Abstract: A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.

Abstract: Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.

Abstract: Method and devices of controlling wavelengths in two-channel DEMUX/MUX in silicon photonics are provided. The two-channel DEMUX/MUX includes a waveguide-based delay-line-interferometer at least in receiver portion of a two-channel transceiver for DWDM optical transmission loop and is configured to split a light wave with combined two-wavelengths into one light wave with locked one channel wavelength and another light wave with locked another channel wavelength. The waveguide-based delayed-line interferometer (DLI) is characterized by a free-spectral-range configured to be equal to twice of channel spacing. The method includes tuning heater of DLI in receiver of each two-channel transceiver by using either low-frequency dither signals added on MZMs associated with respective two channels as feedback signal or one DFB laser wavelength tapped from an input of transmitter portion at one channel before or after the MZMs as a direct wavelength reference to feed into an output of receiver portion at another channel.

Abstract: A hybrid optical device includes an optical bench chip, a laser chip with a laser waveguide flip-chip bonded onto the optical bench chip, and an optical waveguide chip with an optical device waveguide disposed adjacent the optical bench chip. The optical bench chip has multiple “U” shaped alignment optical waveguides and the optical waveguide chip has multiple alignment optical waveguides, and the pitches of the various sets of alignment waveguides are different. A misalignment between the laser waveguide and the optical bench chip is compensated for by aligning the optical waveguide chip to different positions of the optical bench chip using the multiple alignment optical waveguides on the optical bench chip and the optical waveguide chip, without turning on the laser, so that the laser waveguide of the laser chip is aligned with the optical device waveguide of the optical device chip.

Abstract: The invention relates to a method for forming a deposit of a fragile material on a substrate (3) by spraying a powder (1) of said material, said method including the following steps: producing an aerosol containing said powder (1) in a so-called aerosol chamber (10); accelerating the aerosol through a nozzle (31) in a so-called deposition chamber (30) having a negative pressure relative to the aerosol chamber (10); and spraying the aerosol onto the substrate (3), wherein the grains constituting the powder (1) fragment and form said deposit upon impact with the substrate (3), said method being characterized in that the formation of the deposit is controlled on the basis of a three-dimensional digital model of said deposit. The invention also relates to a device for implementing said method.

Abstract: The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

Abstract: An optical module includes a flexible printed circuit board on which a light receiving element and/or a light emitting element is mounted face-down as an optical element, and having a part that transmits incoming light to the light receiving element and/or outgoing light from the light emitting element; a lens member disposed on a surface of the printed circuit board, on which the optical element is not mounted, and integrally formed to have within a predetermined area, a lens that transmits the incoming and/or the outgoing light, and a convex part abutting the printed circuit board; a bonding member disposed in an area other than the predetermined area, between the printed circuit board and the lens member, and that bonds the printed circuit board and the lens member; and a cooling member disposed to apply pressure to the optical element toward the printed circuit board and cool the optical element.

Abstract: An optical communication transmitting device includes a substrate, a first layer with a first optical refractive index formed on the substrate, a waveguide unit formed with a second optical refractive index formed on the first layer, and a second layer with a third optical refractive index covered on the top of the waveguide unit. The second optical refractive index is greater than the first optical refractive index. The second optical refractive index is greater than the third optical refractive index. The waveguide unit is formed from a photo-resistor layer by a high energy light source exposure.

Abstract: One embodiment provides an integrated circuit including a first non-planar structure and a waveguide configured to provide electromagnetic waves to the first non-planar structure. The first non-planar structure provides a first signal in response to at least some of the electromagnetic waves.

Abstract: The present disclosure allows connection between optical and electrical devices at high frequencies and high bit rate. The present disclosure provides an electro-optical device that includes an optical interface for optical signal transmission and reception; an electrical interface for electrical signal transmission and reception; a data and signal unit located inside an integrated circuit chip coupled to the optical interface and to the electrical interface for manipulating data received through said interfaces; and a processing unit located inside the integrated circuit chip coupled to the optical interface and to the electrical interface for processing digital data received through said interfaces. The present disclosure provides devices that achieve smaller physical dimensions with an increased number of interfaces to allow greater throughput of data into and out of the integrated circuit.

