Abstract: Consistent with an aspect of the present disclosure, an optical communication apparatus is provided that transmits a WDM signal including a plurality of optical channels, wherein each channel has a corresponding one of a plurality of wavelengths. Each of the plurality of optical channels includes optical signals having first (e.g., TE) and second (e.g., TM) polarizations. In one example, each polarized optical signal is modulated in accordance with an identifying tone. The optical channels are combined onto a waveguide, and an optical tap connected or coupled to the waveguide supplies a portion of the WDM signal including a composite of the optical channels to a photodiode. The aggregate power received by the photodiode includes the power associated with each optical channel, and the power of each channel is the sum of the powers of individual polarized optical signals within that channel.

Abstract: An optical component optically coupled to an optical fiber includes a substrate and an edge-emitting laser. The substrate includes an accommodating cavity, a plurality of openings, a waveguide, an optical coupler and a plurality of pads. The waveguide and the optical coupler are distributed outside the accommodating cavity. The openings are distributed at the bottom surface of the accommodating cavity and the pads are located at the bottom of the openings. The optical coupler is optically coupled to an end of the waveguide and includes a light-incident surface. The edge-emitting laser is embedded in the accommodating cavity and includes a light-emitting layer and a plurality of bumps located in the openings and electrically connected to the pads. The ratio of the level height difference between the light-emitting layer and the optical coupler to the thickness of the optical coupler ranges from 0 to 0.5.

Abstract: An optical engine for data communication includes a substrate, an array of optical semiconductor devices mounted on the substrate, a device lens block mounted on the substrate and formed with a cavity for accommodating the array of optical semiconductor devices, a jumper lens block coupled with the device lens block at an upper surface thereof, and a fiber array mounted on the jumper lens block and optically coupled with the array of optical semiconductor devices. The jumper lens block is aligned with the device lens block by alignment posts and notches. A metal latch is used to hold the jumper lens block on the device lens block.

Abstract: The present invention relates to optical vias to optically connect multilevel optical circuits. In one example, the optical via includes a surface plasmon polariton waveguide, and a first optical waveguide formed on a first substrate is coupled to a second optical waveguide formed on a second substrate by the surface plasmon polariton waveguide. In some embodiments, the first optical waveguide includes a transition region configured to convert light from an optical mode to a surface plasmon polariton mode or from a surface plasmon polariton mode to an optical mode.

Abstract: A method to control a wavelength tunable laser diode (tunable LD) is disclosed. The tunable LD includes a SG-DFB region and a CSG-DBR region to tune the emission wavelength thereof. The CSG-DBR region includes three segments, where the refractive indices of respective segments are variable by heaters provided therein. When the electrical power supplied to two segments is optionally selected, the power supplied to the rest segment is corrected by an offset from a value reflecting physical dimensions of the heaters. The offset is determined such that the tunable LD shows the best side mode suppression ratio (SMSR).

Abstract: Component carrier for electrical/electronic components, for example for the combination with a lock housing or as a component of a lock housing of a motor vehicle door lock, comprising a carrier element and a conductor track structure of individual metallic conductor tracks, which can be connected to the carrier element, wherein the conductor track structure is composed of at least two conductor track partial structures, each having a different material thickness, of the associated conductor tracks.

Abstract: The optical device includes a waveguide positioned on a base and a modulator positioned on the base. The modulator includes an electro-absorption medium. The waveguide is configured to guide a light signal through the modulator such that the light signal is guided through the electro-absorption medium. A heater is positioned on the electro-absorption medium such that the electro-absorption medium is between the base and the heater.

Abstract: A photoelectric conversion module is proposed. The photoelectric conversion module comprises two parts, interposer and optical bench. At least one optical element is configured on the interposer. The interposer is configured on a first concave portion of the optical bench. A first lens array is configured under the interposer to align the at least one optical element. A mirror is configured under the first lens array, with an optical micro-reflection surface. A second lens array is configured left side of the mirror.

Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

Abstract: Methods for manufacturing and using an optical or optoelectronic device are disclosed. The optical or optoelectronic device and related methods may be useful as an optical or optoelectronic transceiver or for the processing of optical signals. The optical or optoelectronic device generally comprises a light-transmitting medium configured to transmit a first light beam; a light-receiving unit configured to receive and process a focused, reflected light beam; a first mirror or beam splitter configured to reflect at least a first portion of the transmitted light beam away from the light-receiving unit; a lens configured to focus the reflected light beam; and a second mirror configured to reflect the focused, reflected light beam towards the light-receiving unit.

