Temperature Distribution Or Profile Patents (Class 374/137)
  • Patent number: 7828478
    Abstract: A thermal detecting device for sensing temperature at multiple locations proximate to the detecting device is provided. The detecting device has a pair of infrared detectors each configured to measure temperature of two locations by receiving infrared energy of the two locations. A housing encloses the pair of infrared detectors. The housing is configured with an aperture to allow the infrared energy of the two locations to be received by the pair of infrared detectors. A reflective mirror or two mirrors focus the infrared energy of the two locations towards the pair of infrared detectors. The detecting device may be configured to determine if there is a temperature differential at a location as the housing moves with respect to the location.
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: November 9, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Siddharth S. Rege, Joseph E. Harter, Jr., Ronald M. Taylor
  • Patent number: 7798705
    Abstract: A thermoacoustic tomographic method for imaging an object, wherein the object is thermally excited by a source and the acoustic waves from the object, which are caused by the thermal excitation, from different directions of the object are detected using at least one detector and an image of the object is reconstructed from the detected acoustic waves and the positional information, wherein the acoustic waves detected by the detector are integrated at least in one direction over a length of at least ?{square root over (8)}·d, where d denotes the maximum distance from a point of the object to be imaged to the detector.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: September 21, 2010
    Assignees: Upper Austrian Research GmbH, Universitaet Innsbruck
    Inventors: Peter Burgholzer, Markus Haltmeier, Otmar Scherzer
  • Publication number: 20100230597
    Abstract: Counterfeit electronic devices are detected by comparing a thermal profile of the counterfeit device and an authentic device under predetermined operating conditions. A thermal profile for an authentic electronic device is recorded executing an instruction set over time, such as with static infrared images at predetermined times, video infrared images over a predetermined time period or temperature measurements made at predetermined locations of the electronic device. In one embodiment, a thermal profile indicates that a processor device has been used in the place of a field programmable grid array device. In an alternative embodiment, an electromagnetic profile is detected instead of or in addition to the thermal profile. The electromagnetic profile of an authentic device is used to create an expected profile for comparison with an electromagnetic profile of electronic devices under test.
    Type: Application
    Filed: March 16, 2009
    Publication date: September 16, 2010
    Inventors: David B. Kumhyr, Yvonne M. Young, Glenn D. Johnson
  • Patent number: 7789556
    Abstract: The present invention provides a dual-probe thermally compensated fluorescence decay rate temperature sensor capable of measuring the true temperature of a sample surface and its associated method of use.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: September 7, 2010
    Assignee: University of South Florida
    Inventor: Nicholas Djeu
  • Patent number: 7785002
    Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 31, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Brian E. Dewes, Pedro E. Castillo-Borelly
  • Patent number: 7775709
    Abstract: A program comprises a code for implementing a method for regulating the temperature of an environment containing a product when the program is run in a computer system. The method includes measuring an environment temperature; detecting a product temperature; comparing the product temperature with a reference temperature; and varying the environment temperature on the basis of the outcome of the comparing. The detecting includes acquiring the product temperature internally of the product near its outside surface.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: August 17, 2010
    Assignee: S.A.G.I. - S.p.A.
