Abstract: A receptacle of an electrical-optical hybrid connector including a plug having an insertion fitting part and the receptacle having a housing space that receives the insertion fitting part includes an optical connection part disposed in a space in communication with the housing space, and an electrical connection part disposed in front of the optical connection part, a shutter that is opened when the receptacle and the plug are connected to each other is provided in front of the optical connection part of the receptacle, and the optical connection part of the receptacle moves forward in association with the shutter when the shutter is opened, and moves rearward in association with the shutter when the shutter is closed.

Abstract: A structure includes a channel waveguide and a pocket adjacent to an input facet of the channel waveguide. A laser having an output facet is positioned in the pocket. The structure includes a stop on either the laser or a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.

Abstract: An optical phase modulator and modulation method is disclosed. An optical splitter diverts a portion of an input light signal into at least one diverted light signal, and at least one optical amplifier amplifies the at least one diverted light signal to provide at least one amplified light signal. At least one static phase shifter statically phase shifts the at least one amplified light signal to provide at least one phase-shifted diverted light signal, and an optical combiner combines the input light signal with the at least one phase-shifted diverted light signal to provide a phase-shifted combined light signal.

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract: The various technologies presented herein relate to phase shifting light to facilitate any of light switching, modulation, amplification, etc. Structures are presented where a second layer is juxtaposed between a first layer and a third layer with respective doping facilitating formation of p-n junctions at the interface between the first layer and the second layer, and between the second layer and the third layer. Application of a bias causes a carrier concentration change to occur at the p-n junctions which causes a shift in the effective refractive index per incremental change in an applied bias voltage. The effective refractive index enhancement can occur in both reverse bias and forward bias. The structure can be incorporated into a waveguide, an optical resonator, a vertical junction device, a horizontal junction device, a Mach-Zehnder interferometer, a tuneable optical filter, etc.

Abstract: A photoelectric converting module includes a circuit board, a locating frame fixed on the circuit board, and a photoelectric coupling element. The photoelectric coupling element includes a bottom surface. The bottom surface defines a groove. A shape of the groove coincides with that of the locating frame and a size of the groove is slightly greater than that of the locating frame. The groove receives the locating frame.

Abstract: A well voltage supply cell includes third gate electrode group (including a third gate electrode corresponding to a first gate electrode) located symmetrically to first gate electrode group (including the first gate electrode constituting an access transistor) of a first SRAM cell, fourth gate electrode group (including a fourth gate electrode corresponding to a second gate electrode) located symmetrically to second gate electrode group (including the second gate electrode constituting an access transistor) of a second SRAM cell. a P-type impurity diffusion region located on a P well between the third gate electrode and the fourth gate electrode located opposite to each other, a first N-type impurity diffusion region located on the side of the third gate electrode closer to the first SRAM cell, and a second N-type impurity diffusion region located on the side of the fourth gate electrode closer to the second SRAM cell.

Abstract: A method of manufacturing an optical interconnect includes 3D printing a plurality of non-intersecting and spaced apart optical waveguides from a material that guides electromagnetic waves in the optical spectrum after being cross-linked or polymerized in a region activated by the 3D printing. At least some of the optical waveguides change direction at least once by about 90°. The method further includes encasing at least each end of the optical waveguides with a material having a lower index of refraction than the material from which the optical waveguides are formed by 3D printing, to secure the optical waveguides. A corresponding 3D printing apparatus is also described.

Abstract: The disclosure relates to a chip carrier, suitable for being inserted into a corresponding substrate. The light emitting/receiving chip mounted on the chip carrier is disposed within the corresponding substrate and aligned to the waveguide embedded in the corresponding substrate with an appropriate distance.

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract: A 1D nanobeam photonic crystal cavity is provided that includes a substrate, where the substrate includes a dielectric medium, and a series of cutout features in the substrate, where each cutout feature includes a first curved surface and a second curved surface, where the first curved surface and the second curved surface form a meniscus shape, where the series of cutout features include an array of sizes of the meniscus shape cutouts, where edges of the meniscus shape and the array of sizes are disposed to form a pair of opposing parabolic dips proximal to a central region of the series of cutout features.

