Abstract: An anti-fuse unit structure includes a substrate, an anti-fuse device, and a select transistor. The anti-fuse device is formed in the substrate and comprises a first gate structure, a first source doped region, and a first drain doped region, wherein the first gate structure is electrically connected to the first drain doped region. The select transistor is formed in the substrate and matched with the anti-fuse device, and comprises a second gate structure, a second source doped region and a second drain doped region, wherein the second drain doped region is electrically connected to the first source doped region.

Abstract: A field of memory technologies and a reading circuit for a differential one time programmable (OTP) memory including a first and second memory cells in a differentially symmetrical structure, the reading circuit connects between the first and second memory cells and includes: a detector having a first and second connected to respective first and second memory cells, configured to detect one of a resistance value of a first or second fuse of respective first and second memory cells, and a resistance difference between the first and second fuse after a burn-in operation of the first or second memory is completed; and a latch connected to the detector, provides a readout data according to one of the resistance value of the first or second fuse, and the resistance difference. The reading circuit may both read out data normally and detect a resistance value of the fuse.

Abstract: A memory device is provided. The memory device includes a first transistor and a second transistor connected in series with the first transistor. The second transistor is programmable between a first state and a second state. A bit line connected to the second transistor. A sense amplifier connected to the bit line. The sense amplifier is operative to sense data from the bit line. A feedback circuit connected to the sense amplifier, wherein the feedback circuit is operative to control a bit line current of the bit-line.

Abstract: A memory circuit includes a non-volatile memory cell, a comparator and a detection circuit. The comparator is coupled to the non-volatile memory cell, and configured to generate a first output signal. The comparator including a first input terminal and a first output terminal. The first input terminal is coupled to the non-volatile memory cell by a first node, and configured to receive a first voltage. The first output terminal is configured to output the first output signal. The detection circuit is coupled to the comparator and the non-volatile memory cell. The detection circuit is configured to latch the first output signal and disrupt a current path between at least the non-volatile memory cell and the comparator. The detection circuit includes a first inverter coupled to the first output terminal of the comparator and configured to generate an inverted first output signal.

Abstract: Various embodiments of the present disclosure relate to a non-volatile memory device including a sense amplifier and an operation method thereof. The non-volatile memory device may include: a memory cell array comprising a plurality of memory cells; and the sense amplifier configured to read data of the plurality of memory cells and output the read data. The sense amplifier may include: a first stage sense amplifier configured to sense a voltage difference between a reference voltage and a voltage of a bit line connected to at least one memory cell among the plurality of memory cells, and perform a primary amplification of the sensed voltage difference; and a second stage sense amplifier configured to perform a secondary amplification of a first result of the primary amplification and output a second result of the secondary amplification.

Abstract: Disclosed herein are related to a memory device including a set of memory cells and a memory controller. In one aspect, each of the set of memory cells includes a select transistor and a storage element connected in series between a corresponding bit line and a corresponding source line. In one aspect, the memory controller is configured to apply a first write voltage to a bit line coupled to a selected memory cell, apply a second write voltage to a word line coupled to a gate electrode of a select transistor of the selected memory cell during a first time period, and apply a third write voltage to a source line coupled to the selected memory cell. The second write voltage may be between the first write voltage and the third write voltage.

Abstract: A device includes a memory cell that randomly presents either a first logic state or a second logic state. The memory cell includes: a plurality of first nanostructures extending along a first lateral direction; a plurality of second nanostructures extending along the first lateral direction and disposed at a first side of the plurality of first nanostructures; a plurality of third nanostructures extending along the first lateral direction and disposed at a second side of the plurality of first nanostructures; a dielectric fin structure disposed immediately next to the plurality of first nanostructures along a second lateral direction, wherein a first sidewall of each of the plurality of first nanostructures facing toward or away from the second lateral direction is in contact with the dielectric fin structure; and a first gate structure wrapping around each of the plurality of first nanostructures except for the first sidewall.