    Inventors: Michele Biscotti, Ernesto Sacchi, Cristiano Paoletti
  • Patent number: 7778780
    Abstract: One aspect of the invention relates to a method (10) for characterizing a well (700) using distributed temperature sensor (DTS) data to optimise a well model (12). The method comprises providing a well model of flow and thermal properties (12a, 12b) of the well (700), where the well model (12) has a plurality of adjustable physical parameters, providing a data set made up of a plurality of DTS temperature profiles of the well (700) taken at different times during operation of the well (700), and running the well model (12) with different combinations of the plurality of adjustable physical parameters to match to the plurality of DTS temperature profiles. The DTS temperature profiles may also be pre-processed to make them consistent with one another.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: August 17, 2010
    Assignee: Schlumberger Technology Corporation
    Inventors: Stephen J. Kimminau, Mohammed Rupawalla, Kashif Rashid, David Michael Hargreaves, Cyril Lagrange
  • Publication number: 20100204951
    Abstract: A platform that can measure the thermal profiles of devices with nanoscale resolution has been developed. The system measures the local temperature by using an array of nanoscale thermometers. This process can be observed in real time using a high resolution imagining technique such as electron microscopy. The platform can operate at extremely high temperatures.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 12, 2010
    Inventors: Alexander K. Zettl, Gavi E. Begtrup
  • Patent number: 7771114
    Abstract: The installation contains a current conductor producing Joulean heat in the operating state, a cooling element and a monitoring device. The cooling element has a condensable working medium and an evaporator, which can be heated by the current conductor of the installation, and a condenser which has been withdrawn from the heating effect of the current conductor. The monitoring device comprises at least one sensor for detecting a parameter of the cooling element and an evaluation unit, which receives output signals from the sensor. In the evaluation unit, the output signals of the sensors are evaluated and a signal describing the state and/or the functionality of the cooling element is formed there. This installation is characterized by high operational reliability with a high current-carrying capacity and dimensions which are kept small.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: August 10, 2010
    Assignee: ABB Research Ltd
    Inventors: Jochen Kiefer, Martin Lakner, Jean-Claude Mauroux, Daniel Chartouni
  • Publication number: 20100189157
    Abstract: An apparatus and method for increasing the resolution of a linear array of fiber Bragg gratings by applying a plastic coating having a high CTE over the optical fiber. Apparatus and method for determining the temperature of each of a succession of points along a tissue portion during hyperthermia treatment includes an optical fiber with a succession of closely spaced fiber Bragg gratings. Each grating is responsive to a different wavelength and is sensitive to ambient temperature to change that wavelength as a function of temperature. A tunable laser operative continuously over a range of wavelengths including those to which the gratings respond is used to interrogate the gratings. Sensitivity-enhancing coatings are used on the fibers and the lasers are tuned over very short time cycles.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 29, 2010
    Inventors: Indu Saxena, Harold Mukamal
  • Patent number: 7762743
    Abstract: Methods and apparatus for monitoring a remotely operated vehicle umbilical condition in real time allowing for improving of power delivery as well as early detection of threats to integrity of the umbilical. The umbilical may include an optical fiber. Processing equipment may enable distributed temperature sensing along the optical fiber.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: July 27, 2010
    Assignee: Weatherford/Lamb, Inc.
    Inventor: Peter Mark Smith
  • Patent number: 7748895
    Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Arun Sharma
  • Patent number: 7744273
    Abstract: A thermal analysis apparatus possesses a temperature sensor measuring a temperature of a heating furnace inside, a temperature program setter which can set a temperature program and outputs a temperature program signal, a temperature control section adjusting a supply electric power to a heater in compliance with a difference between the temperature program signal and a detection signal of the temperature sensor, a processor section calculating an air flow rate corresponding to a program temperature, and a mass flow controller which adjusts an air flow rate supplied to the heating furnace inside in compliance with a signal of the air flow rate calculated by the processor section. In the processor section, operation expressions calculating the air flow rate are set so as to differ respectively in a higher temperature side and a lower temperature side than a predetermined boundary temperature.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: June 29, 2010
    Assignee: SII Nanotechnology Inc.