Abstract: An optical communication device includes a planar optical waveguide, a circuit board, a light emitting element, and a light receiving element. The circuit board includes a mounting surface. Both the light emitting element and the light receiving element are supported on the mounting surface. The planar optical waveguide is buried in the circuit board. The planar optical waveguide includes a first sloped surface and a second sloped surface respectively on two opposite ends of the planar optical waveguide. The mounting surface defines a first light guide hole aligning with the first sloped surface and a second light guide hole aligning with the second sloped surface. The light emitting element is aligned with the first sloped surface through the first light guide hole. The light receiving element is aligned with the second sloped surface through the second light guide hole.

Abstract: Sacrificial optical test structures are constructed upon a wafer of pre-cleaved optical chips for testing the optical functions of the pre-cleaved optical chips. The sacrificial optical structures are disabled upon the cleaving the optical chips from the wafer and the cleaved optical chips can be used for their desired end functions. The test structures may remain on the cleaved optical chips or they may be discarded.

Abstract: [Problem to be Solved] To make the strength of bonding between an optical semiconductor element and a flexible printed circuit board compatible with the precision of the mounting position of the optical semiconductor element.

Abstract: An optical waveguide device includes a wiring substrate, a connection pad formed in the wiring substrate, an optical waveguide is which a first cladding layer, a core layer, and a second cladding layer are formed of the wiring substrate in this order, an opening portion formed in the second cladding layer in a region including the connection pad, a contact hole formed at least in the first cladding layer on the connection pad, and being communicated with the opening portion of the second cladding layer, an optical element, including a connection terminal, connected to the connection pad through the contact hole, and underfill resin filled in the opening portion of the second cladding layer and the contact hole, and sealing a lower side of the optical element, wherein a part of the opening portion or the second cladding layer in exposed from the optical element.

Abstract: An optical-electric converting module includes a printed circuit board (PCB) and an optical-electric coupling element. The PCB includes a supporting surface, laser diodes and photo diodes. The laser diodes and the photo diodes are positioned on the supporting surface. The optical-electric coupling element includes a lower surface. The lower surface defines a cavity. A bottom portion of the first cavity forms light-receiving coupling lenses and light-emitting coupling lenses. The optical-electric coupling element is positioned on the supporting surface, with each light-receiving coupling lens being aligned with a laser diode, and each light-emitting coupling lens being aligned with a photo diode. A distance between the light-receiving coupling lenses and the laser diodes is equal to a distance between the light-emitting coupling lenses and the photo diodes in a direction perpendicular to the support surface.

Abstract: A waveguide lens includes a substrate, a planar waveguide formed on the substrate and configured to couple with a laser light source that emits a laser beam into the planar waveguide along an optical axis, and a media grating film including two media gratings with a gap intervening therebetween. Each media grating is symmetrical about a widthwise central axis. Each widthwise central axis and the optical axis are substantially parallel with each other and cooperatively define a plane that is substantially perpendicular to the planar waveguide.

Abstract: Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.

Abstract: An optical switch includes: a semiconductor substrate, including a first rotation part and a first torsion beam disposed at two ends of the first rotation part, where the first torsion beam is configured to drive the first rotation part to rotate; a microreflector, disposed on a surface of the first rotation part of the semiconductor substrate; a first latching structure, disposed on a surface of the first torsion beam, the first latching structure including a form self remolding (FSR) material layer and a thermal field source, where the thermal field source is configured to provide a thermal field for the FSR material layer and the FSR material layer is configured to undergo form remolding under the thermal field, so as to latch the first rotation part and the microreflector in a position after rotation.

Abstract: An optical coupling module for a silicon photonics chip in which a grating is formed on an optical waveguide, and a material having an intermediate refractive index between refractive indexes of a core and a cladding for side surface optical coupling of the silicon photonics chip is provided. The optical coupling module which is optically coupled with an internal/external optical fiber comprises a core transmitting light, and a cladding covering the core and holding the light in the core through total internal reflection, wherein a grating is formed at one end of the core, and a refractive element is formed between the one end of the core and the cladding, has an intermediate refractive index between the refractive indexes of the core and the cladding, and is optically coupled with the internal/external optical fiber.

