Temperature Distribution Or Profile Patents (Class 374/137)
  • Patent number: 7240730
    Abstract: A system to determine the mixture of fluids in the deviated section of a wellbore comprising at least one distributed temperature sensor adapted to measure the temperature profile along at least two levels of a vertical axis of the deviated section. Each distributed temperature sensor can be a fiber optic line functionally connected to a light source that may utilize optical time domain reflectometry to measure the temperature profile along the length of the fiber line. The temperature profiles at different positions along the vertical axis of the deviated wellbore enables the determination of the cross-sectional distribution of fluids flowing along the deviated section. Together with the fluid velocity of each of the fluids flowing along the deviated section, the cross-sectional fluid distribution enables the calculation of the flow rates of each of the fluids. The system may also be used in conjunction with a pipeline, such as a subsea pipeline, to determine the flow rates of fluids flowing therethrough.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: July 10, 2007
    Assignee: Schlumberger Technology Corp.
    Inventors: Glynn R Williams, Kevin J Forbes, Arthur H Hartog, Christian Koeniger, George A Brown
  • Patent number: 7237950
    Abstract: An optical fiber temperature sensor employs a holey fiber. The holey fiber has an optical fiber concentrated part that a predetermined length of the holey fiber is concentrated in a spot region that is included in a space to be measured in temperature distribution. The optical fiber concentrated part has a bend formed by looping or winding the holey fiber.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: July 3, 2007
    Assignee: Hitachi Cable, Ltd.
    Inventors: Tamaou Shioji, Shigeo Uchiyama
  • Patent number: 7159476
    Abstract: The invention relates to a device for determining the non precise placement of measuring sites on measuring sensors and for reducing measuring errors, which result from the movement between the measuring sites and the measuring sensors when measuring the most diverse quantities to be measured, with the aim of creating robust measuring systems for recording measured values under real or challenging conditions. The invention is characterized by: detecting whether and which sensor elements are covered and thus in contact with the site to be measured; tracking and/or adapting the sensor elements so that the contact is not interrupted even during movements, and; the resilient arrangement of the contacts for constantly maintaining the mechanical bearing pressure when measuring the electrical skin resistance.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: January 9, 2007
    Inventor: Christian Stockinger
  • Patent number: 7121718
    Abstract: In a method for detecting defects in sheet metal segments of electric generators and motors, wherein between the sheet metal pieces of the sheet metal segment an electric insulating layer is arranged, respectively, and wherein between the sheet metal segments a cooling channel is provided, respectively, magnetic induction is generated within the sheet metal segments by applying externally a magnetic field and the temperature of the heat generated within the sheet metal segment is measured in the cooling channel.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: October 17, 2006
    Assignee: Sensoplan Aktiengesellschaft
    Inventor: Gunter Ebi
  • Patent number: 7073937
    Abstract: A heat emitting probe including a conductive nanotube probe needle with its base end fastened to a holder and its tip end protruded, a heat emitting body formed on the probe needle, a conductive nanotube lead wire fastened to the heat emitting body, and an electric current supply that causes an electric current to pass through the conductive nanotube lead wire and both ends of the probe needle. The tip end of the probe needle is thus heated by an electric current flowing through the heat emitting body. A heat emitting probe apparatus includes the above-described heat emitting probe, a scanning mechanism that allows the heat emitting probe to scan over a thermal recording medium, and a control circuit that causes the tip end of the probe needle to emit heat, thus recording extremely small hole patterns in the surface of a thermal recording medium.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: July 11, 2006
    Assignees: Yoshikaza Nakayama, Daiken Chemical Co., Ltd.
