Abstract: A device includes a first power supply line supplying a first voltage, first, second, and third nodes, a selection circuit connected between the first power supply line and the first node, a first anti-fuse connected between the first node and the second node, and a second anti-fuse connected between the first node and the third node. The second node and the third node are not connected to each other.

Abstract: Apparatuses and methods for sensing fuse states are disclosed herein. An apparatus may include an array having a plurality of sense lines. A plurality of cells may be coupled to a sense line of the plurality of sense lines. A fuse sense circuit may coupled to the sense line of the plurality of sense lines and configured to receive a sense voltage from a cell of the plurality of cells. The sense voltage may be based, at least in part, on a state of a fuse corresponding to the cell of the plurality of cells. The fuse sense circuit may further be configured to compare the sense voltage to a reference voltage to provide a fuse state control signal indicative of the state of the fuse.

Abstract: Methods and apparatus are provided for an integrated circuit with a programmable electrical connection. The apparatus includes an inactive area with a memory line passing over the inactive area. The memory line includes a programmable layer. An interlayer dielectric is positioned over the memory line and the inactive area, and an extending member extends through the interlayer dielectric. The extending member is electrically connected to the programmable layer of the memory line at a point above the inactive area.

Abstract: A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit for a 3D IC to repair defects, trim devices, or adjust parameters is presented here. At least one die in a 3D IC can be built with at least one low-pin-count OTP memory. The low-pin-count OTP memory can be built with a serial interface such as I2C-like or SPI-like of interface. The pins of the low-pin-count OTP in at least one dies can be coupled together to have only one set of low-pin-count bus for external access. With proper device ID, each dies in a 3D IC can be accessed individually for soft programming, programming, erasing, or reading. This technique can improve the manufacture yield, device, circuit, or logic performance or to store configuration parameters for customization after 3D IC are built.

Abstract: Provided is a semiconductor memory device with improved fuse sensing reliability during a slow power-up operation. The semiconductor memory device may include a memory cell array including a normal memory cell array and a spare memory cell array; an anti-fuse circuit supplied with a first voltage and configured to store fail address information associated with a defective memory cell in the normal memory cell array and configured to sense the fail address information in response to a clock signal applied during a power-up period; and a fuse read circuit including a clock generator supplied with a second voltage, the fuse read circuit configured to detect respective levels of the first and second voltages during the power-up period to generate the clock signal and to read the sensed fail address information from the anti-fuse circuit in response to the clock signal.

Abstract: A memory-like structure composed of variable resistor elements for use in tuning respective branches and leaves of a clock distribution structure, which may be used to compensate for chip-by-chip and/or combinatorial logic path-by-path delay variations, which may be due, for example, to physical variations in deep submicron devices and interconnections, is presented. A single system clocked scan flip-flop with the capability to perform delay test measurements is also presented. Methods for measuring combinatorial logic path delays to determine the maximum clock frequency and delays to program the variable resistors, as well as methods for calibrating and measuring the programmed variable resistors, are also presented.

Abstract: A semiconductor memory device is provided which includes a memory cell group and a fuse cell group including at least one fuse cell to store a failed address corresponding to a defective memory cell in the memory cell group; a spare cell group including a spare memory cell configured to replace the defective memory cell included in the memory cell group; a data sensing/selection circuit configured to read data stored in the memory cell group and the spare cell group in response to an activation of the word line; a fuse sense amplifier configured to read the failed address in response to the activation of the word line; and a repair logic circuit configured to control the data sensing/selection circuit in response to the failed address such that the defective memory cell in the memory cell group is replaced by the spare memory cell.

Abstract: A method of programming electrical fuses reliably is disclosed. If a programming current exceeds a critical current, disruptive mechanisms such as rupture, thermal runaway, decomposition, or melt, can be a dominant programming mechanism such that programming is not be very reliable. Advantageously, by controlled programming where programming current is maintained below the critical current, electromigration can be the sole programming mechanism and, as a result, programming can be deterministic and very reliable. In this method, fuses can be programmed in multiple shots with progressive resistance changes to determine a lower bound that all fuses can be programmed satisfactorily and an upper bound that at least one fuse can be determined failed. If programming within the lower and upper bounds, defects due to programming can be almost zero and, therefore, defects are essentially determined by pre-program defects.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuses. At least one portion of the electrical fuse can have at least one extended area to accelerate programming. An extended area is an extension of the fuse element beyond contact or via longer than required by design rules. The extended area also has reduced or substantially no current flowing through. The program selector can be at least one MOS. The OTP device can have the at least one OTP element coupled to at least one diode in a memory cell.