Abstract: A fuse programming unit, comprising: two efuse units and a mode control tube. The first efuse unit includes: one end of the first fuse forms the first end, and the second end is connected to the drain end of the first MOS. The first MOS source terminal is grounded, and the first word line formed by the gate terminal. The second efuse unit includes: the first end of the second fuse forms the second wire end, and the second end is connected to the drain end of the second MOS. The second MOS source terminal is grounded, and the gate terminal forms the second line. The source end of the mode control transistor is connected to the line end of the second efuse unit, the drain end is connected to the source end of the first MOS, and the gate end forms the correction end.

Abstract: A memory includes: first to Nth register circuits each suitable for receiving and storing a failure address transferred from a memory controller when a corresponding selection signal of first to Nth selection signals is activated, where N is an integer equal to or greater than 2; first to Nth resource latch circuits suitable for storing first to Nth resource signals indicating availability of the first to Nth register circuits, respectively; and a priority selection circuit suitable for activating, when two or more of the first to Nth resource signals are activated, one of selection signals respectively corresponding to the activated resource signals among the first to Nth selection signals.

Abstract: Circuits, methods, and devices for protecting against accidental fuse programming are discussed herein. For example, a fuse circuit may include a fuse, a first switch coupled to a first point and coupled in series with the fuse, and a second switch coupled in series with the fuse between the fuse and a second point.

Abstract: An anti-fuse sensing device and an operation method thereof are provided. The anti-fuse sensing device includes an anti-fuse sensing circuit, a voltage generating circuit, and a power-on detection circuit. During a power-on transient period of the voltage generating circuit, the power-on detection circuit provides an initialization voltage to a control terminal of the anti-fuse sensing circuit to prevent a voltage level of the control terminal of the anti-fuse sensing circuit from being in an unknown state. After the power-on transient period ends, the voltage generating circuit provides a control voltage to the control terminal of the anti-fuse sensing circuit. The anti-fuse sensing circuit senses a resistance state of an anti-fuse based on the control voltage. During the period when the voltage generating circuit provides the control voltage, the power-on detection circuit stops providing the initialization voltage to the control terminal of the anti-fuse sensing circuit.

Abstract: The data receiving circuit includes: a first amplification module configured to: receive a data signal, a first reference signal, and a second reference signal; and when an enable signal is at a first level, in response to a sampling clock signal and on a basis of a feedback signal, select the data signal and the first reference signal for first comparison and output a first signal pair, or select the data signal and the second reference signal for second comparison and output a second signal pair; and a second amplification module configured to receive output signals of the first amplification module as an input signal pair, perform amplification processing on a voltage difference of the input signal pair.

Abstract: A memory device is disclosed. The memory device includes a plurality of memory cells, each of the memory cells including an access transistor and a resistor coupled to each other in series. The resistors of the memory cells are each formed as one of a plurality of interconnect structures disposed over a substrate. The access transistors of the memory cells are disposed opposite a first metallization layer containing the plurality of interconnect structures from the substrate.

Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: In an embodiment, a device includes: a first word line over a substrate, the first word line including a first conductive material; a first bit line intersecting the first word line; a first memory film between the first bit line and the first word line; and a first conductive spacer between the first memory film and the first word line, the first conductive spacer including a second conductive material, the second conductive material having a different work function than the first conductive material, the first conductive material having a lower resistivity than the second conductive material.

Abstract: A memory circuit includes a bank of non-volatile memory (NVM) devices, a high-voltage (HV) driver, a global HV power switch configured to generate a HV power signal, and a HV power switch coupled between the global HV switch and the HV driver. The HV power switch is configured to, responsive to the HV power signal, output power and ground signals, each of the power signal and the ground signal having first and second voltage levels, and the HV driver is configured to output a HV activation signal to a column of the bank of NVM devices responsive to the power signal and the ground signal.

Abstract: An anti-fuse structure includes: a first unit including a first selection transistor, a first anti-fuse (AF) cell and a second AF cell; and a second unit including a second selection transistor, a third AF cell and a fourth AF cell. The first unit and second unit share an active region, which is provided with a first extension part and a second extension part which are independent of each other at a first side, and provided with a third extension part and a fourth extension part which are independent of each other at a second side, the first side being opposite to the second side. The first AF cell is arranged at the first extension part, the second AF cell is arranged at the second extension part, the third AF cell is arranged at the third extension part, and the fourth AF cell is arranged at the fourth extension part.