    Inventors: Yoshikazu Nakayama, Akio Harada
  • Patent number: 7040804
    Abstract: Two conductive solid materials with their respective different compositions are joined in parallel with a gravity direction thereof, and then, heated and melted under static magnetic field orthogonal to the gravity direction to form two conductive melts with their respective different compositions. Then, the conductive melts are maintained for a predetermined period of time under the static magnetic field, and cooled and solidified.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 9, 2006
    Assignee: The Institute of Space and Astronautical Science
    Inventors: Yuko Inatomi, Kazuhiko Kuribayashi
  • Patent number: 7036980
    Abstract: A pattern forming apparatus includes a drawing chamber having a drawing substrate on which an original pattern is drawn, a first temperature control unit having a first temperature regulator to make the temperature of the drawing chamber constant, and a constant-temperature member arranged near the drawing substrate. The pattern forming apparatus further includes a second temperature control unit having a second temperature regulator. The second temperature control unit is configured to control the set temperature of the constant-temperature member independently such that the temperature of the drawing substrate becomes substantially constant when the original pattern is drawn.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: May 2, 2006
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Machine Co., Ltd.
    Inventors: Ryoichi Hirano, Satoshi Imura, Noriaki Nakayamada
  • Patent number: 7029172
    Abstract: Apparatus for determining the temperature profile of the surface being sprayed or otherwise treated, the apparatus comprising four electric arc spray guns (1) spraying molten steel. The guns (1) are connected to a six-axis industrial robot (2) which is adapted to move them over the surface of the ceramic substrate (3). The metal deposited by the spray builds up a metal shell referred to as the sprayform. The temperature profile of the sprayform surface (3) is recorded periodically by a thermal imaging camera (4) positioned directly above the surface (3). The apparatus includes a pruning filter for receiving each pixel of an image captured by the camera (4) and for applying at least a lower temperature limit to it so as to reject or disregard any pixels determined to have a temperature less than the lower temperature limit.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: April 18, 2006
    Assignee: Isis Innovation Limited
    Inventors: Paul Jones, Stephen Richard Duncan, Ronald Daniel
  • Patent number: 7018095
    Abstract: A circuit for sensing on-die temperature at multiple locations using a minimum number of pins is described. Thermal diodes coupled to pins are placed on a die to measure the temperature at various die locations. Voltage is applied to the pins to determine the temperature at each given diode location. The polarity of the voltage applied across the pins determines what diodes are selected for measurement.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 28, 2006
    Assignee: Intel Corporation
    Inventors: Dean J. Grannes, Harjinder Singh, Jason A. Gayman
  • Patent number: 7004625
    Abstract: An approach for digitally measuring temperature in support of a monitoring application is disclosed. Multiple probes, according to one embodiment, are deployed for sensing environmental parameters (e.g., temperature, liquid level, flow). Each probe has a thermally conductive cylindrical housing containing one or more digital temperature sensors. In addition, one of the probes includes analog inputs (e.g., Brix probe, level sensor, and flow sensor). The probes share a common fixed size bus and communicates data from the sensors to a controller. Based upon the collected data, the controller can initiate, for example, a pump-over in a winemaking process. The controller can interface with a data network to a monitoring system configured to store and analysis the collected data. The monitoring system supports access of the stored data over a public data network, such as the global Internet.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: February 28, 2006
    Assignee: Acrolon Technologies, Inc.
    Inventor: Paul B. Egidio
  • Patent number: 6997603
    Abstract: An integrated fiber-optic tow cable is described having both optical fibers and armor wires located outside the cable core to avoid high strain on the optical fibers when the cables is under stress during deployment. The optical fibers have integral temperature sensors near the outermost portion in order to measure accurately the temperature of the fluid coming in contact with temperature sensors. A beam of light is shown on the optical fibers which is reflected by the optical fibers and reaches the receiver and processed by the processor which may also include a display unit.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: February 14, 2006
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Anthony A. Ruffa, Thomas R. Stottlemyer, Peter E. Seaman
  • Patent number: 6991366
    Abstract: A method of measuring the heat conductivity of an object to be measured, comprising generating heat between the object to be measured and a heat resistant material, causing heat to flow through the interior of the object to be measured and the interior of the heat resistant material and obtaining the heat conductivity of the object to be measured from a temperature difference between at least two points of the heat resistant material, a heat conductivity measuring instrument using the same and a method of producing a heat insulating material.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: January 31, 2006
    Assignees: Nisshinbo Industries, Inc., EKO Instruments Trading Co., Ltd.
