Abstract: Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

Abstract: An assembly of two fiber optic ferrules allows for the mating of a CWDM fiber optic ferrule with a non-CWDM fiber optic ferrule. The CWDM fiber optic ferrule has optical fibers that carry optical beams with at least two different wavelengths, which the non-CWDM ferrule has optical fibers that carry only one wavelength. The CWDM fiber optic ferrule and the non-CWDM fiber optic ferrule have optical fibers that are inserted along parallel axes. The non-CWDM fiber optic ferrule has a lens pitch that matches the CWDM ferrule.

Abstract: The present disclosure relates to protecting splices of multiple optical fibers with a low-profile multi-fiber splice protector and a compact splice on furcation housing. The present disclosure also relates to optimal fiber wiring patterns within an optical fiber cable assembly.

Abstract: Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

Abstract: A surface-emitting laser package comprises: a substrate; a surface-emitting laser device disposed on the substrate, and having a non-emitting area and an emitting area which includes a plurality of emitters each generating a first laser beam; a housing disposed around the surface-emitting laser device; and a diffusing part disposed on the surface-emitting laser device. The emitting area has a first width in a first direction and a second width in a second direction perpendicular to the first direction, and the second width may be greater than the first width. The diffusing part outputs the first laser beam into a second laser beam having a first angle of view in the first direction and a second angle of view in the second direction, and the first angle of view may be greater than the second angle of view.

Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

Abstract: A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.

Abstract: An optical ferrule comprises first and second compound stop features respectively disposed at opposing sides of the optical ferrule. Each compound stop feature has upper and lower contact surfaces. The lower contact surface is offset below the mating surface of the optical ferrule along a thickness axis perpendicular to the mating surface. The upper contact surface is offset above the mating surface along the thickness axis. The lower contact surface is offset forward from the upper stop surface along a mating direction of the optical ferrule. A connecting surface connects the upper contact surface and the lower contact surface.

Abstract: A multi-axis positioning stage or positioner includes a top plate supported and manipulatable by a plurality of prismatic joint actuators. Each actuator includes an actuator joint having four or five Degrees of Freedom (DOF) with the top plate. When one or more of the actuators extends or contracts, the pivot points, or four or five DOF actuator joints, of the remaining actuators are allowed to shift to move the top plate. The actuators can be disposed between at least one base plate or base structure, and can be fixed thereto.

Abstract: Provided are methods and apparatus for encoding and decoding motion information. The method of encoding motion information includes: obtaining a motion information candidate by using motion information of prediction units that are temporally or spatially related to a current prediction unit; adding, when the number of motion information included in the motion information candidate is smaller than a predetermined number n, alternative motion information to the motion information candidate so that the number of motion information included in the motion information candidate reaches the predetermined number n; determining motion information with respect to the current prediction unit from among the n motion information candidates; and encoding index information indicating the determined motion information as motion information of the current prediction unit.

Abstract: An optical element device includes an opto-electric hybrid board sequentially including an optical waveguide having a mirror, and an electric circuit board having a terminal in a thickness direction, and an optical element optically connected to the mirror and electrically connected to the terminal. The opto-electric hybrid board includes a mounting region including the mirror and the terminal when projected in the thickness direction and mounted with the optical element. Furthermore, the opto-electric hybrid board includes an alignment mark for aligning the optical element with respect to the mirror. The alignment mark is made of a material for forming the optical waveguide, and disposed at both outer sides of the mounting region in a width direction.

Abstract: A method for protecting fusion spliced optical fibers includes immersing sections of fusion spliced first and second optical fibers in a pool of molten thermoplastic material, followed by removal and cooling of liquid-coated areas, to yield a solid thermoplastic overcoating that extends over a splice joint as well as previously stripped sections and pre-coated sections of the first and second optical fibers. Optionally, a strength member may be adhered to the solid thermoplastic overcoating to provide a reinforced fusion spliced section. A strength member may include a metal rod or a secondary, thick thermoplastic coating. A fiber optic cable assembly includes a solid thermoplastic overcoating that extends over the splice joint as well as previously stripped sections and pre-coated sections of the fibers.