Abstract: An optical engine includes a fiber joint, a fiber pad, and a photoelectric module. The fiber joint, has a fiber installation part and an optical signal output part. The fiber installation part is for accommodating a plurality of fibers, the optical signal output part includes a plurality of fiber positioning through holes running through the optical signal part. Each fiber plugs into one terminal of each positioning through hole and outputs an optical signal via the other terminal of the positioning through hole. The fiber pad is disposed on the fiber installation part and has a plurality of fiber guiding grooves for guiding the fibers to the corresponding fiber positioning through holes. The photoelectric module has a plurality of photoelectric components. Each photoelectric component is aligned with one of the positioning through holes for converting the optical signals coming from the fiber positioning through holes into electric signals.

Abstract: Described herein is a system for transmitting an optical signal from a first location to a second location. The system may include first and second mounting fixtures, a reception module, an optical fiber, and a transmission module. The first fixture may define at least a first cavity and a first aperture at the bottom of the cavity. The reception module may be disposed in the cavity, and include a reflector for receiving the optical signal from a first direction through the first aperture and redirecting the optical signal in another direction. The optical fiber may be for receiving the optical signal from the reflector. The second fixture may define at least a second cavity and a second aperture on the side of the cavity. The transmission module may be disposed in the second cavity and direct the optical signal from the optical fiber through the second aperture.

Abstract: A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

Abstract: A method to manufacture an optoelectronic assembly comprises a step of structuring a first wafer to provide a plurality of optical components to change a beam of light in the optoelectronic assembly with a respective alignment structure being formed to couple the respective optical component to an optical connector. A second wafer is provided with a plurality of optoelectronic components. The first and second wafer are stacked on top of each other, aligned and bonded together. The bonded first and second wafers are separated into a plurality of optoelectronic modules. The optical connector is manufactured by structuring a third wafer so that the third wafer is provided with a plurality of optical connectors. The third wafer is separated into a plurality of the optical connectors. The optical fiber is coupled to one of the optical connectors and then is coupled to one of the separated optoelectronic modules.

Abstract: A method is provided for fabricating a semiconductor testing structure. The method includes providing a substrate having a to-be-tested device structure formed on a surface of the substrate, a dielectric layer formed on the surface of the substrate and a surface of the to-be-tested structure, and conductive structures and an insulation layer electrically insulating the conductive structures formed on a first surface of the dielectric layer. The method also includes planarizing the conductive structures and the insulation layer to remove the conductive structures and the insulation layer until the first surface of the dielectric layer is exposed; and bonding the first surface of the dielectric layer with a dummy wafer by an adhesive layer. Further, the method includes removing the substrate to expose a second surface relative to the first surface of the dielectric layer of the dielectric layer and a surface of the to-be-tested device structure.

Abstract: A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.

Abstract: An optical waveguide sheet, includes: an optical path; and a clad member that covers the optical path, wherein the clad member has a portion formed by removing a part of the clad member which is on a first surface of an optical waveguide sheet on which the optical component is to be mounted and is provided within an area which is unused for propagation of light input to and output from the optical component.

Abstract: A compact polarization beam splitter is formed by cascading two stages of three restricted MMIs. Each MIMI is configured to set ultra compact width and length for a rectangular waveguide body to limit no more than 4 modes therein working as a polarization beam splitter in a 50 nm wavelength window around 1300 nm. Each MMI is further configured to couple an input at a first end and a TE bar output and a TM cross output at a second end of the rectangular waveguide body. The locations of the input/output waveguide ports are designated to be a distance of ? of the width away from a middle line from the first end to the second end. Two second-stage MMIs have their inputs coupled to the TE bar output and the TM cross output of the first-stage MMI and provide a second-stage TE bar output and a second-stage TM cross output, respectively.

