Abstract: The disclosed technology relates generally to semiconductor devices and more particularly to magnetic tunnel junction devices. According to an aspect, an MTJ device comprises a spin-orbit-torque (SOT)-layer. The MTJ device additionally comprises a first free layer, a second free layer, a reference layer and a tunnel barrier layer arranged between the second free layer and the reference layer. The MTJ device further comprises a spacer layer arranged as an interfacial layer between the first free layer and the second free layer. The SOT-layer is adapted to switch a magnetization direction of the first free layer through SOT. The first free layer is adapted to generate a magnetic stray field acting on the second free layer such that a magnetization direction of the second free layer is responsive to a magnetization direction of the first free layer. According to another aspect, a circuit comprises the MTJ device.

Abstract: A memory device includes a spin orbit electrode structure having a dielectric structure including a first sidewall, a second sidewall opposite to the first sidewall, a top surface. The spin orbit electrode structure further includes an electrode having a spin orbit material adjacent to the dielectric structure, where the electrode has a first electrode portion on the top surface, a second electrode portion adjacent to the first sidewall and a third electrode portion adjacent to the second sidewall. The first electrode portion, the second electrode portion and the third electrode portion are contiguous. The spin orbit electrode structure further includes a conductive interconnect in contact with the second electrode portion or the third electrode portion. The memory device further includes a magnetic junction device on a portion of the top surface of the first electrode portion.

Abstract: A magnetoresistive memory device includes a plurality of bottom conductive lines, a plurality of top conductive lines, a first memory cell, and a second memory cell. The top conductive lines are over the bottom conductive lines. The first memory cell is between the bottom conductive lines and the top conductive lines and includes a first magnetic tunnel junction (MTJ) stack. The second memory cell is adjacent the first memory cell and between the bottom conductive lines and the top conductive lines. The second memory cell includes a second MTJ stack, and a top surface of the second MTJ stack is higher than a top surface of the first MTJ stack.

Abstract: According to one embodiment, a memory device includes: a first chip including a first insulating layer and a first pad; a plurality of memory units provided in a first area of the first insulating layer and arranged at first intervals in a first direction parallel to a surface of the first chip; a plurality of mark portions provided in a second area of the first insulating layer and arranged at second intervals in the first direction; a second chip including a second pad connected to the first pad and overlapping the first chip in a second direction perpendicular to the surface of the first chip; and a circuit provided in the second chip.

Abstract: Techniques for integrating an embedded MRAM device with a BEOL interconnect structure are provided. In one aspect, a method of forming an embedded MRAM device includes: depositing a cap layer onto a substrate; forming a metal line and metal pad on the cap layer; patterning the metal line to form first top vias, and the metal pad to form a second top via; depositing a dielectric material onto the substrate surrounding the first/second top vias; recessing the second top via to form a bottom contact via self-aligned to the metal pad which serves as a bottom contact; forming an MRAM cell over the bottom contact via; and forming first/second top contacts in contact with the first top vias/the MRAM cell. An embedded MRAM device is also provided.

Abstract: In some embodiments, the present disclosure relates to an integrated circuit. The integrated circuit has a magnetic tunnel junction (MTJ) device disposed within a dielectric structure over a substrate. The MTJ device has a MTJ disposed between a first electrode and a second electrode. A first unipolar selector is disposed within the dielectric structure and is coupled to the first electrode. The first unipolar selector is configured to allow current to flow through the MTJ device along a first direction. A second unipolar selector is disposed within the dielectric structure and is coupled to the first electrode. The second unipolar selector is configured to allow current to flow through the MTJ device along a second direction opposite the first direction.

Abstract: A memory device with reduced power consumption is provided. The memory device includes a plurality of memory cells, a precharge circuit, a latch circuit, a bit line pair, and a local bit line pair. The precharge circuit has a function of supplying precharge voltage to the local bit line pair. The plurality of memory cells are connected to the local bit line pair. The latch circuit is connected to the local bit line pair. The latch circuit in a standby state is preferably supplied with the precharge voltage and one of low power supply voltage and high power supply voltage.

