Abstract: A system to facilitate analysis of component leads is provided and includes a device to form a picture of the leads, from which an image is extracted, to apportion the image and to perform first and second scans of the portions, and a processor, including a memory unit having a set of computer-readable executable instructions stored thereon, which, when executed, cause the processor to receive data of each scan, to establish a rule, based on the data of the first scan of any one portion, governing when to judge that the data of the second scan of the one portion indicates a defect, to determine rule compliance for each of the second scans, to judge that any one second scan in a non-compliance state indicates a defect, and to report a location of the defect. A display unit displays the report to a user.

Abstract: A method for scanning a surface with a number of different illumination configurations, the method comprises capturing a plurality of images in a sequential manner during a single sweep, each image including one or more lines of pixels, sequentially altering an illumination configuration used to capture the plurality of images according to a predefined sequence of illumination configurations and shifts of the relative position of the imaging unit for capturing each of the plurality of images, and repeating the sequence of illumination configurations settings and associated image capture positions until a desired area of the surface is scanned, wherein said predefined shift is between 10 pixels and less then one pixel.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates “ideal solder position information” and “ideal solder sizes” from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions.

Abstract: A method uses a time domain reflectometer (TDR) to determine unqualified clasps of a peripheral component interconnect (PCI) socket. A scanning electron microscope (SEM) captures an image of an unqualified clasp and magnifies the image from a nanometer scale to view the unqualified clasp. An electron spectroscopy for chemical analysis (ESCA) obtains a degree of oxidation at each position of the unqualified clasp in response to a determination that the unqualified clasp is oxidated. A Fourier transform infrared spectroscopy (FTIR) displays a position of the soldering flux using in response to the determination that the unqualified clasp comprises the soldering flux.

Abstract: The present invention relates to an automated electrical connection module for automatically attaching a junction box to a composite solar cell structure. The electrical connection module includes a thermode assembly having heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The electrical connection module further provides a vision system configured to capture images of the soldered connection between the junction box and the composite solar cell structure.

Abstract: A system and a method detect solder paste printing. The system includes a detecting device for detecting solder paste when a scraping blade pushes the solder paste to spread over a template to obtain information associated with the rolling speed of the solder paste, and a state-indicating device for generating a printing-state indication based on the information associated with the rolling speed of the solder paste. The method includes detecting the solder paste during rolling to obtain the information associated with the rolling speed of the solder paste, and generating a printing-state indication based on said information associated with the rolling speed of the solder paste. By detecting the solder paste during rolling to obtain the printing state, it is possible to monitor the printing state in real time, discover an abnormal condition in time, and reduce costs to the maximum extent.

Abstract: A pattern matching method includes: detecting an edge of a pattern in a pattern image obtained by imaging the pattern; segmenting the detected pattern edge to generate a first segment set consisting of first segments; segmenting a pattern edge on reference data which serves as a reference for evaluating the pattern to generate a second segment set consisting of second segments; combining any of the segments in the first segment set with any of the segments in the second segment set to define a segment pair consisting of first and second segments; calculating the compatibility coefficient between every two segment pairs in the defined segment pairs; defining new segment pairs by narrowing down the defined segment pairs by calculating local consistencies of the defined segment pairs on the basis of the calculated compatibility coefficients and by excluding segment pairs having lower local consistencies; determining an optimum segment pair by repeating the calculating the compatibility coefficient and the defini

Abstract: A solder printing inspection apparatus for inspection of solder printed on a circuit board has a multiplicity of lands for mounting of electronic components. The apparatus includes an irradiation unit for irradiating a light on the circuit board, an imaging unit for imaging the circuit board irradiated by the light, a solder bridge detection unit for detecting a solder bridge connecting two of the lands based on an image data imaged by the imaging unit, a distance calculation unit for calculating a bridge distance as distance between two lands contacting the solder bridge or solder bridging regions or solder detection frames corresponding to the two lands contacting the solder bridge, and a distance determination unit for determination of whether or not the bridge distance is within a permissible range.

Abstract: Disclosed is a pattern test method in which a drawing region is divided into a plurality of deflection regions determined by the deflection width of a deflector of a charged beam lithography apparatus, the charged beam lithography apparatus draws a pattern in each divided deflection region on the basis of pattern design data to obtain a sample, and a defect of the pattern on the sample is tested. The method determines the coordinates of a connecting portion of the deflection regions, divides the pattern design data into boundary region pattern data as the connecting portion of the deflection regions and pattern data except for the boundary region pattern data, and obtains image data of the pattern formed on the sample. The method then compares the boundary region pattern data with the image data.