Abstract: A photoelectric hybrid device includes an optical connector on a flat optical surface at one end of vertical optical waveguides for inputting and outputting an optical signal. Integration of the photoelectric hybrid device into an interposer or the like is standardized. The photoelectric hybrid device includes: conductive pins connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member having a flat optical surface and a translucent part; and self-organizing optical waveguides that form an optical path between the translucent part and an optical waveguide. The flat optical surface is not lower than the tops of the electrical connection parts on the conductive pins. Collision of the optical connector and the tops of the electrical connection parts can be avoided when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides.

Abstract: A printed circuit board with an acoustic channel for a microphone and a portable electronic device having such a printed circuit board are provided. In accordance with one embodiment, there is provided a microphone assembly, comprising: a printed circuit board (PCB) comprising a board body having at least one signal trace, the printed circuit board defining an acoustic channel within the board body which extends between a microphone aperture in the board body and a plurality of inlet openings in the board body.

Abstract: An optical module includes: a substrate; a wiring pattern; and a cover material. The wiring pattern includes, on the substrate, an electrode portion having a predetermined width and a signal line having a width smaller than the predetermined width and connected to the electrode portion. The cover material covers a part of the electrode portion and the signal line.

Abstract: An optical, directional coupler has a first input, a second input, a first output, and a second output. The coupler is made with a shoulder disposed on a substrate and a first ridge and a second ridge disposed on the shoulder. The first ridge extends from the first input to the first output. The second ridge extends from the second input to the second output. The shoulder, the first ridge, and the second ridge taper to provide coupling and are modified to select a coupling ratio.

Abstract: An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10?15 seconds to 10?11 seconds.

Abstract: [Task] Reduction in crosstalk between signal electrodes. [Means for Resolution] An optical modulator 1 includes a relay substrate 3 including a substrate portion 30, and signal electrodes 31 and 32, and a ground electrode 33 which are provided on the substrate portion 30, and an optical waveguide substrate 4 including an electrode-optical substrate 40, signal electrodes 431 and 432, and an optical waveguide 42 which are provided on the electro-optical substrate 40.

Abstract: An electro-optic modulator device includes a modulation region, a reflecting region, a conductive line and an anti-reflecting region. The modulation region includes a doped region. The reflecting region is over the modulation region. The conductive line is connected to the doped region. The conductive line extends through the reflecting region. The anti-reflecting region is on an opposite surface of the modulation region from the reflecting region.

Abstract: An integrated optical modulator device. The device can include a driver module coupled to an optical modulator. The optical modulator is characterized by a raised cosine transfer function. This optical modulator can be coupled to a light source and a bias control module, which is configured to apply an off-quadrature bias to the optical modulator. This bias can be accomplished by applying an inverse of the modulator transfer function to the optical modulator in order to minimize a noise variance. This compression function can result in an optimized increased top eye opening for a signal associated with the optical modulator. Furthermore, the optical modulator can be coupled to an EDFA (Erbium Doped Fiber Amplifier) that is coupled to a filter coupled an O/E (Optical-to-Electrical) receiver.

Abstract: Provided is a substrate with a lens, including: a substrate; a columnar member provided on one surface side of the substrate; and a lens member provided on the columnar member. While arbitrarily selecting the height of the lens, the lens is formed in a uniform and desired shape. Thus, the distance between the lens and another optical member can be reduced and the pitch of the lens can be reduced.

Abstract: Athermal arrayed waveguide grating wavelength division multiplexers applicable to a relatively wide temperature range. One athermal arrayed waveguide grating wavelength division multiplexer includes a base board including an arrayed waveguide grating chip, wherein the base board and the arrayed waveguide grating chip are divided into a first portion and a second portion through at least one division plane; and a sliding deflection component positioned on the base board including a first end and a second end which are respectively fixed on the first portion and the second portion, the sliding deflection component including: a telescopic rod having a length that changes with temperature variation, a first sidewall and a second sidewall positioned at two ends of the telescopic rod, respectively, and a first deflection limiting piece fixed on one side of the telescopic rod.

Abstract: The present disclosure provides a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system may comprise: a clock component, and at least two sets of millimeter-wave receiving/transmitting channels. The clock component is configured to provide a clock signal to sending ends and receiving ends of the two sets of millimeter-wave receiving/sending channels respectively. Each set of millimeter-wave receiving/sending channels comprises: a transmitter component, a receiver component and a transmission waveguide. The transmission waveguide is located between the transmitter component and the receiver component and is configured to provide a channel for millimeter-wave transmission. The top face, side face and/or bottom face of the transmission waveguide, except for active devices and accessories thereof, are plated with a metal conductive wall to form an electromagnetic shield from a transmission waveguide in an adjacent millimeter-wave receiving/sending channel.

