inverter circuit is inverted, that is, a potential higher or lower than a logic of an input signal applied to the first inverter circuit by the amount of a predetermined potential, and a feedback path that positive feedbacks an output signal of the second inverter circuit to the external input terminal. The interface circuit of the invention positive-feedbacks a potential of the output signal of the second inverter circuit and shifts the potential of the external input terminal in a floating state to an H or L level potential.

Abstract: A semiconductor memory input/output device includes selection pads used to input and output signals for multiple operation modes and having multiple functions, a control signal generator for outputting setting signals and a mask control signal, a lower input/output unit including a lower output buffer for outputting a read data strobe signal to a selection pad and a lower input buffer for receiving a lower data mask signal from the selection pad, and selecting one operation of the lower output buffer and the lower input buffer, and an upper input/output unit including an upper output buffer for outputting an inverted read data strobe signal to the second selection pad and an upper input buffer for receiving an upper data mask signal from the second selection pad, and selecting one operation of the upper output buffer and the upper input buffer.

Abstract: An integrated circuit is provided with built-in-self test circuitry. The integrated circuit may have multiple blocks of memory. The memory may be tested using the built-in-self test circuitry. Each memory block may include a satellite address generator that is used in generating test addresses for the memory blocks. Each memory block may also include failure analysis logic and output response analyzer logic. Stalling logic may be used to individually stall memory block testing on a block-by-block basis during memory tests. Address buffer circuitry such as first-in-first-out buffers may be used to provide randomized memory addresses during testing.

Abstract: A semiconductor memory device includes: a command latch circuit that latches a command signal; an address latch circuit that latches an address signal; a mode latch circuit that latches a mode signal; and a command decoder that selects the address latch circuit in response to the latch of a normal command by the command latch circuit, and selects the mode latch circuit in response to the latch of an adjustment command. With this arrangement, the mode signal can be dynamically received without performing a mode register set. Therefore, when a sufficiently large latch margin of the mode latch circuit is secured, there is no risk that it becomes impossible to input the mode signal.

Abstract: Circuits and methods are described for decoding exemplary memory arrays of programmable and, in some embodiments, re-writable passive element memory cells, which are particularly useful for extremely dense three-dimensional memory arrays having more than one memory plane. In addition, circuits and methods are described for selecting one or more array blocks of such a memory array, for selecting one or more word lines and bit lines within selected array blocks, for conveying data information to and from selected memory cells within selected array blocks, and for conveying unselected bias conditions to unselected array blocks.

Abstract: A memory device includes a clock buffer circuit. The clock buffer circuit includes a cross-coupled logic circuit. The cross-coupled logic circuit has at least two logic gates in which an output of at least one of the logic gates is coupled to an input of at least one of the logic gates. The cross-coupled logic circuit is coupled to an input for accepting a clock signal. The memory device also includes a clock driver operable to generate a clock signal from the output of the cross-coupled logic circuit. A feedback loop from the clock signal to the cross-coupled logic circuit controls the cross-coupled logic circuit. A buffer circuit including a tri-state inverter is coupled to the clock signal to maintain the clock signal while avoiding contention with the clock generator. The memory device is enabled by a chip select signal.

Abstract: Provided is a cross-point latch and a method of operating the cross-point latch. The cross-point latch includes a signal line, two control lines crossing the signal line, and unipolar switches disposed at crossing points between the signal line and the control lines.

Abstract: A memory device includes a configurable array of memory cells. A number of array banks is configured based upon data stored in a mode register or decoded by logic circuitry. The memory device remains a full capacity memory, regardless of the number of array banks. Memory address decoding circuitry is adjusted to route address signals to or from a bank address decoder based upon the number of array banks selected.

Abstract: The present invention provides a circuit for controlling a column-command address corresponding to a specific column of a DRAM array. The circuit includes a control unit and a FIFO register. The control unit determines a period number, and synchronously produces an input pointer and an output pointer, wherein the output pointer is lagged behind the input pointer by the period number. The FIFO register utilizes the input pointer to store the column-command address, and utilizes the output pointer to output the column-command address.

Abstract: An interface of the present invention includes a first inverter circuit that inverts a logic level of an input signal given to an external input terminal and outputs the inverted logic level, a second inverter circuit that outputs a potential in which a logic level of an output signal of the first inverter circuit is inverted, that is, a potential higher or lower than a logic of an input signal applied to the first inverter circuit by the amount of a predetermined potential, and a feedback path that positive feedbacks an output signal of the second inverter circuit to the external input terminal. The interface circuit of the invention positive-feedbacks a potential of the output signal of the second inverter circuit and shifts the potential of the external input terminal in a floating state to an H or L level potential.

Abstract: A semiconductor device includes a termination driver for driving a data line with a predetermined termination level by using an external power supply voltage and a drive current controller for controlling a drive current flowing into the data line from the termination driver in response to a voltage level of the external power supply voltage.

Abstract: Wordline driving circuit of semiconductor memory device includes a bias generator configured to generate a threshold bias voltage for accessing data, an over-driver configured to increase the threshold bias voltage at an initial stage of a data accessing operation and a wordline driver configured to activate a wordline in response to the threshold bias voltage and a signal output from the over-driver.

Abstract: Electronic apparatus, systems, and methods may operate structures to access a portion of a row of a memory array without accessing the entire row. Additional apparatus, systems, and methods are disclosed.

Abstract: A memory device includes a configurable address register having a first set of input buffers coupled to a first set on address bus terminals and a second set of input buffers coupled to a second set of address bus terminals. In a first addressing configuration, address signals are simultaneously applied to the address bus terminals in the first and second sets, and they are simultaneously stored in respective address registers. In a second addressing configuration, a plurality of sets of address signals are sequentially applied to the address bus terminals in only the first set of address bus terminals. Each set of address signals is then stored in a different address register.

Abstract: A semiconductor memory device is capable of transferring address signals at high speed and improving the operation reliability even though an input rate of an address signal increases, and thus a degradation of an operation speed caused by applying a bus inversion scheme can be prevented and power consumption can be reduced. The semiconductor memory device includes a bus inversion decoding block configured to determine whether a plurality of address signals are inverted or not by decoding an indication control signal, and an address buffer block configured to receive two address signals per one cycle of an external clock, align the received address signals for parallel processing, and transfer the address signals or inverted address signals according to an output of the bus inversion decoding block.