Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: This document discusses, among other things, an apparatus and method for providing temperature information. In an example, an integrated circuit apparatus can include a first resistor configured to be coupled to a first terminal of a temperature-sensitive resistance, a second resistor configured to be coupled to a second terminal of the temperature-sensitive resistance, and a temperature information circuit configured to receive a first voltage from the first terminal of the temperature-sensitive resistance and a second voltage from the second terminal of the temperature-sensitive resistance. The temperature information circuit can provide the temperature information using the first and second voltages.

Abstract: A process temperature transmitter is operable with at least one temperature sensor having a plurality of leads. The temperature transmitter includes measurement circuitry operably coupleable to the at least one temperature sensor to provide an indication of an electrical parameter of the at least one temperature sensor. A controller is coupled to the measurement circuitry to obtain the indication and provide a process temperature output. A current source applies a test current to the plurality of leads simultaneously. Diagnostic circuitry measures a voltage response on each lead in order to provide a diagnostic indication of the temperature sensor.

Abstract: A transducer for transducing time-related temperature variations into a difference in potentials includes an upper conductive electrode designed to be exposed to a time-related temperature variation to be measured, a lower conductive electrode, and at least one layer of pyroelectric material based on a III-V nitride directly interposed between the upper and lower conductive electrodes to generate, between the upper and lower conductive electrodes, a difference in potentials corresponding to the temperature variation even in the absence of external mechanical stress.

Abstract: A paired temperature sensor includes two temperature sensors having electrical characteristics substantially equivalent at the same temperature range, each of the temperature sensor having a thermosensitive element therein that changes its electrical characteristics according to temperature, and a pair of lead wires, and a single connector 3 to which the two temperature sensors are connected via the lead wires. The two temperature sensors have electrical characteristics substantially equivalent at the same temperature range. The connector has positioning portions for allowing the connector to be connected in a predetermined orientation relative to a counterpart connector. There is provided at least one distinguishing difference between the two temperature sensors.

Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.

Abstract: Illumination devices and related systems and methods are closed that can be used for LCD (Liquid Crystal Display) backlights, LED lamps, or other applications. The illumination devices can include a photo detector, such as a photodiode or an LED or other light detecting device, and one or more LEDs of different colors. A related method can be implemented using these illumination devices to maintain precise color produced by the blended emissions from such LEDs. One application for the illumination devices is backlighting for FSC (Field Sequential Color) LCDs (Liquid Crystal Displays). FSC LCDs temporally mix the colors in an image by sequentially loading the red, green, and blue pixel data of an image in the panel and flashing the different colors of an RGB backlight. Precise and uniform color temperature across such a display can be advantageously maintained by continually monitoring ratios of photodiode currents induced by the different colored LEDs in each illumination device as each color is flashed.

Abstract: Adjusting current based on temperature. A change in temperature of a connection between a first device and a second device may be measured. The change in temperature may be performed while the first device provides current to the second device over the connection. If the change in temperature is above a threshold, the current being provided from the first device to the second device may be reduced. The change in temperature may be performed by the first device and/or the second device, e.g., by measuring the temperature of a connector of the connection.

Abstract: A temperature sensor includes a plastic bottom shell, a plastic cap mating the plastic shell, and a temperature responsive element mounted to the plastic cap and received in a cavity of the plastic bottom shell. The temperature responsive element is positioned in the plastic bottom shell by the cap. An insulating coating is applied to the temperature responsive element. The insulating coating and the plastic bottom shell provide dual electrical insulation for the temperature responsive element.

Abstract: A method includes measuring a first voltage across a test diode on a semiconductor wafer while injecting a first current into the test diode, measuring a second voltage across the test diode while injecting a second current into the test diode, and determining temperature of a region proximate the test diode according to difference between the first voltage and the second voltage.

Abstract: This document discusses, among other things, an apparatus and method for providing temperature information. In an example, an integrated circuit apparatus can include a first resistor configured to be coupled to a first terminal of a temperature-sensitive resistance, a second resistor configured to be coupled to a second terminal of the temperature-sensitive resistance, and a temperature information circuit configured to receive a first voltage from the first terminal of the temperature-sensitive resistance and a second voltage from the second terminal of the temperature-sensitive resistance. The temperature information circuit can provide the temperature information using the first and second voltages.