Abstract: A system and method for high-speed alignment and inspection of components, such as BGA devices, having non-uniform features is provided. During training time of a machine vision system, a small subset of alignment significant blobs along with a quantum of geometric analysis for picking granularity is determined. Also, during training time, balls may be associated with groups, each of which may have its own set of parameters for inspection.

Abstract: A visual image retrieval system is provided. The system includes an image database for storing images. The system also includes a preprocessor communicatively linked to the image database for segmenting the images and generating based upon segmented images a region-of-interest (ROI) extraction output. Additionally, the system includes an ROI feature extraction module for computing ROI feature vectors based upon the output, and a global feature extraction module for computing global feature vectors based upon the output. The system further includes an ROI feature vectors database for storing the ROI feature vectors, and a global feature vectors database for storing the global feature vectors. The system also includes a perceptually-relevant image search machine (PRISM) interface for displaying query images and retrieved images, the retrieved images being retrieved in response to a user selecting at least one displayed query image.

Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.

Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.

Abstract: A failure analysis apparatus 10 is composed of an inspection information acquirer 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquirer 12 for acquiring layout information, and a failure analyzer 13 for analyzing a failure. The failure analyzer 13 extracts as a candidate interconnection for a failure, an interconnection passing an analysis region, out of a plurality of interconnections, using interconnection information to describe a configuration of interconnections in the semiconductor device by a pattern data group of interconnection patterns in respective layers, and, for extracting the candidate interconnection, it performs an equipotential trace of the interconnection patterns using the pattern data group, thereby extracting the candidate interconnection.

Abstract: An automated optical inspection system includes a pulsed light source illuminating an article to be inspected thereby to generate at least one image thereof, at least one camera having a field of view, and a relative motion provider operative to provide relative motion between the camera and at least one image of at least a portion of the article. The relative motion provider may include a first continuous motion provider and a second, velocity-during-imaging-lessening motion provider. The relative motion is a superposition of a first continuous component of motion provided by the first motion provider and a second, smaller component of motion provided by the second motion provider which lessens the velocity of the at least one image relative to the camera, during imaging.

Abstract: A method for inspecting a sample, consisting of receiving a definition of image attributes that are characteristic of defects, and processing an image of the sample so as to identify candidate defects on the sample. The method further includes forming distributions of values of the respective attributes from the candidate defects, and selecting a set of the candidate defects that are characterized by respective candidate attribute values that fall in one or more tails of the distributions. The selected set is presented to a human operator, and respective classifications of the candidate defects in the selected set are received from the operator. A definition of the one or more tails of the distributions is refined responsively to the classifications. The method may be used as a filter to remove false alarms, or nuisances. The method may also be used to categorize the candidate defects into two or more classes.

Abstract: A robot system having a vision sensor. The robot system includes a robot; a robot controlling section for controlling an operation of the robot; an imaging section provided on the robot and obtaining image data of a working environment of the robot; an image processing section for processing the image data obtained in the imaging section; a vision controlling section for controlling the imaging section and the image processing section to cause execution of obtaining the image data, transmitting the image data thus obtained, and processing the image data; and a communication network to which the robot controlling section, the image processing section and the vision controlling section are connected.

Abstract: Images of areas of a wafer are generated and registered with respect to computer aided design (CAD) data to provide a registered images. Defects in the wafer are then detected by comparing the registered images to one another and defect location information is generated in CAD coordinates.

Abstract: The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized.

Abstract: Provided is an image recognition method in which a first pattern area which is set inside a target to be recognized and a second pattern area which is set outside the target are used as a mask pattern. When a comparison circuit judges that a difference obtained by subtracting, by a differential circuit, the largest luminance value in the target image contained in the first pattern area, which is detected by a largest value detection circuit, from the smallest luminance value in the target image contained in the second pattern area, which is detected by the smallest value detection circuit, is larger than a certain offset amount, the matching judgement that a predetermined pattern is present is made. This recognition judgment is performed with the whole target image being scanned.

Abstract: A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge of the body of the component to be inspected is captured. By using the color condition, a component body area satisfying the color condition is extracted from the inspection image by an image process.

Abstract: There is provided a component mounting inspecting apparatus which can automatically set a solder bridge inspection region (an inspection point) and output an optimum inspection result of a solder bridge. The component mounting board inspecting apparatus for inspecting a solder bridge of an electronic circuit board, in which a plurality of electrode pads are formed at predetermined spaced intervals and cream solder is applied on the electrode pads, includes a mechanism for automatically determining a distance between adjacent electrode pads and a mechanism for automatically setting a solder bridge inspection point if the distance between the adjacent electrode pads is equal to or shorter than a threshold value.