Abstract: In one embodiment described herein, on-die programmable fuses may be used. On-die programmable fuses may be programmed by entities other than the chip manufacturer after the fuse array chip has been manufactured and shipped out. However, other non-volatile memories may also be used.

Abstract: Circuits, systems and techniques for testing a One-Time Programmable (OTP) memory are disclosed. An extra OTP bit can be provided as a test sample to be programmed. The programmed extra OTP bit can be read with any virgin cells in the OTP memory alternatively to generate a stream of logic 0 and logic 1 data so that every row or column path can be tested and the outcome can be observed in a pseudo-checkerboard pattern or other predetermined pattern. By carefully setting control signals, checkerboard-like pattern can be generated without actual programming any OTP cells in the memory array.

Abstract: A semiconductor device includes a fuse array for storing normal fuse data and pattern data through a programming operation, a boot-up control unit suitable for generating an enable signal for enabling an output of the pattern data, and a pattern detection unit suitable for detecting a pattern of the pattern data in response to the enable signal, and generating a detection signal. The fuse array outputs the normal fuse data in response to the detection signal.

Abstract: A circuit includes a fuse cell, a sense circuit and an output control circuit. The fuse cell includes an electrical fuse. The sense circuit is electrically coupled to the fuse cell and configured for generating a sense signal indicative of a programmed condition of the electrical fuse, at an output of the sense circuit. The output control circuit is electrically coupled to the output of the sense circuit, and the output control circuit is configured for latching the sense signal indicative of the electrical fuse having been programmed, during a read operation of the fuse cell.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP element can be polysilicon, silicided polysilicon, silicide, metal, metal alloy, local interconnect, thermally isolated active region, CMOS gate, or combination thereof.

Abstract: A reprogrammable memory, which can be, programmed a limited number of times. A plurality of one-time programmable elements are combined by a logic arrangement such that the output of that logic arrangement may be reprogrammed a limited number of times.

Abstract: A semiconductor device includes a fuse array having a plurality of fuse sets suitable for outputting a plurality of fuse status signals having different levels according to whether fuses of the plurality of fuse sets are cut or not, a code counter suitable for counting selection codes in a preset order in response to an enable signal and an operation clock, and storage blocks suitable for receiving and storing the plurality of fuse status signals in a preset order in response to the selection codes.

Abstract: A memory device includes a memory cell array and a fuse device. The fuse device includes a fuse cell array and a fuse control circuit. The fuse cell array includes a first fuse cell sub-array which stores first data associated with operation of the fuse control circuit, and a second fuse cell sub-array which stores second data associated with operation of the memory device. The fuse control circuit is electrically coupled to the first and second fuse cell sub-arrays, and is configured to read the first and second data from the first and second fuse cell sub-arrays, respectively.

Abstract: A low-pin-count non-volatile (NVM) memory with no more than two control signals that can at least program NVM cells, load data to be programmed into output registers, or read the NVM cells. At least one of the NVM cells has at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector is coupled to a second supply voltage line and having a select signal. At least one of the selected NVM cells can be coupled to at least one output register. No more than two control signals can be used to select the at least one NVM cells in the NVM sequentially for programming the data into the at least one NVM cells or loading data into the at least one output registers controlled by the pulse of the first signal and voltage level and/or timing of the second signal. Programming into the NVM cells, or loading data into output registers, can be determined by the voltage levels of the first to the second supply voltage lines.

Abstract: A configurable memory circuit is provided. The memory circuit includes an inverter coupled to another inverter as back-to-back inverters. A programmable switch is placed on each side of the memory circuit. The programmable switches are used to configure the memory circuit. The memory circuit, depending on the configuration of the programmable switches and the back-to-back inverters, may operate as a ROM that stores a logic high value, a ROM that stores a logic low value, or a RAM.