Abstract: A static random access memory (SRAM) or other bit-storing cell arrangement includes memory cells and a hierarchical bitline structure including local bitlines for subsets of the memory banks and a global bitline spanning the subsets. A keeper circuit for the global bitline is replaced by bias circuitry on output transistors of the memory cells.

Abstract: A heater device with a memory unit includes a first transistor, a second transistor, a memory unit and a heater. The first terminal of the second transistor and the first terminal of the first transistor are electrically connected to each other. The memory unit is electrically connected to the second terminal of the first transistor. The heater is electrically connected to the second terminal of the second transistor.

Abstract: A fuse structure and a method for manufacturing the same are provided. The fuse structure includes a substrate; a fin, located on the substrate and including a first fin region; and a gate stack structure, surrounding the top and side walls of the first fin region. The gate stack structure includes a first gate stack and a second gate stack. The first gate stack covers the first fin region, the second gate stack covers the first gate stack. The first gate stack is configured to receive a first gate voltage, the second gate stack is configured to receive a second gate voltage, and the first gate voltage is greater than the second gate voltage. The fuse structure reduces the area of the fuse unit and increase the integration level of the fuse circuit.

Abstract: Systems, devices, and methods are described herein for a programmable memory array. A programmable memory system includes an array of programmable memory bit cells. A memory bit cell of the array includes a first transistor of a first type controlled by a bit line, a second transistor of a second type responsive to a first word line and a second word line via a logic gate, and a third transistor of the second type responsive to the word line. The first word line is positioned substantially perpendicular to the bit line, and the second word line is positioned substantially parallel to the bit line. The first word line is activated via an X portion of an address. While the second word line is activated via a Y portion of the address.

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a set of resistive storage circuits including a first subset of resistive storage circuits connected between a first local line and a second local line in parallel. The first local line and the second local line may extend along a first direction. In one aspect, for each resistive storage circuit of the first subset of resistive storage circuits, current injected at a first common entry point of the first local line exits through a first common exit point of the second local line, such that each resistive storage circuit of the first subset of resistive storage circuits may have same or substantial equal resistive loading.

Abstract: A power-on read circuit includes a power voltage detector, a first voltage booster, a voltage selector, a reference voltage generator and a read voltage generator. The power voltage detector detects a power voltage to generate a control signal. The first voltage booster generates a first boosted voltage according to the control signal. The voltage selector selects the power voltage or the first boosted voltage to generate a selected voltage. The reference voltage generator receives the selected voltage as an operating power source, and generates a reference voltage based on the selected voltage according to the control signal. The read voltage generator generates a second boosted voltage according to the reference voltage and a clock signal, and generate a read voltage based on the second boosted voltage according to the control signal. The read voltage is provided to a memory cell array to perform a data reading operation.

Abstract: An element substrate including a liquid discharge element, comprising a memory element capable of storing individual information of the element substrate by a write, the memory element being configured to change an impedance value by the write, a plurality of current supply elements capable of supplying a current to the memory element, and a determination unit configured to determine presence/absence of the write based on a voltage generated in the memory element by the current selectively supplied from the plurality of current supply elements, wherein the plurality of current supply elements constitute a part of a current mirror circuit and each supply the current in an amount according to a size ratio to the memory element.

Abstract: Latch circuits with improved single event upset immunity and related systems, apparatuses, and methods are disclosed. An apparatus includes a fuse, a first driver circuit, and a second driver circuit. The fuse is configured to store a bit of information. The first driver circuit includes a first input terminal electrically connected to the fuse and a first output terminal electrically connected to a first latch input terminal. The second driver circuit includes a second input terminal electrically connected to the fuse and a second output terminal electrically connected to a second latch input terminal. The second latch input terminal is electrically isolated from the first latch input terminal by the first driver circuit and the second driver circuit.