Abstract: Since a cross section of at least a partial segment of a first core has a step-like shape including a quadrilateral shape of a main part and a quadrilateral shape of a protruding part protruding from the main part, respective effective refractive indices of TE polarized waves in the first core and in the second core differ from each other.

Abstract: An optical wiring substrate includes an insulation layer including a resin, and a conductor layer formed on the insulation layer and including a metal and an inclined surface inclined relative to an optical axis of an optical fiber. A first wiring pattern and a second wiring pattern are formed in the conductor layer, the first wiring pattern including a first connecting part to which a first electrode of a photoelectric conversion element is connected, and the second wiring pattern including a second connecting part to which a second electrode of the photoelectric conversion element is connected. A distance between the first wiring pattern and the second wiring pattern is narrowest between the first connecting part and the second connecting part. A distance between the first connecting part and the second connecting part is less than a dimension of the conductor layer in a thickness direction thereof.

Abstract: An optical waveguide device in which optical characteristics are less degraded even when a branch angle in a Y branch portion of an optical waveguide is great is provided.

Abstract: Even in the case of an optical module including a multi-chip integrated device, an optical module having a smaller size in consideration of the connection to optical fibers. An optical module having a package containing a multi-chip integrated device integrated with an optical functional element having both ends connected to planar lightwave circuits (PLCs) is provided. Each of the PLCs includes a folded waveguide for connecting a light waveguide formed in the optical functional element to optical fibers. The optical module comprises a connecting part connected to each of the PLCs for connecting the optical functional element to the optical fibers in the same face. The optical fibers are taken out from opposed surfaces of the package.

Abstract: A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of leadframes, the batch processing including laser diode chips attachment, wirebonding, and packaging, with subsequent breakout of individual packaged laser diodes from the one- or two-dimensional array.

Abstract: An optical device includes: a first cladding layer; a core layer disposed on the first cladding layer and, with increase in its sectional area, extending from a first end which receives/outputs light along a direction from the first end toward a second end; a slab layer disposed on the first cladding layer and extending to the second end along the direction from the first end toward the second end; a rib layer disposed on the slab layer and, with decrease in its sectional area, extending to the second end along the direction from the first end toward the second end; and a second cladding layer disposed on the core layer and the rib layer. The core layer and both of the slab and rib layers are optically coupled in a part in which the sectional are of the core and rib layers is the maximum.

Abstract: An analytical assembly within a unified device structure for integration into an analytical system. The analytical assembly is scalable and includes a plurality of analytical devices, each of which includes a reaction cell, an optical sensor, and at least one optical element positioned in optical communication with both the reaction cell and the sensor and which delivers optical signals from the cell to the sensor. Additional elements are optionally integrated into the analytical assembly. Methods for forming and operating the analytical system are also disclosed.

Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.

Abstract: An optical circuit board including a top face, a bottom face, an optical layer buried between bottom and top faces, the optical layer being adapted to transmit optical signals, an opto-electronic component adapted to emit or receive light transmitted through the optical layer, a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component.

Abstract: An optical modulating apparatus includes driver that is mounted on a printed circuit board such that a signal electrode pad and a ground electrode pad of the driver are exposed in an opening of the printed circuit board. An optical modulating device is mounted on the printed circuit board, opposing the driver across the opening. A flexible circuit board is disposed in the opening. An end of a signal terminal of the flexible circuit board is electrically connected to a signal electrode of the optical modulating device. An end of a ground terminal of the flexible circuit board is electrically connected to a ground electrode of the optical modulating device. The other end of the signal terminal is soldered to the signal electrode pad of the driver, and the other end of the ground terminal is soldered to the ground electrode pad of the driver.

Abstract: System and methods for detecting analytes are provided. The system includes a plasmonic interferometer with a first surface having a first and second scattering element and an aperture disposed between the first scattering element and the second scattering element. A first distance between the aperture and the first scattering element and a second distance between the aperture and the second scattering element are selected to provide interference of light at the slit. The system also includes a light source for illuminating the first surface of the plasmonic interferometer, a detector positioned for detecting light transmitted through the aperture, and a sample holder for disposing a sample to be analyzed onto the first surface of the plasmonic interferometer.