    Inventors: Reishi Naka, Masato Hayashi, Tomohiro Koyama, Toshikazu Hasegawa, Takeshi Aoshima
  • Patent number: 6960019
    Abstract: A method of monitoring a temperature condition includes inputting a light pulse into a fiber optic cable and receiving a reflection signal that arises from said input light pulse in said fiber optic cable. A temperature condition along the fiber optic cable and a location of the temperature condition along the fiber optic cable is determined based on said reflection signal.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: November 1, 2005
    Assignee: Airbus Deutschland GmbH
    Inventor: Hans-Joachim Dammann
  • Patent number: 6945692
    Abstract: A system for monitoring a temperature condition includes a fiber optic cable, a light emitting device coupled to the fiber optic cable and configured to input a light pulse into the fiber optic cable, and an optical receiver coupled to the fiber optic cable and configured to receive a reflection signal that arises from the input light pulse in the fiber optic cable. A processor of the system is configured to determine a temperature condition along the fiber optic cable and a location of the temperature condition along the fiber optic cable based on the reflection signal.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: September 20, 2005
    Assignee: Airbus Deutschland GmbH
    Inventor: Hans-Joachim Dammann
  • Patent number: 6840667
    Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: January 11, 2005
    Assignee: Photon Dynamics, Inc.
    Inventors: Jerry Schlagheck, Marc Pastor, Marc Levesque, Alain Cournoyer
  • Patent number: 6817759
    Abstract: A method that utilizes a short sampling interval and a long-pulsewidth laser source to obtain the long sensing range and employs a signal processing technique of decomposing Brillouin spectrum to achieve high spatial resolution, high temperature resolution of the distributed temperature measurement is disclosed. The present method includes the steps of measuring the Brillouin spectra of an optical pulse applying to a sensing fiber and a overlapped area thereof, determining the length that the pulse enters according to the measured Brillouin spectra and a weighting factor and then determining a real Brillouin spectrum profile and a temperature distribution according to Brillouin frequency shifts thereof. For a 9500-m sensing range of standard single-mode fiber and a 100-ns pulsewidth laser source, spatial and positon resolutions of 20 cm and a temperature resolution of 1° C. are simultaneously achieved by using this signal processing method.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: November 16, 2004
    Assignee: National Chiao Tung University
    Inventors: Sien Chi, Chien-Chung Lee, Po-Wen Chiang
  • Publication number: 20040218661
    Abstract: Apparatus for determining the temperature profile of the surface being sprayed or otherwise treated, the apparatus comprising four electric arc spray guns (1) spraying molten steel. The guns (1) are connected to a six-axis industrial robot (2) which is adapted to move them over the surface of the ceramic substrate.(3). The metal deposited by the spray builds up a metal shell referred to as the sprayform. The temperature profile of the sprayform surface (3) is recorded periodically by a thermal imaging camera (4) positioned directly above the surface (3). When the field of view of the camera (4) is not obscured by the robot (2), the arc spray guns (1) or their cables (5), the thermal image of the whole sprayform surface (3) can be recorded.
    Type: Application
    Filed: February 20, 2004
    Publication date: November 4, 2004
    Inventors: Paul Jones, Stephen Richard Duncan, Ronald Daniel
  • Publication number: 20040208224
    Abstract: An integrated fiber-optic tow cable is described having both optical fibers and armor wires located outside the cable core to avoid high strain on the optical fibers when the cables is under stress during deployment. The optical fibers have integral temperature sensors near the outermost portion in order to measure accurately the temperature of the fluid coming in contact with temperature sensors. A beam of light is shown on the optical fibers which is reflected by the optical fibers and reaches the receiver and processed by the processor which may also include a display unit.
    Type: Application
    Filed: March 20, 2001
    Publication date: October 21, 2004
    Inventors: Anthony A. Ruffa, Thomas R. Stottlemyer, Peter E. Seaman
  • Patent number: 6799888
    Abstract: A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: October 5, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shibata, Yuko Nambu
  • Publication number: 20040190586
    Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus coupled to inspect exterior residential components, interior residential components, a pitched roof and basement of a residential building and the electrical system of a residential building.