Abstract: A low cost IC solution is disclosed to provide Super CMOS microelectronics macros. Hereinafter, the Super CMOS or Schottky CMOS all refer to SCMOS. The SCMOS device solutions with a niche circuit element, the complementary low threshold Schottky barrier diode pairs (SBD) made by selected metal barrier contacts (Co/Ti) to P— and N—Si beds of the CMOS transistors. A DTL like new circuit topology and designed wide contents of broad product libraries, which used the integrated SBD and transistors (BJT, CMOS, and Flash versions) as basic components. The macros include diodes that are selectively attached to the diffusion bed of the transistors, configuring them to form generic logic gates, memory cores, and analog functional blocks from simple to the complicated, from discrete components to all grades of VLSI chips. Solar photon voltaic electricity conversion and bio-lab-on-a-chip are two newly extended fields of the SCMOS IC applications.

Abstract: Transistor antifuses are disclosed. An apparatus may include an antifuse that may be configurable either as a short between a first node and a second node or as an open between the first node and the second node. The antifuse may include a selection transistor and an antifuse transistor. A source or drain of the selection transistor may be electrically coupled to the first node. A gate of the selection transistor may be configured to receive a selection voltage. A gate of the antifuse transistor may be electrically coupled the other of the source or drain of the selection transistor. A source or drain of the antifuse transistor may be electrically coupled to the second node. Associated devices, systems, and methods are also disclosed.

Abstract: Embodiments of the present disclosure relate to the field of semiconductor technology, and provide an anti-fuse memory and a control method thereof. The anti-fuse memory is configured to generate a programming pulse signal based on a row strobe signal, a word line of the anti-fuse memory array is configured to receive the row strobe signal, and the anti-fuse memory array is programmed in response to the programming pulse signal. The embodiments of the present disclosure are at least advantageous to improving accuracy of reading data from the anti-fuse memory array and improving yield of the anti-fuse memory.

Abstract: An anti-fuse unit and an anti-fuse array. The anti-fuse unit includes an anti-fuse device and a diode. An anode of the anti-fuse device is electrically connected with a bit line, a cathode of the anti-fuse device is electrically connected with an anode of the diode, and a cathode of the diode is electrically connected with a word line.

Abstract: A memory circuit includes a sense amplifier coupled to a non-volatile memory cell, and a detection circuit coupled to the sense amplifier and the non-volatile memory cell. The sense amplifier includes a comparator. The comparator includes a first input terminal coupled to the non-volatile memory cell by a first node, and configured to receive a first voltage, a second input terminal configured to receive a second voltage, and a first output terminal configured to output a first output signal. The detection circuit is configured to latch the first output signal and disrupt a current path between the non-volatile memory cell and the sense amplifier. The detection circuit includes a first inverter. A first input terminal of the first inverter is configured to receive the first output signal. A first output terminal of the first inverter is configured to generate an inverted first output signal.

Abstract: A state detection circuit of an anti-fuse memory cell includes a first switching element, having a first end connected to a power supply, a second end connected to a first node, and a control end connected to a controller; an anti-fuse memory cell array including a plurality of anti-fuse memory cell sub-arrays, bit lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the first node, and word lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the controller; and a comparator, having a first input end connected to the first node, and a second input end connected to a reference voltage.

Abstract: An eFuse cell is provided. The eFuse cell may include a first PMOS transistor and a first NMOS transistor configured to receive a programmed state selection (BLOWB) signal, a second PMOS transistor and a second NMOS transistor configured to receive a write word line bar (WWLB) for a program operation, a first read NMOS transistor and a second read NMOS transistor configured to receive a read word line (RWL) for a read operation, a program transistor configured to control a program current to flow for a fusing operation, and an eFuse connected between the first read NMOS transistor and the second read NMOS transistor.

Abstract: Various embodiments of the present disclosure relate to a non-volatile memory device including a sense amplifier and an operation method thereof. The non-volatile memory device may include: a memory cell array comprising a plurality of memory cells; and the sense amplifier configured to read data of the plurality of memory cells and output the read data. The sense amplifier may include: a first stage sense amplifier configured to sense a voltage difference between a reference voltage and a voltage of a bit line connected to at least one memory cell among the plurality of memory cells, and perform a primary amplification of the sensed voltage difference; and a second stage sense amplifier configured to perform a secondary amplification of a first result of the primary amplification and output a second result of the secondary amplification.