    Inventors: Kanji Nagasawa, Rintaro Nakatani
  • Patent number: 7744275
    Abstract: An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: June 29, 2010
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hidetaka Kawauchi, Masaki Ogura, Juhyun Yu, Akihiro Hiruta
  • Patent number: 7736053
    Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: June 15, 2010
    Assignee: International Business Machines Corporation
    Inventors: William F. Clark, Jr., Edward J. Nowak
  • Patent number: 7731421
    Abstract: A technique that is usable with a well includes changing the temperature of a local environment of a distributed temperature sensor, which is deployed in a region of the well and using the sensor to acquire measurements of a temperature versus depth profile. The region contains at least two different well fluid layers, and the technique includes determining the depth of a boundary of at least one of the well fluid layers based at least in part on a response of the temperature versus depth profile to the changing of the temperature.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: June 8, 2010
    Assignee: Schlumberger Technology Corporation
    Inventors: Maxwell Richard Hadley, Dylan H. Davies
  • Publication number: 20100131225
    Abstract: A thermographic analysis method and apparatus is provided. The method includes obtaining base-line and operational thermographic profiles of a subject area, calculating a difference profile from the base-line and operational thermographic profiles, and providing an indication from the difference profile. The indication may be also based on thermographic differences in portions of the subject area that are defined as thermographic zones.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 27, 2010
    Applicant: Fluke Corporation
    Inventor: Paul S. Carlson
  • Patent number: 7717618
    Abstract: An apparatus and method for increasing the resolution of a linear array of fiber Bragg gratings by applying a plastic coating having a high CTE over the optical fiber. Apparatus and method for determining the temperature of each of a succession of points along a tissue portion during hyperthermia treatment includes an optical fiber with a succession of closely spaced fiber Bragg gratings. Each grating is responsive to a different wavelength and is sensitive to ambient temperature to change that wavelength as a function of temperature. A tunable laser operative continuously over a range of wavelengths including those to which the gratings respond is used to interrogate the gratings. Sensitivity-enhancing coatings are used on the fibers and the lasers are tuned over very short time cycles.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: May 18, 2010
    Assignee: Optech Ventures, LLC
    Inventors: Indu Saxena, Harold Mukamal
  • Publication number: 20100103978
    Abstract: A new step-index multimode pure silica core fiber for DTS (Distributed Temperature Sensing) system particularly useful for downhole environments is disclosed and described. The new sensor system provides optimum tradeoffs between coupling power, spatial resolution, and temperature resolution.
    Type: Application
    Filed: July 18, 2008
    Publication date: April 29, 2010
    Inventors: Chung Lee, Kwang Suh, Mahesh Ajgaonkar, Kent Kalar
  • Patent number: 7701222
    Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: April 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Moises Cases, Bradley Donald Herrman, Kent Barclay Howieson, Erdem Matoglu, Bhyrav Murthy Mutnury, Pravin Patel, Nam Huu Pham, Caleb James Wesley
  • Patent number: 7698114
    Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Hendrik F. Hamann, James A. Lacey, Jamil Wakil, Alan J. Weger
  • Patent number: 7695188
    Abstract: An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Arun Sharma
  • Patent number: 7690838
    Abstract: A thermal property measurement apparatus capable of directly measuring thermal conductivity distribution in a ROI within a target only by measuring the temperature distribution that already exists in the ROI without generating other temperature fields artificially. The thermal property measurement apparatus includes a temperature detector for measuring temperatures at plural positions in the ROI, a distance controller for controlling a distance between the temperature detector and the target, a scanner for changing a relative position therebetween, a stage for putting the object thereon, a recorder for recording measured temperature data, position data and time data, a determination unit for determining whether at least one of thermal conductive phenomena and convection phenomena is dealt with or not, a processor for calculating thermal conductivity distribution in the ROI from the recorded data and temporal changeable references of the thermal conductivity in the ROI, and a controller.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: April 6, 2010
    Inventor: Chikayoshi Sumi
  • Patent number: 7686505
    Abstract: The invention concerns a method for the indirect determination of local irradiance in an optical system; wherein the optical system comprises optical elements between which an illuminated beam path is formed and a measurement object which absorbs the radiation in the beam path at least partially is positioned in a partial region of the beam path selected for the locally-resolved determination of the irradiance and the temperature distribution of at least one part of the measurement object is determined by means of a temperature detector.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: March 30, 2010
    Assignee: Carl Zeiss SMT AG
    Inventors: Frank Meltzer, Axel Scholz
  • Patent number: 7686504
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: March 30, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Xiao-Long Li, Chao-Nien Tung
  • Patent number: 7674037
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: March 9, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Hui Lin
  • Publication number: 20100054298
    Abstract: The present invention relates to an optical fiber temperature sensor capable of reducing an error in a temperature measurement. The sensor comprises an optical fiber, an optical frequency difference adjusting section, a light source system, a spectrum measuring section, a temperature calculating section, and a correcting section. The light source system outputs, into different ends of the optical fiber, probe light and pumping light of which each center frequency is set corresponding to an instruction from the optical frequency difference indicating section respectively. The temperature calculating section calculates a temperature of an object based on BGS in a first domain measured by the spectrum measuring section. On the other hand, the correcting section outputs a correction instruction to the light source system so that BGS center frequency of a second domain may be in agreement with a reference value thereof.