    Type: Application
    Filed: March 11, 2004
    Publication date: September 30, 2004
    Inventors: Peng Lee, Kevin J. Seddon
  • Patent number: 6787377
    Abstract: The invention is a method of determining a set temperature profile for a method of controlling respective substrate temperatures of a plurality of groups in accordance with respective corresponding set temperature profiles, in a method of heat processing a plurality of substrates that are classified into the plurality of groups.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: September 7, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Wenling Wang, Koichi Sakamoto, Fujio Suzuki, Moyuru Yasuhara
  • Patent number: 6786639
    Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: September 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Kevin Covi, Raymond Longhi, Edward J. Seminaro, Steven G. Shevach
  • Patent number: 6783273
    Abstract: A method for detecting and locating foreign inclusions in a drilled cylindrical shaft includes the steps of positioning at least one logging tube within the drilled shaft in parallel relation to a longitudinal axis of the drilled shaft, providing a temperature sensing means, identifying a plurality of temperature locations along the extent of the logging tube, pouring concrete into the drilled shaft, covering the at least one logging tube and monitoring in real time the temperature at various depths and radial directions within the logging tube during the hydration phase of the concrete curing. Temperature readings that differ from expected readings are deemed positioned in the vicinity of an anomalous inclusion. The range over which these anomalous readings are detected, the magnitude of the variance, and the orientation are used to predict the size and location of anomalies prior to the full curing of the concrete.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: August 31, 2004
    Assignee: University of South Florida
    Inventors: Austin Gray Mullins, Stanley C. Kranc
  • Patent number: 6769805
    Abstract: A heater cable is deployed in a well bore to elevate the temperature of the wellbore above the temperature of the surrounding fluid and the formation. One or more fiber optic strings are included in or carried by the heater cable which is placed along a desired length of the wellbore. At least one fiber optic string measures temperature of the heater cable at a plurality of spaced apart locations. Another string is utilized to determine the temperature of the wellbore. The heater cable is heated above the temperature of the well bore. The fluid flowing from the formation to the wellbore lowers the temperature of the cable at the inflow locations. The fiber optic string provides measurements of the temperature along the heater cable. The fluid flow is determined from the temperature profile of the heater cable provided by the fiber optic sensors.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: August 3, 2004
    Assignee: Sensor Highway Limited
    Inventors: Glynn R Williams, David H Neuroth, Larry V Dalrymple
  • Patent number: 6758595
    Abstract: In the imaging pyrometer, at least three types of pixels (L, S, V) for sensing electromagnetic radiation in at least three different spectral ranges are arranged in a mosaic pattern. In a neighborhood, there are two types of pixels with relatively narrow spectral sensitivity ranges in the infrared (IR), a first one (L) for sensing longer IR wavelengths and the other one (S) for shorter IR wavelengths. Additionally, there is a third pixel type (V) present for receiving electromagnetic radiation in a broader band such as the visible part of the electromagnetic spectrum. This is preferably realized by placing a mosaic filter pattern directly on pixels of an appropriate optoelectronic image sensor, for example by evaporation and photolithographic definition.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: July 6, 2004
    Assignee: Csem Centre Suisse d' Electronique et de Microtechnique SA
    Inventor: Peter Seitz
  • Publication number: 20040086024
    Abstract: Oxidation of turbine buckets may cause unexpected and expensive turbine failures. Turbine bucket oxidation condition may be estimated to predict remaining useful bucket life during operation of a turbine by processing time-varying temperature distributions measured with a pyrometer of at least one rotating turbine bucket.