Abstract: A semiconductor memory device of an embodiment includes: a first wiring disposed at a first level and extending in a first direction; a second and third wirings disposed at a second level and extending in the first direction; a plurality of fourth wirings disposed at a third level and extending in a third direction; a plurality of first resistive change elements disposed in intersection regions of the first and fourth wirings; a plurality of second resistive change elements disposed in intersection regions between the second wiring and the third wiring and the fourth wirings; a first driving circuit electrically connected to the first wiring, a second driving circuit electrically connected to the second wiring, and a third driving circuit electrically connected to the third wiring; and a control circuit that controls the first driving circuit, the second driving circuit, and the third driving circuit, and also the fourth wirings.

Abstract: A memory device includes a memory cell and a sense amplifier. The sense amplifier has a reference circuit configured to output a reference voltage and a sensing circuit connected to the memory cell. A comparator includes a first input and a second input, with the first input connected to the reference circuit to receive the reference voltage, and the second input connected to the memory cell. A precharger is configured to selectively precharge the sensing circuit to a predetermined precharge voltage.

Abstract: A semiconductor memory device includes a first select line and a second select line. A first memory element among a plurality of memory elements has a first top electrode and a first bottom electrode. The first top electrode is connected to the first select line and the first bottom electrode is connected to the second select line. A second memory element among the plurality of memory elements, which is disposed adjacent to the first memory element, has a second top electrode and a second bottom electrode. The second top electrode is connected to the first select line, and the second bottom electrode is connected to the first select line without passing a resistive element of a memory element other than the second memory element.

Abstract: Described is an apparatus including memory cell with retention using resistive memory. The apparatus comprises: memory element including a first inverting device cross-coupled to a second inverting device; a restore circuit having at least one resistive memory element, the restore circuit coupled to an output of the first inverting device; a third inverting device coupled to the output of the first inverting device; a fourth inverting device coupled to an output of the third inverting device; and a save circuit having at least one resistive memory element, the save circuit coupled to an output of the third inverting device.

Abstract: According to one embodiment, a semiconductor storage device includes a first semiconductor storage area; a second semiconductor storage area; a reference circuit; a sense amplifier senses data stored in the first semiconductor storage area and the second semiconductor storage area; and a control circuit.

Abstract: A 3D NAND memory has vertical NAND strings across multiple memory planes above a substrate, with each memory cell of a NAND string residing in a different memory layer. Word lines in each memory plane each has a series of socket components aligned to embed respective floating gates of a group memory cells. In this way, the word line to floating gate capacitive coupling is enhanced thereby allowing a 4 to 8 times reduction in cell dimension as well as reducing floating-gate perturbations between neighboring cells. In one embodiment, each NAND string has source and drain switches that each employs an elongated polysilicon gate with metal strapping to enhance switching. The memory is fabricated by an open-trench process on a multi-layer slab that creates lateral grottoes for forming the socket components.

Abstract: A multi-core processor is presented. The multi-core processor includes a first spin transfer torque magnetoresistive random-access memory (STT-MRAM) cache associated with a first core of the multi-core processor and tuned according to first attributes and a second STT-MRAM cache associated with a second core of the multi-core processor and tuned according to second attributes.

Abstract: In various embodiments, a circuit arrangement may be provided including a data cell. The circuit arrangement may further include a first transistor and a second transistor. The first controlled electrode of the first transistor and the first controlled electrode of the second transistor may be coupled to the first electrode of the data cell. The second controlled electrode of the first transistor may be configured to electrically connect to a first reference voltage such that the first electrode of the data cell is electrically connected to the first reference voltage when the first transistor is activated. The second controlled electrode of the second transistor may be configured to electrically connect to a second reference voltage, such that the first electrode of the data cell is electrically connected to the second reference voltage when the second transistor is activated.

Abstract: A memory cell with a decoupled read/write path, the memory cell includes a switch comprising a gate, a first terminal and a second terminal, a resistive switching device connected to the gate of the switch, and a conductive path between the gate of the switch and the second terminal.