Abstract: This invention concerns real-time multi-impairment signal performance monitoring. In particular it concerns an optical device, for instance a monolithic integrated photonics chip, comprising a waveguide having an input region to receive a signal for characterization, and a narrow band CW laser signal. A non-linear waveguide region to mix the two received signals. More than one output region, each equipped with bandpass filters that extract respective discrete frequency bands of the RF spectrum of the mixed signals. And, also comprising (slow) power detectors to output the extracted discrete frequency banded signals.

Abstract: An optical interposer comprising: (a) a substrate having a planar surface: (b) at least one groove defined in the planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end perpendicular to side walls, the facet having a first angle relative to the planar surface, the first angle being about 45 degrees; and (c) a reflective coating on the first facet.

Abstract: A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: Improvement of signal integrity, a size reduction of a device, and the like are realized. A semiconductor integrated circuit section 11 and an optical wiring section 21 are electrically connected to each other by a connection section 31 provided between a face of the semiconductor integrated circuit section 11 and a face of the optical wiring section 21 facing each other. An electrical wiring 23 is provided in an optical wiring section 21. The electrical wiring 23 of the optical wiring section 21 functions as a global wiring electrically connecting between a plurality of circuit blocks CB provided in the semiconductor integrated circuit section 11.

Abstract: Light guiding structures are provided to improve the light coupling between photonic active devices and the top of a metallization layer stack interconnecting these photonic active devices. Each light guiding structure comprises a hole extending between the near surface of the photonic active devices and the top surface of the metallization layer stack, said hole being filled with dielectrics or a combination of dielectrics and metals. Such a light guiding structure removes from the optical path of light rays, the interfaces between the metallization layers, thereby confining light laterally and enabling interconnects with increased thickness and more levels of metal. This results in the suppression of multiple reflections and optical crosstalk. The light guiding structures can have cross-section diagonals with sub-wavelength dimensions can be fabricated after all CMOS process steps, thus having minimal interference and maximal compatibility with CMOS processing.

Abstract: In an optical component, a part of a waveguide type optical device is fixed to a convex portion of a mount. The optical component includes an optical device support base, a pressure member and a pressure support base. The optical device support base is interposed between the mount and the presser member enough to be slidable in a direction parallel to surfaces of the mount and the presser member.

Abstract: A method of forming an integrated photonic semiconductor structure having a photonic device and adjacent CMOS devices may include depositing a first silicon nitride layer over the adjacent CMOS devices and depositing an oxide layer over the first silicon nitride layer, wherein the oxide layer conformally covers the first silicon nitride layer and the underlying adjacent CMOS devices to form a substantially planarized surface over the adjacent CMOS devices. A second silicon nitride layer is then deposited over the oxide layer and a region corresponding to forming the photonic device. A germanium layer is deposited over the oxide layer and the region corresponding to forming the photonic device. The germanium layer deposited over the adjacent CMOS devices is etched to form a germanium active layer within the photonic region, whereby the oxide layer and the second silicon nitride layer protect the adjacent CMOS devices during the etching of the germanium.

Abstract: Frequency standards based on mode-locked fiber lasers, fiber amplifiers and fiber-based ultra-broad bandwidth light sources, and applications of the same.

Abstract: An optical system may include an optical multiplexer or demultiplexer circuit having a slab with a propagation region. The propagation region may have a first propagation section and a second propagation section, such that a portion of the first propagation section and a portion of the second propagation section overlap each other to form a shared propagation section. The shared propagation section may include both the portion of the first propagation section and the portion of the second propagation section. The first propagation section and the second propagation section may each have a first end and a second end. The optical system may further include multiple waveguides directly connected to the second end of the first propagation section and directly connected to the second end of the second propagation section.

Abstract: A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region.