    Type: Application
    Filed: November 6, 2002
    Publication date: May 6, 2004
    Inventor: Sukhwan Choi
  • Patent number: 6726357
    Abstract: The present invention involves identifying media type in a media processing device. A system according to one embodiment of the invention includes a thermal energy source and a thermal energy sensor. The thermal energy source and thermal energy sensor are arranged along a media feed path so as to accommodate transfer of thermal energy to the media by the thermal energy source, diffusion of such thermal energy, and subsequent sensing of such diffused thermal energy to determine a heat capacity of the media, such heat capacity being indicative of media type.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: April 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Phillip R. Luque, Jeffrey S. Weaver
  • Publication number: 20040008753
    Abstract: Method and apparatus for measuring a distribution of emissivity on a surface of an object body, on the basis of a light emitted from the surface of the object body, wherein a temperature of the object body at each picture element of its image is calculated on the basis of a radiant intensity ratio at each pair of corresponding picture elements of a first image and a second image which are obtained with respective two radiations of respective first and second wavelengths selected from the light emitted from the surface of the object body, to measure a distribution of the temperature on the surface of the object body, and an emissivity value at each picture element of the image of the object body is calculated on the basis of the measured distribution of the temperature, and according to a predetermined relationship between the temperature and the emissivity value.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 15, 2004
    Applicants: NORITAKE CO., LIMITED, Kuniyuki Kitagawa
    Inventors: Miyuki Hashimoto, Kenji Yano, Misao Iwata, Kuniyuki Kitagawa
  • Patent number: 6666577
    Abstract: A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: December 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shibata, Yuko Nambu
  • Patent number: 6652138
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: November 25, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Craig T. Clyne
  • Patent number: 6648506
    Abstract: The present invention provides a fluorescent imaging thermographic method and system for use particularly in surface temperature measurements, which are reproducible over time. The invention provides a temperature-sensitive fluorescent probe comprising a rare earth compound in an ultraviolet and fluorescence transparent medium wherein the intensity of fluorescence varies as the temperature varies, in particular, provided are probes comprising Europium(1,1,1,5,5,5-hexafluoroacetylacetone)3 for measuring temperatures greater than 24° C., and Terbium(1,1,1,5,5,5-hexafluoroacetylacetone)3 for measuring temperatures less than 24° C. The probe is applied as a layer to a surface, exposed to fluorescence-inducing energy, and emitted fluorescence measured. A ratio imaging algorithm enables the temperature at each location on the surface to be determined.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: November 18, 2003
    Assignee: Board of Trustees of Michigan State University
    Inventors: John J. McGrath, Bin Lian
  • Publication number: 20030160622
    Abstract: The subject invention pertains to an imaging technique and apparatus which can utilize an array of RF probes to measure the non-resonant thermal noise which is produced within a sample, such as a body, and produce a non-resonant thermal noise correlation. The detected noise correlation is a function of the spatial overlap of the electromagnetic fields of the probes and the spatial distribution of the conductivity of the sample. The subject technique, which can be referred to as Noise Tomography (NT), can generate a three-dimensional map of the conductivity of the sample. Since the subject invention utilizes detection of the thermal noise generated within the body, the subject method can be non-invasive and can be implemented without requiring external power, chemicals, or radionuclides to be introduced into the body. The subject imaging method can be used as a stand along technique or can be used in conjunction with other imaging techniques.
    Type: Application
    Filed: December 18, 2002
    Publication date: August 28, 2003
    Inventors: G. Randy Duensing, Charles Saylor, Feng Huang
  • Publication number: 20030152132
    Abstract: A method and apparatus for performing characterization of devices is presented. The characteristic of the device are determined by obtaining a first temperature measurement in a first location of a device, obtaining a second temperature measurement, computing the difference between the temperature measurements and, using the temperatures and/or the temperature difference, a characteristic of the device is determined.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 14, 2003
    Inventors: Kevin P. Pipe, Rajeev J. Ram
  • Publication number: 20030147449
    Abstract: An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles.
    Type: Application
    Filed: October 18, 2002
    Publication date: August 7, 2003
    Applicant: Delphi Technologies, Inc.