Abstract: A semiconductor device includes active strips. Active strip stack selection structures electrically couple to the active strip stacks at positions between the first and second ends, and select particular ones of the active strip stacks for operations. In one embodiment, different pads coupled to opposite pads have a higher voltage, depending on the memory cell selected for read. The same active strip stack selection structure can act as a pair of side gates for opposite sides of a first active strip stack, and as one side gate for each of the adjacent active strip stacks. Each active strip stack can have: a first structure from a first set acting as first and second side gates on a first side of word lines; and a second structure and a third structure from a second set respectively acting as third and fourth side gates on the second side of word lines.

Abstract: To provide a memory apparatus capable of operating at high speed with less current and inhibiting a decrease in an amplitude of a readout signal. A memory apparatus includes a memory device at least including a memory layer, a magnetic fixed layer, and an intermediate layer made of a non-magnetic body disposed between the memory layer and the magnetic fixed layer; current being capable of flowing in a lamination direction; a wiring for supplying current flowing to the lamination direction; and a memory control unit for storing information by flowing standby current at a predetermined level to the memory device via the wiring to incline the magnetization direction of the memory layer from the direction perpendicular to a film surface and flowing recording current that is higher than the standby current via the wiring to change the magnetization direction of the memory layer.

Abstract: A semiconductor storage device includes a first bit line and a second bit line. A nonvolatile memory element and a first cell transistor are connected in series between the first bit line and the second bit line. A sense transistor has a gate connected to a sense node which is provided between the first bit line and the memory element. A read bit line is connected to a source or a drain of the sense transistor. The read bit line is configured to transmit data of the memory element. A sense amplifier is configured to detect the logic of data transmitted from the read bit line.

Abstract: An apparatus includes a group of data cells and a reference cell coupled to the group of data cells. The reference cell includes four magnetic tunnel junction (MTJ) cells.

Abstract: According to one embodiment, a non-volatile semiconductor memory device includes a memory cell array and a row decoder. The memory cell array has NAND strings as a physical block, and word lines respectively connected to memory cells included in the NAND strings. The row decoder includes latch circuits and a drive circuit. When a failure exists within a corresponding first logical block, the latch circuits store a flag indicating the failure. The drive circuit inhibits driving of the word lines belonging to the first logical block when the flag is stored in the latch circuit corresponding to the first logical block to which the selected word lines belong, and allows the driving of the word lines belonging to the physical block including the first logical block when the flag is not stored in the latch circuit corresponding to the first logical block to which the selected word lines belong.

Abstract: A semiconductor storage device according to the present embodiment includes a plurality of bit lines, a plurality of word lines, and a plurality of memory cells each including a storage element and a switching element which are connected in series between adjacently paired ones of the bit lines. Gates of the switching elements of the memory cells connected between one of the adjacently paired ones of the bit lines are respectively connected to different ones of the word lines. A plurality of the storage elements and a plurality of the switching elements of the adjacent memory cells are alternately connected in series.

Abstract: Magnetic memory cell comprising two conductors and a magnetic storage element between the two conductors, wherein a magnetic enhancement layer (MEL) is provided in the proximity of at least along a partial length of at least one of the two conductors. The MEL is for enhancing a magnetic field in the element when the two conductors are energized. Methods for operation and fabrication process for the memory cell are also disclosed. The memory cell is particularly for use in magnetic random access memory (MRAM) circuits, when using magnetic tunnel junction (MTJ) stacks as the magnetic storage elements.

Abstract: A memory array includes wordlines, local bitlines, two-terminal memory elements, global bitlines, and local-to-global bitline pass gates and gain stages. The memory elements are formed between the wordlines and local bitlines. Each local bitline is selectively coupled to an associated global bitline, by way of an associated local-to-global bitline pass gate. During a read operation when a memory element of a local bitline is selected to be read, a local-to-global gain stage is configured to amplify a signal on or passing through the local bitline to an amplified signal on or along an associated global bitline. The amplified signal, which in one embodiment is dependent on the resistive state of the selected memory element, is used to rapidly determine the memory state stored by the selected memory element.