Abstract: A method for thermal characterization of a portion of first material of elongate shape on which there is arranged a portion of a second, electrically conductive material of elongate shape, the method including: a) determining characteristic of the portion of second material, b) applying an electric current of angular frequency between ends of the portion of the second material, and measuring the angular frequency harmonic of the electric voltage between these ends for different values of angular frequency, c) calculating coefficient of thermal conductivity of the portion of first material from the values of the harmonic and of the determined characteristic, a width of the portion of the first material being between about 0.9 and 1.1 times the width of the portion of second material, the portion of first material being surrounded by thermal insulation.

Abstract: A temperature detecting circuit includes a first thermistor, a second thermistor, a first pull-up resistor, and a second pull-up resistor. The first thermistor has a first positive-side terminal. The second thermistor has a second positive-side terminal. The first thermistor and the second thermistor have different detection sensitivities to temperature. The first pull-up resistor is connected between the first thermistor and a power supply. The second pull-up resistor is connected between the second thermistor and the power supply. The first pull-up resistor and the second pull-up resistor have different resistances.

Abstract: The fastening apparatus for fastening elements includes a combustion chamber, a housing for a gas cartridge, means for injecting gas from a cartridge into the combustion chamber and a management module. An engine thermistor is provided to be subjected to the temperature of the chamber, as well as a second cartridge thermistor intended to be subjected to the temperature of the gas cartridge disposed in the cartridge housing. Both thermistors are mounted for transmitting their temperature information to the management module. The management module is operable for managing temperature information and determining the opening time of the injection means.

Abstract: A temperature detecting circuit includes a first thermistor, a second thermistor, a first pull-up resistor, a second pull-up resistor, and a controller. The controller is configured to sense a temperature based on a voltage signal from the first thermistor if a temperature corresponding to a voltage signal from one of the first thermistor and the second thermistor is below a threshold temperature. The controller is configured to sense a temperature based on a voltage signal from the second thermistor if a temperature corresponding to a voltage signal from one of the first thermistor and the second thermistor is higher than or equal to the threshold temperature. A resistance Ra of the first thermistor, a resistance Rb of the second thermistor, a resistance Rc of the first pull-up resistor, and a resistance Rd of the second pull-up resistor have a relationship expressed by Ra<Rb and Rc>Rd.

Abstract: The present application is directed to a system for verifying calibration of a temperature sensor comprising an above-ambient temperature verifier and a below-ambient temperature verifier. The above-ambient temperature verifier includes a first housing containing an ohmic material. At least one pair of electrodes is provided to direct an applied current through the ohmic material to heat the material. A well is provided within the ohmic material for accepting a temperature sensor. A compression assembly cooperates with the ohmic material to create intimate contact with the temperature sensor. An above-ambient reference temperature monitor maintains a calibrated temperature within the ohmic material. The below-ambient temperature verifier includes a second housing and a below-ambient reference temperature monitor to maintain a calibrated temperature of a below-ambient temperature medium.

Abstract: Embodiments include a system and method for determining the temperature of the liquid crystal layer of a liquid crystal display. Because LCD performance is dependant on the temperature of the liquid crystal layer, performing particularly poorly in colder temperatures many LCD's are available with integral heaters. Determining the temperature of the liquid crystal layer of an LCD is imperative for appropriate thermal management, which in turn leads to more-optimal LCD lifetime. Exemplary embodiments relate to accurately determining the temperature of the liquid crystal layer of an LCD by employing the integrated heater layer as a temperature sensor. When the relationship between the temperature of the integral heater is known, and the integral heater is disposed very near the liquid crystal layer, then determining the resistance of the metal heater layer, allows for rapid, accurate determination of the average temperature of the liquid crystal layer, and correspondingly better thermal management.

