Abstract: According to one embodiment, a magnetic memory element includes: a magnetic wire, a stress application unit, and a recording/reproducing unit. The magnetic wire includes a plurality of domain walls and a plurality of magnetic domains separated by the domain walls. The magnetic wire is a closed loop. The stress application unit is configured to cause the domain walls to circle around along the closed loop a plurality of times by applying stress to the magnetic wire. The recording/reproducing unit is configured to write memory information by changing magnetizations of the circling magnetic domains as the domain walls circle around and to read the written memory information by detecting the magnetizations of the circling magnetic domains.

Abstract: A memory structure and method to fabricate the same is described. The memory structure includes a first memory cell having a first pair of non-volatile portions. The memory structure also includes a second memory cell having a second pair of non-volatile portions. The first and second pairs of non-volatile portions are disposed in an inter-locking arrangement.

Abstract: An object of the present invention to provide a semiconductor device having a highly functional memory element with improved reliability, and to provide a technique for manufacturing such a highly reliable semiconductor device with a high yield at low cost without complicating an apparatus or a process. As a top view shape of a memory element, a rectangular shape having a projection and a depression on the periphery, a zigzagged shape having one or plural bends, a comb shape, a ring shape having an opening (space) inside, or the like is used. Alternatively, a rectangle with a ratio of a long side to a short side being high, an ellipse with a ratio of a long axis to a short axis being high, or the like can also be used.

Abstract: The invention provides a semiconductor device where data can be written after the production and forgery caused by rewriting of data can be prevented, and which can be manufactured at a low cost using a simple structure and an inexpensive material. Further, the invention provides a semiconductor device having the aforementioned functions, where wireless communication is not blocked by the internal structure. The semiconductor device of the invention has an organic memory provided with a memory cell array including a plurality of memory cells, a control circuit for controlling the organic memory, and a wire for connecting an antenna. Each of the plurality of memory cells has a transistor and a memory element. The memory element has a structure where an organic compound layer is provided between a first conductive layer and a second conductive layer. The second conductive layer is formed in a linear shape.

Abstract: A multi-port switch and a method of command switching using such a switch. Multiple virtual targets provide multiple hosts with access to the physical target device attached to the target interface of the switch. The switch intelligently dispatches operations received by the virtual targets to the physical storage target device to provide shared access. In doing so, the communication between the switch and the physical target can fully comply with the SATA protocol without the physical target being aware that the operations have originated from multiple physical hosts, and without the multiple physical hosts being aware of the shared nature of the physical SATA target device.

Abstract: A memory module includes an array of N memory devices, each memory device having M data pins, where N is greater than M, and M and N are positive integers; and N bit lines traversing the array of N memory devices, such that each one of the N bit lines is connected to M of the N memory devices.

Abstract: A dynamic random access memory (DRAM) formed in a silicon chip that includes a support area in which support circuitry of the memory includes a single electrical contact through two dielectric layers to a conductive layer of a gate stack of a field effect support transistor that has a capping layer through which the electrical contact passes to the gate. The DRAM also includes a memory area containing an array of memory cells each include a field effect transistor. Drain regions of the transistors of the memory cells and drain and source regions of field effect transistors of the support transistors have first electrical contacts thereto through the first dielectric layer and have second electrical contacts which pass through the second dielectric layer and electrical contact to the first electrical contacts. Forming of the second electrical contacts concurrently with the single electrical contact to the gate of the support transistor saves a processing step over prior art processes.

Abstract: An electrical woven electrical connection matrix plane intended primarily for switching electric signals in electronic circuits, which is made from interwoven insulation threads and X and Y current conductors, the X and Y current conductors at intersections being located on different surfaces of an insulation field formed by the interwoven insulation threads. At preset intersections there are disposed contact nodes formed by interwoven X and Y current conductors brought out at one surface of the insulation field, and at least one of the plane sections is provided with a loose hanging layer of several adjacent current conductors extended along one axis which is positioned over the interwoven insulation threads and current conductors extended along the other axis.