Abstract: The invention relates to a motor vehicle having a storage for electrical energy, which store is coupled to a coil into which electrical energy can be induced from outside the motor vehicle during a charging process. The vehicle includes a housing in which the coil is arranged, the housing being made of plastic toward the underside of the motor vehicle, and an optical waveguide is arranged in particular between two walls of the housing. When light from a light source is coupled into the optical waveguide and a detector detects the light, damage to the housing can be detected and the induction of electrical energy into the coil at a charging station can optionally be interrupted in order to avoid hazards to persons.

Abstract: The optical waveguide includes: a lower clad layer, a core layer, an upper clad layer, a substrate, and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate, the mirror being formed on the core layer, in which the substrate has an opening, the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 ?m or less. The optical waveguide is capable of transmitting a light signal regardless of the type of the substrate, suppressing the spread of a light signal reflected from the mirror, and transmitting a light signal with a low optical transmission loss.

Abstract: The disclosure is directed to systems for providing illumination to a measurement head for optical metrology. In some embodiments of the disclosure, illumination beams from a plurality of illumination sources are combined to deliver illumination at one or more selected wavelengths to the measurement head. In some embodiments of the disclosure, intensity and/or spatial coherence of illumination delivered to the measurement head is controlled. In some embodiments of the disclosure, illumination at one or more selected wavelengths is delivered from a broadband illumination source configured for providing illumination at a continuous range of wavelengths.

Abstract: An optical module includes: an optical modulator that includes a plurality of electrodes and that performs an optical modulation process by using electrical signals input to the electrodes; and a flexible substrate that has flexibility and has a plurality of wiring patterns used for transferring the electrical signals each of which is input to a different one of the electrodes. The optical modulator includes: a plurality of connecting members that connect together the electrodes and the wiring patterns; and at least one protrusion that has a ground voltage, is connected to the flexible substrate while being positioned on a line segment connecting together two of the connecting members positioned adjacent to each other, and has a cross section of which the size measured in the direction perpendicular to the line segment is larger than the size of the cross section of each of the connecting members.

Abstract: The present disclosure relates to an optical sensor module, an optical sensing accessory, and an optical sensing device. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory and an optical sensing device comprise the optical sensor module and other electronic modules to have further applications.

Abstract: A method of manufacturing an integrated circuit including photonic components on a silicon layer and a laser made of a III-V group material includes providing the silicon layer positioned on a first insulating layer that is positioned on a support. First trenches are etched through the silicon layer and stop on the first insulating layer, and the first trenches are covered with a silicon nitride layer. Second trenches are etched through a portion of the silicon layer, and the first and second trenches are filled with silicon oxide, which are planarized. The method further includes removing the support and the first insulating layer, and bonding a wafer including a III-V group heterostructure on the rear surface of the silicon layer.

Abstract: An optical communication device includes a planar optical waveguide, a substrate, a light emitting element, a light receiving element, a first optical waveguide, and a second optical waveguide. The substrate is supported over the planar optical waveguide. The light emitting element and the light receiving element are electrically connected to the substrate. The planar optical waveguide defines a first guide hole and a second guide hole. The substrate defines a first receiving hole and a second receiving hole. The first optical waveguide includes a first sloped surface and is received in the first guide hole and the first receiving hole, such that the first sloped surface aligns with the light emitting element. The second optical waveguide includes a second sloped surface and is received in the second guide hole and the second receiving hole, such that the second sloped surface aligns with the light emitting element.

Abstract: A laser array mux assembly generally includes an array of laser emitters coupled to an optical multiplexer, such as an arrayed waveguide grating (AWG), with an external partial reflector after the multiplexer. Each of the laser emitters may include a gain region that emits light across a range of wavelengths including, for example, channel wavelengths in an optical communication system. The AWG filters the emitted light from each of the laser emitters at different channel wavelengths associated with each of the laser emitters. The reflector reflects at least a portion of the filtered light such that lasing occurs at the channel wavelengths of the reflected light. The laser array mux assembly may be used to generate an optical signal at a selected channel wavelength or to generate and combine optical signals at multiple channel wavelengths.