Abstract: A semiconductor device capable of efficiently increasing a capacity of a mounted storage element while achieving space saving, and an electronic apparatus including this semiconductor device are provided. The semiconductor device includes a storage element including a filament that has a first conductive layer, a second conductive layer, and an insulation layer. The first conductive layer and the second conductive layer are stacked with at least the insulation layer interposed between the first conductive layer and the second conductive layer. The filament obtains at least three identifiable resistance states by changing a combination of a state of the first conductive layer, a state of the second conductive layer, and a state of the insulation layer. The semiconductor device further includes a writing unit that produces the at least three identifiable resistance states by applying a blow current to the storage element.

Abstract: A multi-fuse memory cell is disclosed. The circuit includes: a first fuse element electrically coupled to a first transistor, a gate of the first transistor is electrically coupled to a first selection signal; a second fuse element electrically coupled to a second transistor, a gate of the second transistor is electrically coupled to a second selection signal, both the first transistor and the second transistor are grounded; and a programming transistor electrically coupled to the first fuse element and the second fuse element, wherein a gate of the programming transistor is electrically coupled to a programming signal.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to bulk wafer switch isolation structures and methods of manufacture. The structure includes: a bulk substrate material; an active region on the bulk substrate material; an inactive region adjacent to the active region; and an amorphous material covering the bulk substrate material in the inactive region, which is adjacent to the active region.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for automatic soft post-package repair (ASPPR). A memory may receive a row address along with a signal indicating an ASPPR operation, such as a bad page flag being set. A word line engine generates a physical address based on the row address, and ASPPR registers stores the physical address. The time it takes from receiving the row address to storing the physical address may be within the timing of an access operation on the memory such as tRAS. The row address may specify a single page of information. If the bad page flag is set, then a subsequent PPR operation may blow fuses to encode the physical address stored in the ASPPR registers.

Abstract: A memory circuit includes a bank of non-volatile memory (NVM) devices, a plurality of high-voltage (HV) drivers, a global HV power switch configured to generate a HV power signal, and a plurality of HV power switches coupled to the global HV switch. A first HV power switch of the plurality of HV power switches is coupled to each HV driver of the plurality of HV drivers, the first HV power switch of the plurality of HV power switches is configured to output a power signal responsive to the HV power signal, and each HV driver of the plurality of HV drivers is configured to output a HV activation signal to a corresponding column of the bank of NVM devices responsive to the power signal.

Abstract: When a driving circuit of an anti-fuse memory device programs a selected anti-fuse memory cell, voltage differences between unselected bit lines and unselected anti-fuse control lines would be eliminated or decreased to an acceptable value by floating unselected anti-fuse control lines or by applying a second control line voltage to the unselected anti-fuse control lines. Leakage currents flowing from unselected bit lines through ruptured anti-fuse transistors of the anti-fuse memory device to the unselected anti-fuse control lines would be decreased or eliminated, and program disturbance would be avoided.

Abstract: A semiconductor structure includes first and second transistors each having a source terminal, a drain terminal, and a gate terminal. The semiconductor structure further includes a program line; a first metal plate over the first and the second transistors; a first insulator over the first metal plate; a second metal plate over the first insulator; a second insulator over the second metal plate; and a third metal plate over the second insulator. The first metal plate, the first insulator, and the second metal plate form a first anti-fuse element. The second metal plate, the second insulator, and the third metal plate form a second anti-fuse element. The source terminal of the first transistor is electrically connected to the first metal plate. The source terminal of the second transistor is electrically connected to the third metal plate. The program line is electrically connected to the second metal plate.

Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: A semiconductor circuit according to the present disclosure includes: a first memory element including a first terminal, a second terminal coupled to a first node, and a tunnel barrier film, and configured to store information by breaking the tunnel barrier film; a first transistor including a drain coupled to the first node, a source, a gate, and a back gate coupled to a second node; and a second transistor including a drain, a source coupled to the second node, and a gate coupled to the first node.