Abstract: An e-fuse array circuit includes a high voltage pumping unit configured to generate a high voltage by pumping a power source voltage, a negative voltage pumping unit configured to generate a negative voltage by pumping a ground voltage, a program/read line supplied with the high voltage when a program operation is activated, a read voltage, which is lower than the high voltage, when a read operation is activated, or the negative voltage when deactivated, a row line supplied with the ground voltage when the row line is activated or the negative voltage when the row line is deactivated, an e-fuse device supplied with voltage of the program/read line, a switch device controlled by the row line and configured to electrically connect the e-fuse device with a column line, and a column circuit configured to supply the negative voltage to the column line when the column line is activated.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has an OTP element coupled to a diode in a memory cell. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a high voltage to the P terminal of a diode and switching the N terminal of a diode to a low voltage for suitable duration of time, a current flows through an OTP element in series with the program selector may change the resistance state. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI/LOCOS isolations.

Abstract: A semiconductor device and method of operation having reduced read time of fuse array information during boot-up operation. When fuse array information is read, only repaired fuse-set information is read such that a read time of the semiconductor memory device is reduced, resulting in an increased read margin.

Abstract: A low density One-Time Programmable (OTP) memory is disclosed to achieve low gate count and low overhead in the peripheral circuits to save the cost. A maximum-length Linear Feedback Shift Register (LFSR) can be used to generate 2n?1 address spaces from an n-bit address. The registers used in the address generator can have two latches. Each latch has two cross-coupled inverters with two outputs coupled to the drains of two MOS input devices, respectively. The inputs of the latch are coupled to the gates of the MOS input devices, respectively. The sources of the MOS input devices are coupled to the drains of at least one MOS device(s), whose gate(s) are coupled to a clock signal and whose source(s) are coupled to a supply voltage. The two latches can be constructed in serial with the outputs of the first latch coupled to the inputs of the second latch.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive devices, such as PCM, RRAM, CBRAM, or other memory cells. The reversible resistive devices have a reversible resistive element coupled to a diode. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a voltage or a current between a reversible resistive element and the N terminal of a diode, the reversible resistive device can be programmed into different states based on magnitude, duration, voltage-limit, or current-limit in a reversible manner. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI/LOCOS isolations.

Abstract: A nonvolatile memory cell structure includes a doping well disposed in a substrate, an antifuse gate disposed on the doping well, a drain disposed in the substrate, an optional select gate disposed on the doping well and an optional shallow trench isolation disposed inside the doping well.

Abstract: A semiconductor storage device has a great number of logic circuits and fuse blocks with its space-saving design. In the semiconductor storage device, a plurality of fuse blocks is arranged in a line or row in the vicinity of a gate array. Each fuse block includes a plurality of fuse pieces arranged in a juxtaposed manner and exposed to the exterior through a fuse window. A power-supply wire and a ground wire extend along the juxtaposed direction of the fuse pieces. Spacing in the vicinity of the gate array is used for arrangement of the fuse blocks.

Abstract: Junction diodes or MOS devices fabricated in standard FinFET technologies can be used as program selectors or One-Time Programmable (OTP) element in a programmable resistive device, such as interconnect fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCRAM, CBRAM, or RRAM. The MOS or diode can be built on at least one fin structure or at least one active region that has at least one first active region and a second active region. The first and the second active regions can be isolated by a dummy MOS gate or silicide block layer (SBL) to construct a diode.

Abstract: A circuit for programming a fuse is disclosed. The circuit includes a voltage supply terminal (Vf) and a semiconductor controlled rectifier (222, 224). The fuse is coupled between the voltage supply terminal and the semiconductor controlled rectifier. A switching circuit (200, 202, 208, 210) is coupled to the semiconductor controlled rectifier.

Abstract: Provided is a semiconductor device that includes: a storage element including a first terminal, a second terminal, and a third terminal, and in which a resistance state between the second terminal and the third terminal is changed from a high resistance state to a low resistance state based on a stress current that flows between the first terminal and the second terminal; and a fuse connected to the first terminal, and configured to change from a conductive state to a non-conductive state based on the stress current.

Abstract: Disclosed herein are memory cell arrays and methods for operating memory cell arrays. In one embodiment, a memory cell array includes a plurality of bitcells, a first bitline, a second bitline, a first wordline and a second wordline. The bitcells are arranged into rows and columns and each include a first transistor, a second transistor, and a fuse with a first end and a second end. The second transistor is selectively operable to couple the first end of the fuse to a ground. The first bitline is coupled to the first transistor of each of the bitcells of one column. The second bitline is coupled to the second end of the fuse of each of the bitcells of the column. The first transistor of each of the bitcells of the column is selectively operable to couple the first end of the fuse to the first bitline.