    Type: Application
    Filed: August 21, 2007
    Publication date: March 4, 2010
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Eisuke Sasaoka, Yoshinori Yamamoto
  • Publication number: 20100044586
    Abstract: The present invention relates to a method and an apparatus for a fast thermo-optical characterisation of particles. In particular, the present invention relates to a method and a device to measure the stability of (bio)molecules, the interaction of molecules, in particular biomolecules, with, e.g. further (bio)molecules, particularly modified (bio)molecules, particles, beads, and/or the determination of the length/size (e.g. hydrodynamic radius) of individual (bio)molecules, particles, beads and/or the determination of length/size (e.g. hydrodynamic radius).
    Type: Application
    Filed: November 20, 2007
    Publication date: February 25, 2010
    Applicant: Ludwig Maximilians Universitat Munchen
    Inventors: Stefan Duhr, Philipp Baaske
  • Publication number: 20100046574
    Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
    Type: Application
    Filed: November 3, 2009
    Publication date: February 25, 2010
    Applicant: International Business Machines Corporation
    Inventors: Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Roger R. Schmidt
  • Patent number: 7668686
    Abstract: A method of controlling an initial external temperature display in a vehicle may include comparing an ignition-off time with a first threshold and displaying a current reading from an outside ambient temperature sensor when the ignition-off time equals or exceeds the first threshold. The method further includes comparing at least one secondary condition with at least one secondary parameter when the ignition-off time falls below the first threshold and selecting and displaying a reading based on the comparison of the at least one secondary condition with the at least one secondary parameter. This comparison can include comparing a previous ignition-on time with a second threshold and comparing a sum of the ignition-off time and a stored amount with a third threshold when the previous ignition-on time equals or falls below the second threshold. Alternatively, this comparison can include comparing an engine water temperature with a temperature threshold.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: February 23, 2010
    Assignee: DENSO International America, Inc.
    Inventors: Joshua Conte, Akira Oga, Robert Wunsche
  • Publication number: 20100040108
    Abstract: The present invention relates to a measuring method and a sensor unit of measuring temperature distribution of an object by using an optical fiber sensing technology of BOCDA system. In the measuring method, an optical fiber that functions as a BOCDA-type optical fiber sensor is disposed two-dimensionally or three-dimensionally with respect to a predetermined measurement region of the object, and thereby the temperature distribution of the object can be measured at a high speed and a high accuracy, in the predetermined measurement region configuring a surface or space where the optical fiber is disposed.
    Type: Application
    Filed: December 19, 2007
    Publication date: February 18, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Eisuke Sasaoka, Osamu Ichikawa
  • Publication number: 20100027581
    Abstract: The present invention relates to a measuring method and a controlling method of measuring the physical quantity such as a fluid temperature distribution and the like by using an optical fiber sensing technique of BOCDA system. In the measuring method, an optical fiber that functions as a BOCDA-type optical fiber sensor is disposed along a flow direction of a fluid that flows though a pipe line and in the pipe line. Since the optical fiber directly contacts with the fluid that flows though the pipe line, it is possible to rapidly measure the fluid temperature distribution. Also, based on this measurement result, the controlling method adjusts each temperature of one or more heating/cooling means provided along the longitudinal direction of a pipe line, thereby controlling at high accuracy the fluid temperature distribution in the pipe line.