Abstract: Arrays of fiber pigtails can be used to project and receive light. Unfortunately, most fiber pigtail arrays are not aligned well enough for coherently combining different optical beams. This imprecision stems in part from misalignment between the optical fiber and the endcap spliced to the end of the optical fiber. The endcap is often polished, curved, or patterned, causing the light emitted by the endcapped fiber to refract or diffract as it exits the endcap. This refraction or diffraction shifts the apparent position of the beam waist from its actual position. Measuring this virtual beam waist position before and after splicing the endcap to the fiber increases the absolute precision with which the fiber is aligned to the endcap. This increase in absolute precision reduces the deviation in virtual beam waist position among endcapped fibers, making it easier to produce arrays of endcapped fibers aligned precisely enough for coherent beam combining.

Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: Aspects of an optical element are provided herein for use in an optical assembly. The optical element may include an optical substrate, an optical component (e.g., a lens), and a plurality of alignment features. The optical component is configured to receive light and is included in a middle region of the optical substrate. The alignment features are included in a periphery region on a surface of the optical substrate. The alignment features are configured to contact a corresponding plurality of alignment features included in another optical element of the optical assembly to provide a kinematic coupling between the optical element and the other optical element for aligning the optical components.

Abstract: An optical connector assembly (OCA) includes a connector housing to maintain alignment between optical components housed within the OCA and photoelectric converters on an optoelectronic substrate (OES) assembly. The optical components include a ferrule and an optical cable. The ferrule is optically coupled to the optical cable. The OCA includes a ferrule holder to hold the ferrule within the OCA, and a spring located between the connector housing and the ferrule holder. The spring is to apply a separating force between the ferrule holder and the connector housing. The OCA includes a gasket coupled to the connector housing. The coupling of the connector housing to a socket compresses the gasket to provide a seal between the connector housing and the socket.

Abstract: A print head includes a light guide portion including a light blocking part having a lattice shape, and a plurality of light guide paths defined by the light blocking part, and a light emitting element array in which a plurality of organic EL elements emitting light incident to each light guide path are arranged. In the print head, the plurality of light guide paths of the light guide portion are designed to have an identical width of 30 ?m or less, and thus it is possible to reduce exposure unevenness which is one of exposure characteristics.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate having a first surface and a second surface opposite thereto. The substrate includes a wiring structure. The semiconductor package structure also includes a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The semiconductor package structure further includes a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The first semiconductor die and the second semiconductor die are separated by a molding material. In addition, the semiconductor package structure includes a first hole and a second hole formed on the second surface of the substrate.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: A method of forming an optical device includes forming a waveguide mask on a device precursor. The device precursor includes a waveguide positioned on a base. The method also includes forming a facet mask on the device precursor such that at least a portion of the waveguide mask is between the facet mask and the base. The method also includes removing a portion of the base while the facet mask protects a facet of the waveguide. The portion of the base that is removed can be removed such that a recess is defined in the base and/or a shelf is defined on the device precursor. A light source such as an optical fiber or laser can be received in the recess and/or positioned over the shelf such that the light source is optically aligned with the facet of the waveguide.

Abstract: An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.

Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: A pluggable transceiver module is provided. The pluggable transceiver module is adapted to be inserted to a cage. The pluggable transceiver module includes a housing, a cover, a latch, an elastic element, and a bail bar. The latch is sandwiched between the cover and the housing. The latch includes a fastening portion. The elastic element is disposed on the housing and abuts the latch. The bail bar abuts the latch. The bail bar is rotated between a first bar position and a second bar position. When the bail bar is in the first bar position, the fastening portion is affixed to the cage. When the bail bar is rotated from the first bar position to the second bar position, the latch is moved in an oblique direction, and the fastening portion is separated from the cage.

Abstract: Thermal management of a locker etalon in a transmitter optical subassembly (TOSA). In one example embodiment, a TOSA includes a case, a laser positioned within the case and electro-thermally connected to the case, a locker etalon positioned in the case and thermally connected to the case, and a thermoelectric cooler (TEC) positioned within the case and in thermal contact with both the laser and the locker etalon.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: An optical interconnect structure includes a lens array and a waveguide substrate. The lens array has a dummy lens. The waveguide substrate has a dummy core, a dummy mirror corresponding to the dummy core, and an inspection opening for injecting inspection light into the dummy core to reach the dummy mirror. In the optical interconnect structure, the lens array is mounted on the waveguide substrate such that the dummy lens of the lens array is positioned on the dummy mirror by monitoring inspection light from the inspection opening.

Abstract: An fiber-optic connector assembly includes a fiber optic ferrule and a connector, which engage an optical transceiver component. The fiber optic ferrule engages a mating plane of a lens array in the optical transceiver component and floats within the connector. The engagement of the assembly and the optical transceiver component may be removable rather than fixed. The fiber optic ferrule also engages a mechanical interface to account for three degrees of freedom, while the engagement of the mating surfaces account for another three degrees of freedom.

