Abstract: An intelligent input/output (I/O) temperature sensor includes a temperature sensing element which generates a plurality of digital data indicative of the temperature at the temperature sensing element, a processor directly coupled to the temperature sensing element which generates a plurality of compensated digital data from respective the digital data and a digital delta value, and a memory directly coupled to the processor which stores the digital delta value and the compensated digital data. According to one aspect of the invention, the memory is an electrically erasable programmable read only memory (EEPROM). According to another aspect of the invention, the memory, the temperature sensing element and the processor are all disposed within a unified structure, i.e., on a single chip. A method for calibrating an intelligent input/output (I/O) temperature sensor is also described.

Abstract: Several sensors are provided for determining one of a number of physical roperties including pressure, temperature, chemical species, and other physical conditions. In general, the sensors feature a resonant circuit with an inductor coil which is electromagnetically coupled to a transmitting antenna. When an excitation signal is applied to the antenna, a current is induced in the sensor circuit. This current oscillates at the resonant frequency of the sensor circuit. The resonant frequency and bandwidth of the sensor circuit is determined using an impedance analyzer, a transmitting and receiving antenna system, or a chirp interrogation system. The resonant frequency may further be determined using a simple analog circuit with a transmitter. The sensors are constructed so that either the resonant frequency or bandwidth of the sensor circuit, or both, are made to depend upon the physical properties such as pressure, temperature, presence of a chemical species, or other condition of a specific environment.

Abstract: A method of measuring temperature of momentary anneals in the temperature range of around 900° C. is disclosed. The method comprises the steps of providing a substrate of doped polysilicon or single crystal silicon, applying a blocking layer on a portion of the substrate, selectively forming silicide on the substrate adjacent opposite ends of the blocking layer to define a resistor, subjecting the resistor to a momentary anneal in the temperature range around 900° C., and measuring interfacial resistance between the silicide and the substrate after the annealing step, the resistance correlating to anneal temperature.

Abstract: An arrangement for measuring the temperature of fluids has a measuring sensor (4) to which a measuring current is supplied by a current source (11). This arrangement is improved in that the temperature measurement is carried out without significant inherent warming of the measuring sensor (4). The invention is also directed to a method for carrying out the temperature measurement wherein measuring current pulses are applied to the measuring sensor (4) and the voltage maximum and current maximum, which are generated by the measuring current pulses, drop across the measuring sensor (4) and are detected. A quotient of the voltage maximum and the current maximum is formed and this quotient is an index for the temperature of the fluid.

Abstract: A response-adjustable temperature sensor (306, Rext), particularly for a transponder (102, 200, 400) capable of measuring one or more parameters (e.g., temperature, pressure) and transmitting a data stream (FIGS. 3C, 4B) to an external reader/interrogator (106). The transponder typically operates in a passive mode, deriving its power (Vxx, Vcc, Vdd) from an RF interrogation signal received by an antenna system (210, 410), but can also operate in a battery-powered active mode. The transponder includes memory (238, 438) for storing measurements, calibration data, programmable trim settings (436b), transponder ID and the like.

Abstract: A method for determining the temperature of a wafer during processing is disclosed. A test wafer is specially prepared in conjunction with a calibration chart. The difference in stack sheet resistance of the test wafer before and after processing is plotted onto the calibration chart to determine the temperature of the test wafer during processing.

Abstract: In a three-wire RTD interface, a known current is connected to a first lead during a first measurement interval. In this configuration, current is directed to the first lead and into an RTD. This results in a first signal indicative of a first voltage drop resulting from the voltage drops across the RTD and the lead resistance of the first lead. During a second measurement interval, current is directed through a second lead having a lead resistance substantially identical to the lead resistance of the first lead. This results in a second signal indicative of the voltage drop resulting from the second lead. The first signal, the second signal, and the known current are then combined to eliminate the effect of the lead resistance and to determine the resistance of the RTD.