    Inventors: Abhijeet V. Chavan, James H. Logsdon, Dan W. Chilcott, Han-Sheng Lee, David K. Lambert, Timothy A. Vas
  • Patent number: 6599011
    Abstract: A temperature sensing assembly utilizing a multipoint thermocouple. The assembly comprises a vessel, e.g. a chemical reaction pressure vessel, into which a thermocouple is inserted. The thermocouple utilizes an elongated sheath having a plurality of sensors therein. The sensors are arranged to detect temperature at a plurality of unique locations within the vessel.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: July 29, 2003
    Assignee: Daily Thermetrics
    Inventors: Jeffrey N. Daily, Robert F. Poteet, Michael W. Rahn, Larry D. Welch
  • Publication number: 20030128737
    Abstract: The present invention provides a fluorescent imaging thermographic method and system for use particularly in surface temperature measurements, which are reproducible over time. The invention provides a temperature-sensitive fluorescent probe comprising a rare earth compound in an ultraviolet and fluorescence transparent medium wherein the intensity of fluorescence varies as the temperature varies, in particular, provided are probes comprising Europium (1,1,1,5,5,5-hexafluoroacetylacetone)3 for measuring temperatures greater than 24° C., and Terbium(1,1,1,5,5,5-hexafluoroacetylacetone)3 for measuring temperatures less than 24° C. The probe is applied as a layer to a surface, exposed to fluorescence-inducing energy, and emitted fluorescence measured. A ratio imaging algorithm enables the temperature at each location on the surface to be determined.
    Type: Application
    Filed: September 7, 2001
    Publication date: July 10, 2003
    Applicant: Board of Trustees operating Michigan State University
    Inventors: John J. McGrath, Bin Lian
  • Publication number: 20030108083
    Abstract: In the imaging pyrometer, at least three types of pixels (L, S, V) for sensing electromagnetic radiation in at least three different spectral ranges are arranged in a mosaic pattern. This pattern has the following properties. In a neighborhood, there are two types of pixels with relatively narrow spectral sensitivity ranges in the infrared (IR), a first one (L) for sensing longer IR wavelengths and the other one (S) for shorter IR wavelengths. Additionally, there is a third pixel type (V) present for receiving electromagnetic radiation in a broader band, e.g., in the visible part of the electromagnetic spectrum. This is preferably realized by placing a mosaic filter pattern directly on pixels of an appropriate optoelectronic image sensor, for example by evaporation and photolithographic definition.
    Type: Application
    Filed: September 13, 2002
    Publication date: June 12, 2003
    Inventor: Peter Seitz
  • Publication number: 20030103552
    Abstract: A method that utilizes a short sampling interval and a long-pulsewidth laser source to obtain the long sensing range and employs a signal processing technique of decomposing Brillouin spectrum to achieve high spatial resolution, high temperature resolution of the distributed temperature measurement is disclosed. The present method includes the steps of measuring the Brillouin spectra of an optical pulse applying to a sensing fiber and a overlapped area thereof, determining the length that the pulse enters according to the measured Brillouin spectra and a weighting factor and then determining a real Brillouin spectrum profile and a temperature distribution according to Brillouin frequency shifts thereof. For a 9500-m sensing range of standard single-mode fiber and a 100-ns pulsewidth laser source, spatial and positon resolutions of 20 cm and a temperature resolution of 1° C. are simultaneously achieved by using this signal processing method.
    Type: Application
    Filed: April 9, 2002
    Publication date: June 5, 2003
    Inventors: Sien Chi, Chien-Chung Lee, Po-Wen Chiang
  • Patent number: 6547435
    Abstract: The invention relates to a method and a device for monitoring, also permanently and automatically, temperature distributions and/or temperature anomalies on the basis of distributed fiber-optic temperature sensing as well as to the use of such methods. According to the invention the detection of local temperature extremes, i.e. minimums or maximums, in view of the evaluation is performed by an evaluation without numeric derivations. With the device for monitoring ascending and supply pipes surrounded by an annular space it is possible to check the safety of pressurized installations, particularly in the field of low-pressure gas storage, in a cost-efficient manner. Moreover, the position of an underground watershed or respectively the direction and flow rate of the flows in flooded drift sections can be determined on the basis of fiber-optic temperature measurements.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: April 15, 2003
    Assignee: GESO Gesellschaft für Sensorik, Geotechnischen Umweltschutz und Mathematische Modellierung mbH Jena
    Inventors: Stephan Grosswig, Katrin Kühn
  • Patent number: 6520675
    Abstract: An oven analyzer for profiling a conveyor oven is disclosed that accurately and precisely determines the physical characteristics of an oven and stores such information so that it can be outputted to a computer for analysis. In one embodiment, the oven analyzer includes a pallet that moves through the conveyor oven. The pallet houses an electronic data logger that is coupled to multiple sensors. The electronic data logger has memory for storing information obtained from the sensors. A first sensor is a temperature sensor that detects the ambient temperature within the oven. A second sensor is mounted within a metal mass of known thermal characteristics and detects the ovens ability to heat an object. A third sensor detects the position of the pallet within the oven. The electronic data logger stores the data received from the sensors in the memory for selective output to a computer for analysis or printing.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: February 18, 2003
    Assignee: Electronic Controls Design, Inc.