Abstract: A temperature recorder mainly includes a micro control unit (MCU), a temperature sensing circuit, a memory with RF transmission function, and at least one antenna unit. The MCU electrically connects to the temperature sensing circuit and the memory, and the antenna unit electrically connects to the memory. The temperature sensing circuit senses external temperature variations surrounding the temperature recorder, and the sensed temperature variations are progressed by the MCU and then stored into the memory in accordance with scheduled parameters. The temperature recorder can be connected externally through wired serial transmitting interface or wireless radio frequency (RF) transmitting interface when internal temperature data needs to be retrieved, or a new parameter needs to be written into the memory. Thus, the memory in the temperature recorder can be retrieved and written via both wired connection and wireless connection, the usage of the temperature recorder is more flexible.

Abstract: A bleed leakage detection system includes an arrangement of thermostats that are capable of detecting the place where the bleed air leakage is occurring (e.g., the failed junction in bleed air duct work). The exemplary illustrative non-limiting implementation provides a bleed leakage detection system with continuous monitoring of thermostat sensor wiring during flight and thermostat self-test function (“Initiated Built In Test”—“IBIT”). The IBIT self-testing can be initiated before the aircraft takes off or optionally, during periodic self testing that may be run during predetermined periods such as overnight when the aircraft is not being flown. By the continuous monitoring the pilot is alerted when a bleed leakage has occurred or when the bleed leakage detection system has failed.

Abstract: A thermal sensor system including at least one thermal sensor, a voltage control network, a current gain network, a current compare sensor, and a controller. The voltage control network applies reference and delta voltage levels to a thermal sensor, which develops reference and delta current signals. The current gain network is used to adjust current gain. The current compare sensor is responsive to the reference and delta current signals and provides a comparison metric. The controller selects a temperature subrange and controls the current gain network to adjust the gain of the delta current signal to determine a gain differential value indicative of the temperature. The controller may select from among different sized thermal sensors, current mode gain values, and control voltages corresponding with each of multiple temperature subranges. Any one or more of these parameters may be adjusted to adjust an operating point for selecting a corresponding temperature subrange.

Abstract: A thermal sensor system which includes a thermal sensor and a voltage control network which applies a reference voltage level and a delta voltage level to the same or different thermal sensors. The thermal sensor develops a reference current signal in response to the reference voltage level and a delta current signal in response to the delta voltage level. A current gain network adjusts gain of the delta current signal. A current compare sensor, which is responsive to the reference current signal and the delta current signal, provides a comparison metric. A controller controls the current gain network to adjust gain of the delta current signal while monitoring the comparison metric to determine a gain differential value indicative of a current ratio between the current signals. The controller determines a temperature value based on the gain differential value. A LUT may be used to retrieve the temperature.

Abstract: A method includes alternately coupling a selected one of a plurality of current sources and two or more of the plurality of current sources to a first terminal of a bipolar device during first and second phases of a modulator cycle of a plurality of modulator cycles. The method further includes providing sampled voltages from the first terminal of the bipolar device to a modulator to produce a modulator output signal, filtering the modulator output signal to produce a filtered output signal using a back-end filter having an impulse response, and determining a temperature in response to the filtered output signal.

Abstract: A system and method for using a common subchannel to assess operating characteristics of one of a plurality of transducers coupled to said subchannel is disclosed. The transducers are divided into subsets, with each subset is coupled to a subchannel. The system is configured to activate a selected transducer on the subchannel and the subchannel delivers operational information on the activated transducer. The present invention reduces the number of subchannels required to collect information on the plurality of transducers. The present invention permits a more compact ablation device to be constructed based on the invention's ability to reduce the total number of subchannels required to collect transducer information.

Abstract: There is provided a method for measuring a temperature using a thermistor with which it is possible to precisely measure a temperature above a thermoelectric device by using a thermistor disposed on the thermoelectric device in a module for controlling a temperature of a component arranged on the thermoelectric device by using the thermoelectric device. In the method for measuring a temperature using a thermistor, by electrically connecting the thermistor to an electrode pin through a thermoelectric device or a bridge sub-mount mounted on the thermoelectric device when electrically connecting a top surface of the thermistor and the electrode pin, it is possible to suppress direct heat exchange between the thermistor and the electrode pin. Further, it is possible to effectively suppress heat exchange between the thermistor and a package lid by internal gas of a package by covering the thermistor with a polymer material, such as an epoxy having low thermal transmittance.