Abstract: A method for producing an optical assembly includes the steps of forming an optical semiconductor device including a substrate, a recess and an first optical waveguide, the optical semiconductor device having a principal surface, the recess extending from the principal surface to a middle portion of the substrate; forming an optical waveguide device including a through-hole and a second optical waveguide; positioning the optical semiconductor device and the optical waveguide device so that the principal surface of the optical semiconductor device and a back surface of the optical waveguide device face each other; aligning the optical semiconductor device and the optical waveguide device by inserting a guide pin into the through-hole and the recess so that the first optical waveguide is optically coupled with the second optical waveguide; and joining the optical semiconductor device and the optical waveguide device to each other.

Abstract: An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding layer over the LD die and the adhesive layer. The method still further includes curing the molding layer and partially removing the molding layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure.

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract: An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package.

Abstract: An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.

Abstract: An optical module has a circuit board, a photoelectric conversion element mounted on a mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board and electrically connected to the photoelectric conversion element, and a plate-shaped supporting substrate arranged to sandwich the optical coupling member between the supporting substrate and the circuit board. An electrically conductive metal foil which extends in a thickness direction of the supporting substrate is provided integrally with a side surface of the supporting substrate, and the metal foil is connected at one end thereof to an electrode provided on a non-mount surface of the circuit board.

Abstract: An optical module includes a photoelectric conversion element optically connected to an optical fiber, a plate-shaped substrate mounting the photoelectric conversion element, coupling members fixed to both end portions of the substrate so as to sandwich the photoelectric conversion element, and a cover member coupled to the substrate by the coupling members so as to cover at least a portion of the substrate.

Abstract: A process of manufacturing an optical flexible circuit comprising: (a) disposing an adhesive layer on at least a portion of a carrier film, said adhesive layer having a downward adhesive face and an upward adhesive face, said downward adhesive face and said carrier film being configured such that said carrier film is removable from said downward adhesive face without disruption of said downward adhesive face; (b) routing one or more fibers on said upward adhesive layer; (c) coating said fibers to define an optical circuit; and (d) optionally parting said carrier film to separate said optical circuit from other optical circuits on said carrier film.

Abstract: A plasmon generator includes a first portion and a second portion that are adjacent in a first direction orthogonal to the direction of travel of light propagating through a core. The second portion includes a front end face located in a medium facing surface of a magnetic head. The core has a concave portion recessed from the top surface of the core. At least part of the first portion is received in the concave portion. The concave portion has a surface including an evanescent light generating portion. The first portion includes a plasmon exciting portion opposed to the evanescent light generating portion. The evanescent light generating portion is inclined relative to a first surface.

Abstract: Conventional approaches to integrating waveguides within standard electronic processes typically involve using a dielectric layer, such as polysilicon, single-crystalline silicon, or silicon nitride, within the in-foundry process or depositing and patterning a dielectric layer in the backend as a post-foundry process. In the present approach, the back-end of the silicon handle is etched away after in-foundry processing to expose voids or trenches defined using standard in-foundry processing (e.g., complementary metal-oxide-semiconductor (CMOS) processing). Depositing dielectric material into a void or trench yields an optical waveguide integrated within the front-end of the wafer. For example, a shallow trench isolation (STI) layer formed in-foundry may serve as a high-resolution patterning waveguide template in a damascene process within the front end of a die or wafer.

Abstract: An optical integrated circuit (IC) is provided that includes a waveguide to propagate light in the IC. A diffractive element, such as a grating, couples light between the waveguide and an external optical connector. At least one alignment feature is lithographically formed in the optical IC to facilitate precise positioning of the optical connector on the optical IC. Since the alignment feature is lithographically formed in a precise relation to the diffractive element, the optical connector can be accurately positioned and optically coupled to the optical IC. Complex optical-feedback-based alignment equipment and operations to achieve optical coupling of the optical connector with the waveguide in the optical IC are not necessary.

Abstract: An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.