    Inventors: Rex L. Breunsbach, Paul M. Austen
  • Patent number: 6511222
    Abstract: The invention concerns a temperature sensor including an optical fiber source (10, 30) for supplying an optical signal, a first fiber optic transmission line (12, 32) connected to the optical source, a sensitive optical fiber portion (14, 34) connected to the fiber optic transmission line, a second fiber optic transmission line (16, 36) connected to the sensitive portion of the optical fiber, and an optical detection and processing circuit (18, 38) connected to the second fiber optic transmission line for receiving and analysing the optical signal transmitted by the optical source and passing through the optical fiber, said sensor being characterised in that said sensitive optical fiber portion is mounted on a plane support and bent over a determined length (N1) and with a determined amplitude of curvature (A1).
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: January 28, 2003
    Assignee: Talltec Technologies Holdings S.A.
    Inventor: Mohamed Bouamra
  • Patent number: 6511223
    Abstract: A sensor link is disclosed that simplifies connections between multiple temperature sensors positioned on a test board and a data logger that stores temperature information received from the temperature sensors while passing through the conveyor oven. In one embodiment, the sensor link includes multiple input ports for connecting to the temperature sensors. Conductors within the sensor link connect the multiple temperature sensors to an output port. In one aspect, a single cable extends between the sensor link and a data logger. The data logger stores temperature information received from the temperature sensors while the test board is passed through a conveyor oven. The sensor link can also have additional temperature sensors for providing additional temperature information about the conveyor oven. For example, an ambient temperature sensor may be positioned on the sensor link to provide the ambient temperature of the conveyor oven.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: January 28, 2003
    Assignee: Electronic Controls Design, Inc.
    Inventors: Paul M. Austen, Rex L. Breunsbach
  • Publication number: 20020191671
    Abstract: A method for providing a thermal analysis of an assembly having a first component with an attached friction material controllably engaged with a second component. The method includes the steps of determining an initial interface temperature of the first and second components, determining a heat flux split as a function of the initial interface temperature, determining a first net heat flux into the first component and a second net heat flux into the second component as a function of the heat flux split, and determining a first and a second real interface temperature of the respective first and second components as a function of the respective first and second net heat fluxes.