    Type: Application
    Filed: December 19, 2007
    Publication date: February 4, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Eisuke Sasaoka
  • Patent number: 7653502
    Abstract: A data logger analyzes temperature data associated with a product passing through a conveyor oven and provides a visual indication indicating whether the product's temperature profile is within acceptable limits. Thus, an operator need not download captured temperature data to a computer in order to determine whether the oven settings produce a product profile that is within acceptable limits. In one embodiment, the data logger stores criteria for an acceptable product profile, and collects the temperature data and analyzes whether the temperature profile data is within the acceptable limits of the criteria. In another embodiment, a button and a pass/fail indicator are located externally on data logger. An operator depresses the button in order to request whether the product profile passed or failed the criteria. In response to depressing the button, the pass/fail indicator provides visual indication of whether the current oven settings produce an acceptable product profile.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: January 26, 2010
    Assignee: Electronic Controls Design, Inc.
    Inventor: Rex L. Breunsbach
  • Patent number: 7651264
    Abstract: The object is to provide a laser processing apparatus, a laser processing temperature measuring apparatus, a laser processing method, and a laser processing temperature measuring method which can highly accurately detect the processing temperature when carrying out processing such as welding with laser light. A laser processing apparatus 1A for processing members. DR, UR to be processed by irradiating the members with laser light LB comprises a laser (semiconductor laser unit 20A) for generating the laser light LB; optical means for converging the laser light LB generated by the laser onto processing areas DA, UA; and a filter 30, disposed between the members DR, UR to be processed and the optical means, for blocking a wavelength of fluorescence generated by the optical means upon pumping with the laser light LB; wherein light having the wavelength blocked by the filter 30 is used for measuring a temperature of the processing areas DA, UA.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: January 26, 2010
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Satoshi Matsumoto, Tsuyoshi Kosugi
  • Patent number: 7651260
    Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: January 26, 2010
    Assignee: International Business Machines Corporation
    Inventors: Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Roger R. Schmidt
  • Publication number: 20100017159
    Abstract: A system and method for implementing embedded electronics in environments where radiation or extreme temperatures are used is disclosed. Embedded electronics are affixed to various components of a pharmaceutical system, thereby enabling the customer to download pertinent information about the component, such as lot number, date of manufacturer, test parameters, etc. Additionally, these electronics allow an array of functions and features to be implemented, such as integrity tests and diagnostics. The electronics in the pharmaceutical components utilize a technology that is not as susceptible to radiation and extreme temperatures as traditional electronics.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 21, 2010
    Inventor: Aaron Burke
  • Patent number: 7648267
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: January 19, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
  • Publication number: 20100008394
    Abstract: The present invention relates to a method of measuring a temperature and/or temperature distribution at a resolution <1 &mgr; m in an object and to a device for performing such method, more particularly to a microscope for performing such method. The method comprises applying a molecular thermometer embedded in a matrix layer on an object, photoexciting the said molecular thermometer with a light source of said microscope and measuring emission of radiation from said molecular thermometer with two photodetectors of said microscope. A first intensity at a first wavelength is measured by said first detector, a second intensity at a second wavelength is measured by said second.detector, and a ratio of said intensities is calculated and used to determine a temperature with a calibrated curve. Said microscope is a confocal microscope or a stimulated emission depletion (STED) microscope.
    Type: Application
    Filed: December 12, 2007
    Publication date: January 14, 2010
    Applicant: SONY DEUTSCHLAND GMBH
    Inventors: Tzenka Miteva, Gabriele Nelles, Akio Yasuda
  • Patent number: 7645070
    Abstract: An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: January 12, 2010
    Assignee: Applied Biosystems, LLC
    Inventors: John G. Atwood, Adrian Fawcett, Keith S. Ferrara, Paul M. Hetherington, Richard W. Noreiks, Douglas E. Olsen, John R. Widomski, Charles M. Wittmer
  • Publication number: 20100004891
    Abstract: Embodiments provide systems and methods for analyzing effects of cargo fire on primary aircraft structure. A thermal profile of a suppressed fire in a cargo compartment of an aircraft is developed. The thermal profile is applied to a heat transfer model of structure of an aircraft, and structural integrity of the modeled structure is analyzed. The thermal profile may be developed by introducing a fire in a physical model of a cargo compartment instrumented with temperature sensors and determining profiles of temperature versus time. A heat transfer model of aircraft structure is built, boundary conditions are input into the heat transfer model, and the model is run. When analysis of the modeled structure determined structural integrity to be insufficient to satisfy flight certification requirements, structural parameters are modified, the thermal profile is applied to a heat transfer model of the modified structure, and the analysis is repeated.