Abstract: A photogrammetry system is provided, for examining a feature of interest of a workpiece, the feature of interest having a first constraint. The system comprises a library of constraints, including the known constraint of the feature of interest, a scanner for scanning the workpiece to obtain a scan of the feature of interest, a selector for selecting the one of the set of constraints from the library; and an analyzer, coupled to receive the scan of the feature from the scanner and to receive the one of the set of constraints from the selector, the analyzer including a processor for performing an analysis of the scan and the first constraint, to produce an examination result for the feature of interest.

Abstract: The shape of a cream solder is accurately detected, irrespective of a cream solder composition. An illumination setting section (95b) sets the intensity of infrared light radiated by an illuminating device (5), in accordance with the cream solder composition. An photographing device (6) irradiates a board applied with the cream solder with the infrared light having the light intensity set by the illuminating device (5). The photographing device (6) images the board irradiated with the infrared light by the illuminating device (5). As a result, an image including an image of light reflected from a surface of the board can be acquired.

Abstract: A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a surface of the electrode with the light beam; detecting a height of the electrode relative to the circuit board from data of the scanning of the electrode; scanning a surface of the solder near the electrode with the light beam; detecting a height of the solder relative to the circuit board from data of the scanning of the solder; and determining the solder joint condition between the electronic part and the solder based on the height of the electrode and the height of the solder relative to the circuit board.

Abstract: A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting the X-ray transmitted through the solder connection portion and for outputting a detection signal; and image forming means for forming and outputting a horizontal tomographic image of the solder connection portion on the basis of the detection signal. The horizontal tomographic image shows existence or nonexistence of a solder bump disposed on a side of the land.

Abstract: A component mounting system includes a solder printing inspection apparatus and a component mounting apparatus. The solder printing inspection apparatus includes an ideal solder position generation unit, an ideal loading position generation unit, an image processing unit, and an ideal solder inspection standard generation unit. The ideal solder position generation unit generates ideal solder position information, and the ideal loading position generation unit generates ideal loading position information. The image processing unit generates actual solder position information and loading estimate position information. The ideal solder inspection standard generation unit generates ideal solder inspection position information.

Abstract: A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating layer. A first solder having a first melting point constitutes the solder marker. The first electronic component is mounted on the insulating layer via a second solder having a second melting point lower than the first melting point.

Abstract: Unidirectional light is radiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is radiated onto the bump-formation surface in inclined directions to acquire a second overall image. First bump inspection images are respectively acquired from the first overall image, and second bump inspection images are respectively acquired from the second overall image. Then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Hereby, bump inspection with high precision and efficiency is achieved.

Abstract: An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates “ideal solder position information” and “ideal solder sizes” from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions.

Abstract: According to one embodiment, a method for processing one or more X-ray images includes: receiving at least one image of the one or more X-ray images, the one or more X-ray images being of an assembly extending along a plane; based on the at least one image, autonomously determining a respective displacement value for each of portions of the assembly with respect to one or more directions of the plane, each of the displacement values being determined relative to a respective actual value; storing the displacement values; and applying a rule to the stored displacement values, the rule being for determining a defect status of the assembly.

Abstract: A target object has its surface condition inspected by having its image taken from above while being irradiated by red, green and blue light beams at different elevation angles. An inspection area is set on the image and a direction is extracted on the image in which a change appears in the color phase according to the arrangement of the light sources and this extracted direction is compared with a preliminarily registered standard direction to judge the surface condition from the result of this comparison.

Abstract: A position detecting apparatus for detecting a position of an electronic component, which includes a terminal, includes an image acquiring unit for acquiring an image of the terminal, a terminal area detecting unit for detecting an area of the terminal from the image acquired by the image acquiring unit and an electronic component position detecting unit for detecting a position of the electronic component based on the area of the terminal detected by the terminal area detecting unit and predetermined terminal information of the electronic component.

Abstract: A mask inspection method and system. Provided is a mask fabrication database describing geometrical shapes S to be printed as part of a mask pattern on a reticle to fabricate a mask through use of a mask fabrication tooling. The shapes S appear on the mask as shapes S? upon being printed. At least one of the shapes S? may be geometrically distorted relative to a corresponding at least one of the shapes S due to a lack of precision in the mask fabrication tooling. Also provided is a mask inspection database to be used for inspecting the mask after the mask has been fabricated by the mask fabrication tooling. The mask inspection database describes shapes S? approximating the shapes S?. A geometric distortion between the shapes S? and S? is less than a corresponding geometric distortion between the shapes S? and S.