Abstract: A temperature determining apparatus produces a predetermined reference voltage from an operating voltage supplied thereto from the outside, divides the reference voltage with a pair of resistance values having different temperature-resistance characteristics to produce a first divided voltage and divides the reference voltage with a pair of resistance values having the same temperature-resistance characteristic to produce a second divided voltage, and compares the first and second divided voltages to determine a threshold temperature. Since the reference voltage is constant as long as an ambient temperature is not changed even when the operating voltage is changed, the first and second divided voltages are not changed depending on the operating voltage, thereby allowing the determination of an ambient temperature with favorable accuracy in a wide range of operating voltages.

Abstract: A temperature pickup for an oil-filled transformer or tap changer has within a resistance thermometer standard housing, the circuitry for duty-factor-modulated output of a measurement signal, interference circuitry which can slur the resulting wave form and an interface circuit which subjects the output signal to polarity reversal to produce an output symmetrical with respect to ground potential. This enables zero crossings to be detected and the time lapse between zero crossings or passages to be ascertained and the temperature calculated from the duty-factor ratio.

Abstract: An image heating apparatus includes a heating member for heating an image on a recording material, a first temperature detecting element for detecting a first temperature of the heating member, a second temperature detecting element for detecting the second temperature of the heating member, wherein a thermal property of the second temperature detecting element differs from a thermal property of the first temperature detecting element, and a power supply controller for controlling the power supply to the heating member by utilizing the first temperature detecting element and the second temperature detecting element.

Abstract: An apparatus employing a method for measuring the temperature of a sensor (Rx) having a resistance which varies in accordance with the temperature of the sensor, using a switching sequence to apply a parasitic voltage correction signal to the input of an amplifier in the measurement circuit whereby the sensor generates an offset response signal which is amplified and adjusted to substantially minimize the amplified offset response signal. The temperature of the sensor is calculated from the amplified response signal in accordance with a predetermined algorithm.

Abstract: A temperature probe for use in a product flow line including a valve seat secured in the flow line, a valve stem and an orifice ring. The orifice ring is attached to the valve stem to define a pair of flow paths for product passing through the product flow line. One flow path is through the ring and the other is between the ring and the valve seat. A temperature sensing probe is carried by the valve stem and positioned in the orifice ring for sensing the temperature of the product in the flow line. A spring is connected to act on the valve stem and is responsive to changes in velocity of the product in the flow line to move the orifice ring toward and away from the valve seat to maintain the velocity of the product flowing past the probe constant.

Abstract: Systems and methods for controlling the temperature or other characteristic of semiconductor processing tools by measuring current flow to the tool is provided. In one embodiment, a current sensor is provided for measuring current flow to the heat source and generating an electrical signal proportional to the current flow. The current sensor includes a noise filter for reducing noise in the electrical signal induced by stray emf signals present around the processing tool. A controller, responsive to the electrical signal generated by the current sensor, is provided for controlling the processing tool. In this manner, the controller can, for example, allow for early detection of heat source failures or degradation. When such a condition is detected, the controller may, for instance, signal an audible or visual warning or shut down the processing tool.

Abstract: Several sensors are provided for determining one of a number of physical properties including pressure, temperature, and other physical conditions. In general, the sensors feature a resonant circuit with an inductor coil which is electromagnetically coupled to a transmitting antenna. When an excitation signal is applied to the antenna, a current is induced in the sensor circuit. This current oscillates at the resonant frequency of the sensor circuit. The resonant frequency and bandwidth of the sensor circuit is determined using an impedance analyzer, a transmitting and receiving antenna system, or a chirp interrogation system. The resonant frequency may further be determined using a simple analog circuit with a transmitter. The sensors are constructed so that either the resonant frequency or bandwidth of the sensor circuit, or both, are made to depend upon the physical properties such as pressure, temperature, presence of a chemical species, or other condition of a specific environment.