Abstract: A semiconductor device includes a memory element including a stack structure stacking an insulator film and a metal film or a metal compound film; and a transistor including a gate structure having an identical stack structure as that of the memory element.

Abstract: In accordance with some embodiments, the way in which the fuses are sensed and, particularly, their order may be made more random so that it is much more difficult to simply exercise the device and determine all the values of the storage elements within the fuse array. One result is a more secure storage device.

Abstract: In accordance with some embodiments, fuse information may be written into a fuse array in a way that provides sufficient redundancy, making it harder for malicious parties to attack the fuse array.

Abstract: Provided is a semiconductor integrated circuit including: an anti-fuse element that electrically connects a first node and a first power supply terminal when data is written and electrically disconnect the first node and the first power supply terminal when data is not written; a first switch circuit that is connected between the first node and a first data line applied with a predetermine first voltage, and enters an off state from an on state according to a first control signal; and a detection part that detects write data of the anti-fuse element according to whether a voltage of the first node is substantially the same as the first voltage or substantially the same as a supply voltage of the first power supply terminal when the first switch circuit enters the off state.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP cell can have a MOS in series with the OTP element as a read selector. The OTP element can be polysilicon, silicided polysilicon, silicide, polymetal, metal-0, metal, metal alloy, local interconnect, thermally isolated active region, CMOS gate, or combination thereof.

Abstract: A fuse-based memory includes a plurality of bit lines. Each bit lines couples to a corresponding plurality of fuses. The fuses couple to ground through corresponding access transistors. The memory is configured to precharge an accessed one of the bit lines and a reference one of the bit lines using a low voltage supply. In contrast, a resulting voltage difference between the accessed bit line and the reference bit line is sensed using a sense amplifier powered by a high voltage supply, wherein a high voltage supplied by the high power supply is greater than a low voltage supplied by the low voltage supply.

Abstract: Some embodiments include an improved memory array architecture and memory cell design. In one of such embodiments, a memory cell may comprise a memory element to store a logic state and two access transistors coupled to the memory element to access the logic state of the memory element. Other embodiments are described.

Abstract: In some aspects, a memory cell is provided that includes a steering element and a memory element. The memory element includes a first conductive material layer, a first dielectric material layer disposed above the first conductive material layer, a second conductive material layer disposed above the first dielectric material layer, a second dielectric material layer disposed above the second conductive material layer, and a third conductive material layer disposed above the second dielectric material layer. One or both of the first conductive material layer and the second conductive material layer comprise a stack of a metal material layer and a highly doped semiconductor material layer. Numerous other aspects are provided.

Abstract: A program method for an e-fuse array circuit includes receiving an address and a multi-bit program data, programming the multi-bit program data in e-fuses designated by the address, reading a multi-bit read data from the e-fuses, and comparing bits of the multi-bit program data with bits of the multi-bit read data, wherein if the bits of the multi-bit program data are identical to the bits of the multi-bit read data, a program operation is terminated; and if the bits of the multi-bit read data are not identical to the bits of the multi-bit program data, then the programming of the multi-bit program data, the reading of the multi-bit read data, and the comparing of the bits are performed again.

Abstract: This document discusses, among other things, a reference voltage generator circuit coupled to a plurality of fuse read circuits. The reference voltage generator circuit can be configured to mirror a reference current to produce a reference voltage and a gate bias voltage. The plurality of fuse read circuits can each be coupled to the reference voltage generator circuit and can also be coupled to a fuse of a plurality of fuses. Each fuse read circuit of the plurality of fuse read circuits can be configured to mirror the reference current using the gate bias voltage to produce a fuse read voltage across each fuse coupled to the plurality of fuse read circuits. Each fuse read circuit of the plurality of fuse read circuits can compare the fuse read voltage of each fuse and the reference voltage and can indicate a state of each fuse coupled to each fuse read circuit using the comparison.

Abstract: An integrated circuit includes a high voltage generator generating a high voltage, a negative voltage generator generating a negative voltage, a divided voltage generator generating a divided voltage by dividing the power source voltage and supplying it to a read voltage terminal, a first power gate supplying the high voltage or the divided voltage to a program voltage terminal, a second power gate supplying the negative voltage or the ground voltage to a deactivation voltage terminal, a third power gate supplying the ground voltage or the divided voltage to an activation voltage terminal, and an e-fuse array circuit operating using voltage of the program voltage terminal as a program voltage, voltage of the divided voltage terminal as a read voltage, voltage of the activation voltage terminal as an activation voltage, and voltage of the deactivation voltage terminal as a deactivation voltage.