Abstract: A temperature sensor (100) includes a heat-sensitive element (21) having a thermistor sintered-body (22), an insulating support (31), an insulation sheath (41) and a housing tube (11). The insulating support (31) is in contact with the rear end of the heat-sensitive element (21) and the insulation sheath (41) is in contact with the rear end of the insulating support (31). The housing tube (11) accommodates the heat-sensitive element (21), the insulating support (31) and the insulation sheath (41). The housing tube (11) includes a sheath accommodation portion (14) which accommodates the insulation sheath (41) and a distal accommodation portion (13). The distal accommodation portion (13) is located toward the distal end of the housing tube (11) with respect to the sheath accommodation portion (14), is smaller in outside diameter than the sheath accommodation portion (14), and accommodates at least half of the insulating support (31) as measured from the axially distal end of the insulating support (31).

Abstract: An apparatus includes a temperature detector coupled to a conductive layer of an electrophoretic display device. The temperature detector is operable to measure a leakage current that is responsive to a temperature associated with the electrophoretic device and determine the temperature associated with the electrophoretic device based at least in part on the measured leakage current.

Abstract: The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.

Abstract: A method for controlling a cooking process of food stuff includes: a) detecting at least one physical property such as electrical impedance (Z) and/or a temperature (T) at a check point of the food stuff, b) deriving food type information about the type of food of the food stuff and/or food age information about the age of the food stuff, c) deriving a bacterial information (e.g. F or F<F0) about the bacterial concentration (or reduction thereof) in the food stuff, d) using the food type information of the food stuff and/or the food age information of the food stuff in said step of deriving the bacterial information (e.g. F or F<F0), e) providing said bacterial information (e.g. F or F<F0) to an information output unit for adapting the cooking time and/or temperature dependent on this bacterial information.

Abstract: A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 ?m) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.

Abstract: A fuel property sensor includes an external electrode, an internal electrode, a temperature detecting device, a holder portion, a sealing portion. The external electrode includes a passage portion and a projecting portion to define a transfer passage through which fuel flows. The internal electrode is disposed in the passage portion of the external electrode. The temperature detecting device detects a fuel temperature. The holder portion holds the temperature detecting device. The holder portion has a bottomed-cylindrical shape and disposed in the transfer passage and the through-hole of the internal electrode, or the holder portion has a cylindrical shape and disposed in the transfer passage. The sealing portion seals the transfer passage and prevents fuel flowing in the transfer passage from leaking outside.

Abstract: The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.

Abstract: The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.

Abstract: A method for measuring a contacting thermal resistance of one-dimensional structures is provided. A first one-dimensional structure and A second one-dimensional structure are crossed and in contact with each other to form a suspended junction. A point P of the first one-dimensional structure is heated until the first one-dimensional structure and the second one-dimensional structure reach a thermal equilibrium. A point A and a point B are selected on the first one-dimensional structure and a point C and a point D are selected on the second one-dimensional structure, wherein the point B, the point A, the suspended junction, the point C and the point D are arranged equidistantly with a distance ?x. A temperature difference ?Tj is calculated by the formula ?Tj=?TAC??TBA??TCD. The heat flux Qj is calculated by the formula Qj=2k?TCD/?x. The contacting thermal resistance Rj is calculated by the formula Rj=?Tj/Qj.

Abstract: Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.

Abstract: Disclosed is a temperature measuring apparatus which is provided with: a substrate (2); a temperature sensor (3) disposed on one surface of the substrate (2); and a wire (8) disposed to electrically connect together a circuit, which detects a temperature using the temperature sensor (3), and the temperature sensor (3). In said surface of the substrate (2), a recessed section (7) having a heat capacity smaller than that of the material of the substrate (2) is formed on the periphery of the temperature sensor (3). The recessed section (7) is formed at a predetermined interval from the temperature sensor (3) such that the recessed section surrounds the temperature sensor (3) and has predetermined width and depth. Preferably, the low heat capacity zone is the recessed section (7), i.e., the groove having a recessed cross-section.