Abstract: The invention relates to a method for positioning a light-shaping member, for example a reflector (1), relative to at least one light source (2), comprising the following steps: a) fitting the at least one light source (2) on a carrier plate (3); b) measuring the position of the at least one light source (2) on the carrier plate (3); c) fitting one or preferably more reference positions (4) on the carrier plate (3), wherein the position of the at least one reference position (4) is dependent on the position of the at least one light source (2); d) referencing, i.e. aligning, the light-shaping member to/with the reference position(s) (4) on the carrier plate (3); and e) securing the light-shaping member on the carrier plate (3) or in relation to the carrier plate (3).

Abstract: The present invention is directed to an optical assembly that comprises a coupler and a connecting structure. The coupler comprises first optical waveguides, a male alignment feature and optical connection means. The first optical waveguides extend parallel from a first end to a second end and form a planar end portion at the level of the second end. The male alignment feature, to which said planar end portion is secured, protrudes transversally to an average plane of the planar end portion, at the level of said planar end portion. The optical connection means are arranged at the level of said first end. The connecting structure comprises second optical waveguides that extend parallel to said plane and a female alignment feature, which is configured to receive said male alignment feature, and extends transversally to said plane at the level of the planar end portion.

Abstract: An energy sensor is provided including a collimator comprising a plurality of sensor apertures aligned in a plurality of directions configured to allow passage of an energetic particle or photon in a specific direction for respective apertures of the plurality of sensor apertures and at least one energy detector configured to measure the energetic particle or photon including a plurality of detector segments. Respective detector segments of the plurality of detector segments are aligned with the respective sensor apertures and a detector segment which measures the energetic particle or photon is indicative of a directionality of the energetic particle or photon.

Abstract: A signal cable for transmitting the signal between a transmitter (5) and a receiver (6), wherein the first plug (1) is intended for connection to the signal transmitter (5), and the second plug (2) is intended for connection to the signal receiver (6), and is electrically connected by a connecting portion, wherein the connecting portion includes a graphene layer (4) disposed on a polymer layer, which graphene layer (4) provides an electrical connection between the first plug (1) and the second plug (2).

Abstract: An MPO connector includes a pin configuration with an elongated shaft extending along an axis A. A first portion proximate a first end of the shaft includes a tool surface feature for engagement by a tool to impart a rotation to the shaft. A second portion proximate a second end of the shaft is cylindrical and centered on an axis B, offset relative to the axis A. A method of minimizing insertion loss between mating channels of mated MPO connectors includes inserting light into a channel of a first MPO connector, then measuring an intensity of light output from a channel of a second MPO, mated to the first MPO connector. A pin associated with one of the mated MPO connectors is rotated to a point where the measured light output from the channel of the second MPO connector is approximately maximized.

Abstract: An interface for transmitting a high-speed signal and an optical module including the same. The interface may include a main substrate and a sub-substrate. The main substrate may have at least one high-speed signal line formed on the upper surface of the main substrate. The sub-substrate may have a first conductive line formed on the lower surface thereof so as to adjust high-speed signal transmission characteristics of the high-speed signal line, wherein the first conductive line may be coupled to the upper surface of the main substrate and partially overlap with the high-speed signal line.

Abstract: An optical module device including optical devices 110, a substrate 100 on which the optical devices 110 are disposed, optical fibers 200 that implement optical communications with the optical devices 110, an optical bench 300 to which the optical fibers 200 are fixed and which implements optical coupling between the optical devices 110 and the optical fibers 200, a cover block 400 that covers the optical bench 300 and a copper cable receptacle 500.

Abstract: A high speed optical module, and in particular, a multi-channel, single-mode, parallel transmission optical module in the field of optical communication is disclosed. The optical module includes a chassis, a first transmitter optical subassembly (TOSA), a second transmitter optical subassembly (TOSA), a third transmitter optical subassembly (TOSA), a fourth transmitter optical subassembly (TOSA) and a MT fiber connector. The TOSA may be a TO-38 TOSA of a 10 G DFB chip or FP chip. With single-mode communication, the optical module provides a transmission distance over 10 kilometers. In addition, to make coupling single-mode fibers easier, a twelve-core MT fiber connector is employed, wherein four fiber connectors are respectively connected to LC standard fiber stubs and the outputs of the TOSAs accordingly. Thus, the optical module further provides high speed and long-distance transmission, large capacity, small volume, and light weight and can be broadly applied to high speed optical communications.

Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).

Abstract: An optical alignment system for aligning an optical component is provided. The system includes an alignment component configured to be moveable in a plane and in a fixed relationship with the optical component. Typically the alignment component houses an optical fiber MT ferrule. One or more driving components are further provided typically in the form of a ball headed adjustment screw. The driving components are configured to be moveable, relative to the alignment component, in a first linear direction. At least a component of the first linear direction is parallel with the normal of the plane. The driving component, when forced along the first linear direction and in contact with the alignment component, imparts a force upon the alignment component, in the plane, to move the optical component in the plane. An alignment frame accommodating the driving components may also be provided.

Abstract: A method is for aligning an electro-optic device. The method may include initially positioning an optical fiber array adjacent to optical grating couplers, and actively aligning the optical fiber array relative to the optical grating couplers in a yaw direction and a roll direction to determine a yaw and roll alignment at a first operating wavelength. The method may include actively aligning the optical fiber array relative to optical grating couplers in an x direction and a y direction to determine a first x and y alignment at the first operating wavelength, determining a second operating wavelength, and actively aligning the optical fiber array again relative to the optical grating couplers in the x direction and y direction to determine a second x and y alignment at the second operating wavelength.

Abstract: A weatherproofed interconnection junction includes: a first cable having a first connector at one end; a second connector; a sealing cylinder with an internal cavity, wherein the first connector and second connector are joined and reside within the cavity; and an elastomeric sealing boot having a cable section and a connector section. The first cable is conformably received in the cable section and the sealing cylinder is conformably received in the connector section.

Abstract: The present invention relates to an adapter for a connector, notably for a multicontact connector, of the type including at least one insert, a housing containing the insert and at least one alveolus suitable for housing an alignment sleeve, notably slotted. According to the invention, each alveolus is also suitable for housing a securing cage for an alignment sleeve, by a mounting that is floating radially to its axis, over the entire length of the alignment sleeve.

Abstract: An optical repeater to be arranged between a substrate and an optical connector, the optical repeater includes: a body part including a plurality of optical paths to transmit an optical signal between the substrate and the optical connector, a substrate-side end-face in which one end of each of the optical paths opposes the substrate, and a connector connecting part to connect another end of each of the optical paths to the optical connector, the body part being configured from a material with a greater coefficient of linear expansion than that of the substrate; and a reinforcing member arranged so as to surround the optical paths in a side to the substrate-side end-face, the reinforcing member being configured from a material with a smaller coefficient of linear expansion than that of the body part.

Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Abstract: In a first aspect of the present inventive subject matter, a light source includes a substrate that includes a first electrode and a second electrode, and light-emitting elements arranged in an area and divided into groups each including a same number N of light-emitting elements that are electrically connected to one another in series in each group of the groups and that are electrically connected in series to the first electrode and to the second electrode of the substrate, and the light-emitting elements include a first light-emitting element that is configured to start emitting light when a voltage applied to the light-emitting elements exceeds a first voltage value, and the light-emitting elements except the first light-emitting element are configured to start emitting light when the voltage exceeds a second voltage value that is higher than the first voltage value. Also, a lighting device including the light source is disclosed.

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: In one aspect, an elastically averaged alignment system is provided. The system includes a first component including an alignment member, the alignment member including a base portion extending from an edge of the first component, and a connector portion coupled to the base portion. The system also includes a second component including a receiving member. The receiving member includes a pair of cantilever members extending from an edge of the second component and defines a receiving aperture configured to receive at least a portion of the alignment member to couple the first component and the second component. The alignment member is an elastically deformable material such that when the alignment member is inserted into the receiving aperture, the alignment member elastically deforms to an elastically averaged final configuration to facilitate aligning the first component edge relative to the second component edge.

Abstract: A photoelectric coupling module includes a fiber module and a lens module. The fiber module defines a number of receiving holes and at least one positioning hole. The lens module includes a main body and at least one positioning pole. The main body includes a lens portion and a receiving portion. The lens portion includes a central portion and an edge portion surrounding the central portion, the central portion includes a plurality of lenses. The receiving portion is positioned on the edge portion. The at least one positioning pole is received in the receiving portion, and is positioned on the edge portion. One end of the fiber module is received in the receiving portion. The at least one positioning pole is received in the at least one positioning hole, and the lenses are aligned with the receiving holes.