Abstract: A magnetoresistive device of an embodiment includes: first and second devices each including, a first magnetic layer having a changeable magnetization perpendicular to a film plane, a second magnetic layer having a fixed and perpendicular magnetization, and a nonmagnetic layer interposed between the first and second magnetic layers, the first and second devices being disposed in parallel on a first face of an interconnect layer; and a TMR device including a third magnetic layer having perpendicular magnetic anisotropy and having a changeable magnetization, a fourth magnetic layer having a fixed magnetization parallel to a film plane, and a tunnel barrier layer interposed between the third and fourth magnetic layers, the TMR device being disposed on a second face of the interconnect layer, and the third magnetic layer being magnetostatically coupled to the first magnetic layers of the first and second devices.

Abstract: A method for the control of the magnetic states of interacting magnetic elements comprising providing a magnetic structure with a plurality of interacting magnetic elements. The magnetic structure comprises a plurality of magnetic states based on the state of each interacting magnetic element. The desired magnetic state of the magnetic structure is determined. The active resonance frequency and amplitude curve of the desired magnetic state is determined. Each magnetic element of the magnetic structure is then subjected to an alternating magnetic field or electrical current having a frequency and amplitude below the active resonance frequency and amplitude curve of said desired magnetic state and above the active resonance frequency and amplitude curve of the current state of the magnetic structure until the magnetic state of the magnetic structure is at the desired magnetic state.

Abstract: According to one embodiment, a memory includes a memory cell array including blocks arranged in a column direction, first and second main global conductive lines each extending from a first end to a second end of the memory cell array in the column direction, a first resistance change element connected between the first and second main global conductive lines inside the memory cell array, a first reference global conductive line extending from the first end to the second end of the memory cell array in the column direction, and a second resistance change element connected to the reference global conductive line outside the memory cell array.

Abstract: Magnetic tunnel junctions (MTJ) suitable for spin transfer torque memory (STTM) devices, include perpendicular magnetic layers and one or more anisotropy enhancing layer(s) separated from a free magnetic layer by a crystallization barrier layer. In embodiments, an anisotropy enhancing layer improves perpendicular orientation of the free magnetic layer while the crystallization barrier improves tunnel magnetoresistance (TMR) ratio with better alignment of crystalline texture of the free magnetic layer with that of a tunneling layer.

Abstract: A magnetic memory according to an embodiment includes: a magnetic structure extending in a first direction and having a circular ring-like shape in cross-section in a plane perpendicular to the first direction; a nonmagnetic layer formed on an outer surface of the magnetic structure, the outer surface extending in the first direction; and at least one reference portion formed on part of a surface of the nonmagnetic layer, the surface being on the opposite side from the magnetic structure, the at least one reference portion containing a magnetic material.

Abstract: A memory cell with a decoupled read/write path includes a switch comprising a first terminal connected to a first line and a second terminal connected to a second line, a resistive switching device connected between a gate of the switch and a third line, and a conductive path between the gate of the switch and the second line.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: A semiconductor storage device according to the present embodiment includes a plurality of bit lines, a plurality of word lines, and a plurality of memory cells each including a storage element and a switching element which are connected in series between adjacently paired ones of the bit lines. Gates of the switching elements of the memory cells connected between one of the adjacently paired ones of the bit lines are respectively connected to different ones of the word lines. A plurality of the storage elements and a plurality of the switching elements of the adjacent memory cells are alternately connected in series.

Abstract: A method of fabricating a self-aligning magnetic tunnel junction the method includes patterning a lithographic strip on a second magnetic material deposited on a first magnetic material that is disposed on a substrate, forming a top magnetic strip by etching an exposed portion of the second magnetic material, patterning a nanowire and a magnetic reference layer island over the substrate and forming the nanowire and the magnetic reference layer island by etching an exposed portion of the first magnetic layer and an exposed portion of the top magnetic strip, wherein an interface between the magnetic nanowire and the magnetic reference layer island is an magnetic tunnel junction aligned with a width of the nanowire.

Abstract: Hydro-carbon nanorings may be used in storage. Sufficiently cooled, an externally hydrogen doped carbon nanoring may be used to create a radial dipole field to contain streams of electrons. Similarly, an internally hydrogen doped carbon nanoring may be used to create a radial dipole field to contain streams of positrons. When matched streams of positrons and electrons are sufficiently compressed they may form Cooper pairs with magnetic moments aligned to the movement of the stream. Matched adjacent Cooper pairs of electrons and positrons may contain information within their magnetic moments, and as such, may transmit and store information with little or no energy loss.