Abstract: A circuit for correcting a non-linear output of an electronic temperature sensor due to a non-linear drift over an operating range of temperature. The circuit includes a first circuit portion for adjusting a bias voltage of the sensor to a select initial voltage. The circuit also includes second circuit portion interfacing with the first circuit portion. The second circuit portion comprises at least one electronic element with a non-linear drift over the operating range of temperature, but in a direction opposite that of the drift of the temperature sensor. Thus, the drift of the electronic element alters the bias voltage over the operating range in a manner that compensates (at least partially) for the non-linear drift of the temperature sensor.

Abstract: A temperature sensor for the liquid crystal portion of a liquid crystal display assembly which includes a thin layer of transparent conductive material which is spread across the viewing area of the display. This layer of transparent conductive material can provide heat to warm up the display when a large voltage is put across it, and can also be used to measure liquid crystal temperature. It is known that the resistance of materials such as indium tin oxide (ITO) changes at a known rate with respect to temperature. By using this transparent layer of material in the stacked elements of a liquid crystal display assembly, an accurate reading of the liquid crystal temperature can be made.

Abstract: An on-chip thermometer and methods for using the on-chip thermometer to measure a local temperature and to operate an integrated circuit. The on-chip thermometer comprises a clock circuit, a temperature responsive circuit, and a counter. The clock circuit operates at a fixed frequency and generates a fixed frequency clock signal. The temperature responsive circuit, when enabled, generates a signal dependent on local temperature. In response to receiving the clock signal, the temperature responsive circuit generates an output signal. The counter is coupled to receive the output signal from the temperature responsive circuit and the clock signal. The counter then generates a value indicative of a local temperature of the integrated circuit.

Abstract: An electronic clinical thermometer including a thermistor, a probing bar, a main body, an electronic device, a display, an inner shell and a buzzing device. The probing bar is highly flexible to minimize discomfort or irritation arising from the measurement of the body temperature of a person. The electronic device can be easily joined with the inner shell such that the electronic device is held securely by the retainers of the inner shell.

Abstract: A cost-effective electronic thermometer comprises a rigid case attached to a flexible probe stem in a lap joint. The flexible probe extends away from the case in a taper of both width and thickness. A sensor with sensor cap are mounted a the distal end of the probe stem. The temperature sensor is connected to an electronic processor with display that is positioned within case and powered by a battery.

Abstract: A method of in-line temperature monitoring. At least two control wafers and a monitor wafer are provided. A sacrificial layer is formed on each control wafer and the monitor wafer. Ions are implanted under a predetermined condition in the sacrificial layers. Thermal processes are performed on the control wafers at a higher and the lower limit of a target temperature to enable ions to move partially from the sacrificial layer to the control wafers. The sacrificial layers on the control wafers are subsequently removed. The sheet resistance of the control wafers is measured to obtain a first and the second resistance value, which respectively correspond to the first and second temperatures. A wafer and a monitor wafer are provided. A thermal process is performed on the monitor wafer and the wafer at the target temperature. The sacrificial layer of the monitor wafer is removed, and the sheet resistance of the monitor wafer is subsequently measured.

Abstract: A quick registering thermometer utilizing a sensor that has electrical resistance varying with temperature located at the tip of a probe, the sensor having relatively small thermal mass and short thermal time constant. Within seconds of contact with the patient, the circuitry communicating with the sensor determines the rate of change in resistance of the sensor and, in turn, the temperature that the sensor would reach if allowed the length of time it would need to reach equilibrium with the contact surface of the patient. Based on the equilibrium temperature determined for the surface of the patient, the circuitry calculates and registers the core body temperature.

Abstract: The present invention relates to a method for measuring temperature using a negative temperature coefficient sensor and a device employing a method of this type. The present invention applies more particularly to the field of automobile electronics. The temperature sensor is associated with a signal processing stage including at least one transistor connected in parallel with at least one "pull up" resistor. An analog/digital converter receives a voltage taken at a midpoint between the sensor and the "pull up" resistors.