    Type: Application
    Filed: April 10, 2001
    Publication date: December 19, 2002
    Inventors: Wayne M. Ferrell, Ganesh R. Iyer, Ramesh Sugavanam
  • Publication number: 20020191672
    Abstract: A method and apparatus for mapping the character and location of small surface variations on a planar surface. Energy in the form of pulses is supplied to an object in close proximity to the planar surface to thereby raise the temperature of the object and at part of the surface. A change in temperature of the object is detected when it is in proximity to the variation to define the location and character of the variation. By supplying the energy in the form of pulses, the size of the thermal signature produced in the planar surface is limited wherein a more accurate and more sensitive mapping method and apparatus are provided. The energy supply may be thermal energy or optical energy but preferably is electrical energy which heats a resistive element. Preferably, the object is a magnetoresistive head of a disk drive assembly and the surface may be that of a magnetic recording material. The change in temperature is detected by monitoring the resistance of the magnetoresistive coil of the head.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Inventors: David W. Abraham, Timothy J. Chainer, Philip J. Trouilloud
  • Patent number: 6494617
    Abstract: A status detection apparatus for electrical equipment includes a plurality of distributed multiparameter sensors in a containment vessel or other fluid filled region of the electrical equipment. The sensors are capable of providing data relating to plural parameters of the fluid simultaneously at different positions in the fluid. The data provided by the sensors can be processed to permit localization of incipient faults or can indicate other operating states when combined with known flow data of the fluid through the electrical equipment. A method for detecting status of electrical equipment includes sensing parameters simultaneously at multiple locations in the fluid and determining operating status based on the sensed parameters.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: December 17, 2002
    Assignee: General Electric Company
    Inventors: Edward B. Stokes, Steven H. Azzaro, Thomas G. O'Keeffe
  • Patent number: 6494616
    Abstract: A sensor array includes a plurality of sensors connected to two or more groups of wires such that individual sensors can be addressed. No two sensors are connected to the same two wires. The groups of wires are connected to multiplexers or the like to address particular wires connecting a unique sensor. Dramatically improved accuracy is obtained by connecting rectifiers in series with the sensors to significantly reduce reverse current through a sensor that can lead to significant errors.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: December 17, 2002
    Assignee: Regents of the University of Minnesota
    Inventors: Eugene Tokhtuev, Robert M. Carlson, Christopher J. Owen, Anatoly Skirda, Viktor Slobodyan, Alexander Tokhtuev
  • Publication number: 20020172975
    Abstract: A method of detecting locations on a nucleic acid probe array at which hybridization occurs between targets in a fluid sample and nucleic acid probes disposed on a surface of the nucleic acid probe array, comprising: measuring the temperature at a plurality of locations on the surface of the nucleic acid probe array; applying an oscillating level of energy to the surface of the nucleic acid probe array, thereby causing the temperature at the surface of the nucleic acid probe array to oscillate; and detecting a decreased range of temperature oscillation at at least one of the plurality of locations on the nucleic acid probe array, thereby indicating an increased heat capacity caused by latent heat of hybridization between at least one target in the fluid sample and at least one nucleic acid probe disposed on a surface of the nucleic acid probe array.
    Type: Application
    Filed: July 8, 2002
    Publication date: November 21, 2002
    Applicant: AFFYMETRIX, INC.
    Inventor: Rolfe C. Anderson
  • Patent number: 6450682
    Abstract: A method and system for predicting the end of life of a packed resin or dry chemical bed in a gas scrubber including providing a plurality of thermocouples spacedly disposed in the packed bed, the thermocouples being operatively coupled to a processor, monitoring the motion of an exothermic wavefront through the packed resin or dry chemical bed by periodically sampling the thermocouples and computing a time at which the exothermic wavefront will have traversed the packed resin or dry chemical bed, the computed time being the end of life of the packed resin or dry chemical bed.
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: September 17, 2002
    Assignee: C&M Inc.
    Inventors: Kye-Jin Lim, Gwon Sagong, Daniel K. Weber
  • Patent number: 6447162
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: September 10, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Craig T. Clyne
  • Publication number: 20020110177
    Abstract: A heat emitting probe including a conductive nanotube probe needle with its base end fastened to a holder and its tip end protruded, a heat emitting body formed on the probe needle, a conductive nanotube lead wire fastened to the heat emitting body, and an electric current supply that causes an electric current to pass through the conductive nanotube lead wire and both ends of the probe needle. The tip end of the probe needle is thus heated by an electric current flowing through the heat emitting body. A heat emitting probe apparatus includes the above-described heat emitting probe, a scanning mechanism that allows the heat emitting probe to scan over a thermal recording medium, and a control circuit that causes the tip end of the probe needle to emit heat, thus recording extremely small hole patterns in the surface of a thermal recording medium.
    Type: Application
    Filed: February 13, 2002
    Publication date: August 15, 2002
    Applicant: YOSHIKAZU NAKAYAMA and DAIKEN CHEMICAL CO., LTD.
    Inventors: Yoshikazu Nakayama, Akio Harada