Abstract: In the fabrication of a semiconductor integrated circuit device, a 2D-3D inspection technique for solder printed on a substrate is provided which permits easy preparation of data and easy visual confirmation of a defective portion. In a substrate inspecting step, first, a 3D inspection is performed, followed by execution of 2D inspection, whereby a 2D picked-up image of the portion of a pad determined to be defective can be displayed on a larger scale simultaneously with the end of inspection, thereby providing an environment for efficient visual confirmation of the defect. Further, by subjecting a raw substrate to measurement at the time of preparing inspection data, a relation between an original height measurement reference generated automatically by the inspection system and the height of a pad upper surface is checked, whereby it is possible to measure the height and volume of printed solder based on the pad upper surface.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.

Abstract: An inspection method utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.

Abstract: A characteristic amount calculating device for soldering inspection. The characteristic amount calculating device includes a design information inputting section for inputting design information of an inspection object, an inspection standard inputting section for inputting an inspection standard, a solder shape calculating section for calculating shape information of a solder fillet according to the design information, and an inspection image calculating section for calculating an inspection image according to the shape information.

Abstract: In a gray level image, the direction and the magnitude of a level gradient are found for each of pixels. With respect to the pixel having a level gradient whose magnitude exceeds a predetermined value, a line segment having a predetermined length is drawn in the direction of the level gradient from the pixel or a position spaced apart from the pixel by a predetermined distance. The luminance level of the line segment corresponds to the magnitude of the level gradient. A portion where a lot of line segments are overlapped with one another or a portion where the line segments are concentrated is detected, to recognize the center, the corners, etc. of an object appearing on the image.

Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

Abstract: The invention provides methods and apparatuses for finding features that are similar in the image. The invention finds the similar features by searching portions of the image for features that are substantially similar to a feature prototype. First, individual features in the image are located and designated candidate features, and optionally a spatial pattern representing a majority of the candidate features is generated. Next, feature profiles are generated therefrom, and the feature prototype is constructed using at least a subset of feature profiles. An example is described wherein the object is a ball grid array, the similar features are the solder balls on the ball grid array, the feature profiles are local images of balls of a ball grid array, and the feature prototype is an average of a sub-set of the local images of the balls.

Abstract: Procedure for determining modifications made to an electronic card and methods of fabricating an electronic card and an item of equipment provided with an electronic card. According to the invention, a first diagram (S1) illustrating the electronic card, which includes the electronic components (CE1, CE2, CE3), ports (P1, P2), supply elements (A1) and connection means (L1 to L7) at a first moment is determined, a second diagram illustrating the electronic card at a second moment is determined, a class relating to a change is assigned to each entity in said diagrams, a visual identification attribute is associated with each entity, which is representative of its class, two images corresponding to the first and second diagrams are constructed with the visual identification attributes being displayed, and said images are compared in order to deduce therefrom the modifications made to the electronic card between the first and second moments.

Abstract: An initial similarity candidate calculator calculates a similarity between first and second images, which are expressed by quantized DCT coefficients, on the basis of at least first and second image feature amounts of the first and second images. A coefficient conversion processor executes a coefficient conversion process for at least one of the first and second image feature amounts. Based on an image feature amount obtained by that process, a similarity calculator calculates a similarity between the first and second images. Then, a final similarity between the first and second images is determined from the calculated similarities.

Abstract: A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has bee

Abstract: The invention relates to connection of corresponding points measured by a computer vision system. The points are indicated by an illuminator (LASER), by means of which several points can be illuminated on the surface of the object at the same time. A camera system (CAM1, CAM2) measures the positions of the points. Using a data system (DTE), projection images are generated from a three-dimensional model of the object, in which images the positions of the points are calculated. To locate the actual point in the image perceived by the cameras, a search is performed in an area in the neighborhood of coordinates calculated from the point in the projection image. The point thus located can be connected to the perceptions of the other cameras by the aid of the projection images. After the corresponding points have been found, the actual three-dimensional coordinates of the measured point are calculated.

Abstract: A high-speed image acquisition system includes a source of light; a sensor for acquiring a plurality of images of the target; a system for determining relative movement between the source and the target; and an image processor for processing the acquired images to generate inspection information relative to the target. The system has an extended dynamic range provided by controlling illumination such that the plurality of images is acquired at two or more different illumination levels. In some embodiments, the high-speed image acquisition system is used to perform three dimensional phase profilometry inspection.