Abstract: Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive memory cells that can be programmed based on magnitude, duration, voltage-limit, or current-limit of a supply voltage or current. These cells are PCM, RRAM, CBRAM, or other memory cells that have a reversible resistive element coupled to a diode. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. The memory cells can be used to construct a two-dimensional memory array with the N terminals of the diodes in a row connected as a wordline and the reversible resistive elements in a column connected as a bitline. By applying a voltage or a current to a selected bitline and to a selected wordline to turn on the diode, a selected cell can be programmed into different states reversibly based on magnitude, duration, voltage-limit, or current-limit.

Abstract: A method of programming a memory device including a one-time programmable (OTP) cell array configured to include at least one of a protected area and a programmable area are disclosed. The method includes receiving a fuse-program command to initiate a fuse-programming operation; checking whether the programmable area exists in the OTP cell array, terminating the fuse-programming operation when the OTP cell array does not include the programmable area, performing a fuse-programming operation on the programmable area when the OTP cell array includes the programmable area thereby programming fuses to create a fuse-programmed area; setting the fuse-programmed area of the OTP cell array as the protected area.

Abstract: An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer, second and third semiconductor layers, a dielectric film and a conductive film, a first electrode, a second electrode, and a third electrode, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, the filament being formed by causing a dielectric breakdown of at least a part of the dielectric film, through application of a voltage equal to or higher than a predetermined threshold between the second and third electrodes, thereby causing an electric current to flow between the conductive film and the third semiconductor layer.

Abstract: A non-volatile memory cell using two transistors, a bit select and a sense device and an antifuse device. The antifuse device is implemented with a field-effect transistor operated to behave like an antifuse when the cell is selected and a modest programming voltage under 5.5 volts and a current under 5-?A is applied. Only a soft breakdown is needed in the thin gate oxide because a local sense transistor is used during read operations to detect the programming and amplify it for column sense amplifiers. Reading also only requires low voltages of about one volt.

Abstract: A low-pin-count non-volatile memory (NVM) embedded an integrated circuit can be accessed without any additional pins. The NVM has one or more memory cells and at least one of the NVM cells can have at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector can be coupled to a second supply voltage line and has a selecting signal. The integrated circuit can include at least one test mode detection circuit to activate a test mode upon detecting an abnormal (or out of normal) operation condition(s). Once a test mode is activated, at least one I/O or supply voltage of the integrated circuit can be used as the I/O or supply voltage of the NVM to select at least one NVM cell for read, program into nonvolatile, or volatile state. At least one NVM cell can be read during ramping of at least one supply voltage line.

Abstract: A memory element includes: an electrical fuse provided to be inserted between a first input node and a second input node; and an antifuse provided to be inserted between the second input node and a third input node. The third input node is configured to be a node to which a voltage is allowed to be applied separately from a voltage to be applied to the first input node.

Abstract: A semiconductor device includes: a plurality of repair fuse circuits configured to each program a repair target address; and an enable signal generation circuit configured to generate at least one enable signal in response to a source signal and provide the enable signal to each of the repair fuse circuits in common. Since the semiconductor device may iteratively generate a rupture enable signal through a feedback scheme, the area occupied by a circuit, such as a shift register or a D flip-flop may be saved.

Abstract: An eFuse circuit may include a wordline, a first eFuse, a first logic gate, a first blowFET, and a first bitline discharge device. The first eFuse may have a first end coupled to the wordline and a second end. The first eFuse may have a first resistance when unblown and a second resistance when blown. The first logic gate may be coupled to the first end of the first eFuse. The first logic gate may be capable of driving enough current to blow the first eFuse. The first blowFET may have a source coupled to a first supply voltage, a gate coupled to a program signal, and a drain coupled to the second end of the first eFuse. The first bitline discharge device may have a gate coupled to the second end of the first eFuse, a source coupled to the first supply voltage, and a drain coupled to a first bitline.

Abstract: A semiconductor integrated circuit includes a fuse circuit comprising a fuse configured to generate a fuse state signal corresponding to a rupture state of the fuse in response to an enable signal, a fuse state decision unit configured to determine whether or not the fuse state signal is normal based on a test signal, and generate an output enable signal according to a determination result, and a driving unit configured to output the fuse state signal in response to the output enable signal.