Abstract: According to one embodiment, a semiconductor device includes a processor chip, and a memory chip stacked on the processor chip with bumps and including a memory cell unit and a memory logic unit. The bumps are arranged on the memory logic unit. An address and data are transferred between the processor chip and the memory chip by use of shared bumps of the bumps.

Abstract: According to one or more embodiments of the present invention, the semiconductor memory device of this disclosure includes the first bit line and the second bit line. Each of the multiple memory cells includes a memory element and a transistor, which are connected in series between the first and the second bit lines. Multiple memory cells are connected in parallel between the first and the second bit lines. In the first memory cell, its memory element is connected to the first bit line, and its transistor is connected to the second bit line. In the second memory cell, its memory element is connected to the second bit line, and its transistor is connected to the first bit line.

Abstract: Each of m word lines is connected to n memory cells in a corresponding one of rows of m×n memory cells. Each of n bit lines is connected to m memory cells in a corresponding one of columns of m×n memory cells, and each of n source lines is connected to m memory cells in a corresponding one of columns of m×n memory cells. N first switching elements switch connection states between a reference node and the n bit lines, and n second switching elements switch connection states between the reference node and the n source lines. N third switching elements switch connection states between the write driver and the n bit lines, and n fourth switching elements switch connection states between the write driver and the n source lines.

Abstract: Embodiments include a memory array having a plurality of bit lines and a plurality of source lines disposed in columns. A plurality of word lines is disposed in rows. A plurality of storage elements have a first subset of storage elements electrically decoupled from the memory array and a second subset of storage elements coupled to the memory array. The memory array further includes a plurality of bit cells, each including one storage element from the second subset of storage elements coupled to at least two transistors. The bit cells are coupled to the plurality of bit lines and the plurality source lines. Each transistor is coupled to one word line. The memory array can further include logic to select a high performance mode and a high density mode.

Abstract: A memory array includes wordlines, local bitlines, two-terminal memory elements, global bitlines, and local-to-global bitline pass gates and gain stages. The memory elements are formed between the wordlines and local bitlines. Each local bitline is selectively coupled to an associated global bitline, by way of an associated local-to-global bitline pass gate. During a read operation when a memory element of a local bitline is selected to be read, a local-to-global gain stage is configured to amplify a signal on or passing through the local bitline to an amplified signal on or along an associated global bitline. The amplified signal, which in one embodiment is dependent on the resistive state of the selected memory element, is used to rapidly determine the memory state stored by the selected memory element. The global bit line and/or the selected local bit line can be biased to compensate for the Process Voltage Temperature (PVT) variation.

Abstract: A magnetic memory device includes a free layer and a guide layer on a substrate. An insulating layer is interposed between the free layer and the guide layer. At least one conductive bridge passes through the insulating layer and electrically connects the free layer and the guide layer. A diffusion barrier may be interposed between the guide layer and the insulating layer. The device may further include a reference layer having a fixed magnetization direction on a side of the free layer opposite the insulating layer and a tunnel barrier between the reference layer and the free layer. Related fabrication methods are also described.

Abstract: Magnetic memory cell comprising two conductors and a magnetic storage element between the two conductors, wherein a magnetic enhancement layer (MEL) is provided in the proximity of at least along a partial length of at least one of the two conductors. The MEL is for enhancing a magnetic field in the element when the two conductors are energized. Methods for operation and fabrication process for the memory cell are also disclosed. The memory cell is particularly for use in magnetic random access memory (MRAM) circuits, when using magnetic tunnel junction (MTJ) stacks as the magnetic storage elements.

Abstract: A magnetic random access memory includes multiple gate lines that are divided into a first gate line group and a second gate line group and arranged to be parallel to one another; multiple magnetic random access memory cells that are bonded to the gate lines in a direction intersected with the gate lines, respectively; multiple source lines that are bonded to one ends of switching devices included in the magnetic random access memory cells and arranged to be parallel to one another; and multiple bit lines that are bonded to one ends of magnetic tunnel junction devices included in the magnetic random access memory cells and arranged to be parallel to one another.