Abstract: A transceiver includes an optical waveguide and a first filter optically coupled to the optical waveguide and operable to filter a first optical signal in a first wavelength band propagating downstream. A center wavelength of the first wavelength band is tunable. The transceiver also includes a first receiver optically coupled to the first filter and a second filter optically coupled to the optical waveguide and operable to filter a second optical signal in a second wavelength band propagating downstream. The second wavelength band is different from the first wavelength band. The transceiver further includes a second receiver optically coupled to the second filter to receive the second optical signal and a laser optically coupled to the optical waveguide and operable to output radiation in a third wavelength band propagating upstream. The third wavelength band is different from both the first wavelength band and the second wavelength band.

Abstract: A light emitting device package including light emitting devices, and optical lenses respectively disposed over the light emitting devices. Further, a respective optical lens includes an extending member extending from a body of the respective optical lens, and including a first portion laterally extending in a first direction substantially perpendicular to the central axis of the respective light emitting device, and a second portion extending towards the substrate in a second direction substantially parallel with the central axis of the respective light emitting device. A vertical cross section of the second portion is substantially symmetrical with respect to an axis that is spaced apart in the first direction from and substantially parallel with the central axis of the respective light emitting device.

Abstract: An optical interconnection for a stacked integrated circuit, is provided. The optical interconnection includes: an optical transmission unit disposed in a first layer and an optical receiving unit disposed in a second layer, different from the first layer, and spaced apart from the optical transmission unit by a predetermined gap. The optical transmission unit includes a first optical antenna that outputs light; the optical receiving unit includes a second optical antenna which receives light transmitted from the optical transmission unit. At least one of the first and second optical antennas includes a plurality of nanostructures configured to transmit or receive an optical signal.

Abstract: An optical waveguide type optical terminator forms an optical waveguide structure including at least an optical absorption core (103) which is formed on a clad layer (102) and includes a portion composed of silicon in which an impurity of 1019 cm?3 or more is doped, and is used by being optically connected in series with an optical waveguide including a core (105) composed of silicon. The optical absorption core (103) is sufficient provided that, at least, an impurity of around 1019 cm?3 is doped therein. For example, its impurity concentration is sufficient provided that it falls within a range of 1019-1020 cm?3. The existence of this impurity causes absorption of light in the optical absorption core (103).

Abstract: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

Abstract: Systems and methods are disclosed for converting a legacy 850 nm optical-fiber link in a data center to a 1310 nm optical-fiber link. The methods include accessing the primary optical fiber of the legacy 850 nm optical-fiber link and optically connecting thereto one or more sections of compensating optical fiber. The resulting 1310 nm link has a peak wavelength of nominally 1310 nm and supports a bandwidth of greater than 2 GHz·km and a data rate of at least 25 Gb/s.

Abstract: An optical system includes a substrate and a first waveguide embedded on the substrate. The first waveguide has a first end. The optical system also includes an optical fiber optically coupled to the first waveguide and bounded to the substrate. The optical fiber has a first end with a flat portion forming a D-shaped cross section. The flat portion of the first end of the optical fiber is disposed adjacent to the first end of the first waveguide, thereby facilitating optical coupling between the first waveguide and the optical fiber.

Abstract: An optical communication device includes a light emitting element including a light emitting surface, a first substrate coating the light emitting element, a light receiving element including a light receiving surface, a second substrate coating the light receiving element, a planar optical waveguide, a first reflecting element including a first sloped surface, and a second reflecting element including a second sloped surface. The first substrate includes a first supporting surface. The first supporting surface defines a first light guiding hole spatially corresponding to the light emitting surface. The second substrate includes a second supporting surface. The second supporting surface defines a second light guiding hole spatially corresponding to the light receiving surface. The planar optical waveguide is positioned on the first supporting surface and the second supporting surface.

Abstract: In one form, a multi-chip module for a multi-mode receiver includes an MCM substrate and first and second demodulator die. The MCM substrate has first and second satellite input ports, first and second terrestrial/cable input ports, and first and second transport stream ports. The first demodulator die has a satellite port coupled to the first satellite input port of the MCM substrate, a terrestrial/cable port coupled to the first terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate. The second demodulator die has a satellite port coupled to the second satellite input port of the MCM substrate, a terrestrial/cable port coupled to the second terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate.