Abstract: A transmitter in a process control loop measures temperature. A calibrator includes a known calibration element which is connected to the transmitter. Software in the transmitter compares a measured value of the calibration element with the actual value of the calibration element and responsively calibrates the transmitter. The calibrator includes a temperature calibration sensor for coupling to a terminal block of the transmitter. The temperature calibration sensor provides an actual temperature input to the transmitter. The transmitter measures actual temperature of the terminal block and compares actual temperature with a temperature measured by an internal terminal block temperature sensor, and responsively calibrates the internal temperature sensor.

Abstract: A device appropriate for converting voltages to temperature values by using a thermistor is disclosed. The device according to the present invention utilizes a voltage-temperature cross-reference table and a temperature-increment table to carry out the conversion instead of using the conventional one-to-one voltage-temperature table, thereby reducing the required capacity of RAM and ROM and the fabrication cost. The thermistor is disposed at the place where the temperature is to be measured, and the voltage across the thermistor varies with respect to changes of temperature. An analog-to-digital converter receives the voltage of the thermistor and transforms it into digital output. A first multiplexer decodes the higher bit portion of the digital output thereby selecting a corresponding temperature from a voltage-temperature cross-reference table as a rough temperature.

Abstract: A method of measuring a substrate temperature includes the steps of: forming a first lamination of different metals on a substrate; subjecting the substrate to a heat treatment; measuring a sheet resistance of the substrate after the heat treatment; and estimating a temperature of the substrate during the heat treatment from a correlation between sheet resistances and heat treatment temperatures, the correlation being prepared in advance by subjecting preparatory substrates each having a second lamination having the same structure as the first lamination to heat treatments at a plurality of predetermined heat treatment temperatures and by measuring the sheet resistance of each second lamination layer after the heat treatment. The substrate temperature during heat treatment can be estimated easily without intervening the actual manufacture process by a temperature measuring process.

Abstract: A temperature probe for use in a product flow line including a valve seat secured in the flow line, a valve stem and an orifice ring. The orifice ring is attached to the valve stem to define a pair of flow paths for product passing through the product flow line. One flow path is through the ring and the other is between the ring and the valve seat. A temperature sensing probe is carried by the valve stem and positioned in the orifice ring for sensing the temperature of the product in the flow line. A spring is connected to act on the valve stem and is responsive to changes in velocity of the product in the flow line to move the orifice ring toward and away from the valve seat to maintain the velocity of the product flowing past the probe constant.

Abstract: A power consumption control circuit for CMOS circuit for achieving a constant signal propagation delay time in the CMOS circuit by maintaining the same power consumption all the time. A leading edge heater and a trailing edge heater are provided in close proximity to the CMOS circuit. During a time period for a leading edge of an input pulse propagates through the CMOS circuit, the leading edge heater is turned off. During a time period for a trailing edge of the input pulse propagates through the CMOS circuit, the trailing edge heater is turned off. As result, an overall current flowing in the CMOS circuit, leading and trailing edge heaters is unchanged regardless of the repetition rate of the input pulse provided to the CMOS circuit.

Abstract: A method of measuring the temperature of a wire which is surrounded by a layer of insulation includes the step of wrapping the layer of insulation with an electrically and thermally conductive ground shield having two opposing longitudinal ends, one of the ends being electrically grounded. A first relationship is determined between the temperature of the wire and a temperature of the shield. A second relationship is ascertained between an electrical resistance of the shield between the longitudinal ends and the temperature of the shield. The electrical resistance of the shield between the longitudinal ends is measured. The temperature of the wire is established by using the first relationship and the second relationship to correlate the measured electrical resistance of the shield to the temperature of the wire.

Abstract: A thermometer based on CB tunnelling includes a sensor component and devices for measuring its voltage-current dependence. The sensor includes a chain of several, at least ten, nanoscale tunnel junctions and connection electrodes for connecting the measurement devices to the ends of the chain. The temperature is determined in a manner that is, as such, known, on the basis of the characteristic quantities of the descriptor G/G.sub.T of the voltage-current dependence. The measurement array of the sensor includes several tunnel junction chains connected in parallel, for decreasing the total impedance of the array.