Abstract: An apparatus includes a polymer waveguide having a doped region, with amplifying dopant, separating a first un-doped region and a second un-doped region. The doped region being doped with an amplifying dopant. An optical pump source illuminates the doped region to allow light to transmit from the first un-doped region to the second un-doped region.

Abstract: A method for producing a plurality of optoelectronic components may include measuring at least one measurement parameter for a first optoelectronic component and a second optoelectronic component, and processing the first optoelectronic component and the second optoelectronic component taking account of the measured measurement parameter value of the first optoelectronic component and the measured measurement parameter value of the second optoelectronic component, such that the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component are changed in a different way toward at least one common predefined optoelectronic target property. The processing of at least one value of a measurement parameter of the optoelectronic properties of the first optoelectronic component or of the optoelectronic properties of the second optoelectronic component toward the optoelectronic target property is formed by means of a compensation element.

Abstract: An optical module includes: a light emitting element; an optical waveguide configured to guide light emitted from the light emitting element; and an optical fiber configured to be optically coupled to the optical waveguide, wherein, when an aperture angle of light incident into a core of the optical waveguide is NA1, a core diameter of the optical waveguide is w1, a core diameter of the optical fiber is w2, and a ratio of w1 to w2 is R, an optical system performance index a represented by a=NA1×(w1/w2)=NA1×R meets a condition of a<0.15, and the range of the ratio R meets a condition of 4.38a2+1.63a+0.16<R<?13.09a2?1.04a+0.95.

Abstract: An optical waveguide in a semiconductor material, may include, between two adjacent portions of the waveguide, a plurality of parallel strips of alternating conductivity types forming a plurality of opposing bipolar junctions between the two adjacent portions.

Abstract: A connection module includes a module body and a module circuit board arrangement. The module body defines a first port and an open first end providing access to the first port. The module circuit board arrangement extends across the open first end within a peripheral boundary defined by the module body. The module circuit board arrangement includes at least a first contact set that extends into the first port of the module body; an electronic controller that is electrically connected to the first contact set; and a circuit board connector facing outwardly from the module board arrangement. Example connection modules include optical adapters and electrical jacks.

Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source.

Abstract: An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding layer over the LD die and the adhesive layer. The method still further includes curing the molding layer and partially removing the molding layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure.

Abstract: A structure comprises a substrate having a plateau region and a trench region, a reflecting layer formed over a top surface of the trench region, a first adhesion promoter layer formed over the reflecting layer, a bottom cladding layer deposited over the first adhesion promoter layer, a core layer formed over the bottom cladding layer and a top cladding layer formed over the core layer.

Abstract: In one form, a multi-chip module for a multi-mode receiver includes an MCM substrate and first and second demodulator die. The MCM substrate has first and second satellite input ports, first and second terrestrial/cable input ports, and first and second transport stream ports. The first demodulator die has a satellite port coupled to the first satellite input port of the MCM substrate, a terrestrial/cable port coupled to the first terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate. The second demodulator die has a satellite port coupled to the second satellite input port of the MCM substrate, a terrestrial/cable port coupled to the second terrestrial/cable input port of the MCM substrate, and first and second transport stream ports coupled to the first and second transport stream ports of the MCM substrate.

Abstract: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Abstract: An object of the present invention is to provide a switch unit for optical signals which is capable of reducing an area required for arrangement and reducing manufacturing costs, and a switch apparatus including the switch unit. A switch unit 30 according to one embodiment of the present invention includes two optical switch arrays 34a, 34b arranged to face in opposite directions and in parallel on a substrate. The two optical switch arrays extend along a surface of a chip, and each have four optical switches 31 arranged in parallel. Such a configuration makes it possible to reduce the size of the switch unit because in an excess region of one of the optical switch array, the other optical switch array is disposed.

Abstract: A method for fabrication of a device (206) from a wafer (170) of semiconductor material includes locally thinning the wafer in an area of the device to a predefined thickness by removing the semiconductor material from at least a first side of the wafer using a wet etching process, and etching through the thinned wafer in the area of the device so as to release a moving part (202) of the device. Other methods and systems for fabrication are also described.