Abstract: Described herein is a system for transmitting an optical signal from a first location to a second location. The system may include first and second mounting fixtures, a reception module, an optical fiber, and a transmission module. The first fixture may define at least a first cavity and a first aperture at the bottom of the cavity. The reception module may be disposed in the cavity, and include a reflector for receiving the optical signal from a first direction through the first aperture and redirecting the optical signal in another direction. The optical fiber may be for receiving the optical signal from the reflector. The second fixture may define at least a second cavity and a second aperture on the side of the cavity. The transmission module may be disposed in the second cavity and direct the optical signal from the optical fiber through the second aperture.

Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

Abstract: A device includes a memory and a processor coupled to the memory operable to perform operations. The operations include determining a first estimated distance associated with a first location of an optical fiber based on first light detected by a sensor, where the first light is detected at a first time when a portion of the optical fiber has a first configuration, and determining a second estimated distance associated with a second location of the optical fiber based on second light detected by the sensor, where the second light is detected at a second time when the portion of the optical fiber has a second configuration. The operations further include determining a third estimated distance associated with a third location of the optical fiber based on the first estimated distance and the second estimated distance, where the third location is associated with a fault in the optical fiber.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Abstract: A photonic integrated circuit includes optical circuitry fabricated over an underlying circuitry layer. The optical circuitry includes a dielectric material having recesses disposed within, layers of a light waveguide material deposited within the recesses, and lenses disposed over each layer of waveguide material. The underlying circuitry layer may include, for example, a semiconductor wafer as well as circuitry fabricated during front end of line (FEOL) semiconductor manufacturing such as, for example, sources, gates, drains, interconnects, contacts, resistors, and other circuitry that may be manufactured during FEOL processes. The underlying circuitry layer may also include circuitry manufactured during back end of line semiconductor manufacturing processes such as, for example, interconnect structures, metallization layers, and contacts.

Abstract: An optical waveguide device includes a wiring substrate, a connection pad formed in the wiring substrate, an optical waveguide in which a first cladding layer, a core layer, and a second cladding layer are formed of the wiring substrate in this order, an opening portion formed in the second cladding layer in a region including the connection pad, a contact hole formed at least in the first cladding layer on the connection pad, and being communicated with the opening portion of the second cladding layer, an optical element, including a connection terminal, connected to the connection pad through the contact hole, and underfill resin filled in the opening portion of the second cladding layer and the contact hole, and sealing a lower side of the optical element, wherein a part of the opening portion or the second cladding layer is exposed from the optical element.

Abstract: An optical waveguide device includes a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer, an optical waveguide formed on the insulating layer and the wiring layer, a groove portion formed on an edge side of the optical waveguide, the groove portion including an inclined face, a light path conversion mirror formed on the inclined face, and an opening portion formed in the wiring layer under the optical waveguide, wherein the wiring layer is not formed under the groove portion.

Abstract: An optical waveguide includes a printed circuit board, a waveguide, a light emitter, a light receiver, a transparent driver, and a transparent processor. The driver and the processor are received in and mounted to the printed circuit board through a flip-chip method. The light emitter and the light receiver are mounted to the driver and the processor, respectively, through the flip-chip method. The planar waveguide is attached to a side of the printed circuit board opposite to the light emitter and the light receiver. The driver drives the light emitter to emit light according to input signals. This light is directed onto the light receiver through the driver, the planar waveguide, and the processor. The light receiver converts the light into electrical signals. The processor processes the electrical signals to obtain the input signals.

Abstract: An optical receptacle includes a first optical surface which receives incidence of light, a reflecting surface which reflects light along a substrate, a light separating section which separates light from the reflecting surface into monitor light and signal light, a second optical surface which emits the monitor light toward a light receiving element, and a third optical surface which emits the signal light. The light separating section includes a plurality of separating units each including a vertical splitting transmissive surface, an inclining splitting reflecting surface and a parallel splitting stepped surface. In the light separating section, 4 to 6 separating units are disposed within a region where light reflected at the reflecting surface is incident. A height of a boundary between the splitting transmissive surface and the splitting stepped surface with respect to a virtual plane including the splitting reflecting surface is 13 to 21 ?m.