Abstract: A temperature detection system includes a power semiconductor device, a chip temperature detection device for detecting a temperature of the power semiconductor device, loss-related characteristic value acquiring means for acquiring a loss-related characteristic value that is a characteristic to decide a loss of the power semiconductor device, difference value calculating means for calculating, from the loss-related characteristic value, a difference value between the temperature of the power semiconductor device and a temperature detected by the chip temperature detection device, a corrected temperature signal generating part for generating a corrected temperature signal by adding the temperature detected by the chip temperature detection device and the difference value, and an output part for outputting the corrected temperature signal to the outside.

Abstract: The disclosure relates to a device for measuring an extremal temperature among temperatures of a plurality of temperature sensors. A first temperature sensor is configured to conduct a current that corresponds to the temperature of the sensor, and each (k+1)th temperature sensor is equipped to conduct the larger of two currents, that is, a current that corresponds to the temperature of the respective sensor and the current that the kth temperature sensor conducts.

Abstract: A temperature detecting device for a power conversion device is provided in which the number of components can be reduced. An exemplary embodiment of the temperature detecting device includes: a plurality of temperature detecting elements that are provided in correspondence with a plurality of temperature detection objects, each temperature detecting element outputting a signal having a correlation with the temperature of the temperature detection object by being supplied power by a common power source; and a temperature detector that detects the temperatures of the temperature detection objects based on the signals having correlation with the temperatures of the temperature detection objects outputted from the temperature detecting elements. The temperature detector detects an average temperature of at least two temperature detection objects among the plurality of temperature detection objects or respective temperatures of the plurality of temperature detection objects based on the output signals.

Abstract: In one or more implementations, a temperature measuring system is provided, including a temperature sensing probe having (a) a thermistor operatively connected to a first conductor and (b) a resistor operatively connected to a second conductor, and a temperature determination application stored in a memory of a computing device operatively connected to the temperature sensing probe.

Abstract: A temperature sensor having a weld zone between an element electrode wire and a sheath core wire. When a section of the weld zone is taken orthogonally to the axial direction and in such a manner as to pass through a center point, L/D is greater or equal to 0.6, wherein D represents the diameter of the element electrode wire, and L represents the length of a chord connecting a first weld point and a second weld point as defined herein.

Abstract: Provided is a temperature measuring device capable of continuously measuring a body temperature without imposing a load on a subject or a measurer. The temperature measuring device includes: a temperature measuring unit (10, 210) to be attached to an object to be measured, including a temperature measuring unit-side temperature sensing element (21, 221) and a first coil (11, 211); and a power supplying unit (30, 230) including a second coil (31, 231), for supplying power to the temperature measuring unit (10, 210), in which the temperature measuring unit (10, 210) and the power supplying unit (30, 230) are formed integrally with each other.

Abstract: The invention discloses a method to control the work of electronic thermometer by using the position of probe. The probe incased in a disposable sheath, wherein the pre-heating mechanism in the probe and the control switch is connected with the host of the electronic thermometer by wires; and by using the axial reciprocating motion of the probe to trigger the control switch to initiate the electronic thermometer. When using the invention, we use the movement for the assembling of the sheath to initiate the hearting process and measurement, to ensure that the disposable sheath is assembled on the probe, and then execute the measurement, so as to eliminate the possibility of cross infection completely. The invention also exempts the requirement for the users to the return back of the probe into the cavity after use, and brings convenience for the users: Meanwhile, the equipment structure is simple, and the machinery assembles are few by comparison, which effectively decrease the production cost.

Abstract: According to one embodiment, an apparatus for reading a temperature of a material includes a thermistor that is communicable in temperature sensing communication with the material. The apparatus also includes a first resistor that has a first resistance and a second resistor that has a second resistance that is lower than the first resistance. Additionally, the apparatus includes a switch that is selectively controllable to electrically couple the first resistor and second resistor to the thermistor in a low temperature mode. The switch also is selectively controllable to electrically couple the second resistor to the thermistor and electrically decouple the first resistor from the thermistor in a high temperature mode.