Abstract: A circuit for utilizing multiple resistive sensors and in particular resistive temperature sensors while minimizing the number of conductors necessary to measure the multiple sensors. The multiple sensors are connected in series and the voltage is measured at each node in the series connection of sensors. A switching device then opens to remove one of the sensors from the voltage supply allowing a measurement to be made of the resistance of the conductor between the temperature sensors and a remote transmitter. The measured sensor resistances are then compensated with the measured conductor resistance to obtain a conductor-length compensated resistance for each of the multiple resistive sensors.

Abstract: A temperature compensation circuit which includes a signal detecting circuit provided on a signal supply path which outputs logic signals to a target circuit. Also included are switch elements which turn current on/off to heater elements each time the signal detecting circuit detects that the logic signals are being applied to the target circuit. The power source of the invention therefore only needs to endure the same amount of current applied to the target circuit which leads to a reduction in power consumption.

Abstract: A temperature transmitter in a process control loop comprises a temperature sensor and a transmitter circuit. The temperature sensor includes a sensor sheath and a sensor element positioned within the sensor sheath. At least one element lead is coupled to the sensor element and extends from the sensor sheath. A sheath lead is coupled to the sensor sheath and extends from the sensor sheath, wherein the element lead and the sheath lead provide signals to be measured. The transmitter circuit includes and A/D converter, a microprocessor and an input-output circuit. The A/D converter is coupled to receive the signals from the element lead and the sheath lead. The microprocessor is coupled to the A/D converter. The input-output circuit is coupled to the microprocessor for communication with the process control loop. The sheath lead allows the transmitter to monitor the sensor sheath's insulation resistance and generation of parasitic sheath-to-lead voltage.

Abstract: A method and apparatus for temperature measurement especially suited for low cost, low power, moderate accuracy implementation. It uses a sensor whose resistance varies in a known manner, either linearly or nonlinearly, with temperature, and produces a digital output which is proportional to the temperature of the sensor. The method is based on performing a zero-crossing time measurement of a step input signal that is double differentiated using two differentiators functioning as respective first and second time constants; one temperature stable, and the other varying with the sensor temperature.

Abstract: A smart temperature sensing device 10 includes a sensor 16 and a memory 25 on a sensor unit 14. The memory contains a plurality of custom nonlinear calibration coefficients which uniquely characterize the sensor 16. A temperature system includes the smart temperature sensing device 10 and a FSAU 12 having a processor 28 which downloads the calibration coefficients and utilizes them in converting electrical signals from the sensor 16 into temperature values that represent the temperature at the sensor 16. A method of calibrating a sensor 16 includes measuring an output signal of the sensor 16 over a temperature range, thereby obtaining a plurality of paired data points. The paired data points are used in a curve-fitting algorithm to obtain coefficients to a polynomial that characterizes the nonlinear temperature-voltage relationship of the sensor 16. The coefficients are stored within the memory 25 until downloaded by the processor 28 for use in signal conversion.

Abstract: A temperature sensor includes a ceramic substrate, and a sensing resistor containing platinum is embedded in the ceramic substrate. Electric current can be applied to the sensing resistor through the lead. The voltage of the sensing resistor can be detected through the second lead. Another resistor for dividing voltage is electrically connected to the sensing resistor, the resistor is trimmed by laser irradiation so as to adjust its electrical resistance value such that upon applying electric current having a certain value onto the sensing resistor an output voltage having a predetermined value is generated. Heat generated by the laser irradiation to the resistor does not affect an electrical resistance value of the resistor as much as that of the sensing resistor, thereby improving precision of the temperature sensor. The sensing resistor avoids contact with the atmosphere.

Abstract: An apparatus and method for monitoring a temperature around a point of clinical interest. The apparatus has a sensing surface carrying a plurality of temperature detectors in a regular spatial outer disposition around a central detector. A signal processor computes the highest temperature difference between any two outer detectors and the central detector and compares the highest difference with a predetermined number of temperature domains or ranges. The signal processor activates an output device to provide an indication of the correlation between the highest determined temperature difference and the temperature domains. The output device comprises three different colored lights to provide an indication of normal, doubtful or abnormal correlation. In another embodiment, the output device is a graphical display having a pattern of the organ to be examined as a background and a luminous point on the display, which is either not lit, flashes with a low frequency, or is continuously lit.

Abstract: The invention relates to a method and apparatus for determining the internal temperature and the coefficient of internal thermal conductivity of a structure. In both cases, the surface temperature and ambient temperature of an object are measured from both sides of two structures whose thermal conductivities are known. On the basis of the measured temperature values, the internal temperature or the coefficient of internal thermal conductivity of the object is determined from the function of the heat flux. Thereafter the unknown thermal conductivity or the unknown internal temperature of the object is eliminated from the solutions, and the internal temperature or the coefficient of internal thermal conductivity of the object is determined on the basis of the combined solution.

Abstract: A finger temperature indicating ring for wearing around a finger to measure and indicate the finger temperature of the wearer. A thermal conductive rod made of highly thermal conductive material, such as platinum, is provided in the ring with a lower end of the rod exposed from the ring to contact with the finger. The finger's heat or cold is accurately and quickly transmitted to a thermistor provided with the ring via the thermal conductive rod, causing a circuit connected to the thermistor to operate and convert the finger temperature into a signal which is sent to an indicating element in the ring. With a switch button, the signal can be presented to the wearer in different manners, so that the wearer is always reminded and encouraged to release himself or herself from physical or mental stress.

Abstract: A temperature and depth probe for accurate temperature measurements in snow ontains a temperature sensing element such as thermistor placed in a protective cap affixed to the end of a hollow carbon fiber tubed. Wires connected to the ouput terminals of the temperature sensing element pass through the hollow tube to the input terminals of a temperature indicating instruments. The depth of insertion of the probe into the snow is read from depth markings on the side of the hollow tube.

Abstract: A temperature sensor using doped polysilicon resistors in a bridge configuration, an amplifier, and a doped polysilicon feedback resistor between the input and the output of the amplifier. The polysilicon resistors are doped with selected concentrations of impurities such as boron, phosphorus, arsenic or antimony. The resistors are doped to establish predetermined temperature coefficients so that the resistors exhibit a predetermined temperature dependence. This temperature dependence is utilized to create a temperature sensor that is stable, accurate, and rugged and that has a generally linear output to temperature response.

Abstract: A resistance to frequency circuit for measuring the ambient temperature on a thermostat. The temperature measuring circuit comprises a first Schmitt trigger NAND gate, a rectifier, a capacitor of which one terminal is electrically connected to ground, a first resistor, a thermistor and possibly a second resistor. The capacitor is connected with the cathode electrically connected to ground, the anode is electrically connected to the first input of a NAND gate. The output of the NAND gate is electrically connected to the anode of the rectifier. The cathode of the rectifier is electrically connected to both the thermistor and the first resistor. The second terminal of the first resistor is electrically connected to the anode of the capacitor and the first input to the NAND gate. The thermistor is electrically connected to a tri-state buffer of the microprocessor. The circuit uses the open drain output ports of a microprocessor to provide the multiplexer function of the A/D.

Abstract: The invention relates to a sensor unit and a temperature measuring system that includes the sensor unit for the contactless determination of the object temperature (T.sub.v) of at least a part of an object. The sensor unit is placed near the object and includes a first and second plate. A temperature-sensitive sensor is disposed on each plate to produce first and second sensor signals which represent the temperature of the first and second plates, respectively. The system also includes a control unit which processes the first and second sensor signals in combination for determining the object temperature (T.sub.v). Preferably, the control unit employs a Kalman filter. Also, the temperature measuring system is applied to an image reproduction machine to determine the temperature of a roller or belt.

Abstract: An apparatus is disclosed which adapts the output signal of a thermocouple temperature sensor to be electrically the same as the output signal of a thermistor temperature sensor. The disclosed apparatus, which consists of a conversion circuit, a translation circuit, and an output control circuit, makes the thermocouple temperature sensor compatible with a temperature measuring instrument which is designed for use with a thermistor temperature sensor. The conversion circuit converts the small electrical voltage produced by a thermocouple temperature sensor into a substantial electrical voltage representing the temperature at the location of the thermocouple temperature sensor. The translation circuit translates the electrical voltage at the output of the conversion circuit into an analog electrical signal which is proportional to an electrical voltage that would exist across the terminals of a thermistor temperature sensor exposed to the same temperature as the thermocouple temperature sensor.

Abstract: A wire temperature measuring method for a wire electric discharge machine, by which temperature and temperature distribution of a wire can be accurately measured during electric discharge machining. After a machining voltage is cut off, a loop current flows. Based on the loop current and a voltage between electrodes measured by a differential amplifier, a resistance between the electrodes is obtained, and the temperature of a wire is obtained based on the resistance. Accordingly, the wire temperature during actual machining operation can be measured with accuracy.

Abstract: A hot beverage mug automatically senses the temperature of its liquid contents and generates an accurate aural and/or visual indication of the temperature sensed. The temperature is sensed by a thermistor in a resistive capacitive (R/C) circuit which operates to yield a signal of variable frequency corresponding to the temperature sensed. An integrated circuit (IC) logic controller treats this electrical signal as an input which triggers a further electrical signal from the IC controller to an aural or visual display generating device such as an annunciator, a light emitting diode (LED), liquid crystal display (LCD) or a simulated voice expressing the temperature sensed. The power for the R/C circuit, the IC and the aural/visual indicator(s) is supplied from a battery and controllable by a switch activated either manually or automatically upon sensing the pressure of the liquid contents or by physical contact with the mug handle.

Abstract: A temperature monitoring circuit comprises a thermistor which is connected with a power supply rail by means of a transistor. The transistor is pulsed to connect the thermistor intermittently in circuit with the power supply. The mean power drawn by the thermistor from the power supply is reduced, causing less drain on the power supply.

Abstract: A transmitter in a process control loop measures temperature. A calibrator includes a known calibration element which is connected to the transmitter. Software in the transmitter compares a measured value of the calibration element with the actual value of the calibration element and responsively calibrates the transmitter. The calibrator includes a temperature calibration sensor for coupling to a terminal block of the transmitter. The temperature calibration sensor provides an actual temperature input to the transmitter. The transmitter measures actual temperature of the terminal block and compares actual temperature with a temperature measured by an internal terminal block temperature sensor, and responsively calibrates the internal temperature sensor.

Abstract: The electronic industrial thermometer combines a conventional industrial thermometer with an electrical resistance temperature detector thus providing a thermometer where the temperature can be read visually at the mounting site and where the detector electronically transfers an electrical signal to a remote site for continuing temperature observation or for recording the temperature on electronic display instrument.

Abstract: An error-compensated temperature measurement system has a temperature sensor, an amplifying circuit and a compensation circuit for compensating non-linearities in the amplifying circuit of the temperature sensor. Specifically, the amplifying circuit has an analogue to digital converter exhibiting non-linearity characteristics, and the compensating circuit automatically compensates these non-linearities as well as correcting for the self-zero and self gain characteristics of the amplifying circuit.

Abstract: An elongate temperature sensor comprises two electrical conductors having temperature sensitive insulating material between them whose resistance and capacitance varies with temperature but according to respectively different known relationships. An alternating waveform is applied across the sensor through a known resistor. The amplitudes of the voltage waveforms developed across the known resistor and across the sensor are compared and the phase difference between them measured to determine the corresponding resistance and capacitance values of the sensor. The measured value of one parameter is then substituted into the respective known relationship to produce a corresponding temperature value for the sensor. This temperature value is then substituted into the relationship for the other parameter to calculate a notional value for that parameter.