Abstract: A disclosed optical semiconductor element includes: a semiconductor substrate having a first main surface and a second main surface in which a plurality of first grooves are formed; a first optical waveguide defined by portions of the semiconductor substrate between the first grooves and having side faces defined by the first grooves; and a photoelectric converter configured to transmit or receive an optical signal propagating through the first optical waveguide. Moreover, the first grooves define part of a guide hole.

Abstract: A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.

Abstract: A light emitting device and a light receiving device are in a bare chip form and are a light emitting device of surface emitting type and a light receiving device of surface receiving type having an electrode on an opposite surface of a light emitting portion and a light receiving portion respectively, the light emitting device, the light receiving device, and an optical waveguide are mounted on one surface of a flexible printed wiring board body, the light emitting portion of the light emitting device, an optical waveguide core, and the light receiving portion of the light receiving device are arranged substantially coaxially, and the light emitting device and the light receiving device are mounted in such a way that a light emitting/receiving direction is substantially 90° with respect to an orthogonal direction of a surface of the flexible printed wiring board body.

Abstract: The disclosure relates to a method for manufacturing a photoaligning integrated large area metallic stamp, which includes the following steps: making a unit device PLC mold pattern, and molding a unit PLC device pattern through a multistep imprinting method using the PLC mold pattern; heat treating the unit PLC device pattern to minimize scattering loss due to surface roughness; making a groove pattern for supporting an optical fiber; making an integrated PDMS mold for a unit device by aligning the unit PLC device pattern and the groove pattern; and repeatedly replicating the integrated PDMS mold for a unit device to make a large area PDMS pattern, and making a large area stamp through electroforming using the large area PDMS pattern.

Abstract: A heat dissipation system and method are embodied in an optical subassembly (OSA) that mechanically couples with an electrical subassembly (ESA) of an optical communications module. When the OSA is coupled with the ESA, a heat dissipation block that is embedded in the OSA is spaced apart from components of the ESA by a small air gap. At least a portion of the heat that is generated by one or more of these components passes into the heat dissipation block, which extends through top and bottom surfaces of the OSA. Because the heat dissipation block never makes physical contact with the ESA or with components of the ESA, there is no risk of the block damaging the ESA or detrimentally affecting the electrical performance of the module.

Abstract: A wavelength-tunable optical transmission apparatus including an optical array unit comprising a plurality of light sources whose wavelengths are changed, an optical driving unit configured to receive an electrical signal transmitted from an external circuit, generate the current and input the generated current to the optical array unit, and a control unit configured to control the magnitude of current input to the optical array unit by controlling the optical driving unit.

Abstract: Disclosed is a multi-channel receiver optical sub assembly. The a multi-channel receiver optical sub assembly includes: a multi-channel PD array, in which a plurality of photodiodes (PDs) disposed on a first capacitor, and including receiving areas disposed at centers thereof and anode electrode pads arranged in an opposite direction at an angle of 180 degrees based on the receiving areas between the adjacent PDs is monolithically integrated; a plurality of transimpedance amplifiers (TIAs) arranged on a plurality of second capacitors, respectively, and connected with the anode pads of the respective PDs through wire bonding; a submount on which the first capacitor.

Abstract: This invention relates to structures for mounting LEDs, the structures being suitable for use in the manufacture of light guide devices. This invention also relates to light guide devices comprising the structures and methods of manufacture of the aforementioned. The light guide devices are suitable for use in a range of applications, particularly in connection with the backlighting of displays, for example, liquid crystal displays.

Abstract: A system includes optical modules. Each module includes a different base and one or more module waveguides on the base. Module waveguides from different modules are aligned such that the aligned module waveguides exchange light signals. At least a portion of one of the aligned module waveguides is between the base of one of the modules and the base of another module. First electronics operate a transmitter on a first one of the optical modules so as to generate one of the light signals. Second electronics operate a receiver on a second one of the modules such that the electronics generate an electrical signal in response to the receiver receiving one of the light signals.

Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates a unitary substrate comprising a plurality of staggered light redirecting features on an input surface thereof directing incoming light from optical fibers through the substrate towards optical elements to be coupled with.