Abstract: A temperature-current transducer includes first and second voltage dividers, with the first voltage divider including a thermistor in an environment. An operational amplifier has a first input coupled to an intermediate node of the first voltage divider, and a second input coupled to an intermediate node of the second voltage divider. A cascode stage is configured to be biased in a conduction state and is controlled by the operational amplifier. The cascode stage includes a first current terminal coupled to the intermediate node of the second voltage divider. A current mirror is coupled to a second current terminal of the cascode stage, and is configured to mirror on an output line current flowing through the cascode stage that is representative of temperature differences between a temperature in an environment of the thermistor and a reference temperature.

Abstract: A device for detecting temperature variations of the substrate of an integrated circuit chip, including, in the substrate, implanted resistors connected as a Wheatstone bridge, wherein each of two first opposite resistors of the bridge is covered with an array of metal lines parallel to a first direction, the first direction being such that a variation in the substrate stress along this direction causes a variation of the unbalance value of the bridge.

Abstract: A housing between mineral-insulated cable and connecting wire in a turbocharger overheating protection device may include the following characteristics: coiled regions of springs (10) arranged point-symmetrically to each other; or the springs (10) are not placed on axes; or the coil regions of the coil springs (10) for cushioning the film resistor are shorter than its substrate length and longer than its substrate width; or the connecting wires of the film resistor are shorter than its substrate length and longer than its substrate width; or the springs are arranged staggered in their longitudinal direction adjacent to each other; or coil springs (10) are used, in which the coils are located only in one half of the spring (10) and the coils of one spring are arranged staggered in the longitudinal direction to the coils of the other spring (10).

Abstract: Methods for gas sensing with single-walled carbon nanotubes are described. The methods comprise biasing at least one carbon nanotube and exposing to a gas environment to detect variation in temperature as an electrical response.

Abstract: Methods and systems for dynamically estimating the core temperature of at least one cell in a battery during an operative period. The method includes receiving by at least one controller the surface temperature, the current, the voltage, the state of charge, and the period of time from the initiation of a rest period to the termination of the rest period, determining an initial value of the lumped internal resistance of the at least one cell, determining subsequent values of the lumped internal resistance recursively in real-time based on the initial value, the current, and the voltage, and determining the core temperature of the at least one cell based on the surface temperature, the current, the obtained time, and the lumped internal resistance.

Abstract: A remote, noncontact temperature determination method and apparatus is provided, which is operable to determine the temperature of a conducting member forming a part of or in operative thermal communication with an object of interest. The method comprises the steps of first inducing a closed vortex eddy current (28) in a conducting member (16, 38, 44) by subjecting the member (16, 38, 44) to a magnetic field, such that the corresponding eddy current magnitude changes exponentially over time. A characteristic time constant of the exponential current magnitude changes is then determined, and this is used to calculate the temperature of the object. The apparatus (24) includes a field transmitting coil (14) coupled with a waveform generator (12) for inducing the eddy current (28), and a field receiving coil assembly (18) which detects the corresponding magnetic field induced by the eddy current (28).

Abstract: A multiple temperature sensor system (120) includes a temperature sensor network (180) including temperature-sensing resistors RT1 and RT2 (186, 187) and frequency-selective filters (184, 185) coupled to the plurality of temperature-sensing resistors RT1 and RT2 (186, 187). The frequency-selective filters (184, 185) pass distinct time-varying signals into the temperature sensor network (180) and pass attenuated distinct time-varying signals out. The system (120) further includes a temperature measurement N controller (161) coupled to the temperature sensor network (180) and configured to inject the distinct time-varying signals into the temperature sensor network (180), receive the attenuated distinct time-varying signals in response to the injection, with the attenuated distinct time-varying signals being attenuated by the temperature sensing resistors (186, 187), and generate two or more substantially simultaneous temperature values from the attenuated distinct time-varying signals.