Abstract: Techniques are provided for programming a spin torque transfer magnetic random access memory (STT-MRAM) cell using a unidirectional and/or symmetrical programming current. A unidirectional programming current flows through the free region of the STT-MRAM cell in one direction to switch the magnetization of the free region in at least two different directions. A symmetrical programming current switches the magnetization of the free region to either of the two different directions using a substantially similar current magnitude. In some embodiments, the STT-MRAM cell includes two fixed regions, each having fixed magnetizations in opposite directions and a free region configured to be switched in magnetization to be either parallel with or antiparallel to the magnetization of one of the fixed regions. Switching the free region to different magnetization directions may involve directing the programming current through one of the two oppositely magnetized fixed regions.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: A magnetic memory element capable of maintaining high thermal stability (retention characteristics) while reducing a writing current. The magnetic memory element includes a magnetic tunnel junction having a first magnetic body including a perpendicular magnetization film, an insulating layer, and a second magnetic body serving as a storage layer including a perpendicular magnetization film, which are sequentially stacked. A thermal expansion layer is disposed in contact with the magnetic tunnel junction portion. The second magnetic body is deformed in a direction in which the cross section thereof increases or decreases by the thermal expansion or contraction of the thermal expansion layer due to the flow of a current, thereby reducing a switching current threshold value required to change the magnetization direction.

Abstract: A memory unit includes a magnetic tunnel junction data cell is electrically coupled to a bit line and a source line. The magnetic tunnel junction data cell is configured to switch between a high resistance state and a low resistance state by passing a write current through the magnetic tunnel junction data cell. A first diode is electrically between the magnetic tunnel junction data cell and the source line and a second diode is electrically between the magnetic tunnel junction data cell and the source line. The first diode and second diode are in parallel electrical connection, and having opposing forward bias directions. The memory unit is configured to be precharged to a specified precharge voltage level and the precharge voltage is less than a threshold voltage of the first diode and second diode.

Abstract: Systems and methods for realizing reference currents to improve reliability of sensing operations of segmented semiconductor memory arrays have been achieved. Preferred embodiments of the invention comprise MRAM arrays but the invention could be applied to any other memories requiring access on small, segmented arrays. All embodiments of the invention comprise a folded bit lines scheme, either in adjacent bit lines or in segment-to-segment folded bit lines. In two embodiments alternate strapping of Poly-Si Word Lines in every second segment is achieved by metal layer of Read Word Line and Write Select Line. An embodiment has stored 1 and 0 cells on both sides of a selected segment to be read.

Abstract: A method and system for providing a magnetic junction usable in a magnetic memory are described. The magnetic junction includes first and second pinned layers, first and second nonmagnetic spacer layers, and a free layer. The first pinned layer has a first pinned layer magnetic moment and is nonmagnetic layer-free. The first nonmagnetic spacer layer resides between the first pinned and free layers. The free layer resides between the first and second nonmagnetic spacer layers. The second pinned layer has a second pinned layer magnetic moment and is nonmagnetic layer-free. The second nonmagnetic spacer layer resides between the free and second pinned layers. The first and second pinned layer magnetic moments are antiferromagnetically coupled and self-pinned. The magnetic junction is configured to allow the free layer to be switched between stable magnetic states when a write current is passed through the magnetic junction.

Abstract: CMOS devices are provided in a substrate having a topmost metal layer comprising metal landing pads and metal connecting pads. A plurality of magnetic tunnel junction (MTJ) structures are provided over the CMOS devices and connected to the metal landing pads. The MTJ structures are covered with a dielectric layer that is polished until the MTJ structures are exposed. Openings are etched in the dielectric layer to the metal connecting pads. A seed layer is deposited over the dielectric layer and on inside walls and bottom of the openings. A copper layer is plated on the seed layer until the copper layer fills the openings. The copper layer is etched back and the seed layer is removed. Thereafter, an aluminum layer is deposited over the dielectric layer, contacting both the copper layer and the MTJ structures, and patterned to form a bit line.

Abstract: Methods of forming spin torque microelectronic devices are described. Those methods may include forming a free FM layer on a substrate, forming a non-magnetic layer on the free FM layer, forming at least three input pillars on the non-magnetic layer, and forming an output pillar on the non-magnetic layer to form a majority gate device.