Abstract: A semiconductor package structure includes a first wafer and a second wafer. The first wafer has a concave portion. The concave portion has a bottom surface and at least one sidewall adjacent to the bottom surface. An obtuse angle is formed between the bottom surface and the sidewall. The second wafer is disposed on the first wafer and has a protruding portion. When the protruding portion enters an opening of the concave portion, the protruding portion slides along the sidewall to the bottom surface, such that the protruding portion is coupled to the concave portion.

Abstract: A system is provided for aligning a photodetector array to optical outputs of an optical demultiplexer in a multi-channel receiver optical subassembly (ROSA). In one embodiment, the system may include a clamp alignment fixture configured to secure a position of a photodetector mounting bar within a ROSA housing, wherein the photodetector array is disposed on the photodetector mounting bar and the photodetector array includes a plurality of photodiodes. The system may further include a motion staging device configured to adjust an orientation of the photodetector mounting bar by varying an angle of the clamp alignment fixture. The adjustment may be based on observation of the location of an optical alignment signal relative to the plurality of photodiodes, the optical alignment signal projected onto the photodetector mounting bar by the optical demultiplexer.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Abstract: The present invention relates to a method and system for fiber positioning in wide-field astronomy. In one form the method and system of the present invention relate to anchoring fiber end points adjacent or against the field plate of a telescope. In one embodiment the positioning system for anchoring a fiber end point at a location on a telescope field plate collocated with a telescope focal plane, the positioning system comprising a piezoelectric positioning device for positioning the fiber end point, the positioning device comprising a chamber having an opening, the opening lying against the field plate in use defining a substantially enclosed volume inside the chamber, a pump for reducing pressure inside the enclosed volume; and a path connecting the pump and the enclosed volume so that, in use, the pump effects a reduction in pressure in the chamber thereby anchoring the fiber end point on the field plate.

Abstract: A plurality of flip-chips, each having a plurality of optoelectronic elements formed therein, are flip-chip mounted on a top surface of a substrate that is comprised of a material that is transparent to the operating wavelength of the light produced by optoelectronic elements of the flip-chips. The combination of flip-chips comprises an array of precisely-aligned optoelectronic elements. When the substrate comprising the array of optoelectronic elements is mounted on a PCB, electrical contact pads disposed on the bottom and/or top surface of the substrate are in contact with the respective electrical contact pads disposed on the top surface of the PCB to electrically interconnect the PCB with the flip-chips. Mating features on the substrate that have been precisely positioned by semiconductor fabrication steps are disposed for mating with respective mating features of a multi-optical fiber ferrule device that have been precisely formed in the ferrule device at precise locations.

Abstract: A lens component has a element-side lens portion 65 which is provided so as to face a light emitting and receiving element 52 mounted on a circuit substrate 24, a positioning portion 75 that protrudes such that the element-side lens portion 65 is separated from the circuit substrate 24 by a predetermined distance, and an adhesion portion 76 that forms an adhesive-agent filling space S, which is filled with an adhesive agent 77, between the circuit substrate 24 and the adhesion portion 26, in a state where the positioning portion 75 contacts with the circuit substrate 24 and the element-side lens portion 65 is fixed so as to face the light emitting and receiving element 52.

Abstract: An integrated circuit is described. This integrated circuit includes an optical waveguide defined in a semiconductor layer, and an optical detector disposed on top of the optical waveguide. Moreover, the optical waveguide has an end with a reflecting facet. For example, the reflective facet may be defined using an anisotropic etch of the semiconductor layer. This reflecting facet reflects light propagating in a plane of the optical waveguide out of the plane into the optical detector, thereby providing a photodetector with high optical responsivity, including an extremely low dark current (and, thus, high photosensitivity) and an extremely small capacitance (and, thus, high electrical bandwidth).

Abstract: Technologies are generally described herein for electrocaloric effect heat transfer devices and methods effective to facilitate heat transfer over a wide operating temperature range of a corresponding heat source. Some example heat transfer devices may include multiple heat transfer stacks with at least two heat transfer stacks having electrocaloric effect materials with varying effective temperature ranges. The combined effective temperature ranges of the multiple heat transfer stacks encompass the operating temperature range of the heat source.

Abstract: An optical irradiation apparatus includes: a light-emitting device configured to emit a plurality of light beams whose optical axes extend in a substantially identical direction; a collimator part configured to convert the light beams into parallel light beams; and a light condensing part configured to collect the parallel light beams. The light-emitting device includes a super luminescent diode array in which a plurality of waveguides are provided on a substrate. Each of the waveguides has a light-emitting facet including a light emission point from which an associated one of the light beams is emitted. The light emission points are located in a plane. The plane including the light emission points is orthogonal to a direction of an optical axis of the collimator part.

Abstract: Semiconductor devices having an optical transceiver include a cladding on a substrate, a protrusion vertically extending trough the cladding and materially in continuity with the substrate, and a coupler on the cladding and the protrusion.

Abstract: An apparatus includes a slider structure having a waveguide and a cavity configured to align a laser to the waveguide. The cavity includes a plurality of solder bumps on a bottom of the cavity configured to electrically and thermally couple the laser to the slider. At least one mechanical stopper is disposed in the cavity to facilitate vertical alignment between an output of the laser and an input of the waveguide. At least one solder bump is disposed on the mechanical stopper to facilitate lateral alignment between the output of the laser and the input of the waveguide in response to a reflow of the solder bumps.

Abstract: A light beam is detected/localized by multisector detector—quad-cell, or 5+ sectors handling plural beams. Preferences: Beams focus to diffraction limit on the detector, which reveals origin direction by null-balance—shifting spots to a central sector junction, and measuring shifts to reach there. One or more MEMS reflectors, and control system with programmed processor(s), sequence the spot toward center: following a normal to an intersector boundary; then along the boundary. One afocal optic amplifies MEMS deflections; another sends beams to imaging optics. After it's known which sector received a spot, and the beam shifts, source direction is reported. The system can respond toward that (or a related) direction. It can illuminate objects, generating beams reflectively. Optics define an FOR in which to search; other optics define an FOV (narrower), for imaging spots onto the detector. The FOR:FOV angular ratio is on order of ten—roughly 180:20°, or 120:10°.

Abstract: An optical device has a waveguide immobilized on a base. A lens is defined by the base. A reflecting side reflects a light signal that travels on an optical pathway that extends through the lens and into the waveguide. The reflecting side is positioned to reflect the light signal as the light signal travels along a portion of the optical pathway between the lens and the waveguide. An optical insulator that confines the light signal within the waveguide. The portion of the optical pathway between the lens and the waveguide extends through the optical insulator such that the light signal is transmitted through the optical insulator.

Abstract: An integrated circuit package includes a substrate having a recess formed along at least a portion of a perimeter of the substrate, and an optical die having opto-electric circuitry, the optical die coupled to the substrate such that a portion of the optical die with the opto-electric circuitry overhangs the recess. The integrated circuit package also includes an optical unit disposed in the recess such that optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry.

Abstract: In a semiconductor device manufacturing method, a semiconductor chip is mounted on a support board so as to expose a side of the semiconductor chip on which a plurality of terminal electrodes are provided. An insulating layer is formed so as to cover the side of the semiconductor chip on which the terminal electrodes are provided. Through electrodes connecting to the terminal electrodes and piercing the insulating layer are formed. Metal wirings connecting to the through electrodes are formed on the insulating layer. External terminal electrodes connecting the metal wiring are formed. Second spacing, spacing between the adjacent external terminal electrodes, is larger than first spacing, spacing between the adjacent terminal electrodes.

Abstract: An optical fiber fixing device includes a base, first fixing block and a second fixing block. The base includes an upper surface has a receiving groove and a groove which is connected with the receiving groove. The receiving groove receives an optical fiber connector, the optical fiber connector receives a plurality of optical fibers, and two ends of the optical fibers separately protrude out of the optical fiber connector. The groove has an optical detecting device, the detecting device defines a plurality of light apertures. The first fixing block is set on the upper surface, which is configured to fix the optical fiber connector into the receiving groove. The second fixing block is received in the groove, in order to fix the detecting device in the groove, the plurality of light apertures are aligned with the plurality of optical fibers.

Abstract: An optical interposer comprising: (a) a substrate having a planar surface: (b) at least one groove defined in the planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end perpendicular to side walls, the facet having a first angle relative to the planar surface, the first angle being about 45 degrees; and (c) a reflective coating on the first facet.

Abstract: An optical fiber includes a first end and a second end. The optical fiber includes a core for transmitting optical signals from the first end to the second end. The core has end surfaces at the first and second ends and a cladding is positioned around a circumference of the core. Magnetic elements are provided at the end surfaces of the first end and the second end. The magnetic elements are configured to magnetically couple the core to a magnetic element at an end of a core of another optical fiber. The magnetic elements form part of a light transmission path defined by the core. The magnetic elements are optically transmissive and allow optical signals to pass therethrough.

Abstract: A fiber array for receiving a plurality of light-guiding fibers has a substrate with V grooves for guiding light-guiding fibers. These are fixed inside the V grooves by covers. In order to achieve a better utilization of space, the light-guiding fibers are disposed in two planes. To this end, first fibers in V grooves are fixed on the surface of the substrate in one plane. Second fibers are fixed by V grooves in recesses between the first fibers in a second parallel plane. Here a processing of the substrate may be done without changing clamping or re-clamping of the substrate. Particularly small production tolerances can be achieved by this means.

Abstract: An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide.

Abstract: An optical interposer for optically coupling light between an OED supported on a substrate and an optical fiber, the interposer comprising: (a) an interposer of an optically-clear moldable material comprising at least the following features: (b) a port for receiving a ferrule containing at least one optical fiber, the port comprising an interface surface positioned to optically couple with an end face of the optical fiber; (c) an active lens adapted to optically couple with an OED, the active lens and the interface surface optically coupled along an optical path in the interposer; (d) a protrusion extending backward from the port, the protrusion defining a first register surface, the first register surface being a certain distance from the optical path such that, when a second register surface of a ferrule containing the optical fiber contacts the first register surface, the ferrule is aligned with the port such that the port can receive a front portion of the ferrule if the ferrule is pushed forward.

Abstract: The present invention is directed to an assembly for use in detecting an analyte in a sample based on thin-film spectral interference. The assembly comprises a waveguide, a monolithic substrate optically coupled to the waveguide, and a thin-film layer directly bonded to the sensing side of the monolithic substrate. The refractive index of the monolithic substrate is higher than the refractive index of the transparent material of the thin-film layer. A spectral interference between the light reflected into the waveguide from a first reflecting surface and a second reflecting surface varies as analyte molecules in a sample bind to the analyte binding molecules coated on the thin-film layer.

Abstract: An optical fiber connector includes a main body, a number of lens portions, a number of restricting members, and a number of optical fibers. The main body includes a first side surface and a second side surface opposite to the first side surface. The main body defines a cavity between the first and second side surfaces, and a number of accommodating holes extending through the first side surface and communicating with the cavity. The lens portions are positioned on the second side surface, and each lens portion is coaxial with a corresponding accommodating hole. The restricting members are arranged in the cavity. The optical fibers are fixed in the accommodating holes. Each optical fiber is restricted by a corresponding restricting member and an end of each optical fiber is fixed at the focal plane of a corresponding lens portion.

Abstract: According to an example, an apparatus for use in optoelectronics includes a bottom transparent layer, a top transparent layer having a top surface, a lens sandwiched between the bottom transparent layer and the top transparent layer, and a first alignment element attached to the top surface of the top transparent layer, wherein the first alignment element is offset with respect to the lens and is to mate with a mating alignment element on an optical transmission medium.

Abstract: An optical module with an optical subassembly precisely aligned with an optical fiber is disclosed even when the optical axis of the optical subassembly and that of the optical fiber are perpendicular to each other. The optical module has an auxiliary with a knob and a flange each having a concentric circular periphery. The knob is held by chuck of the welding apparatus, while, the optical subassembly is fixed to the flange. Even when the optical subassembly is slid on the flange to align optically with the optical fiber, the positions of the laser beams for welding are kept on the periphery of the flange.

Abstract: An optical mover with functions of nanometer fine adjustment and micrometer coarse adjustment is mainly used to align two optical elements for connecting two optical elements, such as connection of two optical fibers, connection of one optical fiber with a photo diode, or connection of one optical fiber and one optical waveguide. In using, one optical element is placed upon the supporting seat for fine position adjustment, and another optical element is fixed on an external retainer for aligning to the former optical element on the supporting seat. A coarse control button is firstly used to coarsely adjust the position of the former optical element to approximately align to the later optical element. Then a fine-adjusting button is used to fine adjust the position therebetween so as to well align the two optical elements to a desire level for further operation, such as connecting the two elements.

Abstract: A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

Abstract: A beam coupler alignment system for a fiber laser system is disclosed. The system includes a focus adjust collimator assembly having an inner and outer housing assembly portion. The inner assembly includes a coupler housing assembly and a modified lens housing received within and adjustable relative to via a mechanism configured and arranged to apply an asymmetric binding force in a predictable and repeatable manner. A lever assembly contacts the lens housing and exerts an off-center (asymmetric) force relative to coupler housing assembly creating a friction bind eliminating X and Y axis movement yet allowing Z axis movement with minimal effort. The assembly may further include an alignment mechanism configured and arranged to optically align an input collimator unit and an output collimator unit of a complex fiber laser system about a common optical axis using the proposed assembly.

Abstract: A method of tuning a mold for an optical component, the method comprising: (a) molding an optical component comprising at least: (i) a body portion defining a first face; (ii) at least one optical element on the first face, the optical element having a certain geometry; (iii) at least one alignment element on the first face selected from one of an alignment hole or an alignment pin; and (iv) at least one inspection element in a position fixed relative to the at least one alignment element on the first face; (b) measuring the location of the inspection element on the front face relative to the optical element; (c) comparing the location to a standard to determine a difference; and (d) if the difference is significant, adjusting a component of the mold to change the location of the alignment element relative to the optical element and reiterating steps (a)-(c).

Abstract: A method for fabricating an optical waveguide includes setting, on a lower cladding of an optical waveguide, a light-reflecting feature and at least one waveguide core distinct from the reflecting feature. An upper cladding is applied that embeds both the light-reflecting feature and the waveguide core.

Abstract: A method to assemble a pig-tailed optical module and an arrangement thereof are disclosed. The method includes a step to recover the optical coupling efficiency between the optical device in the optical module and the pig-tailed fiber. The method includes a step to iterating the YAG laser welding at points axially distributed but with an inconstant pitch as slightly rotating the optical module around the optical axis of the pig-tailed fiber clock wise and counter clock wise depending on the enhancement and/or the degradation of the optical coupling efficiency between the optical device and the pig-tailed fiber.

Abstract: An optical fiber splitter has a higher density fiber optic array that allows for smaller packaging. The optical fibers that extend from the optical fiber splitter have one end connectorized and their spacing at the other end reduced, thereby eliminating components that were heretofore required. A method of making the fiber optic array includes interleaving the optical fibers to reduce the overall dimensions of the fiber optic array and the fiber optic splitter. A tool is used to reduce the spacing of the optical fibers in the fiber optic array.

Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Abstract: A test system for a multi-mode fiber comprises a launching device that is configured to generate optical pulses and has a rest position. A centering system is operable to move the launching device in a circular motion having a center corresponding to the rest position and a diameter corresponding to a core diameter of the multi-mode fiber. The centering system is further operable to adjust a position of the multi-mode fiber relative to the launching device while the launching device is moving in the circle until an optical power coupled from the launching device into the multi-mode fiber is below a threshold. The centering system optically centers the launching device with the multi-mode fiber by fixing the position of the multi-mode fiber responsive to the optical power coupled from the launching device into the multi-mode fiber being below the threshold and returning the launching device to the rest position.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.

Abstract: In one embodiment, an optical transceiver assembly includes an active component substrate, first and second fiber securing devices, and a holder device coupled to the active component substrate. The holder device includes an active optical component recess that encloses a first and second active optical component of the active component assembly, and first and second fiber-locating holes having an engagement feature at the active optical component recess such that an end of first and second fibers inserted into the first and second fiber-locating holes are aligned with the first and second active optical components along the x-, y-, and z-axes. In another embodiment, an optical component assembly includes an active component substrate having a solder ring, a fiber securing device, and an active optical component on the active component substrate. The fiber securing device is aligned with the active optical component by the solder ring.

Abstract: Certain embodiments may include a laser system configured to emit collimated laser light, a beam diverging element configured to diverge the laser light to yield a range of propagation angles with a maximum angle greater than zero, and fiber coupling optics configured to direct the diverged laser light towards a spot of a cross-section of a fiber core of an optical fiber. As another example, certain embodiments may include a laser system configured to emit collimated laser light, a beam shaping element configured to shape the laser light into a beam with an elliptical cross-section, and fiber coupling optics configured to direct the diverged laser light towards a spot of a cross-section of a fiber core of an optical fiber, where the spot's center point is located at a distance from the cross-section's center point.

Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

Abstract: A submarine optical connector (1), comprising: a first support element (11) for supporting a first optical fiber, said first support element including at least one alignment pin (31, 31?), a second support element (12) for supporting a second optical fiber, said second support element including at least one through hole intended to receive respectively said at least one alignment pin to guide the first and second support elements towards a contact position in which the first and second fibers are connected, and sealing means (41, 42, 43) to protect the first and second fibers from the external environment at least when the first and second support elements are in the contact position.

Abstract: A method for aligning a ferrule-mounted optical fiber with the optical axis of an electro-optical device, including the following steps: providing an alignment marking with respect to the device in relation to the optical axis; providing an annular receptacle and a tubular alignment pin with a central passageway, having its proximal end slidably fitted in the annulus of the receptacle; aligning the proximal end of the alignment pin with the alignment marking; securing the device to the receptacle; removing the alignment pin from the receptacle; and inserting the ferrule-mounted optical fiber into the receptacle.

Abstract: An optical semiconductor element is held in a junction-up state at an approach start position that is isolated from a mount face of a planar lightwave circuit, and the top-face height of the optical semiconductor element and the surface height of the planar lightwave circuit are aligned by bringing the optical semiconductor element closer towards the mount face. Further, the height of the active layer of the optical semiconductor element is aligned with the height of a waveguide of the planar lightwave circuit by bringing the optical semiconductor element towards the mount face for an amount of a difference between a reference value of a distance on design from the surface of the planar lightwave circuit to the center of the waveguide and a reference value of a distance on design from the top face of the optical semiconductor element to the center of the active layer.

Abstract: An optical communication system comprising first and second planar substrates and an alignment assembly. The first substrate of a semiconductor material, is located on a planar surface of a sub-mount and having a planar first edge. The second substrate of a different second material, is located on said planar surface of said sub-mount and having a planar second edge. The alignment assembly is located on said sub-mount, said alignment assembly including rigid standoff structures configured to fixedly vertically align said first and second edges above said sub-mount such that each optical output of one of said lasers is vertically aligned with the end of one of said light-guiding structures.

Abstract: A cartridge-type optical functional module can achieve excellent optical coupling and has an optical fiber-type module or a waveguide-type module. The present invention relates to a cartridge-type optical functional module which has: first and second optical fiber collimators; an optical functional object which has an optical fiber-type module or a waveguide-type module; and a base section. The optical functional object has a third collimator, and a first alignment mechanism for aligning the position of the third collimator in the optical functional object.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: An optical mover with functions of nanometer fine adjustment and micrometer coarse adjustment is mainly used to align two optical elements for connecting two optical elements, such as connection of two optical fibers, connection of one optical fiber with a photo diode, or connection of one optical fiber and one optical waveguide. In using, one optical element is placed upon the supporting seat for fine position adjustment, and another optical element is fixed on an external retainer for aligning to the former optical element on the supporting seat. A coarse control button is firstly used to coarsely adjust the position of the former optical element to approximately align to the later optical element. Then a fine-adjusting button is used to fine adjust the position therebetween so as to well align the two optical elements to a desire level for further operation, such as connecting the two elements.

Abstract: A suspension board with circuit includes a circuit board and an optical waveguide provided in the circuit board. The optical waveguide is provided with a first optical waveguide having a curved portion and a secondary optical waveguide having a linear portion. The first optical waveguide includes a first under clad layer, a first core layer formed on the first under clad layer and included in the first under clad layer when projected in the thickness direction, and a first over clad layer formed on the first under clad layer so as to cover the first core layer. The secondary optical waveguide includes a secondary under clad layer, a secondary core layer formed on the secondary under clad layer, and a secondary over clad layer formed on the secondary core layer and included in the secondary core layer when projected in the thickness direction.

Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Abstract: An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Abstract: A guide pin for mating multi-fiber optical ferrules includes a first end, a second end and a flexile feature adjacent to the second end. The first end has a first end width and the second end has a first engagement width and may change to a second engagement width while engaging a guide pin bore in a ferrule. The change in width permits the guide pin to engage and axially align with guide pin bores of varying diameters to achieve reliable optical mating of optical wave guides.