Abstract: Methods, systems, and devices for signal sampling with offset calibration are described. For example, sampling circuitry may include an input pair of transistors where input signals may be provided to gate nodes of the transistors, and an output signal may be generated based on a comparison of voltages of drain nodes of the transistors. In some examples, source nodes of the transistors may be coupled with each other, such as via a resistance, and each source node may be configured to be coupled with a ground node. In some examples, a conductive path between the source nodes may be coupled with one or more switching components configurable for further coupling of the source nodes with the ground node. In some examples, enabling such switching components may add an electrical characteristic (e.g., capacitance) to the conductive path between the source nodes, which may be configurable to mitigate sampling circuitry imbalances.

Abstract: A re-programmable integrated circuit (IC) includes a plurality of non-volatile memory elements, each including a fuse portion initially configured to have either a first resistance value or a second resistance value. Re-programming circuitry includes a controllable element coupled to each fuse portion and selectively operable to cause an electrical current to flow through the fuse portion sufficient to cause that fuse portion to transition to an altered state having a resistance value greater than the first and second resistance values. Reference resistance circuitry is configurable between an initial state and a re-programmed state.

Abstract: An anti-fuse sensing device and an operation method thereof are provided. The anti-fuse sensing device is adapted for sensing a resistance state of an anti-fuse. The anti-fuse sensing device includes a voltage generating circuit, a comparison circuit, and a sensing circuit. The voltage generating circuit is configured to generate a comparison voltage that changes with temperature. The comparison circuit is coupled to the voltage generating circuit to receive the comparison voltage. The comparison circuit is configured to compare the comparison voltage with a reference voltage, and convert a difference between the comparison voltage and the reference voltage into a bias voltage that changes with temperature. The sensing circuit is coupled to the comparison circuit to receive the bias voltage. The sensing circuit is configured to sense the resistance state of the anti-fuse according to the bias voltage.

Abstract: An OTP with ultra-low power read can be programmed with a minimum and a maximum program voltage. When programming within the range, the post-program OTP to pre-program resistance ratio can be larger than N, where N>50, so that more sensing techniques, such as single-end sensing, can be used to reduce read current. At least one of the OTP cells can be coupled to a common bitline, which can be further coupled to a first supply voltage lines via a plurality of datalines. The resistance in the at least one OTP cell can be evaluated by strobing at least one comparator output of the discharging bitline/dataline.

Abstract: The present invention relates to a dynamic random access memory and a programming method therefor with two stages. In a first stage, a capacitor of a memory cell of the dynamic random access memory is broken down, so that the dynamic random access memory becomes a one-time programmable memory. In a second stage, a resistance of the capacitor that is broken down is reduced, so that state data of the memory cell can be more easily interpreted.

Abstract: An electronic device includes a row control circuit and a programming circuit. The row control circuit is suitable for activating a synthesis word line selection signal for enabling a first fuse cell and a second fuse cell in a first mode. In addition, the row control circuit is suitable for activating one of a first fuse access signal for storing fuse data in the first fuse cell or outputting the fuse data from the first fuse cell and a second fuse access signal for storing the fuse data in the second fuse cell or outputting the fuse data from the second fuse cell. The programming circuit is configured to store the fuse data in one of the first and second fuse cells based on the synthesis word line selection signal and the first and second fuse access signals in the first mode.

Abstract: A memory device includes at least one bit line, at least one word line, and at least one memory cell comprising a capacitor and a transistor. The transistor has a gate terminal coupled to the word line, a first terminal, and a second terminal. The capacitor has a first end coupled to the first terminal of the transistor, a second end coupled to the bit line, and an insulating material between the first end and the second end. The insulating material is configured to break down under a predetermined break-down voltage or higher applied between the first end and the second end.

Abstract: By stably separating a melting location of a fuse (3) from conductive layers (5A, 5B), reliable melting of the fuse (3) is enabled. A fuse (3) including a fuse body (3A) and two pads (3Ba, 3Bb) connected by this and two conductive layers (5A, 5B) individually connected to the two pads (3Ba, 3Bb) are formed in a multilayer structure on a semiconductor substrate (1). A length of the fuse body (3A) is defined so that the melting location of the fuse (3) becomes positioned in the fuse body (3A) away from the region overlapped on the conductive layer (5A or 5B) when an electrical stress is applied between two conductive layers (5A, 5B) and the fuse (3) is melted.