Abstract: An optical communication apparatus includes a PCB, a photoelectric element, a driver chip, and a light waveguide. The PCB defines a groove in a surface thereof. The groove includes a bottom surface and a side surface connected to the bottom surface. The PCB includes a reflecting layer coated on the side surface. The photoelectric element includes an optical portion for emitting/receiving light carrying optical signals. An optical signal emitting/receiving direction of the photoelectric element is substantially perpendicular to the surface of the PCB. The side surface passes through a projection area of the optical portion along a direction substantially perpendicular to the surface of the PCB. An end of the light waveguide is positioned on the bottom surface of the groove and is out of the projection area of the optical portion. The reflecting layer couples optical signals between the photoelectric element and the light waveguide.

Abstract: An interposer for an optical module includes a first substrate having an optical device mounting part on which an optical device is mounted, and a second substrate including a connection via electrically connected to a terminal pattern of the optical device mounting part. The first and second substrates are coupled with each other while forming a predetermined inclination angle therebetween.

Abstract: Embodiments of the present disclosure describe techniques and configurations for decreasing optical loss in a waveguide of a modulator device. In one embodiment, an apparatus includes a substrate, and a waveguide of a modulator device formed on the substrate, the waveguide having a first portion that is configured to receive light for propagation along the waveguide, a second portion that includes two slots formed in the waveguide that merge into a single slot, the second portion being coupled with the first portion, a third portion that includes the single slot formed in the waveguide, the third portion being coupled with the second portion, a fourth portion that includes another two slots formed in the waveguide, the another two slots branching from the single slot, the fourth portion being coupled with the third portion, and a fifth portion that is configured to output the propagated light, the fifth portion being coupled with the fourth portion. Other embodiments may be described and/or claimed.

Abstract: An optical module includes: a first circuit board that has a first edge connector and a connector socket; and an optical transceiver module that is electrically connected to the first circuit board via the connector socket. The optical transceiver module includes a second circuit board on which an E/O converter, a drive circuit that drives the E/O converter, an O/E converter, and a current-to-voltage conversion circuit that converts an output current of the O/E converter into a voltage signal are mounted. The second circuit board has a second edge connector corresponding to the connector socket mounted on the first circuit board. Signal lines of the drive circuit are pulled out from the drive circuit in a first direction. Signal lines of the current-to-voltage conversion circuit are pulled out from the current-to-voltage conversion circuit in a second direction that is substantially opposite to the first direction.

Abstract: Methods for wavelength filtering and structures for accomplishing the same. Wavelength filtering includes forming grooves in a waveguide to define angled surfaces in a path of the waveguide; forming a reflective layer on the angled surfaces; depositing cladding material on top of the waveguide and on the angled surfaces; forming a filter layer on an active region of an opto-electronic device, which transmits a single wavelength and reflects other wavelengths used; depositing the opto-electrical device on the cladding layer such that the filter layer is aligned with a point of incidence of a light beam reflected from the reflective layer; and electrically bonding the opto-electronic device to vias in the waveguide structure.

Abstract: An apparatus including a waveguide region configured to guide light propagating along a first direction; a reflector region configured to reflect incident light; an interference region formed between the waveguide region and the reflector region, the interference region configured to confine at least a portion of interference light formed by the incident light and the reflected incident light; and a grating region including a grating formed on a region confining at least a portion of the interference light, the grating configured to couple at least a portion of the light along a second direction that is different from the first direction.

Abstract: A planar lightwave circuit (PLC) is disclosed having fixed thereto a coupling tube for coupling an optical fiber. The PLC comprises a planar optical substrate having in it an optical waveguide having an optical aperture located on an edge surface of the optical substrate and a tube formed having a lumen dimensioned to receive an optical fiber ferrule and an edge surface fixed to the substrate edge surface so that a cross section of the lumen at the edge surface is aligned with the optical aperture.

Abstract: Apparatus and method are provided for transmitting at least one electro-magnetic radiation is provided. In particular, at least one optical fiber having at least one end extending along a first axis may be provided. Further, a light transmissive optical arrangement may be provided in optical cooperation with the optical fiber. The optical arrangement may have a first surface having a portion that is perpendicular to a second axis, and a second surface which includes a curved portion. The first axis can be provided at a particular angle that is more than 0° and less than 90° with respect to the second axis.