    Type: Application
    Filed: March 7, 2006
    Publication date: January 7, 2010
    Inventors: Mark F. Ahlers, Mel Eshghi, Daniel F. Lewinski, Richard J. Mazzone
  • Patent number: 7637655
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Publication number: 20090310642
    Abstract: A multiple sensor fiber optic sensing system. A method of sensing distributed temperature and at least another property in a well includes the steps of: interconnecting an optical switch to an optical fiber which extends along a wellbore in the well; operating the optical switch to optically connect the optical fiber to an interferometric measurement system; and operating the optical switch to optically connect the optical fiber to a distributed temperature measurement system. Another method includes the steps of: installing an optical fiber along a wellbore in the well, the optical fiber being a first distributed temperature sensor, the installing step including providing a substantial length of the optical fiber proximate a second sensor which senses the well property; and calibrating the second sensor using a temperature sensed by the first sensor in the substantial length of the optical fiber.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 17, 2009
    Applicant: Halliburton Energy Services, Inc.
    Inventor: Neal G. SKINNER
  • Patent number: 7632009
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: December 15, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Patent number: 7632010
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: December 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Xiao-Long Li, Chao-Nien Tung
  • Patent number: 7633066
    Abstract: A thermal measurement system includes a number of detectors configured to receive radiation within respective wavelength ranges. The system also includes a mirror configured to selectively direct the radiation from an object to each of the detectors. The system further includes an actuator mechanically coupled to the mirror and configured to rotate the mirror through a number of angles. The system also includes an optical and probe subsystem disposed between the object and the mirror to focus the radiation on to the mirror.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: December 15, 2009
    Assignee: General Electric Company
    Inventors: William Joseph Antel, Jr., Nirm Velumylum Nirmalan, Jason Randolph Allen, Jeffrey Lawrence Williams
  • Patent number: 7628531
    Abstract: Systems and methods for calibrating a temperature sensing system are disclosed. In one respect, a dual light source configuration may be provided. A first light source may illuminate a sensing fiber and an anti-Stokes band may be detected. A second light source may illuminate a sensing fiber and a Stokes band may be detected, where the Stokes band is substantially similar to the anti-Stokes band of the first light source. A ratio between the anti-Stokes and Stokes band may be used to calibrate a temperature sensing system.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: December 8, 2009
    Assignee: SensorTran, Inc
    Inventors: Chung E. Lee, Kent Kalar, Michael E. Sanders
  • Patent number: 7611276
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Patent number: 7607825
    Abstract: Method and apparatus for monitoring formation of deposits of solid particles from flue gas onto furnace walls formed of welded-together tubes through which cooling medium flows. For the entire surface of the walls, the exact surface temperature is detected with infrared cameras, offset by 90° relative to one another, via a thermal image obtained of a surface development of the furnace. This exact surface temperature is compared with the temperature of the cooling medium from measurement locations. Individual images from the cameras are composed to form an overall development of the inner surface of the furnace walls. The coordinates of the deposits on the walls are determined from the overall development, and the thickness of the deposits is determined from the temperature comparison.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: October 27, 2009
    Assignee: CMV Systems GmbH & Co. KG
    Inventors: Ralf Koschack, Günter Hoven, Bernhard Sobotta
  • Patent number: 7607824
    Abstract: A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: October 27, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Brian Lee Chandler, Frederick F. Kuhlman
  • Patent number: 7594749
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: September 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee