Abstract: A microphone unit includes a case; a diaphragm arranged inside the case; and an electric circuit unit that processes an electric signal generated in accordance with vibration of the diaphragm. The case has a first sound introducing space that introduces a sound from outside of the case to a first surface of the diaphragm via a first sound hole; and a second sound introducing space that introduces a sound from outside of the case to a second diaphragm, via a second sound hole. A resonance frequency of the diaphragm is set in the range of ±4 kHz based on the resonance frequency of at least one of the first sound introducing space and the second sound introducing space.

Abstract: Disclosed, in general, are devices that provide an air-tight chamber over a sound source while absorbing all fields of sounds from the sound source. In general, the devices feature: an anechoic chamber that is configured to receive a sound source in an air-tight manner; and an anechoic channel that is in fluid communication with the ambient atmosphere. Suitably, the anechoic chamber is adapted to capture air containing sound energy generated by the sound source, and distribute the air about an internal surface area on the inside of the chamber, wherein the internal surface area is sufficiently large to dampen or otherwise absorb the sounds energy. Preferably, the air is directed from the anechoic chamber through an anechoic channel extending therefrom to the ambient to further dampen or absorb the sound energy. In one configuration, the outer wall of the apparatus is configured to reflect ambient sounds.

Abstract: A microphone adapter is attachable to a microphone including a microphone unit and a casing having a front sound terminal and a back sound terminal. The microphone adapter has a bottom having a hole through which the casing of the microphone extends and a cylindrical peripheral wall integrated with the bottom, having an open end opposite to the bottom, and covering the periphery of the back sound terminal. The cylindrical peripheral wall has an internal diameter larger than the external diameter of the casing of the microphone so as to define a space between the cylindrical peripheral wall and the external peripheral surface of the casing of the microphone extending through the hole, and extends from the bottom at least to a position of the front sound terminal in a sound collection axis direction.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: An electronic device comprising a substrate, a cover delimiting at least a part of a main surface of the substrate to thereby form a cover-substrate arrangement enclosing a hollow space and having a through hole, an electroacoustic transducer configured for converting between an electric signal and an acoustic signal and being mounted on the substrate acoustically coupled with the hollow space in such a way that the hollow space constitutes a back volume of the electroacoustic transducer, wherein the electroacoustic transducer provides an acoustical coupling between the hollow space and an exterior of the cover-substrate arrangement via the through hole, an electronic chip mounted within the cover-substrate arrangement and electrically coupled with the electroacoustic transducer for communicating electric signals between the electronic chip and the electroacoustic transducer, and at least one electronic member mounted on the substrate within the cover-substrate arrangement and configured for providing an elec

Abstract: A microphone includes a housing and a microphone capsule positioned within the housing. The microphone is also provided with a vibration damping, non-porous capsule support member supporting the microphone capsule within the housing and electronic circuitry transmitting the signal from the microphone capsule to other equipment.

Abstract: A handheld microphone includes a microphone unit supported with a vibration insulator on a microphone case; the handheld microphone comprising a filter circuit for filtering output signals from the microphone unit; the filter circuit comprising a passive filter connected to an output terminal of the microphone unit, and a high-pass filter connected downstream of the passive filter and outputting the filtered signals from the microphone unit.

Abstract: An autonomous and controllable system of sensors and methods for using such a system of sensors are described.

Abstract: A condenser microphone includes a unit case that supports a condenser microphone unit, has an internal space in communication with a rear acoustic terminal of the microphone unit, and has an opening in a peripheral wall in communication with the internal space; a volume restrictor that reduces the volume of the internal space by partitioning the internal space; a circuit board disposed in the internal space and surrounded by the volume restrictor; and a rigid conductor that electrically connects a signal output terminal of the microphone unit and the circuit board. The circuit board intersects the center axis of the unit case. The rigid conductor is supported such that the rigid conductor slides along the volume restrictor. An elastic conductor is compressed between the rigid conductor and the circuit board or between the rigid conductor and the signal output terminal of the microphone unit.

Abstract: A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.

Abstract: A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on the upper surface of the substrate. The microphone chip is connected to a pad on the lower surface of the cover by a bonding wire. The circuit element is connected to a pad on the upper surface of the substrate by a bonding wire. A cover-side joining portion in conduction with the pad on the lower surface of the cover, and a substrate-side joining portion in conduction with the pad on the upper surface of the substrate, are joined by a conductive material. A conductive layer for electromagnetic shielding is embedded inside the cover near the bonding pad and the cover-side joining portion.

Abstract: A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.

Abstract: A microphone having an integral ball along the microphone body is mounted in a housing that defines a socket for receiving the ball. The microphone may be articulated on the ball and socket mount and the resistance to the articulation force may be varied by tightening and loosening a slotted cap that exerts a spring force on the microphone. The microphone and housing may be mounted to a surface such as a wall or ceiling and plenum ratings may be maintained through ceiling mounts.

Abstract: To stably obtain high acoustic resistance required for pressure equalization in a non-directional condenser microphone unit. A diaphragm 8 whose circumferential edge is attached to a diaphragm holder 4 and a fixed electrode 6 made of a metal material and arranged to face the diaphragm at a predetermined interval through an electrically insulating spacer 5 are provided, and the rear space of the above-mentioned diaphragm is closed to constitute the non-directional condenser microphone unit. A blind groove 16a is formed by an etching process at a portion which is in contact with the spacer 5 and in the fixed electrode 6 so that the rear space between the diaphragm and the fixed electrode may communicate with the outside, and a communication part formed between the groove 16a and the spacer 5 may be used as acoustic resistance for pressure equalization.

Abstract: A remote controlled robot system that includes a robot and a remote control station. The robot includes a binaural microphone system that is coupled to a speaker system of the remote control station. The binaural microphone system may include a pair of microphones located at opposite sides of a robot head. the location of the microphones roughly coincides with the location of ears on a human body. Such microphone location creates a mobile robot that more effectively simulates the tele-presence of an operator of the system. The robot may include two different microphone systems and the ability to switch between systems. For example, the robot may also include a zoom camera system and a directional microphone. The directional microphone may be utilized to capture sound from a direction that corresponds to an object zoomed upon by the camera system.

Abstract: An enclosure (10) of a microphone unit (1) includes a mounting portion (11) which has a mounting surface (11a) where a first vibration portion (13) and a second vibration portion (15) are mounted and in which, in the back surface (11b) of the mounting surface (11a), a first sound hole (23) and a second sound hole (25) are provided; in the enclosure (10), a first sound path (41) is provided that transmits sound waves input through the first sound hole (23) to one surface of a first diaphragm (134) and that also transmits the sound waves to one surface of a second diaphragm (154) and a second sound path (42) is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm (154).

Abstract: An implantable microphone that includes a hermetically-sealed, enclosed volume and an electret member and back plate disposed with a space therebetween and capacitively coupleable to provide an output signal indicative of acoustic signals incident upon at least one of the electret member and back plate. At least one of the electret member and the back plate may include a plurality of laterally offset portions located in corresponding spatial relation to a plurality of laterally offset regions including the lateral extent of the space. The output signal may be at least one of weighted and weightable in relation to the plurality of laterally offset portions. The electret member may include the plurality of laterally offset portions, and the laterally offset portions may include at least one positively charged dielectric material portion and at least one negatively charged dielectric material portion.

Abstract: A condenser microphone unit includes a diaphragm; a fixed electrode defining a capacitor together with the diagram; a cylindrical electrode having a first end and a second end, the first end being fitted to the periphery of the fixed electrode; a circuit board in contact with a second end of the cylindrical electrode, the circuit board being electrically connected to the cylindrical electrode; a unit casing accommodating the diaphragm, the fixed electrode, the cylindrical electrode, and the circuit board; and a hollow insulating air chamber provided between the internal peripheral surface of the unit casing and the external peripheral surface of the cylindrical electrode.

Abstract: An electro-acoustical transducer device includes a body structure (101) and a differential microphone (102) located in an aperture of a wall of the body structure. The microphone includes a front side for receiving an acoustical signal and a rear side for receiving the acoustical signal in modified form. The differential microphone is arranged to produce an electrical output signal proportional to the difference of the acoustical signals at the front and rear sides. The body structure is arranged to form a chamber (105) shared with the rear side of the microphone. There are tubular channels (107) to the chamber so that the channels and the chamber constitute an acoustical filter for filtering the acoustical signal falling to the rear side of the microphone. With proper design of the chamber and the channels, it is possible to achieve acoustical filtering for background noise rejection.

Abstract: A condenser microphone includes a plurality of condenser microphone units, each unit including a diaphragm and a fixed electrode one of which has an electret layer thereon. The condenser microphone units include respective sensitivity controllers changing sensitivities of the units. The sensitivity controllers include respective variable resistors connected between a power source and a ground. Each of the variable resistors has a slidable terminal connected to one, opposed to the electret layer, of the diaphragm and the fixed electrode, of the corresponding condenser microphone unit.

Abstract: The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure.

Abstract: A condenser microphone which prevents a directional axis from varying depending on a sound source frequency is provided. The condenser microphone includes a first reflector member 2 provided below the microphone unit 17 and covering an electronic circuit substrate 19 and a second reflector member 3 formed in the same shape as the first reflector member and provided above the microphone unit, the first reflector member and the second reflector member being disposed symmetrically with respect to the microphone unit.

Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.

Abstract: A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil.

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract: Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within a package arranged to allow the sensor to potentially receive a signal in less time. The package may have a cavity, and the cavity may be at least partly filled with an acoustical transducer.

Abstract: The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.

Abstract: A mobile wireless communications device includes a housing and circuit board in the housing and having radio frequency (RF) circuitry and a power amplifier and microphone mounted thereon. An antenna is carried within the housing and operative with the RF circuitry. An RF shield surrounds and isolates the microphone from the RF circuitry, power amplifier and antenna and shields the microphone from radiated energy generated from the RF circuitry, antenna or power amplifier.

Abstract: A microphone (130) is fitted with a mounting portion (130a) of a front case (12) in a state being set to a microphone folder (134). A metallic mesh-wise sheet (132) is attached to a front face of the microphone. When an EL sheet (110) on a rear face of the front case emits light by supplying power to it, electrical noise is radiated from the EL sheet. The mesh-wise sheet of the front face of the microphone blocks the electrical noise from the EL sheet, which may enter through a sound hole (131) to the inside of the microphone.

Abstract: A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a case (10) for accommodating the first vibrating part (14) and the second vibrating part (15), the case being provided with a first sound hole (132) and a second sound hole (133). The case (10) is provided with a first sound channel (41) for transmitting acoustic pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound channel (42) for transmitting acoustic pressure inputted from the second sound hole (133) to the other surface (152b) of the second diaphragm (152), and a sealed space (S) that faces the other surface (142b) of the first diaphragm (142).

Abstract: A mobile microphone assembly (10) has at least one microphone (40, 42) for generating an audio signal output (52) from sound impinging on the least one microphone, an acceleration sensor (48) for sensing the acceleration acting on the microphone assembly with regard to three orthogonal axes and for providing for an acceleration signal according to the sensed acceleration, and a control unit (50) for judging, by analyzing the acceleration signal, whether there is a drop-down event of the microphone assembly and for interrupting the audio signal output during a drop-down event.

Abstract: There is provided a capacitor microphone comprising a microphone capsule (100), which has an at least partially electrically conductive diaphragm (110) and a counterelectrode (120) associated therewith. The counterelectrode (120) has a printed circuit board (21) having a carrier of an insulating material (121a) and at least one electrically conductive surface (121b).

Abstract: Disclosed is a differential microphone unit which can improve the characteristics of a microphone unit and widen the directional range thereof. The disclosed differential microphone unit (100) is provided with: a microphone housing (20) which is provided with a pair of first sound holes (22a, 22b) on the same major surface (20a); a vibrating portion (11) which is disposed in the microphone housing and which vibrates according to differences in sound pressure transmitted via each of the pair of first sound holes; and sealing members (30, 130), which are disposed on the major surface of the microphone housing and which each contain a pair of second sound holes (31a, 31b, 131a, 131b) disposed so as to be in respective contact with the pair of first sound holes.

Abstract: A microphone includes a microphone unit having a diaphragm, a fixed electrode and a FET as an impedance converter; a plug outputting audio signals output from the microphone unit; and a jack into which audio signals inputted in the microphone unit are inputted. While the plug of the other microphone is inserted in the jack of the microphone, the audio signals output from the other microphone unit are added to the audio signals output from the microphone unit and are output.

Abstract: A transducer assembly utilizing at least two MEMS transducers is provided, the transducer assembly preferably defining either an omnidirectional or directional microphone. In addition to at least first and second MEMS transducers, the assembly includes a signal processing circuit electrically connected to the MEMS transducers, a plurality of terminal pads electrically connected to the signal processing circuit, and a transducer enclosure housing the first and second MEMS transducers. The MEMS transducers may be electrically connected to the signal processing circuit using either wire bonds or a flip-chip design. The signal processing circuit may be comprised of either a discrete circuit or an integrated circuit. The first and second MEMS transducers may be electrically connected in series or in parallel to the signal processing circuit. The first and second MEMS transducers may be acoustically coupled in series or in parallel.

Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

Abstract: The invention regards a hearing device with two or more microphone units each having a conduit leading from a respective sound inlet in the hearing-device housing to a respective transducer, wherein the lengths of the conduits may differ without causing a difference in the frequency characteristics of the microphone units and wherein ultrasonic frequencies may be dampened, while at the same time providing higher freedom in the physical layout of the hearing device. This is achieved in that each conduit comprises a chamber and a pipe forming a resonator, and in that the frequencies of resonance (f1, f2) of the resonators are equal.

Abstract: An air cushioned microphone cable retractor and receptacle assembly for use in controlling the deployment and retraction of a limited length of microphone cable includes a hollow cylindrical housing portion, in which a pulley mounted to a piston is disposed. A microphone cable is connected to the pulley, and then to the microphone, which is configured to reside in a top receptacle when not in use. In use, the microphone may be pulled out and away from the receptacle, at which time air above the piston is permitted to readily escape from above while the overall resistance is determined by operation of a lower relief valve. When the microphone is placed back in the receptacle, the weight of the piston pulls the cable back within the housing, with air venting structure providing an air damping feature to slow the retraction of the cable.

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract: A sensor system is located in an environment composed of a first medium, where waves propagate with a first phase velocity, the sensor system including at least one main enclosure and a sensor array with at least two sensors, said sensor array being arranged inside the main enclosure, wherein the space inside the main enclosure between the sensor array and the inner surface of the main enclosure is filled with a second medium, in which waves propagate with a second phase velocity, the second phase velocity being different from the first velocity.

Abstract: A dynamic microphone unit includes: a diaphragm vibrating in response to received sound waves; a voice coil fixed to the diaphragm and vibrating in cooperation with the diaphragm; a magnetic circuit generating magnetism in a magnetic gap, the voice coil being disposed in the magnetic gap; a first air chamber defined adjacent to the reverse of the diaphragm; and a second air chamber defined behind the voice coil, the second air chamber being in communication with the first air chamber, an elastic thin-plate acoustic resistor being disposed in the second air chamber while having tensile force applied, at a position where the acoustic resistor limits the volume of the second air chamber and comes into contact with the voice coil within a maximum displacement of the voice coil.

Abstract: A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

Abstract: A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components.

Abstract: A unidirectional dynamic microphone includes a grip housing, a microphone unit supported at a first end of the grip housing, a plug assembly attached to a second end of the grip housing and connected to the microphone unit through a lead line, and an air room serving as a part of an acoustic circuit of the microphone unit in the grip housing. The grip housing has a fitting part for the plug assembly and an expanded portion. The plug assembly fitted in the fitting part is fixed within the grip housing by an elastic ring and a pressure ring fitted in the expanded portion. The elastic ring seals a space between the grip housing and the plug assembly.

Abstract: A mobile computing device is disclosed. The mobile computing device comprises a first housing segment and a second housing segment that are slideably coupled to each other so that the mobile computing device can be in an extended position or a contracted position. The second housing segment includes a section that is overlaid by the first housing segment regardless of whether the mobile computing device is in the extended position or the contracted position. The mobile computing device also includes two microphones. A first microphone is provided with the second housing segment and is exposed to an opening of the second housing segment. A second microphone is provided at the overlaid section.

Abstract: A microphone has a slide member and a push member. The slide member has a slide knob, and a conductive state and a nonconductive state are switched according to operation of the slide knob. The push member holds a switch in the conductive state while a push button is pushed. A mechanism interlocking of the slide member and the push member is provided and interlocks operation of the slide member with the push member by converting movement of the slide member in a sliding direction into movement of the push member in a pushing direction, the slide knob and the push button are separated from each other in the sliding direction.

Abstract: There is provided a narrow directional condenser microphone having an acoustic tube, in which a condenser microphone unit having a large effective diaphragm area is arranged on the rear end portion side of the acoustic tube to achieve high sensitivity without an increase in the diameter of the acoustic tube. In a narrow directional condenser microphone in which a unidirectional condenser microphone unit configured by arranging a diaphragm and a backplate opposedly via a spacer is arranged on the rear end side of an acoustic tube 10, the narrow directional condenser microphone is provided with a unit pair assembly 20 configured by opposedly combining two of the condenser microphone units 20R and 20L with the diaphragm side thereof being parallel to each other, and the unit pair assembly 20 is arranged on the rear end side of the acoustic tube 10 in such a manner that the condenser microphone units 20R and 20L are arranged symmetrically with respect to the tube axis X of the acoustic tube 10.

Abstract: As described herein, a sound pickup for musical cymbals includes an integrated assembly attachable to a cymbal stand. The integrated assembly includes a plurality of microphones arranged and electrically connected such that the resulting amplified sound is of optimal quality and of relatively constant loudness regardless of cymbal tilt. In one embodiment, two microphones are used, with the signal phase from one microphone being inverted prior to combination with the signal from the other microphone. The inversion is implemented using an inverter and serves to cancel signals that are in phase with one another and augment signals that are out of phase with one another. This, along with suitable placement of the pickup, exploits the fact that the more desirable components of the cymbal's vibration at the inflection point of the cymbal are out of phase with each other, whereas the less-desirable components are in phase with each other.

Abstract: A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone.

Abstract: An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a stop. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate, and the MEMS apparatus is disposed over the port. The stop is disposed over the MEMS apparatus and configured to prevent movement of portions of the MEMS apparatus that would damage the portions of the MEMS apparatus.